JP5268058B2 - Electronic component set and electronic component package - Google Patents

Description

  The present invention relates to an electronic component set including a plurality of electronic components and an electronic component package.

In recent years, an electronic component set in which a plurality of electronic components are positioned and mounted on a substrate or the like has been studied in order to improve the performance and compactness of the electronic components.
As one example of such an electronic component set, one end of four vibrators (electronic components) including strip-shaped diaphragms at the four corners around a square plate weight is coupled to each of the four vibrations. There is known an acceleration sensor in which elements are arranged in a plane and the other ends of the vibrators are soldered and mounted on a substrate (see, for example, Patent Document 1).
Two of the four vibrators of the acceleration sensor are arranged perpendicular to the horizontal axis passing through the center of the weight and one corner and opposite to each other, and the remaining two vibrators are perpendicular to the horizontal axis. The four vibrators are arranged so as to form four saddle-shaped ends, orthogonal to the axis and opposite to each other. The acceleration sensor configured as described above can measure the acceleration around the horizontal axis and the vertical axis with high accuracy.

As another example of an electronic component set, a sensor in which an acceleration sensor and a gyro sensor (electronic component) are combined on a substrate is arranged and mounted on the substrate in the direction of travel of the moving body and the direction orthogonal to the direction. There is an inclination angle sensor (see, for example, Patent Document 2). These two acceleration sensors and two gyro sensors are each arranged in a plane on the substrate. Under such a configuration, this inclination angle sensor detects an acceleration in the biaxial direction of a roll angle around a traveling direction and a pitch angle around a direction perpendicular to the traveling direction by an acceleration sensor, and further detects 2 by a gyro sensor. Since the angular velocity of each axis is detected, the tilt angle of the moving body in two axial directions can be measured at high speed.
JP-A-8-327654 JP-A-6-347264

However, in the acceleration sensor described in Patent Document 1, since each electronic component is positioned with respect to the substrate, the positional error between the two transducers is the difference between the location of one transducer and the substrate. The error and the positional error between the substrate and the other vibrator are added together, and the relative positional error between the vibrators is large. In addition, since a plurality of electronic components are arranged on the substrate, there is a problem that the area on which the electronic component is mounted increases on the surface of the substrate on which the electronic component is mounted, and the substrate becomes large.
The tilt angle sensor described in Patent Document 2 also has the same problem as in Patent Document 1 although there is a difference that there are a plurality of types of sensors.

  The present invention has been made in view of such problems, and is an electronic component set and an electronic device in which electronic components are positioned relatively accurately and the area of the electronic components arranged on the mounting surface is suppressed. A component package is provided.

In order to solve the above problems, the present invention proposes the following means.
The electronic component set of the present invention is an electronic component set in which the first electronic component and the second electronic component are mounted on the mounting surface of the support, and the first slit formed in the first electronic component has the A second electronic component is inserted , the first electronic component is inserted into a second slit formed in the second electronic component, and a convex portion or an inner surface of the first slit in the first electronic component A first engaging portion made of a concave portion is formed, and a second engaging portion made of a concave portion or a convex portion engaging with the first engaging portion is formed on the second electronic component. Yes.

According to this invention, by inserting the second electronic component through the first slit formed in the first electronic component, the inner surface of the first slit and the surface of the second electronic component face each other in the first slit. For this reason, the second electronic component is restricted from moving from the second electronic component side to the first electronic component side in the direction perpendicular to the facing surface.
In this way, by directly using the target components to be positioned relatively, positioning is performed as in the case where positioning is performed with another component interposed between the first electronic component and the second electronic component. Accumulation of errors can be suppressed, and the first electronic component and the second electronic component can be positioned relatively accurately.
In addition, in the portion where the second electronic component is inserted through the first slit of the first electronic component, both the first electronic component and the second electronic component are arranged on the mounting surface. It is possible to reduce the area of the electronic component to be arranged.

