JP5311961B2 - Envelope, image display device, and video receiving display device manufacturing method - Google Patents

Envelope, image display device, and video receiving display device manufacturing method Download PDF

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JP5311961B2
JP5311961B2 JP2008273263A JP2008273263A JP5311961B2 JP 5311961 B2 JP5311961 B2 JP 5311961B2 JP 2008273263 A JP2008273263 A JP 2008273263A JP 2008273263 A JP2008273263 A JP 2008273263A JP 5311961 B2 JP5311961 B2 JP 5311961B2
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side wall
joining member
envelope
bonding member
manufacturing
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JP2010102947A5 (en
JP2010102947A (en
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孝介 倉知
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Canon Inc
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To control deterioration of adhesion between a jointing member and a substrate or a side wall due to excessive heating. <P>SOLUTION: The manufacturing method of a housing comprises a jointing member arrangement process in which jointing members 4a, 4b are interposed along the whole periphery of a side wall 3 between the substrates 1, 2 and the side wall 3 of frame-shape so as to be in contact with the substrates 1, 2 and the side wall 3, a jointing member melting process in which the jointing members 4a, 4b are melted on at least one of the faces so as to provide a non-melting part 6 at a part of at least one face out of substrate opposed faces 21a, 22a being the opposed face to the substrate 1, 2 of the jointing members 4a, 4b, or side wall opposed faces 22a, 22b being the opposed face to the side wall 3, and a process to solidify the melted jointing members 4a, 4b. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は外囲器、画像表示装置及び映像受信表示装置、並びにそれらの製造方法に関し、特にディスプレイパネルの封着方法に関する。   The present invention relates to an envelope, an image display device, a video reception display device, and methods for manufacturing the same, and more particularly to a method for sealing a display panel.

ディスプレイパネルなどに用いられる外囲器が基板や側壁などの複数の部材から構成される場合、それらの部材同士を高い密着性で封着することが好ましい。特許文献１には、基板と枠部材との間に挟んだ封止部材にレーザ光を照射して局所的に加熱させ、外囲器を封着する方法が記載されている。特許文献２には、リッドと筐体との間に接合部材を配置し、筐体とリッドを加圧して固定し、レーザ光を接合部材に照射する方法が記載されている。特許文献３には、低融点材料中に高融点材料を有する接合部材を用いて封着を行うときに、低融点材料の表面の酸化膜を破り、接合面から酸化膜を排除する方法が記載されている。
特開２０００−２５１７１１号公報 特開２００１−３２６２９０号公報 特開２００３−１５１４７６号公報 When an envelope used for a display panel or the like is composed of a plurality of members such as a substrate and a side wall, it is preferable to seal these members with high adhesion. Patent Document 1 describes a method in which a sealing member sandwiched between a substrate and a frame member is irradiated with a laser beam and locally heated to seal an envelope. Patent Document 2 describes a method in which a joining member is disposed between a lid and a housing, the housing and the lid are pressed and fixed, and laser light is applied to the joining member. Patent Document 3 describes a method of breaking an oxide film on the surface of a low melting point material and removing the oxide film from the joint surface when sealing is performed using a joining member having a high melting point material in the low melting point material. Has been.
JP 2000-251711 A JP 2001-326290 A JP 2003-151476 A

しかしながら、基板と側壁との間に挟まれた接合部材の基板または側壁との接触部分の全域をレーザで溶融させると、レーザの照射パワーや加熱時間などのばらつきなどにより、接合部材を溶融させるために必要な熱量を上回る熱量が接合部材に加わる場合がある。これにより、接合部材と基板との界面状態が劣化し、接合部材と基板との接着力が低下する場合がある。   However, when the entire area of the contact portion between the substrate and the side wall of the bonding member sandwiched between the substrate and the side wall is melted with a laser, the bonding member is melted due to variations in laser irradiation power, heating time, and the like. In some cases, the amount of heat exceeding the amount of heat necessary for heating is applied to the joining member. Thereby, the interface state of a joining member and a board | substrate may deteriorate, and the adhesive force of a joining member and a board | substrate may fall.

本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、過剰な加熱による接合部材と基板または側壁との接着力の低下を抑制することのできる外囲器、画像表示装置及び映像受信表示装置、並びにこれらの製造方法を提供することにある。   The present invention has been made to solve the above-described problems, and an object of the present invention is an envelope capable of suppressing a decrease in the adhesive force between the bonding member and the substrate or the side wall due to excessive heating, An object of the present invention is to provide an image display device, a video reception display device, and a manufacturing method thereof.

上記目的を達成するため、本発明の外囲器の製造方法は、基板と枠状の側壁との間に、前記基板と前記側壁とに接触するように、前記側壁の全周に沿って金属からなる接合部材を配置する接合部材配置工程と、前記接合部材の前記基板と対向する面である基板対向面または前記側壁と対向する面である側壁対向面のうち少なくとも一方の面の一部が非溶融部となるように、該少なくとも一方の面で前記接合部材を溶融させる接合部材溶融工程と、溶融した前記接合部材を固化させる工程と、を含んでいる。前記接合部材溶融工程は、前記側壁の全周の９０％以上にわたって前記非溶融部を形成することを含み、前記接合部材配置工程は、前記基板と前記側壁とが対向する方向に前記接合部材を押圧し、前記接合部材の前記基板対向面または前記側壁対向面の幅方向の両側縁部に、前記接合部材の金属酸化膜が除去された領域を形成することを含み、前記接合部材溶融工程は、前記接合部材に局所加熱光を照射し、前記接合部材の金属酸化膜が除去された前記領域に対して、選択的に熱量を投入することを含んでいる。 In order to achieve the above object, the method for manufacturing an envelope according to the present invention provides a metal along the entire circumference of the side wall between the substrate and the frame-like side wall so as to contact the substrate and the side wall. the bonding member disposing step of disposing a bonding member made of, a portion of said at least one surface of the side wall facing surface is a surface facing the substrate-facing surface or the side wall is a substrate and the opposing surfaces of the joining members A joining member melting step of melting the joining member on the at least one surface so as to be a non-melting portion and a step of solidifying the melted joining member are included. The joining member melting step includes forming the non-melting portion over 90% or more of the entire circumference of the side wall, and the joining member arranging step is configured to place the joining member in a direction in which the substrate and the side wall face each other. Forming a region where the metal oxide film of the bonding member has been removed at both side edges in the width direction of the substrate facing surface or the side wall facing surface of the bonding member, , Irradiating the bonding member with local heating light, and selectively injecting heat into the region where the metal oxide film of the bonding member has been removed.

本発明の他の実施態様によれば、外囲器と、外囲器に内包された表示素子と、を有する画像表示装置の製造方法が提供される。この製造方法は、外囲器を上述の製造方法で製造することを含んでいる。   According to another embodiment of the present invention, there is provided a method for manufacturing an image display device having an envelope and a display element included in the envelope. This manufacturing method includes manufacturing the envelope by the above-described manufacturing method.

本発明の他の実施態様によれば、画像表示装置と、映像信号を選択して受信する受信回路と、受信回路で受信する映像信号から、画像表示装置に出力する画像信号を生成する画像信号生成回路と、を有する映像受信表示装置の製造方法が提供される。この製造方法は、画像表示装置を上述の製造方法で製造することを含んでいる。   According to another embodiment of the present invention, an image display device, a receiving circuit that selects and receives a video signal, and an image signal that generates an image signal to be output to the image display device from the video signal received by the receiving circuit. There is provided a method of manufacturing a video reception display device having a generation circuit. This manufacturing method includes manufacturing the image display device by the above-described manufacturing method.

本発明の他の実施態様によれば、外囲器は、一対の基板と、一対の基板の間に挟まれ、一対の基板とともに内部空間を形成する枠状の側壁と、少なくとも一方の基板と側壁との間に位置し、側壁の全周にわたって少なくとも一方の基板と側壁とに溶着された接合部材と、を有し、接合部材の少なくとも一方の基板と対向する面または側壁と対向する面のうち少なくとも一方の面で、接合部材の溶着部が接合部材の全幅の５％以上、８０％以下を占めている。   According to another embodiment of the present invention, the envelope includes a pair of substrates, a frame-shaped side wall sandwiched between the pair of substrates and forming an internal space together with the pair of substrates, and at least one substrate. And a bonding member welded to at least one substrate and the side wall over the entire circumference of the side wall, and the surface of the bonding member facing the at least one substrate or the surface facing the side wall Among them, the welded portion of the joining member occupies 5% or more and 80% or less of the entire width of the joining member on at least one surface.

本発明の他の実施態様によれば、画像表示装置は、上述の外囲器と、外囲器に内包された表示素子と、を有している。   According to another embodiment of the present invention, an image display device includes the above-described envelope and a display element included in the envelope.

本発明の他の実施態様によれば、映像受信表示装置は、上述の画像表示装置と、映像信号を選択して受信する受信回路と、受信回路で受信する映像信号から、画像表示装置に出力する画像信号を生成する画像信号生成回路と、を有している。   According to another embodiment of the present invention, a video reception display device outputs the above-described image display device, a reception circuit that selects and receives a video signal, and a video signal received by the reception circuit to the image display device. And an image signal generation circuit for generating an image signal to be performed.

本発明によれば、過剰な加熱による接合部材と基板または側壁との界面状態の劣化を抑制し、接合部材と基板との間の接着力の低下を抑制することができる。   ADVANTAGE OF THE INVENTION According to this invention, deterioration of the interface state of the joining member and a board | substrate or a side wall by excessive heating can be suppressed, and the fall of the adhesive force between a joining member and a board | substrate can be suppressed.

