JP5321562B2 - Electronic device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic device in which a vibration isolating member is interposed between the electronic component and the casing so that the electronic component is accommodated in the casing and the electronic component and the casing are connected by wire bonding, and such an electronic device. The present invention relates to a device manufacturing method.

  Conventionally, this type of electronic device has an electronic component and a supporting portion that supports the electronic component on the side facing the one end surface of the electronic component, and a supporting surface is formed on the one end surface side of the electronic component in the supporting portion. There has been proposed a housing provided with a casing and a vibration isolating member provided between one end surface and a support surface of an electronic component (see Patent Document 1).

  Here, the vibration isolating member attenuates the relative vibration between the electronic component and the casing by an elastic force or the like, and is formed using a resin elastomer or the like. Moreover, in the thing of this patent document 1, wire bonding is performed in the other end surface opposite to the one end surface currently supported by the support part via the vibration isolator among electronic components, and the wire formed by it Connects the other end surface of the electronic component and the pad of the casing.

  Such an electronic device disclosed in Patent Document 1 is usually wire bonding after assembling the electronic component and the casing in a state where the one end surface of the electronic component and the support surface of the casing face each other with the vibration isolating member interposed therebetween. Manufactured by performing. In this wire bonding, a work made of an electronic component and a casing is mounted on the support jig in a state where one end surface side of the electronic component is opposed to a support jig for wire bonding.

  Here, the workpieces mounted on the support jig are stacked in the order of the support portion of the casing, the vibration isolation member, and the electronic component from the support jig side. In this state, when wire bonding is performed on the other end surface of the electronic component, the wire bonding load is transmitted to the one end surface side opposite to the other end surface which is the wire bonding surface of the electronic component, and the one end surface Is applied to a vibration isolating member located at

  As described above, since the vibration isolating member is elastically deformed, the wire bonding load escapes in this state. Therefore, conventionally, the wire bonding described above is performed by placing a nesting or the like as a supporting jig in a portion of the one end surface of the electronic component that is detached from the vibration isolation member, and supporting the detached portion with the nesting or the like. The escape of the load was prevented.

JP 2010-181392 A

  However, in the wire bonding, when there is a dimensional variation or the like of the nesting, the adhesion between the nesting and the one end surface of the electronic component varies, and a gap may be generated between the two. . Further, in the wire bonding, there may be a case where there is a variation in the height of the casing on the support jig.

  If these gaps or variations in height occur, the workpiece on the support jig rattles during wire bonding, causing the electronic component to be displaced, and as a result, preventing vibration between the electronic component and the casing. The possibility that the member peels increases.

  The present invention has been made in view of the above-described problem. The electronic component is accommodated in the casing by interposing an anti-vibration member between the electronic component and the casing, and the electronic component and the casing are connected by wire bonding. In this electronic device, while eliminating the wire bonding load during wire bonding, it is not affected by variations in the height of the casing. For the purpose.

  In order to achieve the above-mentioned object, the invention described in claim 1 includes an electronic component (10) and a support portion (10) supporting the electronic component (10) on the side facing the one end surface (11) of the electronic component (10). 22), a casing (20) in which a support surface (23) is formed on the one end surface (11) side of the electronic component (10) in the support portion (22), and one end surface of the electronic component (10) ( 11) and an anti-vibration member (40) that is interposed between the electronic component (10) and the casing (20) and is interposed between the support surface (23) and the electronic component (10). In the device manufacturing method, the following steps are performed.

  The casing (20) has a support portion (22), and an opening (24) penetrating the support portion (22) from the support surface (23) to the surface opposite to the support surface (23). A support jig (1) for supporting the electronic component (10) is prepared, and the other end surface (12) opposite to the one end surface (11) of the electronic component (10) is supported on the support jig ( The electronic component (10) is mounted on the support jig (1) in a state of being opposed to 1).

