JP5240255B2 - Radiation sensitive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition which is excellent in resolution, environmental durability and storage stability as a chemically amplified resist sensitive to active radiation, for example, ultraviolet radiation such as g-line or i-line, far-ultraviolet radiation typified by KrF excimer laser, ArF excimer laser or F2 excimer laser, and EUV (Extreme Ultra Violet), or electron beam or the like. <P>SOLUTION: This radiation-sensitive resin composition contains a compound in which at least one hydrogen atom bonded to a nitrogen atom of a compound having such a structure that at least one hydrogen atom is bonded to the nitrogen atom is protected with a specified group. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to ultraviolet rays such as g rays and i rays, KrF excimer lasers, ArF excimer lasers, F2 excimer lasers, (ultra) far ultraviolet rays such as EUV, X-rays such as synchrotron radiation, and charged particle beams such as electron beams. The present invention relates to a radiation sensitive resin composition used as a chemically amplified resist suitable for fine processing by various kinds of radiation.

In the field of microfabrication represented by the manufacture of integrated circuit elements, in order to obtain a higher degree of integration, recently, lithography technology capable of microfabrication at a level of 0.20 μm or less is required.
However, in the conventional lithography process, near-ultraviolet rays such as i-rays are generally used as radiation, but it is said that fine processing at the subquarter micron level is extremely difficult with this near-ultraviolet rays.
Therefore, in order to enable microfabrication at a level of 0.20 μm or less, use of radiation having a shorter wavelength is being studied. Examples of such short-wavelength radiation include an emission line spectrum of a mercury lamp, deep ultraviolet rays typified by an excimer laser, X-rays, and electron beams. Among these, a KrF excimer laser (wavelength 248 nm) is particularly preferable. ), ArF excimer laser (wavelength 193 nm), F2 excimer laser (wavelength 157 nm), EUV (wavelength 13 nm, etc.), electron beam, and the like are attracting attention.

As a radiation-sensitive resin composition suitable for short-wavelength radiation, between a component having an acid-dissociable functional group and a radiation-sensitive acid generator that generates acid upon irradiation with radiation (hereinafter referred to as “exposure”) Many compositions utilizing the chemical amplification effect (hereinafter referred to as “chemically amplified radiation-sensitive composition”) have been proposed.
Examples of the chemically amplified radiation-sensitive composition include, for example, JP-B-2-27660, a polymer having a t-butyl ester group of carboxylic acid or a t-butyl carbonate group of phenol and generation of a radiation-sensitive acid. A composition containing an agent has been proposed. In this composition, the t-butyl ester group or t-butyl carbonate group present in the polymer is dissociated by the action of an acid generated by exposure, and the polymer is an acidic group consisting of a carboxyl group or a phenolic hydroxyl group. A group is formed, and as a result, a phenomenon that the exposed region of the resist film becomes readily soluble in an alkali developer is utilized.

By the way, as acid generators used in recent photolithographic processes to be miniaturized, in addition to conventional triarylsulfonium salts, iodonium salts, sulfones in addition to highly active alkylsulfonium salts with higher transparency to various types of radiation. Imide and the like are particularly attracting attention. These acid generators are often advantageous in terms of resolution and the like compared to triarylsulfonium salts, but generally have low stability to bases. Therefore, when trialkylamine or the like conventionally used as an acid diffusion inhibitor is used, the acid generator is decomposed nucleophilically in the resist composition, so that the storage stability as the resist composition is deteriorated. However, an acid diffusion inhibitor having a low basicity cannot provide a sufficient acid diffusion suppression effect, or is easily affected by basic substances in the environment, resulting in poor environmental resistance.
In order to overcome this dilemma, attempts to protect alkylamines as carbamates and use them as acid-reactive base precursors have been made in Japanese Patent Application Laid-Open No. 2001-166476, etc. There is a problem that heat treatment during the process cannot be handled.

  The subject of the present invention is a chemical amplification type sensitive to actinic radiation, for example, ultraviolet rays such as g-line and i-line, KrF excimer laser, ArF excimer laser or F2 excimer laser, far-ultraviolet typified by EUV, or electron beam. An object of the present invention is to provide a radiation-sensitive composition having excellent storage stability in addition to resolution and environmental resistance as a resist.

According to the present invention, as a chemically amplified resist sensitive to actinic radiation, for example, far ultraviolet rays and electron beams represented by KrF excimer laser, ArF excimer laser, or F2 excimer laser, resolution, environmental resistance, and storage stability as a composition are improved. In addition, an excellent radiation sensitive resin composition can be provided.

