JP5321064B2 - Base member cleaning method and base member cleaning device - Google Patents

Base member cleaning method and base member cleaning device Download PDF

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JP5321064B2
JP5321064B2 JP2008551143A JP2008551143A JP5321064B2 JP 5321064 B2 JP5321064 B2 JP 5321064B2 JP 2008551143 A JP2008551143 A JP 2008551143A JP 2008551143 A JP2008551143 A JP 2008551143A JP 5321064 B2 JP5321064 B2 JP 5321064B2
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base member
nozzle
cleaning
supply hole
pressure fluid
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JPWO2008078793A1 (en
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直樹 杉尾
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Proterial Ltd
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Hitachi Metals Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B7/00Moulds; Cores; Mandrels
    • B28B7/38Treating surfaces of moulds, cores, or mandrels to prevent sticking
    • B28B7/386Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/024Cleaning by means of spray elements moving over the surface to be cleaned
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/20Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
    • B28B3/26Extrusion dies

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Cleaning In General (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Description

本発明は、セラミックハニカム構造体を押出し成形するために用いる口金部材の洗浄方法及び口金部材の洗浄装置に関する。   The present invention relates to a base member cleaning method and a base member cleaning apparatus used for extruding a ceramic honeycomb structure.

自動車のエンジン等から排出される排気ガスを浄化するために用いられるセラミックハニカム構造体は、セラミック粉末、造孔材、バインダー等の成形助剤、水等からなる可塑性のセラミック坏土を、図4(a)〜図4(c)に示すようなセラミックハニカム構造体成形用口金部材50を用いて押出し成形し、乾燥及び焼成して製造される。前記押出し成形において、セラミック坏土は坏土供給孔51より成形用口金部材50内に導入され、成形溝52から成形されたハニカム構造体として排出される。   A ceramic honeycomb structure used for purifying exhaust gas discharged from an automobile engine is a plastic ceramic clay made of ceramic powder, a pore former, a forming aid such as a binder, water, etc. A ceramic honeycomb structure forming die member 50 as shown in FIGS. 4 (a) to 4 (c) is extruded, dried and fired. In the extrusion molding, the ceramic clay is introduced into the molding die member 50 from the clay supply hole 51 and discharged from the molding groove 52 as a honeycomb structure.

前記口金部材の成形溝は非常に幅が狭いため、ハニカム構造体の押出し成形を繰り返し行うと、口金部材成形溝にセラミック坏土中の異物や高硬度の不均一部分が詰まってくる。このような異物等が蓄積した口金部材を用いて成形すると、ハニカム構造体の品質が劣化するので、定期的に口金部材を洗浄する必要がある。この口金部材の洗浄を行う際には、異物や高硬度の不均一部分と共に坏土供給孔や成形溝に詰まっているセラミック坏土を除去する必要がある。このため高圧水を坏土供給孔側からのみ噴射させて洗浄を行う方法、又は成形溝側からのみ噴射させて洗浄を行う方法が従来から行われている。   Since the forming groove of the die member is very narrow, when the extrusion molding of the honeycomb structure is repeatedly performed, the die member forming groove is clogged with foreign matters in the ceramic clay and uneven portions with high hardness. If molding is performed using a die member in which such foreign substances or the like are accumulated, the quality of the honeycomb structure is deteriorated, and thus the die member needs to be periodically cleaned. When cleaning the die member, it is necessary to remove the ceramic clay clogged in the clay supply holes and the forming grooves together with the foreign matters and the high hardness non-uniform portions. For this reason, a method of cleaning by jetting high-pressure water only from the clay supply hole side or a method of cleaning by jetting only from the molding groove side has been conventionally performed.

しかしながら、セラミック坏土は有機系バインダーを含有しているため、坏土供給孔側からのみ、又は成形溝側からのみ高圧水を噴射する方法では十分な洗浄が困難であった。つまり坏土供給孔側から高圧水を噴射させて洗浄を行った場合、成形溝内に詰まったセラミック坏土を完全に除去することができない。一方、成形溝側から高圧水を噴射させて洗浄を行った場合、口金部材の細かな成形溝の変形や破損などの不具合が生じないように高圧水の圧力を低下させて洗浄する必要があり、充分な洗浄ができなかったり、洗浄に多大な時間を要したりした。   However, since the ceramic clay contains an organic binder, it is difficult to perform sufficient cleaning by a method in which high-pressure water is injected only from the clay supply hole side or from the molding groove side. That is, when cleaning is performed by jetting high-pressure water from the clay supply hole side, the ceramic clay clogged in the forming groove cannot be completely removed. On the other hand, when cleaning is performed by injecting high-pressure water from the side of the molding groove, it is necessary to reduce the pressure of the high-pressure water for cleaning so as not to cause defects such as deformation or breakage of the fine molding groove of the cap member. Therefore, sufficient cleaning could not be performed, and much time was required for cleaning.

