JP5282911B2 - Diamond coated cutting tool - Google Patents
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Abstract
Description
この発明は、炭化タングステン（ＷＣ）基超硬合金または炭窒化チタン基サーメットで構成された工具基体（以下、単に工具基体という）の表面に、ダイヤモンド皮膜を被覆したダイヤモンド被覆切削工具に関し、特に、ＣＦＲＰ材、高Ｓｉ含有アルミニウム合金、グラファイト等の難削材の切削加工において、長期の使用に亘ってすぐれた耐摩耗性を発揮するダイヤモンド被覆切削工具（以下、ダイヤモンド被覆工具という）に関するものである。 The present invention relates to a diamond-coated cutting tool in which a diamond coating is coated on the surface of a tool substrate (hereinafter simply referred to as a tool substrate) made of tungsten carbide (WC) -based cemented carbide or titanium carbonitride-based cermet. The present invention relates to a diamond-coated cutting tool (hereinafter referred to as a diamond-coated tool) that exhibits excellent wear resistance over long-term use in cutting difficult-to-cut materials such as CFRP materials, high Si-containing aluminum alloys, and graphite. .
従来、工具基体の表面に、ダイヤモンド皮膜を被覆したダイヤモンド被覆工具が知られているが、従来のダイヤモンド被覆工具においては、ダイヤモンドを成膜した際に、成膜後の冷却過程で工具基体とダイヤモンド皮膜の熱膨張係数の差に起因して、ダイヤモンド皮膜に大きな圧縮残留応力が発生し、そのため工具基体に対するダイヤモンド皮膜の付着強度が十分でないという問題があった。
このような問題を解決するため、例えば、特許文献１に示されるように、ダイヤモンドの成膜に際し、超硬合金等の基体上へ、基体成分及び炭素成分を有する中間層を介してダイヤモンド皮膜を成膜することにより密着性を改善する技術が提案されているが、この成膜技術では、例えば、基体成分の一つであるＣｏをまず超硬基体上に蒸着し、その後ダイヤモンドの蒸着を行っているが、Ｃｏが超硬基体表面に存在するとダイヤモンドがグラファイト化しやすくなるため、密着性のすぐれたダイヤモンド被覆工具が得られないという問題があった。なお、特許文献１では、基体成分の一つであるＷＣを超硬基体上に蒸着し、その後ダイヤモンドを蒸着することも提案されているが、この場合にも、密着性のすぐれたダイヤモンド被覆工具が得られないという問題があった。
また、ダイヤモンド被膜の密着性改善を試みる他の技術として、例えば、特許文献２に示されるように、中間層として、ＳｉＣまたはＳｉＮｘを形成する技術、また、特許文献３に示されるように、中間層として金属Ｓｉを設ける技術が提案されているが、いずれの場合も、ダイヤモンド皮膜の密着性が十分でないという問題があった。
Conventionally, a diamond-coated tool in which the surface of a tool base is coated with a diamond coating is known. However, in a conventional diamond-coated tool, when a diamond is formed, the tool base and the diamond are cooled in the cooling process after the film is formed. Due to the difference in coefficient of thermal expansion of the film, a large compressive residual stress is generated in the diamond film, and there is a problem that the adhesion strength of the diamond film to the tool substrate is not sufficient.
In order to solve such a problem, for example, as shown in Patent Document 1, when forming a diamond film, a diamond film is formed on a substrate such as a cemented carbide through an intermediate layer having a substrate component and a carbon component. A technique for improving adhesion by forming a film has been proposed. In this film forming technique, for example, Co, which is one of the substrate components, is first deposited on a carbide substrate, and then diamond is deposited. However, when Co is present on the surface of the carbide substrate, diamond is easily graphitized, and there is a problem that a diamond-coated tool with excellent adhesion cannot be obtained. In Patent Document 1, it is also proposed to deposit WC, which is one of the substrate components, on a carbide substrate and then deposit diamond, but in this case as well, a diamond-coated tool with excellent adhesion is proposed. There was a problem that could not be obtained.
