JP5316251B2 - Switch circuit - Google Patents

Description

  The present invention relates to a switch circuit in which a plurality of free-wheeling diode devices composed of one or a plurality of diodes connected in series are connected in parallel to a switching element.

  In recent years, the use of power converters such as DC-DC converters and inverters has been expanded to the high power region, and there is an increasing demand for higher frequency power converters as a challenge for miniaturization of devices. The switching circuit of the power converter mainly uses switching elements such as a field effect transistor made of silicon as a semiconductor material, an IGBT (Insulated Gate Bipolar Transistor), etc., and these switching elements include a current flowing back from a load. In many cases, a reflux diode for bypassing the capacitor is connected in parallel.

  When the current flowing in the forward direction through the return diode is interrupted, the recovery current caused by the carriers accumulated in the return diode flows in the reverse direction, resulting in heat loss. Such a recovery current is generated every conversion cycle of the power converter, and heat loss due to the recovery current increases with an increase in power (voltage and current) handled by the power converter. For this reason, in order to reduce loss in a power converter that handles high power at a high frequency, it is necessary to use a return diode having a short recovery time (reverse recovery time) in which a recovery current flows.

  When a PN junction diode or a PiN junction diode is used as the free-wheeling diode, a recovery time due to accumulation of minority carriers occurs somewhat. However, in the case of a Schottky barrier diode using a Schottky barrier generated by the junction between a metal and a semiconductor, Since there is no accumulation of carriers, the recovery time is extremely short. However, Schottky barrier diodes have difficulty in increasing the reverse withstand voltage (hereinafter referred to as reverse withstand voltage) as compared with PN junction diodes or PiN junction diodes made of the same semiconductor material. It is unsuitable.

  In recent years, wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have attracted attention as semiconductor materials that can replace silicon. Wide band gap semiconductors have a dielectric breakdown electric field strength that is an order of magnitude higher than that of silicon, and have higher thermal conductivity and higher saturation electron velocity than silicon. Therefore, when used in semiconductor devices, high reverse breakdown voltage, high heat resistance, In particular, when used as a switching element, the loss can be reduced due to the low on-resistance. Further, when a wide band gap semiconductor is used for a PN junction diode or a PiN junction diode, the recovery time is shortened, while the voltage that starts to conduct in the forward direction due to the size of the band gap (hereinafter referred to as an on voltage). However, when used in a Schottky barrier diode, the recovery time can be extremely shortened and the on-voltage can be lowered while realizing a high reverse breakdown voltage.

  More specifically, a Schottky barrier diode made of silicon carbide has a higher on-voltage than a PN junction diode made of silicon, but a Schottky barrier diode made of gallium nitride has the same on-voltage as a PN junction diode made of silicon. can do. However, a Schottky barrier diode made of gallium nitride is currently under development for an element that can handle a large current.

  As an invention related to a reflux diode focusing on the characteristics of the above-described semiconductor element made of a wide band gap semiconductor, Patent Document 1 discloses a first reflux diode made of silicon carbide and a first reflux diode made of silicon. A technique for speeding up while reducing a loss caused by a recovery current by connecting a second return diode having a low on-voltage in parallel with a switching element to gently reduce the recovery current is disclosed. . In Patent Document 2, a Schottky barrier diode made of a wide band gap semiconductor and a PiN junction diode made of silicon and having an on-voltage substantially equal to that of the Schottky barrier diode are connected in parallel to the switching element, and both diodes are connected in parallel. A technique for reducing the loss caused by the recovery current by operating in the same manner is disclosed.

JP 2009-32769 A JP 2008-271207 A

  However, the techniques disclosed in Patent Documents 1 and 2 both reduce the recovery current reduction rate by connecting a freewheeling diode with a short recovery time and a freewheeling diode with a slightly long recovery time in parallel. It reduces switching noise (vibration of the voltage across the switching element) due to resonance of capacitance and inductance components in the circuit, and can be applied to high power applications without impairing the characteristics of the diode with shortened recovery time. It wasn't something to do.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a switch circuit that can be applied to a purpose of handling a large amount of power even at a high frequency.

