JP5303858B2 - Multilayer film forming method, multilayer film forming apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to a multilayer film forming method, a multilayer film forming apparatus, and a device manufacturing method.

Conventionally, a circuit pattern is formed on an electric substrate using a fluid ejecting apparatus. A fluid containing a circuit pattern forming material is directly sprayed on an electric substrate, and the fluid is dried to form a circuit pattern. It was. The multilayer circuit pattern was formed by repeating this process. (Patent Document 1)
JP 2004-356296 A

  However, in the method of forming a film by drying a fluid, it takes a long time to form a multilayer film because it takes time to form a single layer.

  It is an object of the present invention to provide a multilayer film forming apparatus, a multilayer film forming method, and a device manufacturing method that form a multilayer film in a short time.

An apparatus for forming a multilayer film on a substrate, wherein a plurality of fluid ejecting heads ejecting a fluid containing a solid component forming the film, and the fluid ejecting heads are arranged to face the fluid ejecting heads. Of the first fluid ejecting head and the second fluid ejecting head of the plurality of fluid ejecting heads and having a permeability, and the fluid from the plurality of fluid ejecting heads A transfer device that transfers the multilayer film formed on the substrate by spraying the substrate onto the substrate; and a plurality of fluid ejecting heads disposed on the substrate and the multilayer film formed on the substrate. And a third fluid ejecting head that ejects a fluid for forming an adhesive layer on the substrate , wherein the multilayer film is bonded onto the substrate via the adhesive layer. A film forming apparatus.
An apparatus for forming a multilayer film on a substrate, wherein a plurality of fluid ejecting heads ejecting a fluid containing a solid component that forms the film, and the fluid ejecting heads are arranged to face each other, and the plurality of fluids A base material that moves between the ejection heads and has permeability, and a transfer device that transfers the multilayer film formed on the base material onto the substrate by ejecting the fluid from the plurality of fluid ejection heads. It is a multilayer film forming apparatus characterized by having. By providing this structure, the multilayer film can be formed in one process, so that a multilayer film forming apparatus capable of continuously manufacturing a plurality of multilayer films in a short time can be obtained.

Wherein the fluid ejecting head, landing point on the base of the fluid ejected from the fluid ejecting head, along the moving direction of the _{substrate, L n ≧ U (m n} s n V n0 / k n which is preferably arranged at intervals L _n which satisfies the formula represented by a _n) ^2.
However,
L _n : Distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream flow in the moving direction of the substrate. moving speed m _n of: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: a bottom area of the fluid. By providing this configuration, after the liquid component is removed from the fluid on the base material, the next fluid is supplied onto the base material. It can be set as the multilayer film formation apparatus which is not mixed.

Distance _{L n} of the fluid ejecting _head, it is preferable to substantially match the _{U (m n s n V n0} / k n A n) 2. By having this configuration, the solid component of each film is mixed in the vicinity of the boundary between the adjacent films, so that a multilayer film forming apparatus that forms a multilayer film with improved adhesion between layers can be obtained. it can.

  The substrate preferably has pores smaller than the particle size of the particles contained in the solid component. With this structure, since the film is not fixed to the base material, a multilayer film forming apparatus capable of reliably transferring to the substrate can be obtained.

  The fluid ejecting head is preferably a line head. By providing this structure, the multilayer film can be formed without stopping the base material. Therefore, a multilayer film forming apparatus that forms the multilayer film in a short time can be obtained.

  It is preferable that the base material is reused by moving from the transfer device to the front surface of the fluid ejecting head after the transfer of the multilayer film. By providing this structure, the amount of the base material used can be suppressed, so that a multilayer film forming apparatus with reduced manufacturing costs can be obtained.

  It is preferable that a cleaning device and a drying device are provided after the transfer device and before the fluid ejecting head. By providing this structure, it is reused after removing the remainder of the multilayer film that has not been transferred to the substrate, so that even if the base material is reused, there is no problem with the multilayer film to be formed. A highly reliable multilayer film forming apparatus can be obtained.

