JP5316782B2 - Method for manufacturing liquid jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid ejection head which includes a piezoelectric actuator with a high reliability, and to provide a method for manufacturing the same and a liquid ejection apparatus. <P>SOLUTION: The liquid ejection head includes: pressure chambers 11 communicated with nozzle holes for ejecting a liquid; a diaphragm with first regions 33 overlapped with the pressure chambers 11; a first conductive layer with a first conductive part formed inside the first region 33 and a second conductive part formed outside the first region 33; a piezoelectric layer 50 formed to cover the first conductive layer; a second conductive layer 60 formed to cover a part of the piezoelectric layer 50 and to overlap at least a part of the first conductive part; and opening parts 54 separated from the second conductive layer 60 in the piezoelectric layer 50 and located on the second conductive part. The liquid ejection head includes a first protecting film 80 comprised of an electric insulating film formed to cover at least a part of where the second conductive layer 60 is not formed above in the piezoelectric layer 50. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a liquid ejecting head, a manufacturing method thereof, and a liquid ejecting apparatus.

  For example, in a liquid ejecting apparatus such as an ink jet printer, a liquid ejecting head including a piezoelectric actuator is known for ejecting liquid droplets such as ink. Such a liquid ejecting head can change the pressure in the pressure chamber formed below the piezoelectric actuator, for example, by displacing the piezoelectric element of the piezoelectric actuator by a drive signal or the like. As a result, droplets such as ink supplied from the nozzle holes into the pressure chamber can be ejected. Such a liquid jet head has a structure in which the piezoelectric layer is covered with an upper electrode for the purpose of protecting the piezoelectric layer of the piezoelectric element that is weak against external factors such as moisture (patent) Reference 1). In such a liquid ejecting head, a liquid ejecting head having a highly reliable piezoelectric actuator that is more resistant to external factors such as moisture and does not cause physical problems such as cracks in a diaphragm during operation. Is desired.

JP 2005-88441 A

  An object of the present invention is to provide a liquid ejecting head having a piezoelectric actuator with high reliability.

  An object of the present invention is to provide a method of manufacturing a liquid jet head having a piezoelectric actuator with high reliability.

  One object of the present invention is to provide a liquid ejecting apparatus having the liquid ejecting head.

(1) A liquid jet head according to the present invention includes:
A pressure chamber plate having a pressure chamber communicating with a nozzle hole for injecting liquid;
A vibration plate formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; A diaphragm having a first region that overlaps the pressure chamber;
A first conductive layer formed on the second surface so as to extend in a first direction, wherein the first conductive layer is formed in the first region and the first conductive layer is formed outside the first region. A first conductive layer having two conductive portions;
A piezoelectric layer formed to cover the first conductive layer;
A second conductive layer that covers a portion of the piezoelectric layer and is formed to overlap at least a portion of the first conductive portion;
In the piezoelectric layer, an opening spaced apart from the second conductive layer and positioned on the second conductive portion;
Have
The piezoelectric layer includes a first protective film made of an electrically insulating film formed to cover at least a part of a portion where the second conductive layer is not formed above.

  In the description of the present invention, the word “upper” is, for example, “forms another specific thing (hereinafter referred to as“ B ”)“ above ”a specific thing (hereinafter referred to as“ A ”)”. Etc. In the description according to the present invention, in the case of this example, the case where B is directly formed on A and the case where B is formed on A via another are included. The word “upward” is used. Similarly, the term “below” includes a case where B is directly formed under A and a case where B is formed under another through A.

  According to the present invention, it is possible to provide a liquid ejecting head having a highly reliable piezoelectric actuator.

(2) The liquid jet head according to the present invention is
A pressure chamber plate having a plurality of pressure chambers in communication with nozzle holes for injecting liquid;
A vibration plate formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; A diaphragm having a first region overlapping each of the plurality of pressure chambers,
A first conductive layer formed on the second surface so as to extend in a first direction, wherein the first conductive layer is formed in the first region and the first conductive layer is formed outside the first region. A plurality of first conductive layers having two conductive portions;
A piezoelectric layer formed to cover each of the plurality of first conductive layers;
A second conductive layer covering a part of the plurality of piezoelectric layers and continuously formed to overlap at least a part of the plurality of first conductive parts;
In the plurality of piezoelectric layers, openings spaced apart from the second conductive layer and positioned on the second conductive portion,
Have
The piezoelectric layer includes a first protective film made of an electrically insulating film formed to cover at least a part of a portion where the second conductive layer is not formed above.

  According to the present invention, it is possible to provide a liquid ejecting head having a highly reliable piezoelectric actuator.

(3) In the liquid jet head according to the present invention,
The first protective film may overlap at least a part of the second conductive layer formed on the piezoelectric layer.

(4) In the liquid jet head according to the present invention,
In the piezoelectric layer, when a region sandwiched between the first conductive layer and the second conductive layer is a driving region,
A second protective film may be included on the second conductive layer so as to overlap with at least a part of the driving region and to be separated from the first protective film.

(5) In the liquid jet head according to the present invention,
The first protective film and the second protective film may be a photosensitive resin.

(6) In the liquid jet head according to the present invention,
The first protective film and the second protective film may be aluminum oxide.

(7) In the liquid jet head according to the present invention,
A third conductive layer formed to cover at least the opening;
A fourth conductive layer electrically connected to the third conductive layer;
May further be included.

(8) A liquid ejecting apparatus according to the present invention includes:
Any one of the above liquid jet heads is provided.

  According to the present invention, it is possible to provide a liquid ejecting apparatus having a highly reliable piezoelectric actuator.

(9) A method for manufacturing a liquid jet head according to the present invention includes:
Forming a pressure chamber plate having a pressure chamber;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps the pressure chamber on the surface;
A first conductive layer extending in a first direction on the second surface, the first conductive layer having a first conductive portion formed in the first region and a second conductive portion formed outside the first region. Forming a first conductive layer;
Forming a piezoelectric layer so as to cover the first conductive layer;
Forming a second conductive layer so as to cover a part of the piezoelectric layer and overlap with at least a part of the first conductive part;
Forming an opening spaced apart from the second conductive layer and positioned on the second conductive portion in the piezoelectric layer;
Forming a first protective film made of an electrically insulating film so as to cover at least a part of a portion of the piezoelectric layer where the second conductive layer is not formed above;
Forming a fourth conductive layer electrically connected to the second conductive portion in the opening;
Including
The step of forming the first protective film is performed before the step of forming the fourth conductive layer.

