JP5278099B2 - Target manufacturing method - Google Patents

Target manufacturing method Download PDF

Info

Publication number
JP5278099B2
JP5278099B2 JP2009078734A JP2009078734A JP5278099B2 JP 5278099 B2 JP5278099 B2 JP 5278099B2 JP 2009078734 A JP2009078734 A JP 2009078734A JP 2009078734 A JP2009078734 A JP 2009078734A JP 5278099 B2 JP5278099 B2 JP 5278099B2
Authority
JP
Japan
Prior art keywords
press
cip
bodies
formed bodies
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009078734A
Other languages
Japanese (ja)
Other versions
JP2010229499A (en
Inventor
山口　　剛
守斌 張
雄也 陸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2009078734A priority Critical patent/JP5278099B2/en
Publication of JP2010229499A publication Critical patent/JP2010229499A/en
Application granted granted Critical
Publication of JP5278099B2 publication Critical patent/JP5278099B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a large-size target for forming a high-quality ceramic thin film on a large-size substrate by sputtering. <P>SOLUTION: A method of manufacturing target comprises: a press forming process of compression-forming material powder P into a plate shape by press forming to form a press-formed body 11; a CIP process of arranging a plurality of press formed bodies 11 side by side into a plate shape while causing the press formed bodies to contact with each other, compressing the press formed bodies 11 by cold isostatic pressing and joining the press formed bodies 11 into one body so as to form a CIP joint body 13 of a plate shape having an area larger than that of the press formed body 11; and calcining process of calcining the CIP joint body 13 to form a plate-shaped calcined body 14. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、スパッタリングに用いられるターゲットの製造方法に関する。   The present invention relates to a method for manufacturing a target used for sputtering.

従来、セラミックスからなるターゲットをスパッタすることによりセラミックス薄膜をガラス等の基板に形成する方法が知られている。スパッタリングにより高品質のスパッタ薄膜を形成するためには、セラミックスターゲットの密度が高く均一であることが求められる。   Conventionally, a method of forming a ceramic thin film on a substrate such as glass by sputtering a target made of ceramic is known. In order to form a high-quality sputtered thin film by sputtering, it is required that the density of the ceramic target is high and uniform.

たとえば特許文献１では、金型プレス装置を用いて比較的低いプレス圧力で材料粉末を成形した後、ＣＩＰ（冷間等方圧加圧：Ｃｏｌｄ Ｉｓｏｓｔａｔｉｃ Ｐｒｅｓｓｉｎｇ）を複数回行って高密度にプレスした圧粉体を焼成することにより、均一かつ高密度な成形体を製造することが提案されている。   For example, in Patent Document 1, after molding a material powder at a relatively low pressing pressure using a mold pressing device, CIP (Cold Isostatic Pressing) is performed multiple times to perform high density pressing. It has been proposed to produce a uniform and high-density molded body by firing a green compact.

このように製造されたターゲットは、スパッタ装置においてバッキングプレート上に固定されて、基板に対向するように設置される。バッキングプレートは、ターゲットを保持するとともに、スパッタリング時のターゲットを冷却するために用いられる（特許文献２参照）。   The target manufactured in this way is fixed on a backing plate in a sputtering apparatus, and is installed so as to face the substrate. The backing plate is used for holding the target and cooling the target during sputtering (see Patent Document 2).

特開平６−１８２７３２号公報JP-A-6-182732 特開２００７−２４５２１１号公報JP 2007-245211 A

近年、太陽電池やフラットパネルディスプレイなどの大型化に伴い、大型の基板にセラミックス薄膜を形成することができる大型のセラミックスターゲットが求められている。しかしながら、前述の方法で大型のセラミックスターゲットを製造するには金型の大型化が必要となり、多大なコストを要するという問題がある。また金型が大きい場合には十分なプレス圧を得られず圧粉体の密度が低くなり、セラミックスターゲットの品質が低下しやすく、高品質な薄膜を形成することが難しいという問題がある。   In recent years, with the increase in size of solar cells and flat panel displays, a large ceramic target capable of forming a ceramic thin film on a large substrate is required. However, in order to produce a large ceramic target by the above-described method, it is necessary to increase the size of the mold, and there is a problem that a great deal of cost is required. In addition, when the mold is large, there is a problem that a sufficient pressing pressure cannot be obtained, the density of the green compact becomes low, the quality of the ceramic target is easily deteriorated, and it is difficult to form a high-quality thin film.

