JP5293704B2 - Coil parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coil component capable of reducing reflection of signals. <P>SOLUTION: In the coil component, the cross section of a conductor pattern P1 is in a recessed and projected shape in the lamination direction of a ceramic layer C2 or the like, and recesses and projections 13 are formed along the extension direction of the conductor pattern P1. A high frequency current for which the frequency of signals is increased flows on the surface of the conductor pattern P1 by a skin effect. At the time, since the cross section of the conductor pattern P1 is in the recessed and projected shape, a surface area is larger compared to a conventional conductor pattern whose cross section is rectangular. Thus, resistance to the high frequency current is lowered, that is impedance is reduced. Also, since the recesses and projections 13 are formed along the extending direction of the conductor pattern P1, the surface area of the conductor pattern P1 in the extending direction is increased as well, and a distance that the high frequency current is reflected and moved back and forth is increased. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a coil component.

  As a coil component, a laminated body constituted by laminating a plurality of insulator layers, a terminal electrode formed on an end surface side of the laminated body, and a plurality of conductor patterns are electrically connected to each other, and the laminated body A multilayer chip inductor having a coil disposed inside is known (for example, see Patent Document 1).

JP-A-3-136307

  When the above-described inductor component is incorporated in a signal system circuit, resistors are connected before and after the inductor component. At this time, if a signal is passed through the resistor and the inductor component, a signal transmitted through the conductor is reflected due to impedance mismatch, and the signal may be attenuated. Moreover, unnecessary radiation may be generated by reflection, which may cause noise. Therefore, it has been desired to reduce the reflection component of the signal.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a coil component that can reduce signal reflection.

  In order to solve the above-described problem, a coil component according to the present invention is configured by stacking a plurality of insulator layers and a plurality of conductor patterns electrically connected to each other. A coil component comprising a coil disposed inside and a pair of terminal electrodes formed in a laminate and connected to conductor patterns located on both ends of the coil, wherein the conductor pattern is a lamination direction of the insulator layers The cross-section in FIG. 5 is uneven, and unevenness is formed along the extending direction.

  In this coil component, the cross section of the conductor pattern has an uneven shape in the stacking direction of the insulator layers, and the unevenness is formed along the extending direction of the conductor pattern. The high-frequency current whose signal has become high frequency flows on the surface of the conductor pattern due to the skin effect. At this time, since the cross section of the conductor pattern is uneven, the surface area is larger than that of the conventional conductor pattern having a rectangular cross section. Therefore, it is possible to reduce the resistance to the high frequency current, that is, reduce the impedance. Moreover, since the unevenness is formed along the extending direction of the conductor pattern, the surface area of the conductor pattern in the extending direction is also increased, and the distance (line length) in which the high-frequency current is reflected and reciprocated is increased. Can do. Therefore, even when signal reflection occurs, the reflection component can be attenuated. As a result, signal reflection can be reduced.

  The conductor pattern has a lead-out portion connected to the terminal electrode. The lead-out portion of the conductor pattern connected to one of the terminal electrodes has an uneven shape in cross section in the stacking direction of the insulator layer, and extends. It is preferable that unevenness is formed along the present direction. The reflection of the signal occurs at the position where the impedance mismatch occurs, that is, at the terminal side where the signal is input. Therefore, by providing irregularities in the lead portion of the conductor pattern connected to the terminal electrode side to which a signal is input, signal reflection can be reduced more accurately.

  According to the present invention, signal reflection can be reduced. Thereby, noise can be reduced.

