JP5284829B2 - Plating equipment cooling device and high-speed continuous plating equipment - Google Patents

Description

  TECHNICAL FIELD The present invention relates to a cooling apparatus for a plating processing apparatus and a high-speed continuous plating processing apparatus, and more particularly to a cooling apparatus for a plating processing apparatus that suppresses an increase in the temperature of a plating solution or a substrate during high-speed continuous plating processing. The present invention relates to a high-speed continuous plating apparatus equipped with a cooling device.

  An electric circuit of a substrate such as a flexible printed circuit (hereinafter referred to as FPC) is generally formed by performing plating such as electrolytic copper plating on the surface of the substrate. As a specific method, conventionally, the roll-shaped substrate is negatively charged, and the feed roller on the unwinding side and the feed roller on the winding side are rotated at high speed between the anodes (anodes) in the plating tank. In addition, a method of performing plating by ejecting a jet of a plating solution toward a substrate and applying a high current to the substrate is widely adopted.

  However, performing plating at such a high speed, that is, applying a high current to a thin substrate leads to an increase in the temperature of the plating solution and the substrate. There was a problem that the surface was oxidized.

  In order to deal with such problems, water is directly sprayed on the substrate or a water cooling jacket is inserted into the power supply roller to cool the substrate and the power supply roller. It is shown that a laminar flow nozzle is disposed on the front and back surfaces of the substrate and sprayed with water or the like (Patent Document 1).

JP 2001-288594 A

However, in recent years, there has been a demand for further high-speed plating using a large current density exceeding 10 A / dm ² , and since the temperature rise of the plating solution and the substrate is further increased, a large amount of water is required for cooling, and the cost is reduced. In addition to the increase, there has been a problem that it becomes difficult to control the concentration of the plating solution.

  Therefore, the present invention provides a cooling device for a plating apparatus and such plating that can efficiently cool a substrate and a power supply roller without using a large amount of water when performing high-speed plating on a substrate such as an FPC. It aims at providing the high-speed continuous plating processing apparatus provided with the cooling device for apparatuses.

  As a result of intensive studies, the inventor has found that the above-described problems can be solved by the inventions of the following claims, and has completed the present invention.

The invention described in claim 1
A cooling device for a plating apparatus that is disposed in front of a plating tank of a high-speed continuous plating apparatus and cools the high-speed continuous plating apparatus,
A water replenishment tank for replenishing cooling water;
A capillary water absorber that absorbs water from the water supply tank;
An ultrasonic vibration element that is provided in contact with one end of the capillary absorbent body, atomizes the water absorbed by the capillary absorbent body from the water replenishing tank, and sprays the water to be cooled in the plating apparatus;
An apparatus for cooling a plating apparatus, comprising: an ultrasonic vibration transmitter that applies ultrasonic vibration to the ultrasonic vibration element.

  In the invention of this claim, by transmitting the ultrasonic vibration of the ultrasonic vibration element to the capillary absorbent body, the water contained in the capillary absorbent body is atomized and sprayed onto a cooling target such as a substrate or a power supply roller. Therefore, it is possible to efficiently cool the substrate, the power supply roller, and the like with a small amount of water, and to prevent the temperature of the plating solution and the substrate from rising. As a result, even when high-speed plating is performed on a substrate such as an FPC, the amount of cooling water used can be greatly reduced and costs can be suppressed. Furthermore, since the amount of water adhering to the substrate surface is small, it is easy to manage the concentration of the plating solution.

  Any ultrasonic vibration element and ultrasonic vibration transmitter may be used as long as they can atomize water through a capillary water absorbent and give sufficient energy for spraying. It can be appropriately selected depending on the case.

  The capillary water-absorbing body refers to a water-absorbing body having a capillary function, and the type is not limited as long as it is a material that absorbs water by capillary action when one end is immersed in a water supply tank. Specifically, it is preferable to use a cotton-molded absorbent cotton, a felt, a synthetic resin porous body having open cells, and the like.

  The water replenishing tank is provided for replenishing the capillary water-absorbing body with the water atomized and sprayed by the ultrasonic vibration, and the capacity can be appropriately determined in consideration of the amount of consumption accompanying the atomization. .

The invention described in claim 2
A high-speed continuous plating apparatus that performs plating on a substrate at a current density exceeding 10 A / dm ² ,
It has a copper ion supply part, a plating tank, and a power supply part.
The plating tank includes a copper ion jet part and an insoluble anode part,
The copper ion supply unit includes a copper oxide powder dissolving tank for dissolving copper oxide powder in a plating solution,
The copper ion jet section includes a jet pump that jets the plating solution prepared in the copper ion supply section toward the substrate surface and supplies the plating bath to the plating tank.
Furthermore, the cooling device for a plating processing apparatus according to claim 1 is disposed in front of the plating tank and between the power supply unit and the plating tank so as to face the substrate and / or the power supply unit. It is a high-speed continuous plating apparatus characterized by

In the case of a high-speed continuous plating apparatus that performs plating on a substrate at a current density exceeding 10 A / dm ² as in the above configuration, plating can be performed in a short time due to the resistance of the plating solution due to the jet of the plating solution or high-speed conveyance of the substrate. The temperature of the liquid and the substrate is likely to rise, and in order to suppress the temperature rise, it is necessary to release a large amount of water to the object to be cooled. Thus, the temperature rise of the plating solution and the substrate can be efficiently suppressed, and the amount of cooling water used can be greatly reduced. Furthermore, since the amount of water adhering to the substrate surface is small, it is easy to manage the concentration of the plating solution.

