JP5318333B2 - Method and apparatus for treating fluorine compound-containing gas - Google Patents

Description

  The present invention relates to a gas processing method and a processing apparatus for processing a gas containing a fluorine compound.

In a semiconductor or liquid crystal manufacturing process, a fluorine compound gas, particularly a perfluoro compound (hereinafter referred to as PFC) is usually used for etching or cleaning. Examples of PFC include CF ₄ , C ₂ F ₆ , C ₃ F ₈ , C ₄ F ₈ , SF ₆ , and NF ₃ . PFC is a global warming gas with infrared absorption several thousand to several tens of thousands times that of carbon dioxide (CO ₂ ), and its emission was restricted worldwide by the Kyoto Protocol issued in February 2005. In the etching or cleaning process, only a part of the introduced PFC is used, and most of the PFC is discharged as exhaust gas. In recent years, it has been clarified that a small amount of PFC is generated and exhausted to the atmosphere in the refining process of metal aluminum. Thus, the PFC discharged to the atmosphere needs to be exhausted after being removed or decomposed.

  As a PFC treatment method, a catalyst method, a combustion method, a plasma method, a drug method, and the like are known. At present, the PFC decomposition method using the catalytic method is becoming widespread because the maintenance is simple, the running cost is low, and the PFC decomposition rate is high.

  In Patent Document 1, as a method for concentrating and decomposing chlorofluorocarbons on the order of several hundred ppm, a technique is described in which chlorofluorocarbon contained in a trace amount in gas is concentrated by adsorption, desorbed and then decomposed by a catalyst.

Japanese Patent Laid-Open No. 3-106419

  However, the amount of PFC discharged from aluminum refining is a very small amount of several ppm to several tens of ppm. Therefore, even if the same system is introduced, it takes time for adsorption / desorption. Therefore, a large amount of heat energy is wasted if the catalyst tank of the downstream PFC decomposition apparatus is always kept at a constant temperature during adsorption / desorption, and the running cost for the PFC throughput increases. Further, Patent Document 1 does not propose details of the system.

  Accordingly, an object of the present invention is to provide a processing method and a processing apparatus, particularly a PFC decomposition apparatus, for processing a gas containing a fluorine compound discharged from a semiconductor, a liquid crystal manufacturing factory, and an aluminum refining factory that solve the above-mentioned problems. is there.

  The feature of the present invention that solves the above problem is that the heating device of the fluorine compound decomposing apparatus is controlled, and the heating apparatus is operated only when supplying the fluorine compound to the fluorine compound decomposing apparatus while switching between capture and desorption of the fluorine compound. The system is adopted. Examples of the heating device of the fluorine compound decomposing apparatus include an apparatus for heating the gas flowing into the fluorine compound decomposing apparatus and an apparatus for heating the decomposing apparatus itself. In particular, a fluorine compound contained in a trace amount in the gas to be treated is concentrated by an adsorbent, desorbed when the adsorption capacity of the adsorbent reaches saturation, and the fluorine compound is treated by a fluorine compound treatment apparatus installed at a later stage. A fluorine compound detector is installed in the downstream of the adsorption tower to monitor the concentration of the fluorine compound that has broken through without being absorbed by the adsorbent. After the breakthrough of the fluorine compound is confirmed, the fluorine compound treatment device and fluorine compound The heating of the gas heating device that heats the gas flowing in to desorb is started. Excessive running costs can be reduced by controlling the heating time. The gas heating device is characterized by rapid heating, and the adsorption / desorption cycle can be accelerated by rapidly desorbing the adsorbed fluorine compound by rapid heating, so that the amount of adsorbed adsorbent can be reduced. Compactness is possible.

  The present invention includes a fluorine compound adsorption step for adsorbing a fluorine compound in a gas to be treated containing a fluorine compound, and a gas heating step 1 for heating a gas supplied to the fluorine compound adsorption step in order to desorb the adsorbed fluorine compound. In the fluorine compound-containing gas treatment method, comprising a fluorine compound treatment step for treating the desorbed fluorine compound and a gas heating step 2 for heating the gas flowing into the fluorine compound treatment step, The fluorine compound containing gas is detected, and after the fluorine compound is detected, heating in the fluorine compound treatment step and the gas heating step is started.

