JP5318235B2 - Stage apparatus, exposure apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to a stage apparatus. The present invention also relates to an exposure apparatus having a stage device for moving a reticle or wafer, and to a device manufacturing method using such an exposure apparatus.

  In a precision positioning device used in an exposure apparatus, it is considered to employ a so-called planar motor stage that does not have a guide in the planar direction and can perform precise positioning at least in the planar direction. In this stage, it is common to use interferometer measurement capable of measuring position with high resolution and high accuracy. Also, in such a planar motor type stage, a large number of mounting parts such as wiring and piping are arranged on the movable part. These mounted parts flexibly connect a fixed part such as a stage surface plate and the stage movable part using an auxiliary member called a cable bear (registered trademark) (hereinafter referred to as an auxiliary member). The main components are power lines and control lines for driving, signal lines for transmitting various sensor outputs, refrigerant piping for temperature control of driving parts, compressed air used for various bearings, etc. Can be mentioned.

  JP-A-2003-37153 (Patent Document 1) and JP-A-2005-32817 (Patent Document 2) are cited as prior arts in which mounting components are routed to the stage of the exposure apparatus using an auxiliary member. It is done.

JP 2003-37153 A JP 2005-32817 A

  Many of the mounting parts arranged on the stage movable part and the mounting parts routed between the stage movable part and the fixed part are accompanied by heat generation and temperature rise. In the case of a driving power line, when the driving current flows, the wiring itself generates heat and causes a temperature rise. Further, the refrigerant pipe through which the refrigerant whose temperature has increased by collecting the heat generated from the driving unit flows is accompanied by a temperature increase according to the heat generation of the driving unit. In some cases, considering the cooling efficiency of the drive unit, a refrigerant having a temperature lower than the reference temperature set for the stage may be allowed to flow, in which case the temperature of the refrigerant pipe is lowered.

  Along with demands for further improvements in the throughput (productivity) of the exposure system, higher acceleration and higher speed of the stage have progressed, and in addition to the heat generation of the drive unit itself, such temperature changes of mounted components can no longer be ignored. ing.

  The temperature change of these mounted components causes thermal deformation of the stage structure and deterioration of the measurement accuracy of the interferometer for measuring the position of the stage, further improving the stage positioning accuracy and further improving the exposure accuracy. There are concerns that interfere. In particular, in the planar motor stage, there is a high possibility that the measurement optical axis of the interferometer is arranged in the immediate vicinity of the auxiliary member on which the mounting component is arranged. When these mounted parts undergo a temperature change, a temperature change in the vicinity of the measurement optical axis, that is, an air refractive index change is caused. As a result, the optical distance of the measurement optical axis changes, and it becomes indistinguishable from the state in which the distance physically changes, and is output as a length measurement error. That is, it is required that the temperature change in the vicinity of the measurement optical axis of the interferometer does not occur even when the temperature of the mounting component arranged on the auxiliary member changes.

  In addition, the temperature change of the mounting component arranged in the stage movable unit heats or cools the gas around the mounting component, and the gas causing the temperature change drifts around the stage movable unit. This gas causes a measurement error of the measurement optical axis of the interferometer arranged around the stage movable part. That is, it is required not to cause a temperature change in the vicinity of the measurement optical axis around the movable part even with respect to a temperature change of the mounted component arranged on the stage movable part.

  In view of the above, an object of the present invention is to suppress an interference measurement length error due to a temperature change of a mounted component and improve the positioning accuracy of the stage. Moreover, it is intended to improve exposure accuracy by mounting such a stage in an exposure apparatus.

  In order to solve the above problems, in the present invention, a stage movable part that can move in a non-contact manner on a surface plate, an interferometer that measures the position of the stage movable part, and a pipe connected to the stage movable part Alternatively, the stage apparatus includes wiring, an auxiliary member that holds piping or wiring drawn out of the stage movable unit, a surrounding member that covers the auxiliary member, and an exhaust unit that exhausts the internal space of the surrounding member. And a heat recovery unit arranged to reduce heat transmitted from the pipe or wiring to a space through which the measurement light of the interferometer passes. Here, “piping or wiring” is used to mean one or both of piping and wiring.

  According to the stage apparatus of the present invention, it is possible to suppress the influence of the temperature change of the mounted components, improve the stage positioning accuracy, and further improve the exposure accuracy.