特開2003-285014号は、成形材料が付着した口金部材を200〜500℃に加熱することにより成形材料に含まれる有機バインダーを除去した後、40 kg/cm2以下の圧力で流体を口金部材に吹き付けることにより成形材料を除去する口金部材の洗浄方法を開示している。しかしながら、特開2003-285014号に記載の洗浄方法では、200〜500℃に加熱したときに口金部材が変形して、所望の成形溝幅が得られなくなるという問題がある。特に外径が200 mm以上の大型の成形体を成形するための口金部材の場合はこの影響が大きい。Japanese Patent Laid-Open No. 2003-285014 discloses a method in which a die member to which a molding material is adhered is heated to 200 to 500 ° C. to remove an organic binder contained in the molding material, and then a fluid is applied to the die member at a pressure of 40 kg / cm 2 or less. Discloses a method of cleaning a die member by removing the molding material by spraying on the nozzle. However, the cleaning method described in Japanese Patent Application Laid-Open No. 2003-285014 has a problem in that the die member is deformed when heated to 200 to 500 ° C. and a desired forming groove width cannot be obtained. This effect is particularly significant in the case of a base member for forming a large molded body having an outer diameter of 200 mm or more.

従って本発明の目的は、口金部材に付着したバインダーを含む成形材料を、口金部材を破損や変形させることなく高効率で除去することができる口金部材の洗浄方法と洗浄装置を提供することにある。   Accordingly, an object of the present invention is to provide a base member cleaning method and a cleaning device capable of removing a molding material containing a binder adhered to a base member with high efficiency without damaging or deforming the base member. .

上記目的に鑑み鋭意研究の結果、本発明者等は、口金部材の坏土供給孔側及び成形溝側の両面から高圧流体を吹き付けて高圧洗浄することにより、口金部材を破損や変形させることなく高効率でバインダーを含む成形材料を除去できることを見出し、本発明に想到した。   As a result of diligent research in view of the above object, the present inventors have sprayed high pressure fluid from both sides of the base material supply hole side and the molding groove side of the base member to perform high pressure cleaning without damaging or deforming the base member. The inventors have found that a molding material containing a binder can be removed with high efficiency, and have arrived at the present invention.

すなわち、本発明の口金部材の洗浄方法は、成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインターを含有するセラミック坏土を除去する口金部材の洗浄方法であって、前記成形溝の幅が0.1〜0.5 mm、溝ピッチが1.0〜1.8 mm、前記供給孔の径が1〜2 mmであり、前記口金部材の供給孔側の面にほぼ垂直に高圧流体を8〜20 MPaの圧力で吹き付けた後に、前記口金部材の成形溝側の面にほぼ垂直に高圧流体を1〜5 MPaの圧力で吹き付けることを特徴とする。
That is, in the method for cleaning a base member of the present invention, after the base member having a forming groove and a ceramic clay supply hole communicating with the forming groove is used for forming a ceramic clay containing a binder, the base member A method of cleaning a base member that removes the ceramic clay containing the binder attached to the groove , wherein the width of the forming groove is 0.1 to 0.5 mm, the groove pitch is 1.0 to 1.8 mm, and the diameter of the supply hole is 1 to After the high pressure fluid is sprayed at a pressure of 8 to 20 MPa substantially perpendicularly to the surface on the supply hole side of the base member, the high pressure fluid is approximately 1 to approximately perpendicular to the surface on the molding groove side of the base member. It is characterized by spraying at a pressure of 5 MPa.

前記成形溝に高圧流体を吹き付けた後、更に前記供給孔に高圧流体を吹き付けるのが好ましい。   After the high pressure fluid is sprayed on the forming groove, it is preferable that the high pressure fluid is further sprayed on the supply hole.

本発明の口金部材の洗浄装置は、成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインダーを含有するセラミック坏土を除去する口金部材の洗浄装置であって、口金部材保持機構、高圧流体用ノズル、エアブロー用ノズル前記ノズルの移動機構前記高圧流体用ノズルが口金部材に対して相対的に移動しつつ高圧流体を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けてセラミック坏土を除去する機構、及び前記エアブロー用ノズルが口金部材に対して相対的に移動しつつ高圧空気を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けて流体を除去する機構を備え、前記口金部材保持機構が反転することを特徴とする。
Cleaning apparatus of the mouthpiece member of the present invention, a die member having a moldable-ceramic-material-supplying holes communicating to the forming groove and forming groove, after used for molding the moldable ceramic material containing a binder, adhering to the die member A base member cleaning apparatus for removing the ceramic clay containing the binder, wherein the base member holding mechanism, the high pressure fluid nozzle, the air blowing nozzle , the nozzle moving mechanism , and the high pressure fluid nozzle are used as the base member. A mechanism for removing the ceramic clay by blowing a high-pressure fluid substantially perpendicularly to the surface on the supply hole side or the surface on the molding groove side of the base member while moving relatively to the base member, and the air blow nozzle to the base member a mechanism for removing the fluid is blown substantially perpendicularly to the high-pressure air to the surface or forming the groove-side surface of the supply hole side of the die member relatively moved while for the mouthpiece Holding mechanism is characterized in that the inversion.

前記ノズルの移動機構は、サーボモータ、ボールネジ又はLMガイドによる機構であるのが好ましい。   The nozzle moving mechanism is preferably a mechanism using a servo motor, a ball screw or an LM guide.