In addition, as another technique for trying to improve the adhesion of the diamond film, for example, as shown in Patent Document 2, a technique of forming SiC or SiNx as an intermediate layer, or as shown in Patent Document 3, Techniques for providing metal Si as a layer have been proposed, but in either case, there was a problem that the adhesion of the diamond film was not sufficient.
近年の切削装置のＦＡ化はめざましく、かつ切削加工の省力化に対する要求も強く、これに伴い、ダイヤモンド被覆工具による切削加工は高速化する傾向にあるが、上記の従来ダイヤモンド被覆工具においては、通常の被削材の連続切削や断続切削ではすぐれた切削性能を発揮するが、金属材料より比強度、比剛性の高いＣＦＲＰあるいは溶着性の高い高Ｓｉ含有Ａｌ合金、グラファイト等の難削材の切削加工に用いた場合には、ダイヤモンド皮膜に作用する応力、歪等がダイヤモンド皮膜と工具基体との界面に作用し、ダイヤモンド皮膜の剥離を引き起こしやすく、比較的短時間で使用寿命に至るのが現状である。 In recent years, the use of FA for cutting devices has been remarkable, and there has been a strong demand for labor saving in cutting work. With this, cutting with diamond-coated tools tends to increase in speed, but in the conventional diamond-coated tools described above, Excellent cutting performance in continuous cutting and intermittent cutting of various work materials, but cutting of difficult-to-cut materials such as CFRP with higher specific strength and rigidity than metal materials, high Si content Al alloy with high weldability, graphite, etc. When used in processing, the stress, strain, etc. acting on the diamond coating will act on the interface between the diamond coating and the tool substrate, easily causing the diamond coating to peel off, and the service life will be reached in a relatively short time. It is.
そこで、本発明者等は、ＣＦＲＰ、高Ｓｉ含有Ａｌ合金、グラファイト等の難削材の切削に用いても、ダイヤモンド皮膜の剥離が発生しないダイヤモンド被覆工具を開発すべく鋭意研究を行った結果、
ＷＣ基超硬合金からなる工具基体表面にダイヤモンド皮膜を成膜するにあたり、まず、工具基体表面近傍のＣｏ成分を酸処理で除去し、
この工具基体に対してダイヤモンド核生成を行い、
核生成終了後に工具基体の温度を高め、工具基体内部から表面側へのＣｏの拡散を促し、
引き続きダイヤモンドの成膜を続けることによって、
工具基体とダイヤモンド皮膜との界面のダイヤモンド皮膜側には、図１に示すように、拡散したＣｏによるＣｏ微粒子が析出形成され、このＣｏ微粒子は、難削材の切削加工に際し、ダイヤモンド皮膜に作用する応力やひずみを緩和する作用があるため、ダイヤモンド皮膜と工具基体間での密着性が向上し、その結果、ダイヤモンド皮膜の剥離が防止され、長期の使用にわたってすぐれた耐摩耗性を発揮するようになることを見出したのである。
Therefore, as a result of earnest research to develop a diamond-coated tool in which peeling of the diamond film does not occur even when the present inventors are used for cutting difficult-to-cut materials such as CFRP, high Si content Al alloy, and graphite,
In forming a diamond film on the surface of a tool base made of a WC-base cemented carbide, first, the Co component near the surface of the tool base is removed by acid treatment,
Diamond nucleation is performed on this tool base,
After the nucleation is completed, the temperature of the tool base is increased, and the diffusion of Co from the inside of the tool base to the surface side is promoted.