  The arrangement of the cooling apparatus for the plating apparatus may be before or after the plating tank, or both. When it is placed in front of the plating tank and facing the substrate and the feed roller, it can be carried into the plating tank with the substrate before plating cooled, so the temperature rise of the plating solution can be suppressed. Uniform plating can be performed.

  In addition, if the substrate is disposed after the plating tank so as to face the power feeding roller, the plated surface can be immediately cooled when the substrate is unloaded from the plating tank, so that the plating surface may be oxidized. Absent.

  Further, the plating apparatus cooling apparatus may directly cool the substrate by facing the substrate, or may cool the power feeding unit by facing the power feeding unit.

  According to the present invention, even when high-speed plating is performed on a substrate such as an FPC, the temperature of the plating solution or the substrate is increased by efficiently cooling the substrate or the power supply roller with a small amount of water. It is possible to suppress the increase in cost. Furthermore, since the amount of water adhering to the substrate surface is small, it is easy to manage the concentration of the plating solution.

It is a schematic diagram which shows notionally the principal part of the cooling device of embodiment of this invention. It is a schematic diagram which shows notionally the principal part of the high-speed continuous plating processing apparatus which employ | adopts the cooling device of embodiment of this invention. It is a figure which shows the temperature change of the plating solution in embodiment of this invention.

  Hereinafter, the present invention will be described based on embodiments. Note that the present invention is not limited to the following embodiments. Various modifications can be made to the following embodiments within the same and equivalent scope as the present invention.

1. First, the cooling device according to the present embodiment will be described with reference to FIG. 1A and 1B are schematic views conceptually showing a main part of a cooling device, wherein FIG. 1A is a perspective view and FIG. 1B is a cross-sectional view.

  In FIG. 1, 30 is an ultrasonic transmitter, and 31 is a nozzle-shaped ultrasonic vibration element. And 40 is a water replenishment tank, 41 is a capillary water absorbing body. Reference numeral 43 denotes minute water droplets atomized from the capillary water-absorbing body 41.

  The water replenishing tank 40 contains water 42 and one end of the capillary water-absorbing body 41 is immersed therein. The capillary water-absorbing body 41 sucks up and holds the water 42 by a capillary phenomenon. In the present embodiment, absorbent cotton having an outer diameter of 10 mm and a length of 80 mm is used as the capillary absorbent body 41, and pure water is used as the water 42.

  As shown in FIG. 1, the ultrasonic wave output from the ultrasonic transmitter 30 is transmitted from the nozzle tip of the ultrasonic vibration element 31 to the capillary water absorber 41. Thereby, the water 42 contained in the capillary water-absorbing body 41 is atomized into minute water droplets 43 and sprayed in the direction of a black arrow toward a substrate or a power supply roller (not shown).

  The sprayed water droplets 43 lower the temperature in the vicinity, and the water droplets 43 adhere to the substrate and the power feeding roller, thereby cooling the substrate and the power feeding roller.

2. High-speed continuous plating apparatus Next, a high-speed continuous plating apparatus that employs the cooling device will be described with reference to FIG. FIG. 2 is a schematic diagram conceptually showing a main part of the high-speed continuous plating apparatus.

  As shown in FIG. 2, the high-speed continuous plating apparatus in the present embodiment includes a power supply unit including a copper ion supply unit 90, a plating tank 70, and power supply rollers 51 and 52. The plating tank 70 is a copper ion jet. Part 80 and insoluble anode part 60 are provided.

  The copper ion supply unit 90 supplies copper ions to the plating solution in the plating tank 70, and includes a copper oxide powder dissolution tank 91, a copper ion supply tank 92, a dissolved oxygen reduction tank 93, and a filter 94. Yes.

  In the copper oxide powder dissolution tank 91, a plating solution having a predetermined concentration is stored. The copper oxide powder is put into the plating solution and stirred to dissolve the copper oxide powder. When the copper oxide powder dissolves to become copper ions, copper ions are supplied into the plating solution.

  After the dissolution, the supernatant of the plating solution is sent to the copper ion replenishing tank 92 and further sent to the dissolved oxygen reducing tank 93, where the dissolved oxygen is reduced by blowing (bubbling) an inert gas such as nitrogen gas. The And after filtering with the filter 94, it is sent to the copper ion jet part 80. FIG.

  The copper ion jet part 80 includes a pipe 81, a jet pump 82 and a jet nozzle 83. The plating solution sent via the piping pipe 81 is pressurized by the jet pump 82 and is jetted from the jet nozzle 83 provided at the tip of the jet pump 82 toward the substrate 10 at a predetermined jet velocity. Erupted.