前記口金部材と前記口金部材保持機構とはブース内に配置され、前記ノズルの移動機構はブース外に配置され、前記ブース内と前記ノズルの移動機構とは可撓性シートで分離されているのが好ましい。
The base member and the base member holding mechanism are arranged in a booth, the nozzle moving mechanism is arranged outside the booth, and the inside of the booth and the nozzle moving mechanism are separated by a flexible sheet. Is preferred.

本発明の洗浄方法及び洗浄装置により、口金部材に付着したバインダーを含む成形材料を、口金部材を破損や変形させずに高い効率で除去することができる。   By the cleaning method and the cleaning apparatus of the present invention, the molding material containing the binder attached to the base member can be removed with high efficiency without damaging or deforming the base member.

本発明の洗浄装置の一例を示す模式図である。It is a schematic diagram which shows an example of the washing | cleaning apparatus of this invention. 本発明の洗浄装置の口金保持機構の一例を示す模式図である。It is a schematic diagram which shows an example of the nozzle | cap | die holding | maintenance mechanism of the washing | cleaning apparatus of this invention. 本発明の洗浄装置のノズル移動機構の一例を示す模式図である。It is a schematic diagram which shows an example of the nozzle moving mechanism of the washing | cleaning apparatus of this invention. 本発明の洗浄方法に用いる口金部材の供給孔側を示す模式図である。It is a schematic diagram which shows the supply hole side of a nozzle | cap | die member used for the washing | cleaning method of this invention. 本発明の洗浄方法に用いる口金部材の成形溝側を示す模式図である。It is a schematic diagram which shows the shaping | molding groove side of the nozzle | cap | die member used for the washing | cleaning method of this invention. 本発明の洗浄方法に用いる口金部材を、供給孔の軸方向に平行に示す模式断面図である。It is a schematic cross section which shows the nozzle | cap | die member used for the washing | cleaning method of this invention in parallel to the axial direction of a supply hole.

[1] 口金部材の洗浄方法
本発明の口金部材の洗浄方法は、成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインターを含有するセラミック坏土を除去する口金部材の洗浄方法であって、前記成形溝の幅が0.1〜0.5 mm、溝ピッチが1.0〜1.8 mm、前記供給孔の径が1〜2 mmであり、前記口金部材の供給孔側の面にほぼ垂直に高圧流体を8〜20 MPaの圧力で吹き付けた後に、前記口金部材の成形溝側の面にほぼ垂直に高圧流体を1〜5 MPaの圧力で吹き付けることを特徴とする。
[1] Method of cleaning a base member The base member cleaning method of the present invention uses a base member having a molding groove and a ceramic clay supply hole communicating with the molding groove for molding a ceramic clay containing a binder. A method for cleaning a base member that removes the ceramic clay containing the binder attached to the base member after the forming groove has a width of 0.1 to 0.5 mm, a groove pitch of 1.0 to 1.8 mm, and the supply The diameter of the hole is 1 to 2 mm, and after spraying high-pressure fluid at a pressure of 8 to 20 MPa almost perpendicularly to the surface on the supply hole side of the base member, the surface is almost perpendicular to the surface on the molding groove side A high pressure fluid is sprayed at a pressure of 1 to 5 MPa.

口金部材は、図4(a)〜図4(c)に示すように、多数の細かな成形溝を有し、この成形溝に連通した坏土供給孔を有している。成形溝は多数の細かな溝からなるため、高圧の流体が吹き付けられると変形することがある。一方、供給孔は成形溝の間隔に比べ広い間隔で形成されているので、成形溝側よりも強度が高い。そのため、先に供給孔側に高圧流体を吹き付けて口金部材に付着した大部分のセラミック坏土を除去することで、成形溝側の洗浄が容易になり成形溝の変形を防止することができる。   As shown in FIGS. 4 (a) to 4 (c), the base member has a large number of fine forming grooves, and has a clay supply hole communicating with the forming grooves. Since the forming groove is composed of a large number of fine grooves, it may be deformed when a high-pressure fluid is sprayed. On the other hand, since the supply holes are formed at a wider interval than the interval between the molding grooves, the strength is higher than that at the molding groove side. Therefore, by removing a large portion of the ceramic clay adhering to the base member by spraying the high-pressure fluid on the supply hole side first, the molding groove side can be easily cleaned and deformation of the molding groove can be prevented.

口金部材の供給孔は、図3に示すように、成形溝と比べて開口部が大きいため、成形溝に吹き付ける圧力よりも高い圧力で高圧流体を吹き付けることで、供給孔内に詰まったセラミック坏土を容易に洗浄することができる。また先に供給孔側に高圧流体を吹き付けて洗浄することで、口金部材に付着した大部分のセラミック坏土を除去することができ、比較的低い圧力の流体で成形溝側の洗浄が可能になるため成形溝の変形を防止することができる。   As shown in FIG. 3, the supply hole of the base member has a large opening compared to the molding groove, so that high pressure fluid is blown at a pressure higher than the pressure blown into the molding groove, so that the ceramic The soil can be washed easily. Also, by washing the supply hole side with high-pressure fluid first, most of the ceramic clay adhering to the base member can be removed, and the molding groove side can be cleaned with a relatively low pressure fluid. Therefore, deformation of the forming groove can be prevented.