Switch circuit according to the present invention with one or series connected plurality of diodes instead diverted diode device, connecting the place diverted diode device on the voltage begins to conduct the phase different in the forward direction in parallel with the switching element in the switching circuit, wherein instead diverted diode device, Made up by Schottky barrier diode ing from different semiconductor materials having a band gap greater than that of silicon, the current to voltage after conducting according to the level of the on-voltage The change rate is designed to be large or small.

In the present invention, the plurality of freewheeling diode devices made of wide band gap semiconductors are configured such that the rate of change of current with respect to the forward voltage increases as the ON voltage at which conduction begins in the forward direction is higher.
As a result, the return current starts to be conducted first from the return diode device having the lowest on-voltage, and as the forward voltage rises, more return current is shunted to the return diode device having the higher on-voltage. In order to conduct, the conduction loss due to the reflux current is distributed to each of the reflux diode devices. In addition, since the forward voltage decreases as a whole compared to the case where there is a single return diode device, the total conduction loss due to the return current is reduced. Furthermore, since each return diode device has a high reverse breakdown voltage, high voltage switching is possible, and since the recovery time is short, the switching loss is reduced to a high frequency region.

  In the present invention, since the return current is shunted to the return diode device composed of a Schottky barrier diode with a low on-voltage and an extremely short recovery time, the conduction loss due to the return current and the switching loss due to the recovery current are reduced. When two or more Schottky barrier diodes are connected in series to form one freewheeling diode device, the voltage after conduction of one Schottky barrier diode is the on-voltage of the other freewheeling diode device. Even when the current is lower, the return current is divided between the return diode device including the Schottky barrier diode and the other return diode device.

  In the present invention, the on-state voltage of each free-wheeling diode device composed of a Schottky barrier diode is low and the recovery time is extremely short, so that conduction loss due to free-wheeling current and switching loss due to recovery current are greatly reduced. Also, because the semiconductor materials of the Schottky barrier diodes are different, even if there is only one diode constituting each freewheeling diode device, a difference occurs in the on-voltage, and the freewheeling current is effective between the freewheeling diode devices. To be diverted to

  The switch circuit according to the present invention is characterized in that the different semiconductor materials include silicon carbide and gallium nitride.

In the present invention, the on-voltage of a Schottky barrier diode made of gallium nitride (hereinafter referred to as GaN) is clearly greater than the on-voltage of a Schottky barrier diode (hereinafter referred to as SBD) made of silicon carbide (hereinafter referred to as SiC). Since it is low, the return current is more effectively divided between the respective return diode devices.
In addition, the SBD suitable for low power made of GaN can conduct the reflux current first, and the SBD for high power made of SiC can conduct most of the reflux current later. Combined application is possible.

  The switch circuit according to the present invention is characterized in that the switching element is a field effect transistor using silicon carbide as a semiconductor material.

  In the present invention, since the switching element is made of SiC, it can be applied to a power converter that switches large power at a high frequency in combination with a reflux diode device made of a wide band gap semiconductor.

According to the present invention, the return current starts to be conducted first from the return diode device having the lowest on-voltage, and as the forward voltage increases, more return current is shunted to the return diode device having the higher on-voltage. Therefore, the conduction loss due to the return current is distributed to each return diode device. In addition, since the forward voltage decreases as a whole compared to the case where there is a single return diode device, the total conduction loss due to the return current is reduced. Furthermore, since each return diode device has a high reverse breakdown voltage, high voltage switching is possible, and since the recovery time is short, the switching loss is reduced to a high frequency region.
Therefore, it becomes possible to apply to the use which handles a large power even at a high frequency.