図１を用いて本発明の外囲器の基本的な構成を説明する。図１（ａ）は本発明の外囲器の一例を示す断面図である。外囲器１００は、一対の基板であるリアプレート１及びフェースプレート２と、これらの基板の間に設けられ基板とともに内部空間１５を形成する側壁３と、から構成されている。側壁３は枠状であり、典型的には閉じた矩形状の形状を有している。側壁３とリアプレート１との間は接合部材４ａで、側壁３とフェースプレート２との間は接合部材４ｂで、各々封着されている。具体的には、接合部材４ａは、リアプレート１と側壁３との間に位置し、側壁３の全周にわたってリアプレート１と側壁３とに溶着されている。同様に、接合部材４ｂは、フェースプレート２と側壁３との間に位置し、側壁３の全周にわたってフェースプレート２と側壁３とに溶着されている。図中、Ｘ方向は、リアプレート１またはフェースプレート２の内部空間１５に面する内側面と平行な方向とする。Ｚ方向は、リアプレート１またはフェースプレート２の上紀内側面の法線方向であり、リアプレート１とフェースプレート２とが対向する方向ということもできる。   The basic configuration of the envelope of the present invention will be described with reference to FIG. Fig.1 (a) is sectional drawing which shows an example of the envelope of this invention. The envelope 100 includes a rear plate 1 and a face plate 2 that are a pair of substrates, and a side wall 3 that is provided between the substrates and forms an internal space 15 together with the substrates. The side wall 3 has a frame shape, and typically has a closed rectangular shape. The side wall 3 and the rear plate 1 are sealed with a joining member 4a, and the side wall 3 and the face plate 2 are sealed with a joining member 4b. Specifically, the joining member 4 a is located between the rear plate 1 and the side wall 3 and is welded to the rear plate 1 and the side wall 3 over the entire circumference of the side wall 3. Similarly, the bonding member 4 b is located between the face plate 2 and the side wall 3 and is welded to the face plate 2 and the side wall 3 over the entire circumference of the side wall 3. In the figure, the X direction is a direction parallel to the inner surface of the rear plate 1 or the face plate 2 facing the internal space 15. The Z direction is a normal direction of the upper inner surface of the rear plate 1 or the face plate 2 and can also be said to be a direction in which the rear plate 1 and the face plate 2 face each other.

図１（ｂ）は、図１（ａ）に示す外囲器の上面図であり、接合部材４ｂの基板対向面２１ｂ（後述）の上面を示している。同図では、フェースプレート２と接合部材４ｂとの接触部分について説明するため、フェースプレート２の図示を省略している。接合部材４ｂは溶着部５ａ，５ｂと、非溶融部６と、に区分されている。Ｙ方向は、リアプレート１またはフェースプレート２の上紀内側面と平行で、かつＸ方向と直交する方向である。   FIG. 1B is a top view of the envelope shown in FIG. 1A and shows the top surface of a substrate facing surface 21b (described later) of the bonding member 4b. In the figure, the face plate 2 is not shown in order to explain the contact portion between the face plate 2 and the bonding member 4b. The joining member 4b is divided into welding parts 5a and 5b and a non-melting part 6. The Y direction is a direction parallel to the upper inner surface of the rear plate 1 or the face plate 2 and orthogonal to the X direction.

このように、本実施形態の外囲器では、外囲器１００がリアプレート１と、フェースプレート２と、それらの間に挟まれた側壁３と、を備え、接合部材４ａ，４ｂが基板であるリアプレート１またはフェースプレート２と、側壁３とに溶着されている。以下、図１に示す外囲器の構造を対象に、フェースプレート２に対する接合部材４ｂの溶着を説明するが、リアプレート１に対する接合部材４ａの溶着についても基本的に同様である。   Thus, in the envelope of the present embodiment, the envelope 100 includes the rear plate 1, the face plate 2, and the side wall 3 sandwiched therebetween, and the joining members 4a and 4b are substrates. It is welded to a certain rear plate 1 or face plate 2 and a side wall 3. Hereinafter, the welding of the joining member 4b to the face plate 2 will be described for the structure of the envelope shown in FIG. 1, but the welding of the joining member 4a to the rear plate 1 is basically the same.

本実施形態の外囲器は、接合部材４ｂのフェースプレート２と対向する面（基板対向面２１ｂ）と側壁３に対向する面（側壁対向面２２ｂ）の少なくとも一方に、フェースプレート２または側壁３と溶着しない非溶融部６を有している。また、溶着部５ａ，５ｂは側壁３に沿って設けられており、これらが本実施形態の外囲器の特徴となっている。これにより、後述するように、接合部材４ｂを局所的に加熱したときに、溶融のために必要な温度以上に接合部材４ｂが加熱されることが防止され、接合部材４ｂとフェースプレート２または側壁３との界面状態の劣化が抑制できる。従って、接合部材４ｂとフェースプレート２または側壁３との間の接着力の低下を抑制することができる。ここで界面状態の劣化とは、接合部材４ｂと基板対向面２１ｂまたは側壁対向面２２ｂとの間に空気や不純物が挟まれることをいう。本実施形態では、接合部材４ｂに加えられた過剰な熱がフェースプレート２または側壁３に伝導することによるフェースプレート２または側壁３の変形を防ぐこともできる。   The envelope of the present embodiment has the face plate 2 or the side wall 3 on at least one of the surface (substrate facing surface 21b) facing the face plate 2 and the surface facing the side wall 3 (side wall facing surface 22b) of the bonding member 4b. And the non-melting part 6 which is not welded. Moreover, the welding parts 5a and 5b are provided along the side wall 3, and these are the characteristics of the envelope of this embodiment. As a result, as will be described later, when the bonding member 4b is locally heated, the bonding member 4b is prevented from being heated above the temperature necessary for melting, and the bonding member 4b and the face plate 2 or the side wall are prevented from being heated. 3 can be prevented from being deteriorated. Accordingly, it is possible to suppress a decrease in the adhesive force between the bonding member 4b and the face plate 2 or the side wall 3. Here, the deterioration of the interface state means that air or impurities are sandwiched between the bonding member 4b and the substrate facing surface 21b or the side wall facing surface 22b. In the present embodiment, the deformation of the face plate 2 or the side wall 3 due to the excessive heat applied to the bonding member 4 b being conducted to the face plate 2 or the side wall 3 can also be prevented.

接合部材４ｂは、フェースプレート２と側壁３との間に、側壁３に沿って全周にわたって連続して溶着されていることが好ましい。即ち、閉ループ状に配された接合部材４ｂが、フェースプレート２と側壁３とに溶着されることが好ましい。これにより、外囲器１００の気密性を保つことができる。溶着とは、部材が溶融することによって該部材が他の部材と接着することをいう。側壁３に沿ってとは、接合部材４ｂの幅方向の両側縁部が側壁３の幅方向縁部３１，３２に一致するか、または側壁３の幅方向縁部３１，３２から一定の距離を保って側壁３の内側または外側、あるいはその両側に張り出すことをいう。ここで、幅方向とは、図１（ｂ）に示すように、側壁３の延びる方向と直交し、かつフェースプレート２の内側面と平行な方向であり、具体的には図中Ｗによって参照される矢印の方向である。このとき、接合部材４ｂの基板対向面２１ｂにおいて、接合部材４ｂの全幅Ｗに対する溶着部５ａ，５ｂの幅の合計の比は、５％以上であることが好ましい。これは、接合部材４ｂとフェースプレート２との接合強度や、外囲器１００の気密性確保の観点から決定される。この比は、８０％以下であることが好ましい。これは、後述するように、接合部材４ｂを局所的に加熱したときの、接合部材４ｂとフェースプレート２との間の界面状態の劣化による接着力の低下を熱拡散によって抑制する観点から決定される。非溶融部６は、図１（ｂ）に示す平面図において、典型的には接合部材４ｂの全周の９０％以上にわたって延びていることが好ましい。これは、外囲器の気密性１００の観点から決定される。以上は、接合部材４ｂの側壁３との封着についても同様である。すなわち、接合部材４ｂの基板対向面２１ｂまたは側壁対向面２２ｂのうち少なくとも一方で、接合部材４ｂの溶着部５が接合部材４ｂの全幅Ｗの５％以上、８０％以下を占めることが望ましい。溶着部５は、図１（ｂ）に示されるような各辺が直線状の形状に限られず、例えば、波状であってもよい。   It is preferable that the bonding member 4 b is continuously welded along the side wall 3 between the face plate 2 and the side wall 3. That is, it is preferable that the joining member 4 b arranged in a closed loop shape is welded to the face plate 2 and the side wall 3. Thereby, the airtightness of the envelope 100 can be maintained. Welding means that the member is bonded to another member by melting the member. Along the side wall 3, both side edges in the width direction of the joining member 4 b coincide with the width direction edges 31, 32 of the side wall 3 or a certain distance from the width direction edges 31, 32 of the side wall 3. This means that the side wall 3 is kept on the inside or outside, or protrudes on both sides thereof. Here, the width direction is a direction orthogonal to the direction in which the side wall 3 extends and parallel to the inner side surface of the face plate 2 as shown in FIG. The direction of the arrow to be played. At this time, in the board | substrate opposing surface 21b of the joining member 4b, it is preferable that the ratio of the sum total of the width | variety of the welding parts 5a and 5b with respect to the full width W of the joining member 4b is 5% or more. This is determined from the viewpoint of the bonding strength between the bonding member 4b and the face plate 2 and the airtightness of the envelope 100. This ratio is preferably 80% or less. As will be described later, this is determined from the viewpoint of suppressing, by thermal diffusion, a decrease in adhesive force due to deterioration of the interface state between the bonding member 4b and the face plate 2 when the bonding member 4b is locally heated. The In the plan view shown in FIG. 1B, the non-melting portion 6 typically extends over 90% or more of the entire circumference of the joining member 4b. This is determined in terms of the hermeticity 100 of the envelope. The same applies to the sealing of the joining member 4b with the side wall 3. That is, it is desirable that the welded portion 5 of the joining member 4b occupies 5% or more and 80% or less of the total width W of the joining member 4b on at least one of the substrate facing surface 21b and the side wall facing surface 22b of the joining member 4b. The welding part 5 is not limited to a linear shape as shown in FIG. 1B, and may be, for example, a wave shape.