供給孔側からの洗浄及び成形溝からの洗浄を行った後でも、場合によってはセラミック坏土が成形溝内又は供給孔内に残留している場合があるため、更に供給孔に高圧流体を吹き付けることで、口金部材を確実に洗浄することができる。更にその後に、再度成形溝側の面の洗浄を行っても良い。   Even after cleaning from the supply hole side and cleaning from the forming groove, ceramic clay may remain in the forming groove or in the supply hole in some cases. Thus, the base member can be reliably cleaned. Further thereafter, the surface on the molding groove side may be washed again.

供給孔側の面にほぼ垂直に吹き付ける高圧流体の圧力は8〜20 MPaとする。前記圧力が8〜20 MPaであると、口金部材を変形させることなく洗浄することができる。前記圧力が7 MPa未満の場合、口金部材に詰まった坏土の洗浄が不十分となり、前記圧力が20 MPaを超えると、口金部材が変形する場合がある。供給孔に吹き付ける高圧流体の圧力は8〜15 MPaであるのがより好ましい。
The pressure of the high-pressure fluid sprayed substantially perpendicular to the plane of the supply hole side and 8 to 20 MPa. When the pressure is 8 to 20 MPa, cleaning can be performed without deforming the base member. When the pressure is less than 7 MPa, the clay clogged in the base member is insufficiently washed, and when the pressure exceeds 20 MPa, the base member may be deformed. The pressure of the high-pressure fluid sprayed to the supply hole is more preferably 8 to 15 MPa.

成形溝側の面にほぼ垂直に吹き付ける高圧流体の圧力は1〜5 MPaとする。前記圧力が1〜5 MPaであると、口金部材を変形させることなく洗浄することができる。前記圧力が1 MPa未満の場合、口金部材に詰まった坏土の洗浄が不十分となり、前記圧力が5 MPaを超えると、口金部材が変形する場合がある。成形溝に吹き付ける高圧流体の圧力は2.5〜5 MPaであるのがより好ましい。
The pressure of the high-pressure fluid sprayed substantially perpendicular to the plane of the forming groove side is set to 1 to 5 MPa. When the pressure is 1 to 5 MPa, cleaning can be performed without deforming the base member. When the pressure is less than 1 MPa, the clay clogged in the base member becomes insufficiently washed, and when the pressure exceeds 5 MPa, the base member may be deformed. The pressure of the high-pressure fluid sprayed on the forming groove is more preferably 2.5 to 5 MPa.

成形溝の幅は0.1〜0.5 mmとする。成形溝の幅が0.1〜0.5 mmであると、高圧流体が成形溝内を流通する際に、成形溝に付着した坏土を確実に洗浄することができる。成形溝の幅が0.1 mm未満の場合、高圧流体が成形溝内を流通し難くなり、洗浄効率が低下する。一方、成形溝の幅が0.5 mmを超えると、成形溝と成形溝との間隔が狭くなるため口金部材の強度が低下して、高圧流体を吹き付けときに口金部材の変形が生じる場合がある。
The width of the molding groove and 0.1 to 0.5 mm. When the width of the molding groove is 0.1 to 0.5 mm, when the high-pressure fluid flows through the molding groove, the clay adhering to the molding groove can be reliably washed. When the width of the molding groove is less than 0.1 mm, it is difficult for the high-pressure fluid to flow through the molding groove, and the cleaning efficiency is lowered. On the other hand, if the width of the forming groove exceeds 0.5 mm, the distance between the forming groove and the forming groove is narrowed, so that the strength of the base member is lowered, and the base member may be deformed when spraying a high-pressure fluid.

供給孔の径は1〜2 mmとする。供給孔の径が1〜2 mmであると、高圧流体が供給孔内を流通する際に、成形溝に付着した坏土を確実に洗浄することができる。供給孔の径が1 mm未満の場合、高圧流体が供給孔内を流通し難くなり、洗浄効率が低下する。一方、供給孔の径が2 mmを超えると、供給孔の間隔が狭くなるため口金部材の強度が低下して、高圧流体を吹き付けたときに口金部材の変形が生じる場合がある。

Diameter of the feed holes is a 1 to 2 mm. When the diameter of the supply hole is 1 to 2 mm, when the high-pressure fluid flows through the supply hole, the clay adhering to the forming groove can be reliably washed. When the diameter of the supply hole is less than 1 mm, it is difficult for the high-pressure fluid to flow through the supply hole, and the cleaning efficiency decreases. On the other hand, when the diameter of the supply holes exceeds 2 mm, the distance between the supply holes is narrowed, so that the strength of the base member is lowered, and the base member may be deformed when the high-pressure fluid is sprayed.