It is a perspective view which shows the coil components which concern on one embodiment of this invention. It is sectional drawing of the coil components shown in FIG. FIG. 2 is an exploded perspective view of an element body included in the coil component shown in FIG. 1. It is a perspective view which shows a conductor pattern. (A) is the longitudinal cross-sectional view of a conductor pattern, (b) is the figure which looked at the conductor pattern from the side, (c) is the figure which looked at the conductor pattern from the top. It is process drawing which shows the formation process of a conductor pattern. It is process drawing which shows the formation process of a conductor pattern. It is a figure which shows the sample of characteristic impedance measurement. It is a figure which shows a measurement result. It is a circuit diagram for demonstrating the mounting structure of the coil components which concern on this embodiment. It is a longitudinal cross-sectional view of the conductor pattern which concerns on a modification. (A) is the figure which looked at the conductor pattern which concerns on a modification from the side, (b) is the figure which looked at the conductor pattern which concerns on a modification from the top.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  1 is a perspective view showing a coil component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the coil component shown in FIG. 1, and FIG. 3 is an element body included in the coil component shown in FIG. It is a disassembled perspective view. The coil component 1 is, for example, a multilayer inductor, and includes a substantially rectangular parallelepiped element body 2 and terminal electrodes 3 and 4 respectively formed at both ends of the element body 2 in the longitudinal direction.

  The element body 2 has a pair of end faces 2a, 2b facing in the longitudinal direction and parallel to each other, a pair of main faces 2c, 2d extending so as to connect the pair of end faces 2a, 2b and facing each other, It has a pair of side surfaces 2e and 2f extending so as to connect the main surfaces 2c and 2d and facing each other. One of the main surfaces 2c and 2d is a surface corresponding to the external substrate when the coil component 1 is mounted on the external substrate (not shown).

  The terminal electrode 3 is formed so as to cover one end face 2a and main edges 2c, 2d and side faces 2e, 2f that are orthogonal to the end face 2a. The terminal electrode 4 is formed so as to cover a part of each edge of the main surface 2c, 2d and side surfaces 2e, 2f orthogonal to the other end surface 2b and the end surface 2b.

  As shown in FIGS. 2 and 3, the element body 2 is a laminated body configured by laminating a plurality of (here, 12) ceramic layers (insulator layers) C1 to C12. The element body 2 includes a coil L including conductor patterns P1 to P10, through-hole electrodes H1 to H9, and lead-out portions P1a and P10a. The element body 2 is formed by firing the ceramic layers C1 to C12 on which the conductor patterns P1 to P10 are formed, and in the actual coil component 1, the layers of the ceramic layers C1 to C12 are integrated to such an extent that they cannot be visually recognized. ing.

  The ceramic layers C1 to C12 and magnetic films F1 to F10 described later function as an insulator having electrical insulation. The ceramic layers C1 to C12 are mainly composed of ferrite (for example, Ni—Cu—Zn based ferrite, Ni—Cu—Zn—Mg based ferrite, Cu—Zn based ferrite, or Ni—Cu based ferrite). The thickness of the ceramic layers C1 to C12 is, for example, about 60 μm. The ceramic layers C1 to C12 and the magnetic films F1 to F10 may be nonmagnetic ceramics other than ferrite. Nonmagnetic ceramics include those obtained by firing a paste (green sheet) in which glass is mixed with alumina powder.

  A conductor pattern P1 and a magnetic film F1 are formed on the surface of the ceramic layer C2. The conductor pattern P1 corresponds to approximately 5/8 turns of the coil L, and is formed in a substantially C shape on the ceramic layer C2. A lead-out portion P1a is integrally formed at one end of the conductor pattern P1. The lead-out part P1a of the conductor pattern P1 is drawn out to the edge of the ceramic layer C2, and its end is exposed at the end face of the ceramic layer C2. As a result, the lead-out part P1a is electrically connected to the terminal electrode 3. The other end of the conductor pattern P1 is electrically connected to a through-hole electrode H1 formed through the ceramic layer C2 in the thickness direction. For this reason, the conductor pattern P1 is electrically connected to one end of the adjacent conductor pattern P2 via the through-hole electrode H1 in a stacked state.