It is a perspective view which shows the structure of a stage apparatus. It is a conceptual diagram which shows the whole exposure apparatus carrying a stage apparatus. FIG. 3A is a perspective view illustrating configurations of auxiliary members, wiring / piping, and a heat insulating material of the stage apparatus according to the first embodiment. FIG. 3B is a perspective view showing the relationship between the auxiliary member of the stage device and the heat insulating material. FIG. 4A is a perspective view illustrating configurations of auxiliary members, wiring / piping, and a high thermal conductivity material of the stage apparatus of the second embodiment. FIG. 4B is a perspective view illustrating the relationship among the auxiliary member, the high thermal conductivity material, and the stage movable part of the stage apparatus according to the second embodiment. FIG. 5A is a perspective view illustrating the configuration of the auxiliary member, the wiring / pipe, and the surrounding member that surrounds the outer periphery of the auxiliary member of the stage device according to the third embodiment. FIG. 5B is a perspective view for explaining the relationship among the auxiliary member, the wiring, the heat insulating material (high heat conductive material), and the surrounding member that surrounds the outer periphery of the auxiliary member of the stage device of the third embodiment. It is a figure explaining the arrangement | positioning relationship of the wiring and piping arrange | positioned in the auxiliary member of the stage apparatus in Example 4. FIG. It is the figure which showed the conventional structure regarding the stage movable part periphery of a stage apparatus. It is the figure explaining the exhaust structure of the stage movable part periphery in Example 4. FIG. It is the figure explaining the exhaust structure of the stage movable part periphery in Example 5. FIG. 6 is a flowchart for explaining device manufacturing using the stage apparatus and the exposure apparatus of any one of Embodiments 1, 2, and 3. 6 is a detailed flowchart relating to the wafer process in Step 4 in the flowchart shown in FIG. 5.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

Example 1
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings of FIGS.

  FIG. 1 is a perspective view showing a configuration of a stage apparatus that sequentially and continuously moves a wafer for each exposure. FIG. 2 shows a configuration of an exposure apparatus that sequentially and continuously moves a wafer for each exposure using the stage of FIG. As shown in FIG. 1, the stage device 75 includes a stage movable unit 11 that can move in a two-dimensional direction on the stage surface plate 12 in a non-contact manner. The illuminance sensor 63 provided on the upper surface of the stage movable unit 11 measures the illuminance of the exposure light for calibration before exposure, and uses the measurement result for correcting the exposure amount. On the other hand, the wafer transfer robot 77 supplies the wafer 64 to the stage device 75. A reticle stage 72 on which a reticle, which is an original exposure pattern, scans the reticle with respect to the wafer 64 at a predetermined reduced exposure magnification ratio. The reduction projection lens 73 reduces and projects the original pattern onto the wafer 64. In addition, a resist that chemically changes when irradiated with exposure light is applied to the surface of the wafer 64 made of single crystal silicon. In this embodiment, the exposure target is described as a wafer, but a liquid crystal substrate or the like may be used, and the target is not limited.

  The exposure apparatus main body 74 supports the reticle stage 72, the reduction projection lens 73, and the stage apparatus 75. The focus scope 76 performs focus measurement of the wafer 64. The alignment scope 78 measures an alignment mark (not shown) created on the wafer 64 and a reference mark (not shown) placed on the stage, and performs measurement when performing alignment of the wafer 64 and alignment between the reticle and the wafer 64. It is a microscope.

  A mounting component 22 such as wiring or piping is connected to the stage movable portion 11, and the mounting component 22 is connected to a power / signal power source 14 fixed on the stage surface plate. The power source 14 may be fixed to a member other than the stage surface plate 12, and the mounting component 22 may be connected to a fixing member other than the power source 14. The mounting component 22 is flexibly held by the auxiliary member 13.

  Main components of the mounting component 22 include driving power lines and control lines, signal lines for transmitting various sensor outputs, refrigerant piping for temperature control of driving units, compressed air used for various bearings, and the like. Is mentioned.

  The position of the stage movable part 11 in the X and Y directions is measured using a laser interferometer 17 and an interferometer mirror 16 arranged on the stage movable part. Note that the interferometer mirror 16 may be disposed on the stage movable unit 11 and the interferometer 17 may be disposed in a portion corresponding to the interferometer mirror 16 of FIG. The interferometer optical path 15 is arranged on a straight line connecting the interferometer 17 and the interferometer mirror 16, and is used as measurement light. In any case, the interferometer optical path 15 is arranged in the vicinity of the stage movable unit 11 or the auxiliary member 13.

  If the air temperature in the vicinity of the interferometer optical path 15 changes due to the temperature change of the mounting part 22, an interference measurement length error occurs. By suppressing it, it is possible to suppress the measurement error.

  FIG. 3A is a perspective view showing a cross-sectional structure of the auxiliary member 13 that bundles the mounting components 22 and flexibly connects the stage movable unit 11 and the fixed unit. The auxiliary member 13 is a structure whose shape can be freely deformed to some extent while holding piping and wiring such as a cable bear (registered trademark), for example. In other words, the auxiliary member 13 functions as a support guide member that supports and guides piping and wiring. The auxiliary member 13 may partially surround the piping and the wiring 22 or may entirely surround it.