[2] 口金部材の洗浄装置
本発明の口金部材の洗浄装置は、成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインダーを含有するセラミック坏土を除去する口金部材の洗浄装置であって、口金部材保持機構、高圧流体用ノズル、エアブロー用ノズル前記ノズルの移動機構前記高圧流体用ノズルが口金部材に対して相対的に移動しつつ高圧流体を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けてセラミック坏土を除去する機構、及び前記エアブロー用ノズルが口金部材に対して相対的に移動しつつ高圧空気を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けて流体を除去する機構を備え、前記口金部材保持機構が反転することを特徴とする
[2] the cleaning apparatus of the mouthpiece member of the cleaning apparatus invention of the base member, use a die member having a moldable-ceramic-material-supplying holes communicating to the forming groove and forming groove, the forming of the ceramic puddle containing a binder A base member cleaning device for removing the ceramic clay containing the binder attached to the base member, the base member holding mechanism, the high pressure fluid nozzle, the air blow nozzle , the nozzle moving mechanism , A mechanism for removing the ceramic clay by blowing the high-pressure fluid substantially perpendicularly to the surface on the supply hole side or the surface on the molding groove side of the base member while the high-pressure fluid nozzle moves relative to the base member; and While the air blowing nozzle moves relative to the base member, high pressure air is blown substantially perpendicularly to the surface on the supply hole side or the surface on the molding groove side of the base member to remove the fluid. Comprising a structure, the mouthpiece member holding mechanism is characterized in that the inverting

上記の機構を備えた洗浄装置により、口金部材の供給孔及び成形溝に高圧流体が確実に流入するので、付着した坏土を確実に洗浄することができる。   Since the high-pressure fluid surely flows into the supply hole and the molding groove of the base member by the cleaning device having the above-described mechanism, the adhered clay can be reliably cleaned.

口金部材保持機構は反転するものとする。口金部材保持機構が反転することで、供給孔に高圧流体を吹き付けた後、更に成形溝に高圧流体を吹き付ける場合に、口金部材を口金部材保持機構に保持し直す必要がなくなる。このため、一旦口金部材を口金部材保持機構にセットすると、供給孔への高圧流体の吹き付けと、成形溝への高圧流体の吹き付けとを連続的に効率よく行うことができる。
Die-member-holding mechanism shall be reversed. By reversing the cap member holding mechanism, it is not necessary to hold the cap member again on the cap member holding mechanism when the high pressure fluid is sprayed to the forming groove after the high pressure fluid is sprayed to the supply hole. For this reason, once the base member is set in the base member holding mechanism, the high-pressure fluid can be sprayed onto the supply hole and the high-pressure fluid onto the forming groove can be continuously and efficiently performed.

ノズルの移動機構がサーボモータ、ボールネジ又はLMガイドによる機構であるのが好ましい。ノズルの移動機構にサーボモータ、ボールネジ又はLMガイドを用いることで、ノズルの移動にむらが生じず、高圧流体を供給孔及び成形溝に精度よく吹き付けることができ、口金部材に付着した坏土を確実に洗浄することができる。   The moving mechanism of the nozzle is preferably a mechanism using a servo motor, a ball screw or an LM guide. By using a servo motor, ball screw, or LM guide for the nozzle movement mechanism, the movement of the nozzle is not uneven, and high-pressure fluid can be accurately sprayed onto the supply holes and molding grooves, and the clay adhering to the base member can be removed. It can be washed reliably.

口金部材と前記口金部材保持機構とはブース内に配置され、前記ノズルの移動機構がブース外に配置され、前記ブース内と前記ノズルの移動機構とは可撓性シートで分離されているのが好ましい。このような構成にすることで、高圧流体を口金部材に吹き付けた際に飛び散った流体及び坏土がノズルの移動機構に付着しなくなるため、故障等のトラブルの発生が防止できる。
The base member and the base member holding mechanism are arranged in a booth, the nozzle moving mechanism is arranged outside the booth, and the inside of the booth and the nozzle moving mechanism are separated by a flexible sheet. preferable. By adopting such a configuration, the fluid and clay scattered when the high-pressure fluid is sprayed on the base member do not adhere to the nozzle moving mechanism, so that troubles such as failure can be prevented.

洗浄に用いる流体は、水、水蒸気、アルコール等の有機溶媒、水/アルコール混合溶媒等を用いることができるが、水又は水蒸気が好ましい。   As the fluid used for washing, water, water vapor, an organic solvent such as alcohol, a water / alcohol mixed solvent, or the like can be used, but water or water vapor is preferable.

[3] セラミック坏土
セラミック原料としては、炭化珪素、窒化珪素、コージェライト、アルミナ、ムライト、窒化珪素、サイアロン、炭化珪素、窒化アルミニウム、ジルコニア、チタン酸アルミニウム等を用いることができる。本発明の洗浄方法は、これらのセラミック原料にメチルセルロース、ヒドロキシプロポキシルメチルセルロース等のバインダー及び水を含有するセラミック坏土を用いて押出し成形した後の口金部材に対して有効である。これらの有機バインダーを含有するセラミック坏土は、口金部材に強固に付着するため通常の方法では洗浄が困難である。セラミック坏土には必要に応じて、界面活性剤及びカーボン等の造孔剤を添加してもよい。
[3] Ceramic clay As the ceramic raw material, silicon carbide, silicon nitride, cordierite, alumina, mullite, silicon nitride, sialon, silicon carbide, aluminum nitride, zirconia, aluminum titanate and the like can be used. The cleaning method of the present invention is effective for a die member after extrusion using a ceramic clay containing a binder such as methyl cellulose and hydroxypropoxyl methyl cellulose and water in these ceramic raw materials. Since the ceramic clay containing these organic binders adheres firmly to the die member, it is difficult to clean by a normal method. If necessary, a pore-forming agent such as a surfactant and carbon may be added to the ceramic clay.