  It is preferable that the base material is in a tape shape, and includes a supply device having a feeding roll on which the base material is wound, and a recovery device for recovering the base material after the multilayer film is transferred to the substrate. By providing this structure, the multilayer film can be transferred using the new base material at all times, so that a highly reliable multilayer film forming apparatus can be obtained. In addition, since the interval between the supply device and the recovery device can be easily changed, a multilayer film forming device in which more layers are stacked can be obtained.

A method of forming a multilayer film on a substrate using a multilayer film forming apparatus including a plurality of fluid ejecting heads, wherein fluid is sequentially ejected from a plurality of fluid ejecting heads onto the base material moving on the front surface of the head. A method for forming a multilayer film, comprising: forming a multilayer film; and transferring the multilayer film formed on the substrate. According to this method, since the multilayer film can be formed in one process, a multilayer film forming method that can continuously manufacture a plurality of multilayer films in a short time can be obtained.

The interval between the landing points of the fluid on the substrate is along the moving direction of the substrate.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
In from the fluid ejecting head disposed with a distance L _n satisfying the equation represented, it is preferred to inject the fluid to the substrate. However,
L _n : Distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream flow in the moving direction of the substrate. moving speed m _n of: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: a bottom area of the fluid. According to this method, after the liquid component is removed from the fluid on the base material, the next fluid is supplied onto the base material. Therefore, the multilayered film does not mix the stacked films. It can be a forming method.

Distance _{L n} of the fluid ejecting _head, it is preferable to substantially match the _{U (m n s n V n0} / k n A n) 2. According to this method, since the solid component of each film is mixed in the vicinity of the boundary between adjacent films, a multilayer film forming method for forming a multilayer film with improved adhesion between layers can be obtained. .

  It is preferable to have a step of forming an adhesive layer on the multilayer film after the multilayer film formation step and before the transfer step. According to this method, since the multilayer film can be securely fixed to the substrate, a multilayer film forming method that improves the manufacturing yield can be obtained.

  It is preferable that the multilayer film forming step is performed again on the base material after the transfer step. According to this method, since the amount of the base material used can be suppressed, a multilayer film forming method with reduced manufacturing cost can be obtained.

  It is preferable to have a washing process and a drying process after the transfer process and before the multilayer film forming process. According to this method, since the base material is reused after removing the remainder of the multilayer film that has not been transferred to the substrate, a highly reliable multilayer film forming method even if the base material is reused It can be.

  It is preferable that the base material is supplied from a feed roll on which the tape-shaped base material is wound to form the multilayer film, and the base material is recovered after the transfer step. According to this method, since the multilayer film can be transferred using the new base material at all times, a highly reliable multilayer film forming method can be achieved. Moreover, since the supply device and the recovery device can be installed at arbitrary positions, a multilayer film forming method for forming a multilayer film having more layers can be provided.

  It is a device manufacturing method using the multilayer film forming method according to the present invention. According to this method, since the formation of the multilayer film can be performed in one process, a multilayer film forming method for forming the multilayer film in a short time can be obtained.

[First Embodiment]
(Configuration of multilayer film forming apparatus)
The configuration of the multilayer film forming apparatus of the present invention will be described below. FIG. 1 is a side view of the multilayer film forming apparatus 1 according to the first embodiment of the present invention as viewed in the Y-axis direction. A first fluid ejecting head 21, a second fluid ejecting head 22, a third fluid ejecting head 23, and an adhesive head (in order from the top of the medium 10 along the circumference of the annular medium (base material) 10. A fluid ejection head) 24 is installed. During the operation of the multilayer film forming apparatus 1, the medium 10 moves from the first fluid ejecting head 21 toward the adhesive head 24, while the ink (fluid) 21 a, 22 a, 23 a and the adhesive liquid ( Fluid) 24a is jetted onto the media. A transfer roller (transfer device) 40 is disposed in contact with the inner side of the medium 10 downstream of the adhesive head 24. A cleaning machine (cleaning device) 50 and a dryer (drying device) 60 are installed downstream of the transfer roller 40. The media 10 is circulated through these devices and reused. On the side opposite to the transfer roller 40, a substrate 30 is disposed in contact with the medium 10. A plurality of substrate transport rollers 70 are arranged on the lower surface of the substrate 30.

