JP5286782B2 - Electro-optical device substrate, electro-optical device, and electronic apparatus - Google Patents

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal display device and an electronic apparatus such as a liquid crystal projector provided with the electro-optical device.

  Since this type of electro-optical device uses a semiconductor process in the manufacturing process, problems due to static electricity or the like are likely to occur in the process. In order to prevent such a problem, for example, a technique has been proposed in which a wiring or a circuit for diffusing excessive current such as static electricity is provided on a substrate such as a mother substrate constituting the apparatus.

  For example, Patent Document 1 discloses a technique for protecting peripheral circuits such as a scanning line driving circuit and a data driving circuit from static electricity by providing a short-circuit wiring on a substrate.

JP-A-11-95257

  However, since a plurality of types of signals are supplied to the short-circuit wiring described above, current consumption varies depending on the type of signals supplied. For this reason, for example, for a signal having a high frequency such as an image signal at the time of inspection and a small current consumption, if the resistance value in the wiring is too high, transmission of a normal signal may be hindered. On the other hand, in order to effectively diffuse static electricity, a relatively high resistance value is required. In other words, the above-described technique has a technical problem that there is a possibility that a failure cannot be appropriately prevented unless the resistance value in the wiring is appropriate in accordance with a signal supplied at the time of inspection or the like.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device that can appropriately prevent problems in a manufacturing process and an electronic apparatus including the electro-optical device.

  In order to solve the above problems, an electro-optical device of the present invention is arranged in a substrate, a plurality of pixel portions arranged in a pixel region on the substrate, and a peripheral region located around the pixel region on the substrate. A peripheral circuit for supplying signals to the plurality of pixel portions; a plurality of input terminals provided in the peripheral region; and the plurality of input terminals routed from the plurality of input terminals to the peripheral circuit. A plurality of signal wirings for supplying a signal input to the peripheral circuit, an outer peripheral wiring for preventing electrostatic breakdown, and a first terminal to which a signal other than an image signal is input as the signal among the plurality of input terminals; A first resistance wiring for electrically connecting between the first resistance wiring and a resistance value lower than that of the first resistance wiring, and an image signal is input as the signal among the outer peripheral wiring and the plurality of input terminals. Electrical connection between two terminals And a second resistor wires fit.

  According to the electro-optical device of the invention, the plurality of pixel portions are arranged in the pixel region on the substrate. The plurality of pixel portions are arranged in a matrix, for example, at intervals in the vertical and horizontal directions. Peripheral circuits for supplying signals to a plurality of pixel portions are arranged in the peripheral region on the substrate. The peripheral circuits are circuits such as a scanning line driving circuit, a data line driving circuit, a selection circuit, and an inspection circuit, for example. In addition to the peripheral circuit, a plurality of input terminals are provided in the peripheral region, and signal wiring is routed from the input terminal to the peripheral circuit. The input terminal is, for example, an external circuit connection terminal that is electrically connected to a circuit or the like outside the substrate, and the input signal is supplied to the peripheral circuit through a signal wiring.

  In the present invention, the first resistance wiring for electrically connecting the first terminal to which a signal other than the image signal among the plurality of input terminals is input and the outer peripheral wiring for preventing electrostatic breakdown is provided. Is provided. In addition, a second resistance wiring is provided for electrically connecting the second terminal to which an image signal is input among the plurality of input terminals described above and the outer peripheral wiring for preventing electrostatic breakdown. Each of the first terminal and the second terminal may be one or plural, and in the case of plural, each terminal is electrically connected to the outer peripheral wiring. In other words, when there are a plurality of first terminals and second terminals, they are connected to each other via the peripheral wiring.

  The “peripheral wiring” is wiring for preventing failure or malfunction of the apparatus by diffusing excessive current such as static electricity generated during inspection. Typically, a part or all of it is formed in a part finally cut off on a mother substrate including a plurality of substrates being manufactured. Alternatively, the outer peripheral wiring may be left on each substrate after being separated from the mother substrate, and may be cut or chopped by etching or the like. In any case, the first and second terminals and the outer peripheral wiring are no longer electrically connected at the product stage, and the outer peripheral wiring or the first or second resistance wiring does not interfere with normal operation.