Further, the surface of the first electronic component and the inner surface of the second electronic component face each other in the second slit formed in the second electronic component. For this reason, the second electronic component is restricted from moving from the second electronic component side to the first electronic component side in the direction perpendicular to the facing surface. Therefore, the first electronic component and the second electronic component relatively accurately, Ru can be more reliably positioned.
In addition, by engaging the convex portion and the concave portion of the first engaging portion and the second engaging portion, the first electronic component and the first electronic component in the direction along the inner surface where the first engaging portion of the first slit is formed. It becomes possible to relatively position the two electronic components. Therefore, the first electronic component and the second electronic component can be more reliably positioned.

In the electronic component set described above, a first engagement portion including a convex portion or a concave portion is formed on an inner surface of the first slit in the first electronic component, and the second electronic component has the first engagement portion. It is more preferable that a second engaging portion formed of a concave portion or a convex portion that engages with the engaging portion is formed.
According to this invention, by engaging the convex portions and the concave portions of the first engaging portion and the second engaging portion, the first in the direction along the inner surface where the first engaging portion of the first slit is formed. It becomes possible to relatively position the electronic component and the second electronic component. Therefore, the first electronic component and the second electronic component can be more reliably positioned.

Further, in the electronic component set, a pair of first electrodes having a plane-symmetric shape with respect to a center plane in the thickness direction of the first electronic component is formed around the first slit in the first electronic component. The second electronic component is formed with a pair of second electrodes that are symmetrical with respect to the center plane, and the pair of first electrodes and the pair of second electrodes are soldered to each other. More preferably.
According to the present invention, by joining the first electrode and the second electrode by solder, equal forces act on the pair of the first electrode and the second electrode due to the surface tension of the solder.
Since the pair of first electrodes formed on the first electronic component is disposed symmetrically with respect to the center plane in the thickness direction of the first electronic component, the second electronic component has the center of the pair of second electrodes. Moved and fixed so that it is on the center plane. Thus, the first electronic component and the second electronic component can be relatively positioned by the position of the electrode provided on each electronic component.
In addition, the first electronic component on which the first electrode is formed and the second electronic component on which the second electrode is formed can be electrically connected by solder bonding.

In the electronic component set, a first sensor that measures a physical quantity in a first direction is formed on the first electronic component, and a second direction that intersects the first direction is formed on the second electronic component. It is more preferable that a second sensor for measuring the physical quantity is formed.
According to this invention, the first direction in which the first sensor measures the physical quantity and the second direction in which the second sensor measures the physical quantity can be relatively accurately positioned. For this reason, it is possible to measure physical property values such as acceleration and magnetism while relatively positioning the two directions, and to obtain a difference in physical property values depending on directions more accurately.

The electronic component package of the present invention includes a casing formed by joining a plurality of constituent members, and the electronic component package according to any one of the above is housed in the casing. The functional surface of 1 electronic component and the said 2nd electronic component, and the junction surface between the structural members of the said casing are arrange | positioned so that it may cross | intersect.
According to the present invention, by housing the electronic component set in the casing, it is possible to prevent dust and water from adhering to the electronic component set and to oxidize the electronic component set, and to operate the electronic component set stably.
In general, the functional surface having a large area in the electronic component is not parallel to the joint surface between the constituent members of the casing. For example, when the casing is formed of a wafer, the electronic component The number of arrangements can be increased, and the manufacturing cost of the electronic component package can be reduced.

The electronic component package of the present invention includes a casing formed by joining a plurality of constituent members, and the electronic component package according to any one of the above is housed in the casing. The functional surface of 1 electronic component and the said 2nd electronic component, and the mounting surface of the said 1st electronic component and the said 2nd electronic component in the said casing are arrange | positioned so that it may cross | intersect.
According to the present invention, by housing the electronic component set in the casing, it is possible to prevent dust and water from adhering to the electronic component set and to oxidize the electronic component set, and to operate the electronic component set stably.
In general, the functional surface having a large area in the electronic component is not parallel to the mounting surface of the first electronic component and the second electronic component in the casing. For example, when the casing is formed of a wafer, the wafer In contrast, the number of electronic components arranged can be increased, and the manufacturing cost of the electronic component package can be reduced.

  According to the electronic component set of the present invention, the electronic components can be positioned relatively accurately and the area of the electronic components arranged on the mounting surface can be suppressed.

