JP5323038B2 - Encapsulant for optical semiconductor device and optical semiconductor device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealant for an optical semiconductor device having excellent defoaming properties. <P>SOLUTION: The sealant for an optical semiconductor device contains: a first silicone resin having an aryl group and an alkenyl group and substantially not having an alkoxy group (excepting a silicone resin having a hydrogen atom bonded to a silicone atom); a second silicone resin having an aryl group and a hydrogen atom bonded to a silicone atom and substantially not having an alkoxy group; and a catalyst for hydrosilylation reaction. The first silicone resin is obtained by hydrolysis polycondensation of at least one kind of alkoxysilane compound and disiloxane compound using a basic catalyst. The second silicone resin is obtained by hydrolysis polycondensation of at least one kind of alkoxysilane compound and disiloxane compound using an acid catalyst. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an optical semiconductor device sealing agent used for sealing an optical semiconductor element in an optical semiconductor device, and an optical semiconductor device using the optical semiconductor device sealing agent.

  An optical semiconductor device such as a light emitting diode (LED) device has low power consumption and long life. Moreover, the optical semiconductor device can be used even in a harsh environment. Accordingly, optical semiconductor devices are used in a wide range of applications such as mobile phone backlights, liquid crystal television backlights, automobile lamps, lighting fixtures, and signboards.

  When an optical semiconductor element (for example, an LED), which is a light emitting element used in an optical semiconductor device, is in direct contact with the atmosphere, the light emission characteristics of the optical semiconductor element rapidly deteriorate due to moisture in the atmosphere or floating dust. For this reason, the said optical semiconductor element is normally sealed with the sealing compound for optical semiconductor devices.

  Patent Document 1 listed below discloses an epoxy resin material containing hydrogenated bisphenol A glycidyl ether, an alicyclic epoxy monomer, and a latent catalyst as a sealant for an optical semiconductor device. This epoxy resin material is cured by thermal cationic polymerization.

JP 2003-73452 A

  In the conventional encapsulant for optical semiconductor devices as described in Patent Document 1, the defoaming property may be low when producing the encapsulant for optical semiconductor devices. Furthermore, even when the light emitting element is sealed with the optical semiconductor device sealant, the defoaming property is low, and the cured sealant may contain bubbles. If there are bubbles in the hardened sealant, the brightness of the light extracted from the obtained optical semiconductor device is lowered.

  The objective of this invention is providing the optical semiconductor device using the sealing agent for optical semiconductor devices excellent in defoaming property, and this sealing agent for optical semiconductor devices.

  According to a wide aspect of the present invention, a first silicone resin having an aryl group and an alkenyl group and having substantially no alkoxy group (excluding a silicone resin having a hydrogen atom bonded to a silicon atom) And a second silicone resin having a hydrogen atom bonded to an aryl group and a silicon atom and substantially free of an alkoxy group, and a hydrosilylation reaction catalyst, wherein the first silicone resin comprises: A first silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using a basic catalyst, wherein the second silicone resin comprises an alkoxysilane compound and a disiloxane compound. An optical semiconductor device, which is a second silicone resin obtained by hydrolytic polycondensation of at least one of the siloxane compounds using an acidic catalyst. Use sealant is provided.

In a specific aspect of the encapsulant for optical semiconductor devices according to the present invention, the first silicone resin is represented by the following formula (1A), and the second silicone resin is represented by the following formula (51A). It represented.

  In the above formula (1A), a, b and c are a / (a + b + c) = 0 to 0.50, b / (a + b + c) = 0.40 to 1.0 and c / (a + b + c) = 0 to 0. 50, R1 to R6 represent at least one aryl group, at least one represents an alkenyl group, and R1 to R6 other than the aryl group and the alkenyl group represent a hydrocarbon group having 1 to 8 carbon atoms. .

  In the above formula (51A), p, q and r are p / (p + q + r) = 0.05 to 0.50, q / (p + q + r) = 0.05 to 0.50 and r / (p + q + r) = 0. 20 to 0.80 are satisfied, R51 to R56 each represent at least one aryl group, at least one represents a hydrogen atom bonded to a silicon atom, and R51 to R51 other than an aryl group and a hydrogen atom bonded to a silicon atom R56 represents a hydrocarbon group having 1 to 8 carbon atoms.

In another specific aspect of the encapsulant for optical semiconductor devices according to the present invention, the content ratios of aryl groups obtained from the following formula (X) in the first silicone resin and the second silicone resin are 30 respectively. % By weight or more and 70% by weight or less.

Content ratio (% by weight ) of aryl group = (average number of aryl groups contained in one molecule of the first silicone resin or the second silicone resin × molecular weight of the aryl group / the first silicone resin or the above Number average molecular weight of second silicone resin) × 100 Formula (X)

  An optical semiconductor device according to the present invention includes an optical semiconductor element and an encapsulant for an optical semiconductor device that is provided so as to seal the optical semiconductor element and is configured according to the present invention.

  The encapsulant for optical semiconductor devices according to the present invention is a first silicone resin having an aryl group and an alkenyl group, and having substantially no alkoxy group (however, a silicone having a hydrogen atom bonded to a silicon atom) 2) a second silicone resin having a hydrogen atom bonded to an aryl group and a silicon atom and having substantially no alkoxy group, and a catalyst for hydrosilylation reaction. 1 is a first silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound with a basic catalyst, and the second silicone resin is an alkoxy A second silicone resin obtained by hydrolytic polycondensation of at least one of a silane compound and a disiloxane compound with an acidic catalyst. Since, it is possible to improve the degassing properties of the sealant. Therefore, when an optical semiconductor element is sealed with the sealing agent for optical semiconductor devices according to the present invention, it is possible to suppress bubbles from being contained in the cured sealing agent.

FIG. 1 is a front sectional view showing an optical semiconductor device according to an embodiment of the present invention.

  Details of the present invention will be described below.

  The encapsulant for optical semiconductor devices according to the present invention includes a first silicone resin, a second silicone resin, and a hydrosilylation reaction catalyst.

  The first silicone resin (excluding a silicone resin having a hydrogen atom bonded to a silicon atom) has an aryl group and an alkenyl group, and has substantially no alkoxy group. The second silicone resin has a hydrogen atom bonded to an aryl group and a silicon atom, and has substantially no alkoxy group.

  In the present specification, “substantially no alkoxy group” means that the content of alkoxy groups in the first and second silicone resins is 0.5 mol% or less. The alkoxy group content (mol%) means the amount of alkoxy groups contained in the average composition formula of the first and second silicone resins. From the viewpoint of further suppressing the inclusion of bubbles in the cured sealant, the content of alkoxy groups in the first and second silicone resins is particularly preferably 0 mol%, It is particularly preferable that the second silicone resin does not have an alkoxy group.

  Due to the combined use of the specific first and second silicone resins and the hydrosilylation reaction catalyst, in particular, the first and second silicone resins are substantially free of alkoxy groups, thereby defoaming the sealant. Sexually can be enhanced considerably. Further, the first silicone resin is a first silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using a basic catalyst, and the second silicone resin Even if the silicone resin is a second silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using an acidic catalyst, the defoaming property is considerably enhanced. Can do. In the encapsulant for optical semiconductor devices according to the present invention, bubbles are effectively removed when the encapsulant for optical semiconductor devices is produced and when the encapsulant for optical semiconductor devices is used. For this reason, it is difficult for bubbles to be included in the cured sealant, and voids are less likely to occur in the cured sealant. If bubbles are not contained in the cured sealant, the brightness of the light extracted in the optical semiconductor device is increased.

  By the way, in the conventional sealing agent for optical semiconductor devices, when used in a harsh environment that is repeatedly subjected to heating and cooling, the sealing agent is cracked or the sealing agent is peeled off from the housing material or the like. Sometimes.

  Moreover, in order to reflect the light which reached the back surface side of the light emitting element, an electrode plated with silver may be formed on the back surface of the light emitting element. When a crack occurs in the sealant or the sealant peels from the housing material, the silver-plated electrode is exposed to the atmosphere. In this case, the silver plating may be discolored by a corrosive gas such as hydrogen sulfide gas or sulfurous acid gas present in the atmosphere. When the color of the electrode changes, the reflectance decreases, which causes a problem that the brightness of the light emitted from the light emitting element decreases.

In view of such a problem, from the viewpoint of improving the gas barrier property of the sealant, the first silicone resin is represented by the formula (1A), has an aryl group and an alkenyl group, and is substantially alkoxy. Preferably, the first silicone resin does not have a group (excluding a silicone resin having a hydrogen atom bonded to a silicon atom), and the second silicone resin is represented by the formula (51A) and is aryl The second silicone resin preferably has a hydrogen atom bonded to a group and a silicon atom, and has substantially no alkoxy group. Furthermore, from the viewpoint of enhancing the gas barrier property of the sealant, the content ratios of the aryl groups obtained from the following formula (X) in the first and second silicone resins are 30% by weight or more and 70% by weight or less, respectively. It is preferable.