このため、金型プレス装置に比較して大型化が容易なＣＩＰにより大型の圧粉体を成形することが考えられる。ＣＩＰでは、材料粉末を型に充填する際の充填密度が不均一であると、圧粉体の密度も不均一になるので、材料粉末を均一に充填することが重要である。しかしながら、ＣＩＰの成形型が大型であると、材料粉末を均一に充填することが難しく、圧粉体の密度を均一にすることが困難になる。また、ＣＩＰにより大型の圧粉体を成形すると、反りや表面の凹凸が生じやすいため、材料歩留まりが悪いという問題もある。   For this reason, it is conceivable to form a large green compact by CIP which is easy to increase in size as compared with a mold press apparatus. In CIP, if the packing density at the time of filling the material powder into the mold is non-uniform, the density of the green compact also becomes non-uniform, so it is important to fill the material powder uniformly. However, if the CIP mold is large, it is difficult to uniformly fill the material powder, and it is difficult to make the density of the green compact uniform. Further, when a large green compact is formed by CIP, there is a problem that the yield of the material is poor because warpage and surface irregularities are likely to occur.

あるいは、小型のプレス金型装置を用いて製造した小型の焼成体を複数枚バッキングプレート上に並べて固定することにより、面積の大きいセラミックスターゲットを製造することが考えられる。この場合、各焼成体の密度を高く均一にすることは比較的容易であるが、焼成体の熱膨張差による割れを防止するために、焼成体間に隙間を設けて配置する必要があり、スパッタ処理時にこの隙間や焼成体の角部で異常放電が発生し、高品質の薄膜を形成することができないおそれがある。   Alternatively, it is conceivable to manufacture a ceramic target having a large area by arranging and fixing a plurality of small fired bodies manufactured using a small press mold apparatus on a backing plate. In this case, it is relatively easy to make the density of each fired body high and uniform, but in order to prevent cracking due to the difference in thermal expansion of the fired body, it is necessary to provide a gap between the fired bodies, Abnormal discharge may occur in the gaps or corners of the fired body during the sputtering process, and there is a possibility that a high-quality thin film cannot be formed.

本発明は、このような事情に鑑みてなされたもので、大型基板に高品質のセラミックス薄膜をスパッタ形成するための大型のターゲットを提供することを目的とする。   The present invention has been made in view of such circumstances, and an object of the present invention is to provide a large target for sputter-forming a high-quality ceramic thin film on a large substrate.

本発明は、材料粉末をプレス成形により板状に圧縮成形して、プレス成形体を形成するプレス成形工程と、複数の前記プレス成形体を互いに接触させて板状に並べ、これらプレス成形体を冷間等方圧加圧により圧縮して一体に接合し、前記プレス成形体よりも大面積の板状のＣＩＰ接合体を形成するＣＩＰ工程と、前記ＣＩＰ接合体を焼成して、板状の焼成体を形成する焼成工程とを有し、前記ＣＩＰ工程において、前記プレス成形体同士の接合部の外面に、隣接する両プレス成形体間にわたる接続部材を前記各プレス成形体に接触させて配置しておき、これらプレス成形体にさらに前記接続部材を一体に接合するターゲットの製造方法である。
ここで、プレス成形とは、金型間に設けられたキャビティに材料を充填し、このキャビティを一軸又は二軸方向に縮小させるように加圧することにより、材料をプレス成形する方法である。 In the present invention, the material powder is compression-molded into a plate shape by press molding to form a press-molded body, and a plurality of the press-molded bodies are brought into contact with each other and arranged in a plate shape. CIP process of compressing by cold isostatic pressing and joining together, forming a plate-like CIP joined body having a larger area than the press-molded body, and firing the CIP joined body, have a firing step of forming a sintered body, in the CIP process, the the outer surface of the joint portion between the pressed bodies, by contacting the connecting member extending between adjacent two press-formed bodies each pressed bodies arranged In addition , this is a target manufacturing method in which the connecting member is further integrally joined to these press-formed bodies .
Here, press molding is a method in which a material is press-molded by filling the cavities provided between the molds with a material and pressurizing the cavities so as to shrink in a uniaxial or biaxial direction.