図２は、本発明の外囲器の他の例であり、図１（ｂ）に相当する上面図である。溶着部５は、図２（ａ）に示すように接合部材４ｂの基板対向面２１ｂの内側にあってもよく、図２（ｂ）に示すように外側にあってもよい。溶着部５は、図２（ｃ）に示すように接合部材４ｂの基板対向面２１の幅方向における中心付近に位置していてもよい。図２（ｃ）に示す構成の場合には、図２（ｄ）に示すように、接合部材４ｂの非溶融部６が、必ずしもフェースプレート２と接触している必要はない。非溶融部６が溶着部５に過剰に加えられる熱を拡散するように作用し、溶着部５が高温になることを抑制することができるためである。   FIG. 2 is another example of the envelope of the present invention and is a top view corresponding to FIG. The welding part 5 may be inside the board | substrate opposing surface 21b of the joining member 4b, as shown to Fig.2 (a), and may be outside as shown in FIG.2 (b). The welding part 5 may be located near the center in the width direction of the board | substrate opposing surface 21 of the joining member 4b, as shown in FIG.2 (c). In the case of the configuration shown in FIG. 2C, the non-melting portion 6 of the joining member 4b does not necessarily need to be in contact with the face plate 2 as shown in FIG. This is because the non-melting part 6 acts to diffuse the heat applied excessively to the welded part 5 and can prevent the welded part 5 from becoming high temperature.

本発明の外囲器の別の例を、図３に示す。図３は、図１のリアプレート１と側壁３とが一つの器状の部材７からなる例である。このような構成にすることで、後述するリアプレート１と側壁３とを接合部材４ａで接着する工程を省くことができ、外囲器をより簡便に作製することができる。図３に示す構造では、器状の部材７のうち図１のリアプレート１に相当する部分と、フェースプレート２と、の間隔を維持する支持部５が、側壁に相当する。図３には、図１のリアプレート１と側壁３とを一つの器状の部材７に置き換えた例を示したが、図１のフェースプレート２と側壁３とを一つの器状の部材に置き換えてもよい。   Another example of the envelope of the present invention is shown in FIG. FIG. 3 shows an example in which the rear plate 1 and the side wall 3 of FIG. By adopting such a configuration, it is possible to omit the step of bonding the rear plate 1 and the side wall 3 described later with the bonding member 4a, and it is possible to manufacture the envelope more simply. In the structure shown in FIG. 3, the support portion 5 that maintains the space between the face plate 2 and the portion corresponding to the rear plate 1 in FIG. 1 of the container-like member 7 corresponds to the side wall. FIG. 3 shows an example in which the rear plate 1 and the side wall 3 of FIG. 1 are replaced with a single vessel-shaped member 7. However, the face plate 2 and the side wall 3 of FIG. It may be replaced.

上述の外囲器は、リアプレート１と、フェースプレート２と、側壁３と、を備える構成に限定されず、例えば、側壁３を設けず、１つの接合部材にリアプレート１とフェースプレート２との両方が接着する構成であってもよい。この構成では、接合部材のリアプレート１に対向する面とフェースプレート２に対向する面とにおいて、接合部材の幅方向の一部を溶融させることで、接着力の低下を抑制することができる。   The envelope described above is not limited to the configuration including the rear plate 1, the face plate 2, and the side wall 3. For example, the side plate 3 is not provided, and the rear plate 1 and the face plate 2 are provided as one joining member. The structure which both adhere | attach may be sufficient. In this configuration, a decrease in adhesive force can be suppressed by melting a part of the bonding member in the width direction on the surface facing the rear plate 1 and the surface facing the face plate 2 of the bonding member.

次に、図４を用いて、図１に示す実施形態の外囲器の製造方法を説明する。   Next, the manufacturing method of the envelope of the embodiment shown in FIG. 1 will be described with reference to FIG.

（リアプレート側の接合部材配置工程）
基板と枠状の側壁３との間に、基板と側壁３とに接触するように、側壁３の全周に沿って接合部材を挟む。具体的には、リアプレート１と、側壁３と、接合部材４ａと、を用意し、リアプレート１と側壁３の間に、リアプレート１と側壁３とに接触するように接合部材４ａを挟む（図４（ａ））。このとき、接合部材４ａは、側壁３のリアプレート１側の端面を覆うように、側壁３の全周にわたって配置される。すなわち、気密空間を規定するための閉じた接合線を形成できるように接合部材４ａを配置する。 (Rear plate side joining member placement process)
A bonding member is sandwiched between the substrate and the frame-shaped side wall 3 along the entire circumference of the side wall 3 so as to be in contact with the substrate and the side wall 3. Specifically, the rear plate 1, the side wall 3, and the joining member 4 a are prepared, and the joining member 4 a is sandwiched between the rear plate 1 and the side wall 3 so as to contact the rear plate 1 and the side wall 3. (FIG. 4A). At this time, the joining member 4a is disposed over the entire circumference of the side wall 3 so as to cover the end surface of the side wall 3 on the rear plate 1 side. That is, the joining member 4a is arranged so that a closed joining line for defining an airtight space can be formed.

リアプレート１及びフェースプレート２は、外囲器としての強度を備えるものであればよい。リアプレート１及びフェースプレート２に用いる材料としては、石英ガラス、Ｎａ等の不純物含有量を減少させたガラス、青板ガラス、青板ガラスにスパッタ法等によりＳｉＯ2を積層した積層体、アルミナ等のセラミックス及びＳｉ基板等を挙げることができる。後述するように、リアプレート１やフェースプレート２を透過させて接合部材４ａ，４ｂをレーザで局所的に加熱する方法を適用する場合には、光の透過性が高いガラスなどの材料をリアプレート１及びフェースプレート２として用いることが好ましい。 The rear plate 1 and the face plate 2 only need to have strength as an envelope. Materials used for the rear plate 1 and the face plate 2 include quartz glass, glass with reduced impurity content such as Na, blue plate glass, a laminate in which SiO 2 is laminated on the blue plate glass by sputtering, ceramics such as alumina, etc. And Si substrate. As will be described later, when applying a method of locally heating the bonding members 4a and 4b with a laser through the rear plate 1 and the face plate 2, a material such as glass having a high light transmittance is applied to the rear plate. 1 and the face plate 2 are preferably used.

側壁３は、リアプレート１及びフェースプレート２と同様に、外囲器としての強度を備えるものであればよく、側壁３として用いられる材料としては、リアプレート１及びフェースプレート２と同様の材料を挙げることができる。側壁３の材料としてガラスを用いた場合には、リアプレート１及びフェースプレート２にガラスを用いた場合と同様に、接合部材４ａ，４ｂに加える熱により、側壁３が変形することがある。このような場合には、接合部材４ａ，４ｂの側壁対向面の、幅方向の一部を溶融することで、接着力の低下を抑えることができる外囲器を作成することができる。   Similar to the rear plate 1 and the face plate 2, the side wall 3 only needs to have strength as an envelope. As the material used for the side wall 3, the same material as the rear plate 1 and the face plate 2 is used. Can be mentioned. When glass is used as the material of the side wall 3, the side wall 3 may be deformed by heat applied to the joining members 4a and 4b, similarly to the case where glass is used for the rear plate 1 and the face plate 2. In such a case, an envelope capable of suppressing a decrease in adhesive force can be created by melting a part in the width direction of the side wall facing surfaces of the joining members 4a and 4b.

接合部材４ａは、リアプレート１上に、ディスペンサ法等で塗布することができる。ワイヤー状や薄膜状の接合部材４ａを側壁３の端面上あるいはリアプレート１上に配置することもできる。接合部材４に用いる材料としては、Ａｌ等の金属やガラスフリットなどが挙げられるが、低温処理が可能なインジウム（Ｉｎ）等の低融点金属が好ましい。   The joining member 4a can be applied on the rear plate 1 by a dispenser method or the like. A wire-like or thin-film-like joining member 4 a can also be disposed on the end face of the side wall 3 or on the rear plate 1. Examples of the material used for the bonding member 4 include metals such as Al and glass frit, but a low melting point metal such as indium (In) capable of low temperature treatment is preferable.

塗布する接合部材４の断面形状については、矩形、円形、ひし形等、様々な形状を採用することができるが、好ましくは、円形やひし形として、フェースプレート１やリアプレート２、側壁３に接触する面積を小さくすることが好ましい。接合部材４ａとリアプレート１、接合部材４ｂとリアプレート２、接合部材４ａ，４ｂと側壁３、の各々の間に空気が挟まれることを抑制するためである。   As the cross-sectional shape of the bonding member 4 to be applied, various shapes such as a rectangular shape, a circular shape, and a rhombus shape can be adopted. Preferably, the cross-sectional shape contacts the face plate 1, the rear plate 2, and the side wall 3 as a circular shape or a rhombus shape. It is preferable to reduce the area. This is to prevent air from being sandwiched between the joining member 4 a and the rear plate 1, the joining member 4 b and the rear plate 2, and the joining members 4 a and 4 b and the side wall 3.