  At the time of inspection in the manufacturing process, for example, signals such as image signals and clock signals are supplied to a plurality of input terminals. That is, energization is performed. Here, each of the first resistance wiring and the second resistance wiring has a relatively high resistance value, so that an excessive current such as static electricity generated during energization is efficiently diffused. However, since the image signal input to the second terminal connected to the second resistance wiring has a lower current consumption and a higher frequency than signals other than the image signal, if the resistance value is too high, it may cause malfunction. There is a risk of becoming.

  In contrast, in the present invention, in particular, the second resistance wiring has a lower resistance value than the first resistance wiring. For this reason, as described above, it is possible to prevent malfunctions and the like from occurring during energization during inspection. Further, since signals other than the image signal supplied to the first terminal connected to the first resistance wiring have a higher current consumption than the image signal, they have a higher resistance value than the second resistance wiring. However, no malfunction occurs. Therefore, it is possible to effectively diffuse an excessive current such as static electricity in the first resistance wiring. Specifically, for example, the resistance value of the first resistance wiring is about 1 MΩ, and the resistance value of the second resistance wiring is several kΩ.

  As described above, according to the electro-optical device according to the invention, the resistance value of the second resistance wiring is made lower than that of the first resistance wiring, thereby preventing malfunction during inspection and excessive static electricity or the like. It is possible to prevent the device from being damaged by the current. That is, the inspection in the manufacturing process can be performed more suitably.

  In one aspect of the electro-optical device of the present invention, a plurality of the substrates are included in a matrix on the mother substrate, and the outer peripheral wiring is at least partially drawn in a gap between the adjacent substrates in the mother substrate. And is at least partially cut off when the substrate is cut from the mother substrate.

  According to this aspect, a plurality of substrates in the middle of manufacture are included in a matrix form on the mother substrate, and are finally divided so that they are configured as individual devices. Note that “division” means various divisions by dicing, scribing, cutting, and the like, and the same meaning is used in the following aspects.

  Here, the peripheral wiring is wiring that is at least partially routed in the gap between adjacent substrates in the mother substrate. That is, the first resistance wiring is a wiring for electrically connecting the outer peripheral wiring and the first terminal while the electro-optical device is being constructed on the mother substrate in the middle of manufacture. Similarly, the second resistance wiring is a wiring for electrically connecting the outer peripheral wiring and the second terminal while the electro-optical device is being constructed on the mother substrate during the manufacturing.

  The peripheral wiring is cut off at least partially when the substrate is separated from the mother substrate. Therefore, the peripheral wiring is only partially or not left on the substrate separated from the mother substrate. By cutting off the outer peripheral wiring in this way, the electrical connection between the first terminal and the outer peripheral wiring and the electrical connection between the second terminal and the outer peripheral wiring are disconnected. Therefore, it is possible to prevent the first and second terminals and the peripheral wiring from interfering with the normal operation of the apparatus in the product stage.

  In another aspect of the electro-optical device according to the aspect of the invention, a plurality of the substrates are included in a matrix form on the mother substrate, and the outer peripheral wiring is at least partially routed around the peripheral region or the outer periphery of the substrate. The outer peripheral wiring is disconnected from the second terminal and the outer peripheral wiring while the electrical connection between the first terminal and the outer peripheral wiring is disconnected when the substrate is separated from the mother substrate. Is cut off at least partly so that the electrical connection between is cut off.

  According to this aspect, similarly to the above-described aspect, a plurality of substrates in the middle of manufacture are included in a matrix in the mother substrate. The outer peripheral wiring is at least partially routed around the peripheral region or the outer periphery of the substrate. That is, the first resistance wiring is a wiring for electrically connecting the outer peripheral wiring and the first terminal while the electro-optical device is being constructed on the mother substrate in the middle of manufacture. Similarly, the second resistance wiring is a wiring for electrically connecting the outer peripheral wiring and the second terminal while the electro-optical device is being constructed on the mother substrate during the manufacturing.

  When the substrate is separated from the mother substrate, the outer peripheral wiring is disconnected from the first terminal and the outer peripheral wiring, and the second terminal and the outer peripheral wiring are electrically connected. It is cut off at least partly so as to be cut. Therefore, in the divided substrate, signals input to the first and second terminals are not supplied to the outer peripheral wiring via the first and second resistance wirings. Therefore, it is possible to prevent the first and second terminals and the peripheral wiring from interfering with the normal operation of the apparatus in the product stage.