この製造方法において、各プレス成形体を小型にしておくことにより、プレス装置を大型化せずにプレス成形により形成できる。また、プレス成形を用いることにより、プレス成形体の密度を均一化することが容易である。このプレス成形体を並べてＣＩＰによりさらに圧縮し、接合するので、反りや表面の凹凸を生じさせずに、高密度かつ均一で大型のＣＩＰ接合体を形成できる。したがって、本発明の製造方法によれば、大面積を有し、密度が高く均一である高品質なターゲットの製造が可能となる。   In this manufacturing method, each press-molded body can be made small so that it can be formed by press molding without increasing the size of the press device. Moreover, it is easy to make the density of a press-molded body uniform by using press molding. Since these press-molded bodies are arranged side by side and further compressed and joined by CIP, high-density, uniform and large-sized CIP joined bodies can be formed without causing warpage or surface irregularities. Therefore, according to the manufacturing method of the present invention, it is possible to manufacture a high-quality target having a large area and a high density and uniformity.

また、この場合、焼成の際に各プレス成形体に収縮量の差が生じても、これらプレス成形体同士を接続部材が接続しているので、接合部で各ターゲット部材間に隙間が生じるのを防止できる。
 In this case, even if a difference in shrinkage occurs between the press molded bodies during firing, since the connecting members connect the press molded bodies to each other, gaps are generated between the target members at the joint. Can be prevented.

前記プレス成形体同士の前記接合部は、これらプレス成形体の側面同士を互いに接触させる傾斜面状であってもよい。また、前記プレス成形体同士の前記接合部は、これらプレス成形体の側面同士を互いに係合させる凹凸面状であってもよい。これらの場合、接合部におけるプレス成形体同士の接触面積が大きくなるので、プレス成形体同士をより強固に接合することができる。   The joints between the press-molded bodies may be inclined surfaces that contact the side surfaces of the press-molded bodies with each other. Moreover, the uneven | corrugated surface shape which makes the side part of these press molded bodies mutually engage may be sufficient as the said junction part of the said press molded bodies. In these cases, since the contact area between the press-formed bodies at the joint portion is increased, the press-formed bodies can be joined more firmly.

本発明のターゲットの製造方法によれば、均一な密度で大型のターゲットを、プレス装置の大型化を伴わずに製造することができ、高品質なセラミックス薄膜を大型基板に形成することが可能になる。   According to the target manufacturing method of the present invention, a large target having a uniform density can be manufactured without increasing the size of the press device, and a high-quality ceramic thin film can be formed on a large substrate. Become.

本発明のセラミックスターゲットの製造方法において、プレス成形体を形成するプレス成形工程を示す断面模式図である。In the manufacturing method of the ceramic target of this invention, it is a cross-sectional schematic diagram which shows the press molding process which forms a press-molding body. 本発明のセラミックスターゲットの製造方法において、複数のプレス成形体を接合してＣＩＰ接合体を形成するＣＩＰ工程を示す模式図である。In the manufacturing method of the ceramic target of this invention, it is a schematic diagram which shows the CIP process of joining a some press-molding body and forming a CIP joined body. 本発明の製造方法により形成されたセラミックス焼成体を示す平面図である。It is a top view which shows the ceramic sintered body formed by the manufacturing method of this invention. プレス成形体およびＣＩＰ接合体の変形例を示す斜視図である。It is a perspective view which shows the modification of a press-molding body and a CIP joined body. プレス成形体およびＣＩＰ接合体のさらに別の変形例を示す斜視図である。It is a perspective view which shows another modification of a press-molding body and a CIP joined body. プレス成形体およびＣＩＰ接合体のさらに別の変形例を示す斜視図である。It is a perspective view which shows another modification of a press-molding body and a CIP joined body. プレス成形体およびＣＩＰ接合体のさらに別の変形例を示す斜視図である。It is a perspective view which shows another modification of a press-molding body and a CIP joined body. プレス成形体およびＣＩＰ接合体のさらに別の変形例を示す斜視図である。It is a perspective view which shows another modification of a press-molding body and a CIP joined body. 接続部材の変形例を示す斜視図である。It is a perspective view which shows the modification of a connection member.