接合部材４ａは、大気中で長時間保存することなどによって、その表面上に接合部材を構成する材料の酸化物が膜状に形成されている（酸化膜と呼ぶ）場合がある。接合部材４ａの表面上に酸化膜が形成されていると、後の接合部材溶融工程において接合部材４ａを高温に加熱しないと、リアプレート１または側壁３と接合部材４ａとの間の接着性が悪くなることがある。従って、接合部材４ａを加熱する前に、接合部材４ａが露出するように酸化膜を除去することが好ましい。接合部材４ａが露出した部分を形成するためには、リアプレート１と側壁３との間に接合部材４ａを挟む前に、接合部材４ａのリアプレート１と対向する基板対向面２１ａの表面上の酸化膜の少なくとも一部を、側壁３に沿って研磨等により除去することが好ましい。あるいは、リアプレート１と側壁３との間に接合部材４ａを挟んだ後、リアプレート１と側壁３とが対向する方向に接合部材４ａを加圧することによっても、酸化膜を破って接合部材４ａが露出した部分を形成することができる。このように接合部材４ａが露出した部分を形成し、後述するように酸化膜を除去した部分を局所的に加熱して溶融させることで、接合部材４ａに加える熱量を低減でき、リアプレート１や側壁３に与える熱的なダメージを低減することができる。   In some cases, the bonding member 4a is formed in a film shape (referred to as an oxide film) on the surface of the bonding member 4a by being stored in the atmosphere for a long time. If an oxide film is formed on the surface of the bonding member 4a, the adhesion between the rear plate 1 or the side wall 3 and the bonding member 4a is increased unless the bonding member 4a is heated to a high temperature in the subsequent bonding member melting step. May be worse. Therefore, before heating the bonding member 4a, it is preferable to remove the oxide film so that the bonding member 4a is exposed. In order to form the exposed portion of the bonding member 4a, before the bonding member 4a is sandwiched between the rear plate 1 and the side wall 3, the surface of the substrate facing surface 21a facing the rear plate 1 of the bonding member 4a is formed. It is preferable to remove at least a part of the oxide film along the side wall 3 by polishing or the like. Alternatively, after the joining member 4a is sandwiched between the rear plate 1 and the side wall 3, the joining member 4a is also broken by pressurizing the joining member 4a in a direction in which the rear plate 1 and the side wall 3 face each other to break the oxide film. An exposed portion can be formed. Thus, by forming a portion where the joining member 4a is exposed and locally heating and melting the portion from which the oxide film has been removed as will be described later, the amount of heat applied to the joining member 4a can be reduced. Thermal damage given to the side wall 3 can be reduced.

接合部材４ａの表面上の酸化膜は、接合部材４ａを常温で大気中にさらしておくと、材料によるが、およそ５ｎｍ以上１００ｎｍ以下の厚みとなる。従って、接合部材４ａの表面上の酸化膜だけでは十分に放熱効果を得ることは難しい。そこで、接合部材４ａの基板対向面２１ａまたは側壁対向面２２ａの少なくとも一方の一部に積極的に非溶融部６を設けて、過剰な熱が接合部材４ａに与えられた場合にも十分に放熱されるように構成する。   The oxide film on the surface of the bonding member 4a has a thickness of about 5 nm to 100 nm, depending on the material, when the bonding member 4a is exposed to the atmosphere at room temperature. Therefore, it is difficult to obtain a sufficient heat dissipation effect only with the oxide film on the surface of the bonding member 4a. Therefore, even when the non-melting portion 6 is positively provided on at least one part of the substrate facing surface 21a or the side wall facing surface 22a of the bonding member 4a and heat is given to the bonding member 4a, sufficient heat dissipation is achieved. To be configured.

（第１の接合部材溶融工程）
接合部材４ａの基板と対向する面である基板対向面２１ａまたは側壁３と対向する面である側壁対向面２２ａのうち少なくとも一方の面の一部に非溶融部を設けるように、少なくとも一方の面で接合部材４ａを溶融させる。具体的には、接合部材４ａの基板対向面２１ａの一部に非溶融部６を設けるように、側壁３に沿って接合部材４ａの基板対向面２１ａ側を溶融する（図４（ｂ））。溶融しない部分を残すことで、接合部材４ａが溶融するために必要な熱以上の熱が接合部材４ａに与えられた場合に、溶融されない部分に熱を拡散させることが可能となる。これにより、特に、リアプレート１の接合部材４ａとの溶融部分の過剰な加熱を防ぐことができ、接合部材４ａの基板対向面２１ａの変質や、接合部材４ａとリアプレート１との界面に生じる気泡の発生を抑制することができる。従って、接合部材４ａとリアプレート１との接着力の劣化を抑制することができる。このように接合部材４ａでの熱の拡散を可能とすることで、接合部材４ａからリアプレート１や側壁３に伝達する熱を低減させて、リアプレート１と側壁３の熱応力を抑え、変形が生じることを抑制することができる。前述の通り、接合部材溶融工程では、側壁３の全周の９０％以上にわたって非溶融部６を形成することが望ましい。 (First joining member melting step)
At least one of the surfaces of the bonding member 4a so as to provide a non-melting portion on at least one of the substrate facing surface 21a that faces the substrate or the side wall facing surface 22a that faces the side wall 3. Then, the joining member 4a is melted. Specifically, the substrate facing surface 21a side of the bonding member 4a is melted along the side wall 3 so that the non-melting portion 6 is provided in a part of the substrate facing surface 21a of the bonding member 4a (FIG. 4B). . By leaving the portion that is not melted, when heat equal to or higher than the heat necessary for melting the bonding member 4a is applied to the bonding member 4a, the heat can be diffused to the portion that is not melted. Thereby, in particular, excessive heating of the melted portion with the joining member 4a of the rear plate 1 can be prevented, and the substrate facing surface 21a of the joining member 4a is deteriorated or occurs at the interface between the joining member 4a and the rear plate 1. Generation of bubbles can be suppressed. Accordingly, it is possible to suppress deterioration of the adhesive force between the joining member 4a and the rear plate 1. In this way, by enabling the heat diffusion in the joining member 4a, the heat transmitted from the joining member 4a to the rear plate 1 and the side wall 3 is reduced, the thermal stress of the rear plate 1 and the side wall 3 is suppressed, and deformation is performed. Can be prevented from occurring. As described above, in the joining member melting step, it is desirable to form the non-melting portion 6 over 90% or more of the entire circumference of the side wall 3.

局所的に加熱するためには、加熱箇所に超音波振動を与える加熱手段や、レーザ照射をする光照射手段を用いることができる。特に、局所的に加熱する位置や大きさの制御が簡易な点で、レーザを接合部材の加熱手段として用いることが好ましい。   In order to perform local heating, a heating unit that applies ultrasonic vibration to a heating portion or a light irradiation unit that performs laser irradiation can be used. In particular, it is preferable to use a laser as a heating means for the bonding member because it is easy to control the position and size of local heating.

レーザを接合部材４ａに照射する場合には、図４（ｂ）の矢印で示すように、レーザの照射強度のピークが、接合部材４ａの基板対向面２１ａに位置することが好ましい。照射するレーザのスポット径は、典型的には、接合部材４ａの幅Ｗ以下とする。ここで、スポット径とは、照射強度のピークの位置から照射強度のピーク値の１４％となる位置までの距離の２倍である。レーザの照射強度のピーク値は、接合部材４ａの材料にもよるが、典型的には、30kW/cm2以上，300kW/cm2以下とすることができる。 When irradiating the bonding member 4a with laser, it is preferable that the peak of the irradiation intensity of the laser is located on the substrate facing surface 21a of the bonding member 4a as shown by the arrow in FIG. The spot diameter of the laser to be irradiated is typically set to be equal to or smaller than the width W of the bonding member 4a. Here, the spot diameter is twice the distance from the peak position of the irradiation intensity to the position that is 14% of the peak value of the irradiation intensity. The peak value of the laser irradiation intensity is typically 30 kW / cm 2 or more and 300 kW / cm 2 or less, although it depends on the material of the bonding member 4a.

例えば、レーザ照射により、図１（ｂ）に示すように接合部材４ａの基板対向面２１ａの幅方向両端縁部を溶融させる場合には、図４（ｂ）中の矢印の箇所にレーザの照射強度のピークが位置するように、レーザを照射することができる。レーザを発光するレーザ装置としては、典型的には、ＹＡＧレーザ、半導体レーザ等を用いることができる。レーザの照射位置を移動させながら接合部材４ａを一周にわたって加熱してもよいし、回折素子等を用いて加熱に必要な強度のレーザを線状に照射してもよい。レーザの照射位置を移動させる場合には、レーザの強度や接合部材４ａの材料にもよるが、スキャン速度は典型的には10mm/sec以上，100mm/sec以下とする。図４（ｂ）のように、接合部材４ａの幅方向において２箇所以上にレーザを照射する場合には、それぞれに同時に照射してもよいし、順次照射してもよい。   For example, when melting both ends in the width direction of the substrate facing surface 21a of the bonding member 4a as shown in FIG. 1B by laser irradiation, laser irradiation is performed at the position indicated by the arrow in FIG. 4B. The laser can be irradiated so that the intensity peak is located. Typically, a YAG laser, a semiconductor laser, or the like can be used as a laser device that emits a laser. The joining member 4a may be heated over the entire circumference while moving the laser irradiation position, or a laser having the intensity required for heating may be linearly irradiated using a diffraction element or the like. When the laser irradiation position is moved, the scan speed is typically 10 mm / sec or more and 100 mm / sec or less, depending on the intensity of the laser and the material of the bonding member 4a. As shown in FIG. 4B, when two or more laser beams are irradiated in the width direction of the bonding member 4a, they may be irradiated simultaneously or sequentially.

その後、溶融した接合部材４ａを固化させる。局部加熱により一部が溶融した接合部材４ａは、溶融した箇所がリアプレート１と接着した状態で冷却、固化し溶着部５となり、溶融しなかった箇所は非溶融部６となる。   Thereafter, the molten joining member 4a is solidified. The bonding member 4 a partially melted by local heating is cooled and solidified in a state where the melted portion is bonded to the rear plate 1, and becomes the welded portion 5, and the unmelted portion becomes the non-melted portion 6.