  Next, the vibration isolating member (40) is mounted on the one end surface (11) of the electronic component (10) while the electronic component (10) is supported by the support jig (1).

  Next, the casing (20) is attached to the electronic component (10) with the one end surface (11) and the support surface (23) of the electronic component (10) facing each other via the vibration isolating member (40). At the same time, the casing (20) is also brought into contact with the support jig (1) to support the casing (20) on the support jig (1).

  Subsequently, in a state where the electronic component (10) and the casing (20) are supported by the support jig (1), wire bonding is performed through the opening (24) to expose from the opening (24). Connecting one end surface (11) of the electronic component (10) and the casing (20) by a bonding wire (50). The production method of the present invention is characterized by performing these steps.

  According to the present invention, in the electronic component (10), the surface to be wire bonded and the surface on which the vibration isolation member (40) is installed are the same surface as the one end surface (11) of the electronic component (10). Therefore, at the time of wire bonding, both the electronic component (10) and the casing (20) are supported by the support jig (1) on the side opposite to the wire bonding side and the side where the vibration isolating member (40) is installed. Can do.

  Therefore, the electronic component (10) can be supported by the support jig (1) regardless of the height variation of the casing (20). Therefore, according to the present invention, it is possible to eliminate the escape of the wire bonding load at the time of wire bonding, without being affected by the height variation of the casing (20), and without having to devise a support jig by nesting or the like. The peeling of (40) can be suppressed.

  According to a second aspect of the present invention, in the method for manufacturing an electronic device according to the first aspect, the opening (24) extends in the X direction parallel to the support surface (23). And a Y-shaped opening (242) extending in the Y direction perpendicular to the X direction and parallel to the support surface (23) to form a cross-shaped opening, and the X direction of the X direction opening (241) Wire bonding is performed at all the positions on both ends in the Y direction and the positions on both ends in the Y direction of the Y-direction opening (242).

  In this way, in the case of the cross-shaped opening (24), wire bonding may be performed at all four positions on the opening (24).

  According to a third aspect of the present invention, in the method for manufacturing an electronic device according to the first aspect, the opening (24) extends in the X direction parallel to the support surface (23). And a Y-shaped opening (242) extending in the Y direction perpendicular to the X direction and parallel to the support surface (23) to form a cross-shaped opening, and the X direction of the X direction opening (241) Wire bonding is performed only at either one of the locations on both ends in the Y-direction opening (242) and the locations on both ends in the Y-direction.

  As described above, in the case of the cross-shaped opening (24), only one of the two ends of the opening (24) at both ends in one direction, that is, it is opposed along one direction. Wire bonding may be performed only at two locations on both ends.

  According to a fourth aspect of the present invention, in the electronic device manufacturing method according to the first aspect, the opening (24) extends in the X direction parallel to the support surface (23). And a Y-shaped opening (242) extending in the Y direction perpendicular to the X direction and parallel to the support surface (23) to form a cross-shaped opening shape, and the X direction opening (241) in the X direction Wire bonding is performed at only one of the four locations, ie, the locations on both ends and the locations on both ends in the Y direction of the Y-direction opening (242).

  Thus, in the case of the cross-shaped opening (24), wire bonding may be performed only at one end of the four ends on the opening (24).

  Furthermore, in the invention described in claim 5, in the method for manufacturing an electronic device according to any one of claims 2 to 4, the X direction opening (241) and the Y direction opening (242) intersect. An anti-vibration member (40) is provided corresponding to all of the four corners (25) of the support part (22) located at the intersection (243) of the opening (24).

  As described above, in the case of the cross-shaped opening (24), the four corners (25) of the support part (23) positioned at the intersection (243) of the opening (24) are prevented in correspondence. Providing the vibration member (40) is preferable because the electronic component (10) is sufficiently supported by the vibration isolation member (40).