It is a circuit diagram which shows the structure of the inverter which concerns on Embodiment 1 of this invention. It is a circuit diagram which shows the structure of the inverter which concerns on Embodiment 1 of this invention. It is a characteristic view which shows the example of the forward direction characteristic of SBD which uses SiC and GaN as a semiconductor material. It is a characteristic view which shows the example of the forward direction characteristic of SBD which uses SiC and GaN as a semiconductor material. It is a characteristic view which shows typically the characteristic of the voltage with respect to the forward direction current of the diode apparatus for reflux. It is explanatory drawing which divides and shows the loss of each switch circuit of an inverter in the conduction | electrical_connection loss of a switching element, and another loss. It is a characteristic view which shows the example of the forward direction characteristic of SBD which uses SiC as a semiconductor material, and the PN junction diode which uses GaN as a semiconductor material.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.
(Embodiment 1)
1 and 2 are circuit diagrams showing the configuration of the inverter according to Embodiment 1 of the present invention. In the figure, each of the field effect transistors FET1, FET2, FET3, and FET4 is a switching element. The field effect transistor FET1 and the diodes D11 and D12, the field effect transistor FET2 and the diodes D21 and D22, the field effect transistor FET3 and the diodes D31 and D32, and the field effect transistor FET4 and the diodes D11 and D12 are switch circuits, respectively. These are connected to form a so-called full bridge. Each of the diodes D11, D12, D21, 22, D31, D32, and D41, D42 functions as a freewheeling diode device (so-called freewheeling diode) for the field effect transistors FET1, FET2, FET3, and FET4. .

  More specifically, the source of the field effect transistor FET1 and the diodes D11 and D12 are connected to one terminal of a load LD1 composed of a series-parallel circuit in which a parallel circuit of a resistive load R1 and a capacitive load C1 and an inductive load L1 are connected in series. Are connected to the drain of the field effect transistor FET2 and the cathodes of the diodes D21 and D22. The other terminal of the load LD1 is connected to the source of the field effect transistor FET3 and the anodes of the diodes D31 and D32, and the drain of the field effect transistor FET4 and the cathodes of the diodes D41 and D42.

  The drains of the field effect transistors FET1 and FET2 and the cathodes of the diodes D11, D12, D31, and D32 are connected to the power supply line + B of the DC power supply. Are connected to the ground potential. Gate control signals are given to the gates G1, G2, G3, and G4 of the field effect transistors FET1, FET2, FET3, and FET4 from an inverter driving circuit (not shown), and the field effect transistors FET1, FET4, and the field effect transistors FET3, FET3, FET3, and FET4, respectively. The load LD1 is driven by an alternating current by repeating ON / OFF alternately with the FET2.

  In the above-described inverter, the field effect transistors FET1, FET2 are prevented so that the field effect transistors FET1, FET2 or the field effect transistors FET3, FET4 are not turned on at the same time and a short-circuit current is conducted from the power supply line + B to the ground potential. , FET3, and FET4 are all provided for a period (so-called dead time). Hereinafter, the operation of the inverter during the dead time and immediately after the dead time will be described with reference to FIGS. 1 and 2.

  In FIG. 1, when all of the field effect transistors FET1, FET2, FET3, and FET4 are turned off, the return current flows through the load LD1 due to the energy stored in the inductive load L1 of the load LD1 before reaching the dead time. to continue. For example, when the load current flows in the direction indicated by the arrow in FIG. 1, the current flows from the ground potential to the power supply line + B through the diodes D21 and D22, the load LD1, and the diodes D31 and D32. At this time, since a reverse voltage substantially equal to the voltage of the power supply line + B is applied to the diodes D11, D12, D41, and D42, the reverse withstand voltage of the diodes D11, D12, D41, and D42 is equal to the voltage value of the power supply line + B. It is only for endurance.