  According to the present invention, it is possible to provide a method for manufacturing a liquid jet head having a highly reliable piezoelectric actuator.

(10) A method for manufacturing a liquid jet head according to the present invention includes:
Forming a pressure chamber plate having a plurality of pressure chambers;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps each of the plurality of pressure chambers,
A first conductive layer extending in a first direction on the second surface, the first conductive layer having a first conductive portion formed in the first region and a second conductive portion formed outside the first region. Forming a plurality of first conductive layers;
Forming a piezoelectric layer so as to cover each of the plurality of first conductive layers;
Forming a second conductive layer so as to cover a part of the plurality of piezoelectric layers and overlap with at least a part of the first conductive part;
Forming a plurality of openings in the plurality of piezoelectric layers spaced apart from the second conductive layer and positioned on the second conductive portion;
Forming a first protective film made of an electrically insulating film so as to cover at least a part of a portion of the piezoelectric layer where the second conductive layer is not formed above;
Forming a fourth conductive layer electrically connected to the second conductive portion in the opening;
Including
The step of forming the first protective film is performed before the step of forming the fourth conductive layer.

  According to the present invention, it is possible to provide a method for manufacturing a liquid jet head having a highly reliable piezoelectric actuator.

(11) In the method of manufacturing the liquid jet head according to the invention,
Forming a third conductive layer so as to cover at least the opening;
The fourth conductive layer may be electrically connected to the second conductive part via the third conductive layer.

(12) In the method of manufacturing a liquid jet head according to the invention,
In the piezoelectric layer, when a region sandwiched between the first conductive layer and the second conductive layer is a driving region,
Forming the first protective film so as to cover a part of the second conductive layer from the piezoelectric layer;
Forming a second protective film on the second conductive layer, overlapping a part of the driving region and spaced apart from the first protective film in the first direction;
May be included.

(13) In the method of manufacturing a liquid jet head according to the invention,
The step of forming the first conductive layer includes:
Forming a conductive layer on the first region;
Forming an etching protective film on the conductive layer;
Etching the conductive layer after forming the etching protection film,
The etching protective film may be made of a material that forms the piezoelectric layer.

(14) In the method of manufacturing a liquid jet head according to the invention,
The step of forming the piezoelectric layer includes
Forming a piezoelectric layer before etching so as to cover at least the first conductive film;
Forming a conductive mask layer on the piezoelectric layer before the etching process;
Etching the piezoelectric layer after forming the mask layer,
The mask layer may be made of a material that forms the second conductive layer.

FIG. 3 is an exploded perspective view schematically illustrating the liquid ejecting head according to the embodiment. FIG. 3 is a plan view schematically showing a main part of the liquid jet head according to the embodiment. Sectional drawing which shows the principal part in the IIB-IIB line | wire of FIG. 2 (A) typically. Sectional drawing which shows the principal part in the IIC-IIC line | wire of FIG. 2 (A) typically. FIG. 9 is a plan view schematically showing a modification of the main part of the liquid jet head according to the present embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the method for manufacturing the liquid jet head according to the embodiment. FIG. 3 is a perspective view schematically illustrating the liquid ejecting apparatus according to the embodiment.

  An example of an embodiment to which the present invention is applied will be described below with reference to the drawings. However, the present invention is not limited only to the following embodiments. The present invention includes any combination of the following embodiments and modifications thereof.

1. Liquid Ejecting Head Hereinafter, the liquid ejecting head according to the embodiment will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view of a liquid jet head 300 according to this embodiment.

  As shown in FIG. 1, the liquid jet head 300 according to this embodiment includes a pressure chamber plate 10 having a pressure chamber 11, a vibration plate 30 formed above the pressure chamber plate 10, and a vibration plate 30. The formed piezoelectric element 100, the nozzle plate 20 formed below the pressure chamber plate 10, and a sealing plate 90 that seals the piezoelectric element 100 are included.

  The pressure chamber plate 10 has a pressure chamber 11 as shown in FIG. As shown in FIG. 1, the pressure chamber plate 10 has a wall portion 12 that constitutes a side wall of the pressure chamber 11. The pressure chamber plate 10 may have a reservoir 15 that communicates with the pressure chamber 11 via the supply path 13 and the communication path 14. A through hole (not shown) may be formed in the reservoir 15, and liquid may be supplied into the reservoir 15 from the outside through the through hole. According to this, by supplying the liquid to the reservoir 15, the liquid can be supplied to the pressure chamber 11 through the supply path 13 and the communication path 14. The shape of the pressure chamber 11 is not particularly limited. The shape of the pressure chamber 11 may be, for example, a parallelogram in a plan view or a rectangle. The number of the pressure chambers 11 is not particularly limited, and may be one or a plurality. The material of the pressure chamber plate 10 is not particularly limited. The pressure chamber plate 10 may be formed of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like.

  As shown in FIG. 1, the nozzle plate 20 is formed below the pressure chamber 10. The nozzle plate 20 is a plate-like member and has a nozzle hole 21. The nozzle hole 21 is formed so as to communicate with the pressure chamber 11. The shape of the nozzle hole 21 is not particularly limited as long as the liquid can be discharged. Through the nozzle hole 21, the liquid in the pressure chamber 11 can be discharged toward the lower side of the nozzle plate 20, for example. Moreover, the number of the nozzle holes 21 is not specifically limited, One may be sufficient and multiple may be provided. The material of the nozzle plate 20 is not particularly limited. The nozzle plate 20 may be made of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like.

  The diaphragm 30 is formed above the pressure chamber plate 10 as shown in FIG. Therefore, the diaphragm 30 is formed above the pressure chamber 11 and the wall portion 12. The vibration plate 30 is a plate-like member, and has a first surface 31 that faces the pressure chamber plate 10 and a second surface 32 that is a surface opposite to the first surface 31. The structure and material of the diaphragm 30 are not particularly limited. For example, the diaphragm 30 may be formed of a laminate of a plurality of films as shown in FIG. At this time, the diaphragm 30 may be a laminated body of a plurality of films made of, for example, an insulating film such as zirconium oxide or silicon oxide, a metal film such as nickel, and a polymer material film such as polyimide. The diaphragm 30 constitutes a vibration part. In other words, the piezoelectric element 100 described later can be vibrated (displaced) by being displaced. Thereby, the volume of the pressure chamber 11 formed below can be changed.