  In addition, a fluorine compound adsorption device that adsorbs the fluorine compound in the gas to be treated containing the fluorine compound, a gas heating device 1 that heats the gas supplied to the fluorine compound adsorption device to desorb the adsorbed fluorine compound, and a desorption In a fluorine compound-containing gas processing apparatus having a fluorine compound processing apparatus for decomposing a separated fluorine compound and a gas heating apparatus 2 for heating a gas flowing into the fluorine compound processing apparatus, a fluorine compound is disposed downstream of the fluorine compound adsorption apparatus. A detection device is provided. When a predetermined amount of fluorine compound is detected by the fluorine compound detection device, heating of the fluorine compound processing device and the gas heating device is started to process the fluorine compound-containing gas. By controlling the capture and desorption of the fluorine compound, the fluorine compound can be concentrated and decomposed.

  According to the present invention, a low concentration fluorine compound can be efficiently removed.

  A feature of the present invention is that it has a fluorine compound capturing device that captures a fluorine compound contained in a gas to be treated, and a gas detecting device that detects the amount or concentration of the fluorine compound downstream of the capturing device. When a predetermined amount is detected, a first gas heating device that supplies heated gas to the fluorine compound trapping device or a first heating device that heats the trapping device is provided.

  By using the equipment in this way, it is possible to concentrate and decompose fluorine compounds, increasing the decomposition efficiency, reducing the heating energy at the time of decomposition, and preventing deterioration of the equipment and catalyst used for decomposition. it can.

  Similarly, based on the gas detection device, the second heating device for heating the gas flowing into the fluorine compound processing device or the fluorine compound decomposition catalyst may be heated.

  In addition, it is preferable that the gas is rapidly heated at 1000 ° C. or more per minute by a heating device.

  The treatment method and treatment apparatus of the present invention can be widely applied to treatment of fluorine compound-containing gas. It is particularly effective for PFC processing.

  One of the PFC concentration methods is an adsorption method using an adsorbent. However, since PFC is difficult to adsorb to other media, it is necessary to fill a large amount of adsorbent. Therefore, the apparatus becomes large. In order to reduce the size of the apparatus, it is effective to develop a system that can perform an adsorption / desorption cycle quickly with a small amount of adsorbent. At the same time, it is possible to efficiently process PFC, which is a global warming gas contained in a very small amount in exhaust gas, and to reduce the running cost of the apparatus.

  FIG. 1 is a system flow showing an example of the processing method of the present invention. This system consists of a fluorine compound adsorption process, a fluorine compound detection process, a fluorine compound treatment process, a gas heating process, and an acid gas removal process.

  A very small amount of a fluorine compound contained in a gas discharged from a factory using a fluorine compound such as an aluminum refining factory is adsorbed in the fluorine compound adsorption process. Over time, the fluorine compound that could not be adsorbed by the fluorine compound adsorbent breaks through. When it breaks through, the fluorine compound concentration at the outlet gradually increases, and therefore the broken fluorine compound is detected in the fluorine compound detection step installed in the downstream portion of the fluorine compound adsorption step.

When the fluorine compound breaks through, heating in the fluorine compound treatment process and gas heating process is started. Fluorine compounds adsorbed by gas heated by the gas heating step is passed through the fluorine compound adsorption step that releases prolapse. Further, the heated fluorine compound is sent to the fluorine compound treatment step and decomposed and removed. Acidic gases such as hydrogen fluoride, SOx, and NOx produced by the decomposition of the fluorine compound are removed in the acidic gas removal step, are rendered harmless, and are discharged.

  In the fluorine compound adsorption step, the concentration of the fluorine compound can be always performed by installing a plurality of adsorption towers. It is preferable to provide two adsorption towers. By installing two towers, the adsorption and desorption processes are completed in one tower, and while the adsorption tower is cooled, the adsorption process can be performed in the remaining one tower. Three or more adsorption towers may be installed.