  In another aspect of the electro-optical device according to the aspect of the invention, a plurality of the substrates are included in a matrix shape on the mother substrate, and the first and second resistance wirings are separated when the substrate is separated from the mother substrate. The electrical connection between the first terminal and the outer peripheral wiring is cut off and the electrical connection between the second terminal and the outer peripheral wiring is partially cut off. .

  According to this aspect, similarly to the above-described aspect, a plurality of substrates in the middle of manufacture are included in a matrix in the mother substrate. Then, when the substrate is separated from the mother substrate, the first resistance wiring is partially cut off, so that the electrical connection between the first terminal and the outer peripheral wiring is disconnected. Similarly, when the second resistance wiring is partially cut off, the electrical connection between the second terminal and the outer peripheral wiring is cut.

  As described above, when the first and second resistance wirings are cut off, the signals input to the first and second terminals are supplied to the outer peripheral wiring via the first and second resistance wirings in the divided substrate. It will never be done. Therefore, it is possible to prevent the first and second terminals and the peripheral wiring from interfering with the normal operation of the apparatus in the product stage.

  In another aspect of the electro-optical device of the present invention, the outer peripheral wiring is at least partially routed around an outer periphery of the substrate, and the outer peripheral wiring is formed when the outer periphery of the substrate is cut off. It is cut off at least partially so that the electrical connection between one terminal and the peripheral wiring is cut and the electrical connection between the second terminal and the peripheral wiring is cut.

  According to this aspect, the outer peripheral wiring in the course of manufacture is routed at least partially around the outer periphery of the substrate. And when the outer periphery of a board | substrate is cut off in a manufacturing process, an electrical connection between a 1st terminal and an outer periphery wiring is cut | disconnected by at least partially cutting off an outer periphery wiring. Further, the electrical connection between the second terminal and the outer peripheral wiring is also disconnected.

  As described above, when the outer peripheral wiring is cut off, the signal input to the first and second terminals is supplied to the outer peripheral wiring through the first and second resistance wirings in the substrate from which the outer periphery is cut off. There is no. Therefore, it is possible to prevent the first and second terminals and the peripheral wiring from interfering with the normal operation of the apparatus in the product stage.

  In another aspect of the electro-optical device according to the aspect of the invention, when the outer periphery of the substrate is cut off, the electrical connection between the first terminal and the outer peripheral wire is disconnected in the first and second resistance wires. And partially cut off so that the electrical connection between the second terminal and the outer peripheral wiring is cut.

  According to this aspect, when the outer periphery of the substrate is cut off in the manufacturing process, the electrical connection between the first terminal and the outer peripheral wiring is cut off by at least partially cutting off the first resistance wiring. . Similarly, the second resistance wiring is cut off at least partially, so that the electrical connection between the second terminal and the outer peripheral wiring is also cut.

  As described above, when the first and second resistance wirings are cut off, the signal input to the first and second terminals is output to the outer peripheral wiring via the first and second resistance wirings on the substrate whose outer periphery is cut off. Will not be supplied. Therefore, it is possible to prevent the first and second terminals and the peripheral wiring from interfering with the normal operation of the apparatus in the product stage.

  In another aspect of the electro-optical device of the present invention, a signal including a clock signal is supplied to the first terminal as a signal other than the image signal.

  According to this aspect, a signal including a clock signal that consumes more current than the image signal is supplied to the first terminal. Here, the first resistance wiring electrically connected to the first terminal has a higher resistance value than the second resistance wiring, but the resistance value is relatively high when a signal with large current consumption is supplied. Even in such a case, malfunctions are less likely to occur than when the current consumption is small. Accordingly, it is possible to prevent malfunction of the apparatus due to excessive current such as static electricity while preventing malfunction during inspection.

  In another aspect of the electro-optical device of the present invention, the resistance value of the second resistance wiring is set based on the frequency of the image signal.

  According to this aspect, the resistance value of the second resistance wiring is set based on the frequency of the image signal supplied to the second terminal electrically connected to the second resistance wiring. A malfunction at the time of inspection differs depending on the frequency of the signal. Typically, the malfunction increases as the frequency of the signal increases. Therefore, for example, if the resistance value of the second resistance wiring is set based on the frequency of the image signal, for example, the resistance is increased as the frequency is higher, malfunction can be prevented appropriately. Further, if the resistance value is increased within a range in which malfunction does not occur, the effect of protecting the device from excessive current such as static electricity can be enhanced.