  The mounted component 22 changes in temperature mainly due to the following factors. That is, in the case of a driving wiring, heat is generated by the electrical resistance of the wiring itself when supplying a current to the driving unit, thereby causing an increase in the temperature of the wiring. In addition, the temperature of the refrigerant whose temperature is controlled by the drive unit is increased by the amount of heat recovered from the drive unit, and naturally the temperature of the refrigerant pipe through which the refrigerant flows increases. Alternatively, in order to improve the temperature control efficiency, the temperature of the refrigerant supplied to the drive unit or the like may be set lower than the stage reference temperature (including the ambient temperature around the stage). In that case, the temperature of the refrigerant pipe decreases. Invite.

  For this reason, in this embodiment, a heat insulating material 23 is provided between the mounting component 22 and the inner surface of the auxiliary member 13, thereby suppressing the temperature of the mounting component 22 from changing and transferring heat to the auxiliary member 13. That is, the heat insulating material 23 prevents heat from the mounting component 22 from leaking to the external atmosphere (the atmosphere on the stage surface plate 12) including the interferometer optical path 15.

  As shown in FIG. 3A, the heat insulating material 23 is attached to the inner walls on the left and right side surfaces of the auxiliary member 13 and the inner walls on the upper and lower surfaces of the auxiliary member 13. The heat insulating material should just be arrange | positioned at the auxiliary member 13 so that the heat transmitted from piping or wiring to the space where the measurement light of an interferometer passes may be reduced. Furthermore, if a heat insulating material is arrange | positioned between wiring and piping, the heat transmitted to space can be reduced more. A material having a thermal conductivity of 0.1 W / m · ° C. or less is preferably used as the material of the heat insulating material 23. Moreover, as a material of the heat insulating material 23, a material having a thermal conductivity of ½ or less of that of the auxiliary member may be used. As the heat insulating material 23, one having a thickness of 0.5 mm or less is preferably used so as not to lower the flexibility. Further, in this embodiment, since the heat insulating material is not directly attached to the wiring and the piping, the flexibility of the wiring and the piping is not greatly reduced. That is, it is possible to suppress the influence of disturbance force applied to the stage when wiring and piping are bent.

  FIG. 3B is a perspective view showing the relationship between the auxiliary member 13 and the heat insulating material 23. The heat insulating material 23 is divided into, for example, a plurality of parts, each of which is attached to the inner wall of the auxiliary member 13. Such a configuration further promotes the effect of suppressing the above-described decrease in flexibility.

  In addition, the auxiliary member 13 is formed with slits along the vertical direction at a plurality of equally spaced positions in order to improve shape deformability. The heat insulating material 23 is attached to the region of the inner wall surface between the slits. As a mounting method, any mounting method other than bonding with an adhesive may be used.

  When the auxiliary member 13 is composed of a plurality of components, the heat transfer is suppressed by installing a heat insulating material 23 in each component. Furthermore, the heat insulating material 23 is preferably a low friction material, thereby improving the slidability between the wiring and the wiring and the auxiliary member 13 and the slidability between the wiring and the piping. For example, Gore-Tex can be used as a material having the above-described heat insulating properties and slidability.

  According to the present embodiment, since the heat insulating material is arranged so as to reduce the heat transmitted from the mounting component 22 (pipe or wiring) to the space through which the measurement light of the interferometer passes, measurement due to the temperature change of the mounting component 22 The error can be reduced.

  Furthermore, since the heat insulating material is disposed on the auxiliary member 13 in this embodiment, the flexibility of the mounting component 22 can be maintained, and the force applied to the stage movable unit 11 from the mounting component can be suppressed. That is, the positioning accuracy of the stage movable unit 11 can be improved.

(Example 2)
Next, a second embodiment of the present invention will be described. The basic configuration is the same as in FIGS. 1 and 2 as in the first embodiment, but the configuration around the auxiliary member 13 is slightly different from that in the first embodiment.

  FIG. 4 is a perspective view showing the configuration around the auxiliary member 13 of the stage device 75, and FIG. 4A is a cross-sectional view showing the configuration including the auxiliary member 13 and the internal mounting component 22. In the present embodiment, similarly to the first embodiment, the mounting component 22 is held by the auxiliary member 13. In the left and right side portions between the mounting component 22 and the auxiliary member 13, a flexible plate-like high heat conductive material 32 is disposed.

  For example, the highly heat-conductive material 32 has a high conductivity such that the thermal conductivity is 10 W / (m · K) or more in the plane direction and the thermal conductivity is low in the thickness direction. Etc.