  The piezoelectric element 100 of the liquid jet head 300 according to the present embodiment is formed on the second surface 32 of the diaphragm 30 as shown in FIG. The piezoelectric actuator 110 of the liquid ejecting head 300 according to the present embodiment includes the piezoelectric element 100 and the diaphragm 30. Hereinafter, the details of the piezoelectric element 100 of the liquid jet head 300 according to the present embodiment will be described with reference to FIGS.

  FIG. 2A is a plan view illustrating only the pressure chamber plate 10, the vibration plate 30, and the piezoelectric element 100, which are the main parts of the liquid ejecting head 300, for convenience. 2B is a cross-sectional view taken along the line IIB-IIB in the main part shown in FIG. 2C is a cross-sectional view taken along the line IIC-IIC of the main part shown in FIG. FIG. 2D is a cross-sectional view schematically showing a modification of the main part of the liquid jet head 300. FIG. 3A to FIG. 3C are plan views schematically showing modifications of the main part of the liquid ejecting head 300.

  Details of the structure of the piezoelectric element 100 will be described below.

  As shown in FIG. 2A to FIG. 2C, the piezoelectric element 100 includes a first conductive layer 40 formed on the diaphragm 30 so as to extend in the first direction 200, in short, A piezoelectric layer 50 formed to cover the first conductive layer 40 and a second conductive layer 60 formed to cover at least a part of the piezoelectric layer 50 are included.

  As shown in FIG. 2A, the diaphragm 30 has a first region 33 (a bold broken line portion in FIG. 2A) on the second surface 32 (see FIG. 2B). The first region 33 is a region that overlaps the pressure chamber 11 on the second surface 32. As shown in FIG. 2A, the first region 33 is formed for each pressure chamber 11. The first region 33 has the same shape as that of the pressure chamber 11 in plan view. In addition, as shown in FIG. 2B, a region overlapping the wall portion 12 of the pressure chamber plate 10 between the adjacent first regions 33 is defined as a second region 34.

  As shown in FIG. 2A, the first conductive layer 40 is formed to extend in the first direction 200 in the first region 33. As shown in FIG. 2A, the first direction 200 is one direction on the second surface 32 and the longitudinal direction of the first region 33. A direction orthogonal to the first direction 200 is defined as a second direction 210. As shown in FIG. 2A, the first conductive layer 40 has an end 41 that is one end in the first direction 200 in the first region 33. Further, as shown in FIG. 2B, the first conductive layer 40 has both end portions in the second direction 210 in the first region 33. As shown in FIG. 2A, the first conductive layer 40 includes a first conductive portion 42 formed in the first region 33 and a first side 33 a that is one short side of the first region 33. , And a second conductive portion 43 extending continuously from the first region 33 to the outside of the first region 33. Therefore, the end portion 41 is an end portion in the first direction of the first conductive portion 42. The first conductive layer 40 is made of a conductive layer, and constitutes a lower electrode in the piezoelectric element 100. The structure and material of the first conductive layer 40 are not particularly limited. For example, the first conductive layer 40 may be formed as a single layer. Alternatively, the first conductive layer 40 may be formed of a stacked body of a plurality of films. The first conductive layer 40 may be a metal layer including any of platinum (Pt), iridium (Ir), gold (Au), and the like, for example.

As shown in FIG. 2A, the piezoelectric layer 50 is formed so as to cover the first conductive layer 40 in the first region 33. As shown in FIG. 2B, the piezoelectric layer 50 has both end portions in the second direction 210 in the first region 33. That is, the piezoelectric layer 50 has a width larger than the width of the first conductive layer 40 and narrower than the width of the first region 33 in the second direction 210. As shown in FIG. 2A, the piezoelectric layer 50 continuously extends along the first direction 200 even outside the first region 33, and the second conductive portion 43 of the first conductive layer 40. It is formed so as to cover. As shown in FIG. 2A, the piezoelectric layer 50 continuously extends outside the first region 33 from the first side 33a and the second side 33b which is the other short side of the first region 33. It may be formed as follows. The shape of the piezoelectric layer 50 is not particularly limited. As shown in FIG. 2B, the piezoelectric layer 50 has an upper surface 51 above the first conductive layer 40 and has a tapered side surface 52 continuous with the upper surface 51. It may be. Further, as shown in FIG. 2D, the side surface 52 does not reach the second surface 32 of the diaphragm 30 and is formed continuously from the first region 33 to the second region 34. The surface 53 may be continuous. The surface 53 is a surface having a height lower than that of the upper surface 51, and the height of the surface 53 can be adjusted to a desired height. In other words, the rigidity of the piezoelectric actuator 110 can be adjusted by adjusting the thickness of the piezoelectric layer 50 on the surface 53 to a desired thickness. The piezoelectric layer 50 is made of a polycrystalline body having piezoelectric characteristics, and can vibrate when applied in the piezoelectric element 100. The structure and material of the piezoelectric layer 50 are not particularly limited as long as they have piezoelectric characteristics. The piezoelectric layer 50 may be formed of a known piezoelectric material, such as lead zirconate titanate (Pb (Zr, Ti) O ₃ ), bismuth sodium titanate ((Bi, Na) TiO ₃ ), or the like. It may be used.

  In addition, as shown in FIGS. 2A and 2C, the piezoelectric layer 50 has a part of the second conductive portion 43 exposed on the second conductive portion 43 of the first conductive layer 40. Such an opening 54 is provided. The position of the opening 54 is not particularly limited as long as it is located on the second conductive portion 43 and separated from the second conductive layer 60 described later. The shape of the opening 54 is not particularly limited as long as the first conductive layer 40 as the second conductive portion can be exposed.