In the invention according to claim 6, the electronic component (10) has a support portion (22) for supporting the electronic component (10) on the side facing the one end surface (11) of the electronic component (10), and is supported. A casing (20) in which a support surface (23) is formed on one end surface (11) side of the electronic component (10) in the portion (22), and an end surface (11) and support surface (23 of the electronic component (10) And an anti-vibration member (40) for attenuating relative vibration between the electronic component (10) and the casing (20).
The casing (20) is provided with an opening (24) that penetrates the support portion (22) from the support surface (23) to a surface opposite to the support surface (23), and is exposed from the opening (24). The one end face (11) of the electronic component (10) to be connected and the casing (20) are connected by a bonding wire (50) formed by wire bonding through the opening (24). The surface to be wire-bonded in 10) and the surface on which the vibration isolator (40) is installed are the same as the one end surface (11) of the electronic component (10).

  The electronic device of the present invention can be appropriately manufactured by the method of manufacturing an electronic device according to claim 1 and, like the above, there is no escape of the wire bonding load, and a device for supporting the wire bonding by nesting or the like is devised. As unnecessary, peeling of the vibration isolating member (40) can be suppressed.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a figure which shows the electronic device which concerns on 1st Embodiment of this invention, (a) is a schematic plan view, (b) is AA schematic sectional drawing in (a). FIG. 6 is a process drawing illustrating the method for manufacturing the electronic device of the first embodiment. It is a schematic plan view which shows the electronic device which concerns on 2nd Embodiment of this invention. It is a schematic plan view which shows the electronic device as another example of the said 2nd Embodiment. It is a schematic plan view which shows the electronic device which concerns on 3rd Embodiment of this invention. It is a schematic plan view which shows the electronic device as another example of the said 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
1A and 1B are diagrams showing an electronic device according to a first embodiment of the present invention, in which FIG. 1A is a schematic plan view, and FIG. 1B is a schematic cross-sectional view along a one-dot chain line AA in FIG. FIG. In FIG. 1, (a) corresponds to a top view of (b).

  The electronic device according to the present embodiment mainly includes an electronic component 10, a casing 20 that houses the electronic component 10, a vibration isolating member 40 that attenuates relative vibration between the electronic component 10 and the casing 20, and an electronic device. A bonding wire 50 that electrically connects the component 10 and the casing 20 is provided.

  The electronic component 10 is a variety of sensor chips such as an acceleration sensor, an angular velocity sensor, a pressure sensor, and a flow sensor, or a semiconductor chip such as a circuit chip. Specifically, as the electronic component 10, a sensor chip and a signal processing chip as described in Patent Document 1 may be laminated, or a sensor chip alone may be used.

  The electronic component 10 has a plate shape, here, a rectangular plate shape, and has an end surface 11 and an end surface 12 as rectangular plate surfaces at both ends in the thickness direction. Here, the upper end surface 11 in FIG. 1B is one end surface 11, and the lower end surface 12 in FIG. 1B opposite to the one end surface 11 is the other end surface 12.

  A pad (not shown) to be wire-bonded is provided on one end surface 11 of the electronic component 10. That is, the one end surface 11 of the electronic component 10 is a surface to be wire bonded. When the electronic component 10 is, for example, a laminated body of sensor chips and circuit chips, for example, one end surface is a sensor chip surface and the other end surface is a circuit chip surface.

  The casing 20 is made of a resin molded by a mold or the like, and includes a casing body 21 and a support portion 22. Here, the casing main body 21 is formed in a rectangular tube shape having a hollow portion in which one end side and the other end side are opened and the electronic component 10 is inserted therein.

  Here, the one end surface 11 of the electronic component 10 is located on one end side of the casing body 21, and the other end surface 12 of the electronic component 10 is located on the other end side of the casing body 21. The casing body 21 has a rectangular tube shape surrounding the outside of the electronic component 10.