  The medium 10 is formed in a cylindrical shape having a central axis in the Y-axis direction shown in the figure, and a material that is porous and permeable at least on the outermost surface is used. As the medium 10, for example, a material obtained by solidifying silica, alumina or the like with a polymer, ceramic, or the like is used.

  Among these materials, ceramics has a high porosity and has pores with an average pore diameter of about several tens of μm. Ceramics are formed by firing at a high temperature, and therefore pores with smooth wall surfaces are connected. Therefore, ceramic exhibits an excellent capillary phenomenon and can absorb various liquids at high speed. Ceramic is a material with excellent chemical resistance.

  The medium 10 may be formed in a two-layer structure of a base material layer 10a that does not have permeability and a penetration layer 10b that has permeability. In the present embodiment, a medium 10 having a two-layer structure is used. By adopting a two-layer structure, it is possible to ensure the rigidity of the medium 10 and adjust the permeability of the inks 21a, 22a, and 23a.

  In the present embodiment, the medium 10 is substantially circular when viewed in the Y-axis direction. However, the multilayered film is formed by keeping the distance between the fluid ejecting heads 21, 22, 23 and the adhesive head 24 constant. Any shape can be used as long as it can be transferred to the substrate 30 (not shown).

  The first fluid ejecting head 21, the second fluid ejecting head 22, and the third fluid ejecting head 23 extend in the Y-axis direction in the drawing, and a line in which nozzles are formed in the width direction (Y-axis direction) of the medium 10. Head. The fluid ejecting heads 21, 22, and 23 are used to eject inks 21 a, 22 a, and 23 a containing solid components that form a film on the medium 10. In the present embodiment, the multilayer film forming apparatus 1 that forms a three-layer film on the substrate 30 is shown, but a multilayer film forming apparatus that forms a multilayer film by adding a fluid ejecting head can be provided.

  The adhesive head 24 is a line head that extends in the Y-axis direction in the drawing and has nozzles formed in the width direction (Y-axis direction) of the medium 10. From the adhesive head 24, an adhesive liquid 24 a (fluid) containing an adhesive component is ejected onto the solid component laminated on the medium 10.

The fluid ejecting heads 21, 22, 23 and the adhesive head 24 described above are installed so as to satisfy the following formula.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
However,
L _n : Distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream flow in the moving direction of the substrate. moving speed m _n of: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume k _n of the fluid (ink): permeation velocity of the fluid (ink) a _n: the bottom area of the fluid (ink) is there.

Will now be described wherein _{L n ≧ U (m n s} n V n0 / k n A n) 2. First, ink that does not contain a solid component will be described. FIG. 2 is a diagram illustrating the penetration of the ink 27. When the ink lands on the medium 10 (FIG. 2A), the pores 10c of the medium 10 are regarded as capillaries, and the capillary force F and the viscous friction force _Fη work (FIG. 2B). Satisfies.
F = F _η
F = 2πRγ cos θ _E
F _η = 8πηz (t) dz / dt
However,
R: capillary radius γ: surface tension θ _E : contact angle η: fluid (ink) viscosity z: fluid (ink) penetration distance t: penetration time From these equations,
z (t) = (Rγ cos θ _E / 2η) ^1/2 · t ^1/2
Is obtained. Since the ink 27 does not contain a solid component, all the ink 27 penetrates into the medium 10 (FIG. 2C).

