JP5333272B2 - Power amplifier module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power amplifier module in which a plurality of input matching circuits and a plurality of output matching circuits can be compactly mounted. <P>SOLUTION: The power amplifier module 11 includes: a power amplifier 20 for selectively power-amplifying a plurality of wireless signals having respectively different frequency bands; a plurality of input matching circuits 31, 32 which are monolithically integrated so as to perform the impedance matching of an input of the power amplifier 20 for the respective wireless signals; a plurality of output matching circuits 41, 42 which are monolithically integrated so as to perform the impedance matching of an output of the power amplifier 20 for the respective wireless signals; and a multi-layer substrate 50 on which the power amplifier 20 is mounted and which incorporates the input matching circuits 31, 32 and the output matching circuits 41, 42. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a power amplifier module that selectively amplifies a plurality of radio signals each having a different frequency band.

  In recent years, mobile communication terminals have multiple bands that can support multiple frequency bands and international roaming that can be used overseas in order to ensure more stable and high-quality communication while expanding communication capacity. In order to cope with this, there is an increasing demand for a multi-mode capable of supporting a plurality of communication methods. For example, in Japan, the third generation system such as the CDMA system and the UMTS system uses the 800 MHz band, the 1.7 GHz band, and the 2 GHz band, and overseas, the GSM system uses the 850 MHz band, 900 MHz, 1.8 GHz band, The 1.9 GHz band is used. In order to cope with such a multiband / multimode configuration, an example in which a plurality of input matching circuits and a plurality of output matching circuits are mounted on one power amplifier module has been reported. As a device structure of a power amplifier module, for example, as disclosed in JP-A-2006-261170, a mounting structure in which an LTCC substrate or an HTCC substrate is stacked is known.

JP 2006-261170 A

  However, the method of surface mounting a plurality of input matching circuits and a plurality of output matching circuits on the power amplifier module substrate increases the mounting area, and thus there are technical limitations in reducing the size of the power amplifier module. .

  Accordingly, an object of the present invention is to propose a power amplifier module that can mount a plurality of input matching circuits and a plurality of output matching circuits in a compact manner.

  In order to solve the above problems, a power amplifier module according to the present invention includes a power amplifier that selectively amplifies a plurality of radio signals each having a different frequency band, and an input of the power amplifier for each of the plurality of radio signals. A plurality of input matching circuits that are monolithically integrated to perform impedance matching, and a plurality of output matching circuits that are monolithically integrated to perform impedance matching of the output of the power amplifier for each of a plurality of radio signals, and And a multilayer substrate having a power amplifier and a plurality of input matching circuits and a plurality of output matching circuits.

  By incorporating a plurality of input matching circuits and a plurality of output matching circuits in the multilayer substrate, compact mounting is possible and the module size can be reduced.

  The multilayer substrate may have a stacked structure in which a plurality of inner layer substrates are stacked via a ground layer. The plurality of radio signals include first and second radio signals having different frequency bands. The plurality of input matching circuits include first and second input matching circuits that are monolithically integrated so as to perform impedance matching of the input of the power amplifier with respect to the first and second radio signals. The plurality of output matching circuits include first and second output matching circuits that are monolithically integrated circuits so as to perform impedance matching of the output of the power amplifier for the first and second radio signals. The first input matching circuit and the second input matching circuit are two projections obtained by projecting the first input matching circuit and the second input matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on a different inner layer substrate via a ground layer so that a part of the surface overlaps. The first output matching circuit and the second output matching circuit are two projections obtained by projecting the first output matching circuit and the second output matching circuit on a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on a different inner layer substrate via a ground layer so that a part of the surface overlaps.

  By interposing the ground layer between the first input matching circuit and the second input matching circuit, the oscillation operation caused by the wraparound of the high-frequency signal between the first input matching circuit and the second input matching circuit can be performed. It can be effectively suppressed. Further, by mounting the first input matching circuit and the second input matching circuit on different inner layer substrates, compact and high-density mounting can be realized. By interposing a ground layer between the first output matching circuit and the second output matching circuit, the oscillation operation caused by the wraparound of the high-frequency signal between the first output matching circuit and the second output matching circuit can be performed. It can be effectively suppressed. Further, by mounting the first output matching circuit and the second output matching circuit on different inner layer substrates, compact and high-density mounting can be realized.