  In another aspect of the electro-optical device of the present invention, the first resistance wiring and the second resistance wiring are formed in different layers.

  According to this aspect, since the first and second resistance wirings are formed in different layers, it is easy to form them so as to have different resistance values. Therefore, it is easy to make the resistance value of the second resistance wiring lower than the resistance value of the first resistance wiring.

  For example, even if the first and second resistance wirings are not formed so as to have different shapes such as length and thickness, the resistance values are different if the constituent materials are different. Further, by making the shapes and the like different from each other, even if the resistance values are different values, the formation process can be performed relatively easily if the layers are different from each other.

  In another aspect of the electro-optical device of the present invention, at least one of the first resistance wiring and the second resistance wiring includes conductive polysilicon.

  According to this aspect, since at least one of the first and second resistance wirings includes conductive polysilicon, it can be easily formed to have a high resistance value or a desired resistance value. The resistance value in the wiring depends on the length and thickness of the wiring in addition to the resistance value of the material. For this reason, for example, when a wiring having a high resistance value is formed using a material having a relatively low resistance value such as aluminum, the arrangement space becomes large.

  On the other hand, in this aspect, since the first and second resistance wirings are formed including polysilicon having a relatively high resistance value, an increase in arrangement space can be prevented. That is, space saving can be realized. In addition, since the conductive polysilicon may be the same as that used when forming the semiconductor elements, wirings, electrodes, and the like constituting the pixel portion and the drive circuit portion on the substrate, it is not necessary to increase the manufacturing process. It is also possible. Alternatively, it is possible to realize a desired resistance value by performing dedicated doping when forming conductive polysilicon. Therefore, for example, it is extremely effective in efficiently realizing high definition and downsizing of the apparatus.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, since the electro-optical device according to the present invention described above is provided, a projection display device, a television, a mobile phone, an electronic device capable of performing inspection in the manufacturing process more suitably. Various electronic devices such as a notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. Further, as the electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper can be realized.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a drive circuit built-in TFT (Thin Film Transistor) active matrix drive type liquid crystal device, which is an example of the electro-optical device of the present invention, is taken as an example.

<Mother board>
First, the configuration of the mother substrate in the manufacturing process of the electro-optical device according to this embodiment and the effect in the manufacturing process will be described with reference to FIGS. FIG. 1 is a plan view showing the configuration of the mother substrate in the manufacturing process, and FIG. 2 is an enlarged plan view showing the configuration around the external circuit connection terminals in the mother substrate. 3 is a cross-sectional view taken along line AA ′ of FIG. In the cross-sectional view of FIG. 3, for convenience of explanation, only the layer on which the resistance wiring is formed is shown, and the other layers are omitted.

  As shown in FIG. 1, a plurality of electro-optical devices according to this embodiment are formed on a mother substrate 1 in the manufacturing process. That is, the TFT array substrate 10 constituting the electro-optical device is formed on the mother substrate 1 so as to be arranged in a matrix. In each electro-optical device, as shown in the drawing, around the pixel display area 10a which is an example of the “pixel area” of the present invention, a data line driving circuit 101 which is an example of the “peripheral circuit” of the present invention and a scan. The line drive circuit 104 and the external circuit connection terminal 102 which is an example of the “input terminal” of the present invention are formed. The data line driving circuit 101 and the scanning line driving circuit 104 and the external circuit connection terminal 102 are electrically connected to each other by a signal wiring 110.

  In the electro-optical device according to this embodiment, the outer peripheral wiring 200 is formed so as to extend along the outer periphery of the TFT array substrate 10. The peripheral wiring 200 is a wiring for diffusing an excessive current such as static electricity generated at the time of inspection in a manufacturing process, for example, and is electrically connected to the external circuit connection terminal 102 by a resistance wiring 210.

In FIG. 2, for example, in addition to an image signal for displaying an image, a plurality of types of signals such as a clock signal that defines a timing for supplying the image signal and a power supply potential are input to the external circuit connection terminal 102. Here, among the external circuit connection terminals 102, a terminal to which a signal other than an image signal is input is referred to as a first terminal 102a, and a terminal to which an image signal is input is referred to as a second terminal 102b. Further, among the resistance wirings 210, the connection between the first terminal 102a and the outer peripheral wiring 200 is referred to as a first resistance wiring 210a.
A connection between the second terminal 102b and the peripheral wiring 200 is referred to as a second resistance wiring 210b.