The fluorine compound is preferably adsorbed by an adsorbent, and the adsorbent preferably has a pore diameter sufficiently larger than the molecular diameter of the PFC to be adsorbed. For example, since the molecular diameter of CF ₄ is about 3.6 mm, a material having a larger pore diameter is preferred. Activated carbon, zeolite, and mesoporous silica can be used as the adsorbent. Among these, mesoporous silica is a preferable material because it has 2-50 nm mesopores and a large pore volume. Moreover, it is preferable to implement adsorption at normal temperature (25 degreeC).

Installed in the downstream portion of the adsorption tower, as an example of a gas analyzer for detecting the breakthrough and fluorine compounds, a laser gas analyzer, gas chromatography (GC), Fourier transform infrared spectrophotometric meter (FT-IR ) An analyzer suitable for the present invention has a short measurement time. Commercially available gas detection sensors can also be used. One detector is preferably installed at the bottom of each adsorption tower. However, when an expensive detector is used, one detector may be installed at the portion where the gas from the adsorption tower is mixed.

  When breakthrough of the fluorine compound is confirmed in the fluorine compound detection step, the adsorption tower line is switched and heating of the heating device for heating the fluorine compound decomposition catalyst is started. In addition, supply of a gas for desorbing the adsorbed fluorine compound from the adsorbent and heating of a heating device for heating the gas are started.

  In addition, the system which grasps | ascertains the fluorine compound adsorption capacity to the adsorbent and the gas processing amount in advance and starts the heating and gas supply of each heating device after the adsorption processing for a certain period of time may be used.

  It is desirable to shift the heating start time of the catalyst heating device and the gas heating device. The decomposition temperature of the fluorine compound is about 750 ° C., and the desorption temperature of the fluorine compound is about 100 to 200 ° C. Therefore, even if heating is started at the same time and PFC is desorbed and reaches the catalytic reaction tank, it does not decompose if the catalyst temperature is low. A system that heats only the catalyst heating device when the fluorine compound breaks through and starts heating the gas heating device when the temperature of the catalyst reaction tank becomes sufficiently high is also effective. Excessive running costs can be reduced by heating only when the low concentration fluorine compound is concentrated and desorbed instead of constantly heating to decompose the low concentration fluorine compound.

  It is desirable to install a buffer before the fluorine compound treatment step. Even if breakthrough of the fluorine compound begins, if the catalyst temperature in the fluorine compound treatment step is low, the fluorine compound is discharged without being treated. By installing a buffer before the fluorine compound treatment step, the inflow of the fluorine compound into the catalyst can be suppressed until the catalyst reaches a predetermined temperature. It is further desirable to fill the buffer with a fluorine compound adsorbent. Any method other than the buffer may be used as long as it can suppress the inflow of the fluorine compound to the catalyst.

  It is preferable that the heating device for heating the gas supplied to desorb the fluorine compound can be rapidly heated. This is because the fluorine compound can be quickly desorbed by rapid heating, and a sufficient time for cooling for the next adsorption can be secured. One method capable of rapid heating is microwave heating. This is a method of generating heat by the action of electric and magnetic fields of electrons and microwaves constituting the substance. There are various types of solids that can be heated by irradiation with microwaves. For example, CuO can be heated to about 700 ° C. in 30 seconds, and C can be heated to about 1200 ° C. in 1 minute. It is desirable to determine the irradiation amount of the heating medium and the microwave according to the desorption temperature of the fluorine compound. Any method other than microwave heating can be used as long as the gas can be rapidly heated.

  In the fluorine compound decomposition step using a catalyst, the fluorine compound is decomposed by hydrolysis. When the fluorine compound is hydrolyzed, acid fluorides such as hydrogen fluoride, SOx, and NOx are generated. The generated acid gas is sent to the acid gas removal step after the PFC decomposition step to be removed.