Content ratio (% by weight ) of aryl group = (average number of aryl groups contained in one molecule of the first silicone resin or the second silicone resin × molecular weight of the aryl group / the first silicone resin or the above Number average molecular weight of second silicone resin) × 100 Formula (X)

That is, by using the specific first and second silicone resins represented by the formula (1A) or the formula (51A), the content ratios of the aryl groups are 30% by weight or more and 70% by weight or less, respectively. By using the first and second silicone resins, the gas barrier property of the sealant can be enhanced. For this reason, it becomes difficult to produce a crack in sealing agent, and also sealing agent becomes difficult to peel from a housing material etc.

  Hereinafter, the detail of each component contained in the sealing compound for optical semiconductor devices which concerns on this invention is demonstrated.

(First silicone resin)
The first silicone resin (excluding the silicone resin having a hydrogen atom bonded to a silicon atom) contained in the encapsulant for optical semiconductor devices according to the present invention has an aryl group and an alkenyl group. The first silicone resin is obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using a basic catalyst.

  The first silicone resin is a first silicone resin that does not have a hydrogen atom bonded to a silicon atom and has an aryl group and an alkenyl group. The first silicone resin is different from the second silicone resin because it does not have a hydrogen atom bonded to a silicon atom. Each of the aryl group and the alkenyl group is preferably directly bonded to the silicon atom. As said aryl group, an unsubstituted phenyl group and a substituted phenyl group are mentioned. The carbon atom in the carbon-carbon double bond of the alkenyl group may be bonded to the silicon atom, and the carbon atom different from the carbon atom in the carbon-carbon double bond of the alkenyl group is in the silicon atom. It may be bonded. As for the 1st silicone resin, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of obtaining a sealing agent that is more excellent in gas barrier properties, the first silicone resin is preferably a first silicone resin represented by the following formula (1A). However, a silicone resin other than the first silicone resin represented by the following formula (1A) may be used as the first silicone resin.

In the above formula (1A), a, b and c are a / (a + b + c) = 0 to 0.50, b / (a + b + c) = 0.40 to 1.0 and c / (a + b + c) = 0 to 0. 50, R1 to R6 represent at least one aryl group, at least one represents an alkenyl group, and R1 to R6 other than the aryl group and the alkenyl group represent a hydrocarbon group having 1 to 8 carbon atoms. . In the above formula (1A), the structural unit represented by (R4R5SiO _2/2 ) and the structural unit represented by (R6SiO _3/2 ) may each have a hydroxy group.

  The above formula (1A) represents an average composition formula. The hydrocarbon group in the above formula (1A) may be linear or branched. R1 to R6 in the above formula (1A) may be the same or different.

In the above formula (1A), the oxygen atom part in the structural unit represented by (R4R5SiO _2/2 ) and the oxygen atom part in the structural unit represented by (R6SiO _3/2 ) each form a siloxane bond. An oxygen atom part or an oxygen atom part of a hydroxy group is shown.

  In general, in each structural unit of the above formula (1A), the hydroxy group content is small. This is because, in general, when an organosilicon compound such as an alkoxysilane compound is hydrolyzed and polycondensed to obtain a first silicone resin, most of the hydroxy groups are converted into a partial skeleton of a siloxane bond. is there. That is, most of the oxygen atoms of the hydroxy group are converted into oxygen atoms forming a siloxane bond. When each structural unit of the above formula (1A) has a hydroxy group, it indicates that a slight amount of unreacted hydroxy group that has not been converted into a partial skeleton of a siloxane bond remains. The same applies to the case where each structural unit of formula (51A) described later has a hydroxy group.

  In the above formula (1A), examples of the alkenyl group include a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexenyl group. From the viewpoint of further improving gas barrier properties, the alkenyl group in the first silicone resin and the alkenyl group in the above formula (1A) are preferably vinyl groups or allyl groups, and more preferably vinyl groups.

  It does not specifically limit as a C1-C8 hydrocarbon group in the said Formula (1A), For example, a methyl group, an ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, Examples thereof include n-heptyl group, n-octyl group, isopropyl group, isobutyl group, sec-butyl group, t-butyl group, isopentyl group, neopentyl group, t-pentyl group, isohexyl group and cyclohexyl group.

The aryl group content as determined from the following formula (X1) in the first silicone resin is preferably at most 30% by weight or more and 70 wt%. When the content ratio of the aryl group is 30% by weight or more, the gas barrier property is further enhanced. When the content ratio of the aryl group is 70% by weight or less, the sealant is hardly peeled off. From the viewpoint of further enhancing the gas barrier properties, the aryl group content is more preferably 35% by weight or more. From the viewpoint of making peeling more difficult, the aryl group content is more preferably 65% by weight or less.

Content ratio of aryl group (% by weight ) = (average number of aryl groups contained in one molecule of the first silicone resin whose average composition formula is represented by formula (1A) × molecular weight of aryl group / average composition formula Number average molecular weight of first silicone resin represented by formula (1A)) × 100 Formula (X1)

In the first silicone resin represented by the above formula (1A), the structural unit represented by (R4R5SiO _2/2 ) (hereinafter also referred to as a bifunctional structural unit) is represented by the following formula (1-2). A structure in which one of oxygen atoms bonded to a silicon atom in the bifunctional structural unit constitutes a hydroxy group may be included.

(R4R5SiXO _1/2 ) (Formula (1-2))

The structural unit represented by (R4R5SiO _2/2 ) includes a portion surrounded by a broken line of the structural unit represented by the following formula (1-b), and is further represented by the following formula (1-2b). A portion surrounded by a broken line of the structural unit may be included. That is, a structural unit having a group represented by R4 and R5 and having a hydroxy group remaining at the terminal is also included in the structural unit represented by (R4R5SiO _2/2 ). Specifically, when the alkoxy group is converted into a partial skeleton of a siloxane bond, the structural unit represented by (R4R5SiO _2/2 ) is a broken line of the structural unit represented by the following formula (1-b) The part enclosed by is shown. When an alkoxy group is converted into a hydroxy group, the structural unit represented by (R4R5SiO _2/2 ) having a hydroxy group is surrounded by a broken line of the structural unit represented by the following formula (1-2b) The part indicated. In the structural unit represented by the following formula (1-b), the oxygen atom in the Si—O—Si bond forms a siloxane bond with the adjacent silicon atom, and the adjacent structural unit and oxygen atom Sharing. Accordingly, one oxygen atom in the Si—O—Si bond is defined as “O _1/2 ”.

  In the above formulas (1-2) and (1-2b), X represents OH. R4 and R5 in the above formulas (1-b), (1-2) and (1-2b) are the same groups as R4 and R5 in the above formula (1A).

In the first silicone resin represented by the above formula (1A), the structural unit represented by (R6SiO _3/2 ) (hereinafter also referred to as trifunctional structural unit) is represented by the following formula (1-3) or (1 -4), that is, a structure in which two of the oxygen atoms bonded to the silicon atom in the trifunctional structural unit each form a hydroxy group, or the oxygen atom bonded to the silicon atom in the trifunctional structural unit One of these may include a structure constituting a hydroxy group.

(R6SiX ₂ O _1/2 ) Formula (1-3)
(R6SiXO _2/2 ) Formula (1-4)

The structural unit represented by (R6SiO _3/2 ) includes a portion surrounded by a broken line of the structural unit represented by the following formula (1-c), and further includes the following formula (1-3-c) or (1 The part enclosed with the broken line of the structural unit represented by -4-c) may be included. That is, a structural unit having a group represented by R6 and having a hydroxyl group remaining at the terminal is also included in the structural unit represented by (R6SiO _3/2 ).

  In the above formulas (1-3), (1-3-c), (1-4) and (1-4-c), X represents OH. R6 in the above formulas (1-c), (1-3), (1-3-c), (1-4) and (1-4-c) is the same as R6 in the above formula (1A). It is the basis of.

In the above formula (1A), the lower limit of a / (a + b + c) is 0, and the upper limit is 0.50. When a / (a + b + c) satisfies the above upper limit, the heat resistance of the sealant can be further increased, and peeling of the sealant can be further suppressed. In said formula (1A), the preferable upper limit of a / (a + b + c) is 0.45, and a more preferable upper limit is 0.40. When a is 0 and a / (a + b + c) is 0, there is no structural unit (R1R2R3SiO _1/2 ) in the above formula (1A).

  In the above formula (1A), the lower limit of b / (a + b + c) is 0.40, and the upper limit is 1.0. When b / (a + b + c) satisfies the above lower limit, the cured product of the sealant does not become too hard, and cracks are hardly generated in the sealant. In said formula (1A), the minimum with preferable b / (a + b + c) is 0.50.

In the above formula (1A), the lower limit of c / (a + b + c) is 0, and the upper limit is 0.50. When c / (a + b + c) satisfies the above upper limit, it is easy to maintain an appropriate viscosity as a sealant, and adhesion can be further enhanced. In the above formula (1A), the preferable upper limit of c / (a + b + c) is 0.45, the more preferable upper limit is 0.40, and the still more preferable upper limit is 0.35. In addition, when c is 0 and c / (a + b + c) is 0, the structural unit of (R6SiO _3/2 ) does not exist in the above formula (1A).

  C / (a + b + c) in the above formula (1A) is preferably 0. That is, the first silicone resin represented by the above formula (1A) is preferably the first silicone resin represented by the following formula (1Aa). As a result, cracks are less likely to occur in the sealant, and the sealant is more difficult to peel from the housing material or the like.