以下、本発明に係るセラミックスターゲットの製造方法について説明する。
本発明の製造方法は、材料粉末Ｐをプレス成形により板状に圧縮成形して、プレス成形体１１を形成するプレス成形工程（図１）と、複数のプレス成形体１１を互いに接触させて板状に並べるとともに、プレス成形体１１同士の接合部の外面に、隣接する両プレス成形体１１間にわたる接続部材１２を各プレス成形体１１に接触させて配置しておき、これらプレス成形体１１および接続部材１２を冷間等方圧加圧により圧縮して一体に接合し、プレス成形体１１よりも大面積の板状のＣＩＰ接合体１３を形成するＣＩＰ工程（図２）と、ＣＩＰ接合体１３を焼成して、板状のセラミックス焼成体１４を形成する焼成工程（図３）とを有する。 Hereinafter, a method for producing a ceramic target according to the present invention will be described.
In the manufacturing method of the present invention, the material powder P is compression-molded into a plate shape by press molding to form a press-molded body 11 (FIG. 1), and a plurality of press-molded bodies 11 are brought into contact with each other to form a plate. The connecting members 12 extending between the two adjacent press molded bodies 11 are arranged in contact with the press molded bodies 11 on the outer surfaces of the joints between the press molded bodies 11. A CIP process (FIG. 2) for forming the plate-like CIP joined body 13 having a larger area than the press-formed body 11 by compressing the connecting member 12 by cold isostatic pressing and joining them together, and the CIP joined body 13 is fired to form a plate-like ceramic fired body 14 (FIG. 3).

図１に示すプレス成形工程では、プレス装置２０により材料粉末Ｐを板状に圧縮成形して、プレス成形体１１を形成する。材料粉末Ｐは、酸化物系の粉末材料と有機バインダとを含み、加圧により成形され、焼成によりセラミックスとなる。プレス装置２０は、一軸方向にプレス圧力を発生する油圧プレス装置であって、ダイプレート２１、上パンチ２２および下パンチ２３の間にキャビティ２４が形成される。このキャビティ２４に材料粉末Ｐを充填し、キャビティ２４の厚さを小さくするように上パンチ２２および下パンチ２３を駆動することにより、キャビティ２４内の材料粉末Ｐが圧縮される。   In the press molding step shown in FIG. 1, the material powder P is compression-molded into a plate shape by the press device 20 to form the press-molded body 11. The material powder P includes an oxide-based powder material and an organic binder, is formed by pressing, and becomes ceramic by firing. The press device 20 is a hydraulic press device that generates a press pressure in a uniaxial direction, and a cavity 24 is formed between the die plate 21, the upper punch 22, and the lower punch 23. The material powder P in the cavity 24 is compressed by filling the cavity 24 with the material powder P and driving the upper punch 22 and the lower punch 23 so as to reduce the thickness of the cavity 24.

このプレス装置２０におけるプレス圧力は３９．２ＭＰａ（４００ｋｇｆ／ｃｍ２）以上とし、形成されるプレス成形体１１の成形密度は４０％以上６０％以下とする。成形密度の下限を４０％に設定することにより、プレス成形体１１の形状が維持される。一方、プレス成形体１１の成形密度の上限は、ＣＩＰ工程によりさらに圧縮するために６０％に設定する。このプレス成形工程により、材料粉末Ｐは全体がほぼ均一な密度の板状のプレス成形体１１に形成される。 The press pressure in the press device 20 is 39.2 MPa (400 kgf / cm 2 ) or more, and the forming density of the formed press-formed body 11 is 40% or more and 60% or less. By setting the lower limit of the molding density to 40%, the shape of the press-molded body 11 is maintained. On the other hand, the upper limit of the molding density of the press-molded body 11 is set to 60% for further compression by the CIP process. By this press molding process, the material powder P is formed into a plate-shaped press molded body 11 having a substantially uniform density as a whole.

なお、このプレス成形工程においては、プレス装置２０の可能な出力に対して受圧面積が大きすぎると十分なプレス圧力を得ることができないので、高品質なプレス成形体１１を得るのに十分なプレス圧力を達成できる大きさのプレス装置２０が用いられる。しかしながら、この製造方法においては、複数枚のプレス成形体１１を接合して大面積のＣＩＰ接合体１３を形成するので、プレス成形体１１を大型化する必要はなく、したがって特に大型の金型やプレス装置２０を用いる必要はない。   In this press molding process, if the pressure receiving area is too large for the possible output of the press device 20, sufficient press pressure cannot be obtained, so that a press sufficient to obtain a high-quality press-formed body 11 is obtained. A pressing device 20 having a size capable of achieving the pressure is used. However, in this manufacturing method, since a large-area CIP joined body 13 is formed by joining a plurality of press-formed bodies 11, it is not necessary to increase the size of the press-formed body 11. It is not necessary to use the press device 20.