  A typical reaction formula in the hydrolysis reaction of PFC which is a fluorine compound is shown below.

CF ₄ + 2H ₂ O → CO ₂ + 4HF (Formula 1)
C ₂ F ₆ + 3H ₂ O → CO + CO ₂ + 6HF (Formula 2)
CHF ₃ + H ₂ O → CO + 3HF (Formula 3)
SF ₆ + 3H ₂ O → SO ₃ + 6HF (Formula 4)
2NF ₃ + 3H ₂ O → NO + NO ₂ + 6HF (Formula 5)
Hereinafter, the present invention will be described in detail with reference to examples.

  FIG. 2 shows an example of the processing apparatus of the present invention.

In this example, a spray tower 110 is used as a wet processing apparatus in front of the fluorine compound adsorption apparatus 120. From the fluorine compound-containing gas 100, solids and acid gas contained in the gas are removed by a spray tower 110 which is a wet processing apparatus. As wet processing apparatuses other than the spray tower, there are a shelf-type gas-liquid contact apparatus and a scrubber. In any case, it is desirable that gas-liquid contact is sufficient. Further, when the inner diameter of the apparatus is small, the gas linear velocity in the apparatus increases, and the amount of mist accompanying the gas increases. Therefore, the gas flow rate in the apparatus is 10 m / min to 18 m / min.
It is desirable to design it to be less than min. In addition, tap water or circulating water in the apparatus can be used as the inflow water to the wet processing apparatus, but if only the circulating water is used, a large amount of solids and acidic components dissolved in the circulating water are discharged as mist. There is a possibility. Therefore, it is desirable to make tap water flow from the uppermost nozzle installed in the packed tower and spray tower, and tap water to flow in from the shelf and scrubber so that the silicon compound concentration in the inflow water is lowered. . Moreover, as inflow water, you may use alkaline aqueous solution etc. other than a tap water and circulating water.

  Further, a hygroscopic material 200 is installed downstream of the spray tower 110 to completely remove moisture in the gas after the wet treatment. This is because, if moisture is contained in the gas, moisture is selectively adsorbed depending on the kind of adsorbent, and the fluorine compound is not adsorbed.

  Two adsorption towers 120 are installed, and switching of the inflow gas flow path is operated by the electromagnetic valve 300.

  A fluorine compound detector 130 is installed downstream of the adsorption tower to detect breakthrough of the fluorine compound. When the result obtained by the fluorine compound detection device 130 is larger than the predetermined concentration / compound amount, heating by the preheating device 141, the catalyst heating device 142, and the gas heating device 161 of the catalytic reactor is appropriately started.

  A buffer 400 filled with an adsorbent is installed in the rear stage of the adsorption tower and in the front stage of the catalytic reactor, and the fluorine compound inflow to the catalyst is suppressed until the catalyst in the catalytic reactor reaches a predetermined temperature.

  In order to desorb the fluorine compound from the fluorine compound adsorption device, nitrogen 101 is introduced. In order to heat the nitrogen 101, a heating chamber 160 is provided in the middle of the piping, and the heating chamber 160 is heated by a heating device 161 capable of rapid heating from the outside.

In addition, a reaction tower 140 is installed as a catalytic reactor equipped with a preheating device 141, and a fluorine compound decomposition catalyst 143 is installed at the lower part of the reaction tower 140. The fluorine compound decomposition catalyst is heated by the catalyst heating device 142 from the outside of the reaction tower 140.

  The operation of the preheating device 141, the catalyst heating device 142, and the gas heating device 161 of the catalytic reactor is started when the breakthrough of the fluorine compound is detected. At this time, first, the operation of the preheating device 141 and the catalyst heating device 142 of the catalytic reactor is started, and the operation of the gas heating device 161 is started when the temperature of the catalyst 143 reaches a predetermined temperature (for example, about 700 ° C.). Is desirable. This is because the desorbed PFC is reliably decomposed by shifting the heating start time. When the temperature of the catalyst reaches a predetermined temperature, the operation of the gas heating device 161 is started and the nitrogen 101 is rapidly heated. The heating temperature of the gas heating device needs to be set according to the fluorine compound desorption temperature from the adsorbent or the inflow amount of the inflowing fluorine compound-containing gas 100.