By continuing the diamond film formation,
As shown in FIG. 1, Co fine particles of diffused Co are deposited on the diamond film side of the interface between the tool base and the diamond film, and these Co fine particles act on the diamond film when cutting difficult-to-cut materials. As a result, the adhesion between the diamond coating and the tool base is improved, and as a result, peeling of the diamond coating is prevented, and excellent wear resistance is exhibited over a long period of use. I found out that
この発明は、上記知見に基づいてなされたものであって、
「（１） 炭化タングステン基超硬合金または炭窒化チタン基サーメットで構成された工具基体表面に５〜３０μｍの膜厚のダイヤモンド皮膜が被覆されたダイヤモンド被覆切削工具であって、上記工具基体とダイヤモンド皮膜の界面部のダイヤモンド皮膜側の基体表面から４００ｎｍの範囲には、平均粒径５〜２００ｎｍのＣｏ粒子が析出しており、かつ、Ｃｏ粒子の含有割合は、０．１〜２０原子％であることを特徴とするダイヤモンド被覆切削工具。」
を特徴とするものである。
This invention has been made based on the above findings,
“(1) A diamond-coated cutting tool in which a diamond coating film having a film thickness of 5 to 30 μm is coated on the surface of a tool base made of tungsten carbide-based cemented carbide or titanium carbonitride-based cermet, the tool base and diamond Co particles having an average particle diameter of 5 to 200 nm are deposited in the range of 400 nm from the surface of the substrate on the diamond film side at the interface of the film , and the content ratio of Co particles is 0.1 to 20 atomic%. diamond-coated cutting tool, wherein the Rukoto Oh. "
It is characterized by.
以下、本発明について説明する。
本発明では、工具基体は、ＷＣを硬質成分とするＷＣ基超硬合金または炭窒化チタン基サーメットから構成するが、上記各成分を所望配合組成となるように配合した原料粉末を、成形、焼結することにより、本発明の工具基体を製造する。
また、Ｃｏ粒子が析出している範囲は、基体表面から４００ｎｍの範囲が望ましく、この範囲を越えたところにＣｏ粒子が析出していても、ダイヤモンド膜の応力やひずみを緩和する効果がなく、かえって耐摩耗性などに悪影響を及ぼす可能性がある。
The present invention will be described below.
In the present invention, the tool base is composed of a WC-base cemented carbide or titanium carbonitride-based cermet containing WC as a hard component. As a result, the tool base of the present invention is manufactured.
In addition, the range in which Co particles are precipitated is desirably a range of 400 nm from the surface of the substrate, and even if Co particles are precipitated beyond this range, there is no effect of relaxing the stress and strain of the diamond film, On the contrary, it may adversely affect wear resistance.
本発明では、まず、ＷＣ基超硬合金からなる工具基体表面を、例えば、硫酸、過酸化水素および水からなる混合溶液にて短時間エッチングする酸処理を行うことによって、工具基体表面に存在するＣｏを除去する。
その後、微粒（粒径５〜１００nm）のダイヤモンド粒子を分散させたアルコール中に浸漬し、超音波を付与することで、種ダイヤモンドを工具基体表面に付着させる。
次いで、上記酸処理をした工具基体を、例えば、熱フィラメントＣＶＤ方式のダイヤモンド成膜炉に装入し、工具基体温度を７００℃に維持した状態で、水素とメタン（濃度０．５〜５％程度）の混合ガス４００Ｐａの気流中で、フィラメント温度を約２２００℃として、約３０分間、初期のダイヤモンド核生成処理を行う。
ダイヤモンドの核生成終了後、フィラメント温度を約２３５０℃に高めて、それにより工具基体の温度を約１０５０℃にまで昇温し、約２０〜６０分間成膜を行う。
そして、工具基体温度およびフィラメント温度を高めた成膜処理時に、工具基体が高温に維持されていることから、工具基体内部から工具基体表面への超硬合金成分であるＣｏの拡散が促され、図１に示すように、工具基体とダイヤモンド皮膜の界面には微粒のＣｏ粒子の析出物が生成する。
工具基体とダイヤモンド皮膜の界面でかつダイヤモンド皮膜側に生成するＣｏ粒子は、難削材の切削加工時に、ダイヤモンド皮膜に作用する応力やひずみを緩和させる作用を有し、しかも、Ｃｏ粒子は、ダイヤモンド皮膜の表面に形成されるものでないから、ダイヤモンドの成膜時に、グラファイト化を起こす危険性はない。
ついで、フィラメント温度を約２２００℃に下げることにより、工具基体温度を約６５０〜８００℃の範囲に下げ、所望の膜厚になるまでダイヤモンドの成膜を継続することによって、本発明のダイヤモンド被覆工具を作製する。
なお、成膜するダイヤモンド皮膜の膜厚が、５μｍ未満では、長期の使用に亘ってすぐれた摩耗性を発揮し、長寿命化を図ることができなくなり、一方、膜厚が３０μｍを超えると、成膜の際にエッジ部での鋭利さを保つことが出来なくなり、切れ味が低下することから、本発明では、ダイヤモンド皮膜の膜厚を５〜３０μｍと定めた。
In the present invention, first, the surface of the tool base made of a WC-based cemented carbide is present on the surface of the tool base by performing an acid treatment for a short time with, for example, a mixed solution of sulfuric acid, hydrogen peroxide and water. Co is removed.