  FIG. 4B is an explanatory diagram for explaining the relationship between the auxiliary member 13 and the cooling device 34. The heat of the mounting component 22 is removed by the cooling device 34 through the high heat conductive material 32. The cooling device may include, for example, a circulation mechanism for circulating the refrigerant. Further, it is desirable that the cooling device is installed not near the movable stage 11 but near the power / signal power source 14 (see FIG. 1) so as not to hinder the movement.

  When conducting heat to the cooling device 34 using the high thermal conductive material 32, the heat is prevented from leaking to the external atmosphere (the atmosphere on the stage surface plate 12) including the interferometer optical path 15.

  In other words, the heat transferred from the stage movable unit 11 to the power / signal power source 14 through the high heat conductive material 32 is removed (heat absorption) by the cooling device 34.

  The high heat conductive material 32 and the cooling device 34 may be disposed on the auxiliary member 13 so as to reduce heat transmitted from the mounting component 22 to the space in which the measurement optical path 15 of the interferometer is disposed. In the present invention, since the high thermal conductive material 32 is not directly attached to the mounting component 22, the flexibility of the mounting component 22 is not greatly reduced. That is, the influence of the disturbance force applied to the stage movable unit 11 when the mounting component 22 is bent can be suppressed.

  Since the high heat conductive material 32 is a low friction material and improves the slidability of the auxiliary member 13 and the piping and wiring 22, the influence on the deformability (mobility) of the mounting component 22 and the auxiliary member 13 is small. 4B shows a state in which the high heat conductive material 32 is exposed in the vicinity of the cooling device 34 for convenience of explanation, this portion may also be completely surrounded by the auxiliary member 13. Of course.

According to the present embodiment, the heat recovery unit is arranged so as to reduce the heat transmitted from the mounting component (wiring or piping) 22 to the space through which the measurement light of the interferometer passes. Measurement error can be reduced. Here, the heat recovery unit further includes a high heat conductive material 32 disposed on the auxiliary member 13 and a cooling device 34 for cooling the high heat conductive material 32. In this embodiment, the high heat conductive material is a part of the heat recovery unit. Since 32 is arrange | positioned at the auxiliary member 13, the softness | flexibility of the mounting component 22 can be maintained and the force applied to the stage movable part 11 from a mounting component can be suppressed. That is, the positioning accuracy of the stage movable unit 11 can be improved.

(Example 3)
Next, a third embodiment of the present invention will be described with reference to FIG. Also in this embodiment, the basic configuration is based on FIGS. 1 and 2 as in the first embodiment, and the configuration around the auxiliary member 13 is different from those in the first and second embodiments.

  FIG. 5 is a perspective view showing the configuration around the auxiliary member of the stage device 75, and FIG. 5A is a cross-sectional view showing the configuration including the auxiliary member 13 and the internal mounting component 22. The surrounding member 41 that wraps around the outer periphery of the auxiliary member 13 that holds the mounting component 22 through a certain gap is a member that has good flexibility and heat insulation, such as a bellows structure.

  A gap is formed between the auxiliary member 13 and the surrounding member 41 that surrounds the outer periphery of the auxiliary member 13 to form a heat exhaust space 43. Thereby, the heat accompanying the temperature change of the mounting component 22 is exhausted together via the temperature-changed gas, and the heat is prevented from leaking around the stage movable part 11 including the interferometer optical path 15 (see FIG. 2). . Here, the purpose of the heat exhaust space 43 is to exhaust the heat from the mounting component 22 through the surrounding member 41 without leaking to the periphery of the stage movable portion 11, and the mounting component 22 and the surrounding member 41 covering it. It is sufficient if there is a space through which gas such as air flows. Therefore, when the mounting component 22 can stand up and be routed, the auxiliary member 13 may not be provided, and the presence or absence of the auxiliary member 13 is not limited. In addition, if there is a member having both the function of the auxiliary member 13 (holding the mounting component flexibly) and the function of the surrounding member 41 (covering the mounting component 22), the member is arranged around the mounting component 22. But it ’s okay.

  Exhaust in the heat exhaust space 43 is performed by installing an intake mechanism (not shown) such as a fan or a vacuum pump in the stage fixing portion and appropriately connecting it to the end of the surrounding member 41, for example. Is heat exhausted so as not to affect the periphery of the stage movable unit 11.

  FIG. 5B is a cross-sectional view showing a configuration combined with the form of the second embodiment regarding a portion including the auxiliary member 13 and the internal mounting component 22.