  A conductor pattern P2 and a magnetic film F2 are formed on the surface of the ceramic layer C3. The conductor pattern P2 corresponds to approximately 3/4 turns of the coil L. The conductor pattern P2 is formed in a substantially U shape on the ceramic layer C3. One end of the conductor pattern P2 includes a region electrically connected to the through-hole electrode H1 in a stacked state. The other end of the conductor pattern P2 is electrically connected to a through-hole electrode H2 formed through the ceramic layer C3 in the thickness direction. Therefore, the conductor pattern P2 is electrically connected to one end of the adjacent conductor pattern P3 via the through-hole electrode H2 in a stacked state.

  The ceramic layers C5, C7, and C9 have the same configuration as the ceramic layer C3. That is, conductor patterns P4, P6, P8 and magnetic films F4, F6, F8 are formed on the surfaces of the ceramic layers C5, C7, C9. Each of the conductor patterns P4, P6, P8 corresponds to approximately 3/4 turns of the coil L, and is formed in a substantially U shape on the ceramic layers C5, C7, C9. One end of each conductor pattern P4, P6, P8 includes a region electrically connected to each through-hole electrode H3, H5, H7 in a stacked state. The other ends of the conductor patterns P4, P6, and P8 are electrically connected to through-hole electrodes H4, H6, and H8 formed through the ceramic layers C5, C7, and C9 in the thickness direction, respectively. For this reason, the conductor patterns P4, P6, and P8 are electrically connected to one end of the adjacent conductor patterns P5, P7, and P9 through the through-hole electrodes H4, H6, and H8 in a stacked state. Is done.

  A conductor pattern P3 and a magnetic film F3 are formed on the surface of the ceramic layer C4. The conductor pattern P3 corresponds to approximately 3/4 turns of the coil L. The conductor pattern P3 is formed in a substantially C shape on the ceramic layer C4. One end of the conductor pattern P3 includes a region electrically connected to the through-hole electrode H2 in a stacked state. The other end of the conductor pattern P3 is electrically connected to a through-hole electrode H3 formed through the ceramic layer C4 in the thickness direction. For this reason, the conductor pattern P3 is electrically connected to one end of the adjacent conductor pattern P4 via the through-hole electrode H3 in a stacked state.

  The ceramic layers C6, C8, and C10 have the same configuration as the ceramic layer C4. That is, conductor patterns P5, P7, P9 and magnetic films F5, F7, F9 are formed on the surfaces of the ceramic layers C6, C8, C10. Each of the conductor patterns P5, P7, and P9 corresponds to approximately 3/4 turns of the coil L, and is formed in a substantially C shape on the ceramic layers C6, C8, and C10. One end of each conductor pattern P5, P7, P9 includes a region electrically connected to each through-hole electrode H4, H6, H8 in a stacked state. The other ends of the conductor patterns P5, P7, and P9 are electrically connected to through-hole electrodes H5, H7, and H9 formed through the ceramic layers C6, C8, and C10 in the thickness direction, respectively. Therefore, the conductor patterns P5, P7, and P9 are electrically connected to one end of the adjacent conductor patterns P6, P8, and P10 through the through-hole electrodes H5, H7, and H9 in a stacked state. Is done.

  A conductor pattern P10 and a magnetic film F10 are formed on the surface of the ceramic layer C11. The conductor pattern P10 corresponds to approximately 7/8 turns of the coil L, and is formed in a substantially U shape on the ceramic layer C11. One end of the conductor pattern P10 includes a region electrically connected to the through-hole electrode H9 in a stacked state. A lead-out portion P10a is integrally formed at the other end of the conductor pattern P10. The lead-out part P10a of the conductor pattern P10 is drawn out to the edge of the ceramic layer C11, and its end is exposed on the end surface of the ceramic layer C11. As a result, the lead-out part P10a is electrically connected to the terminal electrode 4.

  As described above, the ceramic layers C1 to C12 are laminated, and the conductor patterns P1 to P10 are electrically connected to each other through the through-hole electrodes H1 to H9, so that the number of turns is 7.5. A coil L is formed. Each of the conductor patterns P1 to P10 and the lead-out portions P1a and P10a is formed of a conductive paste mainly composed of Ag or Ni.