Thereafter, the seed diamond is adhered to the surface of the tool base by immersing in fine particles (particle size 5 to 100 nm) of dispersed diamond particles and applying ultrasonic waves.
Next, the acid-treated tool base is placed in, for example, a hot filament CVD diamond deposition furnace, and the tool base temperature is maintained at 700 ° C., and hydrogen and methane (concentration 0.5 to 5%). The initial diamond nucleation treatment is performed for about 30 minutes at a filament temperature of about 2200 ° C. in an air stream of about 400 Pa of mixed gas.
After the nucleation of diamond is completed, the filament temperature is raised to about 2350 ° C., thereby raising the temperature of the tool base to about 1050 ° C., and film formation is performed for about 20 to 60 minutes.
And, since the tool base is maintained at a high temperature during the film forming process in which the tool base temperature and the filament temperature are increased, diffusion of Co, which is a cemented carbide component, from the inside of the tool base to the tool base surface is promoted. As shown in FIG. 1, precipitates of fine Co particles are generated at the interface between the tool base and the diamond film.
Co particles generated at the interface between the tool base and the diamond coating and on the diamond coating side have a function of relaxing stress and strain acting on the diamond coating when cutting difficult-to-cut materials. Since it is not formed on the surface of the film, there is no danger of graphitization during diamond film formation.
Next, by lowering the filament temperature to about 2200 ° C., the tool substrate temperature is lowered to a range of about 650 to 800 ° C., and diamond film formation is continued until a desired film thickness is obtained. Is made.
In addition, when the film thickness of the diamond film to be formed is less than 5 μm, it exhibits excellent wearability over a long period of use, and it is impossible to achieve a long life, whereas when the film thickness exceeds 30 μm, Since the sharpness at the edge portion cannot be maintained during film formation and the sharpness is lowered, the thickness of the diamond film is set to 5 to 30 μm in the present invention.
上記本発明のダイヤモンド被覆工具において、工具基体とダイヤモンド皮膜の界面でかつダイヤモンド皮膜側に生成するＣｏ粒子の大きさは、その平均粒径が５ｎｍ未満ではダイヤモンド皮膜に生じる応力・ひずみの緩和効果が小さく、また、平均粒径が２００ｎｍを超えるようになると、ダイヤモンド皮膜の強度を低下させ、かえって、膜を剥離させる原因となることから、Ｃｏ粒子の平均粒径は５〜２００ｎｍと定めた。
なお、上記Ｃｏ粒子の平均粒径は、ダイヤモンド被覆工具の縦断面を透過型電子顕微鏡にて観察・測定することにより、求めることができる。
In the diamond coated tool of the present invention, the Co particles generated at the interface between the tool base and the diamond film and on the diamond film side have a stress / strain relaxation effect on the diamond film when the average particle size is less than 5 nm. If it is small and the average particle diameter exceeds 200 nm, the strength of the diamond film is lowered, which causes the film to peel off. Therefore, the average particle diameter of Co particles is determined to be 5 to 200 nm.
The average particle diameter of the Co particles can be obtained by observing and measuring the longitudinal section of the diamond-coated tool with a transmission electron microscope.