  As shown in FIG. 3, the first resistance wiring 210a and the second resistance wiring 210b are formed in different layers. That is, first, the second resistance wiring 210b is formed, and the first interlayer insulating film 401 is formed thereon. Subsequently, a first resistance wiring 210a is formed on the first interlayer insulating film 401, and a second interlayer insulating film 402 is formed thereon. The first resistance wiring 210 a and the second resistance wiring 210 b should have a higher resistance value than the signal wiring 110 in order to efficiently diffuse excessive current such as static electricity. Therefore, the first resistance wiring 210a and the second resistance wiring 210b are formed including, for example, conductive polysilicon having a relatively high resistance value.

  Here, in the present embodiment, in particular, the resistance value of the second resistance wiring 210b is set to be lower than the resistance value of the first resistance wiring 210a. That is, the resistance wiring connected to the second terminal 102b to which the image signal is supplied has a lower resistance value than the resistance wiring connected to the first terminal 102a to which a signal other than the image signal is supplied. Yes.

  At the time of inspection of the apparatus in the manufacturing process, for example, a plurality of signals that are input during an actual operation (that is, a normal operation as a product) are input to the external circuit connection terminal 102. Among the plurality of signals, the image signal input to the second terminal 102b has a smaller current consumption and a higher frequency than other signals. Therefore, if the resistance value of the second resistance wiring 210b is too high, the signal may not be transmitted accurately, which may cause malfunction. In the present embodiment, as described above, the second resistance wiring 210b has a lower resistance value than the first resistance wiring 210a, thereby preventing a malfunction or the like from occurring when a signal is input during inspection. Is possible.

  Further, a signal other than an image signal such as a clock signal supplied to the first terminal 102a consumes a larger amount of current than an image signal. Therefore, even if the first resistance wiring 210a has a relatively high resistance value, malfunction does not easily occur. Therefore, by setting the first resistance wiring 210a to have a higher resistance value than the second resistance wiring 210b, it is possible to effectively diffuse an excessive current such as static electricity.

  Note that the first resistance wiring 210a and the second resistance wiring 210b have different resistance values by forming the wirings in different lengths, thicknesses, or constituent materials, for example. Further, for example, different resistance values may be obtained by making ion implantation concentrations different in ion implantation or the like.

  As described above, since the resistance values of the first resistance wiring 210a and the second resistance wiring 210b are different from each other, the malfunction of the apparatus is prevented by an excessive current such as static electricity while preventing malfunction during inspection. Can be prevented. That is, it is possible to perform inspection more suitably in the manufacturing process of the electro-optical device.

<Electro-optical device>
Next, the electro-optical device according to the present embodiment, which is separated from the mother substrate 1 described above, will be described with reference to FIGS.

<First Embodiment>
First, the overall configuration of the electro-optical device according to the first embodiment will be described with reference to FIGS. 4 and 5. 4 is a plan view showing the entire configuration of the electro-optical device according to the first embodiment, and FIG. 5 is a cross-sectional view taken along the line HH ′ of FIG.

  4 and 5, in the electro-optical device according to this embodiment, the TFT array substrate 10 and the counter substrate 20 are disposed to face each other. The TFT array substrate 10 is a transparent substrate such as a quartz substrate, a glass substrate, or a silicon substrate. The counter substrate 20 is also a transparent substrate, like the TFT array substrate 10. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20. The TFT array substrate 10 and the counter substrate 20 are bonded to each other by a sealing material 52 provided in a sealing region located around the image display region 10a provided with a plurality of pixel electrodes.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or the like for bonding the two substrates, and is applied on the TFT array substrate 10 in the manufacturing process and then cured by ultraviolet irradiation, heating, or the like. It is. In the sealing material 52, a gap material such as glass fiber or glass bead is dispersed for setting the distance between the TFT array substrate 10 and the counter substrate 20 (that is, the inter-substrate gap) to a predetermined value.

  A light-shielding frame light-shielding film 53 that defines the frame area of the image display area 10a is provided on the counter substrate 20 side in parallel with the inside of the seal area where the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  In the peripheral region, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in the region located outside the sealing region where the sealing material 52 is disposed, as described above. It has been. The scanning line driving circuit 104 is provided along two sides adjacent to the one side so as to be covered with the frame light shielding film 53. Further, in order to connect the two scanning line driving circuits 104 provided on both sides of the image display region 10 a in this way, a plurality of the pixel lines are covered along the remaining side of the TFT array substrate 10 and covered with the frame light shielding film 53. Wiring 105 is provided.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20.