(First embodiment)
Hereinafter, a first embodiment of an electronic component package according to the present invention will be described with reference to FIGS. In FIG. 2, for convenience of explanation, a part of the casing 6 described later is omitted, and a two-dot chain line in FIG. 5 indicates the inner surface of the casing 6.
As shown in FIGS. 1 to 5, the electronic component package 7 of this embodiment includes an electronic component set 1 and a casing (support) 6 that accommodates the electronic component set 1.
The electronic component set 1 includes a first electronic component 2 and a second electronic component 3 which are combined so as to be orthogonal to each other and are formed in a substantially rectangular parallelepiped shape. The casing 6 includes a first casing 4 and a second casing 5 which are two constituent members, and the first casing 4 is joined to a joining surface 5 a of the second casing 5.
In normal use, the electronic component package 7 is disposed such that the direction E1 is above the vertical direction and the direction E2 is below the vertical direction. A direction including both the direction E1 and the direction E2 is defined as a vertical direction E.

Functional surfaces 12a and 12b are respectively formed on the pair of side surfaces 2a and 2b along the vertical direction E of the first electronic component 2, and the functional surfaces 12a and 12b are directions in the direction of the axis of the first electronic component 2, for example. It functions as an acceleration sensor (first sensor) that measures the acceleration of D1. Similarly, functional surfaces 12c and 12d are respectively formed on the pair of side surfaces 3b and 3c along the vertical direction E of the second electronic component 3, and the functional surfaces 12c and 12d are, for example, the direction of the axis of the second electronic component 3 It functions as an acceleration sensor (second sensor) that measures the acceleration in the direction D2.
A pair of side surfaces 2a, 2b of the first electronic component 2 is cut out in the vertical direction E by a length H2 to form a connecting portion 2c having a length H1 below, and is orthogonal to the side surfaces 2a, 2b. A first slit 2d penetrating in the penetration direction K is formed. In the first slit 2d, the length of the orthogonal direction J orthogonal to the vertical direction E and the penetration direction K is set to be approximately equal to the length of the second electronic component 3 in the orthogonal direction J.
The length of the second electronic component 3 in the vertical direction E is set to be H2, and when the second electronic component 3 is combined with the first slit 2d of the first electronic component 2, the first electronic component 3 The top surface 2e of the component 2 and the top surface 3a of the second electronic component 3 are configured to be positioned on the same plane parallel to the horizontal plane.

As shown in FIGS. 2 and 5, when the second electronic component 3 is combined, the inner surface 2 f of the first slit 2 d and the side surface 3 b of the second electronic component 3 face each other.
In this embodiment, as will be described below, electrodes connected to circuits in the electronic components 2 and 3 are formed.
That is, with respect to the center plane P in the thickness direction (penetration direction K) of the first electronic component 2, the periphery of the first slit 2 d in the first electronic component 2 is plane-symmetric with respect to the center plane P. A pair of first electrodes 9a, 9b is formed, and the second electronic component 3 has a pair of first electrodes 9a, 9b which are equal in position in the vertical direction E and symmetrical with respect to the center plane P. Two electrodes a and 10b are formed. Furthermore, in the present embodiment, a pair of first electrodes 9c and 9d having a plane-symmetric shape are formed at positions moved from the first electrodes 9a and 9b in the direction E1 by a certain distance in the first electronic component 2, and the second electronic component 3 A pair of second electrodes 10c and 10d having a plane symmetry are formed at positions moved from the second electrodes 10a and 10b in the direction E1 by the predetermined distance. That is, two pairs of the first electrode and the second electrode are formed by offsetting the positions in the direction E1.
The first electrodes 9a to 9d are collectively referred to as the first electrode 9, and the second electrodes 10a to 10d are collectively referred to as the second electrode 10.

The first electrodes 9a to 9d are the same electrode, and the second electrodes 10a to 10d are the same electrode. The first electrodes 9a to 9d and the second electrodes 10a to 10d may be the same electrode or different electrodes.
Then, the first electronic component 2 is connected to the first electronic component 2 by an equal amount of solder portion 11 provided to connect the electrodes 9a and 10a, the electrodes 9b and 10b, the electrodes 9c and 10c, and the electrodes 9d and 10d, respectively. 2 The electronic component 3 is soldered and positioned.
The first electronic component 2 and the second electronic component 3 are electrically connected by the solder portion 11.