また、この発明では、ダイヤモンド皮膜の膜厚を５〜３０μｍと定めているが、膜厚がこの範囲から外れた場合には、長期の使用に亘ってすぐれた耐剥離性を発揮することができなくなり、長寿命化を図ることができなくなるという理由から、本発明では、ダイヤモンド皮膜の膜厚を５〜３０μｍと定めた。 Moreover, in this invention, although the film thickness of the diamond film is set to 5 to 30 μm, when the film thickness is out of this range, excellent peeling resistance can be exhibited over a long period of use. In the present invention, the film thickness of the diamond film is determined to be 5 to 30 μm because it is impossible to extend the life.
また、この発明では、工具基体とダイヤモンド皮膜の界面部のダイヤモンド皮膜側に析出しているＣｏ粒子の含有割合を０．１〜２０原子％としているが、Ｃｏ粒子の含有割合が０．１〜２０原子％の範囲を外れると、Ｃｏ粒子の析出がダイヤモンド膜の応力やひずみを緩和する効果が見られなくなることから、Ｃｏ粒子の含有割合を０．１〜２０原子％と定めた。
Ｃｏ粒子の含有割合は、ダイヤモンド皮膜断面の工具基体表面直上を透過型電子顕微鏡で観察し、例えば、任意の４００×４００ｎｍの領域をエネルギー分散型Ｘ線分析（ＥＤＸ）により測定することにより求めることができる。
Moreover, in this invention, although the content rate of Co particles deposited on the diamond film side of the interface portion between the tool base and the diamond film is 0.1 to 20 atomic%, the content rate of Co particles is 0.1 to 20%. When the content is out of the range of 20 atomic%, the effect of relieving the stress and strain of the diamond film by the precipitation of Co particles is not observed.
The content ratio of the Co particles is obtained by observing the surface of the diamond substrate just above the surface of the tool base with a transmission electron microscope and measuring, for example, an arbitrary 400 × 400 nm region by energy dispersive X-ray analysis (EDX). Can do.
この発明のダイヤモンド被覆工具は、ダイヤモンド皮膜と工具基体の界面部かつダイヤモンド皮膜側に、平均粒径５〜２００ｎｍのＣｏ粒子が析出しており、また、析出しているＣｏ粒子の含有割合は、基体表面から４００ｎｍの範囲において０．１〜２０原子％であって、切削加工時にダイヤモンド皮膜に作用する応力・ひずみが、上記Ｃｏ粒子の存在によって緩和され、ダイヤモンド皮膜が工具基体から剥離するのが抑制されることから、これを、金属材料より比強度、比剛性の高いＣＦＲＰあるいは溶着性の高い高Ｓｉ含有Ａｌ合金、グラファイト等の難削材の切削加工で用いた場合でも、ダイヤモンド皮膜の剥離が防止されるとともに長期の使用に亘ってすぐれた耐摩耗性を発揮し、工具の長寿命化が図られるのである。 In the diamond-coated tool of the present invention, Co particles having an average particle diameter of 5 to 200 nm are deposited on the interface part between the diamond film and the tool base and the diamond film side, and the content ratio of the precipitated Co particles is: It is 0.1 to 20 atomic% in the range of 400 nm from the surface of the substrate, and the stress and strain acting on the diamond film during cutting are alleviated by the presence of the Co particles, and the diamond film peels off from the tool substrate. Even if this is used for cutting difficult-to-cut materials such as CFRP, which has a higher specific strength and higher rigidity than metal materials, or a high Si content Al alloy with high weldability, graphite, etc., the diamond film is peeled off. In addition, the wear resistance is excellent over a long period of use, and the tool life is extended.
つぎに、この発明のダイヤモンド被覆工具を実施例により具体的に説明する。
なお、以下ではダイヤモンド被覆ドリルについて説明するが、ドリルに何ら限定されるものではない。
Next, the diamond-coated tool of the present invention will be specifically described with reference to examples.
In addition, although a diamond covering drill is demonstrated below, it is not limited to a drill at all.