Next, the case where the ink contains a solid component will be described. FIG. 3 shows permeation of the ink 28 containing a solid component. In the landed ink 28 (FIG. 3A), the liquid component penetrates into the medium 10, but since the solid component is larger than the pores 10c, the solid component is deposited on the medium 10 (FIG. 3B). Thus, the pressure loss F _L by deposition layer 28a to be formed is generated, osmotic when containing solid component can be expressed as follows.
FP / (n _p A) = F _η
However,
_np : number of capillaries per unit area A: contact area of fluid (ink) P: total pressure loss due to deposited layer

Ruth's cake filtration theory is known for dealing with pressure loss, and its equation is shown below.
p = dY / dt · μ ′ / A ² t · Yρsα / (1-ms)
P = dz / dt · ηzA · ρsα / (1-ms)
However,
p: Pressure loss due to the deposited layer Y: Total filtration amount μ ': Fluid (ink) viscosity ρ: Fluid (ink) density s: Solid component concentration α: Average resistivity of the deposited layer m: Dry / wet weight ratio of the deposited layer It is.

Solving the above equation yields the following equation representing the penetration distance of the ink 28 having a solid component.
z (t) = (Rγcos θ _E / 2η) ^1/2 · (1 / (ρsα / 8πn _p (1-ms) +1)) ^1/2 · t ^1/2

Place the proportionality constant of the equation and k _n, the following equation is obtained.
_{V n / A n = k n} · t 1/2
However,
V _n : fluid (ink) volume _An : fluid (ink) bottom area

The volume of the deposited layer 28a formed by the permeation of this ink is expressed by the following equation.
V _nc = m _n s _n V _n0
However,
V _nc : Volume of the deposited layer _mn : Dry / wet weight ratio of the deposited layer s _n : Solid component concentration V _n0 : Initial volume of fluid (ink).

When the volume of the ink 28 is only the deposited layer 28a (FIG. 3C) is the cake formation time, the following equation is established.
_{t nc = (m n s n} V n0 / k n A n) 2

Therefore, if the fluid ejecting heads 21, 22, 23, and 24 are installed so that the ink landing point interval L _n satisfies the following expression, the next ink is transferred before the liquid component of the ink penetrates the medium 10. Since it is not arranged, the next ink can be ejected onto the solidified film.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
However,
U: Substrate moving speed

  Returning to FIG. 1, the transfer roller 40 is disposed in contact with the lower part inside the medium 10 in the drawing. The transfer roller 40 is disposed with a central axis in the Y-axis direction shown in the figure. The transfer roller 40 is used to press the medium 10 against the substrate 30 and transfer the multilayer film laminated on the medium 10 to the substrate 30.

  The substrate 30 is a device substrate for transferring a solid component laminated by the medium 10. The board | substrate 30 can use what has arbitrary materials and shapes by the device manufactured. Since the medium 10 has a structure sandwiched between the substrate 30 and the transfer roller 40, the solid component laminated on the medium 10 is pressed and transferred by the transfer roller 40. The substrate 30 moves to the left along the X-axis direction in the figure by the rotation of the medium 10 and the transfer roller 40.

  The substrate transport roller 70 is disposed with a central axis in the Y-axis direction shown in the figure. A plurality of substrate transport rollers 70 are arranged in the X-axis direction and can be easily rotated. The substrate transport roller 70 is used to move the substrate 30 smoothly.

  The cleaning machine 50 extends in the Y-axis direction in the drawing and is installed across the width direction (Y-axis direction) of the medium 10. The cleaning machine 50 cleans the film forming surface of the media 10 while circulating the media 10 inside.

  The dryer 60 extends in the Y-axis direction in the figure and is installed across the width direction (Y-axis direction) of the medium 10. The dryer 60 removes the cleaning liquid remaining on the medium 10 while circulating the medium 10 inside.

(Multilayer film formation method)
Next, a multilayer film forming method using the multilayer film forming apparatus 1 according to this embodiment will be described. FIG. 4 is a diagram illustrating a manufacturing process of a multilayer film. The continuous formation of the multilayer film is performed by a multilayer film formation process, a transfer process, a cleaning process, and a drying process.

  First, the multilayer film forming process will be described. The substrate 30 is moved by rotating the medium 10 and the transfer roller 40. While the medium 10 moves between the fluid ejecting heads 21, 22, 23 and the adhesive head 24, ink (fluid) is formed on the permeation layer 10 b of the medium 10 based on the multilayer film data formed on the substrate 30. ) 21a, 22a, 23a, and 24a are sequentially injected. The first ink (fluid) 21 a ejected from the first fluid ejecting head 21 is transferred to the substrate 30 in order to transfer the laminated solid component. A film to be formed is formed.