The first casing 4 is formed in a rectangular parallelepiped shape, and is formed with a receiving portion 4b which is a rectangular parallelepiped hole extending in the direction E2 which is vertically downward from the top surface. The accommodating portion 4b is formed so that the combined first electronic component 2 and second electronic component 3 are accommodated therein, and the length in the vertical direction E is a value obtained by the expression (H1 + H2). It has become.
A mounting surface 4c is provided on the bottom surface of the accommodating portion 4b, and a through electrode (not shown) that communicates with the outside of the casing body 4a is provided on the mounting surface 4c.
The bottom surface 2g of the first electronic component 2 is mounted and fixed to the mounting surface 4c of the casing body 4a with a conductive member 8 such as a conductive paste. Then, an unillustrated electrode provided on the bottom surface 2g of the first electronic component 2 and the through electrode are connected by a conductive member, and the first electronic component 2 and the second electronic component connected to the first electronic component 2 are connected. 3 can transmit / receive a signal to / from the outside of the casing 6.
As described above, in the present embodiment, the functional surfaces 12a to 12d of the first electronic component 2 and the second electronic component 3 are orthogonal to the bonding surface 5a of the second casing 5 and the mounting surface 4c of the first casing 4, respectively. Is arranged.
Here, the area of the electronic components 2 and 3 disposed on the mounting surface 4c is a direction in which the shape of the electronic components 2 and 3 is perpendicular to the mounting surface 4c with respect to the mounting surface 4c (in the case of this embodiment). It is the area on the mounting surface 4c when projected in the vertical direction E).

  The second casing 5 is joined to the top surface of the first casing 4 so as to cover the accommodating portion 4 b of the first casing 4. Thus, the casing 6 formed by joining the first casing 4 and the second casing 5 is formed in a box shape as a whole.

Next, a method for manufacturing the electronic component package 7 configured as described above will be described.
As shown in FIG. 6, a first electronic component 2, a second electronic component 3, and two first and second wafers 24 and 25 having substantially the same size in plan view are prepared.
The first wafer 24 is a constituent material of the first casing 4, and the second wafer 25 is a constituent material of the second casing 5. The length H of the first wafer 24 in the vertical direction E is greater than the sum of the lengths of the first electronic component 2 and the second electronic component 3 in the vertical direction E, that is, the value obtained by the expression (H1 + H2). It has become. At this stage, the first slit 2d is not yet formed in the first electronic component 2.

First, as shown in FIG. 7, the first slit 2d is formed in the first electronic component 2 (notch portion forming step).
Next, as shown in FIG. 8, the second electronic component 3 is combined with the first slit 2d of the first electronic component 2 (electronic component combining step).
Next, as shown in FIG. 9, the electrode 9a and the electrode 10a, the electrode 9b and the electrode 10b, the electrode 9c and the electrode 10c, and the electrode 9d and the electrode 10d are connected by an equal amount of the solder part 11, respectively. (Electrode soldering process).

Next, as shown in FIG. 10, a plurality of accommodating portions 4b are formed on the first wafer 24 (accommodating portion forming step).
Next, as shown in FIG. 11, the electronic component set 1 produced on the mounting surface 4 c provided on the bottom surface of the accommodating portion 4 b is fixed and mounted by the conductive member 8 (electronic component set mounting step).
Next, as shown in FIG. 12, the second wafer 25 is bonded to the top surface 24 a of the first wafer 24.
Next, the first wafer 24 and the second wafer 25 are separated into individual pieces, and the manufacture of the electronic component package 7 is completed.