As a result of various studies, the present inventors have found that a specific compound described below and a resin composition using the same can solve the above problems, and have reached the present invention.
According to the present invention, the above problem is firstly
(A) One or more hydrogen atoms bonded to the nitrogen atom of a compound having a structure in which at least one hydrogen atom is bonded to the nitrogen atom (hereinafter also referred to as “nitrogen-containing compound (a)”) is represented by the following formula: A compound protected with at least one selected from the group represented by (5) and the group represented by the following formula (6) (hereinafter also referred to as “compound (A)”),
(B) a radiation-sensitive acid generator (hereinafter also referred to as “acid generator (B)”), and (C) (a) an alkali-insoluble or alkali-insoluble resin protected with an acid-dissociable group. A resin that becomes alkali-soluble when the acid-dissociable group is dissociated (hereinafter, also referred to as “acid-dissociable group-containing resin”) or (b) an alkali-soluble resin and an alkali solubility controller. This is achieved by the positive radiation sensitive resin composition.

(In the formula, each R ₄ independently represents a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted, and at least two groups are connected to each other to form a ring. R ₅ and R ₆ each independently represent a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted, and R ₅ and R 6 ₆ may be linked to each other to form a ring.)

Hereinafter, the present invention will be described in detail.
<Compound (A)>
The compound (A) in the present invention is selected from the group represented by the above formula (5) and the group represented by the above formula (6) at least one hydrogen atom bonded to the nitrogen atom of the nitrogen-containing compound (a). It consists of a compound protected with at least one. Since these compounds have higher thermal stability than carbamate, decomposition does not occur during pre-baking, and the resistance to placement (PCD) after resist coating is also good.

Examples of the nitrogen-containing compound (a) include compounds represented by the following formula (a). Therefore, the compound protected by the group represented by the formula (5) is a compound represented by the following formula (2), and the compound protected by the group represented by the formula (6) is represented by the following formula (3). A compound.

(Wherein, R ₁ and R ₂ each independently represent a hydrogen atom or an optionally substituted linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms, wherein R ₁ and R ₂ are They may be linked together to form a ring.)

Wherein R ₁ , R ₂ and R ₄ are as defined in the above formulas (5) and (a), and at least two of R ₁ , R ₂ and R ₄ are linked to each other to form a ring May be formed.)

Wherein R ₁ , R ₂ , R ₅ and R ₆ are as defined in the above formulas (6) and (a), and at least two groups of R ₁ , R ₂ , R ₅ and R ₆ May be linked together to form a ring.)

As the linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted, represented by R ₁ and R ₂ in the above formula,
Methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n-pentyl group, n-hexyl group, n-heptyl group N-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group An alkyl group having 1 to 20 carbon atoms such as n-octadecyl group, n-nonadecyl group, n-eicosyl group;
A cycloalkyl group having 3 to 20 carbon atoms such as a cyclopentyl group, a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group;
Aryl groups having 6 to 20 carbon atoms such as phenyl group, toluyl group, benzyl group, methylbenzyl group, xylyl group, mesityl group, naphthyl group, anthryl group;
Examples thereof include a bridged alicyclic hydrocarbon group having 6 to 20 carbon atoms such as a norbornyl group, a tricyclodecanyl group, a tetracyclododecyl group, an adamantyl group, a methyladamantyl group, an ethyladamantyl group, and a butyladamantyl group.
R ₁ and R ₂ may be connected to each other to form a saturated or unsaturated nitrogen-containing heterocycle having preferably 2 to 20 carbon atoms.

The hydrocarbon group may be substituted, and as this substituent,
Hydroxyl group; carboxyl group; hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group, 1-hydroxypropyl group, 2-hydroxypropyl group, 3-hydroxypropyl group, 1-hydroxybutyl group, 2-hydroxybutyl Group, a hydroxyalkyl group having 1 to 4 carbon atoms such as 3-hydroxybutyl group and 4-hydroxybutyl group; methoxy group, ethoxy group, n-propoxy group, i-propoxy group, n-butoxy group, 2-methylpropoxy group A C1-C4 alkoxyl group such as a group, 1-methylpropoxy group or t-butoxy group; a cyano group; a carbon number of 2 such as cyanomethyl group, 2-cyanoethyl group, 3-cyanopropyl group, 4-cyanobutyl group, etc. 5 cyanoalkyl group; methoxycarbonyl group, ethoxycarbonyl group, t-butoxycar Examples thereof include alkoxycarbonyl groups such as a bonyl group; alkoxycarbonylalkoxy groups such as a methoxycarbonylmethoxy group, an ethoxycarbonylmethoxy group, and a t-butoxycarbonylmethoxy group.