  The heated nitrogen 101 is supplied to the adsorption tower 120 to desorb the fluorine compound from the adsorbent. In addition, the fluorine compound adsorbed on the adsorbent filled in the buffer 400 by the heated nitrogen 101 can also be desorbed.

  A cooling chamber 150 is installed downstream of the reaction tower 140. A spray tower 170 is installed as an acidic gas removal device downstream thereof, and the gas after removal of the acidic gas is discharged using an exhaust device 180 such as an ejector or a blower. The exhaust device is always installed in order to keep the inside of the device at a negative pressure and prevent the differential pressure from rising.

The fluorine compound desorbed from the fluorine compound adsorption device 120 is decomposed by the catalyst 143. Since the decomposition reaction of PFC, which is a fluorine compound, is hydrolysis, the reaction water 103 is vaporized in a preheating tank at the top of the reaction tower 140 and is allowed to pass through the catalyst 143 as water vapor. Decomposes on reaction. Since CO is generated in the reactions of (Expression 2) and (Expression 3), CO can be changed to CO ₂ by flowing air 102 into the reaction. Further, if the CO oxidation catalyst is installed at the subsequent stage of the fluorine compound decomposition catalyst, CO can be oxidized to CO ₂ in the reaction tower. Hydrolysis of fluorine compounds such as PFC causes acidic gases such as hydrogen fluoride, SOx,
NOx is generated. These acidic gases are washed with water or the like in a spray tower 170 which is an acidic gas removing device, removed from the exhaust gas, and other gases are exhausted.

The catalyst used for the decomposition of the fluorine compound is a catalyst for hydrolysis or oxidative decomposition. For example, Al and Zn, Ni, Ti, Fe, Sn, Co, Zr, Ce, Si, W, Pt,
A catalyst containing at least one selected from Pd. The catalyst component is included in the form of an oxide, metal, composite oxide or the like. In particular, a catalyst of Al and at least one selected from Ni, Zn, Ti, and W is preferable because it has high fluorine compound decomposition performance.

  The amount of water vapor added to the reaction tower during the hydrolysis of the fluorine compound is preferably 2 to 50 times the theoretical amount of water vapor required for hydrolysis, usually 3 to 30 times. When the silicon compound is hydrolyzed and removed by the scavenger, it is desirable to supply more than the theoretical water vapor amount required for hydrolysis of the fluorine compound, preferably 2 to 60 times, usually 5 to 50 times. .

  The hydrolysis temperature of the fluorine compound is preferably 500 to 850 ° C. When the fluorine compound concentration is high, the reaction temperature is raised, and when the fluorine compound concentration is 1% or less, the reaction temperature is preferably lowered. When the reaction temperature is higher than 850 ° C., the catalyst tends to deteriorate and the reaction tower material also tends to corrode. On the other hand, when the reaction temperature is lower than 500 ° C., the decomposition rate of the fluorine compound decreases.

  In this apparatus example, a cooling chamber 150 is installed downstream of the reaction tower 140. In the cooling chamber 150, for example, water is sprayed by the nozzle 151 to lower the gas temperature to a predetermined temperature. A general heat exchanger of water cooling type or gas cooling type may be used. Further, compressed air or the like may be introduced into the gas and controlled to a predetermined temperature.

  As the acid gas removing device, general wet and dry removing devices can be used. Examples of wet methods include spray towers, packed towers, scrubbers, and shelf-type gas-liquid contact devices. Examples of the dry type include a fixed bed, a moving bed, and a fluidized bed type dry removal apparatus using an acid gas remover. Also, a bug filter method is good. As acid gas removal agent, basic salts of alkali metals and alkaline earth metals such as calcium hydroxide, sodium hydroxide, potassium hydroxide, magnesium hydroxide, sodium hydrogen carbonate, sodium carbonate, calcium carbonate, calcium oxide are used. it can.