  Then, with reference to FIG. 4, the structure of the conductor patterns P1-P10 is demonstrated in detail. FIG. 4 is an enlarged perspective view showing the conductor pattern. 5A is a longitudinal sectional view of the conductor pattern shown in FIG. 4, FIG. 5B is a view of the conductor pattern shown in FIG. 4 from the side, and FIG. 5C is FIG. It is the figure which looked at the conductor pattern shown from the top. In FIG. 5, the magnetic films F1 to F10 are not shown for convenience of explanation. Hereinafter, the conductor pattern P1 will be described as an example. As shown in each drawing, in the conductor pattern P1, the cross section (vertical cross section) in the stacking direction of the ceramic layers C1 to C12 has an uneven shape, and the unevenness 13 is formed along the extending direction.

  The conductor pattern P1 includes a flange portion 10 provided with a predetermined interval, and a connecting portion 11 that is disposed between the flange portions 10 and connects the flange portions 10 to each other. The collar part 10 and the connection part 11 are integrally formed. The flange portion 10 is formed with concave notches 12a and 12b in the upper and lower portions (in the stacking direction of the ceramic layers C1 to C12) and in the center portion, and the cross section in the stacking direction has an H shape.

  The connecting portion 11 has a substantially rectangular parallelepiped shape, is formed slightly thicker in the extending direction of the conductor pattern P1 than the flange portion 10, and has an outer dimension (outer peripheral portion) smaller than that of the flange portion 10. . Specifically, the width dimension of the connection part 11 is approximately 2/5 of the width dimension of the flange part 10. With such a configuration, the conductor pattern P1 has the irregularities 13 formed in the extending direction (the surface direction of the ceramic layer C2). The unevenness 13 is formed continuously with the conductor pattern P1. That is, the conductor pattern P1 has a so-called bellows shape.

  Then, the manufacturing method of the coil component 1 which concerns on this embodiment is demonstrated. First, the ceramic green sheet used as the ceramic layers C1-C12 is prepared. A through hole penetrating the ceramic green sheet in the thickness direction is formed at a predetermined position in the ceramic green sheet by laser processing or the like, and the through hole is filled with a conductive paste.

  Subsequently, a conductive pattern is formed by applying a conductive paste on the ceramic green sheet in a predetermined pattern. The conductor pattern is formed by screen printing, etching, sputtering, or the like. A method for forming a conductor pattern will be described with reference to FIGS. 6 and 7 are process diagrams showing a process of forming a conductor pattern. In FIG. 6, only a part of the conductor pattern is illustrated, but actually, the configuration shown in FIG. 6 is formed continuously in the longitudinal direction. Further, although the magnetic film F1 (ferrite layers FL1 to FL4) is formed in FIG. 7, the formation process will be partially omitted. In the following description, the conductor pattern P1 is taken as an example, and the formation of the conductor pattern by screen printing is described.

  The conductor pattern P1 is formed by printing a plurality of conductive pastes containing conductive powder, a binder, and the like by overlapping them. As shown in FIGS. 6A and 7A, first-layer first conductive paste layer L1 is first formed on green sheet G. As shown in FIG. 6A, the first conductive paste layer L1 has a substantially rectangular parallelepiped shape, and a plurality of first conductive paste layers L1 are formed with a predetermined interval in the extending direction of the conductor pattern P1. Thus, the first conductive paste layer L1 is formed in an uneven shape on the green sheet G. Further, as shown in FIG. 7A, a pair of first conductive paste layers L1 are formed substantially in parallel with a predetermined interval in the width direction of the conductor pattern P1.

  Next, as shown in FIGS. 6B and 7B, the ferrite layer FL1 is formed so as to fill the gap K1 formed by the first conductive paste layer L1 and the green sheet G. . The ferrite layer FL1 forms a magnetic film F1. The ferrite layer FL1 is formed so as to be substantially flush with the upper surface of the first conductive paste layer L1.