  The liquid component 21b of the first ink 21a ejected from the first fluid ejecting head 21 onto the medium 10 (FIG. 4A) penetrates into the medium 10 through the hole 10c of the medium 10. However, since the particle size of the solid component 21c in the first ink 21a is larger than the pores of the osmotic layer 10b, the particle does not penetrate into the osmotic layer 10b (FIG. 4B). After a certain period of time, the liquid component 21b of the first ink 21a penetrates into the medium 10, and only the solid component 21c remains on the medium 10 to form the first thin film layer 21d. (FIG. 4 (c)). During this time, the medium 10 and the transfer roller 40 are rotating.

  Next, when the portion of the medium 10 on which the first thin film layer 21d is formed moves to the front surface of the second fluid ejecting head 22, the second fluid ejecting head 22 moves onto the first thin film layer 21d as shown in FIG. The second ink 22a is ejected to form the second thin film layer 22d (FIG. 4D). Similarly, the third ink 23a of FIG. 1 is ejected from the third fluid ejecting head 23 onto the second thin film layer 22d, and the third thin film layer 23d is formed to form the multilayer film 25 (see FIG. FIG. 4 (e)). Further, an adhesive liquid (fluid) 24a is ejected from the adhesive fluid ejecting head 24 on the multilayer film 25 to form an adhesive layer 24d (FIG. 4F).

  In FIG. 4, the case where the multilayer film 25 on the medium 10 is formed by stacking all the thin film layers 21d, 22d, and 23d has been described. However, not all of the thin film layers 21d, 22d, and 23d may be formed in the multilayer film 25. At this time, the adhesive liquid 24a is sprayed onto the uppermost layer that forms the multilayer film 25, thereby forming the adhesive layer 24d.

  The multilayer film 25 can be easily transferred to the substrate 30 by the adhesive layer 24d. However, the adhesive layer 24d is not used by replacing the solid components 21c, 22c, and 23c of each ink. The multilayer film 25 can be transferred to the substrate 30.

  In this embodiment, line heads are used as the fluid ejecting heads 21, 22, 23, and 24, and a desired film is continuously formed while the medium 10 is circulated.

  The multilayer film forming process is thus completed, and the process proceeds to the transfer process. FIG. 5 is a diagram showing a transfer process to the substrate 30. The multilayer film 25 and the adhesive layer 24b formed on the medium 10 are carried to the lowermost part where the transfer roller 40 of FIG. At the bottom of the medium 10, the multilayer film 25 and the adhesive layer 24d are sandwiched between the medium 10 and the substrate 30, and are pressed by the transfer roller 40 that is in contact with the inside of the medium 10 and rotates (see FIG. 5 (a)). As a result, the multilayer film 25 is transferred to the substrate 30 via the adhesive layer 24d (FIG. 5B).

  After the transfer process, the medium 10 is circulated through the cleaning machine 50 shown in FIG. In the cleaning process, the multilayer film 25 and the adhesive layer 24d remaining on the surface of the medium 10 are removed, and the liquid components 21b, 22b, and 23b of the first ink 21a, 22a, and 23a that have penetrated into the medium are washed away. It is.

  The media 10 that has finished the cleaning process is circulated through the dryer 60 of FIG. In the drying process, the remaining cleaning liquid used in the cleaning machine 50 is removed, and the media 10 is dried.

  After the drying process, the medium 10 is reused, and the multilayer film formation process, the transfer process, the cleaning process, and the drying process are performed again. A multilayer film is formed on the substrate 30 through the above steps.