Thus, according to the electronic component package 7 of the first embodiment of the present invention, the second electronic component 3 is inserted into the first slit 2d formed in the first electronic component 2 so that the first electronic component package 7 is inserted into the first slit 2d. The inner surface of the 1 slit 2d and the surface of the second electronic component 3 face each other at the side surfaces 3b and 3c and the bottom surface 3e shown in FIG. For this reason, the second electronic component 3 is restricted from moving from the second electronic component 3 side to the first electronic component 2 side in the direction perpendicular to the facing surface. That is, the second electronic component 3 is restricted from moving in both the orthogonal direction J and the direction E2, and the relative positions of the first electronic component 2 and the second electronic component 3 are determined in three directions.
As described above, by directly using the target component to be positioned, positioning is performed with another component interposed between the first electronic component 2 and the second electronic component 3. Accumulation of positioning errors can be suppressed, and the first electronic component 2 and the second electronic component 3 can be positioned relatively accurately.
In the portion where the second electronic component 3 is inserted into the first slit 2d of the first electronic component 2, both the first electronic component 2 and the second electronic component 3 are disposed on the mounting surface 4c. Therefore, the area of the electronic component arranged on the mounting surface 4c can be suppressed.

Further, by joining the first electrode 9 and the second electrode 10 with the same amount of the solder portion 11, an equal force is generated between the first electrode 9 and the second electrode 10 in a pair due to the surface tension of the solder. Works.
The two pairs of first electrodes 9 a to 9 d formed on the first electronic component 2 are arranged symmetrically with respect to the center plane P in the thickness direction of the first electronic component 2, and are formed on the second electronic component 3. Since the two pairs of second electrodes 10a to 10d are also arranged in plane symmetry with respect to the plane orthogonal to the penetration direction K, the center of the second electronic component 3 is the center plane of the two pairs of second electrodes 10a to 10d. It is moved and fixed so as to be on P. Thus, the first electronic component 2 and the second electronic component 3 can be relatively positioned by the positions of the electrodes 9 and 10 provided on the electronic components 2 and 3.
Also, the first electronic component 2 on which the first electrode 9 is formed and the second electronic component 3 on which the second electrode 10 is formed can be electrically connected by solder bonding.

Further, the direction D1 in which the first sensor of the first electronic component 2 measures the acceleration and the direction D2 in which the second sensor of the second electronic component 3 measures the acceleration can be relatively accurately positioned. For this reason, the difference in acceleration according to the direction can be obtained with higher accuracy while the directions D1 and D2 are relatively positioned.
In addition, by housing the electronic component set 1 in the casing 6, it is possible to prevent the electronic component set 1 from being attached to dust or water or to be oxidized, and to operate the electronic component set 1 stably. In general, the functional surfaces 12a to 12d having a large area in the electronic components 2 and 3 are not parallel to the bonding surface 5a. For example, when the casing 6 is formed of a wafer, the electronic components are mounted on the wafer. The number of arrangements 2 and 3 can be increased, and the manufacturing cost of the electronic component package 7 can be reduced.
In general, the functional surfaces 12a to 12d having a large area among the electronic components 2 and 3 are not parallel to the mounting surface 4c of the casing. For example, when the casing 6 is formed of a wafer, Thus, the number of electronic components 2 and 3 can be increased, and the manufacturing cost of the electronic component package 7 can be reduced.

In the above embodiment, as shown in FIG. 13, the connecting portion 2 c of the first electronic component 2 may be inserted into the second slit 26 formed in the second electronic component 3.
With this configuration, the surface of the first electronic component 2 and the inner surface of the second electronic component 3 face each other in the second slit 26 formed in the second electronic component 3. For this reason, the second electronic component 3 is restricted from moving from the second electronic component 3 side to the first electronic component 2 side in the direction perpendicular to the facing surface. That is, the second electronic component 3 is restricted from moving in both the penetration direction K and the direction E2. Due to the effects of the first slit 2 d and the second slit 26, the second electronic component 3 can move only in the direction E <b> 1 with respect to the first electronic component 2.
Therefore, the first electronic component and the second electronic component can be positioned more accurately and more reliably.

  Further, in the above embodiment, the second electronic component 3 is combined with the first slit 2d of the first electronic component 2, and then the electrode 9 and the electrode 10 are soldered to produce the electronic component set 1 before the component. The set 1 was mounted on the mounting surface 4c of the housing portion 4b. However, first, the first electronic component 2 alone is mounted on the mounting surface 4c, and then the second electronic component 3 is soldered to the first slit 2d of the first electronic component 2 and the electrode 9 and the electrode 10 are soldered. The second electronic component 3 may be mounted.