  Subsequently, as shown in FIGS. 6C and 7C, a second conductive paste layer L2 and a third conductive paste layer L3 are formed. The second conductive paste layer L2 is printed on the first conductive paste layer L1 and the ferrite layer FL1. The third conductive paste layer L3 is formed on the second conductive paste layer L2. The second conductive paste layer L2 and the third conductive paste layer L3 are formed to be smaller than the width dimension of the first conductive paste layer L1 in the portion corresponding to the connection portion 11. Specifically, as shown in FIG. 5C, the second conductive paste layer L2 and the third conductive paste layer L3 have a width dimension of about 2/5 of the width dimension of the first conductive paste layer L1. It is formed. The width dimension of the paste layer to be formed is set by adjusting the hole diameter of the screen mesh.

  Subsequently, as shown in FIGS. 6D and 7D, a fourth conductive paste layer L4 is formed. The fourth conductive paste layer L4 is formed on the third conductive paste layer L3. The fourth conductive paste layer L4 has a substantially rectangular parallelepiped shape like the first conductive paste layer L1, and has a predetermined interval in the extending direction of the conductor pattern P1 in the portion corresponding to the flange portion 10. A plurality are formed. Thereby, the fourth conductive paste layer L4 is formed in an uneven shape on the third conductive paste layer L3. Further, as shown in FIG. 7 (d), a pair of fourth conductive paste layers L4 are formed substantially in parallel with a predetermined interval in the width direction of the conductor pattern P1 in a portion corresponding to the flange portion 10. .

  Then, as shown in FIGS. 6E and 7E, the ferrite layer FL4 is formed so as to fill the gap K2 formed by the third conductive paste layer L3 and the fourth conductive paste layer L4. Is done. The ferrite layer FL4 is formed so as to be substantially flush with the upper surface of the fourth conductive paste layer L4. As described above, the conductor pattern P1 includes the first conductive paste layer L1 and the second conductive paste layer L2 from the main surface 2d side (one side in the stacking direction) to the main surface 2c side (the other side in the stacking direction). The third conductive paste layer L3 and the fourth conductive paste layer L4 are stacked in this order. The conductor patterns P2 to P10 are also formed in the same manner as the conductor pattern 1.

  Subsequently, the ceramic layers C1 to C12 are laminated in the order shown in FIG. 3, and pressure is applied in the laminating direction to perform pressure bonding to form a laminated body (not shown). The obtained laminated body is cut into chips, and then fired at a predetermined temperature (for example, about 870 ° C.) to form the element body 2. The element body 2 has, for example, a length in the longitudinal direction after firing of 2.0 mm, a width of 1.25 mm, and a height of 0.8 mm. By firing, the ceramic green sheet G becomes the ceramic layer C2, and the first to fourth conductive paste layers L1 to L4 become the conductor pattern P1. That is, the ceramic layer C2 and the conductor pattern P1 are respectively composed of a fired product of the ceramic green sheet G and a fired product of the first to fourth conductive paste layers L1 to L4.

  Thereafter, by forming the terminal electrodes 3 and 4 on the element body 2, the coil component (multilayer inductor) 1 is obtained. The terminal electrodes 3 and 4 are each baked at a predetermined temperature (for example, about 700 ° C.) after transferring an electrode paste mainly composed of silver, nickel, or copper to both end faces of the element body 2 in the longitudinal direction, It can be formed by plating. Cu, Ni, Sn, etc. can be used for electroplating.