図２に示すＣＩＰ工程では、複数枚（本実施形態では３枚）のプレス成形体１１を冷間等方圧加圧（ＣＩＰ：Ｃｏｌｄ Ｉｓｏｓｔａｔｉｃ Ｐｒｅｓｓｉｎｇ）により圧縮して一体に接合し、ＣＩＰ接合体１３を形成する。より具体的には、プレス成形体１１を互いに接触させて板状に並べるとともに、隣接するプレス成形体１１同士の接合部をわたる接続部材１２を各プレス成形体１１に接触させて配置し、これらのプレス成形体１１および接続部材１２をゴム型（図示せず）内に入れて真空封入し、ＣＩＰ装置（図示せず）での加圧により矢印で図示するように全体を加圧圧縮する。   In the CIP process shown in FIG. 2, a plurality of (three in the present embodiment) press-formed bodies 11 are compressed and joined together by cold isostatic pressing (CIP: Cold Isostatic Pressing). 13 is formed. More specifically, the press-formed bodies 11 are brought into contact with each other and arranged in a plate shape, and the connection members 12 that cross the joints between the adjacent press-formed bodies 11 are arranged in contact with the respective press-formed bodies 11. The press-molded body 11 and the connecting member 12 are put in a rubber mold (not shown) and vacuum-sealed, and the whole is pressurized and compressed as shown by the arrows by pressurization with a CIP device (not shown).

接続部材１２は、焼成時の収縮率がプレス成形体１１と同程度の材質であることが好ましく、本実施形態ではプレス成形体１１と同じく、プレス装置２０で材料粉末Ｐを圧縮して成形して成形された矩形板状の部材である。   The connecting member 12 is preferably made of a material having a shrinkage ratio similar to that of the press-formed body 11 at the time of firing. In the present embodiment, like the press-formed body 11, the material powder P is compressed by the press device 20 and formed. It is the member of the rectangular plate shape shape | molded.

ＣＩＰ装置の圧力は１６６．７ＭＰａ（１．７ｔｏｎ／ｃｍ２）とする。このように圧縮されることにより、互いに隣接するプレス成形体１１同士およびプレス成形体１１と接続部材１２とが接合され、１枚の板状のＣＩＰ接合体１３が形成される。形成されるＣＩＰ接合体１３の成形密度は、プレス成形体１１の成形密度よりも高く、５５％以上６５％以下とする。 The pressure of the CIP device is 166.7 MPa (1.7 ton / cm 2 ). By being compressed in this way, the press-molded bodies 11 adjacent to each other and the press-molded bodies 11 and the connecting member 12 are joined to form a single plate-like CIP joined body 13. The molding density of the formed CIP joined body 13 is higher than the molding density of the press-molded body 11, and is 55% or more and 65% or less.

このように形成されたＣＩＰ接合体１３を焼成することにより、材料粉末Ｐの有機バインダが焼失するとともに、酸化物粉粒体が焼結されて、図３に示すセラミックス焼成体１４が形成される（焼成工程）。焼成によって各プレス成形体１１および接続部材１２は収縮し、たとえばプレス成形体１１の接合部において隣接する角部同士が離れるように変形する。しかしながら、本実施形態のＣＩＰ接合体１３では、接続部材１２がこの接合部に設けられ、各プレス成形体１１に接合されているので、焼成に伴う収縮によってプレス成形体１１の角部同士が離れることが防止される。以上のように、複数のプレス成形体１１が隙間なく接合された、密度が均一であり大面積を有するセラミックス焼成体１４が得られる。   By firing the CIP joined body 13 formed in this manner, the organic binder of the material powder P is burned out, and the oxide powder is sintered to form the ceramic fired body 14 shown in FIG. (Baking process). Each press-molded body 11 and the connecting member 12 are shrunk by firing, and are deformed so that, for example, adjacent corners are separated from each other at the joint portion of the press-molded body 11. However, in the CIP joined body 13 of this embodiment, since the connecting member 12 is provided at this joined portion and joined to each press-formed body 11, the corners of the press-formed body 11 are separated from each other by shrinkage due to firing. It is prevented. As described above, a ceramic fired body 14 having a uniform density and a large area, in which a plurality of press-formed bodies 11 are joined without gaps, is obtained.