  Further, in this embodiment, the heat insulating material 23 or the high thermal conductive material 32 is installed along the arrangement in the vertical direction of the mounted components 22 (in the figure, an example in which the heat insulating material 23 is arranged), so that heat to the interferometer measurement space is obtained. Efficiently suppress the movement of

  When the high heat conductive material 32 is used along the mounting component 22 in the auxiliary member 13, it is preferable to improve the exhaust heat effect using the cooling device 34 as in the second embodiment.

  Needless to say, the configuration of the heat insulating material 23 or the high thermal conductive material 32 along the vertical arrangement of the mounted components 22 may be applied to the first and second embodiments.

  According to the present embodiment, since the heat recovery unit is arranged so as to reduce the heat transmitted from the mounting component 22 to the space through which the measurement light of the interferometer passes, the measurement error due to the temperature change of the mounting component 22 is reduced. be able to. Here, the heat recovery unit includes an enclosing member 41 that covers the auxiliary member 13 and an exhaust unit that exhausts the internal space of the enclosing member 31.

  According to such a configuration, the flexibility of the mounting component 22 can be maintained by the auxiliary member 13 and heat from the mounting component 22 can be recovered.

  Further, in addition to the configurations of the first and second embodiments, the surrounding member 41 and exhaust means for exhausting the internal space of the surrounding member 31 may be provided.

Example 4
Next, a fourth embodiment will be described with reference to FIG. Also in the present embodiment, the basic configuration is based on FIGS. 1 and 2 similarly to the first embodiment, and is a further developed form of the first embodiment with respect to the configuration around the auxiliary member 13.

  The mounted parts drawn around the movable stage 11 are roughly classified as follows. There are a drive wiring 22a that may generate heat and a return pipe 22c for refrigerant that may cause a temperature rise. On the other hand, a sensor output transmission wiring 22a that can ignore temperature changes, and a temperature control. There is also a refrigerant supply pipe 22b through which the refrigerant flows and the temperature change can be ignored. Therefore, in this embodiment, in order to suppress the influence on the atmosphere of the interferometer optical path 15 as much as possible, the arrangement of the mounting component 22 is devised in consideration of the characteristics of each mounting component as described above.

  In FIG. 6, mounting components (wiring 22 a and refrigerant return pipe 22 c) that generate heat or change in temperature are not arranged outside the mounting bundle, but are arranged as much as possible inside. In FIG. 6, the hatched pipes indicate the refrigerant return pipe 22 c, and the refrigerant that has recovered the heat generated from the drive unit and the like flows and the temperature is expected to rise. It shows how it is. On the other hand, the refrigerant supply pipe 22b through which the temperature-controlled refrigerant flows is arranged on the outer peripheral portion of the mounting bundle because the temperature is stable. If the refrigerant return pipe 22c has a small temperature change and a slight influence, the refrigerant return pipe 22c may be arranged on the outer periphery. The gist of the present invention is to arrange a pipe having a stable temperature outside the mounting bundle (portion forming the outer peripheral portion). In addition, here, the refrigerant supply pipe 22b having a stable temperature is disposed outside the mounting bundle to stabilize the outside temperature of the mounting bundle, but of course, a dedicated temperature controlled temperature is provided on the outer periphery of the mounting bundle. It does not matter if the piping is routed.

  On the other hand, the following mounting components are positively arranged inside the mounting bundle. The mounted components are the drive wiring 22a in which the temperature rise is expected due to the wiring heat generation due to the current, the refrigerant return pipe 22c in which the temperature rise is expected because the refrigerant recovered from the heat generation of the drive unit flows.

  If the influence on the vicinity of the interferometer optical path 15 is taken into consideration, the effect can be expected only by arranging a temperature-stable refrigerant pipe on at least the surface facing the interferometer optical path 15. In the mounting bundle of FIG. 6, the interferometer optical path 15 is arranged in the + Z direction of the mounting bundle (auxiliary member 13) as shown in FIG. That is, the temperature change of the upper surface (+ Z surface) of the mounting bundle in FIG. Therefore, it is desirable to arrange a refrigerant pipe (refrigerant supply pipe 22b or dedicated temperature control pipe) with a stable temperature at least on the outer peripheral portion near the upper surface of the mounting bundle. If the design allows, it is more desirable to arrange refrigerant pipes with stable temperatures on the outer periphery along the side surfaces (+ X surface and -X surface) and also on the bottom surface (-Z surface). .

  The present embodiment can be applied as the mounting component 22 of the first to third embodiments. That is, a heat insulating material or a heat recovery unit arranged to reduce the heat transmitted from the mounting component 22 to the space through which the measurement light of the interferometer passes is provided, and the mounting component 22 has a temperature-controlled refrigerant inside. The flowing piping is bundled so as to be arranged outside. Thereby, the heat transmitted from the mounting component 22 to the space through which the measurement light of the interferometer passes can be reduced.