  In the above formula (1Aa), a and b satisfy a / (a + b) = 0 to 0.50 and b / (a + b) = 0.50 to 1.0, and at least one of R1 to R5 is aryl. R4 to R5 each represents an alkenyl group, and R1 to R5 other than the aryl group and the alkenyl group each represent a hydrocarbon group having 1 to 8 carbon atoms.

  In said formula (1Aa), the preferable upper limit of a / (a + b) is 0.45, and a more preferable upper limit is 0.40. In said formula (1Aa), the preferable minimum of b / (a + b) is 0.55, and a more preferable minimum is 0.60.

When the first silicone resin is subjected to ²⁹ Si-nuclear magnetic resonance analysis (hereinafter referred to as NMR) based on tetramethylsilane (hereinafter referred to as TMS), although the above formula shows a slight variation depending on the type of substituent. The peak corresponding to the structural unit represented by (R1R2R3SiO _1/2 ) _a in (1A) appears in the vicinity of +10 to −5 ppm, and (R4R5SiO _2/2 ) _b and (1-2) in the above formula (1A) ) Appearing in the vicinity of −10 to −50 ppm, (R6SiO _3/2 ) _c in the above formula (1A), and (1-3) and (1-4) Each peak corresponding to the functional structural unit appears in the vicinity of −50 to −80 ppm.

Therefore, the ratio of each structural unit in the above formula (1A) can be measured by measuring ²⁹ Si-NMR and comparing the peak areas of the respective signals.

However, in the case where the structural unit in the formula (1A) cannot be distinguished by the ²⁹ Si-NMR measurement based on the TMS, not only the ²⁹ Si-NMR measurement result but also the ¹ H-NMR measurement result. Can be used to distinguish the proportion of each structural unit in the above formula (1A).

(Second silicone resin)
The second silicone resin contained in the encapsulant for optical semiconductor devices according to the present invention has an aryl group and a hydrogen atom bonded to a silicon atom. The aryl group is preferably directly bonded to the silicon atom. Hydrogen atoms are directly bonded to silicon atoms. The second silicone resin is obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using an acidic catalyst. As for the 2nd silicone resin, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of obtaining a sealant that is more excellent in gas barrier properties, the second silicone resin is preferably a second silicone resin represented by the following formula (51A). However, a silicone resin other than the second silicone resin represented by the following formula (51A) may be used as the second silicone resin.

In the above formula (51A), p, q and r are p / (p + q + r) = 0.05 to 0.50, q / (p + q + r) = 0.05 to 0.50 and r / (p + q + r) = 0. 20 to 0.80 are satisfied, R51 to R56 each represent at least one aryl group, at least one represents a hydrogen atom bonded to a silicon atom, and R51 to R51 other than an aryl group and a hydrogen atom bonded to a silicon atom R56 represents a hydrocarbon group having 1 to 8 carbon atoms. In the above formula (51A), the structural unit represented by (R54R55SiO _2/2 ) and the structural unit represented by (R56SiO _3/2 ) may each have a hydroxy group.

  The above formula (51A) represents an average composition formula. The hydrocarbon group in the above formula (51A) may be linear or branched. R51 to R56 in the above formula (51A) may be the same or different.

In the formula (51A), the oxygen atom part in the structural unit represented by (R54R55SiO _2/2 ) and the oxygen atom part in the structural unit represented by (R56SiO _3/2 ) each form a siloxane bond. An oxygen atom part or an oxygen atom part of a hydroxy group is shown.

  It does not specifically limit as a C1-C8 hydrocarbon group in the said Formula (51A), For example, a methyl group, an ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, isopropyl group, isobutyl group, sec-butyl group, t-butyl group, isopentyl group, neopentyl group, t-pentyl group, isohexyl group, cyclohexyl group, vinyl group and allyl group Is mentioned.

From the viewpoint of enhancing the curability of the sealant and further suppressing cracking and peeling in the thermal cycle, the structural unit represented by (R51R52R53SiO _1/2 ) in the above formula (51A) is such that R51 is a silicon atom. It is preferable that the hydrogen atom couple | bonded with and R52 and R53 contain the structural unit which represents a hydrogen atom, an aryl group, or a C1-C8 hydrocarbon group. The structural unit represented by (R51R52R53SiO _1/2 ) in the above formula (51A) represents a hydrogen atom in which R51 is bonded to a silicon atom, and R52 and R53 represent an aryl group or a hydrocarbon group having 1 to 8 carbon atoms. It is more preferable that the structural unit to represent is included.

That is, in the above formula (51A), the structural unit represented by (R51R52R53SiO _1/2 ) preferably includes a structural unit represented by the following formula (51-a). The structural unit represented by (R51R52R53SiO _1/2 ) may include only the structural unit represented by the following formula (51-a), and the structural unit represented by the following formula (51-a) and the following And a structural unit other than the structural unit represented by Formula (51-a).

  In said formula (51-a), R52 and R53 represent a hydrogen atom, an aryl group, or a C1-C8 hydrocarbon group, respectively. R52 and R53 each preferably represent an aryl group or a hydrocarbon group having 1 to 8 carbon atoms.

From the viewpoint of enhancing the curability of the sealant and further suppressing cracking and peeling in the thermal cycle, it is represented by (R51R52R53SiO _1/2 ) in 100 mol% of all structural units in the above formula (51A). A structural unit in which R51 represents a hydrogen atom bonded to a silicon atom, and R52 and R53 represent a hydrogen atom, an aryl group, or a hydrocarbon group having 1 to 8 carbon atoms (in the above formula (51-a)). The proportion of the structural unit represented is preferably 5 mol% or more, more preferably 10 mol% or more, preferably 50 mol% or less, more preferably 45 mol% or less.

The aryl group content as determined from the following equation (X51) in the second silicone resin is preferably at most 30% by weight or more and 70 wt%. When the content ratio of the aryl group is 30% by weight or more, the gas barrier property is further enhanced. When the content ratio of the aryl group is 70% by weight or less, the sealant is hardly peeled off. From the viewpoint of further enhancing the gas barrier properties, the aryl group content is more preferably 35% by weight or more. From the viewpoint of making peeling more difficult, the aryl group content is more preferably 65% by weight or less.

Content ratio (% by weight ) of aryl group = (average number of aryl groups contained in one molecule of the second silicone resin whose average composition formula is represented by the above formula (51A) × molecular weight of aryl group / average composition formula Is the number average molecular weight of the second silicone resin represented by the above formula (51A)) × 100 Formula (X51)

In the second silicone resin represented by the above formula (51A), the structural unit represented by (R54R55SiO _2/2 ) (hereinafter also referred to as a bifunctional structural unit) is represented by the following formula (51-2). A structure in which one of oxygen atoms bonded to a silicon atom in the bifunctional structural unit constitutes a hydroxy group may be included.

(R54R55SiXO _1/2 ) Formula (51-2)

The structural unit represented by (R54R55SiO _2/2 ) includes a portion surrounded by a broken line of the structural unit represented by the following formula (51-b), and is further represented by the following formula (51-2-b). A portion surrounded by a broken line of the structural unit may be included. That is, a structural unit having a group represented by R54 and R55 and having a hydroxyl group remaining at the terminal is also included in the structural unit represented by (R54R55SiO _2/2 ).

  In the above formulas (51-2) and (51-2-b), X represents OH. R54 and R55 in the above formulas (51-b), (51-2) and (51-2-b) are the same groups as R54 and R55 in the above formula (51A).

In the second silicone resin represented by the above formula (51A), the structural unit represented by (R56SiO _3/2 ) (hereinafter also referred to as trifunctional structural unit) is represented by the following formula (51-3) or (51 -4), that is, a structure in which two of the oxygen atoms bonded to the silicon atom in the trifunctional structural unit each form a hydroxy group, or the oxygen atom bonded to the silicon atom in the trifunctional structural unit One of these may include a structure constituting a hydroxy group.

(R56SiX ₂ O _1/2 ) (Formula (51-3)
(R56SiXO _2/2 ) Formula (51-4)

The structural unit represented by (R56SiO _3/2 ) includes a portion surrounded by a broken line of the structural unit represented by the following formula (51-c), and further includes the following formula (51-3-c) or (51 The part enclosed with the broken line of the structural unit represented by -4-c) may be included. That is, a structural unit having a group represented by R56 and having a hydroxyl group remaining at the terminal is also included in the structural unit represented by (R56SiO _3/2 ).

  In the above formulas (51-3), (51-3-c), (51-4) and (51-4-c), X represents OH. R56 in the above formulas (51-c), (51-3), (51-3-c), (51-4) and (51-4-c) is the same as R56 in the above formula (51A). It is the basis of.

  In the above formula (51A), the lower limit of p / (p + q + r) is 0.05, and the upper limit is 0.50. When p / (p + q + r) satisfies the above upper limit, the heat resistance of the sealant can be further increased, and peeling of the sealant can be further suppressed. In said formula (51A), the preferable minimum of p / (p + q + r) is 0.10, and a more preferable upper limit is 0.45.

  In the above formula (51A), the lower limit of q / (p + q + r) is 0.05, and the upper limit is 0.50. When q / (p + q + r) satisfies the above lower limit, the cured product of the sealant does not become too hard, and cracks are hardly generated in the sealant. When q (p + q + r) satisfies the above upper limit, the gas barrier property of the sealant is further enhanced. In said formula (51A), the preferable minimum of q / (p + q + r) is 0.10, and a more preferable upper limit is 0.45.