上述した接合部材の配置工程で、接合部材４ａを押圧した場合には、接合部材４ａの酸化膜が形成されていない部分が、接合部材４ａの基板対向面２１ａの幅方向両端縁部に設けられる。従って、この両端縁部の少なくとも一端を溶融させることが好ましい。これにより、酸化膜が形成された部分を加熱する場合に比べ、低温で接合部材４ａを溶融させてリアプレート１と接着することができる。   When the bonding member 4a is pressed in the above-described bonding member arrangement step, the portions of the bonding member 4a where the oxide film is not formed are provided at both edges in the width direction of the substrate facing surface 21a of the bonding member 4a. . Therefore, it is preferable to melt at least one end of the both edge portions. Thereby, compared with the case where the part in which the oxide film was formed is heated, the joining member 4a can be melted and bonded to the rear plate 1 at a low temperature.

上述した方法では、接合部材４ａをリアプレート１と側壁３とで挟み、接合部材４ａの基板対向面２１ａ側を溶融させて接着したが、接合部材４ａと側壁３との接着は、接合部材４ａとリアプレート１とを接着させる前または後に行うことができる。この場合、接合部材４ａと側壁３との接合部を直接加熱することによって、それらを接着することができる。   In the method described above, the bonding member 4a is sandwiched between the rear plate 1 and the side wall 3 and the substrate facing surface 21a side of the bonding member 4a is melted and bonded. However, the bonding between the bonding member 4a and the side wall 3 is performed by the bonding member 4a. Can be performed before or after the rear plate 1 is bonded. In this case, they can be bonded by directly heating the joint between the joining member 4a and the side wall 3.

上述の接合部材溶融工程で、リアプレート１と接合部材４ａ及び側壁３と接合部材４ａを同時に接着することもできる。例えば、Ｚ方向の厚さの薄い接合部材４ａを用いれば、上述した接合部材４ａの基板対向面２１ａの一部を溶融させるために加えた熱を利用して、接合部材４の側壁対向面２２ａの一部を溶融させることで、側壁３と接着することができる。   In the above-described joining member melting step, the rear plate 1, the joining member 4a, the side wall 3, and the joining member 4a can be bonded simultaneously. For example, if the bonding member 4a having a small thickness in the Z direction is used, the side wall facing surface 22a of the bonding member 4 is utilized by utilizing the heat applied to melt a part of the substrate facing surface 21a of the bonding member 4a described above. It is possible to bond to the side wall 3 by melting a part of.

（フェースプレート側の接合部材配置工程）
フェースプレート２及び接合部材４ｂを用意し、フェースプレート２と側壁３の間に、フェースプレート２と側壁３とに接触するように接合部材４ｂを挟む（図４（ｃ））。フェースプレート２は、リアプレート１に用いられる材料として挙げたものと同様の材料を用いることができる。 (Face plate side joining member placement process)
The face plate 2 and the joining member 4b are prepared, and the joining member 4b is sandwiched between the face plate 2 and the side wall 3 so as to be in contact with the face plate 2 and the side wall 3 (FIG. 4C). The face plate 2 can be made of the same material as the material used for the rear plate 1.

（第２の接合部材溶融工程）
接合部材４ｂの基板対向面２１ｂ側の幅方向の一部を局所的に加熱し（図４（ｄ））、第１の接合部材溶融工程と同様に加熱処理を行う。 (Second joining member melting step)
A part of the bonding member 4b in the width direction on the substrate facing surface 21b side is locally heated (FIG. 4D), and heat treatment is performed in the same manner as in the first bonding member melting step.

以上の工程を経ることにより図１に示す本実施形態の外囲器を作成することができる。
上述の製造方法では、リアプレート１と接合部材４ａとを先に溶着する例を示したが、フェースプレート２と接合部材４ｂとを先に溶着してもよい。リアプレート１と接合部材４ａ、フェースプレート２と接合部材４ｂ、を同時に溶着することもできる。 The envelope of this embodiment shown in FIG. 1 can be created through the above steps.
In the above-described manufacturing method, the rear plate 1 and the joining member 4a are welded first, but the face plate 2 and the joining member 4b may be welded first. The rear plate 1 and the joining member 4a, and the face plate 2 and the joining member 4b can be welded simultaneously.

上述した外囲器は、表示素子を内包する外囲器にも用いることもできる。即ち、フェースプレート２のリアプレート１側の面上に蛍光体及び電子加速電極が配置され、リアプレート１のフェースプレート２側の面上に表示素子が配置された画像表示装置としても好適に用いることができる。表示素子は、表示素子に対応して光が画像表示装置の外に向かって照射されるものであればよく、例えば、電子放出素子やエレクトロルミネセンス素子などが挙げられる。特に、表示素子として電子放出素子を用いる場合には、電子放出素子の経時劣化や外囲器内の放電抑制などのため、外囲器内を減圧状態に保つ（画像表示装置内へのガスの流入を抑制する）ことが望まれる。従って、画像表示装置の外囲器を側壁や基板を用いて形成する場合には、それらの部材同士が機械的に高い強度で構成され、該外囲器が高い気密性を有することが好ましい。   The envelope described above can also be used for an envelope containing a display element. In other words, it is also suitably used as an image display device in which a phosphor and an electron acceleration electrode are arranged on the face of the face plate 2 on the rear plate 1 side, and a display element is arranged on the face of the rear plate 1 on the face plate 2 side. be able to. The display element may be any element that emits light toward the outside of the image display device corresponding to the display element, and examples thereof include an electron emission element and an electroluminescence element. In particular, when an electron-emitting device is used as the display device, the inside of the envelope is kept in a reduced pressure state for the purpose of aging deterioration of the electron-emitting device and suppression of discharge in the envelope (gas in the image display device). It is desirable to suppress the inflow). Therefore, when the envelope of the image display apparatus is formed using a side wall or a substrate, it is preferable that these members are mechanically configured with high strength and the envelope has high airtightness.

図５に本発明の画像表示装置の一例を示す。図５は、便宜上、画像表示装置の一部を切り欠いて示している。リアプレート１のフェースプレート２側の面上に、Ｄx1、Ｄx2、・・・、ＤxNのＮ本からなるＸ配線１０と、Ｄy1、Ｄy2、・・・、ＤyMのＭ本からなるＹ配線１１と、がマトリクス状に配置されている。複数の電子放出素子１２が、それぞれＸ配線１０とＹ配線１１とに接続されている。フェースプレート２のリアプレート１側の面上には、蛍光体１４とその表面を覆うメタルバック（アノード）１３とが配置されている。このように構成された画像表示装置は、Ｘ配線１０、Ｙ配線１１及びメタルバック１３に電圧を印加して駆動することができる。この画像表示装置のリアプレート１、フェースプレート２、側壁３及び接合部材４ａ，４ｂからなる外囲器を、上述した外囲器と同様の工程を経て作成することで、電子放出特性が依存する外囲器内の圧力の変化を抑制することができる。従って、長時間駆動しても画像の劣化の抑制することができ、安定した画像表示装置を作成することができる。 FIG. 5 shows an example of the image display apparatus of the present invention. FIG. 5 shows a part of the image display device cut out for convenience. On the face of the rear plate 1 on the face plate 2 side, there are N X wirings 10 of D x1 , D x2 ,..., D xN and M Ms of D y1 , D y2 ,. Y wirings 11 made up of are arranged in a matrix. A plurality of electron-emitting devices 12 are connected to the X wiring 10 and the Y wiring 11, respectively. On the face of the face plate 2 on the rear plate 1 side, a phosphor 14 and a metal back (anode) 13 covering the surface are arranged. The image display device configured as described above can be driven by applying a voltage to the X wiring 10, the Y wiring 11, and the metal back 13. The envelope made up of the rear plate 1, the face plate 2, the side wall 3, and the joining members 4a and 4b of the image display device is produced through the same process as the above-described envelope, so that the electron emission characteristics depend. A change in pressure in the envelope can be suppressed. Accordingly, image deterioration can be suppressed even when driven for a long time, and a stable image display device can be created.

図５を用いて説明した本発明の画像表示装置を用いて、映像受信表示装置を構成することができる。   A video receiving display device can be configured using the image display device of the present invention described with reference to FIG.

図６は、本発明の画像表示装置を用いた映像受信表示装置の概略構成を示す図である。まず、映像情報受信装置２１の受信回路で映像信号を選択（選局）して受信し、受信された映像信号を画像信号生成回路２２に入力し、画像信号を生成する。映像情報受信装置２１は、例えば、無線放送、有線放送、インターネットを介した映像放送等を選局し受信できるチューナーなどの受信機を挙げることができる。映像情報受信装置２１に音響装置等を接続し、更に画像信号生成回路２２、駆動回路２３、及び画像表示装置２４を含めてテレビセットを構成することができる。画像信号生成回路２２は、映像情報から画像表示装置２４の各画素に対応した画像信号を生成し、画像信号生成回路２２の出力回路から出力して、駆動回路２３に入力する。そして、入力された画像信号に基づいて駆動回路２３で画像表示装置２４に印加する電圧を制御し、画像表示装置２４に画像を表示させる。画像表示装置２４は上述の外囲器の製造方法により製造することができる。   FIG. 6 is a diagram showing a schematic configuration of a video reception display device using the image display device of the present invention. First, a video signal is selected (tuned) by the receiving circuit of the video information receiving device 21 and received, and the received video signal is input to the image signal generating circuit 22 to generate an image signal. Examples of the video information receiving device 21 include a receiver such as a tuner that can select and receive wireless broadcasting, cable broadcasting, video broadcasting via the Internet, and the like. An audio device or the like is connected to the video information receiving device 21, and a television set including the image signal generation circuit 22, the drive circuit 23, and the image display device 24 can be configured. The image signal generation circuit 22 generates an image signal corresponding to each pixel of the image display device 24 from the video information, outputs it from the output circuit of the image signal generation circuit 22, and inputs it to the drive circuit 23. The drive circuit 23 controls the voltage applied to the image display device 24 based on the input image signal, and causes the image display device 24 to display an image. The image display device 24 can be manufactured by the above-described envelope manufacturing method.