  The jet pump 82 (and the jet nozzle 83) are arranged at positions that are alternately shifted to face the front surface and the back surface of the substrate 10. In this way, by arranging the positions alternately on the front and back sides, turbulence does not occur in the vicinity of the substrate. Further, deformation such as the bending of the substrate 10 hardly occurs.

  The power feeding unit includes a power feeding roller 51 on the unwinding side and a power feeding roller 52 on the winding side. The power feeding rollers 51 and 52 cause the substrate 10 to be negatively charged and travel in the plating tank 70. Since the substrate 10 is negatively charged, copper ions in the plating solution are electrodeposited on the surface, and copper plating is performed.

3. Example The high-speed continuous plating of the present example was performed by placing the cooling device facing the substrate from the vertical direction of the substrate at a total of four locations, two at the top and bottom of the arrow A and two at the top and bottom of the arrow B in FIG. A processing apparatus was produced. Then, using this high-speed continuous plating apparatus, a copper layer having a width of 125 mm in which a copper layer having a thickness of about 9 μm is formed on both the front and back surfaces of the polyimide layer 11 having a thickness of 20 μm and a through hole having a diameter of about 100 μm is appropriately formed. The pasted substrate (length: 100 m) was plated with a current density of 25 A / dm ² for 3 hours.

The plating solution was ejected from the jet nozzle at a jet velocity of 50 km / h, an ejection amount of 20 L / min (flow rate per ² dm ² ), and the distance between the insoluble anode and the substrate was set to 15 mm. And the output (85 kHz, 3 W / m < ² >) of an ultrasonic wave was adjusted so that the spray amount of the water from each cooling device might be 150 ml / h, respectively.

  Plating treatment was performed with the above configuration, and a location 20 cm away from the feeding roller at the center of the FPC substrate and the surface temperature of the feeding roller were measured. The results are shown in Table 1.

4). Comparative Example Plating was performed in the same manner as in the example except that the cooling device was not incorporated. Similarly, the surface temperatures of the substrate and the feeding roller were measured. The results are shown in Table 1.

  As shown in Table 1, by incorporating the cooling device of the present embodiment, a substrate temperature exceeding 5 ° C. with a very small amount of cooling water of 150 ml / h that could hardly be expected in the conventional cooling method. We were able to get a drop in In this embodiment, since the cooling water is sprayed on the substrate surface, the power supply roller has only a slight cooling effect.

5. Temperature Change of Plating Solution In addition to the above example, the temperature change of the plating solution as the plating process progressed was measured. The measurement results are shown in the graph of FIG. As shown in FIG. 3, the temperature of the plating solution was gradually increased from a little less than 30 ° C. (at the start of plating), but after 2 hours, it was stable at about 50 ° C. and increased further. There wasn't. As a result, it was confirmed that by using the cooling device of the present invention, the cooling effect necessary for the plating apparatus can be obtained even with a small amount of water.

  And when the state of the plating by a present Example was observed, it has confirmed that the uniform plating surface was formed.

  Thus, according to the present embodiment, it can be understood that even during high-speed continuous plating treatment, it is possible to suppress an increase in the temperature of the plating solution and the substrate with an extremely small amount of cooling water of 150 ml / h.

DESCRIPTION OF SYMBOLS 10 Flexible wiring board 30 Ultrasonic transmitter 31 Ultrasonic vibration element 40 Water replenishment tank 41 Capillary water absorption body 42 Water 43 Water drop 51, 52 Feed roller 60 Insoluble anode part 61 Foaming resistor 62 Insoluble anode main body 63 Ceramic coat layer 70 Plating tank 80 Copper ion jet part 81 Pipe pipe 82 Jet pump 83 Jet nozzle 90 Copper ion supply part 91 Copper oxide powder supply tank 92 Copper ion replenishment tank 93 Dissolved oxygen reduction tank 94 Filter

Claims (2)

A cooling device for a plating apparatus that is disposed in front of a plating tank of a high-speed continuous plating apparatus and cools the high-speed continuous plating apparatus,
A water replenishment tank for replenishing cooling water;
A capillary water absorber that absorbs water from the water supply tank;
An ultrasonic vibration element that is provided in contact with one end of the capillary absorbent body, atomizes the water absorbed by the capillary absorbent body from the water replenishing tank, and sprays the water to be cooled in the plating apparatus;
An apparatus for cooling a plating apparatus, comprising: an ultrasonic vibration transmitter that applies ultrasonic vibration to the ultrasonic vibration element. A high-speed continuous plating apparatus that performs plating on a substrate at a current density exceeding 10 A / dm ² ,
It has a copper ion supply part, a plating tank, and a power supply part.
The plating tank includes a copper ion jet part and an insoluble anode part,
The copper ion supply unit includes a copper oxide powder dissolving tank for dissolving copper oxide powder in a plating solution,
The copper ion jet section includes a jet pump that jets the plating solution prepared in the copper ion supply section toward the substrate surface and supplies the plating bath to the plating tank.
Furthermore, the cooling device for a plating processing apparatus according to claim 1 is disposed in front of the plating tank and between the power supply unit and the plating tank so as to face the substrate and / or the power supply unit. A high-speed continuous plating apparatus characterized by

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