(Function, effect)
The operation and effect of using the multilayer film forming apparatus 1 of the present invention will be described. On the medium 10, the distance between the landing points of the ink 21 a, 22 a, 23 a from the fluid ejecting head and the adhesive liquid 24 a from the adhesive head 24 is relative to the moving direction of the medium 10.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
L _n : The distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream in the moving direction of the base material U: moving speed m n of the _substrate: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: to satisfy equation bottom area of the fluid fluid jet By arranging the heads 21, 22, 23 and the adhesive head 24, the liquid component is removed from the ink on the medium 10, and then the next ink is supplied onto the medium 10. Thus, the apparatus can form a multilayer film so that the formed films are not mixed. Further, the adhesive liquid 24a can be ejected without being mixed with the inks 21a, 22a, and 23a.

  By using a line head for the fluid ejecting heads 21, 22, 23 and the adhesive head 24, the multilayer film 25 can be continuously formed on the medium 10 moving at a constant speed. While shortening, the multilayer film 25 can be formed at low cost.

  By providing the washer 50 and the dryer 60, the media 10 can be washed and reused, so that the multilayer film 25 can be formed at low cost.

  By providing the adhesive layer 24d between the multilayer film 25 and the substrate 30, the multilayer film 25 can be reliably bonded to the substrate 30, so that the multilayer film 25 can be manufactured with high yield.

(Concrete example)
Below, the example of the manufacturing method of the device using the multilayer film forming apparatus 1 of this invention is given.
<Color filter substrate>
6A is a diagram illustrating a manufacturing process of a multilayer film 190 for a color filter, and FIG. 6B is a diagram illustrating a laminated structure of the color filter 100. FIG.

  The medium 10 moves to the left along the illustrated X axis. Ink containing ITO particles is ejected onto the medium 10 to form the electrode 110. A protective film 120 is formed on the electrode 110 using black resin, metal particles, or the like. Further, a light shielding layer 130 is formed on the protective film 120.

  Next, the red layer 140R, the green layer 140G, and the blue layer 140B are sequentially formed on the light shielding film 130, and then the adhesive layer 150 is formed on the entire surface. At this time, the adhesive layer 150 is formed on the light shielding layer 130 in a region where the red layer 140R, the green layer 140G, and the blue layer 140B are not formed.

  Through the above steps, the color filter multilayer film pattern 190 including the multilayer film patterns 190R, 190G, and 190B corresponding to the respective colors is formed (FIG. 6A).

  The color filter multilayer film 190 is transferred to the substrate 30 using the transfer roll 40 shown in FIG. 1, thereby forming the color filter 100 (FIG. 6B).

  The formed color filter 100 is used for a display device or the like. The white light incident from the back surface of the color filter 100 passes red light when passing through the red color filter 100R, green light when passing through the green color filter 100G, and blue light when passing through the blue color filter 100B. Radiate.

<Printed wiring board>
As a next example, a method for manufacturing the printed circuit board 200 will be described. 7A is a plan view of the printed circuit board 200, FIG. 7B is a diagram illustrating a manufacturing process of the multilayer film 290 for the printed circuit board, and FIG. 7C is a cross-sectional view taken along line AA ′ of the plan view of the printed circuit board 200. As a board | substrate used for the printed circuit board 200, the small sized flexible board | substrate mounted in an electronic device etc., the large sized board | substrate used for production facilities etc. are mentioned.

  It is assumed that the medium 10 moves to the left along the illustrated X axis (FIG. 7B). A first insulating layer 210 is formed on the medium 10, and a first wiring layer 220 is patterned on the first insulating layer 210. A second insulating film 230 is formed on the formed first wiring layer 220. At this time, the second insulating layer 230 is formed on the first insulating layer 210 in a region where the first wiring layer 220 is not formed.

  Next, the second wiring layer 240 is patterned on the second insulating layer 230. Further, a third insulating layer 250 is formed on the second wiring layer 240. At this time, the third insulating layer 250 is formed on the second insulating layer 230 in a region where the second wiring layer 240 is not formed. Further, an adhesive layer 260 is formed on the third insulating layer 250. Through the above steps, a multilayer film pattern 290 is formed on the medium 10 (FIG. 7B).

  Next, the multilayer film pattern 290 formed on the medium 10 is transferred to the substrate 30 to manufacture the printed circuit board 200 (FIG. 7C). The printed circuit board 200 to which the multilayer film pattern 290 has been transferred is flowed to the next step, and circuit elements 201, 202, 203, 204, and the like are mounted.