(Second Embodiment)
Next, a second embodiment according to the present invention will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, the description thereof will be omitted, and only different points will be described.
As shown in FIG. 14, in the electronic component set 21 accommodated in the electronic component package 27 of the present embodiment, the horizontal cross section is triangular on the inner surfaces 2 f and 2 h of the first slit 2 d in the first electronic component 2. The first engaging portions 2i, 2j made of projecting protrusions are formed and extended in the vertical direction E. The second electronic component 3 has a horizontal direction engaging with the first engaging portions 2i, 2j. Second engaging portions 3g and 3h each having a concave portion with a triangular cross section are formed.
In the present embodiment, the electrodes 9 and 10 and the solder part 11 are not provided.
According to the electronic component package 27 configured as described above, the first electronic component is obtained by engaging the convex portions and the concave portions of the first engaging portions 2i, 2j and the second engaging portions 3g, 3h. 2 and the second electronic component 3 can be relatively positioned in the penetration direction K. Therefore, the first electronic component 2 and the second electronic component 3 can be positioned more reliably.

In the present embodiment, two sets of the first engaging portion and the second engaging portion are formed on the inner surface of the first slit 2d and the second electronic component 3, but the first engaging portion and the second engaging portion are One or more sets may be formed.
In addition, first engagement portions 2i and 2j made of concave portions are formed on the inner surfaces 2f and 2h of the first slit 2d, and second engagement portions 3g and 3h made of convex portions are formed on the second electronic component 3. Also good.

(Third embodiment)
Next, a third embodiment according to the present invention will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different points will be described.
As shown in FIGS. 15 to 17, the electronic component set 31 accommodated in the electronic component package 37 of the present embodiment includes a first electronic component 32 formed in a substantially rectangular parallelepiped shape and two second electronic components 3. Provided and accommodated in the casing 6.
Two first slits 2 d penetrating in the penetrating direction K are formed in the orthogonal direction J on the pair of side surfaces 2 a and 2 b along the vertical direction E of the first electronic component 32. The second electronic components 3 are assembled in the two first slits 2d so as to be aligned in the orthogonal direction J.
According to the electronic component package 37 configured as described above, the acceleration in the direction D2 can be measured by the two second electronic components 3, and the measurement accuracy can be improved.
In the present embodiment, the same second electronic component 3 is assembled so as to be aligned in the orthogonal direction J. However, different types of electronic components may be assembled in the orthogonal direction J.

(Fourth embodiment)
Next, a fourth embodiment according to the present invention will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different points will be described. Note that the electronic component set 1 in FIG. 18 is omitted.
As shown in FIGS. 18 to 19, the electronic component package 47 of the present embodiment includes the same electronic component set 1 as that of the first embodiment, a casing 46 formed in a substantially cross shape when viewed from the vertical direction E, It has.
The casing 46 is formed in a cross shape on the horizontal plane, a first casing 44 formed in a shape extending in the vertical direction E, and a cross-shaped plate shape having the same shape as the cross section of the first casing 44. And a second casing 45 that is formed and covers an upper portion of the first casing 44. The first casing 44 is formed with an accommodating portion 44b whose cross section extending from the top surface in the direction E2 is a cross-shaped hole. The electronic component set 1 is mounted and fixed by the conductive member 8 on the mounting surface 44c provided on the bottom surface of the housing portion 44b.

According to the electronic component package 47 configured as described above, by reducing the unused space in the casing 46, the volume of the casing 46 can be reduced and the periphery of the electronic component package 47 can be used effectively. . Further, when the casing 46 is formed of a wafer, the number of casings 46 can be increased with respect to a wafer having a certain area.
In the present embodiment, the casing 46 as a whole is formed into a shape in which the cross shape extends in the vertical direction E perpendicular to the shape. However, the present invention is not limited to this, and the casing 46 may be formed in a shape in which a shape such as a circle or a polygon is extended in the vertical direction E perpendicular to the shape.