セラミックスターゲットは、このように形成されたセラミックス焼成体１４に対して機械加工等を施すことにより製造される。すなわち、セラミックス焼成体１４の外形を切削して所望の形状としたり、表面を研削して平面度を向上させたりする加工を行う。このように製造されたセラミックスターゲットは、プレス成形によって均一に圧縮された複数のプレス成形体１１を冷間等方加圧により接合して大型化したＣＩＰ接合体１３を焼成してなるので、全体の密度が均一であり、面積が大きく、隙間がない。したがって、このセラミックスターゲットを用いたスパッタ処理により、高品質なセラミックス薄膜を大型基板上に形成することが可能となる。   The ceramic target is manufactured by subjecting the ceramic fired body 14 thus formed to machining or the like. That is, the outer shape of the ceramic fired body 14 is cut into a desired shape, or the surface is ground to improve the flatness. The ceramic target manufactured in this manner is obtained by firing a large CIP joined body 13 by joining a plurality of press-formed bodies 11 uniformly compressed by press molding by cold isostatic pressing. The density is uniform, the area is large, and there is no gap. Therefore, a high-quality ceramic thin film can be formed on a large substrate by sputtering using this ceramic target.

なお、本発明は前記実施形態の構成のものに限定されるものではなく、細部構成においては、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。
たとえば、図４に示すように、プレス成形体１１Ａを台形板として、斜めに形成された端面同士を接合してもよい。この場合、接合部がプレス成形体１１Ａ同士を互いに接触させる傾斜面状であるので、前記実施形態の接合部に比較して接合面が大きくなり、より確実にプレス成形体１１Ａ同士が接合されたＣＩＰ接合体１３Ａを形成することができる。この場合も、接続部材１２を用いてプレス成形体１１Ａ同士の剥離を防止することが好ましい。 In addition, this invention is not limited to the thing of the structure of the said embodiment, In a detailed structure, it is possible to add a various change in the range which does not deviate from the meaning of this invention.
For example, as shown in FIG. 4, the end surfaces formed obliquely may be joined using the press-formed body 11 </ b> A as a trapezoidal plate. In this case, since the joint portion has an inclined surface shape that brings the press-formed bodies 11A into contact with each other, the joint surface becomes larger than the joint portion of the embodiment, and the press-formed bodies 11A are joined more reliably. The CIP joined body 13A can be formed. In this case as well, it is preferable to use the connecting member 12 to prevent the press-formed bodies 11A from being separated from each other.

また、図５に示すように、ジグザグ状の接合部により各プレス成形体１１Ｂ同士を係合させたＣＩＰ接合体１３Ｂにおいても、接合面が大きいので、プレス成形体１１Ｂ同士の接合をより確実にすることができる。
また、図６に示すように、プレス成形体１１Ｃの端面を表面に対して傾斜させ、この傾斜面同士が互いに接触するようにプレス成形体１１Ｃを接合させることにより、接合面を大きくして、ＣＩＰ接合体１３Ｃにおける接合をより確実することもできる。
また、図７に示すＣＩＰ接合体１３Ｄは、プレス成形体１１Ｄの端面に段差を設けることにより、プレス成形体１１Ｄ同士の接合部がこれらプレス成形体１１Ｄ同士を互いに係合させる凹凸面状となっている。これにより、ＣＩＰ接合体１３Ｄにおいても、接合面が大きく設けられ、より確実な接合が図られている。 In addition, as shown in FIG. 5, the CIP joined body 13 </ b> B in which the press-formed bodies 11 </ b> B are engaged with each other by the zigzag-shaped joint portion has a large joining surface, so that the press-formed bodies 11 </ b> B are more reliably joined. can do.
Further, as shown in FIG. 6, the end surface of the press-formed body 11C is inclined with respect to the surface, and the press-formed body 11C is joined so that the inclined surfaces are in contact with each other, thereby increasing the joining surface. Bonding in the CIP bonded body 13C can be further ensured.
Further, the CIP joined body 13D shown in FIG. 7 is provided with a step on the end face of the press-formed body 11D, so that the joint portion between the press-formed bodies 11D has an uneven surface shape for engaging the press-formed bodies 11D with each other. ing. Thereby, also in CIP conjugate | zygote 13D, a joining surface is largely provided and more reliable joining is achieved.