  As described above, in the coil component 1, the cross sections of the conductor patterns P1 to P10 are uneven in the stacking direction of the ceramic layers C1 to C12, and the unevenness 13 is formed along the extending direction of the conductor patterns P1 to P10. Is formed. The high-frequency current whose signal has become high frequency flows on the surface of the conductor pattern due to the skin effect. At this time, since the cross sections of the conductor patterns P1 to P10 are uneven, the surface area is larger than that of a conventional conductor pattern having a rectangular cross section. Therefore, it is possible to reduce the resistance to the high frequency signal, that is, reduce the impedance. Moreover, since the unevenness | corrugation is formed along the extension direction of a conductor pattern, the surface area of the conductor patterns P1-P10 in the extension direction is also increasing, and the distance (line | wire length) which a high frequency current reflects and reciprocates is increased. Can be increased. Therefore, even when signal reflection occurs, the reflection component of the signal can be attenuated. As a result, signal reflection can be reduced.

  Next, it will be specifically shown that signal reflection can be reduced according to the present embodiment. Here, the impedance of the sample is measured by a TDR (Time Domain Reflectometry) method. The TDR method is a measurement method for measuring the characteristic impedance of the transmission line by sending a step pulse to the transmission line and measuring the pulse reflected at the discontinuous part of the characteristic impedance.

  Two types of samples were prepared as measurement objects. FIG. 8 is a diagram illustrating a sample of characteristic impedance measurement. As shown in FIG. 8A, in the first sample 20, the conductor pattern (electrode) 22 is linearly formed on the ferrite substrate 21. The ferrite substrate 21 having a length of 25 mm, a width of 10 mm, and a thickness of 1 mm was used. The conductor pattern 22 had a width of about 1 mm. On the other hand, as shown in FIG. 8B, in the second sample 24, the conductor pattern 25 is formed on the ferrite substrate 21 so as to be thinner than the first sample 20 and about 2 mm in width, and a part of the conductor pattern 25 is further formed. As a result of polishing, the irregularities 26 were formed on the surface. With such a configuration, the second sample 24 has a larger surface area than the first sample 20. Both samples 20 and 24 have a DC resistance of 5Ω and an inductance of about 2 μH. The measurement results by the TDR method using these samples 20 and 24 are shown in FIG.

FIG. 9 is a diagram showing measurement results. In FIG. 9, the characteristic 11 of the first sample 20 is indicated by a solid line, and the characteristic 12 of the second sample 24 is indicated by a broken line. As shown in FIG. 9, in the first sample, as can be seen from the characteristic l1, the impedance changes greatly at the position indicated by “T ₁ ”, and the impedance at the position indicated by “T ₂ ”. It has changed.

On the other hand, in the second sample 24, as can be seen from the characteristic l2, the impedance is changed at the position indicated by “T ₁ ” and is indicated by “T ₃ ” as in the first sample 20. Impedance changes at the position where In the second sample 24, the impedance changes at the position “T ₁ ” as in the first sample 20, but the change is smaller than that in the first sample 20. Also, the slope D1 of the straight line connecting “T ₁ ” in the first sample 20 and the next change point “T ₂ ”, and “T ₁ ” in the second sample 24 and the next change point “T ₃ ” are obtained. Compared with the slope D2 of the connecting straight line, the slope of the second sample 24 is small. That is, in the second sample 24 having a larger surface area than the first sample 20, the rise time is slower than that in the first sample 24.

  From the above results, by forming the unevenness 26 on the surface of the conductor pattern 25, the resistance to high-frequency current is reduced by increasing the surface area of the cross section, so that the impedance with respect to time is reduced, and the unevenness in the extending direction. As a result, the distance in which the signal is reflected and reciprocated increases, and the inclination decreases (the reflection component of the signal is attenuated).

  Subsequently, a mounting structure of the coil component 1 according to the present embodiment will be described with reference to FIG. FIG. 10 is a circuit diagram for explaining the coil component mounting structure according to the present embodiment.

  As shown in FIG. 10, the coil component 1 is inserted into a power supply line 102 to the IC 100 and an output line (for example, a clock line or a signal line) 104 from the IC 100. The coil component 1 inserted in the power line 102 constitutes an LC filter together with the capacitor 106.