(Modification)
In the modification of the present embodiment, the landing point interval L _n of the first inks 21 a, 22 a, and 23 a from the fluid ejecting heads 21, 22, and 23 in FIG. _{m n s n V n0 / k} n A n) 2 moving and being arranged to be substantially equal to each other.
However,
L _n : The distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the uppermost stream in the moving direction of the medium 10 U: moving speed m _n of the substrate: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: a bottom area of the fluid.

  With this configuration, the next ink is ejected around the point where all the liquid components 21b, 22b, and 23b of the first ink 21a, 22a, and 23a penetrate into the medium 10. For this reason, the solid components 21c, 22c, and 23c of each layer are partially mixed in the boundary region between the thin film layers 21d, 22d, and 23d.

  Thereby, the adhesion between the thin film layers can be improved during the transfer to the substrate 30. Further, when connecting wirings of different layers, contact resistance between the wirings can be suppressed.

[Second Embodiment]
FIG. 8 is a Y-axis side view of the multilayer film forming apparatus 500 according to the second embodiment. The configuration of the multilayer film forming apparatus 500 of this embodiment will be described below. Fluid ejecting heads (fluid ejecting devices) 521, 522, 523, and 524 are arranged to face the media 510 fed out from the wound media roll (supply device) 515, and ink ( Fluid) 521a, 522a, 523a, and adhesive liquid (fluid) 524a. A transfer roller 540 is installed on the left side of the fluid ejecting head 524 in the figure. A substrate 530 is disposed on the opposite side of the medium 510 from the transfer roller 540, and a substrate transport roller 570 is disposed on the lower surface of the substrate 530.

  In the multilayer film forming apparatus 500 of this embodiment, the medium 510 is flown in one direction without being circulated, and the medium 510 that has finished the transfer process is discarded without being reused. For this reason, in this embodiment, a washing process and a drying process are not performed.

  However, for example, by providing a collection device (not shown), the media 510 after the transfer process can be collected and reused by performing a washing process and a drying process. Alternatively, after the transfer process, the washing process and the drying process may be performed and then recovered and reused.

  The operation and effect of using the multilayer film forming apparatus 500 of this embodiment will be described below. By adjusting the distance between the media roll 515 and the transfer roll, the medium 510 can be fed out longer, so that more fluid ejecting heads are installed between them to form a multilayer film having more films. be able to.

  Since the cleaning process and the drying process are not required, the multilayer film forming apparatus 500 can be made small. This also allows more equipment to be installed within the manufacturing process.

Y axis view side view of multilayer film forming apparatus 1 The figure which shows the osmosis | permeation process of the ink 27 The figure which shows the osmosis | permeation process of the ink 28 Diagram showing manufacturing process of multilayer film The figure which showed the transfer process to the board | substrate 30 The figure which shows the manufacturing process of the color filter 100 The figure which shows the manufacturing process of the printed circuit board 200 Y axis view side view of multilayer film forming apparatus 500

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multilayer film forming apparatus, 10 ... Media (base material), 21 ... 1st fluid ejecting head, 22 ... 2nd fluid ejecting head, 23 ... 3rd fluid ejecting head, 24 ... Adhesive head, 25 ... Multilayer film, 30 ... Substrate, 40 ... Transfer roller, 50 ... Washing machine, 60 ... Dryer, 70 ... Substrate transport roller, 100 ... Color filter, 200 ... Print substrate

Claims (15)