[4] 実施例
本発明を以下の実施例により更に詳細に説明するが、本発明はこれらに限定されるものではない。
[4] Examples The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.

参考例1
カオリン、タルク、シリカ、アルミナの粉末を調整して、50質量%のSiO2、35質量%のAl2O3及び15質量%のMgOを含むコーディエライト生成原料粉末を作製し、バインダーとしてメチルセルロース及びヒドロキシプロピルメチルセルロース、潤滑材、造孔剤としてグラファイトを添加し、乾式で十分混練した後、水を添加し、十分な混練を行って可塑化したセラミック坏土を作製した。この坏土を、図4(a)〜図4(b)に示すような成形溝の幅が0.3 mm、溝ピッチが1.5 mm、及び供給孔の径が1.5 mmの口金部材を用いて押出し成形し、セラミックハニカム構造の成形体を成形した。
Reference example 1
A cordierite-producing raw material powder containing 50% by mass of SiO 2 , 35% by mass of Al 2 O 3 and 15% by mass of MgO is prepared by preparing kaolin, talc, silica, and alumina powders, and methylcellulose as a binder Further, graphite was added as hydroxypropylmethylcellulose, a lubricant, and a pore-forming agent, and after kneading sufficiently with a dry method, water was added and sufficient kneading was performed to prepare a plasticized ceramic clay. Extrusion molding of this clay was performed using a die member with a groove width of 0.3 mm, a groove pitch of 1.5 mm, and a feed hole diameter of 1.5 mm as shown in FIGS. 4 (a) to 4 (b). Then, a formed article having a ceramic honeycomb structure was formed.

押出し成形に用いた口金部材を、図1に示すような口金部材洗浄装置1を用いて洗浄した。口金部材洗浄装置1は、ベース19と、ベース19に設置されたテーブル11と、テーブル11上に配置された口金部材50をセットするための口金部材セット治具13と、テーブル11を反転させるためのモータ12とから構成される口金部材保持機構10、台座29と、台座29に設置されたガイド24と、ガイド24に配置された高圧流体用ノズル21とエアブロー用ノズル22からなるノズル23と、ガイド24の上端と下端に取り付けられたモータ25,26とから構成されるノズル移動機構20、及び口金部材保持機構10を覆うブース31とから構成されている。ブース31のノズル23を挿入する部分には、ノズル23とブース31との間を接続するビニール製のカバー34が取り付けられており、洗浄流体及び洗浄した坏土がノズル移動機構20に付着するのを防止するとともに、ノズル23を移動可能にしている。口金部材50は、図2に示すように、テーブル11上に配置された口金部材セット治具13によって固定されている。ノズル23は、図3に示すように、モータ25により上下方向に,モータ26により左右方向に移動可能となっている。洗浄後の廃液は排水口33より排出される。   The base member used for extrusion molding was cleaned using a base member cleaning apparatus 1 as shown in FIG. The base member cleaning apparatus 1 includes a base 19, a table 11 installed on the base 19, a base member setting jig 13 for setting the base member 50 disposed on the table 11, and a table 11 A base member holding mechanism 10 composed of the motor 12, a pedestal 29, a guide 24 installed on the pedestal 29, a nozzle 23 composed of a high-pressure fluid nozzle 21 and an air blow nozzle 22 disposed on the guide 24, The guide 24 includes a nozzle moving mechanism 20 including motors 25 and 26 attached to the upper and lower ends of the guide 24, and a booth 31 covering the base member holding mechanism 10. The portion of the booth 31 where the nozzle 23 is inserted is attached with a vinyl cover 34 connecting the nozzle 23 and the booth 31 so that the cleaning fluid and the washed clay adhere to the nozzle moving mechanism 20. In addition, the nozzle 23 can be moved. The base member 50 is fixed by a base member setting jig 13 disposed on the table 11 as shown in FIG. As shown in FIG. 3, the nozzle 23 is movable in the vertical direction by the motor 25 and in the horizontal direction by the motor 26. The waste liquid after washing is discharged from the drain port 33.

まず、口金部材50の坏土供給孔側の面がノズル移動装置20のノズル23とほぼ垂直に面するように、口金部材50を口金部材セット治具13にセットした。次に、(a)ノズル移動装置20の高圧流体用ノズル21(ノズル径2 mm)から、水を含んだ高圧流体を6 MPaの圧力で噴出させ、口金部材50の供給孔51に対して吹き付けながら、水平方向にノズル21を相対的に移動し洗浄を行った。(b)水平方向の洗浄が終了するとノズル21を垂直方向に移動し、先程とは逆の水平方向に相対的に移動しながら洗浄を行った。この(a)及び(b)の動作を繰り返して、口金部材50の坏土供給孔側の面全体の洗浄を行った。次にテーブル11を反転して、口金部材の成形溝側の面がノズル移動装置20のノズル23にほぼ垂直に面するようにセットした。そして、成形溝52に対して、高圧流体用ノズル21から高圧流体を0.9 MPaの圧力で噴出させ、坏土供給孔側の面と同様にして成形溝側の面の洗浄を行った。口金部材の各面とノズルとの距離は200 mmであった。   First, the base member 50 was set on the base member setting jig 13 so that the surface of the base member 50 on the side of the clay supply hole faces substantially perpendicular to the nozzle 23 of the nozzle moving device 20. Next, (a) a high-pressure fluid containing water is ejected from the high-pressure fluid nozzle 21 (nozzle diameter 2 mm) of the nozzle moving device 20 at a pressure of 6 MPa and sprayed to the supply hole 51 of the base member 50. However, the nozzle 21 was relatively moved in the horizontal direction for cleaning. (b) When the horizontal cleaning was completed, the nozzle 21 was moved in the vertical direction, and cleaning was performed while relatively moving in the horizontal direction opposite to the previous one. The operations of (a) and (b) were repeated to clean the entire surface of the base member 50 on the side of the clay supply hole. Next, the table 11 was inverted and set so that the surface of the die member on the side of the forming groove faced the nozzle 23 of the nozzle moving device 20 substantially perpendicularly. Then, the high-pressure fluid was jetted from the high-pressure fluid nozzle 21 to the forming groove 52 at a pressure of 0.9 MPa, and the surface on the forming groove side was cleaned in the same manner as the surface on the clay supply hole side. The distance between each face of the base member and the nozzle was 200 mm.