  The first input matching circuit and the first output matching circuit are two projections obtained by projecting the first input matching circuit and the first output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates via a ground layer so that the surfaces do not overlap. The second input matching circuit and the second output matching circuit are two projections obtained by projecting the second input matching circuit and the second output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates via a ground layer so that the surfaces do not overlap. By interposing a ground layer between the first input matching circuit and the first output matching circuit, an oscillation operation caused by the wraparound of the high-frequency signal between the first input matching circuit and the first output matching circuit can be performed. It can be effectively suppressed. By interposing a ground layer between the second input matching circuit and the second output matching circuit, the oscillation operation caused by the wraparound of the high-frequency signal between the second input matching circuit and the second output matching circuit can be performed. It can be effectively suppressed.

  The multilayer substrate may have a stacked structure in which a plurality of inner layer substrates are stacked. The plurality of radio signals include first and second radio signals having different frequency bands. The plurality of input matching circuits include first and second input matching circuits that are monolithically integrated so as to perform impedance matching of the input of the power amplifier with respect to the first and second radio signals. The plurality of output matching circuits include first and second output matching circuits that are monolithically integrated circuits so as to perform impedance matching of the output of the power amplifier for the first and second radio signals. The first input matching circuit and the second input matching circuit are two projections obtained by projecting the first input matching circuit and the second input matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates so that the surfaces do not overlap. The first output matching circuit and the second output matching circuit are two projections obtained by projecting the first output matching circuit and the second output matching circuit on a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates so that the surfaces do not overlap.

  Even if there is no ground layer between the first input matching circuit and the second input matching circuit, the first input matching circuit and the second input matching circuit are different so that these two projection planes do not overlap. By mounting on the inner layer substrate, it is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the first input matching circuit and the second input matching circuit. Even if no ground layer is interposed between the first output matching circuit and the second output matching circuit, the first output matching circuit and the second output matching circuit are different so that these two projection planes do not overlap. By mounting on the inner layer substrate, it is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the first output matching circuit and the second output matching circuit.

  The first input matching circuit and the first output matching circuit are two projections obtained by projecting the first input matching circuit and the first output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates so that the surfaces do not overlap. The second input matching circuit and the second output matching circuit are two projections obtained by projecting the second input matching circuit and the second output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates, respectively. It may be mounted on different inner layer substrates so that the surfaces do not overlap. By mounting the first input matching circuit and the first output matching circuit on different inner layer substrates so that the two projection planes of the first input matching circuit and the first output matching circuit do not overlap each other, It is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the first input matching circuit and the first output matching circuit. By mounting the second input matching circuit and the second output matching circuit on different inner layer substrates so that the two projection planes of the second input matching circuit and the second output matching circuit do not overlap each other, The oscillation operation caused by the high-frequency signal wraparound between the second input matching circuit and the second output matching circuit can be effectively suppressed.

  According to the present invention, a plurality of input matching circuits and a plurality of output matching circuits can be compactly mounted on a power amplifier module.

1 is a cross-sectional view of a power amplifier module according to Embodiment 1. FIG. FIG. 6 is an explanatory diagram illustrating a layout position of a matching circuit according to the first embodiment. 7 is a cross-sectional view of a power amplifier module according to Embodiment 2. FIG. FIG. 9 is an explanatory diagram illustrating the arrangement position of a matching circuit according to a second embodiment. 3 is a circuit diagram of a power amplifier module according to Embodiments 1 and 2. FIG. 3 is a circuit diagram of a power amplifier module according to Embodiments 1 and 2. FIG. 3 is a circuit diagram of a power amplifier module according to Embodiments 1 and 2. FIG.

  Embodiments according to the present invention will be described below with reference to the drawings. About the same circuit element, the same code | symbol shall be attached | subjected and the overlapping description is abbreviate | omitted. In the second embodiment, the description will focus on the differences from the first embodiment, and a duplicate description will be omitted.

  FIG. 1 is a sectional view showing a device structure of a power amplifier module 11 according to this embodiment. The power amplifier module 11 includes a power amplifier 20 that is monolithically integrated so as to selectively amplify a plurality of radio signals each having a different frequency band, and an input of the power amplifier 20 for each of the plurality of radio signals. A plurality of input matching circuits 31 and 32 that are monolithically integrated to perform impedance matching, and a plurality of outputs that are monolithically integrated to perform impedance matching of the output of the power amplifier 20 for each of a plurality of radio signals. The matching circuit 41 and 42 and the power amplifier 20 are mounted, and a multilayer substrate 50 including a plurality of input matching circuits 31 and 32 and a plurality of output matching circuits 41 and 42 is provided. The input matching circuit 31 and the output matching circuit 41 are designed to perform impedance matching with respect to the first radio signal having the first frequency band, and the input matching circuit 32 and the output matching circuit 42 have the second frequency. The circuit is designed to match the impedance of the second wireless signal having a band. However, the first and second frequency bands are different frequency bands.

  As shown in FIG. 5, each of the plurality of input matching circuits 31 and 32 and the plurality of output matching circuits 41 and 42 includes switches 121, 122, 123, and 124, respectively. The switches 121, 122, 123, and 124 are controlled to open and close based on a control signal CTL supplied from the outside of the power amplifier module 11. For example, when the power of the first radio signal is amplified, the switch 121 is switched so that the output of the input matching circuit 31 is connected to the input of the amplifier 20, and the output of the amplifier 20 is used as the input of the output matching circuit 41. Switch 123 is switched to connect. On the other hand, when power-amplifying the second radio signal, the switch 122 is switched so that the output of the input matching circuit 32 is connected to the input of the amplifier 20, and the output of the amplifier 20 is input to the output matching circuit 42. Switch 124 is switched to connect. With such a configuration, the power amplifier 11 can correspond to a plurality of frequency bands (multiband) and a plurality of communication methods (multimode). However, as shown in FIG. 6, the power amplifier 20 includes a switch 125 that switches the connection of the output of any one of the input matching circuits selected from the plurality of input matching circuits 31 and 32 to the input of the power amplifier 20. A switch 126 for switching the connection of the input of any one of the output matching circuits selected from the plurality of output matching circuits 41 and 42 to the output of the power amplifier 20 may be incorporated. In addition, as shown in FIG. 7, a switch 127 for switching the output of any one of the input matching circuits selected from the plurality of input matching circuits 31 and 32 to the input of the power amplifier 20, and a plurality of output matchings The switch 128 that switches the input of any one of the output matching circuits selected from the circuits 41 and 42 to the output of the power amplifier 20 includes the power amplifier 20, the plurality of input matching circuits 31, 32, and the plurality of outputs. The matching circuits 41 and 42 may be mounted on the multilayer substrate 50 as a separate component. The plurality of input matching circuits 31 and 32 and the plurality of output matching circuits 41 and 42 are not limited to those having the circuit configuration shown in FIGS. 5 to 7, and may be known matching circuits. The circuit configurations shown in FIGS. 5 to 7 may be applied to a second embodiment to be described later.

  As shown in FIG. 1, the multilayer substrate 50 has a laminated structure in which a plurality of inner layer substrates 51, 52, 53, 54 are laminated via ground layers 61, 62, 63 and resin layers 71, 72. . More specifically, a ground layer 61 is interposed between two adjacent inner layer substrates 51 and 52, and a resin layer 71 and a ground layer 62 are interposed between two adjacent inner layer substrates 52 and 53. The resin layer 72 and the ground layer 63 are interposed between the two adjacent inner layer substrates 53 and 54. For example, a plastic substrate, a ceramic substrate, a metal substrate, a film substrate, or the like can be used as the inner layer substrates 51, 52, 53, and 54. Specifically, a glass epoxy substrate, a glass polyimide substrate, an alumina substrate, and a low temperature firing are used. A ceramic substrate, an aluminum nitride substrate, an aluminum substrate, a polyimide film substrate, or the like can be used. The input matching circuit 31 is electrically connected to an inner layer wiring 83 formed on the surface of the inner layer substrate 52. The connection between the input matching circuit 31 and the inner layer wiring 83 may be a connection using bumps such as CSP or wire bonding. The wiring pattern of the inner layer wiring 83 is preferably formed of copper, and in particular, a wiring pattern subjected to chemical surface treatment is preferable. The electrode pad 81 exposed on the outermost surface of the multilayer substrate 50 is electrically connected to a part of the inner layer wiring 83 through a via wiring 82 penetrating the inside of the multilayer substrate 50. The ground layer 61 is electrically connected to a part of the inner layer wiring 83 through a via wiring 84 penetrating the inner layer substrate 52. The signal electrode 86 exposed on the rearmost surface of the multilayer substrate 50 is electrically connected to a part of the inner layer wiring 83 through a via wiring 85 penetrating the inside of the multilayer substrate 50. In the power amplifier 20, the connection between the power amplifier 20 and the matching circuit 31 is obtained by bonding the wire 92 to the electrode pad 81 with the solder 91. The inner layer wiring 83 and the input matching circuit 31 are resin-sealed by a resin layer 71, and an inner layer substrate 53 is laminated thereon via a ground layer 62. Since the connection structure between the other matching circuits 31, 41, and 42 and the power amplifier 20 is the same, detailed description is omitted. As shown in FIG. 1, the electrode pad 101 is exposed on the outermost surface of the multilayer substrate 50, and the ground electrode 103 is exposed on the outermost surface of the multilayer substrate 50. The electrode pad 101 and the ground electrode 103 are electrically connected via a via wiring 102 penetrating the inside of the multilayer substrate 50. The ground terminal of the power amplifier 20 is connected to the electrode pad 101 by solder 104.

  As shown in FIGS. 1 and 2, the two input matching circuits 31 and 32 project the input matching circuits 31 and 32 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, and 54, respectively. The two obtained projection planes 310 and 320 are mounted on different inner layer substrates 52 and 53 through the ground layer 62 so as to overlap each other. Thus, by interposing the ground layer 62 between the two input matching circuits 31 and 32, it is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the input matching circuits 31 and 32. Further, by mounting the two input matching circuits 31 and 32 on different inner layer substrates 52 and 53, for example, as shown in FIG. 2, the two input surfaces 310 and 320 are partially overlapped with each other. Since the matching circuits 31 and 32 can be arranged, compact and high-density mounting can be realized. Similarly, the two output matching circuits 41, 42 are two projection planes 410 obtained by projecting the output matching circuits 41, 42 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, 54. , 420 are mounted on different inner layer substrates 52 and 53 via a ground layer 62 so that a part of them overlaps. By interposing the ground layer 62 between the two output matching circuits 41 and 42, it is possible to effectively suppress the oscillation operation caused by the wraparound of the high-frequency signal between the output matching circuits 41 and 42. Further, by mounting the two output matching circuits 41 and 42 on different inner layer substrates 52 and 53, respectively, for example, as shown in FIG. 2, the two output surfaces 410 and 420 are overlapped so that two outputs overlap each other. Since the matching circuits 41 and 42 can be arranged, compact and high-density mounting can be realized.

  The input matching circuit 31 and the output matching circuit 41 are obtained by projecting the input matching circuit 31 and the output matching circuit 41 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, and 54, respectively. The projection surfaces 310 and 410 are mounted on different inner layer substrates 52 and 53 via the ground layer 62 so that parts of the projection surfaces 310 and 410 do not overlap. Thus, by interposing the ground layer 62 between the input matching circuit 31 and the output matching circuit 41, the oscillation operation caused by the high-frequency signal wraparound between the input matching circuit 31 and the output matching circuit 41 can be effectively performed. Can be suppressed. Similarly, the input matching circuit 32 and the output matching circuit 42 are obtained by projecting the input matching circuit 32 and the output matching circuit 42 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, and 54, respectively. The two projection surfaces 320 and 420 are mounted on different inner layer substrates 53 and 52 through the ground layer 62 so as not to overlap each other. Thus, by interposing the ground layer 62 between the input matching circuit 32 and the output matching circuit 42, the oscillation operation caused by the high-frequency signal wraparound between the input matching circuit 32 and the output matching circuit 42 can be effectively performed. Can be suppressed.

  In FIG. 2, reference numeral 200 indicates a projection plane obtained by projecting the power amplifier 20 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, 54, and reference numeral 500 indicates the multilayer substrate 50. 3 shows a projection plane obtained by projecting onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51, 52, 53, 54.

  According to the present embodiment, since the plurality of input matching circuits 31 and 32 and the plurality of output matching circuits 41 and 42 are formed into a monolithic integrated circuit and built in the multilayer substrate 50, the matching circuits can be stacked with high density. Therefore, the device structure of the power amplifier module 11 can be made compact. Further, between the plurality of input matching circuits 31 and 32, between the plurality of output matching circuits 41 and 42, between the input matching circuit 31 and the output matching circuit 41, and between the input matching circuit 32 and the output matching circuit 42. Since the device structure of the power amplifier module 11 is designed so as to suppress the oscillation operation caused by the wraparound of the high frequency signal, the stable operation of the power amplifier module 11 can be secured.

  In the present embodiment, the case where the power amplifier module 11 has a dual band compatible circuit configuration has been described. However, the present embodiment is not limited to this, and the power amplifier module 11 can support three or more frequency bands. The module 11 may be circuit designed. For example, WiMAX (IEEE802.16-2004, IEEE802.16e-2005) using 2.5 GHz band, 3.5 GHz band, and 5.8 GHz band and a wireless LAN (IEEE802.11a) using 5 GHz band are used. The present embodiment may be applied to a shared communication system. Similarly in the second embodiment to be described later, the present invention is not limited to the dual band support, and may be designed to support three or more frequency bands.

  The power amplifier module 12 according to the present embodiment has no ground layer, the relative positional relationship between the plurality of input matching circuits 31 and 32, and the relative positional relationship between the plurality of output matching circuits 41 and 42. It is different and common in other points. As shown in FIG. 3, the multilayer substrate 50 according to the present embodiment has a laminated structure in which a plurality of inner layer substrates 51 and 52 are laminated via resin layers 71, 72, and 73. As shown in FIGS. 3 and 4, the two input matching circuits 31 and 32 are obtained by projecting the input matching circuits 31 and 32 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51 and 52, respectively. The projection surfaces 310 and 320 are mounted on different inner layer substrates 51 and 52 so as not to overlap. Even if no ground layer is interposed between the two input matching circuits 31 and 32, the two input matching circuits 31 and 32 are mounted on different inner layer substrates 51 and 52 so that the two projection planes 310 and 320 do not overlap. Thus, it is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the two input matching circuits 31 and 32. Similarly, in the two output matching circuits 41 and 42, two projection planes 410 and 420 obtained by projecting the output matching circuits 41 and 42 on a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51 and 52 respectively overlap. It is mounted on different inner layer substrates 52 and 51 so as not to become. Even if there is no ground layer between the two output matching circuits 41, 42, the two output matching circuits 41, 42 are mounted on different inner layer substrates 52, 51 so that the two projection planes 410, 420 do not overlap. Thus, it is possible to effectively suppress the oscillation operation caused by the high-frequency signal wraparound between the two output matching circuits 41 and 42.

  In addition, the input matching circuit 31 and the output matching circuit 41 include two projection planes 310, obtained by projecting the input matching circuit 31 and the output matching circuit 41 on a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51 and 52, respectively. It is mounted on different inner layer substrates 51 and 52 so that part of 410 does not overlap. By mounting the input matching circuit 31 and the output matching circuit 41 on different inner layer substrates 51 and 52 so that parts of the two projection planes 310 and 410 do not overlap, a high frequency between the input matching circuit 31 and the output matching circuit 41 is obtained. Oscillation operations caused by signal wraparound can be effectively suppressed. Similarly, the input matching circuit 32 and the output matching circuit 42 have two projection planes 320 obtained by projecting the input matching circuit 32 and the output matching circuit 42 onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates 51 and 52, respectively. , 420 are mounted on different inner layer substrates 51, 52 so as not to overlap each other. By mounting the input matching circuit 32 and the output matching circuit 42 on different inner layer substrates 52 and 51 so that parts of the two projection planes 320 and 420 do not overlap, a high frequency between the input matching circuit 32 and the output matching circuit 42 is obtained. Oscillation operations caused by signal wraparound can be effectively suppressed.

  According to the present embodiment, since the plurality of input matching circuits 31 and 32 and the plurality of output matching circuits 41 and 42 are formed into a monolithic integrated circuit and built in the multilayer substrate 50, the matching circuits can be stacked with high density. Thus, the device structure of the power amplifier module 12 can be made compact. Further, between the plurality of input matching circuits 31 and 32, between the plurality of output matching circuits 41 and 42, between the input matching circuit 31 and the output matching circuit 41, and between the input matching circuit 32 and the output matching circuit 42. Since the device structure of the power amplifier module 12 is designed so as to suppress the oscillation operation caused by the wraparound of the high frequency signal, the stable operation of the power amplifier module 12 can be secured.

  The power amplifier module according to the present invention can be used for various wireless communication devices such as mobile phones and automobile phones.

DESCRIPTION OF SYMBOLS 11, 12 ... Power amplifier module 20 ... Power amplifier 31, 32 ... Input matching circuit 41, 42 ... Output matching circuit 51, 52, 53, 54 ... Inner layer board | substrate 61, 62, 63 ... Ground layer 71, 72, 73 ... Resin layer

Claims (4)

A power amplifier that selectively amplifies a plurality of radio signals each having a different frequency band; and
A plurality of input matching circuits that are monolithically integrated so as to perform impedance matching of the input of the power amplifier for each of the plurality of radio signals;
A plurality of output matching circuits that are monolithically integrated circuits to perform impedance matching of the output of the power amplifier for each of the plurality of radio signals;
A multilayer substrate having the power amplifier mounted therein and incorporating the plurality of input matching circuits and the plurality of output matching circuits;
Power amplifier module with The power amplifier module according to claim 1,
The multilayer substrate has a laminated structure in which a plurality of inner layer substrates are laminated via a ground layer,
The plurality of radio signals include first and second radio signals having different frequency bands,
The plurality of input matching circuits include first and second input matching circuits monolithically integrated so as to perform impedance matching of the input of the power amplifier with respect to the first and second radio signals,
The plurality of output matching circuits include first and second output matching circuits monolithically integrated so as to perform impedance matching of the output of the power amplifier for the first and second radio signals,
The first input matching circuit and the second input matching circuit respectively project the first input matching circuit and the second input matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates. The two obtained projection planes are mounted on different inner layer substrates via the ground layer so that they overlap, or the first output matching circuit and the second output matching circuit are Different inner layers through the ground layer such that a part of two projection planes obtained by projecting the output matching circuit and the second output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates respectively overlap. Power amplifier module mounted on the board. The power amplifier module according to claim 1,
The multilayer substrate has a laminated structure in which a plurality of inner layer substrates are laminated,
The plurality of radio signals include first and second radio signals having different frequency bands,
The plurality of input matching circuits include first and second input matching circuits monolithically integrated so as to perform impedance matching of the input of the power amplifier with respect to the first and second radio signals,
The plurality of output matching circuits include first and second output matching circuits monolithically integrated so as to perform impedance matching of the output of the power amplifier for the first and second radio signals,
The first input matching circuit and the second input matching circuit respectively project the first input matching circuit and the second input matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates. The obtained two projection planes are mounted on different inner layer substrates so as not to overlap each other, or the first output matching circuit and the second output matching circuit are the first output matching circuit and the second output matching circuit. A power amplifier module mounted on different inner layer substrates so that two projection planes obtained by projecting output matching circuits onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates do not overlap each other. The power amplifier module according to claim 1,
The multilayer substrate has a laminated structure in which a plurality of inner layer substrates are laminated,
The plurality of radio signals include first and second radio signals having different frequency bands,
The plurality of input matching circuits include first and second input matching circuits monolithically integrated so as to perform impedance matching of the input of the power amplifier with respect to the first and second radio signals,
The plurality of output matching circuits include first and second output matching circuits monolithically integrated so as to perform impedance matching of the output of the power amplifier for the first and second radio signals,
The first input matching circuit and the first output matching circuit respectively project the first input matching circuit and the first output matching circuit onto a plane perpendicular to the stacking direction of the plurality of inner layer substrates. A power amplifier module mounted on different inner layers so that the two projection planes obtained do not overlap.

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