  In the coil component 1 inserted into the power line 102, the terminal electrode 3 is connected to the IC 100. In the coil component 1 inserted into the output line 104, the terminal electrode 3 is also connected to the IC 100.

  In the IC 100, switching is performed at high speed in the IC 100, and noise is easily superimposed on the power supply line 102, the output line 104, and the like. However, since the reflection at the coil component 1 is reduced as described above, the superposition of noise generated in the IC 100 is reduced. In the coil (inductor) component of the prior art, since the reflection at the coil component is large, the superposition of noise generated in the IC 100 becomes large.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the conductor patterns P1 to P10 have a configuration in which the cross section has an uneven shape and the unevenness 13 is formed along the extending direction. It may be provided only in. That is, in the lead-out portions P1a and P10a connected to any one of the terminal electrodes 3 and 4 side of the conductor patterns P1 and P10, the cross section may have a concavo-convex shape and the concavo-convex 13 may be formed along the extending direction. . The reflection of the signal occurs at the position where the impedance mismatch occurs, that is, at the terminal side where the signal is input. Therefore, the reflection of the signal is more accurately performed by providing the unevenness 13 on the lead-out portion P1a of the conductor pattern P1 or the lead-out portion P10a of the conductor pattern P10 connected to one terminal electrode 3 or the terminal electrode 4 side where the signal is input. Can be reduced.

  Moreover, in the said embodiment, although the cross section of the conductor patterns P1-P10 is made into H shape as shown in FIG. 5, various shapes can be employ | adopted for the cross section of the conductor patterns P1-P10. Specifically, as shown in FIGS. 11A to 11C, for example, the cross section of the conductor pattern P1A has a concave shape in which the notch 40a is formed, and a plurality (three in this case) of notches 40a to 40a. The shape in which 40c was formed, the shape in which several (here four) notch parts 40a-40d were formed, etc. may be sufficient. In short, any shape that increases the surface area of the outer peripheral portion of the collar portion 10 as compared with a rectangular shape or a circular shape may be used.

  Similarly, the uneven shape in the extending direction of the conductor patterns P1 to P10 is not limited to the shape shown in FIG. For example, as shown in FIG. 12A, when the conductor pattern P1B is viewed from the side, the unevenness 13A may be formed in a staggered pattern. Similarly, as shown in FIG. 12B, when the conductor pattern P11B is viewed from above, the unevenness 13A may be formed in a staggered pattern. Furthermore, although not illustrated, the conductor patterns P1 to P10 may have a cross-sectional shape in a concavo-convex shape and a spiral shape in the extending direction.

  In the above embodiment, the conductor patterns P1 to P10 are formed by screen printing. However, the conductor patterns P1 to P10 may be formed by sputtering, etching, or the like. In the case of sputtering, a thin-film conductor pattern is formed by using a mask having a desired shape.

  DESCRIPTION OF SYMBOLS 1 ... Coil component, 2 ... Element body (laminated body), 3, 4 ... Terminal electrode, 13 ... Concavity and convexity, C1-C12 ... Ceramic layer (insulator layer), F1-F10 ... Magnetic body film (insulator layer), P1 to P10: Conductor patterns.

Claims (3)

A laminate formed by laminating a plurality of insulator layers;
A plurality of conductor patterns are configured to be electrically connected to each other, and a coil disposed inside the laminate,
A coil component comprising a pair of terminal electrodes formed in the laminate and connected to the conductor pattern located on both ends of the coil,
The conductor pattern is a coil component characterized in that a cross section in the stacking direction of the insulator layer has an irregular shape and irregularities are alternately formed along the extending direction. The conductor pattern has a lead-out portion connected to the terminal electrode,
The lead-out portion of the conductor pattern connected to one of the terminal electrodes has a concave-convex shape in cross section in the stacking direction of the insulator layer, and irregularities are alternately formed along the extending direction. The coil component according to claim 1.   The coil component according to claim 1 or 2, wherein the conductor pattern is formed by a method of forming a thin film.

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