  Here, in FIG. 1, the casing body 21 has a rectangular tube shape with a rectangular cross section orthogonal to the axis, and a direction parallel to one of the two adjacent sides orthogonal to each other in the rectangular cross section is the X direction. The direction parallel to the other side is the Y direction, and the direction orthogonal to the X direction and the Y direction, that is, the axial direction of the casing body 21 is the Z direction.

  The support portion 22 supports the electronic component 10 and is provided on one end side of the casing body 21. The support portion 22 is provided in the casing 20 as a portion facing the one end face 11 of the electronic component 10 in the casing 20, and the support portion 22 and the casing body 21 are integrally formed.

  The support portion 22 protrudes inward from the casing body 21 and is provided so as to cover a part of the one end surface 11 of the electronic component 10. A surface of the support 22 that faces the one end surface 11 of the electronic component 10 is configured as a support surface 23. Here, the X direction and the Y direction are directions parallel to the support surface 23, and the Z direction is a direction orthogonal to the support surface 23.

  In the case of this embodiment, as shown in FIG. 1, the support portion 22 protrudes inward from each corner portion of the rectangular rectangular tubular casing body 21. An opening 24 is formed between the casing body 21 and the support portion 22. The opening 24 penetrates the support portion 22 in the Z direction from the support surface 23 side to the surface opposite to the support surface 23.

  Here, as shown in FIG. 1, the opening 24 includes an X-direction opening 241 extending in the X direction parallel to the support surface 23, and a Y direction extending in the Y direction orthogonal to the X direction and parallel to the support surface 23. The X-direction opening 241 and the Y-direction opening 242 intersect with each other to form a cross-shaped opening shape. Then, four corner portions 25 are formed in the support portion 22 by the intersection portion 243 of the opening portion 24 which is a portion where the X-direction opening portion 241 and the Y-direction opening portion 242 intersect.

  Thus, in the electronic component 10, the one end surface 11 of the electronic component 10 is exposed from the opening 24 on the one end side of the casing body 21, and the other end surface 12 of the electronic component 10 is the opening on the other end side of the casing body 21. The part 26 is exposed.

  As shown in FIG. 1, the vibration isolation member 40 is provided between the one end surface 11 of the electronic component 10 and the support surface 23 of the casing 20. The vibration isolator 40 connects, i.e., bonds, the casing 20 and the electronic component 10. Thereby, the electronic component 10 is held by the vibration isolation member 40 on the support portion 22 of the casing 20.

  Here, the four corners 25 of the support 22 located at the intersection 243 of the opening 24 where the X-direction opening 241 and the Y-direction opening 242 intersect, that is, at the intersection 243 of the cross-shaped opening 24. The vibration isolator 40 is provided corresponding to all of the above.

  Specifically, as shown in FIG. 1A, the support portion 22 is a side that forms the X-direction opening 241 around the intersection 243 of the cross-shaped opening 24 with the corner 25 interposed therebetween. And four sides where the sides forming the Y-direction opening 242 are adjacent to each other. And the vibration isolator 40 is arrange | positioned in all the four area | regions in this support part 22. As shown in FIG.

  The vibration isolator 40 can be applied to a general one or an electronic device of this type, and is formed of a flexible elastomer such as silicone rubber or silicone RTV rubber. And the relative vibration between the electronic component 10 and the casing 20 is attenuate | damped by making the resonance frequency of the vibration isolator 40 into a desired value.

  The casing 20 includes a lead frame 30 for electrically connecting the electronic component 10 and the outside. Here, the lead frame 30 is insert-molded in the casing 20. The casing 20 has a pad 31 that is electrically connected to the lead frame 30.

  Although not shown in FIG. 1A, the pad 31 is provided on one end side of the casing body 21, as shown in FIG. 1B. Here, a groove 27 for pad placement is provided on one end side of the casing body 21, and the pad 31 is exposed on the bottom surface of the groove 27 for pad placement.

  The pad 31 is made of aluminum, copper, or the like, and is electrically connected to a lead frame 30 (not shown) inside the casing body 21. The pad 31 may be a part of the lead frame 30 exposed in the pad placement groove 27.