以下に、本発明に係る外囲器の作成方法の一例を説明する。   Below, an example of the preparation method of the envelope based on this invention is demonstrated.

（実施例１）
本実施例では、図１に示す外囲器を以下の方法で１００個作成した。以下にプロセスを示す。 Example 1
In this example, 100 envelopes shown in FIG. 1 were produced by the following method. The process is shown below.

工程１：ガラス基板であるリアプレート１、ガラスからなる枠状の側壁３、及びインジウムからなる接合部材４ａを用意した。リアプレート１には、後で気密性の評価を行うために排気口が設けられている。リアプレート１上に封着材料４ａをディスペンサ法により一周するように塗布し、接合部材４ａを介して側壁３をリアプレート１上に配置した。そして、リアプレート１と側壁３とが対向する方向に接合部材４ａを押圧（加圧）した。接合部材４ａは、厚みが0.6mm、幅が1.2mmであった。リアプレート１と接合部材４ａ、及び側壁３と接合部材４ａが、それぞれ一周にわたって接触していることを確認した。   Step 1: A rear plate 1 that is a glass substrate, a frame-shaped side wall 3 made of glass, and a bonding member 4a made of indium were prepared. The rear plate 1 is provided with an exhaust port for later airtightness evaluation. The sealing material 4a was applied on the rear plate 1 by a dispenser method, and the side wall 3 was disposed on the rear plate 1 via the joining member 4a. And the joining member 4a was pressed (pressurized) in the direction where the rear plate 1 and the side wall 3 face each other. The joining member 4a had a thickness of 0.6 mm and a width of 1.2 mm. It was confirmed that the rear plate 1 and the joining member 4a, and the side wall 3 and the joining member 4a were in contact with each other over one circumference.

工程２：レーザのパワーピークが接合部材４ａのリアプレート１との対向面の内周に位置するようにして、全周にわたって照射した。波長が810nm、照射強度のピーク値が40kW/cm2、スポット径がφ1.0mm、スキャン速度が10mm/secの条件で、連続波のレーザを照射した。その後、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の外周に位置するようにして、全周にわたって照射した。照射したレーザの条件は、枠状の側壁３の内周側に照射したレーザの条件と同じにした。リアプレート１の接合部材４ａとの対向面を観測したところ、リアプレート１の接合部材４ａとの対向面のうち、幅方向において６０％が溶融した後に凝固され、リアプレート１と接合部材４ａとが接着されていた。幅方向における溶着した部分の割合は、次のように算出した。 Step 2: Irradiation was performed over the entire circumference so that the power peak of the laser was located on the inner circumference of the surface of the bonding member 4a facing the rear plate 1. A continuous wave laser was irradiated under conditions of a wavelength of 810 nm, an irradiation intensity peak value of 40 kW / cm 2 , a spot diameter of φ1.0 mm, and a scanning speed of 10 mm / sec. Thereafter, irradiation was performed over the entire circumference such that the power peak of the laser was located on the outer circumference of the surface of the bonding member 4a facing the rear plate 1. The conditions of the irradiated laser were the same as the conditions of the laser irradiated on the inner peripheral side of the frame-shaped side wall 3. When the surface of the rear plate 1 facing the bonding member 4a was observed, 60% of the surface of the rear plate 1 facing the bonding member 4a melted in the width direction and then solidified, and the rear plate 1 and the bonding member 4a Was glued. The ratio of the welded part in the width direction was calculated as follows.

封着材料４ａのリアプレート１側の面の法線方向から、封着材料４ａに向けて光を照射する。接合部材４ａの溶融し凝固した箇所（溶着された箇所）は、溶融しなかった箇所に比べ、封着材料４ａのリアプレート１側の面の法線方向に反射する光の強度が高くなる。即ち、封着材料４ａに上記のように光を照射すると、溶着された箇所は明るくなり、溶融しなかった箇所は暗くなることが目視で確認できる。この詳細な理由は明らかではないが、接合部材４ａの溶着された箇所がリアプレート１（接合部材４ｂの場合はフェースプレート２）の表面形状に沿って平坦化されたためと考えられる。そこで、上記のように接合部材４ａに光を照射したときに上述の接合部材４ａが溶着した部分の割合を、接合部材４ａの全幅に対する接合部材４ａの明るい箇所の幅の比として算出した。   Light is irradiated toward the sealing material 4a from the normal direction of the surface of the sealing material 4a on the rear plate 1 side. The intensity | strength of the light reflected in the normal line direction of the surface by the side of the rear plate 1 of the sealing material 4a becomes high compared with the location which the fusion | melting solidified part (welded location) of the joining member 4a did not fuse | melt. That is, when the sealing material 4a is irradiated with light as described above, it can be visually confirmed that the welded portion becomes bright and the portion that has not melted becomes dark. Although the detailed reason is not clear, it is considered that the welded portion of the joining member 4a is flattened along the surface shape of the rear plate 1 (or the face plate 2 in the case of the joining member 4b). Therefore, the ratio of the portion where the joining member 4a is welded when the joining member 4a is irradiated with light as described above is calculated as the ratio of the width of the bright portion of the joining member 4a to the entire width of the joining member 4a.

工程３：ガラス基板であるフェースプレート２及びインジウムからなる接合部材４ｂを用意した。工程１と同様に、リアプレート１上に固定された側壁３を、接合部材４ｂを介してフェースプレート２上に配置した。   Step 3: A face plate 2 as a glass substrate and a bonding member 4b made of indium were prepared. In the same manner as in step 1, the side wall 3 fixed on the rear plate 1 was disposed on the face plate 2 via the joining member 4b.

工程４：レーザのパワーピークが接合部材４ｂのリアプレート１との対向面の内周及び外周に位置するようにして、全周にわたって照射した。レーザの照射は２と同様の条件で行った。   Step 4: Irradiation was performed over the entire circumference so that the power peak of the laser was located on the inner circumference and the outer circumference of the surface of the bonding member 4b facing the rear plate 1. Laser irradiation was performed under the same conditions as in 2.

以上の工程を行い、作成した１００個の外囲器各々のリアプレート１と接合部材４ａ及びフェースプレート２と接合部材４ｂの接着状態について調べたところ、９０個の外囲器は、実用に耐えられる程度に強固に接着されていることが確認できた。   By performing the above steps and examining the adhesion state of the rear plate 1 and the joining member 4a and the face plate 2 and the joining member 4b of each of the 100 envelopes created, the 90 envelopes are practical. It was confirmed that they were firmly bonded to the extent possible.

次に、作成した１００個の外囲器の気密性を測定装置により評価した。リアプレート１の排気口からガスを排出し、ビルドアップ法を用いて外囲器のHeリーク量を測定した。ビルドアップ法は、G.F.Weston著、石川和夫訳、「超高真空技術の実際」（共立出版）pp.364-366に記載の方法で行った。この結果、接着性の高かった９０個の外囲器については、リーク量が10-14Pa・m3/sec以下であり、測定装置のリーク量の検出限界以下であった。 Next, the airtightness of the 100 envelopes prepared was evaluated with a measuring device. Gas was discharged from the exhaust port of the rear plate 1, and the amount of He leak in the envelope was measured using the build-up method. The build-up method was carried out by the method described by GF Weston, translated by Kazuo Ishikawa, “Actual of Ultra High Vacuum Technology” (Kyoritsu Shuppan) pp.364-366. As a result, the 90 envelopes having high adhesiveness had a leak amount of 10 −14 Pa · m 3 / sec or less, which was less than the detection limit of the leak amount of the measuring apparatus.

（実施例２）
本実施例では、接合部材４ａ，４ｂに照射するレーザの条件を変えたことを除き、実施例１と同様の方法で、図１に示す外囲器を１００個作成した。以下、実施例１と異なる工程を説明する。 (Example 2)
In this example, 100 envelopes shown in FIG. 1 were produced in the same manner as in Example 1 except that the conditions of the laser applied to the joining members 4a and 4b were changed. Hereinafter, steps different from those in Example 1 will be described.

工程１は、実施例１と同様に行った。   Step 1 was performed in the same manner as in Example 1.

工程２では、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の内周に位置するようにして、全周にわたって照射した。波長が810nm、照射強度のピーク値が55 kW/cm2、スポット径がφ1.0mm、スキャン速度が10mm/secの条件で、連続波のレーザを照射した。その後、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の外周に位置するようにして、全周にわたって照射した。照射したレーザの条件は、内周に照射したレーザの条件と同じにした。リアプレート１の接合部材４ａとの対向面を観測したところ、リアプレート１の接合部材４ａとの対向面のうち、幅方向において８０％が溶融した後に凝固され、リアプレート１と接合部材４ａとが接着されていた。接合部材４ａの溶融箇所の確認については、実施例１と同様の手法で行った。 In step 2, the laser was irradiated over the entire circumference so that the power peak of the laser was located on the inner circumference of the surface of the bonding member 4a facing the rear plate 1. A continuous wave laser was irradiated under conditions of a wavelength of 810 nm, an irradiation intensity peak value of 55 kW / cm 2 , a spot diameter of φ1.0 mm, and a scanning speed of 10 mm / sec. Thereafter, irradiation was performed over the entire circumference such that the power peak of the laser was located on the outer circumference of the surface of the bonding member 4a facing the rear plate 1. The condition of the irradiated laser was the same as the condition of the laser irradiated on the inner periphery. When the surface of the rear plate 1 facing the bonding member 4a was observed, 80% of the surface of the rear plate 1 facing the bonding member 4a melted in the width direction and then solidified, and the rear plate 1 and the bonding member 4a Was glued. About the confirmation of the fusion | melting location of the joining member 4a, it performed by the method similar to Example 1. FIG.