In this example, the performance of the adsorbent was evaluated. The configuration of the test apparatus is shown in FIG. CF ₄ that is one of the PFCs was passed through the adsorbent, and the CF ₄ concentration in the adsorbent outlet gas was monitored and examined.

CF ₄ as N ₂ and PFC was adjusted by the flow controller 12 and supplied to the reaction tube 20. The supply amount was 2 slm, and CF ₄ was 200 ppm. This reaction gas was brought into contact with the CF ₄ adsorbent 23 at a space velocity of 800 per hour.

  At this time, as the adsorbent 23, mesoporous silica, zeolite, or zeolite carrying Cu was used. The filling amount of the adsorbent was 150 ml. The reaction tube 20 was made of Inconel having an inner diameter of 47 mm and a length of 450 mm.

The reason why Cu is supported on the zeolite is to control the pore diameter. The adsorbent was molded and used in a powder form, and the particle size was 2.0 to 4.5 mm. The CF ₄ concentration in the gas that passed through the adsorbent was measured by FT-IR for gas. The adsorption performance was compared by the amount of CF ₄ adsorption of each adsorbent. The amount of CF ₄ adsorption was determined by the following formula.

FIG. 4 shows the CF ₄ adsorption performance of each adsorbent. The amount of CF ₄ adsorbed on each adsorbent was 8.2 × 10 ⁻³ mmol for mesoporous silica, 1.1 × 10 ⁻³ mmol for zeolite, and 4.6 × 10 ⁻⁴ mmol for Cu / zeolite. . Mesoporous silica showed the highest adsorption performance. The mesoporous silica and zeolite have average pore sizes of 41 mm and 7 mm, respectively, and mesoporous silica has a larger pore size. Cu / zeolite has a pore size smaller than that of zeolite and is about 5 mm. The average molecular diameter of CF ₄ is about 3.6 mm, which is smaller than the pore diameters of zeolite and Cu / zeolite, but is estimated to be less than about twice the pore diameter. Therefore, it is estimated that mesoporous silica having pores 10 times larger than the molecular diameter of CF ₄ is more suitable for CF ₄ adsorption. In this example, the adsorption performance was compared with CF ₄ , but it is desirable to select an optimum adsorbent depending on the fluorine compound used.

  According to the present invention, a fluorine compound can be efficiently decomposed in a line from which a trace amount of a fluorine compound is discharged, so that the fluorine compound decomposing apparatus can be downsized and the running cost can be reduced.

It is a system flow figure showing an example of the processing method of the present invention. It is a system configuration figure showing an example of a processing device of the present invention. It is the schematic of the apparatus used for the evaluation experiment of the performance of an adsorbent. It is a test result figure which shows the adsorption effect of an adsorbent.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Nitrogen gas, 11 ... PFC gas, 12 ... Flow controller, 20 ... Reaction tube, 23 ... Fluorine compound adsorption material, 30 ... FT-IR for gas, 100 ... Fluorine compound containing gas, 101 ... Nitrogen, 102 ... Air , 103 ... Reaction water, 110 ... Spray tower, 111, 171 ... Spray nozzle, 120 ... Fluorine compound adsorption device, 130 ... Fluorine compound detection device, 140 ... Reaction tower, 141 ... Preheating device, 142 ... Catalyst heating device, 143 ... Fluorine compound decomposition catalyst, 150 ... cooling chamber, 151 ... nozzle, 160 ... heating chamber, 161 ... gas heating device, 170 ... acid gas removal device (spray tower), 180 ... exhaust device, 200 ... hygroscopic material, 300, 301 ... solenoid valve,
400: Buffer.