  Next, when the field effect transistors FET1 and FET4 are turned on in FIG. 2, the load current is supplied from the power supply line + B to the ground potential in the direction indicated by the arrow in FIG. 2 through the field effect transistor FET1, the load LD1, and the field effect transistor FET4. Flows. In this case, the cathode voltage of the diodes D21 and D22 is raised to almost the voltage of the power supply line + B, and the anode voltage of the diodes D21 and D22 is lowered to the substantially ground potential, so that the diodes D21, D22, D31, and D32 Is applied with a reverse voltage corresponding to the voltage value of the power supply line + B. Accordingly, the reverse withstand voltages of the diodes D21, D22, D31, and D32 are set to withstand the voltage value of the power supply line + B.

  Here, when a diode having a long recovery time is used as the diodes D21, D22, D31, and D32, the field effect transistor FET1 is changed to the diodes D21 and D22 and the diodes D31 and D32 are changed to FET4 for the time during which the recovery current is flowing. In this embodiment, the loss is reduced by using a diode with a short recovery time for the diodes D21, D22, D31, and D32.

Below, the freewheeling diode apparatus used for each switch circuit of the inverter mentioned above is explained.
3 and 4 are characteristic diagrams showing examples of forward characteristics of SBDs using SiC and GaN as semiconductor materials. The horizontal axis of each figure represents the forward voltage (V), and the vertical axis represents the current (A). In addition, the solid line and the broken line in each figure indicate the characteristics of SiC SBD and GaN SBD, respectively. These SBDs all have a very short recovery time and a reverse breakdown voltage exceeding 500V.

  In FIG. 3, the SiC SBD and the GaN SBD each have an on-voltage of 0.9 V or less at which current starts to flow in the forward direction. Since the on-voltage is relatively low, the GaN SBD that begins to conduct first is Since the ON voltage is relatively high, the rate of change of current with respect to the voltage after conduction is made smaller than the SBD of SiC that starts conduction later. As a result, when the SiC SBD and the GaN SBD are connected in parallel as the free-wheeling diode device, when the forward voltage is less than about 1 V, a large amount of current flows through the GaN SBD having a low on-voltage. When is greater than about 1 V, a large amount of current flows through the SiC SBD having a high on-voltage. In addition, since the current when the forward voltage is 1 V is about 3.5 A, in the region where the return current is larger than 7 A (3.5 A × 2), a larger amount of return current is generated by the SBD of SiC capable of flowing a large current. As a result, the conduction loss can be dispersed in each SBD.

  In FIG. 4, the on-voltages at which the SBD of SiC and the SBD of GaN start to conduct in the forward direction are VnSiC and VnGaN, respectively. Further, when a SiC SBD or a GaN SBD is used alone as the reflux diode device, the forward voltages when the reflux current (Ir) flows are VrSiC and VrGaN, respectively. In the first embodiment, a reflux current that is about twice the current value when the currents flowing in the SiC SBD and the GaN SBD are substantially equal to the forward voltage flows in each of the return diode devices of the inverter. However, it goes without saying that the present invention may be applied to applications in which a larger reflux current flows.

  FIG. 5 is a characteristic diagram schematically showing the voltage characteristic with respect to the forward current of the freewheeling diode device. FIG. 5 is a schematic diagram based on a diagram in which the vertical axis and the horizontal axis in FIG. 4 are reversed. The horizontal axis in FIG. 5 represents the forward current (A), and the vertical axis represents the voltage (V). The solid and broken lines in the figure indicate forward current-voltage characteristics when SiC SBD and GaN SBD are used as the freewheeling diode device, respectively, and the alternate long and short dash line indicates SiC SBD and GaN SBD, respectively. The forward current-voltage characteristics when connected in parallel as a reflux diode device are shown. The characteristic diagram of the alternate long and short dash line is drawn by adding the forward current values indicated by the solid line and the broken line to the same voltage in the horizontal axis direction. In the first embodiment, since the solid line and the broken line are approximated by a straight line, the alternate long and short dash line is also drawn by a straight line.