工程３は、実施例１と同様に行った。   Step 3 was performed in the same manner as in Example 1.

工程４は、レーザのパワーピークが接合部材４ｂのリアプレート１との対向面の内周及び外周に位置するようにして、全周にわたって照射した。レーザの照射は２と同様の条件で行った。   In step 4, the entire power was irradiated so that the power peak of the laser was located on the inner periphery and the outer periphery of the surface of the bonding member 4b facing the rear plate 1. Laser irradiation was performed under the same conditions as in 2.

以上の工程を行い、作成した作成した１００個の外囲器各々のリアプレート１と接合部材４ａ及びフェースプレート２と接合部材４ｂの接着状態を調べたところ、９５個の外囲器は、実用に耐えられる程度に強固に接着されていることが確認できた。   By performing the above steps and examining the adhesion state of the rear plate 1 and the joining member 4a and the face plate 2 and the joining member 4b of each of the created 100 envelopes, 95 envelopes are practical. It was confirmed that it was firmly bonded to such an extent that it could withstand.

次に、作成した１００個の外囲器各々の気密性を測定装置により評価した。リアプレート１の排気口からガスを排出し、ビルドアップ法を用いて外囲器のHeリーク量を測定した。この結果、接着性の高かった９５個の外囲器については、リーク量が10-14Pa・m3/sec以下であり、測定装置のリーク量の検出限界以下であった。 Next, the airtightness of each of the 100 envelopes prepared was evaluated with a measuring device. Gas was discharged from the exhaust port of the rear plate 1, and the amount of He leak in the envelope was measured using the build-up method. As a result, for the 95 envelopes having high adhesiveness, the leak amount was 10 −14 Pa · m 3 / sec or less, which was below the detection limit of the leak amount of the measuring apparatus.

（実施例３）
本実施例では、接合部材４ａ，４ｂに照射するレーザの条件を変えたことを除き、実施例１と同様の方法で、図１に示す外囲器を１００個作成した。以下、実施例１と異なる工程を説明する。 (Example 3)
In this example, 100 envelopes shown in FIG. 1 were produced in the same manner as in Example 1 except that the conditions of the laser applied to the joining members 4a and 4b were changed. Hereinafter, steps different from those in Example 1 will be described.

工程１は、実施例１と同様に行った。   Step 1 was performed in the same manner as in Example 1.

工程２では、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の内周に位置するようにして、全周にわたって照射した。波長が810nm、照射強度のピーク値が30kW/cm2、スポット径がφ1.0mm、スキャン速度が5mm/secの条件で、連続波のレーザを照射した。その後、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の外周に位置するようにして、全周にわたって照射した。照射したレーザの条件は、内周に照射したレーザの条件と同じにした。リアプレート１の接合部材４ａとの対向面を観測したところ、リアプレート１の接合部材４ａとの対向面のうち、幅方向において８０％が溶融した後に凝固され、リアプレート１と接合部材４ａとが接着されていた。接合部材４ａの溶融箇所の確認については、実施例１と同様の手法で行った。 In step 2, the laser was irradiated over the entire circumference so that the power peak of the laser was located on the inner circumference of the surface of the bonding member 4a facing the rear plate 1. A continuous wave laser was irradiated under the conditions of a wavelength of 810 nm, an irradiation intensity peak value of 30 kW / cm 2 , a spot diameter of φ1.0 mm, and a scanning speed of 5 mm / sec. Thereafter, irradiation was performed over the entire circumference such that the power peak of the laser was located on the outer circumference of the surface of the bonding member 4a facing the rear plate 1. The condition of the irradiated laser was the same as the condition of the laser irradiated on the inner periphery. When the surface of the rear plate 1 facing the bonding member 4a was observed, 80% of the surface of the rear plate 1 facing the bonding member 4a melted in the width direction and then solidified, and the rear plate 1 and the bonding member 4a Was glued. About the confirmation of the fusion | melting location of the joining member 4a, it performed by the method similar to Example 1. FIG.

工程３は、実施例１と同様に行った。   Step 3 was performed in the same manner as in Example 1.

工程４は、レーザのパワーピークが接合部材４ｂのリアプレート１との対向面の内周及び外周に位置するようにして、全周にわたって照射した。レーザの照射は２と同様の条件で行った。   In step 4, the entire power was irradiated so that the power peak of the laser was located on the inner periphery and the outer periphery of the surface of the bonding member 4b facing the rear plate 1. Laser irradiation was performed under the same conditions as in 2.

以上の工程を行い、作成した１００個の外囲器各々のリアプレート１と接合部材４ａ及びフェースプレート２と接合部材４ｂの接着状態について調べたところ、９５個の外囲器は、実用に耐えられる程度に強固に接着されていることが確認できた。   When the above steps were performed and the adhesion state of the rear plate 1 and the joining member 4a and the face plate 2 and the joining member 4b of each of the 100 envelopes created was examined, 95 envelopes were practically used. It was confirmed that they were firmly bonded to the extent possible.

次に、作成した１００個の外囲器各々の気密性を測定装置により評価した。リアプレート１の排気口からガスを排出し、ビルドアップ法を用いて外囲器のHeリーク量を測定した。この結果、接着性の高かった９５個の外囲器については、リーク量が10-14Pa・m3/sec以下であり、測定装置のリーク量の検出限界以下であった。 Next, the airtightness of each of the 100 envelopes prepared was evaluated with a measuring device. Gas was discharged from the exhaust port of the rear plate 1, and the amount of He leak in the envelope was measured using the build-up method. As a result, for the 95 envelopes having high adhesiveness, the leak amount was 10 −14 Pa · m 3 / sec or less, which was less than the detection limit of the leak amount of the measuring apparatus.

（比較例１）
本比較例では、接合部材４ａ，４ｂに照射するレーザの条件を変えたことを除き、実施例と同様の方法で、図１に示す外囲器を１００個作成した。以下、実施例と異なる工程を説明する。 (Comparative Example 1)
In this comparative example, 100 envelopes shown in FIG. 1 were produced in the same manner as in the example except that the conditions of the laser applied to the joining members 4a and 4b were changed. Hereinafter, steps different from those of the examples will be described.

工程１は、実施例と同様に行った。   Step 1 was performed in the same manner as in the example.

工程２では、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の内周に位置するようにして、全周にわたって照射した。波長が810nm、照射強度のピーク値が70kW/cm2、スポット径がφ1.0mm、スキャン速度が10mm/secの条件で、連続波のレーザを照射した。その後、レーザのパワーピークが接合部材４のリアプレート１との対向面の外周に位置するようにして、全周にわたって照射した。照射したレーザの条件は、内周に照射したレーザの条件と同じにした。リアプレート１の接合部材４ａとの対向面を観測したところ、リアプレート１の接合部材４ａとの対向面のうち、幅方向の全てが溶融されて凝固されていた。接合部材４ａの溶融箇所の確認については、実施例と同様の手法で行った。 In step 2, the laser was irradiated over the entire circumference so that the power peak of the laser was located on the inner circumference of the surface of the bonding member 4a facing the rear plate 1. A continuous wave laser was irradiated under conditions of a wavelength of 810 nm, an irradiation intensity peak value of 70 kW / cm 2 , a spot diameter of φ1.0 mm, and a scanning speed of 10 mm / sec. Thereafter, the entire power was irradiated so that the power peak of the laser was located on the outer periphery of the surface of the bonding member 4 facing the rear plate 1. The condition of the irradiated laser was the same as the condition of the laser irradiated on the inner periphery. When the surface facing the bonding member 4a of the rear plate 1 was observed, all of the surfaces facing the bonding member 4a of the rear plate 1 in the width direction were melted and solidified. About confirmation of the fusion | melting location of the joining member 4a, it performed by the method similar to an Example.

工程３は、実施例１と同様に行った。   Step 3 was performed in the same manner as in Example 1.

工程４は、レーザのパワーピークが接合部材４ｂのリアプレート１との対向面の内周及び外周に位置するようにして、全周にわたって照射した。レーザの照射は２と同様の条件で行った。   In step 4, the entire power was irradiated so that the power peak of the laser was located on the inner periphery and the outer periphery of the surface of the bonding member 4b facing the rear plate 1. Laser irradiation was performed under the same conditions as in 2.

以上の工程を行い、作成した１００個の外囲器各々のリアプレート１と接合部材４ａ及びフェースプレート２と接合部材４ｂの接着状態を調べたところ、６０個の外囲器については実施例１で作成した外囲器の接着力程度を有することが確認できた。その他の外囲器については、実用的な接着強度を備えていなかった。   By performing the above steps and examining the adhesion state of the rear plate 1 and the joining member 4a and the face plate 2 and the joining member 4b of each of the 100 envelopes that were created, Example 1 was found for 60 envelopes. It was confirmed that the envelope produced in (1) had an adhesive strength level. Other envelopes did not have practical adhesive strength.

次に、作成した１００個の外囲器各々の気密性を測定装置により評価した。リアプレート１の排気口からガスを排出し、ビルドアップ法を用いて外囲器のＨｅリーク量を測定した。この結果、接着性の高かった６０個の外囲器については、リーク量は10-14 Pa・m3/sec以下であり、測定装置のリーク量の検出限界以上であったが、その他の外囲器については、リーク量が多いことが確認できた。 Next, the airtightness of each of the 100 envelopes prepared was evaluated with a measuring device. Gas was discharged from the exhaust port of the rear plate 1, and the amount of He leak in the envelope was measured using a build-up method. As a result, for 60 envelopes with high adhesiveness, the leak rate was 10 -14 Pa · m 3 / sec or less, which was above the detection limit of the leak rate of the measuring device. Regarding the envelope, it was confirmed that there was a large amount of leakage.