  In FIG. 5, on the TFT array substrate 10, an alignment film is formed on the pixel electrode 9a after the pixel switching TFT, the scanning line, the data line and the like are formed. The pixel electrode 9a is made of a transparent conductive film such as an ITO (Indium Tin Oxide) film, and the alignment film is made of an organic film such as a polyimide film. On the other hand, on the counter substrate 20, a lattice-shaped or striped light-shielding film 23 is formed, and then a counter electrode 21 is provided over the entire surface, and an alignment film is formed on the uppermost layer portion. Yes. The counter electrode 21 is made of a transparent conductive film such as an ITO film, and the alignment film is made of an organic film such as a polyimide film. A liquid crystal layer 50 is formed between the TFT array substrate 10 and the counter substrate 20 that are configured as described above and are arranged so that the pixel electrode 9a and the counter electrode 21 face each other. The liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  4 and 5, the image signal on the image signal line is sampled on the TFT array substrate 10 in addition to the data line driving circuit 101, the scanning line driving circuit 104 and the like described above. Sampling circuit that supplies lines, precharge circuit that supplies pre-charge signals of a predetermined voltage level to multiple data lines in advance of image signals, inspection of quality, defects, etc. of the electro-optical device during production or shipment An inspection circuit or the like may be formed.

  In the electro-optical device according to the first embodiment, the outer peripheral wiring 200 shown in FIGS. 1 and 2 is cut off when the electro-optical device is divided from the mother substrate 1, and the first resistance wiring 210a. In addition, a part of the second resistance wiring 210b remains. The configuration of these electro-optical devices will be described in detail later.

  Next, an electrical configuration of the pixel unit of the electro-optical device according to the first embodiment will be described with reference to FIG. FIG. 6 is an equivalent circuit diagram of various elements, wirings, and the like in a plurality of pixels formed in a matrix forming the image display area of the electro-optical device according to the first embodiment.

  In FIG. 6, a pixel electrode 9a and a TFT 30 are formed in each of a plurality of pixels formed in a matrix that forms the image display region 10a. The TFT 30 is electrically connected to the pixel electrode 9a, and performs switching control of the pixel electrode 9a during the operation of the electro-optical device according to the present embodiment. The data line 6a to which the image signal is supplied is electrically connected to the source of the TFT 30. The image signals S1, S2,..., Sn to be written to the data lines 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. May be.

  The scanning line 3a is electrically connected to the gate of the TFT 30, and the electro-optical device according to the present embodiment pulse-scans the scanning signals G1, G2,. Gm is applied in this order in a line sequential manner. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the image signal S1, S2,... Supplied from the data line 6a is closed by closing the switch of the TFT 30 serving as a switching element for a certain period. Sn is written at a predetermined timing. A predetermined level of image signals S1, S2,..., Sn written in the liquid crystal as an example of the electro-optical material via the pixel electrode 9a is held for a certain period with the counter electrode formed on the counter substrate. The

  The liquid crystal constituting the liquid crystal layer 50 (see FIG. 2) modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. In the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel, and in the normally black mode, the light is incident according to the voltage applied in units of each pixel. The transmittance for light is increased, and light having a contrast corresponding to an image signal is emitted from the electro-optical device as a whole.

  In order to prevent the image signal held here from leaking, a storage capacitor 70 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 9a and the counter electrode 21 (see FIG. 2). The storage capacitor 70 is a capacitive element that functions as a storage capacitor that temporarily holds the potential of each pixel electrode 9a in response to supply of an image signal. One electrode of the storage capacitor 70 is connected to the drain of the TFT 30 in parallel with the pixel electrode 9a, and the other electrode is connected to the capacitor line 300 with a fixed potential so as to have a constant potential. According to the storage capacitor 70, the potential holding characteristic in the pixel electrode 9a is improved, and display characteristics such as contrast improvement and flicker reduction can be improved.

  Next, the configuration of the outer peripheral wiring and the resistance wiring in the electro-optical device according to the first embodiment will be described with reference to FIG. FIG. 7 is an enlarged plan view showing a configuration around the external circuit connection terminal in the electro-optical device according to the first embodiment.