  In the above formula (51A), the lower limit of r / (p + q + r) is 0.20, and the upper limit is 0.80. When r / (p + q + r) satisfies the above lower limit, the hardness of the encapsulant is increased, the adhesion of scratches and dust can be prevented, the heat resistance of the encapsulant is increased, and the cured product of the encapsulant in a high temperature environment It becomes difficult to reduce the thickness. When r / (p + q + r) satisfies the above upper limit, it is easy to maintain an appropriate viscosity as a sealant, and adhesion can be further enhanced.

For the second silicone resin, when ²⁹ Si-nuclear magnetic resonance analysis (hereinafter referred to as NMR) is performed with reference to tetramethylsilane (hereinafter referred to as TMS), although some variation is observed depending on the type of substituent, the above formula The peak corresponding to the structural unit represented by (R51R52R53SiO _1/2 ) _p in (51A) appears in the vicinity of +10 to −5 ppm, and (R54R55SiO _2/2 ) _q and (51-2) in the above formula (51A). ) Appearing in the vicinity of −10 to −50 ppm, and (R56SiO _3/2 ) _r in the above formula (51A) and three of (51-3) and (51-4) Each peak corresponding to the functional structural unit appears in the vicinity of −50 to −80 ppm.

Therefore, the ratio of each structural unit in the above formula (51A) can be measured by measuring ²⁹ Si-NMR and comparing the peak areas of the respective signals.

However, in the case where the structural unit in the formula (51A) cannot be identified by the ²⁹ Si-NMR measurement based on the TMS, not only the ²⁹ Si-NMR measurement result but also the ¹ H-NMR measurement result. Can be used to distinguish the proportion of each structural unit in the above formula (51A).

  The content of the second silicone resin is preferably 10 parts by weight or more and 400 parts by weight or less with respect to 100 parts by weight of the first silicone resin. When the content of the first and second silicone resins is within this range, a sealant that is more excellent in gas barrier properties can be obtained. From the viewpoint of obtaining a sealant that is further excellent in gas barrier properties, the more preferable lower limit of the content of the second silicone resin is 30 parts by weight, and still more preferable lower limit with respect to 100 parts by weight of the first silicone resin. Is 50 parts by weight, a more preferred upper limit is 300 parts by weight, and a still more preferred upper limit is 200 parts by weight.

(Other properties of the first and second silicone resins and their synthesis methods)
The first silicone resin is obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using a basic catalyst. The second silicone resin is obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using an acidic catalyst. The alkoxysilane compound is a silicon compound having an alkoxy group. The disiloxane compound is a silicon compound having a siloxane bond and having two silicon atoms.

  The first and second silicone resins substantially have no alkoxy group. The first and second silicone resins may be first and second silicone resins obtained by hydrolytic polycondensation of an alkoxy compound. In this case, the hydrolysis polycondensation reaction is preferably performed so that the alkoxy group does not substantially remain. Moreover, you may substitute an alkoxy group by another group after a hydrolysis heavy assembly reaction. The first and second silicone resins may be the first and second silicone resins obtained using a disiloxane compound having no alkoxy group.

  In the case where the first and second silicone resins are obtained by hydrolytic polycondensation of a silicon compound having an alkoxy group, the reaction that does not have a residual alkoxy group is preferably a reaction using a solvent. . Solvents used in such a reaction include mixed solvents of alcohol solvents such as methanol, ethanol and isopropanol and low polar solvents such as hexane, toluene and xylene, and tetrahydrofuran, dioxane, N, N-dimethylformamide and dimethyl sulfoxide. Etc. Of these, N, N-dimethylformamide is particularly preferred.

  The first and second silicone resins preferably do not contain silanol groups. When the first and second silicone resins do not contain a silanol group, the storage stability of the first and second silicone resins and the sealant is increased. The silanol group can be reduced by heating under vacuum. The content of silanol groups can be measured using infrared spectroscopy.

  The preferable lower limit of the number average molecular weight (Mn) of the first and second silicone resins is 500, the more preferable lower limit is 800, the still more preferable lower limit is 1000, the preferable upper limit is 50000, and the more preferable upper limit is 15000. When the number average molecular weight satisfies the above preferable lower limit, the volatile components are reduced at the time of thermosetting, and the thickness of the cured product of the sealant is hardly reduced under a high temperature environment. When the number average molecular weight satisfies the above preferable upper limit, viscosity adjustment is easy.

  The number average molecular weight (Mn) is a value obtained by using polystyrene as a standard substance using gel permeation chromatography (GPC). The number average molecular weight (Mn) was measured using two measuring devices manufactured by Waters (column: Shodex GPC LF-804 (length: 300 mm) manufactured by Showa Denko KK), measuring temperature: 40 ° C., flow rate: 1 mL / min, solvent: Tetrahydrofuran, standard substance: polystyrene) means a value measured.

  Examples of the method of hydrolyzing the alkoxysilane compound and causing the polycondensation reaction include a method of reacting the alkoxysilane compound in the presence of water and an acidic catalyst or a basic catalyst. Further, the disiloxane compound may be hydrolyzed and used.

  Examples of the organosilicon compound for introducing an aryl group into the first and second silicone resins include triphenylmethoxysilane, triphenylethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methyl (phenyl) dimethoxysilane, and Examples thereof include phenyltrimethoxysilane.

  Examples of the organosilicon compound for introducing an alkenyl group into the first silicone resin include vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldimethoxysilane, methoxydimethylvinylsilane, vinyldimethylethoxysilane, and 1,3-divinyl- Examples include 1,1,3,3-tetramethyldisiloxane.

  Examples of organosilicon compounds for introducing hydrogen atoms bonded to silicon atoms into the second silicone resin include trimethoxysilane, triethoxysilane, methyldimethoxysilane, methyldiethoxysilane, and 1,1,3,3. -Tetramethyldisiloxane and the like.

  Examples of other organosilicon compounds that can be used to obtain the first and second silicone resins include trimethylmethoxysilane, trimethylethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, and isopropyl (methyl) dimethoxysilane. Cyclohexyl (methyl) dimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, hexyltrimethoxysilane, and octyltrimethoxysilane.

  Examples of the acidic catalyst include inorganic acids, organic acids, acid anhydrides of inorganic acids and derivatives thereof, and acid anhydrides of organic acids and derivatives thereof.

  Examples of the inorganic acid include hydrochloric acid, phosphoric acid, boric acid, and carbonic acid. Examples of the organic acid include formic acid, acetic acid, propionic acid, butyric acid, lactic acid, malic acid, tartaric acid, citric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric acid, maleic acid, and oleic acid. , Paratoluenesulfonic acid, trifluoroacetic acid, trifluoromethanesulfonic acid and the like. Of these, p-toluenesulfonic acid or trifluoromethanesulfonic acid is preferably used.

  Examples of the basic catalyst include alkali metal hydroxides, alkali metal alkoxides, and alkali metal silanol compounds.

  Examples of the alkali metal hydroxide include sodium hydroxide, potassium hydroxide, and cesium hydroxide. Examples of the alkali metal alkoxide include sodium-t-butoxide, potassium-t-butoxide, and cesium-t-butoxide.

  Examples of the alkali metal silanol compound include a sodium silanolate compound, a potassium silanolate compound, and a cesium silanolate compound. Of these, a potassium-based catalyst or a cesium-based catalyst is preferable.

(Catalyst for hydrosilylation reaction)
The hydrosilylation reaction catalyst contained in the encapsulant for optical semiconductor devices according to the present invention includes an alkenyl group in the first silicone resin and a hydrogen atom bonded to a silicon atom in the second silicone resin. Is a catalyst for hydrosilylation reaction.

  As the hydrosilylation reaction catalyst, various catalysts that cause the hydrosilylation reaction to proceed can be used. As for the said catalyst for hydrosilylation reaction, only 1 type may be used and 2 or more types may be used together.

  Examples of the hydrosilylation reaction catalyst include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts. Since the transparency of the sealant can be increased, a platinum-based catalyst is preferable.

  Examples of the platinum-based catalyst include platinum powder, chloroplatinic acid, a platinum-alkenylsiloxane complex, a platinum-olefin complex, and a platinum-carbonyl complex. In particular, a platinum-alkenylsiloxane complex or a platinum-olefin complex is preferable.

  Examples of the alkenylsiloxane in the platinum-alkenylsiloxane complex include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3,5,7-tetramethyl-1,3,5. , 7-tetravinylcyclotetrasiloxane and the like. Examples of the olefin in the platinum-olefin complex include allyl ether and 1,6-heptadiene.

  Since the stability of the platinum-alkenylsiloxane complex and platinum-olefin complex can be improved, alkenylsiloxane, organosiloxane oligomer, allyl ether or olefin is added to the platinum-alkenylsiloxane complex or platinum-olefin complex. Is preferred. The alkenylsiloxane is preferably 1,3-divinyl-1,1,3,3-tetramethyldisiloxane. The organosiloxane oligomer is preferably a dimethylsiloxane oligomer. The olefin is preferably 1,6-heptadiene.