  The bonding wire 50 connects the electronic component 10 and the pad 31 of the casing 20. Thereby, the electronic component 10 and the lead frame 30 of the casing 20 are electrically connected by the bonding wire 50.

  Here, the one end surface 11 of the electronic component 10 exposed from the opening 24 of the casing 20 and the pad 31 of the casing 20 are connected by the bonding wire 50 through the opening 24. The bonding wire 50 is formed by wire bonding, for example, by ball bonding or wedge bonding using a general wire such as gold or aluminum.

  As described above, in the present embodiment, as shown in FIG. 1, the opening 24 has a cross-shaped opening shape in which the X-direction opening 241 and the Y-direction opening 242 intersect. Of these openings 24, the X-direction openings 241 are exposed from the four places in all four places including the positions on both ends in the X direction and the positions on both ends in the Y direction of the Y-direction openings 242. Wire bonding is performed on one end surface 11 of the electronic component 10 to be formed, and a bonding wire 50 is formed.

  Such an electronic device is applied, for example, as an electronic device of an automobile ECU. In this case, although not shown in the drawing, a lid is attached to the opening 26 on the other end side of the casing main body 21 to shield the electronic component 10 from the outside. Electrical connection with the outside is performed at the lead frame 30 portion.

  Next, a method for manufacturing the electronic device of this embodiment will be described with reference to FIG. FIG. 2 is a process diagram showing the manufacturing method, and shows a work in each process in a cross section corresponding to FIG. 1B.

  First, as the casing 20, a casing 20 having a support portion 22 having a support surface 23 and an opening 24, and further including the lead frame 30 and the pad 31 is prepared. On the other hand, an electronic component 10 is prepared, and a support jig 1 that supports the electronic component 10 is prepared. The material of the support jig 1 is not particularly limited, but one surface (the upper surface in FIG. 2) is a support surface on which the electronic component 10 and the casing 20 are mounted and supported.

  As shown in FIG. 2A, the electronic component 10 is placed on the support jig 1 with the other end surface 12 opposite to the one end surface 11 of the electronic component 10 facing the support jig 1. Mount. Here, as in the case of general wire bonding, the electronic component 10 is fixed to the support jig 1 by, for example, an adsorption force.

  Then, as shown in FIG. 2B, the vibration isolation member 40 is mounted on the one end surface 11 of the electronic component 10 with the electronic component 10 supported by the support jig 1. Typically, the vibration-proof member 40 in an elastomer state is applied to the one end surface 11 of the electronic component 10 in a liquid or semi-solid state before curing. At this time, the vibration isolation member 40 is provided at a position corresponding to the four corner portions 25 of the support portion 22 in the one end surface 11 of the electronic component 10.

  Next, as illustrated in FIG. 2C, the casing 20 is attached to the electronic component 10 with the one end surface 11 of the electronic component 10 and the support surface 23 facing each other with the vibration isolating member 40 interposed therebetween. At this time, the casing 20 is also brought into contact with the support surface of the support jig 1 to support the casing 20 on the support jig 1. In this state, the vibration isolation member 40 is cured, and the electronic component 10 and the casing 20 are connected and fixed by the vibration isolation member 40.

  At this time, when the other end surface 12 of the electronic component 10 exposed at the opening 26 on the other end side of the casing body 21 and the other end of the casing body 21 are located on the same plane, the support jig 1 The supporting surface that contacts and supports the electronic component 10 and the casing 20 is a flat surface.

  The other end surface 12 of the electronic component 10 exposed at the opening 26 on the other end side of the casing body 21 and the other end of the casing body 21 are not located on the same plane, and either one is more than the other. There may be a step between the two by protruding. In this case, if the support surface of the support jig 1 is an uneven surface corresponding to the step, the other end surface 12 of the electronic component 10 and the other end of the casing body 21 are both in contact with the support jig 1. Making it easier.