  In FIG. 7, in the electro-optical device according to the first embodiment, the outer peripheral wiring 200, along with a part of the first resistance wiring 201a and the second resistance wiring 210b, is on the lower side of the TFT array substrate 10 in the drawing. It is cut off along. That is, the peripheral wiring 200 is not left in the electro-optical device as a product. In addition to the outer peripheral wiring 200, at least part or all of the first resistance wiring 201a and the second resistance wiring 210b are used when the electro-optical devices are separated from the mother substrate 1 by, for example, dicing, scribing, cutting, or the like. Alternatively, the substrate may be cut off when the substrate is divided. In addition, the outer peripheral wiring 200 is formed in a zigzag manner in such a way as to alternately cross the center lines between adjacent substrates, so that the electric connection by the outer peripheral wiring 200 is achieved by dividing the peripheral wiring 200 by the center line. It is also possible to divide.

  As described above, when the outer peripheral wiring 200 is cut off, the electrical connection between the external circuit connection terminal 102 and the outer peripheral wiring 200 is disconnected. As shown in the drawing, a part of the first resistance wiring 210a and the second resistance wiring 210b remains on the TFT array substrate 10 in the electro-optical device, but is electrically connected to other than the external circuit connection terminals 102. It has not been. Therefore, a signal input to the external circuit connection terminal 102 flows to the signal wiring 110 side, and does not flow to the first resistance wiring 210a and the second resistance wiring 210b.

  As described above, according to the electro-optical device according to this embodiment, since the outer peripheral wiring 200 is cut off, the outer peripheral wiring 200 used at the time of inspection, the first resistance wiring 210a, and the second resistance wiring 210b are as follows. It can prevent the operation as a product from being hindered. In addition, as described above, since inspection in the manufacturing process can be performed more suitably, a high-quality device can be manufactured more easily.

  Note that the mother substrate may be divided by any inspection after the TFT array substrate 10 is formed, before or after the counter substrate 20 is bonded, before or after the liquid crystal is sealed, or after an operation test or a display test. It is executed after finishing. The counter substrate 20 may be individually divided from the beginning, and may be bonded to the mother substrate, or after being bonded to the mother substrate as a large plate, in batch with the mother substrate or before and after. Then, it may be divided into individual counter substrates 20.

Second Embodiment
Next, an electro-optical device according to a second embodiment will be described with reference to FIGS. FIG. 8 is a plan view showing the overall configuration of the electro-optical device according to the second embodiment, and FIG. 9 is an enlarged plan view showing the configuration around the external circuit connection terminal in the electro-optical device according to the second embodiment. FIG. The second embodiment is different from the first embodiment described above in how it is divided from the mother substrate, and the other configurations are generally the same. Therefore, in the second embodiment, portions different from the first embodiment will be described in detail, and descriptions of other overlapping portions will be omitted as appropriate. 8 and 9, the same reference numerals are given to the same components as those according to the first embodiment shown in FIGS. 4 and 7.

  In the electro-optical device according to the second embodiment shown in FIG. 8, the outer peripheral wiring 200 is not cut off from the TFT array substrate 10, unlike the first embodiment described above. That is, in the second embodiment, the outer peripheral wiring 200 exists on the TFT array substrate 10 in the electro-optical device completed as a product.

  As shown in FIG. 9, the first resistance wiring 210a and the second resistance wiring 210b are cut in the middle of the wiring by etching or the like, for example. For this reason, the electrical connection between the external circuit connection terminal 102 and the outer peripheral wiring 200 is disconnected. Therefore, a signal input to the external circuit connection terminal 102 flows to the signal wiring 110 side, and does not flow to the first resistance wiring 210a and the second resistance wiring 210b. That is, in the electro-optical device according to the second embodiment, although the outer peripheral wiring 200 exists on the TFT array substrate 10, the electrical connection relationship according to the first embodiment shown in FIG. It can be said that it is the same as the optical device.

  In this way, when the wiring is exposed on the surface, it is not limited to removing the wiring by etching, but after another layer such as an interlayer insulating film is formed on the wiring, it is similar to a contact hole penetrating the other layer and the wiring. It is also possible to cut the wiring by opening the hole by etching.

  As described above, according to the electro-optical device according to the second embodiment, similarly to the first embodiment described above, the outer peripheral wiring 200, the first resistance wiring 210a, and the second resistance wiring 210b used during the inspection are provided. It is possible to prevent the operation as a product from being hindered. In addition, since inspection in the manufacturing process can be performed more suitably, a high-quality device can be manufactured more easily.

<Electronic equipment>
Next, the case where the liquid crystal device which is the above-described electro-optical device is applied to various electronic devices will be described. FIG. 10 is a plan view showing a configuration example of the projector. Hereinafter, a projector using the liquid crystal device as a light valve will be described.

  As shown in FIG. 10, a projector 1100 includes a lamp unit 1102 made of a white light source such as a halogen lamp. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G are the same as those of the liquid crystal device described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In the dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Therefore, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display image by the liquid crystal panel 1110G needs to be horizontally reversed with respect to the display images by the liquid crystal panels 1110R and 1110B.

  In addition, since light corresponding to each primary color of R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic device described with reference to FIG. 10, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic device Examples include a notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal devices described in the above embodiments, the present invention includes a reflective liquid crystal device (LCOS), a plasma display (PDP), a field emission display (FED, SED), an organic EL display, and a digital micromirror device. (DMD), electrophoresis apparatus and the like are also applicable.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change, In addition, an electronic apparatus including the electro-optical device is also included in the technical scope of the present invention.

It is a top view which shows the structure of the mother board | substrate in a manufacturing process. It is an enlarged plan view showing a configuration around an external circuit connection terminal on the mother board. FIG. 3 is a cross-sectional view taken along line AA ′ in FIG. 2. 1 is a plan view showing an overall configuration of an electro-optical device according to a first embodiment. It is the HH 'sectional view taken on the line of FIG. FIG. 3 is an equivalent circuit diagram of various elements, wirings, and the like that constitute an image display area of the electro-optical device according to the first embodiment. FIG. 3 is an enlarged plan view illustrating a configuration around an external circuit connection terminal in the electro-optical device according to the first embodiment. FIG. 6 is a plan view illustrating an overall configuration of an electro-optical device according to a second embodiment. FIG. 6 is an enlarged plan view illustrating a configuration around an external circuit connection terminal in an electro-optical device according to a second embodiment. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mother substrate, 3a ... Scan line, 6a ... Data line, 9a ... Pixel electrode, 10 ... TFT array substrate, 10a ... Image display area, 20 ... Counter substrate, 21 ... Counter electrode, 30 ... TFT, 50 ... Liquid crystal layer 101 ... Data line driving circuit, 102 ... External circuit connection terminal, 102a ... First terminal, 102b ... Second terminal, 104 ... Scanning line driving circuit, 110 ... Signal wiring, 200 ... Peripheral wiring, 210 ... Resistance wiring, 210a ... 1st resistance wiring, 210b ... 2nd resistance wiring, 401 ... 1st interlayer insulation film, 402 ... 2nd interlayer insulation film

Claims (5)

A mother board,
A plurality of substrates provided in a matrix on the mother substrate;
In the outer peripheral portion of the plurality of substrates, outer peripheral wiring having at least a part routed around,
A first input terminal that is provided on each of the plurality of substrates and receives an image signal;
A second input terminal provided on each of the plurality of substrates and receiving a signal other than the image signal;
The first input terminal and the outer peripheral wiring are electrically connected via a first resistance wiring,
The second input terminal and the outer peripheral wiring are electrically connected via a second resistance wiring,
The signal other than the image signal includes a clock signal,
The first resistance wiring has a first resistance value;
The second resistance wiring has a second resistance value,
The first resistance value is determined based on the frequency of the image signal, and the first resistance value is smaller than the second resistance value,
The mother substrate is divided into each of the plurality of substrates by being cut,
The outer peripheral wiring has a portion that is electrically divided by being cut;
The first resistance wiring has a portion where the first input terminal and the outer peripheral wiring are electrically separated by being cut,
The substrate for an electro-optical device, wherein the second resistance wiring has a portion where the second input terminal and the outer peripheral wiring are electrically separated by being cut. The electro-optical device substrate according to claim 1,
The first resistor line and the second resistor wires, electro-optical device substrate according to claim Tei Rukoto formed in different layers. The substrate for an electro-optical device according to claim 1 or 2,
Wherein at least one of the first resistance wire and the second resistor wires, electro-optical device substrate, characterized by comprising a conductive polysilicon. An electro-optical device comprising the electro-optical device substrate according to claim 1. An electronic device characterized by being provided with the electro-optical device substrate according to any one of claims 1 to 3.

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