  As shown in FIG. 2A, the second conductive layer 60 overlaps with the first conductive layer 40 including the end portion 41 and covers a part of the piezoelectric layer 50 in the first region 33. Formed. The second conductive layer 60 is formed to have one end 61 in the first direction 200 in the first region 33. The second conductive layer 60 may be continuously formed in the second direction 210 so as to cover a part of the plurality of piezoelectric layers 50 in FIG. Further, as shown in FIG. 2B, the second conductive layer 60 is formed by continuously connecting the upper surface 51 and the side surface 52 of the piezoelectric layer 50 in a part of the piezoelectric layer 50 in the second direction 210. Can be covered. At this time, as shown in FIG. 2A, the end 61 may be continuously formed on the plurality of piezoelectric layers 50. As shown in FIGS. 2B and 2C, the second conductive layer 60 is formed in the first region 33 so as to overlap the first conductive layer 40 including the end portion 41. The As a result, a partial region of the piezoelectric layer 50 in the first region 33 is sandwiched between the first conductive portion 42 and the second conductive layer 60 of the first conductive layer 40. At this time, a region sandwiched between the first conductive layer 40 and the second conductive layer 60 in the piezoelectric layer 50 is defined as a drive region 55. As shown in FIG. 2C, the position of one end 55 a in the first direction 200 of the drive region 55 can be defined by the position of the end 61 of the second conductive layer 60. Further, the position of the other end 55 b in the first direction 200 of the drive region 55 can be defined by the position of the end 41 of the first conductive layer 40. As shown in FIG. 2A, the second conductive layer 60 may be formed so as not to overlap the first side 33 a of the first region 33. The structure and material of the second conductive layer 60 are not particularly limited. For example, the second conductive layer 60 may be formed as a single layer. Alternatively, the second conductive layer 60 may be formed of a stacked body of a plurality of films. The second conductive layer 60 is made of a conductive layer, and constitutes an upper electrode in the piezoelectric element 100. The second conductive layer 60 may be a metal layer including, for example, platinum (Pt), iridium (Ir), gold (Au), and the like. Although not shown, the second conductive layer 60 may be connected to, for example, a ground circuit or the like via a wiring or continuously. The second conductive layer 60 can completely cover the portion including the drive region 55 of the piezoelectric layer 50 in the second direction 210. According to this, since the piezoelectric layer 50 in the drive region 55 can be protected from the influence of external factors such as moisture in the atmosphere (humidity), the reliability of the piezoelectric actuator 110 can be improved.

  As shown in FIGS. 2A and 2C, the third conductive layer 67 may be formed to cover at least the opening 54. The third conductive layer 67 may be formed so as to cover at least the second conductive portion 43 (first conductive layer 40) in the opening 54 (not shown). The structure and material of the third conductive layer 67 are not particularly limited. The third conductive layer 67 may be a layer having conductivity and may be the same as the second conductive layer 60. By forming the third conductive layer 67, the surface of the second conductive portion 43 of the first conductive layer 40 in the opening 54 can be protected in the manufacturing process. Details thereof will be described later in the manufacturing method. Further, since the third conductive layer 67 is not an essential component of the piezoelectric element 100 in the present embodiment, even if the third conductive layer 67 is not formed on the first conductive layer 40 in the opening 54. Good (not shown).

  As shown in FIGS. 2A and 2C, the fourth conductive layer 70 is formed so as to be electrically connected to the third conductive layer 67. That is, the fourth conductive layer 70 is electrically connected to the first conductive part 42 via the second conductive part 43. When the third conductive layer 67 is not formed, the fourth conductive layer 70 may be electrically connected to the second conductive portion 43 in the opening 54. 70 may be formed so as to cover at least the opening 54 without passing through the third conductive layer 67. The shape of the fourth conductive layer 70 is not particularly limited as long as it is formed at least in the opening 54. The structure and material of the fourth conductive layer 70 are not particularly limited. For example, the fourth conductive layer 70 may be formed as a single layer. Alternatively, the fourth conductive layer 70 may be formed of a stacked body of a plurality of films. The fourth conductive layer 70 is made of a conductive layer, and constitutes a lead wire to the lower electrode in the piezoelectric element 100. The fourth conductive layer 70 may be a metal layer including, for example, gold (Au), nickel-chromium alloy (Ni-Cr), platinum (Pt), iridium (Ir), and the like. Although not shown, the fourth conductive layer 70 may be connected to an external drive circuit. As a result, the first conductive layer 40 can be electrically connected to, for example, an external drive circuit via the fourth conductive layer 70.

  As shown in FIG. 2C, the first protective film 80 may be formed so as to cover at least a part of the portion of the piezoelectric layer 50 where the second conductive layer is not formed above. In addition, as shown in FIG. 2C, the first protective film 80 may be formed so as to overlap with at least a part of the drive region 55. In other words, as shown in FIG. 2A, a part of one end 80a in the first direction 200 of the first protective film 80 (portion indicated by a thick line in FIG. 2A) is a drive region. 55 may be formed. In other words, it may be formed so as to overlap the end portion 55a. At this time, as shown in FIG. 2C, the first protective film 80 is formed so as to cover the end portion 61 of the second conductive layer 60. As shown in FIG. 2A, the first protective film 80 may be formed so as to continuously cover the first portions 56 of the plurality of piezoelectric layers 50. In addition, the first protective film 80 may be formed so as to continuously cover the end portions 61 formed on the plurality of piezoelectric layers 50. The material of the first protective film 80 is not particularly limited as long as it has electrical insulation and moisture barrier properties. The first protective film 80 may be formed of, for example, an oxide insulating film (inorganic insulating film) such as aluminum oxide, or a polymer material film (organic insulating film) such as polyimide. When the first protective film 80 is a photosensitive resin such as polyimide, the first protective film 80 may be a resist layer used in the manufacturing process. Details will be described later.

  As shown in FIG. 2C, the second protective film 81 overlaps at least a part of the drive region 55 on the second conductive layer 60, and in the first direction 200, the second protective film 81 One protective film 80 may be disposed apart from the protective film 80. In other words, as shown in FIG. 2A, a part of one end portion 81a (a portion indicated by a thick line in FIG. 2A) in the first direction 200 of the second protective film 81 is a drive region. 55 may be formed. In other words, the second protective film 81 may be formed so as to overlap the end portion 55 b of the drive region 55. Further, as shown in FIG. 2C, the plurality of end portions 55b may be continuously formed so as to overlap each other. The material of the second protective film 81 is not particularly limited as long as it has electrical insulating properties and moisture barrier properties. The second protective film 81 may be formed of, for example, an oxide insulating film (inorganic insulating film) such as aluminum oxide or a polymer material film (organic insulating film) such as polyimide. When the second protective film 81 is a photosensitive resin such as polyimide, the second protective film 81 may be a resist layer used in the manufacturing process. Details will be described later. Further, the second protective film 81 may be formed of the same material as the first protective film 80.

  With any of the above configurations, the piezoelectric element 100 and the piezoelectric actuator 110 including the piezoelectric element 100 can be configured.