まず、表１に示す、いずれも１〜３μｍの範囲内の所定の平均粒径を有する原料粉末を用意し、同じく表１に示す配合組成となるように配合した混合粉末を調製し、これをボールミルで７２時間湿式混合し、乾燥した後、１００ＭＰａの圧力でプレス成形して、直径が１０ｍｍ，８ｍｍの丸棒圧粉体とし、これらの丸棒圧粉体を焼結して焼結体を製造し、さらに、研削加工にて溝形成部の外径を８ｍｍ、６ｍｍの寸法に加工し、その際に、外周マージン部および切れ刃エッジ部に対しては、粒度＃６００のＳｉＣ砥粒を用いたエアーブラスト処理および粒度＃１２００のダイヤモンド砥石を用いた３０μｍ以上の仕上研削加工処理を行い、外径８ｍｍの工具基体１〜５および外径６ｍｍの工具基体６〜１０を製造した。 First, as shown in Table 1, all prepared raw material powder having a predetermined average particle diameter in the range of 1 to 3 μm, and prepared a mixed powder blended so as to have the composition shown in Table 1, After wet mixing for 72 hours in a ball mill and drying, press molding is performed at a pressure of 100 MPa to form round bar compacts with diameters of 10 mm and 8 mm, and these round bar compacts are sintered to obtain a sintered body. In addition, the outer diameter of the groove forming portion is processed to a size of 8 mm and 6 mm by grinding, and at that time, SiC abrasive grains of particle size # 600 are applied to the outer margin portion and the cutting edge portion. The air blasting process used and the finishing grinding process of 30 μm or more using a diamond grindstone with a grain size of # 1200 were performed to produce tool bases 1 to 5 having an outer diameter of 8 mm and tool bases 6 to 10 having an outer diameter of 6 mm.
ついで、上記工具基体１〜１０に、硫酸、過酸化水素および水を１：１：１の割合で混合した溶液にて、室温で３０秒間エッチングする酸処理を施し、ついで、平均粒径３０〜６０ｎｍのダイヤモンド粒子を分散させたＩＰＡ（イソプロピルアルコール）溶液で超音波洗浄を行うことにより、工具基体１〜１０の表面からのＣｏ成分の除去および種ダイヤモンドの付着処理を行った。 Subsequently, the tool bases 1 to 10 were subjected to an acid treatment for etching at room temperature for 30 seconds with a solution in which sulfuric acid, hydrogen peroxide and water were mixed at a ratio of 1: 1: 1, and then an average particle size of 30 to By performing ultrasonic cleaning with an IPA (isopropyl alcohol) solution in which 60 nm diamond particles are dispersed, the Co component was removed from the surfaces of the tool bases 1 to 10 and seed diamond was adhered.
ついで、上記工具基体１〜１０を、熱フィラメントＣＶＤ方式のダイヤモンド成膜炉に装入し、表２に示す条件で、ダイヤモンド核生成、Ｃｏ粒子析出物の生成を行うと同時に、所定膜厚のダイヤモンド皮膜の成膜を行うことにより、表３に示す本発明のダイヤモンド被覆工具１〜１０（以下、本発明１〜１０という）を作製した。 Next, the tool bases 1 to 10 are charged into a hot filament CVD diamond deposition furnace, and under the conditions shown in Table 2, diamond nucleation and Co particle precipitates are generated, and at the same time, a predetermined film thickness is obtained. By forming a diamond film, diamond coated tools 1 to 10 (hereinafter referred to as present inventions 1 to 10) of the present invention shown in Table 3 were produced.
比較のため、上記工具基体１〜１０に対して、表４に示す条件でダイヤモンドの成膜を行い、表５に示される比較例のダイヤモンド被覆工具１〜１０（比較例１〜１０という）を作製した。
なお、比較例１および比較例６については、工具基体の酸処理を行っておらず、したがって、工具基体表面に存在するＣｏは除去されていない。
For comparison, a diamond film was formed on the tool bases 1 to 10 under the conditions shown in Table 4, and diamond coated tools 1 to 10 (referred to as Comparative Examples 1 to 10) of Comparative Examples shown in Table 5 were used. Produced.