An apparatus for forming a multilayer film on a substrate,
A plurality of fluid ejecting heads for ejecting a fluid containing a solid component forming a film;
Arranged to face the fluid ejecting head, and moves between a first fluid ejecting head of the plurality of fluid ejecting heads and a second fluid ejecting head of the plurality of fluid ejecting heads; A substrate having permeability,
A transfer device that transfers the multilayer film formed on the base material onto the substrate by ejecting the fluid from the plurality of fluid ejecting heads;
A third fluid ejecting head which is disposed together with the plurality of fluid ejecting heads and ejects a fluid for forming an adhesive layer on the multilayer film formed on the substrate;
Have
The multilayer film forming apparatus, wherein the multilayer film is bonded onto the substrate through the adhesive layer. The multilayer film forming apparatus according to claim 1,
The fluid ejecting head includes:
The landing point of the fluid ejected from the fluid ejecting head on the substrate is along the moving direction of the substrate.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
A multilayer film forming apparatus, characterized in that the multilayer film forming apparatus is arranged with an interval Ln satisfying an expression represented by:
However,
L _n : Distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream flow in the moving direction of the substrate. moving speed m _n of: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: a bottom area of the fluid. The multilayer film forming apparatus according to claim 2, wherein
Distance _{L n} of the fluid ejecting _head, the multilayer film forming apparatus characterized by matching the _{U (m n s n V n0} / k n A n) 2. The multilayer film forming apparatus according to any one of claims 1 to 3,
The substrate is a multilayer film forming apparatus characterized by having a smaller pore than the particle diameter of particles contained in the solid body component. In the multilayer film formation apparatus according to any one of claims 1 to 4,
The multilayer film forming apparatus, wherein the fluid ejecting head is a line head. In the multilayer film formation apparatus according to any one of claims 1 to 5,
The multilayer film forming apparatus, wherein the substrate is reused after being transferred from the transfer apparatus to the front surface of the fluid ejecting head after the transfer of the multilayer film. The multilayer film forming apparatus according to claim 6, wherein
A multilayer film forming apparatus comprising a cleaning device and a drying device at a stage after the transfer device and before the fluid ejecting head. In the multilayer film formation apparatus according to any one of claims 1 to 5,
The base material is tape-shaped,
A supply device having a feed roll wound with the substrate;
A collection device for collecting the base material after transferring the multilayer film to the substrate;
A multilayer film forming apparatus comprising: A method of forming a multilayer film on a substrate using a multilayer film forming apparatus including a plurality of fluid ejecting heads,
Forming a multilayer film by sequentially ejecting fluid from a plurality of fluid ejection head to the substrate you move the front of the plurality of fluid ejecting head,
Ejecting a fluid for forming an adhesive layer on the multilayer film from the fluid ejecting head disposed together with the plurality of fluid ejecting heads to the multilayer film;
Transferring the multilayer film formed on the base material onto the substrate via the adhesive layer;
A method for forming a multilayer film, comprising: The multilayer film forming method according to claim 9,
The interval between the landing points of the fluid on the substrate is along the moving direction of the substrate.
_{L n ≧ U (m n s} n V n0 / k n A n) 2
A method of forming a multilayer film, comprising: ejecting the fluid onto the base material from the fluid ejecting head arranged with an interval Ln satisfying an expression represented by:
However,
L _n : Distance between the landing point of the fluid ejected from the nth fluid ejecting head and the landing point of the fluid ejected from the (n + 1) th fluid ejecting head, counted from the most upstream flow in the moving direction of the substrate. moving speed m _n of: wet and dry weight ratio of the solid components s _n: concentration of solid component V _n0: initial volume of the fluid k _n: permeation rate of the fluid a _n: a bottom area of the fluid. The multilayer film forming method according to claim 10,
The multilayer film forming method, wherein the interval L _n between the fluid ejecting heads is _equal to U (m _n s _n V _n0 / k _n A _n ) ² . A multilayer film forming method according to any one of claims 9 to 11,
Multilayer film forming method characterized by a step of to the base material having been subjected to the process of the transfer, again forming the multilayer film. The multilayer film forming method according to claim 12,
Subsequent and the step of the transfer, the upstream of the step of forming the multilayer film, the multilayer film forming method characterized by having a washing and drying steps. A multilayer film forming method according to any one of claims 9 to 11,
Supplying the base material from a feed roll on which the tape-shaped base material is wound to form the multilayer film;
A method for forming a multilayer film, wherein the substrate is recovered after the transfer step.   The device manufacturing method using the multilayer film formation method of any one of Claims 9-14.

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