(Example 5)
In the first to fourth embodiments, an example has been described in which, among the mounted components connected to the stage movable unit 11, the influence of the temperature change of the mounted components drawn out of the stage movable unit 11 is suppressed.

  In the present embodiment, an example will be described in which the influence on the interferometer optical path 15 of the temperature change of the mounted components arranged on the stage movable unit 11 is suppressed. Also in this embodiment, the basic configuration is based on FIGS. 1 and 2 as in the other embodiments, and is a form developed with respect to the configuration around the stage movable unit 11.

  First, in order to clarify the problem, the influence of the temperature change of the mounted parts in the conventional configuration will be described with reference to FIG. FIG. 7 is a diagram showing the stage movable unit 11 in the conventional configuration. The stage movable unit 11 has a coarse / fine movement configuration, and is mounted on the coarse movement stage (first stage) 91 and the coarse movement stage 91, and moves on the coarse movement stage 91 with a small stroke. 2 stages). FIG. 7A is a view of the stage movable unit 11 as viewed from above, and a part indicated by a dotted line is a group of parts mainly for fine movement arranged between the fine movement stage part 91 and the coarse movement stage part 92. (81, 82, 83). FIG. 7B schematically shows a cross-sectional view of the movable stage 11 cut along the Y-axis direction near the center of the wafer 64. An auxiliary member 13 is connected to the stage movable portion 11, and the mounting component 22 described above is disposed on the auxiliary member 13. When moving on the stage surface plate 12 with a large stroke, the movement is performed by the coarse movement stage unit 92, and the fine movement stage unit 91 performs the precise positioning of the wafer 64. The coarse motion stage 92 has a self-weight compensation mechanism 83 for floating the fine motion stage unit 91 in a non-contact manner and a fine motion stage unit 91 for applying acceleration / deceleration force in a non-contact manner when the coarse motion stage unit 92 is accelerated / decelerated. An electromagnetic coupling mechanism 81 is installed. Furthermore, a position sensor 82 for measuring the relative positional relationship between the coarse movement stage unit 92 and the fine movement stage unit 91 is also installed.

  Here, the mounted component connected to the stage movable unit 11 is pulled out of the stage movable unit through the stage movable unit. A mounting component 85 in the figure is a pipe or wiring that passes through the stage movable unit 11. Usually, the mounting component 85 (FIG. 7A is not shown) is an area sandwiched between the fine movement stage portion 91 and the coarse movement stage portion 92 as shown in FIG. 82, 83) and is often arranged in an area where the air flow is poor. The arrows in FIG. 7 indicate the air flow in the gap between the stage fine movement portion 91 and the stage coarse movement portion 92. That is, since the air flow is poor, for example, when the temperature of the mounting component 85 rises, the air around the mounting component 85 is warmed, and the air whose temperature has risen gradually flows around the stage movable unit 11 due to the influence of buoyancy. Therefore, the air temperature in the vicinity of the interferometer mirror 16 installed on the stage movable unit 11, that is, the air temperature of the interferometer optical path 15 changes, and an interference measurement length error occurs. In addition, if the air whose temperature has increased stays between the fine movement stage unit 91 and the coarse movement stage unit 92, heat is also transmitted from the warmed air to the fine movement stage unit 91 that requires precise positioning. The stage portion 91 is thermally deformed. Due to this thermal deformation, there is a concern that the positioning accuracy of the stage is deteriorated and the exposure accuracy is accordingly deteriorated.

  That is, the air temperature around the mounting component 85 changes due to the temperature change of the mounting component 85, but it is required to suppress the air from flowing into the interferometer optical path 15. Furthermore, it is required that the temperature-changed air does not stay between the fine movement stage unit 91 and the coarse movement stage unit 92.

  Considering the above, this embodiment has a configuration as shown in FIG. FIG. 8 is a diagram showing the stage movable unit 11 as in FIG. In addition to the configuration of FIG. 7, the air whose temperature has changed with the temperature change of the mounting member 85 (FIG. 8A not shown) disposed between the fine movement stage portion 91 and the coarse movement stage portion 92 is changed. A vacuum suction port (exhaust port) is provided for positive suction. In this embodiment, the vacuum suction pipe 86 is mounted so that the vacuum suction ports can be disposed at four positions between the fine movement stage portion 91 and the coarse movement stage portion 92 in consideration of the placement of the mounting component 85 and the like. The vacuum suction pipe 86 is mounted together with a mounting component disposed on the auxiliary member 13 and is connected to an exhaust means such as a vacuum pump or a suction fan outside the stage movable unit 11. As a result, the air whose temperature has changed due to the influence of the mounted components is forcibly collected at the vacuum suction port and moved to a place that does not affect the positioning accuracy. The arrows in the figure indicate the air flow in the space between the stage fine movement portion 91 and the stage coarse movement portion 92. Further, since the air conditioned around the stage movable unit 11 flows in by the amount of air sucked in by the vacuum suction port, the air can flow more than the conventional configuration, and the fine movement stage unit 91 and the coarse movement stage unit 92 are between. The air conditioning performance of the space is improved. As a result, the air whose temperature has changed between the fine movement stage unit 91 and the coarse movement stage unit 92 does not flow out to the interferometer optical path 15 and does not remain for a long time.