  In FIG. 5, the characteristics of the SBD of SiC and the SBD of GaN indicated by the solid line and the broken line are straight lines that intersect with each other upward, and the intercepts on the vertical axis are VnSiC and VnGaN, respectively. When a reflux current (Ir) is passed through the reflux diode device indicated by these characteristics, the voltages when the SiC SBD or GaN SBD is used alone for the reflux diode device are VrSiC and VrGaN, respectively. On the other hand, the voltage when the SBD of SiC and the SBD of GaN are respectively connected in parallel as a reflux diode device is Vr [SiC + GaN] smaller than either VrSiC or VrGaN.

  From the above, when the SBD of SiC and the SBD of GaN are connected in parallel as a reflux diode device, respectively, the same as when the SiC SBD or GaN SBD is used alone for the reflux diode device It can be seen that the conduction loss can be reduced as a whole of the reflux diode device because the forward voltage decreases even when the reflux current is passed. Further, in this case, since only forward current corresponding to the voltage of Vr [SiC + GaN] flows through the SBD of SiC and the SBD of GaN, it can be seen from FIG. 5 that the reflux current is divided into each SBD.

FIG. 6 is an explanatory diagram showing the loss of each switch circuit of the inverter divided into conduction loss of the switching element and other loss. The horizontal axis of FIG. 6 represents the switching frequency (Hz), and the vertical axis represents the loss (%) of the switch circuit with respect to the power switched by the switch circuit. The broken line in the figure indicates the conduction loss of the switching elements (field effect transistors FET1 to FET4). The solid line and the alternate long and short dash line indicate the sum of the switching loss of the switching element and the total loss (conduction loss and switching loss) of the freewheeling diode device when the freewheeling diode device is an SBD of SiC, The case where the SBD of GaN and SBD of GaN are respectively connected in parallel as a reflux diode device is shown.
The power switched by the switch circuit here is about 2 kW (200 V × 10 A).

  In FIG. 6, the conduction loss of the switching element indicated by the broken line corresponds to the loss when the current supplied to the load LD1 conducts the switching element, and is represented by a straight line extending in the lateral direction independent of the switching frequency. The On the other hand, the other losses indicated by the solid line and the alternate long and short dash line include the conduction loss when the return current generated every time switching is conducted through the return diode device, and the switching element and the return diode device during switching. Since the loss generated transiently is included, it tends to increase as the switching frequency increases. Even in this case, when the SiC SBD and the GaN SBD are connected in parallel as the free-wheeling diode, the conduction loss due to the free-wheeling current is less than when the SiC SBD is used alone in the free-wheeling diode device. Since there are few, loss is reduced as shown with the dashed-dotted line of a figure.

As described above, according to the first embodiment, two free-wheeling diode devices each made of SiC and GaN and connected in parallel to the field effect transistor have a higher on-voltage as they start to conduct in the forward direction. The rate of change of current with respect to the voltage in the direction is increased.
As a result, the reflux current starts to be conducted first from the reflux diode device made of GaN having the lower on-voltage, and with the rise of the forward voltage, the reflux diode device made of SiC having the higher on-voltage is more increased. Therefore, the conduction loss due to the reflux current is distributed to each of the reflux diode devices. Further, since the forward voltage decreases as a whole as compared with the case where the return diode device is a single diode made of SiC or GaN, the total value of conduction loss due to the return current is reduced. Furthermore, since each freewheeling diode device has a high reverse withstand voltage, switching of a high voltage exceeding 200 V is possible, and since a recovery time is short, a switching loss is reduced to a high frequency region.
Therefore, the present invention can be applied to applications that handle large power even at high frequencies.

  In addition, since the return current is divided into the two return diode devices composed of the SBD with a low ON voltage and an extremely short recovery time, the conduction loss due to the return current and the switching loss due to the recovery current can be greatly reduced.

  Furthermore, since the semiconductor materials of the two free-wheeling diode devices made of SBD are different, the free-wheeling current can be effectively divided between the free-wheeling diode devices by using the difference in the on-voltage of the free-wheeling diode devices. Can do.