Claims (16)

A fluorine compound adsorption step for adsorbing a fluorine compound in a gas containing a fluorine compound, a first gas heating step for desorbing the adsorbed fluorine compound by heating a gas supplied to the fluorine compound adsorption step, and the desorption And a fluorine compound treatment step of decomposing the fluorine compound, wherein the fluorine compound-containing gas treatment method comprises:
The fluorine compound includes perfluoro compound (PFC),
The fluorine compound adsorption step uses an adsorbent selected from activated carbon, zeolite and mesoporous silica ,
Before the fluorine compound adsorption step, it has a wet treatment step of removing solids and acid gas in the gas to be treated containing the fluorine compound, and a step of removing moisture in the gas after the wet treatment, A step of detecting a fluorine compound downstream of the fluorine compound adsorption step, and starting heating of the first gas heating step based on the amount of the detected fluorine compound. Processing method.   The method for treating a fluorine compound-containing gas according to claim 1, wherein the fluorine compound adsorption step uses a mesoporous silica adsorbent.   3. The PFC according to claim 1 or 2, wherein the PFC is CF. _Four , C ₂ F ₆ , C _Three F ₈ , C _Four F ₈ , SF ₆  And NF _Three A method for treating a fluorine compound-containing gas, which is selected from the group consisting of:   4. The fluorine compound-containing gas according to claim 1, further comprising a second gas heating step of heating the gas containing the desorbed fluorine compound before flowing into the fluorine compound treatment step. Processing method.     5. The method for treating a fluorine compound-containing gas according to claim 1, wherein the fluorine compound treatment step is a catalytic decomposition step. 6. The method for treating a fluorine compound-containing gas according to claim 1, wherein in the fluorine compound adsorption step, a plurality of fluorine gas adsorption towers are switched and used.   7. The method for treating a fluorine compound-containing gas according to claim 1, wherein the first or second gas heating step is a step of rapid heating at 1000 ° C./min or more.   8. The method for treating a fluorine compound-containing gas according to claim 1, wherein the fluorine compound adsorption step is changed or stopped based on the detected amount of the fluorine compound.   5. The method for treating a fluorine compound-containing compound gas according to claim 4, wherein the first heating step is started after the second heating step is started. A wet processing apparatus for removing solids and acid gas in a gas to be treated containing a fluorine compound, a moisture removing apparatus for removing water in the gas after the wet treatment, and a fluorine compound in the gas to be treated containing a fluorine compound A fluorine compound adsorption device for adsorbing, a first heating device for heating the fluorine compound adsorption device to desorb the adsorbed fluorine compound, a fluorine compound treatment device for decomposing the desorbed fluorine compound, A fluorine compound-containing gas treatment device having a second heating device for heating a gas flowing into the fluorine compound treatment device,
The fluorine compound includes perfluoro compound (PFC),
The fluorine compound adsorption step uses an adsorbent selected from activated carbon, zeolite and mesoporous silica ,
A fluorine compound detection device disposed downstream of the fluorine compound adsorption device; and a heating control device that controls the heating of the heating device by detecting a predetermined amount of the fluorine compound. Fluorine compound-containing gas treatment device.   The apparatus for treating a fluorine compound-containing gas according to claim 10, wherein the fluorine compound adsorption step uses a mesoporous silica adsorbent.   12. The PFC according to claim 10 or 11, wherein the PFC is CF. _Four , C ₂ F ₆ , C _Three F ₈ , C _Four F ₈ , SF ₆  And NF _Three An apparatus for treating a fluorine compound-containing gas, which is selected from the group consisting of:   The apparatus for treating a fluorine compound-containing gas according to any one of claims 10 to 12, wherein the first heating device is a device that heats a gas flowing into the fluorine compound adsorption device.   The apparatus for treating a fluorine compound-containing gas according to any one of claims 10 to 13, wherein the first or second heating device is a device that heats at 1000 ° C / min or more.   The apparatus for treating a fluorine compound-containing gas according to any one of claims 10 to 14, wherein the fluorine compound decomposition apparatus is a catalytic decomposition apparatus.   16. The apparatus for treating a fluorine compound-containing gas according to claim 10, further comprising an acid gas removing device on a downstream side of the fluorine compound decomposition apparatus.

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