さらに、プレス成形体１１Ｅを縦横に並べて大面積化を図る場合、図８に示すように、各プレス成形体１１Ｅ同士の接合面が連続しないようにずらすことにより、隣接するプレス成形体１１Ｅが接続部材の役目を果たすので、より大面積のＣＩＰ接合体１３Ｅにおいても焼成時の収縮による割れや剥離を防止できる。   Further, when the press-formed bodies 11E are arranged vertically and horizontally to increase the area, as shown in FIG. 8, the adjacent press-formed bodies 11E are connected by shifting so that the joining surfaces of the press-formed bodies 11E are not continuous. Since it plays the role of a member, even in a CIP joined body 13E having a larger area, it is possible to prevent cracking and peeling due to shrinkage during firing.

なお、長方形板状の接続部材１２を設けることにより、ＣＩＰ工程においてプレス成形体に応力が集中し、接続部材１２とプレス成形体とが形成する隅部近傍に割れが生じる場合には、図９に示すように、三角形板状の接続部材１２Ｆを用いるように、プレス成形体１１と接続部材１２Ｆとの隅部を鈍角にして応力集中を避けることにより、ＣＩＰ工程におけるＣＩＰ接合体１３Ｆの破損を防止することができる。   If the rectangular plate-like connection member 12 is provided, stress concentrates on the press-formed body in the CIP process, and cracks occur in the vicinity of the corner formed by the connection member 12 and the press-formed body. As shown in FIG. 5, the CIP joined body 13F in the CIP process is damaged by avoiding stress concentration by making the corners of the press-formed body 11 and the connecting member 12F obtuse as in using a triangular plate-shaped connecting member 12F. Can be prevented.

１１ プレス成形体
１２ 接続部材
１３ ＣＩＰ接合体
１４ セラミックス焼成体
２０ プレス装置
２１ ダイプレート
２２ 上パンチ
２３ 下パンチ
２４ キャビティ
Ｐ 材料粉末 DESCRIPTION OF SYMBOLS 11 Press molding 12 Connection member 13 CIP joined body 14 Ceramic sintered body 20 Press apparatus 21 Die plate 22 Upper punch 23 Lower punch 24 Cavity P Material powder

Claims (3)

材料粉末をプレス成形により板状に圧縮成形して、プレス成形体を形成するプレス成形工程と、
複数の前記プレス成形体を互いに接触させて板状に並べ、これらプレス成形体を冷間等方圧加圧により圧縮して一体に接合し、前記プレス成形体よりも大面積の板状のＣＩＰ接合体を形成するＣＩＰ工程と、
前記ＣＩＰ接合体を焼成して、板状の焼成体を形成する焼成工程と、
を有し、
前記ＣＩＰ工程において、前記プレス成形体同士の接合部の外面に、隣接する両プレス成形体間にわたる接続部材を前記各プレス成形体に接触させて配置しておき、これらプレス成形体にさらに前記接続部材を一体に接合することを特徴とするターゲットの製造方法。 A press molding step of compressing and molding the material powder into a plate shape by press molding to form a press molded body;
A plurality of the press-formed bodies are brought into contact with each other and arranged in a plate shape, and these press-formed bodies are compressed and joined together by cold isostatic pressing, so that a plate-like CIP having a larger area than the press-formed body. A CIP process for forming a joined body;
A firing step of firing the CIP joined body to form a plate-like fired body;
I have a,
In the CIP step, on the outer surface of the joint portion between the press-formed bodies, a connecting member extending between both adjacent press-formed bodies is placed in contact with the press-formed bodies, and the connection is further made to these press-formed bodies. A method for producing a target , comprising joining members together . 前記プレス成形体同士の前記接合部は、これらプレス成形体同士を互いに接触させる傾斜面状であることを特徴とする請求項１に記載のターゲットの製造方法。 The method for manufacturing a target according to claim 1 , wherein the joint portion between the press-formed bodies has an inclined surface shape that brings the press-formed bodies into contact with each other. 前記プレス成形体同士の前記接合部は、これらプレス成形体同士を互いに係合させる凹凸面状であることを特徴とする請求項１又は２に記載のターゲットの製造方法。 Wherein the joint between the press-molded body, the target manufacturing method according to claim 1 or 2, characterized in that these press molded bodies are uneven surface shape to engage with each other.
JP2009078734A 2009-03-27 2009-03-27 Target manufacturing method Expired - Fee Related JP5278099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009078734A JP5278099B2 (en) 2009-03-27 2009-03-27 Target manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009078734A JP5278099B2 (en) 2009-03-27 2009-03-27 Target manufacturing method

