JP2010239344A - Radio circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radio circuit module including a radio circuit IC that sufficiently exhibits its performance. <P>SOLUTION: A base substrate 30, a first adhesive layer 40 and a first printed circuit board 50 are stacked in order. In the first adhesive layer 40, a radio circuit IC chip 10 and a WLP chip 20 are disposed side by side along a surface of the first printed circuit board 50, the WLP chip 20 forming a functional element constituting a radio communication circuit in cooperation with the radio circuit IC chip 10. The radio circuit IC chip 10 and the WLP chip 20 are connected via wiring 52a formed in a first wiring layer 52 of the first printed circuit board 50 and conductive via holes 53a, 53b of a first conductive via hole group 53 provided through the first printed circuit board 50 and the first adhesive layer 40. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wireless circuit module that implements a wireless communication circuit including a wireless circuit IC chip as a SiP (System in Package), and more particularly, to the wireless circuit IC chip and wireless communication in cooperation with the wireless circuit IC chip. The present invention relates to a wireless circuit module in which a WLP (Wafer Level Package) chip in which functional elements such as coils constituting a circuit are formed by WLCSP (Wafer Level Chip Scale Package) technology is used.

  In a wireless communication device such as a mobile phone, a signal received by an antenna is amplified by an LNA (Low-Noise Amplifier) and then passed through a BPF (Band-Pass Filter) such as a SAW (Surface Acoustic Wave) filter. And is down-converted to a low frequency that is easy to process signals, converted from an analog signal to a digital signal by an ADC (Analog to Digital Converter), sent to a baseband IC, and processed.

  In recent years, a direct conversion method in which a received high-frequency signal is down-converted to a low frequency in the vicinity of a direct current has become mainstream. In addition, the number of frequency bands to be used is also increasing, and a model corresponding to 3 bands or 4 bands has appeared in one mobile terminal.

  There are three bands, 800 MHz band, 1.7 GHz band, and 2 GHz band, which are defined by the IMT-2000 system, for example, as frequency bands used for 3rd generation mobile phones in Japan. Corresponding radio circuit ICs have also been developed.

  The current radio circuit IC integrates most of the functional circuit blocks necessary to obtain I and Q signals from analog high-frequency signals or to obtain analog high-frequency signals from I and Q signals. Specifically, LNA (Low-Noise Amplifier), Demodulator, Voltage Controlled Oscillator (VCO), PLL (Phase Locked Loop), LPF (Low Pass Filter), Modulator, A variable gain amplifier (VGA), a driver amplifier, or the like.

  A wireless communication circuit requires many functional elements (mainly passive elements). Typical examples of the passive element include a coil and a capacitor. These passive elements are required to have a particularly high Q value (quality factor). By using a passive element having a high Q value, it is possible to reduce the noise and power consumption of the radio circuit.

  The radio circuit IC is manufactured using CMOS technology. When a planar coil is manufactured using CMOS technology, the Q value that can be realized is 10 or less because the thin film Al wiring having a large resistance is used. This is a factor that significantly reduces the performance of the radio circuit IC.

  On the other hand, a technique has been proposed in which flexible circuit boards are stacked to form passive elements (coils, capacitors, resistors, etc.), and an LSI is mounted on a flexible circuit board containing the passive elements (for example, see Patent Document 1). .

  However, since this technique forms a passive element on a flexible circuit board, there is a problem that microfabrication is difficult. For example, if a coil is formed according to the design rule L / S = 70 μm / 70 μm and the through hole diameter is 100 μm, a large coil occupying a huge space is obtained. Not only that, the parasitic capacitance increases, and as a result, the self-resonant frequency of the coil decreases.

  For this reason, it is difficult to apply to a frequency band used in current or future mobile phones such as 2 GHz and 3 GHz. Furthermore, since one passive element becomes large, if a plurality of passive elements are incorporated, the module becomes large, and it can be said that it is difficult to apply it to the current equipment that is becoming multiband.

  In recent years, a technique called WLCSP (Wafer Level Chip Scale Package) has been proposed (see, for example, Patent Documents 2 to 4). WLCSP is a technique in which a rewiring layer is formed on a wafer by a resin layer forming process and a thick film copper wiring process, and then separated by dicing. In other words, it is a manufacturing method in which a wafer is packaged as it is. A package chip manufactured by the WLCSP technology is called a WLP (Wafer Level Package) chip.

  According to this WLCSP technology, it is possible to build a passive element having a high Q value by fine processing on a semiconductor wafer in which a wireless circuit is built. Therefore, it can be said that the WLCSP technology is a package form suitable for the radio circuit IC.

Japanese Patent Laying-Open No. 2005-045111 JP 2005-108929 A JP 2007-281929 A JP 2008-016703 A

  However, the number of pins required for the radio circuit IC is considerable in order to control the radio circuit IC or input / output signals in response to the background of multi-band devices and integration of functional circuit blocks. . For example, the latest W-CDMA triple-band compatible transmission / reception one-chip IC requires 96 pins for a radio circuit IC having a size of 4.13 mm × 4.16 mm. For this reason, even if a rewiring layer is formed on the upper surface of the wireless circuit IC by WLCSP technology in order to connect (electrically connect) the numerous pins to the mounting substrate, the electrode pads formed by the rewiring layer have a narrow spacing. Many will be arranged.

  On the other hand, passive elements made by the WLCSP technology, particularly coils, occupy a relatively large area of several hundred μm square. For this reason, in the current wireless circuit IC in which a large number of electrode pads by redistribution layers for connecting a large number of pins are arranged on the upper surface at a narrow interval, a space for creating a passive element by the WLCSP technology is secured on the upper surface. Is difficult. Thus, since functional elements (mainly passive elements) such as a high-performance coil cannot be obtained, there is a problem that the wireless circuit IC cannot sufficiently exhibit its performance.

  The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a wireless circuit module in which the wireless circuit IC can sufficiently exhibit its performance.

  In the wireless circuit module of the present invention, a base substrate, a first adhesive layer, and a first printed circuit board are provided in this order so as to be wirelessly provided in the first adhesive layer along an overlapping surface with the first printed circuit board. A circuit IC chip and a WLP chip in which a functional element constituting a wireless communication circuit is formed in cooperation with the wireless circuit IC chip are arranged side by side, wiring formed on the first printed circuit board, and the first The wireless circuit IC chip and the WLP chip are electrically connected through a printed circuit board and a conductive via hole provided through the first adhesive layer.

  According to the wireless circuit module of the present invention, the wireless circuit IC chip and the WLP chip in which the functional elements constituting the wireless communication circuit are formed in cooperation with the wireless circuit IC chip are juxtaposed in the first adhesive layer. In the WLP chip, the wirings formed on the first printed circuit board and the conductive via holes provided through the first printed circuit board and the first adhesive layer are connected to each other. Can realize a functional element such as a high-performance coil, so that the performance of the wireless circuit IC chip can be sufficiently exerted without incorporating a high-performance functional element by the WLCSP technology into the wireless circuit IC chip. There is an effect. Thereby, for example, one inductor can be formed by electrically connecting the wiring of the WLP chip and the wiring of the printed circuit.

It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 1 of this invention. It is a schematic cross-sectional view illustrating a configuration example of a wireless circuit IC. It is a schematic diagram explaining the structural example of a WLP chip | tip. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 2 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 3 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 4 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 5 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 6 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 7 of this invention. It is a schematic cross section which shows the structural example of the radio | wireless circuit module of Embodiment 8 of this invention.

  Hereinafter, the present invention will be described in detail with reference to the drawings. However, the present invention is not limited thereto, and various modifications can be made without departing from the gist of the present invention.

<Embodiment 1>
FIG. 1 is a schematic cross-sectional view showing a configuration example of a radio circuit module according to Embodiment 1 of the present invention. 1, the wireless circuit module 100 according to the first embodiment includes a wireless circuit IC chip 10, a WLP chip 20 in which a coil or the like is formed, a base substrate 30, a first adhesive layer 40, and a first printed circuit board 50. The second adhesive layer 60, the second printed circuit board 70, and the spacers 80a and 80b constitute an IC-embedded board. Here, the WLP chip 20 is a chip in which functional elements constituting a wireless communication circuit are formed by the WLCSP technology in cooperation with the wireless circuit IC chip 10.

[Base substrate 30]
The base substrate 30 is an insulating substrate made of an insulating film or the like. Here, a polyimide film is used as the base substrate 30.

[First printed circuit board 50]
The first printed circuit board 50 forms the first wiring layer 52 on the surface of the insulating substrate 51 made of an insulating film or the like, and penetrates through the insulating substrate 51 and the first adhesive layer 40 underneath, A first conductive via hole group 53 that is electrically connected to the back surface of the wiring and electrode pads constituting the first wiring layer 52 is formed. Here, a polyimide film is used as the insulating substrate 51. In addition, a conductive paste IVH (Interstitial Via Hole) is used as a conductive via hole constituting the first conductive via hole group 53.

[Second printed circuit board 70]
Similarly, the second printed circuit board 70 forms a second wiring layer 72 on the surface of an insulating substrate 71 made of an insulating film or the like, and penetrates the insulating substrate 71 and the second adhesive layer 60 below it. Thus, a second conductive via hole group 73 is formed which is electrically connected to the wiring constituting the second wiring layer 72 and the back surface of the electrode pad. Here, a polyimide film is used as the insulating substrate 71. In addition, as a conductive via hole constituting the second conductive via hole group 73, a conductive paste IVH (Interstitial Via Hole) is used.

[First Adhesive Layer 40, Second Adhesive Layer 60]
The first adhesive layer 40 is an insulating resin layer made of a thermosetting adhesive such as an epoxy resin. Similarly, the second adhesive layer 60 is also an insulating resin layer made of a thermosetting adhesive such as an epoxy resin.

[Spacers 80a, 80b]
The spacers 80a and 80b are each an insulating material made of an insulating film or the like. As the spacers 80a and 80b, the same material as that of the base substrate 30 and the insulating substrates 51 and 71 can be used. Here, a polyimide film is used as the spacers 80a and 80b. The thicknesses of the spacers 80a and 80b are appropriately set according to the thicknesses of the wireless circuit IC chip 10 and the WLP chip 20.

  These spacers 80a and 80b are provided to ensure flatness between the base substrate 30 and the first printed circuit board 50 and to avoid problems such as contact between the radio circuit IC chip 10 and the WLP chip 20. It is.

[Wireless circuit IC chip 10]
FIG. 2 is a schematic cross-sectional view illustrating a configuration example of the wireless circuit IC chip 10. In FIG. 2, the wireless circuit IC chip 10 includes a semiconductor substrate 13, a functional circuit block 14, an Al pad 15, a passivation film 16, a rewiring layer 17, and a resin layer 18. The wireless circuit IC chip 10 is a WLP chip processed by the WLCSP technology, but an IC chip not processed by WLCSP can also be used.

  The semiconductor substrate 13 is a compound semiconductor substrate such as a silicon substrate, a SiGe substrate, or a GaAs substrate, for example. On the surface side of the semiconductor substrate 13, a plurality of functional circuit blocks 14 necessary for obtaining I and Q signals from analog high frequency signals or obtaining an analog high frequency signal from I and Q signals are formed. These functional circuit blocks 14 include an LNA (Low-Noise Amplifier), a demodulator (Demodulator), a voltage controlled oscillator (VCO), a PLL (Phase Locked Loop), an LPF (Low Pass Filter), a modulator ( Modulator), variable gain amplifier (VGA), driver amplifier, and the like.

  A passivation film 16 is formed on the semiconductor substrate 13, and an opening for exposing the Al pad 15 is formed in the passivation film 16. A rewiring layer 17 and a resin layer 18 are formed on the passivation film 16 by WLCSP technology. Each rewiring constituting the rewiring layer 17 is connected to the functional circuit block 14 via the Al pad 15. In the resin layer 18, an opening 18 a that exposes an electrode pad portion of the rewiring that constitutes the rewiring layer 17 is formed. The rewiring electrode pad portion is connected to the conductive via hole of the first conductive via hole group 53 when the wireless circuit IC chip 10 is built in the wireless circuit module 100.

[WLP chip 20]
3A and 3B are schematic diagrams for explaining a configuration example of the WLP chip 20, wherein FIG. 3A is a perspective view and FIG. 3B is a cross-sectional view taken along line AA in FIG. In FIG. 3, the WLP chip 20 includes a substrate 23, a passivation film 24 such as an oxide film, a first resin layer 25, a first redistribution layer 26, a second resin layer 27, and a second redistribution layer 28. And a sealing resin layer 29. The WLP chip 20 in FIG. 3 is an example in which a coil is formed by a first redistribution layer 26 and a second redistribution layer 28.

  In the WLP chip 20 of FIG. 3, a passivation film 24 is formed on a substrate 23, a first resin layer 25 is formed thereon, and a first redistribution layer 26 is formed on the first resin layer 25 by copper plating or the like. A second resin layer 27 is formed thereon by patterning, and a contact hole for connecting the first rewiring layer 26 and the second rewiring layer 28 is provided in the second resin layer 27. Further, a second rewiring layer 28 is formed by patterning on the second resin layer 27 by copper plating or the like, a sealing resin layer 29 is formed thereon, and the second rewiring layer 29 is formed on the sealing resin layer 29. An opening 29a is formed to expose the electrode pad portion of the rewiring constituting 28. The electrode pad portion of the rewiring is connected to the conductive via hole of the first conductive via hole group 53 when the WLP chip 20 is built in the wireless circuit module 100.

  As the substrate 23, silicon, glass, ceramics, or the like is used. Moreover, as the 1st resin layer 25, the 2nd resin layer 27, and the sealing resin layer 29, photosensitive resin, such as a polyimide resin and an epoxy resin, is used. It is also possible to adopt a configuration in which the passivation film 24 is not provided.

  In the WLP chip 20, the wiring of the second redistribution layer 28 constitutes a spiral portion of the coil, an electrode pad at the outer peripheral end of the coil, and an electrode pad at the inner peripheral end of the coil. An underpass that connects between the electrode pad at the end and the electrode pad at the outer peripheral end of the coil is formed.

As described above, the width and length of the WLP chip 20 in which the coil is formed by the WLCSP technology is several hundred μm square. The Q value of the coil formed on the WLP chip 20 is 20 or more. That is, a high Q value that is four times or more that of a coil formed of thin film Al by CMOS technology can be obtained.
Further, since the WLP chip 20 is processed using a semiconductor manufacturing process, the WLP chip 20 can be processed with finer and higher precision than when a coil is formed on a printed circuit board. Therefore, by forming the coil by the WLCSP technology, it is possible to realize a finer and higher performance (high self-resonant frequency) coil than when the coil is formed on the printed circuit board.

  The WLP chip 20 includes, in addition to a coil formed, an LC filter circuit formed of a coil and a capacitor, a balance transformer (balun), and a directional coupler. It is also possible to form a plurality of passive circuits on the WLP chip 20 for processing signals in respective multiband frequency bands.

[Manufacturing procedure]
A manufacturing procedure of the wireless circuit module 100 according to the first embodiment will be described below. First, the wireless circuit IC chip 10, the WLP chip 20, the base substrate 30, the insulating substrate 51 constituting the first printed circuit board 50, and the insulating substrate 71 constituting the second printed circuit board 70 are prepared. To do.

  Next, a thermosetting resin sheet to be the first adhesive layer 40 is provided on the surface of the base substrate 30. This is the first structure.

  In addition, each wiring and electrode pad constituting the first wiring layer 52 are formed by etching from a single-sided copper-clad plate having a copper foil disposed on the surface of the insulating substrate 51, and the back surface of the insulating substrate 51. A thermosetting resin sheet to be the first adhesive layer 40 is provided. Then, a plurality of via holes reaching the wiring back surface from the resin sheet side are formed, and a conductive paste is filled in each of these via holes to form a first conductive via hole group 53. This is the second structure.

  Similarly, each wiring and electrode pad constituting the second wiring layer 72 are formed on the surface of the insulating substrate 71 by etching from a single-sided copper-clad plate in which a copper foil is arranged, and the insulating substrate 71 A thermosetting resin sheet to be the second adhesive layer 60 is provided on the back surface. Then, a plurality of via holes reaching the wiring back surface from the resin sheet side are formed, and a conductive paste is filled in each of these via holes to form a second conductive via hole group 73. This is the third component.

  Next, the wireless circuit IC chip 10 and the WLP chip 20 are placed in the space between the front surface of the first structure and the back surface of the second structure, and the back surface of the second structure (first printed circuit board 50). The spacers 80a and 80b are arranged on both sides of the WLP chip 20 and sandwiched therebetween. That is, the wireless circuit IC chip 10 and the WLP chip 20 are juxtaposed with each other through the spacer 80a and sandwiched between the first structure (base substrate 30) and the second structure (first printed circuit board 50). . Further, the third structure (second printed circuit board 70) is disposed on the surface of the second structure. Then, the three laminated bodies are thermocompression bonded together.

  As a result, the substrates or the substrate and the chip are joined and buried with the thermosetting resin, and the first conductive via hole group 53 and the wiring provided on different substrates and between the wiring provided on the substrate and the chip electrode are The second conductive via hole group 73 is electrically connected. In FIG. 1, the electrode pad portion of the wireless circuit IC chip 10 and the electrode pad portion of the WLP chip 20 are at least formed by the wiring 52 a of the first wiring layer 52 and the conductive via holes 53 a and 53 b of the first conductive via hole group 53. It is connected. In FIG. 1, the second adhesive layer 60 and the second printed circuit board 70 may be omitted. Alternatively, the adhesive layer and the printed circuit board can have three or more layers.

  As described above, according to the first embodiment, the wireless circuit IC chip 10 and the WLP chip 20 in which the functional elements constituting the wireless communication circuit are formed in cooperation with the wireless circuit IC chip 10 are the first. In parallel with the adhesive layer 40, the wiring 52 a formed in the first wiring layer 52 of the first printed circuit board 50 and the first printed circuit board 50 and the first adhesive layer 40 provided through the first wiring layer 52. By connecting the two chips with the conductive via holes 53a and 53b of the conductive via hole group 53, a functional element such as a high-performance coil can be realized in the WLP chip 20, so that the wireless circuit IC chip 10 has WLCSP technology. The performance of the wireless circuit IC chip 10 can be fully exhibited without having to make a high-performance functional element.

<Embodiment 2>
FIG. 4 is a schematic cross-sectional view showing a configuration example of a radio circuit module according to the second embodiment of the present invention. In FIG. 4, the same components as those in FIG. The wireless circuit module 200 according to the second embodiment includes a wireless circuit IC chip 11, a WLP chip 21, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer 60. The second printed circuit board 70 and the spacers 81a and 81b are provided to form an IC built-in board.

  The wireless circuit IC chip 11 is obtained by grinding the wireless circuit IC chip 10 (see FIG. 1) of the first embodiment from the back surface (surface opposite to the functional circuit block forming surface) to reduce the thickness. . Similarly, the WLP chip 21 is obtained by thinning the WLP chip 20 (see FIG. 1) of the first embodiment, whose substrate is made of a semiconductor, from the back surface. These thinnings are performed, for example, by applying a back grind of a semiconductor manufacturing process to a wafer before dicing into chips. According to the back grind, the substrate (wafer) can be thinned to a minimum of about 30 μm.

  Further, the spacers 81a and 81b are thinned from the spacers 80a and 80b (see FIG. 1) of the first embodiment in accordance with the thinning of the wireless circuit IC chip and the WLP chip.

  That is, the wireless circuit module 200 of the second embodiment is obtained by reducing the thickness between the base substrate 30 and the first printed circuit board 50 in the wireless circuit module 100 of the first embodiment (see FIG. 1). The module is made thinner.

  As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained, and the wireless circuit module can be thinned. This is effective when this module is mounted in a position where it cannot be secured.

<Embodiment 3>
FIG. 5 is a schematic cross-sectional view showing a configuration example of a wireless circuit module according to Embodiment 3 of the present invention. In FIG. 5, the same components as those in FIG. The wireless circuit module 300 according to the third embodiment shown in FIG. 5 includes a wireless circuit IC chip 10, a WLP chip 20, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer. 60 and the second printed circuit board 70 to form an IC-embedded board.

  That is, the wireless circuit module 300 according to the third embodiment has the same first adhesive layer as the wireless circuit IC chip 10 and the WLP chip 20 without providing the spacers 80a and 80b in the wireless circuit module 100 according to the first embodiment. 40 are juxtaposed adjacent to each other. By optimizing the adjacent distance between the wireless circuit IC chip 10 and the WLP chip 20, the flatness between the base substrate 30 and the first printed circuit board 50 can be secured without providing a spacer, and the wireless circuit IC chip 10. And other problems such as contact between the WLP chip 20 and the like can be avoided.

  Therefore, the wireless circuit module 300 according to the third embodiment has a module configuration in which the spacer is omitted by arranging the wireless circuit IC chip 10 and the WLP chip 20 adjacent to each other in the wireless circuit module 100 according to the first embodiment. In addition to simplification, the width and length of the module are shortened.

  As described above, according to the third embodiment, the same effects as those of the first embodiment can be obtained, and the width or length of the module can be shortened. This is effective when the module is mounted at a position where a space in the width direction or the length direction cannot be secured.

  Note that the configuration in which the spacer of the third embodiment is not provided can also be applied to the second embodiment.

<Embodiment 4>
FIG. 6 is a schematic cross-sectional view showing a configuration example of a radio circuit module according to the fourth embodiment of the present invention. In FIG. 6, the same components as those in FIG. The wireless circuit module 400 of the fourth embodiment shown in FIG. 6 includes a wireless circuit IC chip 10, WLP chips 20a and 20b, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second printed circuit board 50. The adhesive layer 60, the second printed circuit board 70, and the spacers 80a, 80b, 80c, and 80d are included to form an IC built-in board.

  The two WLP chips 20a and 20b have the same configuration as the WLP chip 20 (see FIG. 3) of the first embodiment, and the passive circuits formed on the respective chips may be different from each other. May be the same. The materials and functions of the spacers 80c and 80d are the same as those of the spacers 80a and 80b in the first embodiment.

  The wireless circuit module 400 according to the fourth embodiment is the same as the wireless circuit module 100 according to the first embodiment (see FIG. 1), in which the wireless circuit IC chip 10 and the WLP chip 20a are bonded to each other through the spacer 80a. The radio circuit IC chip 10 and the WLP chip 20b are juxtaposed in the same first adhesive layer 40 via a spacer 80c while juxtaposed in the layer 40. In FIG. 6, the electrode pad portion of the wireless circuit IC chip 10 and the electrode pad portion of the WLP chip 20 a are at least formed by the wiring 52 a of the first wiring layer 52 and the conductive via holes 53 a and 53 b of the first conductive via hole group 53. The electrode pad portion of the wireless circuit IC chip 10 and the electrode pad portion of the WLP chip 20b are connected by the wiring 52b of the first wiring layer 52 and the conductive via holes 53c and 53d of the first conductive via hole group 53. Has been.

  Similarly, three or more WLP chips can be arranged in the same first adhesive layer 40 as the wireless circuit IC chip 10. In this way, by arranging a necessary number of various WLP chips that form high-performance peripheral circuits necessary for the wireless circuit IC chip 10, including a WLP chip that forms high-performance coils with a high self-resonance frequency, The performance and function of the radio circuit IC chip 10 can be sufficiently exhibited, and thereby the module can have high performance and multiple functions.

  Furthermore, in addition to one or a plurality of WLP chips, a baseband IC chip and other application IC chips can be arranged in the same first adhesive layer 40 as the wireless circuit IC chip 10. The baseband IC chip is connected to the radio circuit IC chip 10 via the first wiring layer 52 and the first conductive via hole group 53.

  When a plurality of chips are juxtaposed with the wireless circuit IC chip 10 in this way, for example, considering the wiring length with the wireless circuit IC chip 10 and the width and length dimensions of the module, the respective chips are arranged. It is desirable to arrange.

  As described above, according to the fourth embodiment, the same effects as those of the first embodiment can be obtained, and a plurality of WLP chips and the like necessary for exhibiting the performance and function of the wireless circuit IC chip 10 can be obtained. By juxtaposing in the same first adhesive layer 40 as the radio circuit IC chip 10 and incorporating it in the module, a high-performance and multi-function radio circuit module can be realized without changing the thickness of the module.

  The configuration in which the plurality of WLP chips and the like according to the fourth embodiment are provided can also be applied to the second or third embodiment.

<Embodiment 5>
FIG. 7 is a schematic cross-sectional view showing a configuration example of a radio circuit module according to the fifth embodiment of the present invention. In FIG. 7, the same components as those in FIG. The wireless circuit module 500 of the fifth embodiment shown in FIG. 7 includes a wireless circuit IC chip 10, a WLP chip 20, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer. 60, a second printed circuit board 70, and spacers 80a and 80b to form an IC-embedded board, and an antenna 72a is formed on the second wiring layer 72 of the second printed circuit board 70.

  That is, the wireless circuit module 500 of the fifth embodiment is one of the components of the second wiring layer 72 of the second printed circuit board 70 in the wireless circuit module 100 of the first embodiment (see FIG. 1). The antenna 72a is formed. The antenna 72 a includes conductive via holes that constitute the second conductive via hole group 73, wiring that constitutes the first wiring layer 52 of the first printed circuit board 50, and conductive via holes that constitute the first conductive via hole group 53. Is connected to the wireless circuit IC chip 10 via

  In addition to the antenna, a balance transformer, a directional coupler, a trap circuit, and the like can be provided on the second wiring layer 72 of the second printed circuit board 70.

  The antenna does not require much microfabrication, but it is necessary to design a scale size according to the wavelength of a signal to be transmitted or received. The same applies to balance transformers, directional couplers, trap circuits, and the like. These circuits can be provided on the first wiring layer 52 of the first printed circuit board 50 or the WLP chip 20, but the second wiring layer 72 at the top of the module capable of securing the necessary space can be used. It is easiest to provide. For example, when forming a circuit such as a balance transformer or a directional coupler that cannot be formed in one layer, or when forming a circuit such as an antenna in multiple layers, the third wiring layer is formed on the second wiring layer 72. Is provided. Even if these circuits are provided in the second wiring layer 72 and the third wiring layer, the performance of the module is not deteriorated.

  As described above, according to the fifth embodiment, although fine processing is not so required, a circuit such as an antenna whose scale size needs to be designed according to the wavelength of a signal to be transmitted or received is connected to the second wiring layer at the top of the module. By providing in 72, the freedom degree of design of a module can be improved.

  Note that the configuration in which the antenna or the like according to the fifth embodiment is provided can be applied to any of the second to fourth embodiments.

<Embodiment 6>
FIG. 8 is a schematic cross-sectional view showing a configuration example of a wireless circuit module according to the sixth embodiment of the present invention. In FIG. 8, the same components as those in FIG. 7 (Embodiment 5) are denoted by the same reference numerals. The wireless circuit module 600 of the sixth embodiment shown in FIG. 8 includes a wireless circuit IC chip 10, a WLP chip 20, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer. 60, a second printed circuit board 70, and spacers 80a and 80b to form an IC-embedded board. An antenna 72a is formed on the second wiring layer 72 of the second printed circuit board 70, and a duplexer (antenna A duplexer, duplexer) component 601 and a BPF (Band-Pass Filter) component 602 are mounted. For example, one terminal of a duplexer component is connected to the input part (pad) of the LNA of the wireless circuit IC chip, and the output part (pad) of the LNA is a BPF mounted on the top through a printed circuit and a conductive via hole. It is conceivable to be connected to the input unit (pad).

  Therefore, the wireless circuit module 600 according to the sixth embodiment is similar to the wireless circuit module 500 according to the fifth embodiment, except that the duplexer component 601 is formed on the wirings or electrode pads constituting the second wiring layer 72 of the second printed circuit board 70. And a BPF component 602 mounted.

  However, in the sixth embodiment, the antenna 72a is connected to the radio circuit IC chip 10 via the duplexer component 601. Of course, a configuration in which either the duplexer component 601 or the BPF component 602 is mounted is also possible.

  For example, a dielectric duplexer is used as the duplexer component 601. Further, as the BPF component 602, for example, a SAW (Surface Acoustic Wave) filter or a FBAR (Film Bulk Acoustic Resonator) filter MEMS (Micro Electro Mechanical Systems) chip or a ceramic filter chip is used.

  For example, the duplexer component 601 is mounted so that one end thereof is connected to the antenna 72 a and the other end is connected to the electrode pad 72 b of the second wiring layer 72 that is electrically connected to the wireless circuit IC chip 10. In addition, the BPF component 602 has one end connected to the electrode pad 72c of the second wiring layer 72 that is electrically connected to the output of the LNA circuit block of the wireless circuit IC chip 10, and the other end connected to the RFIC ( It is mounted so as to be connected to the electrode pad 72d of the second wiring layer 72 that is conducted to the input of the (Radio Frequency Integrated Circuit) block.

  As described above, according to the sixth embodiment, by mounting the duplexer component 601 and the like on the wireless circuit module, it is possible to reduce the size of the wireless communication device such as a mobile phone.

  The configuration for mounting the duplexer part or the like according to the sixth embodiment can be applied to any of the second to fourth embodiments.

<Embodiment 7>
FIG. 9 is a schematic cross-sectional view showing a configuration example of a wireless circuit module according to the seventh embodiment of the present invention. In FIG. 9, the same components as those in FIG. 9 includes a wireless circuit IC chip 10, a WLP chip 20, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer. 60, the second printed circuit board 70, the spacers 81a and 81b, the third adhesive layer 90, and the third printed circuit board 95 constitute an IC-embedded board.

  In the wireless circuit module 700 of the seventh embodiment, the second wiring layer 72 of the second printed circuit board 70 has a two-layer structure, and a decoupling capacitor 72e is formed on the second printed circuit board 70.

  A third adhesive layer 90 is further provided on the second printed circuit board 70 on which the decoupling capacitor 72e is formed, and a third printed circuit board 95 is provided thereon. The insulating substrate 96 of the third printed circuit board 95 is provided with an electrode pad 97a and a conductive via hole 98a for connecting the upper electrode of the decoupling capacitor 72e to GND.

  It is also possible to form a high frequency choke coil on the second printed circuit board 70. In this case, one end of the high-frequency choke coil is connected to a power source through an electrode pad formed on the third printed circuit board 95 and a conductive via hole.

  As described above, according to the seventh embodiment, it is possible to reduce the size of a wireless communication device such as a mobile phone by incorporating the decoupling capacitor 72e and the like in the wireless circuit module.

  The configuration incorporating the decoupling capacitor or the like according to the seventh embodiment can be applied to any of the second to sixth embodiments.

<Eighth embodiment>
FIG. 10 is a schematic cross-sectional view showing a configuration example of a radio circuit module according to the eighth embodiment of the present invention. In FIG. 10, the same reference numerals are assigned to the same components as those in FIG. The wireless circuit module 800 of the eighth embodiment shown in FIG. 10 includes a wireless circuit IC chip 10, a WLP chip 20, a base substrate 30, a first adhesive layer 40, a first printed circuit board 50, and a second adhesive layer. 60, a second printed circuit board 70, and spacers 80a and 80b to form an IC-embedded board, and a decoupling capacitor component 801 is further mounted on the second wiring layer 72 of the second printed circuit board 70. It is a thing.

  In the radio circuit module 800 according to the eighth embodiment, the decoupling capacitor component 801 is mounted on the second printed circuit board 70. However, a high-frequency choke coil component may be mounted on the second printed circuit board 70. Is possible.

  As described above, according to the eighth embodiment, it is possible to reduce the size of a wireless communication device such as a mobile phone by mounting the decoupling capacitor component 801 and the like on the wireless circuit module.

  The configuration for mounting the decoupling capacitor component or the like according to the eighth embodiment can be applied to any one of the second to sixth embodiments.

  10, 11 wireless circuit IC chip, 13 semiconductor substrate, 14 functional circuit block, 15 Al pad, 16 passivation film, 17 rewiring layer, 18 resin layer, 18a opening, 20, 20a, 20b, 21 WLP chip, 23 substrate 24 Passivation film, 25 First resin layer, 26 First redistribution layer, 27 Second resin layer, 28 Second redistribution layer, 29 Sealing resin layer, 29a Opening, 30 Base substrate, 40 First adhesive layer 50 First printed circuit board, 51 Insulating board, 52 First wiring layer, 52a, 52b Wiring, 53 First conductive via hole group, 53a, 53b, 53c, 53d Conductive via hole, 60 Second adhesive layer, 70 Second printed circuit board, 71 Insulating board, 72 Second wiring layer, 72a Antenna, 72b, 72c, 72d electrode pad, 72e decoupling capacitor, 73 second conductive via hole group, 80a, 80b, 80c, 80d, 81a, 81b spacer, 90 third adhesive layer, 95 third printed circuit board, 96 insulation Conductive substrate, 97a electrode pad, 98a conductive via hole, 100, 200, 300, 400, 500, 600 wireless circuit module, 601 duplexer component, 602 BPF component, 700, 800 wireless circuit module, 801 decoupling capacitor component.

Claims (5)

A base substrate, a first adhesive layer, and a first printed circuit board are stacked in order,
A WLP in which a wireless circuit IC chip and a functional element constituting a wireless communication circuit in cooperation with the wireless circuit IC chip are formed in the first adhesive layer along an overlapping surface with the first printed circuit board. Place the chip side by side,
The wireless circuit IC chip and the WLP chip through wiring formed on the first printed circuit board and conductive via holes provided through the first printed circuit board and the first adhesive layer And a wireless circuit module characterized by being electrically connected to each other.   The wireless circuit module according to claim 1, wherein the WLP chip is a chip in which a coil is formed on a resin layer on a substrate.   The wireless circuit module according to claim 1, wherein a spacer is provided between the wireless circuit IC chip and the WLP chip.   The wireless circuit module according to any one of claims 1 to 3, wherein the wireless circuit IC chip and the WLP chip are thinned by grinding back surfaces of respective substrates. A second adhesive layer and a second printed circuit board are sequentially stacked on the first printed circuit board,
An antenna is formed on the second printed circuit board, and one end of the antenna is formed on the first printed circuit board and a conductive via hole provided through the second printed circuit board and the second adhesive layer. The wireless circuit IC chip is electrically connected via the formed wiring and a conductive via hole provided through the first printed circuit board and the first adhesive layer. The radio circuit module according to claim 1.

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