  Here, when a drive unit or a sensor is arranged in the space between the coarse movement stage 92 and the fine movement stage 91, the temperature change occurs not only by the mounting component 85 but also by the drive unit and the sensor. The configuration of is effective.

  In the present embodiment, the mounting component 22 is pulled out of the stage movable unit 11 through the space in the stage movable unit 11, and heat transmitted from the mounting component 22 in this space to the space through which the measurement light of the interferometer passes is reduced. A heat recovery unit is arranged in Here, the heat recovery unit includes an exhaust unit that exhausts the space in the stage movable unit 11, thereby reducing the heat transmitted by the gas whose temperature has changed in the space flowing out to the space through which the measurement light of the interferometer passes. Can do. In addition, the space in the stage movable part 11 is preferably a space surrounded by the members constituting the stage movable part 11, for example, means a space between the coarse movement stage and the fine movement stage, but the coarse movement and the fine movement are integrated. In the case of a structure, it may be a hollow interior.

(Example 6)
Next, an embodiment in which the configuration shown in Example 5 is further developed will be described below. Also in this embodiment, the basic configuration is based on FIGS. 1 and 2 as in the other embodiments, and is a form developed with respect to the configuration around the stage movable unit 11. Parts not particularly mentioned in the present embodiment are the same as those in the fifth embodiment. FIG. 9 is a diagram for explaining this embodiment, and shows a configuration in which an exhaust port member 87 having an exhaust port is added to the side portion of the stage movable unit 11 shown in FIG. The exhaust port member 87 is a component having a pressure adjusting component 88 so that the air in the gap between the fine movement stage portion 91 and the coarse movement stage portion 92 can be exhausted uniformly and efficiently. The pressure adjusting component 88 adjusts the pressure in the exhaust port member so that the exhaust can be uniformly exhausted over the entire exhaust port. Thereby, it is suppressed that the exhaust gas flow rate is biased in the exhaust port. Specifically, it may be a pressure loss adjusting filter or a plate member provided with a plurality of holes over the entire exhaust port. The exhaust port member 87 is fixed to the coarse movement stage 92 so as not to affect the fine movement positioning of the wafer.

  The exhaust port member 87 is connected to the thermal exhaust space 43 formed by the gap between the auxiliary member 13 and the surrounding member 41 described in the third embodiment, and this does not affect the positioning of the stage movable unit 11. The exhausted air is moved to the location. In the configuration of the fifth embodiment, air whose temperature has been locally changed is exhausted to the outside of the stage movable portion 11, whereas in the configuration of the present embodiment, the space between the stage fine movement portion 91 and the stage coarse movement portion 92 is exhausted. Is exhausted as a whole. The arrows in FIG. 9 indicate the air flow in the space between the stage fine movement unit 91 and the stage coarse movement unit 92. With the configuration of this embodiment, the air flow is uniform, and the exhaust effect of the space between the stage fine movement portion 91 and the stage coarse movement portion 92 is higher.

  Here, the same effect can be expected even if the exhaust port member 87 is connected to the vacuum suction pipe 86 disposed in the auxiliary member 13 and exhausted out of the stage movable portion 11 as described in the fifth embodiment.

  In this embodiment, the pipe or wiring 22 is drawn out of the stage movable part 11 through the space in the stage movable part 11, and heat transmitted to the space through which the measurement light of the interferometer passes from the pipe or wiring 22 in this space is reduced. A heat recovery unit is arranged to do so. Here, the heat recovery unit includes an exhaust unit that exhausts the space in the stage movable unit 11, thereby reducing the heat transmitted by the gas whose temperature has changed in the space flowing out to the space through which the measurement light of the interferometer passes. Can do. In addition, the space in the stage movable part 11 is preferably a space surrounded by the members constituting the stage movable part 11, for example, means a space between the coarse movement stage and the fine movement stage, but the coarse movement and the fine movement are integrated. In the case of a structure, it may be a hollow interior.