  From the viewpoint of further suppressing the decrease in luminous intensity when used in a harsh environment under high temperature and high humidity, and further suppressing discoloration of the sealant, the hydrosilylation reaction catalyst is An alkenyl complex of platinum is preferable. From the viewpoint of further suppressing the decrease in luminous intensity when used in a state of being energized in a severe environment under high temperature and high humidity, and further suppressing discoloration of the sealant, the platinum alkenyl complex is: It is preferably a platinum alkenyl complex obtained by reacting chloroplatinic acid hexahydrate with 6 equivalents or more of a bifunctional or higher alkenyl compound. In this case, the platinum alkenyl complex is a reaction product of chloroplatinic acid hexahydrate and 6 equivalents or more of a bifunctional or higher alkenyl compound. Moreover, the transparency of the sealant can be increased by using the platinum alkenyl complex. As for the said platinum alkenyl complex, only 1 type may be used and 2 or more types may be used together.

It is preferable to use the chloroplatinic acid hexahydrate (H ₂ PtCl ₆ .6H ₂ O) as a platinum raw material for obtaining the platinum alkenyl complex.

  Examples of the bifunctional or higher alkenyl compound of 6 equivalents or more for obtaining the platinum alkenyl include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3-dimethyl- Examples include 1,3-diphenyl-1,3-divinyldisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane.

  Regarding the “equivalent” in the bifunctional or higher alkenyl compound of 6 equivalents or more, the equivalent weight of 1 mol of the bifunctional or higher alkenyl compound is 1 equivalent to 1 mol of the chloroplatinic acid hexahydrate. . It is preferable that the bifunctional or higher alkenyl compound having 6 equivalents or more is 50 equivalents or less.

  Examples of the solvent used to obtain the platinum alkenyl complex include alcohol solvents such as methanol, ethanol, 2-propanol, and 1-butanol. Aromatic solvents such as toluene and xylene may be used. As for the said solvent, only 1 type may be used and 2 or more types may be used together.

  In order to obtain the platinum alkenyl complex, a monofunctional vinyl compound may be used in addition to the above components. Examples of the monofunctional vinyl compound include trimethoxyvinylsilane, triethoxyvinylsilane, and vinylmethyldimethoxysilane.

  Regarding the reaction product of chloroplatinic acid hexahydrate and 6 equivalents or more of bifunctional or higher alkenyl compound, platinum element and 6 equivalents or more of bifunctional or higher alkenyl compound are covalently bonded or distributed. Or are covalently bonded and coordinated.

  In the sealant, the content of the catalyst for hydrosilylation reaction is preferably 0.01 ppm or more and 1000 ppm or less in terms of weight units of metal atoms (in the case of platinum alkenyl complexes, platinum atoms). When the content of the hydrosilylation reaction catalyst is 0.01 ppm or more, it is easy to sufficiently cure the sealant. When the content of the catalyst for hydrosilylation reaction is 1000 ppm or less, the problem of coloring the cured product hardly occurs. The content of the hydrosilylation catalyst is more preferably 1 ppm or more, and more preferably 500 ppm or less.

(Silicon oxide particles)
The encapsulant for optical semiconductor devices according to the present invention preferably further contains silicon oxide particles.

  By using the silicon oxide particles, the viscosity of the sealant before curing can be adjusted to an appropriate range without impairing the heat resistance and light resistance of the cured product of the sealant. Therefore, the handleability of the sealing agent can be improved.

  The preferable lower limit of the primary particle diameter of the silicon oxide particles is 5 nm, the more preferable lower limit is 8 nm, the preferable upper limit is 200 nm, and the more preferable upper limit is 150 nm. When the primary particle diameter of the silicon oxide particles satisfies the preferable lower limit, the dispersibility of the silicon oxide particles is further increased, and the transparency of the cured product of the sealant is further increased. When the primary particle diameter of the silicon oxide particles satisfies the above preferable upper limit, the effect of increasing the viscosity at 25 ° C. can be sufficiently obtained and the decrease in the viscosity due to the temperature increase can be suppressed.

  The primary particle diameter of the silicon oxide particles is measured as follows. The cured product of the encapsulant for optical semiconductor devices is observed using a transmission electron microscope (trade name “JEM-2100”, manufactured by JEOL Ltd.). The size of the primary particles of 100 silicon oxide particles in the visual field is measured, and the average value of the measured values is defined as the primary particle diameter. The primary particle diameter means an average value of the diameters of the silicon oxide particles when the silicon oxide particles are spherical, and an average value of the major diameters of the silicon oxide particles when the silicon oxide particles are non-spherical.

The minimum with a preferable BET specific surface area of the said silicon oxide particle is 30 m < ² > / g, and a preferable upper limit is 400 m < ² > / g. When the BET specific surface area of the silicon oxide particles is 30 m ² / g or more, the viscosity of the sealant at 25 ° C. can be controlled within a suitable range, and a decrease in viscosity due to a temperature rise can be suppressed. When the BET specific surface area of the silicon oxide particles is 400 m ² / g or less, the aggregation of the silicon oxide particles hardly occurs, the dispersibility can be increased, and the transparency of the cured product of the sealant is further increased. Can be high.

  The silicon oxide particles are not particularly limited, and examples thereof include silica produced by a dry method such as fumed silica and fused silica, and silica produced by a wet method such as colloidal silica, sol-gel silica and precipitated silica. It is done. Among these, fumed silica is suitably used as the silicon oxide particles from the viewpoint of obtaining a sealant with less volatile components and higher transparency.

Examples of the fumed silica include Aerosil 50 (specific surface area: 50 m ² / g), Aerosil 90 (specific surface area: 90 m ² / g), Aerosil 130 (specific surface area: 130 m ² / g), Aerosil 200 (specific surface area). : 200 m ² / g), Aerosil 300 (specific surface area: 300 m ² / g), Aerosil 380 (specific surface area: 380 m ² / g) (all manufactured by Nippon Aerosil Co., Ltd.) and the like.

  The silicon oxide particles are preferably surface-treated with an organosilicon compound. By this surface treatment, the dispersibility of the silicon oxide particles becomes very high, and the decrease in the viscosity due to the increase in the temperature of the sealant before curing can be further suppressed.

  The organosilicon compound is not particularly limited. For example, a silane compound having an alkyl group, a silicon compound having a siloxane skeleton such as dimethylsiloxane, a silicon compound having an amino group, and a silicon compound having a (meth) acryloyl group. Examples thereof include a compound and a silicon compound having an epoxy group. The “(meth) acryloyl group” means an acryloyl group and a methacryloyl group.

  From the viewpoint of further enhancing the dispersibility of the silicon oxide particles, the silicon oxide particles are preferably surface-treated with an organosilicon compound having a trimethylsilyl group or an organosilicon compound having a polydimethylsiloxane group.

  As an example of a method for surface treatment with an organosilicon compound, when an organosilicon compound having a trimethylsilyl group is used, the silicon oxide particles are surface-treated using, for example, hexamethyldisilazane, trimethylsilyl chloride, trimethylmethoxysilane, or the like. A method is mentioned. In the case of using an organosilicon compound having a polydimethylsiloxane group, a method of surface-treating silicon oxide particles using a compound having a silanol group at the terminal of the polydimethylsiloxane group, cyclic siloxane, or the like can be mentioned.

Commercially available silicon oxide particles surface-treated with the above organosilicon compound having a trimethylsilyl group include RX200 (specific surface area: 140 m ² / g) and R8200 (specific surface area: 140 m ² / g) (both from Nippon Aerosil Co., Ltd.) Manufactured) and the like.

RY200 (specific surface area: 120 m ² / g) (manufactured by Nippon Aerosil Co., Ltd.) and the like can be mentioned as a commercial product of silicon oxide particles surface-treated with an organosilicon compound having a polydimethylsiloxane group.

  The method for surface-treating the silicon oxide particles with the organosilicon compound is not particularly limited. As this method, for example, a dry method in which silicon oxide particles are added to a mixer and an organosilicon compound is added while stirring, a slurry method in which an organosilicon compound is added to a slurry of silicon oxide particles, and silicon oxide particles And a direct treatment method such as a spray method in which an organosilicon compound is sprayed after drying. Examples of the mixer used in the dry method include a Henschel mixer and a V-type mixer. In the dry method, the organosilicon compound is added directly or as an alcohol aqueous solution, an organic solvent solution or an aqueous solution.

  In order to obtain silicon oxide particles surface-treated with the organosilicon compound, when preparing a sealant for an optical semiconductor device, the silicon oxide particles and the matrix resin such as the first and second silicone resins An integral blend method in which an organosilicon compound is directly added during mixing may be used.

  The content of the silicon oxide particles is preferably 0.5 parts by weight or more and 40 parts by weight or less with respect to 100 parts by weight in total of the first silicone resin and the second silicone resin. A more preferable lower limit of the content of the silicon oxide particles is 1 part by weight and a more preferable upper limit is 35 parts by weight with respect to a total of 100 parts by weight of the first silicone resin and the second silicone resin. When the content of the silicon oxide particles satisfies the lower limit, it is possible to suppress a decrease in viscosity during curing. When content of the said silicon oxide particle satisfy | fills the said upper limit, the viscosity of sealing agent can be controlled to a more suitable range, and the transparency of sealing agent can be improved further.