  As shown in FIG. 1, the liquid ejecting head 300 according to this embodiment may include a sealing plate 90 that can seal the piezoelectric element 100. The sealing plate 90 has a sealing region 91 that can seal the piezoelectric element 100 in a predetermined space region. The sealing region 91 may be a spatial region that does not hinder the vibration motion of the piezoelectric element 100. The structure and material of the sealing plate 90 are not particularly limited. For example, the sealing plate 90 may be formed from, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, or the like. In addition, the liquid ejecting head 300 may include a housing (not shown) that is made of, for example, various resin materials and various metal materials and can accommodate the above-described configuration.

  With any one of the configurations described above, the configuration of the liquid jet head 300 according to the present embodiment can be obtained.

  The liquid ejecting head 300 according to the present embodiment has, for example, the following characteristics.

  According to the liquid jet head 300 according to the present embodiment, the first protective film 80 is formed so as to cover at least a part of the portion of the piezoelectric layer 50 where the second conductive layer is not formed above. The moisture barrier property of the piezoelectric layer 50 can be improved. In addition, physical damage can be prevented by being covered with the first protective film 80.

  Further, according to the liquid jet head 300 according to the present embodiment, the first protective film 80 can cover the end portion 61 of the second conductive layer 60. According to this, peeling of the second conductive layer 60 can be prevented.

  Further, according to the liquid jet head 300 according to the present embodiment, the first protective film 80 overlaps with one end portion 55 a of the drive region 55. According to this, the driving of the piezoelectric actuator 110 can be suppressed by overlapping the first protective film 80 at the end portion 55 a of the driving region 55. At this time, it is possible to enhance the effect of suppressing driving at the end portion 55a by forming the first protective film 80 thicker or suitably using inorganic insulation such as aluminum oxide having a high Young's modulus. As a result, it is possible to prevent physical damage such as cracks from occurring in a member adjacent to the end portion 55a of the drive region 55, for example, the vibration plate 30 or a joint portion between the vibration plate 30 and the pressure chamber substrate 10. be able to.

Further, according to the liquid jet head 300 according to the present embodiment, the second protective film 81 overlaps the end portion 55 b of the drive region 55. According to this, the driving of the piezoelectric actuator 110 can be suppressed by overlapping the second protective film 81 at the end 55 b of the driving region 55. At this time, it is possible to enhance the effect of suppressing driving at the end portion 55b by forming the second protective film 81 thicker and suitably using inorganic insulation such as aluminum oxide having a high Young's modulus. As a result, it is possible to prevent physical damage such as cracks from occurring in a member adjacent to the end portion 55b of the drive region 55, such as the vibration plate 30 or the joint portion between the vibration plate 30 and the pressure chamber plate 10. In addition, according to the liquid jet head 300 according to the present embodiment, the first protective film 80 is formed so as to cover at least a part of the portion of the piezoelectric layer 50 where the second conductive layer is not formed above. Therefore, chemical damage to the piezoelectric layer 50 in the manufacturing process can be avoided. Therefore, since the piezoelectric layer 50 in the portion where the second conductive layer is not formed above is not chemically damaged, the reliability of the piezoelectric actuator 110 can be improved. Details of the manufacturing process will be described later.

  As described above, according to the liquid jet head 300 according to the present embodiment, it is possible to provide a liquid jet head including the piezoelectric actuator 110 with high reliability.

2. Hereinafter, a method for manufacturing a liquid jet head according to the present embodiment will be described with reference to the drawings.

  3 to 10 are cross-sectional views schematically showing a method for manufacturing the liquid jet head 300 according to the present embodiment.

  As shown in FIGS. 3 to 10, the method of manufacturing the liquid jet head according to the present embodiment includes a step of forming a pressure chamber plate 10 having a pressure chamber 11 and a diaphragm formed above the pressure chamber plate 10. 30 having a first surface 31 facing the pressure chamber plate 10 and a second surface 32 opposite to the first surface 31, and overlapping the pressure chamber 11 on the second surface 32. Forming the diaphragm 30 having the first region 33, and the first conductive layer 40 extending in the first direction 200 on the second surface 32, the first conductive layer 40 being formed in the first region 33. Forming the first conductive layer 40 having the first conductive portion 42 and the second conductive portion 42 formed outside the first region 33; and forming the piezoelectric layer 50 so as to cover the first conductive layer 40. A step, covering a part of the piezoelectric layer 50 and at least a part of the first conductive portion 42 A step of forming the second conductive layer 60 so as to be overlapped; and a step of forming an opening 54 spaced apart from the second conductive layer 60 and positioned on the second conductive portion 43 in the piezoelectric layer 50. A step of forming a first protective film 80 made of an electrically insulating film so as to cover at least a part of a portion of the piezoelectric layer 50 where the second conductive layer 60 is not formed above; Forming a fourth conductive layer 70 that is electrically connected to the second conductive portion 43 in 64, and forming the first protective film 80 forms the fourth conductive layer 70. It is performed before the step of performing.

  The method for manufacturing the liquid jet head according to the present embodiment differs depending on whether the material used for forming the pressure chamber plate 10 and the nozzle plate 20 is single crystal silicon or the like, and the case where stainless steel or the like is used. Hereinafter, a method for manufacturing a liquid jet head in the case of using single crystal silicon will be described as an example. The manufacturing method of the liquid jet head according to the present embodiment is not particularly limited to the following manufacturing method, and when nickel, stainless steel, stainless steel, or the like is used as a material, a process such as a known electroforming method may be included. Good. Further, the process after each step is not limited to the manufacturing method described below.

  First, as shown in FIG. 3A, the diaphragm 30 is formed on the prepared substrate 1 made of single crystal silicon. As shown in FIG. 3A, in a manufacturing process to be described later, a region where the pressure chamber 11 of the substrate 1 is formed is defined as a region 11a. The diaphragm 30 is formed by a known film forming technique. As shown in FIG. 3A, for example, the diaphragm 30 is formed by forming the elastic layer 30a constituting the elastic plate by a sputtering method or the like and then forming the insulating layer 30b on the elastic layer 30a by a sputtering method or the like. May be. For example, the elastic layer 30a may use zirconium oxide, and the insulating layer 30b may use silicon oxide. Here, a region that overlaps the region 11 a on the second surface 32 is defined as a first region 33.