  In the first to sixth embodiments, the stage apparatus applied to the exposure apparatus has been described. However, the stage apparatus is not limited to when applied to an exposure apparatus. Further, the stage apparatus may be a stage apparatus having a guide other than the planar motor type. According to the exposure apparatus of the present embodiment, the measurement error due to the temperature change of the measurement optical path of the interferometer can be reduced and the positioning accuracy of the stage movable unit 11 can be improved. As a result, the exposure accuracy can be improved. .

(Example 7)
(Example of device manufacturing method)
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described with reference to FIGS.

  FIG. 9 is a flowchart for explaining how to fabricate devices (ie, semiconductor chips such as IC and LSI, LCDs, CCDs, and the like). Here, a semiconductor chip method will be described as an example. In step S1 (circuit design), a semiconductor device circuit is designed. In step S2 (mask production), a mask is produced based on the designed circuit pattern.

  In step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by using the mask and the wafer by the above-described exposure apparatus using the lithography technique.

  Step S5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer manufactured in step S4. The assembly process includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including.

  In step S6 (inspection), inspections such as an operation check test and a durability test of the semiconductor device manufactured in step S5 are performed. Through these steps, the semiconductor device is completed and shipped (step S7).

  FIG. 10 is a detailed flowchart of the wafer process in Step 4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer.

  In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist process), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed on the wafer by the exposure apparatus.

  In step S17 (development), the exposed wafer is developed. In step S18 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), the resist that has become unnecessary after the etching is removed.

  By repeatedly performing these steps, multiple circuit patterns are formed on the wafer.

  In this device manufacturing method, since an exposure apparatus to which any of the stage apparatuses of the first, second, and third embodiments that prevent the positioning accuracy of the stage movable unit 11 is applied is used, a highly reliable device is stabilized. Can be manufactured.

DESCRIPTION OF SYMBOLS 11 Stage movable part 12 Stage surface plate 13 Auxiliary member 14 Power / signal power source 15 Interferometer optical path 16 Interferometer mirror 22 Mounted part 22a Wiring 22b Refrigerant supply piping 22c Refrigerant return piping 23 Heat insulating material 31 Piping and wiring 32 High heat conduction material 41 Enclosure Member 43 Thermal exhaust space 63 Illuminance sensor 64 Wafer 71 Illumination system unit 72 Reticle stage 73 Reduction projection lens 74 Exposure device main body 75 Stage device 76 Focus scope 77 Wafer transfer robot 78 Alignment scope 81 Electromagnetic coupling 82 Sensor 83 Self-weight compensation mechanism 85 Mounting parts 86 Vacuum suction piping 87 Exhaust port parts 88 Pressure adjusting parts 91 Fine movement stage part 92 Coarse movement stage part

Claims (10)

A stage movable unit that can move in a non-contact manner on a surface plate, an interferometer that measures the position of the stage movable unit, and a pipe or wiring connected to the stage movable unit,
An auxiliary member for holding piping or wiring drawn out of the stage movable part;
An enclosure member that covers the auxiliary member; and an exhaust unit that exhausts the internal space of the enclosure member, and is arranged to reduce heat transmitted from the pipe or wiring to a space through which the measurement light of the interferometer passes. A stage apparatus comprising a heat recovery unit. The piping or wiring has a plurality of piping or wiring,
The stage apparatus according to claim 1, wherein the stage apparatus is bundled so that a pipe through which the temperature-controlled refrigerant flows is arranged outside. The piping or wiring is drawn out of the stage movable part through the space in the stage movable part,
The stage apparatus according to claim 1, wherein the exhaust unit exhausts a space in the stage movable unit.   The stage movable part includes a first stage and a second stage mounted on the first stage and moving with a movement stroke shorter than the movement stroke of the first stage, and the space exhausted by the exhaust means is: The stage apparatus according to claim 1, wherein the stage apparatus is a space between the first stage and the second stage.   The stage apparatus according to claim 4, further comprising an exhaust port member fixed to the first stage and facing the space.   The stage apparatus according to claim 5, wherein the exhaust port member is provided on a side portion of the stage movable portion. A surface plate,
A first stage movable along the surface of the surface plate;
A stage movable unit including a second stage mounted on the first stage and movable with respect to the first stage;
An interferometer for measuring the position of the stage movable part;
Wiring or piping connected to the first or second stage and drawn out of the stage movable part through a space between the first stage and the second stage;
An exhaust unit for exhausting the space;
A stage apparatus comprising:   The stage apparatus according to any one of claims 1 to 7, further comprising a planar motor that drives the stage movable unit.   An exposure apparatus for positioning a substrate or an original using the stage apparatus according to claim 1.   A device manufacturing method comprising: exposing a substrate using the exposure apparatus according to claim 9; and developing the exposed substrate.

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