(Phosphor)
The encapsulant for optical semiconductor devices according to the present invention may further contain a phosphor. The above phosphor acts to absorb light emitted from a light emitting element that is sealed using a sealant for an optical semiconductor device and generate fluorescence to finally obtain light of a desired color. To do. The phosphor is excited by light emitted from the light emitting element to emit fluorescence, and light of a desired color can be obtained by a combination of light emitted from the light emitting element and fluorescence emitted from the phosphor.

  For example, when it is intended to finally obtain white light using an ultraviolet LED chip as a light emitting element, it is preferable to use a combination of a blue phosphor, a red phosphor and a green phosphor. When it is intended to finally obtain white light using a blue LED chip as a light emitting element, it is preferable to use a combination of a green phosphor and a red phosphor, or a yellow phosphor. As for the said fluorescent substance, only 1 type may be used and 2 or more types may be used together.

The blue phosphor is not particularly limited. For example, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu, (Ba, Sr) MgAl ₁₀ O ₁₇ : Eu, (Sr, Ba) ₃ MgSi ₂ O ₈ : Eu and the like.

The red phosphor is not particularly limited. For example, (Sr, Ca) S: Eu, (Ca, Sr) ₂ SI ₅ N ₈ : Eu, CaSiN ₂ : Eu, CaAlSiN ₃ : Eu, Y ₂ O ₂ S : Eu, La ₂ O ₂ S: Eu, LiW ₂ O ₈ : (Eu, Sm), (Sr, Ca, Bs, Mg) ₁₀ (PO ₄ ) ₈ Cl ₂ : (Eu, Mn), Ba ₃ MgSi ₂ And O ₈ : (Eu, Mn).

The green phosphor is not particularly limited, and for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce, SrGa ₂ S ₄ : Eu, Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, SrSiON: Eu, ZnS: (Cu, Al), BaMgAl ₁₀ O ₁₇ (Eu, Mn), SrAl ₂ O ₄ : Eu, and the like.

Is not particularly restricted but includes the yellow phosphor, for _{example, Y 3 Al 5 O 12:} Ce, (Y, Gd) 3 Al 5 O 12: Ce, Tb 3 Al 5 O 12: Ce, CaGa 2 S 4: Eu , Sr ₂ SiO ₄ : Eu, and the like.

  Furthermore, examples of the phosphor include perylene compounds that are organic phosphors.

(Coupling agent)
The encapsulant for optical semiconductor devices according to the present invention may further contain a coupling agent in order to impart adhesiveness.

  It does not specifically limit as said coupling agent, For example, a silane coupling agent etc. are mentioned. Examples of the silane coupling agent include vinyltriethoxysilane, vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ-methacryloxypropyltrimethoxy. Examples include silane, γ-aminopropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane. As for a coupling agent, only 1 type may be used and 2 or more types may be used together.

(Other ingredients)
The encapsulant for optical semiconductor devices according to the present invention includes a dispersant, an antioxidant, an antifoaming agent, a colorant, a modifier, a leveling agent, a light diffusing agent, a thermally conductive filler, a flame retardant, and the like as necessary. The additive may be further contained.

  In addition, the said 1st silicone resin, the said 2nd silicone resin, and the said catalyst for hydrosilylation reaction prepare the liquid containing these 1 type (s) or 2 or more types separately, and just before use, several The encapsulant for optical semiconductor devices according to the present invention may be prepared by mixing the liquid. For example, liquid A containing the first silicone resin and hydrosilylation reaction catalyst and liquid B containing the second silicone resin are prepared separately, and liquid A and liquid B are mixed immediately before use. The encapsulant for optical semiconductor devices according to the present invention may be prepared. In this case, the silicon oxide particles and the phosphor may be added to the liquid A or the liquid B, respectively. Thus, the storage stability is improved by separately forming the first silicone resin and the hydrosilylation reaction catalyst and the second silicone resin into two liquids of the first liquid and the second liquid. Can be made.

(Details and applications of sealants for optical semiconductor devices)
The curing temperature of the encapsulant for optical semiconductor devices according to the present invention is not particularly limited. The preferable lower limit of the curing temperature of the encapsulant for optical semiconductor devices is 80 ° C., the more preferable lower limit is 100 ° C., the preferable upper limit is 180 ° C., and the more preferable upper limit is 150 ° C. When the curing temperature satisfies the above preferable lower limit, curing of the sealant proceeds sufficiently. When the curing temperature satisfies the above preferable upper limit, the package is unlikely to be thermally deteriorated.

  Although it does not specifically limit to hardening, It is preferable to use a step cure system. The step cure method is a method in which the resin is temporarily cured at a low temperature and then cured at a high temperature. By using the step cure method, curing shrinkage of the sealant can be suppressed.

  The method for producing the encapsulant for optical semiconductor devices according to the present invention is not particularly limited, for example, using a mixer such as a homodisper, a homomixer, a universal mixer, a planetarium mixer, a kneader, a three roll or a bead mill, Examples thereof include a method of mixing the first silicone resin, the second silicone resin, the hydrosilylation reaction catalyst, and other components blended as necessary at room temperature or under heating.

  The light emitting element is not particularly limited as long as it is a light emitting element using a semiconductor. For example, when the light emitting element is a light emitting diode, for example, a structure in which a semiconductor material for LED type is stacked on a substrate can be given. In this case, examples of the semiconductor material include GaAs, GaP, GaAlAs, GaAsP, AlGaInP, GaN, InN, AlN, InGaAlN, and SiC.

  Examples of the material for the substrate include sapphire, spinel, SiC, Si, ZnO, and GaN single crystal. Further, a buffer layer may be formed between the substrate and the semiconductor material as necessary. Examples of the material of the buffer layer include GaN and AlN.

  Specific examples of the optical semiconductor device according to the present invention include a light emitting diode device, a semiconductor laser device, and a photocoupler. Such optical semiconductor devices include, for example, backlights such as liquid crystal displays, illumination, various sensors, light sources such as printers and copiers, vehicle measuring instrument light sources, signal lights, indicator lights, display devices, and light sources for planar light emitters. , Displays, decorations, various lights, switching elements and the like.

  In the optical semiconductor device according to the present invention, the light emitting element formed of the optical semiconductor is sealed with the cured product of the encapsulant for optical semiconductor devices according to the present invention. In the optical semiconductor device according to the present invention, a cured product of an encapsulant for optical semiconductor devices is arranged so as to seal a light emitting element formed of an optical semiconductor such as an LED. For this reason, it is hard to produce a crack in the hardened | cured material of the sealing compound for optical semiconductor devices which has sealed the light emitting element, it is hard to peel from a package, and improves light transmittance, heat resistance, a weather resistance, and gas barrier property. be able to.

(Embodiment of optical semiconductor device)
FIG. 1 is a front sectional view showing an optical semiconductor device according to an embodiment of the present invention.

  The optical semiconductor device 1 of this embodiment has a housing 2. An optical semiconductor element 3 made of LEDs is mounted in the housing 2. The optical semiconductor element 3 is surrounded by an inner surface 2 a having light reflectivity of the housing 2. In the present embodiment, the optical semiconductor element 3 is used as a light emitting element formed of an optical semiconductor.

  The inner surface 2a is formed so that the diameter of the inner surface 2a increases toward the opening end. Therefore, of the light emitted from the optical semiconductor element 3, the light that has reached the inner surface 2 a is reflected by the inner surface 2 a and travels forward of the optical semiconductor element 3. In a region surrounded by the inner surface 2 a so as to seal the optical semiconductor element 3, an optical semiconductor device sealing agent 4 is filled. The encapsulant 4 for optical semiconductor devices is a cured product of the encapsulant for optical semiconductor devices.

  The structure shown in FIG. 1 is merely an example of an optical semiconductor device according to the present invention, and can be appropriately modified to the mounting structure of the optical semiconductor element 3.

  Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to the following examples.

(Synthesis Example 1) Synthesis of first silicone resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 56 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and dimethyl 198 g of dimethoxysilane, 183 g of diphenyldimethoxysilane and 150 g of N, N-dimethylformamide were added and stirred at 50 ° C. A solution obtained by dissolving 0.7 g of potassium hydroxide in 92 g of water was slowly dropped therein, and after the dropwise addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, 0.8 g of acetic acid was added to the reaction solution, the pressure was reduced to remove volatile components, and potassium acetate was removed by filtration to obtain a polymer (A).

The number average molecular weight (Mn) of the obtained polymer (A) was 1400. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (A) had the following average composition formula (A1).

(ViMe ₂ SiO _1/2 ) _0.16 (Me ₂ SiO _2/2 ) _0.55 (Ph ₂ SiO _2/2 ) _0.29 ... Formula (A1)

  In the above formula (A1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group of the obtained polymer (A) was 40% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

  In addition, the molecular weight of each polymer obtained in Synthesis Example 1 and Synthesis Examples 2 to 10 was measured by GPC measurement by adding 1 mL of tetrahydrofuran to 10 mg of each polymer, stirring until dissolved. In GPC measurement, a measuring device manufactured by Waters (column: Shodex GPC LF-804 (length: 300 mm) x 2 manufactured by Showa Denko KK), measuring temperature: 40 ° C., flow rate: 1 mL / min, solvent: tetrahydrofuran, standard substance: Polystyrene) was used.