  Subsequently, as shown in FIG. 2 (d), the electronic component 10 and the casing 20 are supported by the support jig 1, and wire bonding is performed through the opening 24 to expose the opening 24. The one end surface 11 of the electronic component 10 and the casing 20 are connected by a bonding wire 50.

  In this wire bonding, a pad (not shown) on one end surface 11 of the electronic component 10 and a pad 31 of the casing 20 are connected to each other. Wire bonding is performed at all positions on both ends in the Y direction of the direction opening 242.

  After the wire bonding is completed in this way, the electronic device according to the present embodiment is completed by attaching a cover (not shown) or cutting / molding the lead frame 30 as necessary.

  By the way, according to the present embodiment, in the electronic component 10, the surface to be wire-bonded and the surface on which the vibration isolation member 40 is installed are the same as the one end surface 11 of the electronic component 10.

  Thereby, at the time of wire bonding, both the electronic component 10 and the casing 20 can be supported by the support jig 1 on the side opposite to the wire bonding side and the installation side of the vibration isolation member 40. Therefore, the electronic component 10 can be supported by the support jig 1 having a general structure regardless of the height variation of the casing 20 and without using a nest.

  Even when a wire bonding load is applied to the one end surface 11 of the electronic component 10 at the time of wire bonding, the other end surface 12 side of the electronic component 10 is supported in contact with the support jig 1. Is reliably transmitted to the electronic component 10 and does not escape.

  Therefore, according to the present embodiment, it is possible to eliminate the escape of the wire bonding load at the time of wire bonding, and to eliminate the need to devise a support jig by nesting or the like without being affected by the height variation of the casing 20. Separation between the casing 10 and the vibration isolation member 40 can be suppressed.

  Further, according to the electronic device and the manufacturing method of the present embodiment, the vibration isolation member 40 is provided corresponding to all the four corner portions 25 of the support portion 22 located at the intersection portion 243 of the opening portion 24. ing. For example, in the present embodiment, the vibration isolation member 40 may be provided corresponding to one, two, or three of the four corner portions 25.

  However, in the case of the cross-shaped opening 24 as described above, if the vibration isolation members 40 are provided corresponding to all the four corners 25 of the support portion 22 located at the intersection 243, one to three pieces are provided. Compared with the case where the vibration isolation member 40 is provided corresponding to only the corner portion 25, the number of support points is increased, and the electronic component 10 can be sufficiently supported by the vibration isolation member 40.

(Second Embodiment)
FIG. 3 is a schematic plan view showing an electronic apparatus according to the second embodiment of the present invention. This embodiment differs from the first embodiment in the position where wire bonding is performed, and here, the difference will be mainly described.

  In the first embodiment, wire bonding is performed at all the positions on both ends in the X direction of the X direction opening 241 and on both ends in the Y direction of the Y direction opening 242.

  On the other hand, in the present embodiment, among the openings 24 having a cross-shaped opening shape, the positions on both ends in the X direction of the X direction opening 241 and the positions on both ends in the Y direction of the Y direction opening 242 are. Wire bonding is performed only at the locations on either side of either of them.

  As described above, in which part of the opening 24 the wire bonding is performed depends on the arrangement form of the part where the wire bonding is required on the one end surface 11 of the electronic component 10, and is appropriately determined depending on the arrangement form. It is what

  In the example shown in FIG. 3, the X direction opening 241 has only two locations on both ends in the X direction, that is, only two locations on one end side and the other end side in the X direction of the X direction opening 241. Thus, a bonding wire 50 is formed.

  Note that, depending on the arrangement form of the portions required for wire bonding, in contrast to the example of FIG. 3, only the positions on both ends in the Y direction of the Y direction opening 242, that is, one end in the Y direction of the Y direction opening 242. The bonding wire 50 may be formed at only two locations, i.e., the location on the other end side.