In Comparative Examples 1 and 6, the tool base was not acid-treated, and therefore Co existing on the tool base surface was not removed.
上記本発明１〜１０、比較例１〜１０について、工具基体とダイヤモンド皮膜の界面部の縦断面を透過型電子顕微鏡にて観察し、工具基体とダイヤモンド皮膜の界面部であってかつダイヤモンド皮膜側の基体から４００ｎｍの範囲に析出しているＣｏ粒子の粒径を１０箇所で測定し、その平均値を算出することによりＣｏ粒子の平均粒径を求めた。
また、同じく上記本発明１〜１０、比較例１〜１０について、ダイヤモンド皮膜断面の工具基体表面直上を透過型電子顕微鏡で観察し、任意の４００×４００ｎｍの領域をエネルギー分散型Ｘ線分析（ＥＤＸ）により測定し、析出しているＣｏ粒子の含有割合を求めた。
表３、表５に、これらの測定値を示す。
For the present inventions 1 to 10 and Comparative Examples 1 to 10, the longitudinal section of the interface between the tool substrate and the diamond film was observed with a transmission electron microscope, and the interface between the tool substrate and the diamond film was on the diamond film side. The average particle size of the Co particles was determined by measuring the particle size of the Co particles deposited in the range of 400 nm from the substrate at 10 locations and calculating the average value.
Similarly, for the present inventions 1 to 10 and Comparative Examples 1 to 10, the surface immediately above the tool substrate surface of the diamond coating was observed with a transmission electron microscope, and an arbitrary 400 × 400 nm region was analyzed by energy dispersive X-ray analysis (EDX). ) And the content ratio of the precipitated Co particles was determined.
Tables 3 and 5 show these measured values.
つぎに、上記本発明１〜５および比較例１〜５については、次の条件Ａでグラファイト板の乾式穴あけ切削加工試験を行った。
《切削条件Ａ》
被削材：厚さ１０ｍｍのグラファイト板、
切削速度：１５０ ｍ／ｍｉｎ．、
送り：０．２ ｍｍ／ｒｅｖ．、
穴深さ：１０ ｍｍ（貫通穴）、
また、上記本発明６〜１０および比較例６〜１０については、次の条件Ｂで高Ｓｉ含有アルミニウム板の乾式穴あけ切削加工試験を行った。
《切削条件Ｂ》
被削材：厚さ５０ｍｍの２０％Ｓｉ含有アルミニウム合金板、
切削速度：３５０ ｍ／ｍｉｎ．、
送り：０．２ ｍｍ／ｒｅｖ．、
穴深さ：２５ ｍｍ、
エアブロー
いずれの穴あけ切削加工試験でも、切削不能になるまでの穴あけ加工数を測定した。
これらの測定結果を表６に示す。
Next, about the said invention 1-5 and the comparative examples 1-5, the dry-type drilling cutting test of the graphite board was done on the following conditions A.
<Cutting condition A>
Work material: Graphite plate with a thickness of 10 mm,
Cutting speed: 150 m / min. ,
Feed: 0.2 mm / rev. ,
Hole depth: 10 mm (through hole),
Moreover, about the said invention 6-10 and the comparative examples 6-10, the dry drilling cutting test of the high Si content aluminum plate was done on the following conditions B.
<Cutting condition B>
Work material: Aluminum alloy plate containing 20% Si with a thickness of 50 mm,
Cutting speed: 350 m / min. ,
Feed: 0.2 mm / rev. ,
Hole depth: 25 mm,
In any air blow drilling test, the number of drilling processes until cutting became impossible was measured.
These measurement results are shown in Table 6.