(Synthesis Example 2) Synthesis of First Silicone Resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 56 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and dimethyl 108 g of dimethoxysilane, 367 g of diphenyldimethoxysilane and 150 g of N, N-dimethylformamide were added and stirred at 50 ° C. A solution obtained by dissolving 0.7 g of potassium hydroxide in 92 g of water was slowly dropped therein, and after the dropwise addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, 0.8 g of acetic acid was added to the reaction solution, the pressure was reduced to remove volatile components, and potassium acetate was removed by filtration to obtain a polymer (B).

The number average molecular weight (Mn) of the obtained polymer (B) was 1500. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (B) had the following average composition formula (B1).

(ViMe ₂ SiO _1/2 ) _0.15 (Me ₂ SiO _2/2 ) _0.31 (Ph ₂ SiO _2/2 ) _0.54 Formula (B1)

  In the above formula (B1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group in the obtained polymer (B) was 58% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

Synthesis Example 3 Synthesis of First Silicone Resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 78 g of dimethyldimethoxysilane, 318 g of diphenyldimethoxysilane, 119 g of vinylmethyldimethoxysilane, 16 g of trimethylmethoxysilane and N, N-dimethylformamide 150 g was added and stirred at 50 ° C. A solution obtained by dissolving 0.8 g of potassium hydroxide in 105 g of water was slowly added dropwise thereto, and after the addition, the mixture was stirred at 50 ° C. for 6 hours to be reacted to obtain a reaction solution. Next, 0.9 g of acetic acid was added to the reaction solution, the pressure was reduced to remove volatile components, and potassium acetate was removed by filtration to obtain a polymer (C).

The number average molecular weight (Mn) of the obtained polymer (C) was 5100. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (C) had the following average composition formula (C1).

(Me ₃ SiO _1/2 ) _0.05 (Me ₂ SiO _2/2 ) _0.22 (Ph ₂ SiO _2/2 ) _0.43 (ViMeSiO _2/2 ) _0.30 ... Formula (C1)

  In the above formula (C1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group of the obtained polymer (C) was 50% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

(Synthesis Example 4) Synthesis of Second Silicone Resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 31 g of trimethylmethoxysilane, 50 g of 1,1,3,3-tetramethyldisiloxane, dimethyldimethoxy 108 g of silane, 208 g of phenyltrimethoxysilane and 215 g of N, N-dimethylformamide were added and stirred at 50 ° C. Into this, a solution of 2.5 g of p-toluesulfonic acid and 101 g of water was slowly added dropwise, and after the addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, the polymer was obtained by removing the volatile component under reduced pressure. To the obtained polymer, 150 g of hexane and 150 g of ethyl acetate were added, washed 10 times with 300 g of ion-exchanged water, reduced in pressure to remove volatile components, and polymer (D) was obtained.

The number average molecular weight (Mn) of the obtained polymer (D) was 1200. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (D) had the following average composition formula (D1).

(Me ₃ SiO _1/2 ) _0.09 (HMe ₂ SiO _1/2 ) _0.23 (Me ₂ SiO _2/2 ) _0.28 (PhSiO _3/2 ) _0.40 ... Formula (D1)

  In the above formula (D1), Me represents a methyl group, and Ph represents a phenyl group.

The content ratio of the phenyl group of the obtained polymer (D) was 32% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

Synthesis Example 5 Synthesis of Second Silicone Resin A 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer was charged with 16 g of trimethylmethoxysilane, 50 g of 1,1,3,3-tetramethyldisiloxane, and dimethyldimethoxy. 36 g of silane, 183 g of diphenyldimethoxysilane, 149 g of phenyltrimethoxysilane, 45 g of vinyltrimethoxysilane and 215 g of N, N-dimethylformamide were added and stirred at 50 ° C. Into this, a solution of 2.5 g of p-toluesulfonic acid and 104 g of water was slowly added dropwise. After the addition, the solution was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, the polymer was obtained by removing the volatile component under reduced pressure. To the obtained polymer, 150 g of hexane and 150 g of ethyl acetate were added, washed 10 times with 300 g of ion-exchanged water, reduced in pressure to remove volatile components, and polymer (E) was obtained.

The number average molecular weight (Mn) of the obtained polymer (E) was 1100. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (E) had the following average composition formula (E1).

(Me ₃ SiO _1/2 ) _0.05 (HMe ₂ SiO _1/2 ) _0.23 (Me ₂ SiO _2/2 ) _0.09 (Ph ₂ SiO _2/2 ) _0.26 (PhSiO _3/2 ) _0.27 (ViSiO _3/2 ) _0.10 Formula (E1)

  In the above formula (E1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group of the obtained polymer (E) was 50% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

Synthesis Example 6 Synthesis of Second Silicone Resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 31 g of trimethylmethoxysilane, 40 g of 1,1,3,3-tetramethyldisiloxane, diphenyldimethoxy 110 g of silane, 268 g of phenyltrimethoxysilane, 45 g of vinyltrimethoxysilane and 215 g of N, N-dimethylformamide were added and stirred at 50 ° C. Into this, a solution of 2.5 g of p-toluesulfonic acid and 116 g of water was slowly added dropwise. After the addition, the solution was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, the polymer was obtained by removing the volatile component under reduced pressure. To the obtained polymer, 150 g of hexane and 150 g of ethyl acetate were added, washed 10 times with 300 g of ion-exchanged water, reduced in pressure to remove volatile components, and polymer (F) was obtained.

The number average molecular weight (Mn) of the obtained polymer (F) was 1200. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (F) had the following average composition formula (F1).

(Me ₃ SiO _1/2 ) _0.09 (HMe ₂ SiO _1/2 ) _0.19 (Ph ₂ SiO _2/2 ) _0.16 (PhSiO _3/2 ) _0.46 (ViSiO _3/2 ) _{0. 10} : Formula (F1)

  In the above formula (F1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group of the obtained polymer (F) was 51 wt %, and the content of alkoxy groups was 0 mol% by ¹ H-NMR.

(Synthesis Example 7) Synthesis of Second Silicone Resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 31 g of trimethylmethoxysilane, 40 g of 1,1,3,3-tetramethyldisiloxane, diphenyldimethoxy 44 g of silane, 321 g of phenyltrimethoxysilane, 45 g of vinyltrimethoxysilane and 215 g of N, N-dimethylformamide were added and stirred at 50 ° C. Into this, a solution of 2.5 g of p-toluesulfonic acid and 121 g of water was slowly added dropwise. After the addition, the solution was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, the polymer was obtained by removing the volatile component under reduced pressure. To the obtained polymer, 150 g of hexane and 150 g of ethyl acetate were added, washed 10 times with 300 g of ion-exchanged water, reduced in pressure to remove volatile components, and polymer (G) was obtained.

The number average molecular weight (Mn) of the obtained polymer (G) was 1100. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (G) had the following average composition formula (G1).

(Me ₃ SiO _1/2 ) _0.09 (HMe ₂ SiO _1/2 ) _0.19 (Ph ₂ SiO _2/2 ) _0.06 (PhSiO _3/2 ) _0.56 (ViSiO _3/2 ) _{0. 10} : Formula (G1)

  In the above formula (G1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The content ratio of the phenyl group of the obtained polymer (G) was 47% by weight , and the content of the alkoxy group was 0 mol% by ¹ H-NMR.

Synthesis Example 8 [Comparative Example] Synthesis of a silicone resin similar to the first silicone resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 94 g of trimethylmethoxysilane, 99 g of dimethyldimethoxysilane, diphenyl 92 g of dimethoxysilane and 133 g of vinyltrimethoxysilane were added and stirred at 50 ° C. A solution obtained by dissolving 0.8 g of potassium hydroxide in 108 g of water was slowly dropped therein, and after the dropwise addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, 0.9 g of acetic acid was added to the reaction solution, the pressure was reduced to remove volatile components, and potassium acetate was removed by filtration to obtain a polymer (H).

The number average molecular weight (Mn) of the obtained polymer (H) was 1800. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (H) had the following average composition formula (H1).

(Me ₃ SiO _1/2 ) _0.29 (Me ₂ SiO _2/2 ) _0.27 (Ph ₂ SiO _2/2 ) _0.13 (ViSiO _3/2 ) _0.31 ... Formula (H1)

  In the above formula (H1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The obtained polymer (H) had a phenyl group content of 21% by weight , and an alkoxy group content of 1.8 mol% by ¹ H-NMR.

(Synthesis Example 9) [For Comparative Example] Synthesis of a silicone resin similar to the first silicone resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 180 g of dimethyldimethoxysilane, 73 g of diphenyldimethoxysilane, vinyl 119 g of methyldimethoxysilane and 76 g of 1,4-bis (dimethylmethoxysilyl) benzene were added and stirred at 50 ° C. A solution obtained by dissolving 0.8 g of potassium hydroxide in 108 g of water was slowly dropped therein, and after the dropwise addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, 0.9 g of acetic acid was added to the reaction solution, the pressure was reduced to remove volatile components, and potassium acetate was removed by filtration to obtain polymer (I).

The number average molecular weight (Mn) of the obtained polymer (I) was 3400. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (I) had the following average composition formula (I1).