  As another example of the second embodiment, among the openings 24 having a cross-shaped opening, the X-side openings 241 are located at both ends in the X direction and the Y-direction openings 242 in the Y direction. Wire bonding may be performed at only one of the four locations on both ends.

  FIG. 4 is a schematic plan view showing an electronic apparatus as another example of the second embodiment. Here, the bonding wire 50 is formed only at one position on one end side in the X direction of the X-direction opening 241 in the cross-shaped opening 24.

  Here, although not shown, when wire bonding is performed only at the one position, the bonding wire 50 may be formed only at one position on one end side in the Y direction of the Y-direction opening 242. Of course.

  In the present embodiment, the bonding wire is provided only at either one of the positions on both ends in the X direction of the X direction opening 241 and the positions on both ends in the Y direction of the Y direction opening 242. By forming 50, two wire bonding locations were formed.

  On the other hand, as another example having two wire bonding locations, only one of the locations on both ends of the X-direction opening 241 and the locations on both ends of the Y-direction opening 242 Of these, wire bonding may be performed only at one location.

(Third embodiment)
FIG. 5 is a schematic plan view showing an electronic device according to the third embodiment of the present invention. The present embodiment is different from the first embodiment in the shape of the support portion 22, and here, the difference will be mainly described.

  In the said 1st Embodiment, the support part 22 was made into the support part 22 which has the cross-shaped opening part 24 by projecting inward from the perimeter of the casing main body 21. As shown in FIG. On the other hand, in the case of FIG. 5, the support portion 22 has a shape bridged between two opposing sides of the rectangular rectangular cylindrical casing body 21, here, two sides facing each other in the X direction. The part located in the center between the sides forms a shape wider than the peripheral part.

  And the vibration isolator 40 is arrange | positioned in the wide part in this support part 22. As shown in FIG. Here, one vibration isolating member 40 is provided. In addition, openings 24 are formed on both sides in the Y direction across the bridging support 22, and bonding wires 50 are formed through the openings 24.

  FIG. 6 is a schematic plan view showing an electronic apparatus as another example of the third embodiment. In the example shown in FIG. 5, the number of vibration isolating members 40 is one. However, as shown in FIG. 6, the number of vibration isolating members 40 may be two. Moreover, although not shown in figure, also in this embodiment, the vibration isolator 40 may be three or more.

(Other embodiments)
In addition to the semiconductor chip such as the sensor chip described above, the electronic component 10 has one end surface 11 supported by the support portion 22 of the casing 20 via the vibration isolation member 40 and the same end surface 11. As long as wire bonding is performed, various electronic components can be applied. For example, the chip may be molded with a resin, or the chip may be packaged in a housing.

  The casing 20 may be any one that is wire-bonded to the electronic component 10 and includes the support portion 22 and the opening 24 as described above, and the lead frame 30 as described above is insert-molded. Other than those made of resin, for example, a box-like one made entirely of metal, or a ceramic molded body provided with a lead frame may be used.

  Further, the opening 24 of the casing 20 can be wire-bonded to the one end surface 11 of the electronic component 10 through the opening 24 and the area of the support portion 23 for supporting the electronic component 10 is large. As long as it can be secured, the opening shape is not limited to the cross shape shown in FIG. 1 and the like, and the shapes shown in FIGS. Are possible. Needless to say, the support portion 22 can have various shapes depending on the shape of the opening 24.