（比較例２）
本比較例では、接合部材４ａ，４ｂに照射するレーザの条件を変えたことを除き、実施例と同様の方法で、図１に示す外囲器を１００個作成した。以下、実施例と異なる工程を説明する。 (Comparative Example 2)
In this comparative example, 100 envelopes shown in FIG. 1 were produced in the same manner as in the example except that the conditions of the laser applied to the joining members 4a and 4b were changed. Hereinafter, steps different from those of the examples will be described.

工程１は、実施例と同様に行った。   Step 1 was performed in the same manner as in the example.

工程２では、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の内周に位置するようにして、全周にわたって照射した。波長が810nm、照射強度のピーク値が40kW/cm2、スポット径がφ1.0mm、スキャン速度が5mm/secの条件で、連続波のレーザを照射した。その後、レーザのパワーピークが接合部材４ａのリアプレート１との対向面の外周に位置するようにして、全周にわたって照射した。照射したレーザの条件は、内周に照射したレーザの条件と同じにした。リアプレート１の接合部材４ａとの対向面を観測したところ、リアプレート１の接合部材４ａとの対向面のうち、幅方向の全てが溶融されて凝固されていた。接合部材４ａの溶融箇所の確認については、実施例と同様の手法で行った。 In step 2, the laser was irradiated over the entire circumference so that the power peak of the laser was located on the inner circumference of the surface of the bonding member 4a facing the rear plate 1. A continuous wave laser was irradiated under the conditions of a wavelength of 810 nm, an irradiation intensity peak value of 40 kW / cm 2 , a spot diameter of φ1.0 mm, and a scanning speed of 5 mm / sec. Thereafter, irradiation was performed over the entire circumference such that the power peak of the laser was located on the outer circumference of the surface of the bonding member 4a facing the rear plate 1. The condition of the irradiated laser was the same as the condition of the laser irradiated on the inner periphery. When the surface facing the bonding member 4a of the rear plate 1 was observed, all of the surfaces facing the bonding member 4a of the rear plate 1 in the width direction were melted and solidified. About confirmation of the fusion | melting location of the joining member 4a, it performed by the method similar to an Example.

工程３は、実施例１と同様に行った。   Step 3 was performed in the same manner as in Example 1.

工程４は、レーザのパワーピークが接合部材４ｂのリアプレート１との対向面の内周及び外周に位置するようにして、全周にわたって照射した。レーザの照射は２と同様の条件で行った。   In step 4, the entire power was irradiated so that the power peak of the laser was located on the inner periphery and the outer periphery of the surface of the bonding member 4b facing the rear plate 1. Laser irradiation was performed under the same conditions as in 2.

以上の工程を行い、作成した１００個の外囲器各々のリアプレート１と接合部材４ａ及びフェースプレート２と接合部材４ｂの接着状態を調べたところ、６０個の外囲器については実施例１で作成した外囲器の接着力程度を有することが確認できた。その他の外囲器については、実用的な接着強度を備えていなかった。   By performing the above steps and examining the adhesion state of the rear plate 1 and the joining member 4a and the face plate 2 and the joining member 4b of each of the 100 envelopes that were created, Example 1 was found for 60 envelopes. It was confirmed that the envelope produced in (1) had an adhesive strength level. Other envelopes did not have practical adhesive strength.

次に、作成した１００個の外囲器各々の気密性を測定装置により評価した。リアプレート１の排気口からガスを排出し、ビルドアップ法を用いて外囲器のＨｅリーク量を測定した。この結果、接着性の高かった６０個の外囲器については、リーク量は10-14Pa・m3/sec以下であり、測定装置のリーク量の検出限界以上であったが、その他の外囲器については、リーク量が多いことが確認できた。 Next, the airtightness of each of the 100 envelopes prepared was evaluated with a measuring device. Gas was discharged from the exhaust port of the rear plate 1, and the amount of He leak in the envelope was measured using a build-up method. As a result, for 60 envelopes with high adhesiveness, the leak rate was 10 -14 Pa · m 3 / sec or less, which was above the detection limit of the leak rate of the measuring device. Regarding the envelope, it was confirmed that there was a large amount of leakage.

本発明の外囲器の一例を説明する図である。It is a figure explaining an example of the envelope of the present invention. 本発明の外囲器の別の例を説明する図である。It is a figure explaining another example of the envelope of the present invention. 本発明の外囲器の更に別の例を説明する図である。It is a figure explaining another example of the envelope of the present invention. 本発明の外囲器の製造方法の一例を説明する図である。It is a figure explaining an example of the manufacturing method of the envelope of the present invention. 本発明の画像表示装置の一例を説明する図である。It is a figure explaining an example of the image display apparatus of this invention. 本発明の映像受信表示装置の構成の一例を説明するブロック図である。It is a block diagram explaining an example of a structure of the video reception display apparatus of this invention.

符号の説明Explanation of symbols

１ リアプレート
２ フェースプレート
３ 側壁
４ａ，４ｂ 接合部材
５ａ，５ｂ 溶着部
６ 非溶融部 DESCRIPTION OF SYMBOLS 1 Rear plate 2 Face plate 3 Side wall 4a, 4b Joining member 5a, 5b Welding part 6 Non-melting part

Claims (7)

基板と枠状の側壁との間に、前記基板と前記側壁とに接触するように、前記側壁の全周に沿って金属からなる接合部材を配置する接合部材配置工程と、
前記接合部材の前記基板と対向する面である基板対向面または前記側壁と対向する面である側壁対向面のうち少なくとも一方の面の一部が非溶融部となるように、該少なくとも一方の面で前記接合部材を溶融させる接合部材溶融工程と、
溶融した前記接合部材を固化させる工程と、
を含み、
前記接合部材溶融工程は、前記側壁の全周の９０％以上にわたって前記非溶融部を形成することを含み、
前記接合部材配置工程は、前記基板と前記側壁とが対向する方向に前記接合部材を押圧し、前記接合部材の前記基板対向面または前記側壁対向面の幅方向の両側縁部に、前記接合部材の金属酸化膜が除去された領域を形成することを含み、
前記接合部材溶融工程は、前記接合部材に局所加熱光を照射し、前記接合部材の金属酸化膜が除去された前記領域に対して、選択的に熱量を投入することを含むことを特徴とする、外囲器の製造方法。 A joining member disposing step of disposing a joining member made of metal along the entire circumference of the side wall between the substrate and the frame-shaped side wall so as to contact the substrate and the side wall;
The at least one surface of the bonding member such that a part of at least one of the substrate facing surface that is the surface facing the substrate or the side wall facing surface that is the surface facing the side wall is an unmelted portion. A joining member melting step for melting the joining member at,
Solidifying the molten joining member;
Only including,
The joining member melting step includes forming the non-melting portion over 90% or more of the entire circumference of the side wall,
In the bonding member arranging step, the bonding member is pressed in a direction in which the substrate and the side wall face each other, and the bonding member is formed on both side edges of the bonding member in the width direction of the substrate facing surface or the side wall facing surface. Forming a region where the metal oxide film is removed,
The joining member melting step includes irradiating the joining member with local heating light and selectively supplying heat to the region where the metal oxide film of the joining member is removed. The manufacturing method of the envelope. 前記局所加熱光は、前記両側縁部の少なくとも一方の縁部に照射され、前記少なくとも一方の縁部が溶融されることを特徴とする、請求項１に記載の外囲器の製造方法。The method for manufacturing an envelope according to claim 1, wherein the local heating light is applied to at least one edge of the both side edges, and the at least one edge is melted. 前記局所加熱光は、前記両側縁部に照射され、前記両側縁部が溶融されることを特徴とする、請求項２に記載の外囲器の製造方法。The method for manufacturing an envelope according to claim 2, wherein the local heating light is applied to both side edges, and the both side edges are melted. 前記接合部材配置工程は、前記接合部材の前記基板対向面または前記側壁対向面の少なくとも一方の面上に形成された前記金属酸化膜の一部を前記側壁に沿って除去する工程を含み、
前記接合部材溶融工程は、前記接合部材の前記金属酸化膜を除去した部分を溶融させることを含む、請求項１から３のいずれか１項に記載の外囲器の製造方法。 The bonding member arranging step includes a step of removing a part of the metal oxide film formed on at least one of the substrate facing surface and the side wall facing surface of the bonding member along the side wall,
4. The method of manufacturing an envelope according to claim 1, wherein the joining member melting step includes melting a portion of the joining member from which the metal oxide film is removed. 前記接合部材溶融工程は、前記接合部材をレーザで加熱することを含む、請求項１から４のいずれか１項に記載の外囲器の製造方法。 The joining member melting step comprises heating the joining member with a laser, the envelope method according to any one of claims 1 4. 外囲器と、該外囲器に内包された表示素子と、を有する画像表示装置の製造方法であって、前記外囲器を請求項１から５のいずれか１項に記載の製造方法で製造することを含む、画像表示装置の製造方法。 6. A manufacturing method of an image display device comprising an envelope and a display element included in the envelope, wherein the envelope is a manufacturing method according to any one of claims 1 to 5. A manufacturing method of an image display device including manufacturing. 画像表示装置と、映像信号を選択して受信する受信回路と、該受信回路で受信する映像信号から、前記画像表示装置に出力する画像信号を生成する画像信号生成回路と、を有する映像受信表示装置の製造方法であって、前記画像表示装置を請求項６に記載の製造方法により製造することを含む、映像受信表示装置の製造方法。 Video reception display comprising: an image display device; a reception circuit that selects and receives a video signal; and an image signal generation circuit that generates an image signal to be output to the image display device from the video signal received by the reception circuit A method for manufacturing a video receiving display device, comprising: manufacturing the image display device by the manufacturing method according to claim 6 .
JP2008273263A 2008-10-23 2008-10-23 Envelope, image display device, and video receiving display device manufacturing method Expired - Fee Related JP5311961B2 (en)

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