実施例1〜17、参考例2〜8、及び比較例3〜5
口金部材の形状、洗浄時の高圧流体の圧力、及び洗浄内容を表1に示すように変更した以外は参考例1と同様にして、押出し成形に用いた口金部材の洗浄を行った。なお、表1において、参考例7の洗浄方法に記載した「供給孔→成形溝→供給孔」は、供給孔の面の洗浄及び成形溝側の面の洗浄が終了した後、再度坏土供給孔側の面の洗浄を行ったことを意味し、参考例8の洗浄方法に記載した「供給孔→成形溝→供給孔→成形溝」は、更にその後に、再度成形溝側の面の洗浄を行ったことを意味する。
Examples 1 to 17, Reference Examples 2 to 8, and Comparative Examples 3 to 5
The die member used for extrusion molding was washed in the same manner as in Reference Example 1, except that the shape of the die member, the pressure of the high-pressure fluid during washing, and the washing contents were changed as shown in Table 1. In Table 1, “supply hole → molding groove → supply hole” described in the cleaning method of Reference Example 7 is again supplied with clay after cleaning of the surface of the supply hole and cleaning of the surface of the molding groove side. This means that the surface on the hole side has been cleaned, and “supply hole → molding groove → supply hole → molding groove” described in the cleaning method of Reference Example 8 is followed by cleaning the surface on the molding groove side again. Means that

比較例1
口金部材の形状、洗浄時の高圧流体の圧力、及び洗浄内容を表1に示すように変更し、成形溝側からのみ洗浄を行った以外は実施例1と同様にして、押出し成形に用いた口金部材の洗浄を行った。比較例1は従来行われていた高圧洗浄方法である。
Comparative Example 1
The shape of the base member, the pressure of the high-pressure fluid at the time of cleaning, and the content of cleaning were changed as shown in Table 1, and used for extrusion molding in the same manner as in Example 1 except that cleaning was performed only from the molding groove side. The base member was cleaned. Comparative Example 1 is a conventional high-pressure cleaning method.

比較例2
口金部材の形状、洗浄時の高圧流体の圧力、及び洗浄内容を表1に示すように変更し、供給孔側からのみ洗浄を行った以外は実施例1と同様にして、押出し成形に用いた口金部材の洗浄を行った。比較例2は従来行われていた高圧洗浄方法である。
Comparative Example 2
The shape of the base member, the pressure of the high-pressure fluid at the time of cleaning, and the content of cleaning were changed as shown in Table 1, and were used for extrusion molding in the same manner as in Example 1 except that cleaning was performed only from the supply hole side. The base member was cleaned. Comparative Example 2 is a conventional high-pressure cleaning method.

洗浄性の評価
洗浄後の口金部材の成形溝及び供給孔を目視により観察し、洗浄残りの有無を調べた。洗浄性の評価は以下の基準で行った。結果を表1に示す。
洗浄残りがないもの・・・○
洗浄残りが若干あるが、押出し成形に用いても問題のないもの・・・△
洗浄残りがあり、押出し成形に用いることができないもの・・・×
Evaluation of cleaning property The molding groove and the supply hole of the base member after the cleaning were visually observed, and the presence or absence of the cleaning residue was examined. Detergency was evaluated according to the following criteria. The results are shown in Table 1.
No cleaning residue ... ○
There is a little washing residue, but there is no problem even if it is used for extrusion molding ... △
Uncleanable items that cannot be used for extrusion molding

口金部材の変形の評価
洗浄後の口金部材の変形を次のように評価した。結果を表1に示す。
口金部材の変形がないもの・・・○
口金部材の変形が若干あるが、押出し成形に用いても問題のないもの・・・△
口金部材の変形があり、押出し成形に用いることができないもの・・・×
Evaluation of Deformation of Base Member Deformation of the base member after cleaning was evaluated as follows. The results are shown in Table 1.
No deformation of the base member ... ○
Although there is some deformation of the base member, there is no problem even if it is used for extrusion molding ... △
Cannot be used for extrusion molding due to deformation of the base member ... ×