DESCRIPTION OF SYMBOLS 1 Support jig 10 Electronic component 11 One end surface of electronic component 12 Other end surface of electronic component 20 Casing 22 Support part of casing 23 Support surface of casing 24 Opening part of casing 25 Corner part of support part 40 Anti-vibration member 50 Bonding wire 241 X direction opening 242 Y direction opening 243 Intersection of opening

Claims (6)

An electronic component (10);
The electronic component (10) has a support portion (22) that supports the electronic component (10) on the side facing the one end surface (11), and the electronic component (10) in the support portion (22) A casing (20) having a support surface (23) formed on one end surface (11) side;
Relative vibration between the electronic component (10) and the casing (20) provided between the one end surface (11) of the electronic component (10) and the support surface (23). In the manufacturing method of an electronic device provided with the vibration isolating member (40) which attenuates
The casing (20) has the support part (22) and an opening part (24) penetrating the support part (22) from the support surface (23) to a surface opposite to the support surface (23). Prepare what is equipped with,
A support jig (1) for supporting the electronic component (10) is prepared, and the other end surface (12) of the electronic component (10) opposite to the one end surface (11) is disposed on the support jig (1). With the electronic component (10) mounted on the support jig (1)
Next, in a state where the electronic component (10) is supported by the support jig (1), the vibration isolation member (40) is mounted on the one end surface (11) of the electronic component (10),
Next, the casing (20) is moved to the electronic component in a state where the one end surface (11) of the electronic component (10) and the support surface (23) face each other through the vibration isolating member (40). (10) and the casing (20) is also brought into contact with the support jig (1) to support the casing (20) on the support jig (1),
Subsequently, in a state where the electronic component (10) and the casing (20) are supported by the support jig (1), wire bonding is performed through the opening (24), whereby the opening (24 A method of manufacturing an electronic device, comprising: connecting the one end face (11) of the electronic component (10) exposed from the casing (20) and the casing (20) with a bonding wire (50). An X direction opening (241) extending in the X direction parallel to the support surface (23) and an Y direction extending in the Y direction perpendicular to the X direction and parallel to the support surface (23). A cross-shaped opening that intersects the opening (242) shall be formed,
The wire bonding is performed at all positions on both ends in the X direction of the X direction opening (241) and on both ends in the Y direction of the Y direction opening (242). The method for manufacturing an electronic device according to claim 1. An X direction opening (241) extending in the X direction parallel to the support surface (23) and an Y direction extending in the Y direction perpendicular to the X direction and parallel to the support surface (23). A cross-shaped opening that intersects the opening (242) shall be formed,
Of the X-direction opening (241) at both ends in the X-direction and the Y-direction opening (242) at both ends in the Y-direction, only at both ends. The method for manufacturing an electronic device according to claim 1, wherein wire bonding is performed. An X direction opening (241) extending in the X direction parallel to the support surface (23) and an Y direction extending in the Y direction perpendicular to the X direction and parallel to the support surface (23). A cross-shaped opening that intersects the opening (242) shall be formed,
The wire at only one of a total of four locations including the X-direction opening (241) at both ends in the X-direction and the Y-direction opening (242) at both ends in the Y-direction. The method for manufacturing an electronic device according to claim 1, wherein bonding is performed.   Four corners (25) of the support (22) located at the intersection (243) of the opening (24) where the X-direction opening (241) and the Y-direction opening (242) intersect. 5) The method for manufacturing an electronic device according to any one of claims 2 to 4, wherein the vibration isolating member (40) is provided corresponding to all of the above. An electronic component (10);
The electronic component (10) has a support portion (22) that supports the electronic component (10) on the side facing the one end surface (11), and the electronic component (10) in the support portion (22) A casing (20) having a support surface (23) formed on one end surface (11) side;
Relative vibration between the electronic component (10) and the casing (20) provided between the one end surface (11) of the electronic component (10) and the support surface (23). An electronic device comprising a vibration isolating member (40) for damping
The casing (20) includes an opening (24) penetrating the support portion (22) from the support surface (23) to a surface opposite to the support surface (23),
A bonding wire formed by wire bonding between the one end surface (11) of the electronic component (10) exposed from the opening (24) and the casing (20) through the opening (24). (50),
The wire-bonded surface of the electronic component (10) and the surface on which the vibration isolator (40) is installed are the same surface as the one end surface (11) of the electronic component (10). An electronic device characterized by the above.

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