  After the diaphragm 30 is formed, the first conductive layer 40 is formed on the second surface 32 of the diaphragm 30 as shown in FIG. Here, the first conductive layer 40 is patterned into a desired shape so as to overlap the region 11a. Thereby, one end 41 in the first direction 200 of the first conductive layer 40 is formed in the first region 33. In addition, a first conductive portion 42 in the first region 33 and a second conductive portion 43 extending outside the first region 33 are formed. Note that the detailed configuration of the first conductive layer 40 has been described above, and will be omitted. The first conductive layer 40 may be formed by a known film formation technique. For example, a conductive layer (not shown) may be formed by stacking platinum, iridium, or the like by a sputtering method or the like, and the first conductive layer 40 may be formed by etching the conductive layer into a predetermined shape.

  Here, as shown in FIG. 3C, an etching protective film 50a may be formed on the conductive layer before the conductive layer for forming the first conductive layer 40 is patterned by etching. Good. The etching protection film 50a may be a piezoelectric layer formed of the same piezoelectric material as the piezoelectric layer 50 described later. The etching protective film 50a may be formed at least in a region where the first conductive layer 40 to be patterned into a desired shape is formed. According to this, in the etching process of patterning the first conductive layer 40, the surface of the first conductive layer 40 can be protected from chemical damage caused by the etchant used.

  Next, as illustrated in FIG. 4A, the piezoelectric layer 50 b is formed so as to cover the first conductive layer 40. The piezoelectric layer 50 is formed by patterning the piezoelectric layer 50b. Details will be described later. The piezoelectric layer 50b may be formed by a known film formation technique. The piezoelectric layer 50b may be formed, for example, by applying a precursor, which is a known piezoelectric material, onto the second surface 32 and performing a heat treatment. The precursor to be used is not particularly limited as long as it is subjected to a polarization treatment after firing by heat treatment and generates piezoelectric characteristics. For example, a precursor such as lead zirconate titanate may be used. When the etching protective film 50a is formed, the etching protective film 50a is formed of the same piezoelectric material as that of the piezoelectric layer 50b (piezoelectric layer 50). 50b can be integrated.

  Here, for example, when the piezoelectric pair layer 50b (piezoelectric layer 50) is formed of lead zirconate titanate, an intermediate titanium layer 50c made of titanium is formed on the second surface 32 as shown in FIG. After forming the entire surface, a precursor which is a piezoelectric material may be applied. According to this, when the piezoelectric layer 50b is crystal-grown by heat treatment of the precursor, the interface for crystal growth of the precursor can be unified with the intermediate titanium layer 50c. In other words, the piezoelectric layer 50b that grows crystals on the vibration plate 30 can be eliminated. Thereby, the controllability of crystal growth of the piezoelectric layer 50b can be enhanced, and the piezoelectric layer 50b can be a piezoelectric crystal with higher orientation. The intermediate titanium layer 50c can be taken into the crystal of the piezoelectric layer 50b during the heat treatment.

  Next, as shown in FIG. 5A, before the piezoelectric layer 50b is patterned into a desired shape by etching, a conductive mask layer 60a is formed so as to cover the piezoelectric layer 50b. Good. The mask layer 60a is a metal layer formed from the same material as the second conductive layer 60 described later. As shown in FIG. 5B, after forming the mask layer 60a, the piezoelectric layer 50b is patterned by etching, and the piezoelectric layer 50 is patterned to a desired formation. Here, since the mask layer 60a functions as a hard mask in the etching process by forming the mask layer 60a, the tapered side surface 52 is easily formed in the piezoelectric layer 50 as shown in FIG. be able to. The detailed configuration of the piezoelectric layer 50 has been described above, and will not be described.

  As shown in FIG. 5C, when the piezoelectric layer 50 is etched, an opening 54 for exposing the first conductive layer 40 is formed on the second conductive portion 43 of the first conductive layer 40 at the same time. The The opening 54 is formed on the second conductive portion 43 so as to be separated from the second conductive layer 60.

  As shown in FIG. 6, a conductive layer 60 b is formed so as to cover the piezoelectric layer 50 and the opening 54. Therefore, the conductive layer 60 b is formed of the same material as the second conductive layer 60. The conductive layer 60b may be formed by a known film formation technique. For example, the conductive layer 60b may be formed by stacking platinum, iridium, or the like by a sputtering method or the like. When the mask layer 60a is formed, the mask layer 60a is made of the same material as the second conductive layer 60. Therefore, the mask layer 60a can be integrated with the conductive layer 60b.

  Next, as shown in FIG. 7A, the conductive layer 60b is patterned into a desired shape by etching, so that the second conductive layer 60 is formed. At this time, the second conductive layer 60 overlaps the first conductive layer 40 including the end portion 41, covers a part of the piezoelectric layer 50, and the one end portion 61 in the first direction 200 is the first end portion 61. It is patterned so as to have it in one region 33. In the step of patterning the second conductive layer 60, as shown in FIG. 7B, the second conductive layer 60 is continuously formed so as to cover at least a part of the plurality of piezoelectric layers 50, respectively. Is done. According to this, when the second conductive layer 60 is connected to the ground circuit, the second conductive layer 60 can be used as a common upper electrode of the piezoelectric element 100.

  In the step of patterning the second conductive layer 60, the conductive layer 60b may be patterned so as to cover at least the opening 54 as shown in FIG. In other words, the third conductive layer 67 may be formed by not removing the conductive layer 60b formed above the opening 54. According to this, for example, when a resist is applied, an exposure process and a development process are performed to form a resist film, and etching is performed using the resist film as a mask, an organic alkali developer, an organic stripping solution, a cleaning solution, etc. are used. . Accordingly, by not removing the conductive layer 60b formed above the opening 54 (in other words, by forming the third conductive layer 67), the surface of the first conductive layer 40 in the opening 54 is The possibility of overetching can be eliminated. In addition, it is possible to prevent the exposed portion of the first conductive layer 40 in the opening 54 from being exposed to an organic stripping solution, a cleaning solution, or the like after being etched, and thus being chemically damaged. In the manufacturing method according to the present embodiment, the third conductive layer 67 is not an essential component, and the third conductive layer 67 may not be formed by removing the conductive layer 60 b in the opening 54.