  Furthermore, since the on-voltage of the GaN SBD is clearly lower than the on-voltage of the SiC SBD, the reflux current can be more effectively shunted between the respective reflux diode devices. And since the SBD of GaN suitable for low power can conduct the reflux current first, and the SBD of SiC for high power can conduct most of the reflux current later, it can be adapted to the characteristics of SBD due to the difference in semiconductor materials Is possible.

  Furthermore, since the switching element is a field effect transistor made of SiC, it can be applied to a power converter that switches large power at a high frequency in combination with a free wheel diode device made of SiC and GaN, which are wide band gap semiconductors. .

  In the first embodiment, SiC and GaN are used as the wide band gap semiconductor. However, the present invention is not limited to this, and other wide band gap semiconductors such as diamond and aluminum nitride are used. May be used.

  In addition, although two freewheeling diode devices are connected in parallel to one switching element, three or more freewheeling diode devices may be connected in parallel.

  Furthermore, although the field effect transistor made of SiC is used as the switching element, the present invention is not limited to this, and for example, an IGBT (Insulated Gate Bipolar Transistor) may be used.

(Embodiment 2)
In the first embodiment, each of the two freewheeling diode devices connected in parallel to one switching element is configured by one diode, whereas in the second embodiment, one switching element is used. One of the two free-wheeling diode devices connected in parallel is configured by a plurality of diodes.

  FIG. 7 is a characteristic diagram showing an example of forward characteristics of an SBD using SiC as a semiconductor material and a PN junction diode using GaN as a semiconductor material. The horizontal axis in FIG. 7 represents the forward voltage (V), and the vertical axis represents the current (A). Also, the solid line, the alternate long and short dash line, and the broken line in the figure indicate the characteristics of a SiC SBD, three SiC SBDs connected in series, and a GaN PN junction diode, respectively.

  In FIG. 7, the ON voltage at which the GaN PN junction diode indicated by the broken line starts to conduct in the forward direction is about 3.8 V, and the characteristic diagram does not intersect with the SiC SBD indicated by the solid line. Even if the diodes are connected in parallel, all the return currents flow through the SiC SBD. Therefore, in the second embodiment, a reflux diode device in which three SiC SBDs are connected in series and a reflux diode device composed of a GaN PN junction diode are connected in parallel. By connecting in this way, as shown by the one-dot chain line and the broken line in FIG. 7, the characteristics of the two return diode devices can be crossed to appropriately divide the return current to each return diode device.

  In addition, the same code | symbol is attached | subjected to the location corresponding to Embodiment 1, and the detailed description is abbreviate | omitted.

  As described above, according to the second embodiment, since three SiC SBDs are connected in series to form one free-wheeling diode device, the voltage after the SiC SBD becomes conductive is the PN PN junction. Although the voltage is lower than the on-voltage of the diode, the reflux current can be shunted between the SiC SBD and the GaN PN junction diode.

  In the second embodiment, three SBDs connected in series and a GaN PN junction diode are connected in parallel. However, the present invention is not limited to this, and a characteristic diagram as shown in FIG. One or two SBDs in series and a PN junction diode may be connected in parallel as long as they are used in a region where the two cross.

D11, D12, D21, D22, D31, D32, D41, D42 Diode device for reflux FET1, FET2, FET3, FET4 Field effect transistor (switching element)
G1, G2, G3, G4 Gate LD1 Load L1 Inductive load C1 Capacitive load R1 Resistive load

Claims (3)

And one or series connected plurality of diodes instead diverted diode device, the switch circuit connected in parallel diversion diode device on voltage begins to conduct in the forward direction instead of the phase different to the switching element,
Wherein instead diverted diode device includes a Made up by Schottky barrier diode ing from different semiconductor materials having a band gap larger than silicon, the rate of change of current with respect to voltage after conducting according to the level of the turn-on voltage magnitude A switch circuit characterized by comprising: The switch circuit according to claim 1 , wherein the different semiconductor materials include silicon carbide and gallium nitride. The switching device, the switching circuit according to claim 1 or 2, characterized in that a field effect transistor using silicon carbide as a semiconductor material.

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