Publications (2)

Publication Number Publication Date
JP2010229499A JP2010229499A (en) 2010-10-14
JP5278099B2 true JP5278099B2 (en) 2013-09-04

Family

ID=43045582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009078734A Expired - Fee Related JP5278099B2 (en) 2009-03-27 2009-03-27 Target manufacturing method

Country Status (1)

Country Link
JP (1) JP5278099B2 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251272A (en) * 1984-05-29 1985-12-11 Hitachi Metals Ltd Target for sputtering
JPS6433080A (en) * 1987-07-30 1989-02-02 Ngk Insulators Ltd Production of ceramic structure
JPH07316801A (en) * 1994-05-24 1995-12-05 Japan Energy Corp Mosaic target and its production
JP3863932B2 (en) * 1995-10-02 2006-12-27 三井金属鉱業株式会社 Magnetron sputtering method using split target
JP2000203929A (en) * 1999-01-14 2000-07-25 Hitachi Metals Ltd Sputtering target and its production
JP4312431B2 (en) * 2001-11-30 2009-08-12 新日鉄マテリアルズ株式会社 Target material
JP2005015915A (en) * 2003-06-05 2005-01-20 Showa Denko Kk Sputtering target, and its production method
JP2005327997A (en) * 2004-05-17 2005-11-24 Akio Ikesue Composite laser element and laser oscillator using the element
JP2008138225A (en) * 2006-11-30 2008-06-19 Mitsubishi Materials Corp Method for performing film deposition on large substrate surface
JP2008179013A (en) * 2007-01-23 2008-08-07 Nippon Steel Materials Co Ltd Method for jointing ceramic powder molded product and method for producing ceramic sintered body

Also Published As

Publication number Publication date
JP2010229499A (en) 2010-10-14

Similar Documents

Publication Publication Date Title
JP5804109B2 (en) Sintered body and sputtering target
KR20100080765A (en) Lamination apparatus, hot platen for the same and process for manufacturing the hot platen
JP5778372B2 (en) Sintered body, sputtering target, mold and method for producing sintered body
CN1200597C (en) Manufacturing method for multilayer ceramic substrate
JP5278099B2 (en) Target manufacturing method
JP2013204051A (en) Method for manufacturing cylindrical sputtering target material
CN202367205U (en) Hot-pressing sintering mould
JP2001145911A (en) Press molding machine
JP2015175035A (en) Method of manufacturing cylinder type sputtering target material
JP2015175034A (en) Method for producing sputtering target material
US8257834B2 (en) Process for joining stainless steel part and silicon nitride ceramic part and composite articles made by same
JP2020186151A (en) METHOD FOR PRODUCING SiC SINTERED MEMBER
TWM556733U (en) Pressure device for hermetic-type continuous hot press molding device
TWI685472B (en) Pressurizing device of airtight continuous hot press forming device
TWI685471B (en) Mould with transfer part
JP2011110749A (en) Mold for skin material
KR102061270B1 (en) Mold system for hot pressed ceramic with air hole
CN113878919B (en) Mould pressing forming device for nanometer heat insulation material
JP2766443B2 (en) Manufacturing method of ceramic heater
JP7460656B2 (en) Manufacturing method of bonded substrate
WO2021106098A1 (en) Method for manufacturing joined substrate
JP2003155563A (en) Long-size, multi-divided ito sputtering target
KR100488404B1 (en) A powder metallurgy mold
JP2000319775A (en) Production of sputtering target
JP2015175033A (en) Method of manufacturing cylinder type sputtering target material

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110927

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130108

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130305

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130423

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130506

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees