JP5327150B2 - Laminate of semiconductor module and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor module laminate easy to assemble the semiconductor module laminate, capable of sustaining the sealed state of mating surfaces for a long term use. <P>SOLUTION: A laminate 1 of semiconductor modules 2 has a plurality of laminated semiconductor modules 2 formed by the disposition of semiconductor devices 3 in a mold resin 4. The mold resin 4 includes: refrigerant channels 41; seal filling grooves 46 formed on the entire circumferences of mating surfaces 42 on the circumference side of the refrigerant channels 41; and a filling connection port 47 communicating with the seal filling grooves 46. Lids 21A, 21B are laminated on both lamination ends relative to the plurality of semiconductor modules 2. On one lid 21A, a filling injection port 24 communicating with the seal filling grooves 46 is formed. In the laminate 1 of the semiconductor modules 2, a seal material 6 injected from the seal injection port 24 is continuously filled into the plurality of seal filling grooves 46 through the filling connection port 47. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a laminate formed by laminating a plurality of semiconductor modules having semiconductor elements, and a method for manufacturing the same.

When configuring a power conversion device or the like used in a vehicle, a semiconductor element including a switching element or the like is arranged in a mold resin to form a semiconductor module, and a plurality of the semiconductor modules are stacked and used.
As this laminated body of semiconductor modules, for example, there is a semiconductor device disclosed in Patent Document 1. In this semiconductor device, a heat sink for heat transfer is arranged on both sides of the semiconductor element, and the semiconductor element and the heat sink are sealed with a mold resin so that the heat dissipation surface of the heat sink is exposed to form a semiconductor mounting body. ing. Further, the heat radiating surface of the heat sink is configured to be cooled by the refrigerant, and a refrigerant flow path for flowing the refrigerant is formed by a part of the mold resin.

JP 2006-165534 A

By the way, when forming the coolant flow path in the mold resin itself, there is a problem of how to seal the mating surfaces where a plurality of semiconductor mounting bodies (semiconductor modules) are combined.
In Patent Document 1, an adhesive is applied to the entire peripheral wall portion of the mating surface formed by the mold resin constituting the semiconductor mounting body, and the respective semiconductor mounting bodies are joined by this adhesive.
However, the adhesive is difficult to apply uniformly and is not sufficient for the continuous sealing of the mating surfaces.
On the other hand, it is also conceivable to use a sealing material such as an O-ring or a gasket instead of using an adhesive. However, when these sealing materials are used, the assembling man-hours are required, and if dust or the like is sandwiched between the mating surface and the sealing material, it becomes difficult to seal the mating surface.

  The present invention has been made in view of such conventional problems, and can easily assemble a laminated body of semiconductor modules, and can maintain a sealing state of a mating surface for long-term use. It is intended to provide a laminated body.

A first invention is a laminated body of semiconductor modules in which a plurality of semiconductor modules formed by arranging semiconductor elements in a mold resin are laminated,
The mold resin includes a coolant channel for flowing a coolant that cools the semiconductor element, a seal filling groove formed on the entire periphery of the mating surface where the mold resin meets each other on the outer peripheral side of the coolant channel, and the seal A filling connection port formed through the semiconductor module in the stacking direction so as to communicate with the filling groove;
A lid is laminated on both sides of the plurality of semiconductor modules, and a filling inlet that communicates with the seal filling groove is formed on one of the lids.
The semiconductor module laminate is characterized in that the sealing material injected from the filling inlet is continuously filled into the plurality of seal filling grooves via the filling connection port (Claim 1). .

According to a second aspect of the present invention, there is provided a method for manufacturing a stacked body of semiconductor modules in which a plurality of semiconductor modules formed by arranging semiconductor elements in a mold resin are stacked.
The mold resin includes a coolant channel for flowing a coolant for cooling the semiconductor element, a seal filling groove formed on the entire periphery of the mating surface where the mold resin is combined with each other on the outer peripheral side of the coolant channel, And forming a filling connection port penetrating in the stacking direction of the semiconductor module so as to communicate with the seal filling groove,
A laminated body on both sides of the plurality of semiconductor modules is laminated with a lid, and a filling inlet that communicates with the seal filling groove is formed on one of the lid,
A method of manufacturing a laminated body of a semiconductor module, comprising: injecting a sealing material from the filling inlet, and continuously filling the sealing material into the plurality of seal filling grooves via the filling connection port. (Claim 6).

The laminated body of the semiconductor module of the first invention does not require application of an adhesive or the like, and seals (seal) the mating surface of the mold resin without using a sealing material such as an O-ring or a gasket. It is something that can be done.
Specifically, in the present invention, the seal filling groove and the filling connection port are formed in the mold resin, and the sealing material injected from the filling injection port is transferred to the plurality of seal filling grooves via the filling connection port. The laminated body is formed by continuously filling and laminating each semiconductor module. That is, a stacked body can be formed by stacking the semiconductor modules and filling the sealing material in the stacked state.
Thereby, the sealing material of the present invention does not need to be applied to the mating surfaces like an adhesive, and does not need to be molded into a predetermined shape like an O-ring or a gasket. Therefore, sealing of the mating surfaces where the mold resins are combined can be performed by a simple method, and sealing of the mating surfaces can be performed stably.

  Therefore, according to the laminated body of the semiconductor module of the first invention, it is easy to assemble the laminated body of the semiconductor module, and the sealing state of the mating surface can be maintained for long-term use.

  According to the method for manufacturing a laminated body of semiconductor modules of the second invention, as in the first invention, assembly of the laminated body of semiconductor modules is easy, and the sealing state of the mating surface for long-term use Can be sustained.

1 is a perspective view showing a stacked body of semiconductor modules in Example 1. FIG. 1 is a perspective view showing a semiconductor module in Example 1. FIG. Sectional explanatory drawing shown in the state which looked at the laminated body of the semiconductor module in Example 1 from the width direction. Sectional explanatory drawing shown in the state which looked at the laminated body of the semiconductor module in Example 1 from the longitudinal direction. Sectional explanatory drawing which shows the semiconductor module and cooler in Example 1 in the state seen from the width direction. Sectional explanatory drawing which shows the semiconductor module and cooler in Example 1 in the state seen from the longitudinal direction. Sectional explanatory drawing which shows the laminated body of the semiconductor module of the state filled with the sealing material in Example 1 in the state seen from the width direction. Sectional explanatory drawing which expands and shows a part of laminated body of the semiconductor module in Example 1 in the state seen from the longitudinal direction. FIG. 3 is a perspective view schematically showing only a formed state of a seal filling groove and a filling connection port in Example 1. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a circuit explanatory diagram showing an electrical configuration of a power conversion device formed using a stacked body of semiconductor modules in Example 1. Sectional explanatory drawing which shows the laminated body of the other semiconductor module in the state filled with the sealing material in Example 1 in the state seen from the width direction. FIG. 5 is a perspective view schematically showing only the formation state of a seal filling groove and a filling connection port in a stacked body of another semiconductor module in Example 1. FIG. 6 is a perspective view showing a semiconductor module in Example 2. Sectional explanatory drawing which expands and shows a part of laminated body of the semiconductor module in Example 2 in the state seen from the longitudinal direction.

A preferred embodiment of the above-described laminated body of semiconductor modules and the manufacturing method thereof according to the first and second inventions will be described.
In the first and second inventions, as the sealing material, various resin materials that have fluidity at the time of filling and can be cured or solidified after filling can be used. As the sealing material, a thermosetting resin having a property of being cured at a temperature lower than the allowable heat resistant temperature of the semiconductor element can be used. This thermosetting resin may have a property of being cured at a temperature higher than the temperature when the refrigerant used for the laminated body of the semiconductor modules is heated. Moreover, as a thermosetting resin used for a sealing material, what hardens | cures by irradiating light can also be used. As the sealing material, a liquid gasket (FIPG) made of a rubber material such as silicone can also be used.

The filling connection port can be formed to penetrate in the laminating direction at one place in the mold resin of the semiconductor module, or can be formed to penetrate in the laminating direction at a plurality of places.
The filling inlet can be formed at one or a plurality of locations on one side of the lid. Further, the filling inlet can be formed in the lids on both sides in the stacking direction with respect to the plurality of semiconductor modules. In this case, the sealing material can be injected from the filling inlets of the lids on both sides, and the gas can be vented from the outer peripheral side of the seal filling groove located in the central portion of the plurality of seal filling grooves in the stacking direction.

In the first aspect of the present invention, the semiconductor modules that are adjacent to each other are alternately formed at positions opposite to each other in the circumferential direction of the seal filling groove, and the sealing material passes through the plurality of filling connection ports. It is preferable that the plurality of seal filling grooves meander and be filled (claim 2).
In the second invention, the plurality of filling connection ports are alternately formed at positions opposite to each other in the circumferential direction of the seal filling groove of the semiconductor modules adjacent to each other, and the sealing material is provided with a plurality of sealing materials. It is preferable to meander and fill the plurality of seal filling grooves via the filling connection port.
In these cases, the sealing material can be filled almost uniformly from the filling inlet or the filling connection port to both sides in the circumferential direction of each seal filling groove. The sealing material can be filled stably without being generated.
In addition, the filling communication port can be formed at a plurality of positions on opposite sides in the circumferential direction of the seal filling grooves of the semiconductor modules adjacent to each other.

In the first invention, the mold resin has an outflow prevention weir formed by projecting a part of the mating surface on the entire circumference between the seal filling groove and the coolant channel on the mating surface. It is preferable to have (claim 3).
In a second aspect of the invention, the mold resin is provided with an outflow prevention weir formed by projecting a part of the mating surface on the entire circumference between the seal filling groove and the coolant channel on the mating surface. In addition, it is preferable to prevent the sealing material from flowing out to the refrigerant flow path by the outflow prevention weir (claim 8).
In these cases, the formation of the outflow prevention weir can prevent the sealing material filled in the seal filling groove from unexpectedly flowing out to the refrigerant flow path.

In the first invention, it is preferable that a filling outlet for communicating with the seal filling groove is formed on the other side of the lid.
In the second aspect of the invention, a filling outlet that communicates with the seal filling groove is formed on the other side of the lid, and a plurality of injections are made through the filling inlet through the filling inlet. It is preferable that a flow front end of the sealing material continuously filled in the seal filling groove is caused to flow out from the filling outlet.
In these cases, the gas present in the plurality of seal filling grooves and filling connection ports can be extracted from the filling outlet, and the sealing material can be filled more stably.

Further, in the first invention, the seal filling groove is formed on the mating surface located in one of the mold resins in the stacking direction, and the outflow prevention weir is the stack of the mold resin. Preferably, it is formed on the mating surface located in one of the directions (Claim 5).
In this case, it is easy to form the seal filling groove and the outflow prevention weir.

Hereinafter, embodiments of a semiconductor module laminate and a method for manufacturing the same according to the present invention will be described with reference to the drawings.
Example 1
As shown in FIGS. 1 and 3, the stacked body 1 of the semiconductor modules 2 of this example is formed by stacking a plurality of semiconductor modules 2 formed by disposing the semiconductor elements 3 in the mold resin 4.
The mold resin 4 includes a coolant channel 41 for flowing the coolant C that cools the semiconductor element 3 and a seal filling groove 46 formed on the entire periphery of the mating surface 42 where the mold resin 4 meets each other on the outer peripheral side of the coolant channel 41. And a filling connection port 47 penetratingly formed in the stacking direction T of the semiconductor module 2 so as to communicate with the seal filling groove 46.
Lid bodies 21A and 21B are laminated at the laminated ends on both sides of the plurality of semiconductor modules 2, and a filling inlet 24 communicating with the seal filling groove 46 is formed in one lid body 21A. The stacked body 1 of the semiconductor module 2 is formed by continuously filling the sealing material 6 injected from the filling injection port 24 into the plurality of seal filling grooves 46 via the filling connection ports 47.

Below, it demonstrates in full detail with reference to FIGS. 1-12 about the laminated body 1 of the semiconductor module 2 of this example, and its manufacturing method.
As shown in FIG. 10, the laminated body 1 of the semiconductor module 2 of this example constitutes an in-vehicle power converter 7, a booster circuit 72 that boosts a DC voltage, and an inverter that generates an AC voltage from the DC voltage. The circuit 73 is used. The semiconductor element 3 includes a switching element, and forms a bridge circuit of a three-phase AC motor generator 71 by the switching element.
As shown in FIGS. 1 and 2, each semiconductor element 3 is formed by integrating a switching element 3A connected to the positive power supply side and a switching element 3B connected to the negative power supply side. Each semiconductor module 2 pulls out the terminal 22 constituting the positive power supply terminal 731, the negative power supply terminal 732, and the output terminal 733 (or the input terminal 734) to one side in the width direction W, and transmits a control signal to the switching elements 3A and 3B. For this purpose, the terminal 23 constituting the control terminal 735 is drawn out to the other side in the width direction W. The width direction W refers to a direction orthogonal to a thickness direction T and a longitudinal direction L described later.

As shown in FIGS. 3 and 4, the stacked body 1 of the semiconductor modules 2 of this example is configured by sandwiching a cooler 5 for flowing the refrigerant C supplied to the refrigerant flow path 41 between the semiconductor modules 2. ing.
As shown in FIG. 5 and FIG. 6, each semiconductor element 3 is formed in a plate shape, and a plate surface 31 on both sides thereof is provided with a bonding layer 34 of solder, adhesive or the like excellent in heat conductivity. A heat radiating plate 32 (a heat sink, a heat conductive metal plate) made of an aluminum material is arranged to face.

The cooler 5 absorbs heat generated from the semiconductor element 3 that is a heating element via the heat radiating plate 32, and cools the semiconductor element 3.
An insulating film 33 is provided on the outer surface 321 of the heat radiating plate 32 (the surface opposite to the inner surface facing the semiconductor element 3) to insulate between the heat radiating plate 32 and the cooler 5.
A plurality of semiconductor modules 2 (the number necessary for forming the power conversion circuit) are stacked in the thickness direction T of the semiconductor element 3.

As shown in FIGS. 2 and 8, the seal filling groove 46 of this example is formed on the mating surface 42 located on one side in the stacking direction T in the mold resin 4. Each seal filling groove 46 is formed on the outer circumference side of the refrigerant flow path 41 and in the vicinity of the outer circumference end of the mating surface 42 along the shape of the outer circumference end.
As shown in FIGS. 3 and 9, the filling connection ports 47 of this example are alternately formed at positions farthest from each other in the circumferential direction of the seal filling grooves 46 of the semiconductor modules 2 adjacent to each other. That is, in the stacked body 1 of the semiconductor modules 2, the filling connection port 47 is formed on one side (one side in the longitudinal direction) of the positions facing each other in any of the semiconductor modules 2, and in the semiconductor module 2 adjacent thereto, Forms a filling connection port 47 on the other side of the position facing each other (the other side in the longitudinal direction), and further forms a filling connection port 47 on one side of the position facing each other in the adjacent semiconductor module 2. The connection ports 47 are formed alternately on the other side and one side. FIG. 9 is a diagram schematically showing only the formation state of the seal filling groove 46 and the filling connection port 47.

As shown in FIG. 7, the sealing material 6 of this example is meanderingly filled into the plurality of seal filling grooves 46 via the plurality of filling connection ports 47. As a result, the sealing material 6 injected from the filling injection port 24 can be filled substantially evenly from the filling injection port 24 or the filling connection port 47 to both sides in the circumferential direction of each seal filling groove 46. The sealing groove 6 can be stably filled into the filling groove 46 without causing a filling failure.
The sealing material 6 of this example is a thermosetting resin that has fluidity at the time of filling and has a property of being cured by heating after filling. This thermosetting resin has a property of curing at a temperature lower than the allowable heat-resistant temperature of the semiconductor element 3.

As shown in FIG. 8, the seal filling groove 46 of this example is formed in a substantially square cross-sectional shape. On the other hand, the seal filling groove 46 can be formed in various cross-sectional shapes such as a V shape and an arc shape.
As shown in FIG. 3, a filling outlet 25 communicating with the seal filling groove 46 is formed in the other lid 21 </ b> B of the pair of lids 21 </ b> A and 21 </ b> B stacked at the stacked ends on both sides of the plurality of semiconductor modules 2. It is.
The filling inlet 24 and the filling outlet 25 of this example are a filling connecting port in the circumferential direction of the seal filling groove 46 in the semiconductor module 2 at the extreme end so as to perform meandering filling of the sealing material 6 together with a plurality of filling connecting ports 47. 47 is formed on the side opposite to the side on which 47 is formed.

  As shown in FIGS. 2 and 8, the mold resin 4 is formed such that the insulating film 33 provided on the outer surface 321 of the heat radiating plate 32 is exposed to the central portion 43 of the mating surface 42, so that the semiconductor element 3 and the heat radiating plate 32. Etc. are placed inside and molded. In the mold resin 4, the central portion 43 of the mating surface 42 provided with the insulating film 33 is lower than the peripheral portion 44 for disposing the cooler 5, and the peripheral portion 44 is lower than the peripheral portion 45. It is low. An outer peripheral wall 45 is formed by an outer peripheral portion 45 on the entire circumference of the mating surfaces 42 on both sides of the mold resin 4.

As shown in FIG. 5, the semiconductor module 2 of this example has two switching elements 3 </ b> A and 3 </ b> B arranged in parallel to the mold resin 4. The semiconductor module 2 is formed long in the direction in which two switching elements are arranged, and this direction is a longitudinal direction L orthogonal to the thickness direction T of the switching element (semiconductor element 3).
The semiconductor module 2 can be formed by arranging the semiconductor element 3, the heat radiating plate 32, the insulating film 33, etc., and performing molding with the molding resin 4. In addition, the semiconductor element 3, the heat radiating plate 32, the insulating film 33, and the like can be arranged in an arrangement portion formed inside after molding the mold resin 4.

As shown in FIGS. 3 and 4, the refrigerant flow path 41 of the present example is a through refrigerant flow path formed so as to penetrate in the thickness direction T on both sides in the longitudinal direction L of the mold resin 4 when a plurality of semiconductor modules 2 are stacked. 411 and the creeping refrigerant flow path 412 formed in the central portion 43 and the peripheral portion 44 of the mating surface 42 on both sides of the mold resin 4 are formed to be connected.
The through refrigerant flow path 411 is formed in a pair on both sides in the longitudinal direction L with respect to the semiconductor element 3, and one supply refrigerant flow path 411 </ b> A supplies the refrigerant C to each cooler 5 in the stacked body 1. The other through coolant channel 411 </ b> B is formed as a recovery channel for recovering the coolant C from each cooler 5 in the stacked body 1.
The cooler 5 of this example is disposed in the central portion 43 of the mold resin 4. The cooler 5 is composed of an aluminum plate, and is formed by joining a corrugated plate 52 between two flat plates 51. The cooler 5 is arranged with the direction orthogonal to the wave forming direction of the corrugated plate 52 facing the longitudinal direction L of the mold resin 4, and the refrigerant flowing in the creeping refrigerant flow path 412 formed between the semiconductor modules 2. C is configured to pass through.

  As shown in FIG. 3, lid bodies 21 </ b> A and 21 </ b> B made of resin are laminated on the semiconductor module 2 with the cooler 5 interposed therebetween at the extreme ends on both sides in the lamination direction T of the laminated body 1. In addition, a refrigerant introduction pipe 211 and a refrigerant discharge pipe 212 communicating with the pair of through refrigerant flow paths 411 in the semiconductor module 2 are formed in the other lid body 21 </ b> B in which the filling outlet 25 in the stacked body 1 is formed. .

Next, a method for manufacturing the laminate 1 of the semiconductor module 2 of this example will be described.
In this example, first, the semiconductor element 3, the heat radiating plate 32, and the like are disposed inside, and the semiconductor module 2 is formed by molding with the molding resin 4 in a state where the insulating film 33 is exposed on the surface of the heat radiating plate 32. To do. At this time, the coolant passage 41, the seal filling groove 46, and the filling connection port 47 are formed in the mold resin 4.

  Next, as shown in FIGS. 5 and 6, a plurality of semiconductor modules 2 are stacked while the cooler 5 is disposed therebetween, and the cooler 5 is disposed between the outermost semiconductor modules 2. The lids 21A and 21B are stacked. Then, bolts (not shown) are tightened to maintain and fix the laminated state. In this stacked and fixed state, as shown in FIGS. 3 and 4, the seal filling groove 46 in each semiconductor module 2 communicates with the seal filling groove 46 in the adjacent semiconductor module 2 through the filling connection port 47. Further, the filling inlet 24 in one lid 21 </ b> A communicates with the seal filling groove 46 of the adjacent semiconductor module 2, and the filling outlet 25 in the other lid 21 </ b> B communicates with the seal filling groove 46 of the adjacent semiconductor module 2. Communicated with

Next, in a state where the plurality of semiconductor modules 2 are stacked and fixed by tightening bolts or the like, the liquid sealing material 6 is injected from the filling inlet 24 of one lid 21A, and this sealing material 6 is supplied to the filling inlet. The seal filling grooves 46 and the filling connection ports 47 are alternately filled in order from the semiconductor module 2 located on the 24 side. As shown in FIG. 9, the sealing material 6 filled in the seal filling groove 46 branches and flows from the filling connection port 47 or the filling injection port 24 to both sides in the circumferential direction of the seal filling groove 46, and the next filling connection port. To 47.
Then, as shown in FIG. 7, the sealing material 6 reaches the filling outlet 25 of the other lid 21 </ b> B, and its flow front end flows out from the filling outlet 25. Gases (air or the like) present in the plurality of seal filling grooves 46 and the filling connection port 47 can be easily extracted from the filling outlet 25. Thus, the seal material 6 can be filled into each seal filling groove 46.
Thereafter, the sealing material 6 is cured by heating or the like, and the gaps between the semiconductor modules 2 around the refrigerant flow paths 41 can be sealed (sealed).

The laminate 1 of the semiconductor module 2 of this example does not require application of an adhesive or the like, and can seal the mating surface 42 of the mold resin 4 without using a sealing material such as an O-ring or a gasket. It can be done.
Specifically, in this example, the seal filling groove 46 and the filling connection port 47 are formed in the mold resin 4, and the sealing material 6 injected from the filling injection port 24 is passed through the filling connection port 47. A plurality of seal filling grooves 46 are continuously filled to form a laminated body 1 in which the semiconductor modules 2 are laminated. That is, the stacked body 1 can be formed by stacking the semiconductor modules 2 and filling the sealing material 6 in the stacked state.
Thereby, the sealing material 6 of this example does not need to be applied to the mating surface 42 like an adhesive, and does not need to be molded into a predetermined shape like an O-ring or a gasket. Therefore, sealing of the mating surface 42 where the mold resins 4 are combined can be performed by a simple method, and sealing of the mating surface 42 can be performed stably.

  Therefore, according to the laminated body 1 of the semiconductor module 2 and the manufacturing method thereof of the present example, the assembly of the laminated body 1 of the semiconductor module 2 is easy, and the sealing state of the mating surface 42 is maintained for a long-term use. Can last.

  In this example, the lid 21A in which the filling inlet 24 is formed is arranged on the upper side, and follows the gravity from the upper side to the lower side with respect to the seal filling groove 46 and the filling connection port 47 in the plurality of semiconductor modules 2. Sealing material 6 was filled. On the other hand, as shown in FIGS. 11 and 12, the lid 21 </ b> A in which the filling inlet 24 is formed is disposed below, and the seal filling groove 46 and the filling connection port 47 in the plurality of semiconductor modules 2 are viewed from below. The sealing material 6 can also be filled up against gravity. As shown in each figure, the filling injection port 24 and the filling connection port 47 can be provided at a plurality of locations with respect to each seal filling groove 46. FIG. 12 is a diagram schematically showing only the formation state of the seal filling groove 46 and the filling connection port 47 in the same manner as FIG.

(Example 2)
In this example, as shown in FIG. 13, an outflow prevention weir 48 formed by projecting a part of the mating surface 42 on the mating surface 42 of the mold resin 4 of the semiconductor module 2 is an example.
As shown in FIG. 14, the outflow prevention weir 48 of this example is formed on the mating surface 42 located on one side in the stacking direction T in the mold resin 4. Each outflow prevention weir 48 is formed on the entire circumference between the seal filling groove 46 and the coolant channel 41 on the mating surface 42 of the mold resin 4.

In this example, when a plurality of semiconductor modules 2 are stacked, the outflow prevention weir 48 formed on the mating surface 42 on one side of the mold resin 4 of the semiconductor module 2 and the other side of the mold resin 4 of the adjacent semiconductor module 2 The mating surface 42 faces each other. And in the seal filling groove | channel 46 of each mating surface 42, the inner peripheral side which is the refrigerant flow path 41 side is obstruct | occluded, and an outer peripheral side is open | released.
When a plurality of semiconductor modules 2 are stacked and fixed by tightening bolts or the like, when the sealing material 6 in the liquid state is injected from the filling inlet 24 of one lid 21A, the outer peripheral side of each seal filling groove 46 Each seal filling groove 46 can be filled with the sealing material 6 via the filling connection port 47 while letting gas (air or the like) escape. At this time, the formation of the outflow prevention weir 48 can prevent the sealing material 6 filling the seal filling groove 46 from unexpectedly flowing out to the refrigerant flow path 41.
Also in this example, the other structure of the laminated body 1 of the semiconductor module 2 is the same as that of the said Example 1, and the effect similar to the said Example 1 can be acquired.

DESCRIPTION OF SYMBOLS 1 Laminated body 2 Semiconductor module 21A, 21B Cover body 24 Filling inlet 25 Filling outflow port 3 Semiconductor element 32 Heat sink 33 Insulating film 4 Mold resin 41 Refrigerant flow path 42 Matching surface 46 Seal filling groove 47 Filling connection port 48 Outflow prevention weir 5 Cooler 6 Sealing material C Refrigerant

Claims (9)

In a laminate of semiconductor modules formed by laminating a plurality of semiconductor modules formed by arranging semiconductor elements in a mold resin,
The mold resin includes a coolant channel for flowing a coolant that cools the semiconductor element, a seal filling groove formed on the entire periphery of the mating surface where the mold resin meets each other on the outer peripheral side of the coolant channel, and the seal A filling connection port formed through the semiconductor module in the stacking direction so as to communicate with the filling groove;
A lid is laminated on both sides of the plurality of semiconductor modules, and a filling inlet that communicates with the seal filling groove is formed on one of the lids.
A laminated body of semiconductor modules, wherein the sealing material injected from the filling inlet is continuously filled into the plurality of seal filling grooves via the filling connection port. The laminated body of semiconductor modules according to claim 1, wherein the plurality of filling connection ports are alternately formed at positions opposite to each other in the circumferential direction of the seal filling groove of the semiconductor modules adjacent to each other.
The said sealing material is meanderingly filled with respect to the said several seal filling groove | channel via the said some filling connection port, The laminated body of the semiconductor module characterized by the above-mentioned.   3. The semiconductor module laminate according to claim 1, wherein the molding resin projects a part of the mating surface along the entire circumference between the seal filling groove and the coolant channel on the mating surface. A laminated body of semiconductor modules, characterized by having an outflow prevention weir.   4. The semiconductor module according to claim 1, wherein a filling outlet that communicates with the seal filling groove is formed on the other side of the lid. 5. Laminated body. In the laminated body of the semiconductor module according to claim 3, the seal filling groove is formed on the mating surface located on either side in the lamination direction in the mold resin,
The laminated body of semiconductor modules, wherein the outflow prevention weir is formed on the mating surface located on either side of the molding resin in the laminating direction. In a method for manufacturing a stacked body of semiconductor modules in which a plurality of semiconductor modules formed by arranging semiconductor elements in a mold resin are stacked,
The mold resin includes a coolant channel for flowing a coolant for cooling the semiconductor element, a seal filling groove formed on the entire periphery of the mating surface where the mold resin is combined with each other on the outer peripheral side of the coolant channel, And forming a filling connection port penetrating in the stacking direction of the semiconductor module so as to communicate with the seal filling groove,
A laminated body on both sides of the plurality of semiconductor modules is laminated with a lid, and a filling inlet that communicates with the seal filling groove is formed on one of the lid,
A method for producing a laminated body of semiconductor modules, comprising: injecting a sealing material from the filling inlet and continuously filling the sealing material into the plurality of seal filling grooves via the filling connection port. 7. The method of manufacturing a laminated body of semiconductor modules according to claim 6, wherein the plurality of filling connection ports are alternately formed at positions opposite to each other in the circumferential direction of the seal filling grooves of the semiconductor modules adjacent to each other. Every
A method of manufacturing a laminated body of semiconductor modules, wherein the sealing material is meandered and filled into the plurality of seal filling grooves via the plurality of filling connection ports. 8. The method of manufacturing a laminated body of semiconductor modules according to claim 6 or 7, wherein the mold resin is provided on the mating surface with a single surface of the mating surface on the entire circumference between the seal filling groove and the coolant channel. The outflow prevention weir formed by protruding the part is formed,
A method of manufacturing a laminated body of semiconductor modules, wherein the outflow prevention weir prevents the sealing material from flowing out into the coolant channel. In the manufacturing method of the laminated body of the semiconductor module as described in any one of Claims 6-8, the filling outflow port connected to the said seal filling groove is formed in the other of the said cover body,
A semiconductor which is injected from the filling inlet and flows out from the filling outlet through a flow front end of the sealing material which is continuously filled into the plurality of seal filling grooves via the filling connection port. Manufacturing method of module laminate.

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