表３、５、６に示される結果から、工具基体とダイヤモンド皮膜の界面部のダイヤモンド皮膜側には、平均粒径５〜２００ｎｍのＣｏ粒子が析出しており、また、Ｃｏ粒子の含有割合が０．１〜２０原子％である本発明１〜１０では、Ｃｏ粒子の存在によりダイヤモンド皮膜に作用する切削加工時の応力・ひずみが緩和され、工具基体との密着性にすぐれるため、ダイヤモンド皮膜の剥離が防止されるとともに長期の使用に亘ってすぐれた耐摩耗性を発揮する。
これに対して、比較例１、６は、工具基体表面にＣｏ成分が存在し、成膜時にダイヤモンドがグラファイト化するため、密着性が劣っており、また、比較例２〜５、７〜１０は、工具基体とダイヤモンド皮膜の界面部のダイヤモンド皮膜側にＣｏ粒子の存在が僅かである、全く存在しない、あるいは、過剰に存在するため、いずれの場合も、ダイヤモンド皮膜と工具基体間での密着性に劣り、特に、ダイヤモンド皮膜の剥離により短時間で使用寿命に至ることは明らかである。
From the results shown in Tables 3, 5, and 6, Co particles having an average particle diameter of 5 to 200 nm are precipitated on the diamond film side of the interface portion between the tool base and the diamond film, and the content ratio of the Co particles is In the present invention 1 to 10 of 0.1 to 20 atomic%, the presence of Co particles relaxes the stress and strain at the time of cutting that acts on the diamond film, and is excellent in adhesion to the tool base. Peeling is prevented and excellent wear resistance is exhibited over a long period of use.
On the other hand, Comparative Examples 1 and 6 have a Co component on the surface of the tool base, and diamond is graphitized during film formation. Therefore, the adhesion is inferior, and Comparative Examples 2-5 and 7-10. Since the Co particles exist in the diamond film side at the interface between the tool substrate and the diamond film, there is little, no, or excessive presence of Co particles. It is apparent that the service life is shortened in a short time by peeling off the diamond film.
この発明のダイヤモンド被覆工具は、金属材料より比強度、比剛性の高いＣＦＲＰあるいは溶着性の高いＡｌ合金、グラファイト等の難削材の切削においても、ダイヤモンド皮膜の剥離が生じることなく長期の使用に亘って、すぐれた耐剥離性と耐摩耗性を発揮するものであり、ドリルに限らず、インサート、フライス工具、エンドミル、カッター等の各種切削工具として幅広く利用することが可能である。 The diamond-coated tool of the present invention can be used for a long period of time without causing peeling of the diamond film even when cutting difficult-to-cut materials such as CFRP having a higher specific strength and higher rigidity than metal materials, Al alloys having high weldability, and graphite. It exhibits excellent peeling resistance and wear resistance, and can be widely used as various cutting tools such as inserts, milling tools, end mills, cutters, etc., as well as drills.
Claims (1)
A diamond-coated cutting tool in which a diamond coating film having a film thickness of 5 to 30 μm is coated on the surface of a tool substrate made of tungsten carbide-based cemented carbide or titanium carbonitride-based cermet, and the interface between the tool substrate and the diamond coating the range of the substrate of 400nm diamond film side and precipitated Co particles having an average particle diameter 5~200nm is, and, the content of Co particles, wherein 0.1 to 20 atomic% der Rukoto Diamond coated cutting tool.
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| CN104002537B (en) * | 2013-02-25 | 2018-02-27 | 三菱综合材料株式会社 | Improve the diamond-coated hard alloy cutting element of point of a knife intensity |
| JP5716861B1 (en) * | 2013-11-29 | 2015-05-13 | 三菱マテリアル株式会社 | Diamond-coated cemented carbide cutting tool and method for manufacturing the same |
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| JPS61106494A (en) * | 1984-10-29 | 1986-05-24 | Kyocera Corp | Member coated with diamond and its production |
| US5068148A (en) * | 1988-12-21 | 1991-11-26 | Mitsubishi Metal Corporation | Diamond-coated tool member, substrate thereof and method for producing same |
| US5236740A (en) * | 1991-04-26 | 1993-08-17 | National Center For Manufacturing Sciences | Methods for coating adherent diamond films on cemented tungsten carbide substrates |
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