The first to fourth embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the configuration does not depart from the gist of the present invention. Changes are also included.
For example, in the said 1st Embodiment, 2nd Embodiment, and 4th Embodiment, the 1st electrode 9, the 2nd electrode 10, and the solder part 11 do not need to be provided. This is because the second electronic component 3 can be positioned with respect to the first electronic component 2 simply by inserting the first electronic component 2 into the first slit 2 d of the first electronic component 2.
In the first to fourth embodiments, the first electronic component 2 and the second electronic component 3 or the first electronic component 32 and the second electronic component 3 are combined so as to be orthogonal to each other. You may combine these so that it may mutually cross.

In the first to fourth embodiments, two sets of electrodes offset by a certain distance in the direction E1 are formed. However, only one set of electrodes may be formed in the direction E1.
In the first to fourth embodiments, the functional surfaces 12 a to 12 d of the first electronic component 2 and the second electronic component 3 are the joining surface 5 a of the second casing 5 and the mounting surface 4 c of the first casing 4. Are arranged so as to be orthogonal to each other. However, the functional surfaces 12a to 12d may intersect the bonding surface 5a and the mounting surface 4c.
In the present embodiment, the first electronic component and the second electronic component are acceleration sensors. However, the present invention is not limited to this, and other sensors, ICs, or the like may be used.

It is a front view of the electronic component package in 1st Embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 1st Embodiment of this invention. FIG. 3 is a cross-sectional view taken along a cutting line A1-A1 in FIG. FIG. 3 is a cross-sectional view taken along a cutting line A2-A2 in FIG. It is a perspective view of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st Embodiment of this invention. It is sectional drawing of the principal part of the electronic component package in the modification of 1st Embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 2nd Embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 3rd Embodiment of this invention. FIG. 16 is a cross-sectional view taken along section line B1-B1 in FIG. It is a perspective view of the electronic component set in 3rd Embodiment of this invention. It is a perspective view of the electronic component package in 4th Embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 31 Electronic component set 2, 32 1st electronic component 2d 1st slit 2f, 2h Inner surface 2i, 2j 1st engaging part 3 2nd electronic component 3g, 3h 2nd engaging part 4c, 44c Mounting surface 5a Joining surface 6, 46 Casing (support)
7, 27, 37, 47 Electronic component package 9a to 9d First electrode 10a to 10d Second electrode 26 Second slit P Center plane

Claims (5)

An electronic component set in which the first electronic component and the second electronic component are mounted on the mounting surface of the support,
The second electronic component is inserted into the first slit formed in the first electronic component ,
The first electronic component is inserted into a second slit formed in the second electronic component,
On the inner surface of the first slit in the first electronic component, a first engaging portion consisting of a convex portion or a concave portion is formed,
The electronic component set, wherein the second electronic component is formed with a second engaging portion including a concave portion or a convex portion that engages with the first engaging portion . The electronic component set according to claim 1 ,
Around the first slit in the first electronic component, a pair of first electrodes having a plane-symmetric shape with respect to the center plane in the thickness direction of the first electronic component is formed,
The second electronic component is formed with a pair of second electrodes that are symmetrical with respect to the center plane.
The electronic component set, wherein the pair of first electrodes and the pair of second electrodes are soldered to each other. In the electronic component set according to claim 1 or 2 ,
A first sensor for measuring a physical quantity in a first direction is formed on the first electronic component,
The electronic component set, wherein a second sensor for measuring a physical quantity in a second direction intersecting the first direction is formed on the second electronic component. An electronic component package comprising a casing formed by joining a plurality of constituent members, wherein the electronic component set according to any one of claims 1 to 3 is accommodated in the casing.
An electronic component package, wherein functional surfaces of the first electronic component and the second electronic component and a bonding surface between constituent members of the casing are arranged to intersect each other. An electronic component package comprising a casing formed by joining a plurality of constituent members, wherein the electronic component set according to any one of claims 1 to 3 is accommodated in the casing.
The function surface of the first electronic component and the second electronic component and the mounting surface of the first electronic component and the second electronic component in the casing are arranged so as to intersect with each other. Parts package.

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