  Next, as shown in FIG. 8, a first protective film 80 is formed on at least a part of the piezoelectric layer 50 where the second conductive layer is not formed above. The first protective film 80 is formed by a known film formation technique. The first protective film 80 may be formed, for example, by forming a photosensitive resin film such as polyimide by a coating method or the like and patterning the film into a desired shape. Here, as shown in FIG. 8, the first protective film 80 is formed so as to overlap at least a part of the drive region 55. The first protective film 80 may be formed so as to cover the end portion 61 of the second conductive layer 60 and overlap with at least a part of the drive region 55. In addition, the second protective film 81 may be integrally formed so as to be separated from the first protective film 80 in the first direction 200. Here, the first protective film 80 and the second protective film 81 may be part of a resist layer when a fourth conductive layer 70 described later is formed.

  Next, as shown in FIG. 9, a fourth conductive layer 70 is formed so as to cover at least the opening 54. The fourth conductive layer 70 only needs to be electrically connected to the second conductive portion 43 in the opening 54. In the case where the third conductive layer 67 is formed, the fourth conductive layer 70 may be formed so as to be electrically connected to the third conductive layer 67. When the third conductive layer 67 is not formed, the fourth conductive layer 70 may be formed so as to cover at least the opening 54. The fourth conductive layer 70 may be formed by a known film formation technique. For example, a conductive layer (not shown) is formed by laminating gold, nickel-chromium alloy, or the like by a sputtering method, and the fourth conductive layer 70 is formed by etching the conductive layer into a predetermined shape. May be. The fourth conductive layer 70 may be connected to an external drive circuit (not shown).

  Here, as shown in FIG. 9, when the first protective film 80 is formed, in the step of forming the fourth conductive layer 70 by etching, the second conductive layer 60 of the piezoelectric layer 50 is moved upward. It is possible to protect a portion that is not formed from chemical damage due to an etchant or the like. More specifically, after the conductive layer for the fourth conductive layer 70 is formed by sputtering or the like, the conductive layer is etched to obtain the fourth conductive layer 70 having a desired shape. Here, the first protective film 80 is formed on at least a part of the portion of the piezoelectric layer 50 where the second conductive layer 60 is not formed above, so that, for example, the first protective film 80 is adjacent to the drive region 55. Since the piezoelectric layer 50 is not chemically damaged by the etchant or the like, the reliability of the piezoelectric element 100 can be improved. The first protective film 80 may be used as a resist layer for patterning the fourth conductive layer 70 in the step of forming the fourth conductive layer 70.

  The piezoelectric element 100 and the piezoelectric actuator 110 can be manufactured by the above method.

  As shown in FIG. 10A, the sealing plate 90 in which the sealing region 91 is formed is mounted from above the piezoelectric element 100. Here, the piezoelectric element 100 can be sealed in the sealing region 91. The sealing plate 90 may seal the piezoelectric element 100 with an adhesive, for example. Next, as shown in FIG. 10B, the substrate 1 is thinned to a predetermined thickness, and the pressure chambers 11 and the like are partitioned. For example, a mask (not shown) is formed on the surface opposite to the surface on which the vibration plate 30 is formed so as to be patterned into a desired shape on the substrate 1 having a predetermined thickness, and is etched. The pressure chamber 11, the wall 12, the supply path 13, the communication path 14, and the reservoir 15 are partitioned (not shown). As described above, the pressure chamber plate 10 having the pressure chamber 11 below the diaphragm 30 can be formed. After the pressure chamber plate 11 is formed, as shown in FIG. 10C, the nozzle plate 20 having the nozzle holes 21 is joined to a predetermined position by, for example, an adhesive. As a result, the nozzle hole 21 communicates with the pressure chamber 11.

  The liquid jet head 300 can be manufactured by any of the above methods. As described above, the manufacturing method of the liquid ejecting head 300 is not limited to the above-described manufacturing method, and the pressure chamber plate 10 and the nozzle plate 20 may be integrally formed using an electroforming method or the like.

  The method for manufacturing a liquid jet head according to this embodiment has the following features, for example.

  According to the method of manufacturing the liquid ejecting head 300 according to this embodiment, in the step of forming the fourth conductive layer 70, at least a part of the first portion 56 of the piezoelectric layer 50 is formed by the first protective film 80. Since it is covered, chemical damage due to the etchant used in the etching process of the fourth conductive layer 70 can be reduced with respect to the first portion 56 of the piezoelectric layer 50. As a result, since the reliability of the piezoelectric layer 50 can be increased, the piezoelectric actuator 110 having the highly reliable piezoelectric element 100 can be manufactured.

  As described above, according to the liquid ejecting head 300 according to the present embodiment, it is possible to provide a liquid ejecting head having a highly reliable piezoelectric actuator.

3. Liquid ejecting apparatus Next, the liquid ejecting apparatus according to the present embodiment will be described. The liquid ejecting apparatus according to this embodiment includes the liquid ejecting head according to the present invention. Here, a case where the liquid ejecting apparatus 1000 according to the present embodiment is an ink jet printer will be described. FIG. 11 is a perspective view schematically showing the liquid ejecting apparatus 1000 according to the present embodiment.

  The liquid ejecting apparatus 1000 includes a head unit 1030, a driving unit 1010, and a control unit 1060. Further, the liquid ejecting apparatus 1000 includes an apparatus main body 1020, a paper feeding unit 1050, a tray 1021 on which the recording paper P is set, a discharge port 1022 for discharging the recording paper P, and an operation arranged on the upper surface of the apparatus main body 1020. A panel 1070.

  The head unit 1030 includes, for example, an ink jet recording head (hereinafter also simply referred to as “head”) configured from the liquid ejecting head 300 described above. The head unit 1030 further includes an ink cartridge 1031 that supplies ink to the head, and a transport unit (carriage) 1032 on which the head and the ink cartridge 1031 are mounted.

  The drive unit 1010 can reciprocate the head unit 1030. The drive unit 1010 includes a carriage motor 1041 serving as a drive source for the head unit 1030, and a reciprocating mechanism 1042 that reciprocates the head unit 1030 in response to the rotation of the carriage motor 1041.

  The reciprocating mechanism 1042 includes a carriage guide shaft 1044 whose both ends are supported by a frame (not shown), and a timing belt 1043 extending in parallel with the carriage guide shaft 1044. The carriage guide shaft 1044 supports the carriage 1032 while allowing the carriage 1032 to freely reciprocate. Further, the carriage 1032 is fixed to a part of the timing belt 1043. When the timing belt 1043 is caused to travel by the operation of the carriage motor 1041, the head unit 1030 is reciprocated by being guided by the carriage guide shaft 1044. During this reciprocation, ink is appropriately discharged from the head, and printing on the recording paper P is performed.

  The control unit 1060 can control the head unit 1030, the drive unit 1010, and the paper feed unit 1050.

  The paper feeding unit 1050 can feed the recording paper P from the tray 1021 to the head unit 1030 side. The paper feed unit 1050 includes a paper feed motor 1051 serving as a driving source thereof, and a paper feed roller 1052 that rotates by the operation of the paper feed motor 1051. The paper feed roller 1052 includes a driven roller 1052a and a drive roller 1052b that face each other up and down across the feeding path of the recording paper P. The drive roller 1052b is connected to the paper feed motor 1051. When the paper supply unit 1050 is driven by the control unit 1060, the recording paper P is sent so as to pass below the head unit 1030.

  The head unit 1030, the drive unit 1010, the control unit 1060, and the paper feed unit 1050 are provided inside the apparatus main body 1020.

  The liquid ejecting apparatus 1000 can include the liquid ejecting head 300 according to the present invention. As described above, the liquid ejecting head 300 according to the present invention can include a highly reliable piezoelectric actuator. Therefore, the liquid ejecting apparatus 1000 having high reliability can be obtained.

  In the above-described example, the case where the liquid ejecting apparatus 1000 is an ink jet printer has been described. However, the printer of the present invention can also be used as an industrial liquid ejecting apparatus. As the liquid (liquid material) discharged in this case, various functional materials adjusted to an appropriate viscosity with a solvent or a dispersion medium, or those containing metal flakes or the like can be used.

  Although the embodiments of the present invention have been described in detail as described above, it will be readily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Board | substrate, 10 Pressure chamber board, 11 Pressure chamber, 11a area | region, 12 Wall part, 13 Supply path,
14 communication path, 15 reservoir, 20 nozzle plate, 21 nozzle hole, 30 vibration plate,
31 1st surface, 32 2nd surface, 33 1st area | region, 33a 1st edge | side,
33b second side, 40 first conductive layer, 41 end, 42 first conductive part,
43 second conductive layer, 50 piezoelectric layer, 50a protective layer, 50b piezoelectric layer,
50c Intermediate titanium layer, 51 upper surface, 52 side surface, 54 opening, 55 drive region,
55a end, 55b end, 60 second conductive layer, 60a conductive layer, 60b conductive layer,
61 end, 67 third conductive layer, 70 fourth conductive layer,
80 first protective film, 81 second protective film, 90 sealing plate, 91 sealing region,
100 piezoelectric element, 110 piezoelectric actuator, 200 first direction,
210 second direction, 300 liquid ejecting head, 1000 liquid ejecting apparatus,
1010 drive unit, 1020 device main body, 1021 tray, 1022 discharge port,
1030 head unit, 1031 ink cartridge, 1032 carriage,
1041 Carriage motor, 1042 Reciprocating mechanism, 1043 Timing belt, 1044 Carriage guide shaft, 1050 Paper feed unit, 1051 Paper feed motor,
1052 Paper feed roller, 1060 control unit, 1070 operation panel

Claims (6)

Forming a pressure chamber plate having a pressure chamber;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps the pressure chamber on the surface;
A first conductive layer extending in a first direction on the second surface, the first conductive layer having a first conductive portion formed in the first region and a second conductive portion formed outside the first region. Forming a first conductive layer;
Forming a piezoelectric layer so as to cover the first conductive layer;
Forming a second conductive layer so as to cover a part of the piezoelectric layer and overlap with at least a part of the first conductive part;
Forming an opening spaced apart from the second conductive layer and positioned on the second conductive portion in the piezoelectric layer;
Forming a first protective film made of an electrically insulating film so as to cover at least a part of a portion of the piezoelectric layer where the second conductive layer is not formed above;
Forming a fourth conductive layer electrically connected to the second conductive portion in the opening,
The step of forming the first protective film is a method of manufacturing a liquid jet head, which is performed before the step of forming the fourth conductive layer. Forming a pressure chamber plate having a plurality of pressure chambers;
A diaphragm formed above the pressure chamber plate, having a first surface facing the pressure chamber plate, and a second surface opposite to the first surface; Forming a diaphragm having a first region that overlaps each of the plurality of pressure chambers,
A first conductive layer extending in a first direction on the second surface, the first conductive layer having a first conductive portion formed in the first region and a second conductive portion formed outside the first region. Forming a plurality of first conductive layers;
Forming a piezoelectric layer so as to cover each of the plurality of first conductive layers;
Forming a second conductive layer so as to cover a part of the plurality of piezoelectric layers and overlap with at least a part of the first conductive part;
Forming a plurality of openings in the plurality of piezoelectric layers spaced apart from the second conductive layer and positioned on the second conductive portion;
Forming a first protective film made of an electrically insulating film so as to cover at least a part of a portion of the piezoelectric layer where the second conductive layer is not formed above;
Forming a fourth conductive layer electrically connected to the second conductive portion in the opening,
The step of forming the first protective film is a method of manufacturing a liquid jet head, which is performed before the step of forming the fourth conductive layer. In claim 1 or claim 2,
Forming a third conductive layer so as to cover at least the opening;
The method of manufacturing a liquid jet head, wherein the fourth conductive layer is electrically connected to the second conductive portion via the third conductive layer. In any one of Claims 1-3,
In the piezoelectric layer, when a region sandwiched between the first conductive layer and the second conductive layer is a driving region,
Forming the first protective film so as to cover a part of the second conductive layer from the piezoelectric layer;
Forming a second protective film on the second conductive layer, overlapping a part of the driving region and spaced apart from the first protective film in the first direction;
A method of manufacturing a liquid jet head including: In any one of Claims 1-4,
The step of forming the first conductive layer includes:
Forming a conductive layer on the first region;
Forming an etching protective film on the conductive layer;
Etching the conductive layer after forming the etching protection film,
The method for manufacturing a liquid jet head in which the etching protective film uses a material for forming the piezoelectric layer. In any one of Claims 1-5,
The step of forming the piezoelectric layer includes
Forming a piezoelectric layer before etching so as to cover at least the first conductive film;
Forming a conductive mask layer on the piezoelectric layer before the etching process;
Etching the piezoelectric layer after forming the mask layer,
The mask layer is a method of manufacturing a liquid jet head in which a material for forming the second conductive layer is used.

Images