(Me ₂ SiO _2/2 ) _0.49 (Ph ₂ SiO _2/2 ) _0.10 (ViMeSiO _2/2 ) _0.31 (Me ₄ SiPheO _2/2 ) _0.10 ... Formula (I1)

  In the above formula (I1), Me represents a methyl group, Ph represents a phenyl group, Vi represents a vinyl group, and Phe represents a phenylene group.

The total content ratio of the phenyl group and the phenylene group in the obtained polymer (I) was 22% by weight , and the content of the alkoxy group was 1.4 mol% by ¹ H-NMR.

Synthesis Example 10 [Comparative Example] Synthesis of a silicone resin similar to the second silicone resin In a 1000 mL separable flask equipped with a thermometer, a dropping device and a stirrer, 31 g of trimethylmethoxysilane, 1,1,3, 50 g of 3-hexamethyldisiloxane, 140 g of dimethyldimethoxysilane, 59 g of diphenyldimethoxysilane, 48 g of phenyltrimethoxysilane and 45 g of vinyltrimethoxysilane were added and stirred at 50 ° C. Into this, a solution of 1.4 g of hydrochloric acid and 92 g of water was slowly added dropwise, and after the addition, the mixture was stirred at 50 ° C. for 6 hours and reacted to obtain a reaction solution. Next, the polymer was obtained by removing the volatile component under reduced pressure. To the obtained polymer, 150 g of hexane and 150 g of ethyl acetate were added, washed 10 times with 300 g of ion-exchanged water, reduced in pressure to remove volatile components, and polymer (J) was obtained.

The number average molecular weight (Mn) of the obtained polymer (J) was 600. As a result of identifying the chemical structure from ²⁹ Si-NMR, the polymer (J) had the following average composition formula (J1).

(Me ₃ SiO _1/2 ) _0.09 (HMe ₂ SiO _1/2 ) _0.24 (Me ₂ SiO _2/2 ) _0.38 (Ph ₂ SiO _2/2 ) _0.08 (PhSiO _3/2 ) _0.10 (ViSiO _3/2 ) _0.10 Formula (J1)

  In the above formula (J1), Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

The obtained polymer (J) had a phenyl group content of 23% by weight , and an alkoxy group content of 2.2 mol% by ¹ H-NMR.

(Synthesis of platinum alkenyl complex A)
A reaction flask equipped with a reflux condenser, chloroplatinic acid hexahydrate _{(H 2 PtCl 6 · 6H 2} O, 300mg), and placed 2-propanol (4.6 ml), at room temperature under a nitrogen atmosphere 20 Stir for minutes. After 20 minutes, sodium bicarbonate (NaHCO ₃ , 400 mg) was added and stirred until no gas was evolved, then 1,3-divinyl-1,1,3,3-tetramethyldisiloxane (8 equivalents, 864 mg) was added and the reaction solution was stirred at 60 ° C. for 24 hours. The reaction solution was returned to room temperature, anhydrous magnesium sulfate (300 mg) was added, and the mixture was stirred for 5 minutes. Thereafter, celite filtration was performed using diethyl ether as a solvent, and the solution was concentrated until the amount of the solution became 5 g to obtain a solution of platinum alkenyl complex A.

Example 1
A solution of polymer A (10 g), polymer D (20 g), and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 2)
A solution of polymer A (10 g), polymer E (20 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 3)
A solution of polymer A (10 g), polymer F (20 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

Example 4
A solution of polymer A (10 g), polymer G (20 g), and platinum alkenyl complex A (amount of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 5)
A solution of polymer B (10 g), polymer E (20 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 6)
A solution of polymer B (10 g), polymer F (20 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 7)
A solution of polymer B (10 g), polymer G (20 g), and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 8)
A solution of polymer C (10 g), polymer E (10 g) and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

Example 9
A solution of polymer C (10 g), polymer F (10 g) and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Example 10)
A solution of polymer C (10 g), polymer G (10 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Comparative Example 1)
A solution of polymer H (10 g), polymer D (10 g) and platinum alkenyl complex A (amount in which the platinum element content in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Comparative Example 2)
A solution of polymer I (10 g), polymer D (10 g) and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Comparative Example 3)
A solution of polymer H (10 g), polymer J (10 g) and platinum alkenyl complex A (amount in which the content of platinum element in the sealant is 10 ppm) is mixed, defoamed, and sealed for an optical semiconductor device. A stop was obtained.

(Evaluation)
(Production of optical semiconductor device)
In a structure in which a light emitting element having a main emission peak of 460 nm is mounted on a silver-plated polyphthalamide housing material with a lead electrode by a die bond material, and the light emitting element and the lead electrode are connected by a gold wire. The obtained sealant for optical semiconductor device was injected, and heated and cured at 150 ° C. for 2 hours to produce an optical semiconductor device. Using this optical semiconductor device, the following evaluation items were evaluated.

(Gas corrosion test)
The obtained optical semiconductor device was placed in a chamber at 40 ° C. and a relative humidity of 90% RH, and the chamber was filled with gas so that the concentration of hydrogen sulfide gas was 5 ppm and the concentration of sulfur dioxide gas was 15 ppm. . From the gas filling, the lead electrodes plated with silver were visually observed after 24 hours, 48 hours, 96 hours, 168 hours and 500 hours.

  “○○” indicates no discoloration in the silver plating, “○” indicates that the silver plating is slightly browned, “△” indicates that almost all of the silver plating has changed to brown, The case where almost all of the plating changed to black was judged as “x”.

(Thermal shock test)
The obtained optical semiconductor device was held at −50 ° C. for 5 minutes using a liquid tank thermal shock tester (“TSB-51”, manufactured by ESPEC), then heated to 135 ° C., and at 135 ° C. A cold cycle test was conducted in which the process of holding for 5 minutes and then lowering the temperature to −50 ° C. was one cycle. After 500 cycles, 20 samples were taken after 1000 cycles and 1500 cycles, respectively.

  The sample was observed with a stereomicroscope (“SMZ-10”, manufactured by Nikon Corporation). It is observed whether or not each of the 20 samples of the encapsulant for optical semiconductor devices has cracks, or whether or not the encapsulant for optical semiconductor devices has peeled off from the package or electrode, and cracks or delamination occurred. The number of samples (NG number) was counted.

(Defoaming property)
In the obtained 100 optical semiconductor devices, it was confirmed using a stereomicroscope (“SMZ-10”, manufactured by Nikon Corporation) whether or not bubbles were contained in the cured sealant. The defoaming property was determined according to the following criteria.

[Degassing criteria]
○○: No optical semiconductor device in which bubbles are mixed in the sealant ○: Less than 5 optical semiconductor devices in which bubbles are mixed in the sealant Δ: Bubbles are mixed in the sealant 5 to less than 20 optical semiconductor devices ×: 20 or more optical semiconductor devices in which bubbles are mixed in the sealant

  The results are shown in Table 1 below.

DESCRIPTION OF SYMBOLS 1 ... Optical semiconductor device 2 ... Housing 2a ... Inner surface 3 ... Optical semiconductor element 4 ... Sealant for optical semiconductor devices

Claims (4)

A first silicone resin having an aryl group and an alkenyl group and having substantially no alkoxy group (excluding a silicone resin having a hydrogen atom bonded to a silicon atom);
A second silicone resin having a hydrogen atom bonded to an aryl group and a silicon atom, and having substantially no alkoxy group;
A catalyst for hydrosilylation reaction,
The first silicone resin is a first silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using a basic catalyst,
The sealing for optical semiconductor device, wherein the second silicone resin is a second silicone resin obtained by hydrolytic polycondensation of at least one of an alkoxysilane compound and a disiloxane compound using an acidic catalyst. Agent. The first silicone resin is represented by the following formula (1A) ,
It said second silicone resin is represented by the following formula (51A), a sealant for an optical semiconductor device according to claim 1.

In the formula (1A), a, b and c are a / (a + b + c) = 0 to 0.50, b / (a + b + c) = 0.40 to 1.0 and c / (a + b + c) = 0 to 0. 50, R1 to R6 represent at least one aryl group, at least one represents an alkenyl group, and R1 to R6 other than the aryl group and the alkenyl group represent a hydrocarbon group having 1 to 8 carbon atoms. .

In the formula (51A), p, q and r are p / (p + q + r) = 0.05 to 0.50, q / (p + q + r) = 0.05 to 0.50 and r / (p + q + r) = 0. 20 to 0.80 are satisfied, R51 to R56 each represent at least one aryl group, at least one represents a hydrogen atom bonded to a silicon atom, and R51 to R51 other than an aryl group and a hydrogen atom bonded to a silicon atom R56 represents a hydrocarbon group having 1 to 8 carbon atoms. The content ratio of the aryl group calculated | required from the following formula (X) in the said 1st silicone resin and the said 2nd silicone resin is 30 weight % or more and 70 weight % or less, respectively. Sealant for optical semiconductor devices.
Content ratio (% by weight ) of aryl group = (average number of aryl groups contained in one molecule of the first silicone resin or the second silicone resin × molecular weight of the aryl group / the first silicone resin or the above Number average molecular weight of second silicone resin) × 100 Formula (X)   An optical semiconductor device comprising: an optical semiconductor element; and the encapsulant for an optical semiconductor device according to claim 1, which is provided so as to seal the optical semiconductor element.

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