Figure 0005321064
Figure 0005321064

表1(続き)

Figure 0005321064
Table 1 (continued)
Figure 0005321064

表1(続き)

Figure 0005321064
Table 1 (continued)
Figure 0005321064

表1(続き)

Figure 0005321064
Table 1 (continued)
Figure 0005321064

表1に示すように、本発明の方法で洗浄を行った実施例1〜17は、口金部材がほとんど変形しないで洗浄されることがわかる。一方、比較例1〜5の口金部材は、洗浄残り又は変形が生じ押出し成形に用いることができなかった。
As shown in Table 1, it can be seen that Examples 1 to 17 which were cleaned by the method of the present invention were cleaned with almost no deformation of the base member. On the other hand, the base members of Comparative Examples 1 to 5 could not be used for extrusion molding due to residual cleaning or deformation.

Claims (5)

成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインターを含有するセラミック坏土を除去する口金部材の洗浄方法であって、
前記成形溝の幅が0.1〜0.5 mm、ピッチが1.0〜1.8 mm、前記供給孔の径が1〜2 mmであり、前記口金部材の供給孔側の面にほぼ垂直に高圧流体を8〜20 MPaの圧力で吹き付けた後に、前記口金部材の成形溝側の面にほぼ垂直に高圧流体を1〜5 MPaの圧力で吹き付けることを特徴とする口金部材の洗浄方法。
After the die member having the molding groove and the ceramic clay supply hole communicating with the molding groove is used for forming the ceramic clay containing the binder, the ceramic clay containing the binder attached to the die member is used. A method of cleaning a base member to be removed,
The molding groove has a width of 0.1 to 0.5 mm, a pitch of 1.0 to 1.8 mm, a diameter of the supply hole of 1 to 2 mm, and a high-pressure fluid of 8 to 20 substantially perpendicular to the surface of the base member on the supply hole side. A method of cleaning a die member, characterized by spraying a high-pressure fluid at a pressure of 1 to 5 MPa substantially perpendicularly to the surface of the die member on the molding groove side after spraying at a pressure of MPa.
請求項1に記載の口金部材の洗浄方法において、前記成形溝に高圧流体を吹き付けた後、更に前記供給孔に高圧流体を吹き付けることを特徴とする洗浄方法。 2. The cleaning method for a cap member according to claim 1, wherein after the high-pressure fluid is sprayed on the forming groove, the high-pressure fluid is further sprayed on the supply hole. 成形溝と前記成形溝へ連通するセラミック坏土供給孔とを有する口金部材を、バインダーを含有するセラミック坏土の成形に用いた後に、前記口金部材に付着した前記バインダーを含有するセラミック坏土を除去する口金部材の洗浄装置であって、口金部材保持機構、高圧流体用ノズル、エアブロー用ノズル、前記ノズルの移動機構、前記高圧流体用ノズルが口金部材に対して相対的に移動しつつ高圧流体を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けてセラミック坏土を除去する機構、及び前記エアブロー用ノズルが口金部材に対して相対的に移動しつつ高圧空気を口金部材の供給孔側の面又は成形溝側の面に対してほぼ垂直に吹き付けて流体を除去する機構を備え、前記口金部材保持機構が反転することを特徴とする口金部材の洗浄装置。 After the die member having the forming groove and the ceramic clay supply hole communicating with the forming groove is used for forming the ceramic clay containing the binder, the ceramic clay containing the binder attached to the die member is used. A device for cleaning a base member to be removed, comprising a base member holding mechanism, a nozzle for high pressure fluid, an air blow nozzle, a moving mechanism for the nozzle, and a high pressure fluid while the nozzle for high pressure fluid moves relative to the base member. A mechanism for removing ceramic clay by spraying the nozzle member substantially perpendicularly to the surface on the supply hole side or the surface on the molding groove side of the base member, and high-pressure air while the air blowing nozzle moves relative to the base member In which the fluid is removed by spraying the nozzle member substantially perpendicularly to the surface on the supply hole side or the surface on the molding groove side of the base member, and the base member holding mechanism is reversed. Cleaning device mouthpiece member. 請求項3に記載の口金部材の洗浄装置において、前記ノズルの移動機構がサーボモータ、ボールネジ又はLMガイドによる機構であることを特徴とする洗浄装置。 4. The base member cleaning apparatus according to claim 3 , wherein the nozzle moving mechanism is a mechanism using a servo motor, a ball screw, or an LM guide. 請求項3又は4に記載の口金部材の洗浄装置において、前記口金部材と前記口金部材保持機構とがブース内に配置され、前記ノズルの移動機構がブース外に配置され、前記ブース内と前記ノズルの移動機構とは可撓性シートで分離されていることを特徴とする洗浄装置。
The base member cleaning apparatus according to claim 3 or 4 , wherein the base member and the base member holding mechanism are disposed in a booth, the moving mechanism of the nozzle is disposed outside the booth, and the booth and the nozzle. The moving mechanism is separated by a flexible sheet.
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EP2098346A1 (en) 2009-09-09
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US20100012155A1 (en) 2010-01-21
WO2008078793A1 (en) 2008-07-03
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EP2098346A4 (en) 2013-09-04
CN101568414B (en) 2012-05-16

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