  Specific examples of the nitrogen-containing compound (a) include monoalkylamines such as n-hexylamine, cyclohexylamine, n-heptylamine, n-octylamine, n-nonylamine, n-decylamine; diethylamine, di- Dialkylamines such as n-butylamine, di-n-pentylamine, di-n-hexylamine, dicyclohexylamine, di-n-heptylamine, di-n-octylamine, di-n-nonylamine, di-n-decylamine Alkanolamines such as ethanolamine and diethanolamine; aromatic amines such as aniline, N-methylaniline, 2-methylaniline, 3-methylaniline, 4-methylaniline, 4-nitroaniline, diphenylamine and 1-naphthylamine 1-adamantylamine, N Primary amines having a bridged alicyclic skeleton such as methyl-1-adamantyl amine;

Ethylenediamine, tetramethylenediamine, hexamethylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminobenzophenone, 4,4′-diaminodiphenylamine, 2,2′-bis (4 -Aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 2- (4-aminophenyl) -2- (3-hydroxyphenyl) propane, 2- (4-amino) Phenyl) -2- (4-hydroxyphenyl) propane, 1,4-bis [1- (4-aminophenyl) -1-methylethyl] benzene, 1,3-bis [1- (4-aminophenyl)- Diamino compounds such as 1-methylethyl] benzene;

Imidazoles such as imidazole, benzimidazole, 4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylbenzimidazole;
Ethyleneimine, pyrrole, pyrazole, indole, isoindole, purine, carbazole, carboline, perimidine, phenothiazine, phenoxazine, pyrrolidine, pyrroline, imidazolidine, imidazoline, pyrazolidine, pyrazoline, piperazine, indoline, isoindoline, benzimidazole, 4- Methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylbenzimidazole, pyrazine, pyridazine, piperidine, morpholine, 4-methylmorpholine, 1,4-dimethylpiperazine, 1,4-diazabicyclo [2.2.2] And nitrogen-containing heterocyclic compounds such as octane.

  Of these nitrogen-containing compounds (a), diethylamine, diethanolamine, di-n-octylamine, dicyclohexylamine, diphenylamine, imidazole, benzimidazole, 2-phenylbenzimidazole and the like are preferable.

As the linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms represented by R _{4 to} R ₆ in the above formulas (5) and (6), the hydrocarbons represented by R ₁ and R ₂ described above The group can be mentioned. In particular, as R ₄ , a methyl group, an ethyl group, an i-propyl group, a t-butyl group and the like are preferable. As R ₅ , a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an i-propyl group, n-Butyl group, i-butyl group, t-butyl group and the like are preferable, and R ₆ is hydrogen atom, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl. Group, t-butyl group, phenyl group, toluyl group, benzyl group and the like are preferable.
In the present invention, the compound (A) can be used alone or in combination of two or more kinds, and can also be used in combination with other acid diffusion inhibitors described later.

As a synthesis method of the compound (A) represented by the general formula (2), a nitrogen-containing compound (a) is mixed with a corresponding silylating agent and deprotonating agent such as t-butyldimethylsilyl chloride. Can be obtained.
Examples of the deprotonating agent include n-butyl lithium, sec-butyl lithium, t-butyl lithium, methyl lithium, sodium hydride, potassium hydride, calcium hydride and the like.

The reaction time in the above reaction is usually about 10 minutes to 24 hours, preferably about 20 minutes to 6 hours, and more preferably about 30 minutes to 2 hours.
In addition, the reaction temperature in the above reaction is usually −20 ° to 80 °, preferably 0 ° to 60 °, and more preferably 0 ° to 30 °.

As a method for synthesizing the compound represented by the general formula (3), a nitrogen-containing compound (a) and a corresponding hydroxyalkyl chloride or alkoxyalkyl chloride such as methoxymethyl chloride are mixed in the presence of a base catalyst. Can be obtained.
Examples of the basic catalyst include super strong bases such as sodium amide, sodium hydride, n-butyl lithium, 1,8-diazabicyclo “5, 4, 0” undeca 7-ene; methoxy potassium, ethoxy potassium, t-butoxy Examples include strong bases such as potassium, sodium hydroxide, and potassium hydroxide; weak bases such as triethylamine and tri-n-butylamine.

The reaction time in the above reaction is usually about 10 minutes to 24 hours, preferably about 20 minutes to 6 hours, and more preferably about 30 minutes to 2 hours.
In addition, the reaction temperature in the above reaction is usually −20 ° to 80 °, preferably 0 ° to 60 °, and more preferably 0 ° to 30 °.

  As a reaction solvent in the synthesis reaction of each compound (A), haloalkyls such as methylene chloride and chloroform; ethers such as diethyl ether and tetrahydrofuran; ketones such as acetone, methyl amyl ketone, methyl ethyl ketone, and methyl isobutyl ketone; dimethyl Examples include sulfoxide, dimethylformamide and the like.

<Acid generator (B)>
Examples of the acid generator (B) include I.I. Onium salt compounds, II. Sulfone compounds, III. Sulfonic acid ester compounds, IV. Sulfonimide compounds, V.I. Diazomethane compounds, VI. A disulfonylmethane compound etc. can be mentioned.
Examples of these acid generators (B) are shown below.

I. Onium salt compounds:
Examples of the onium salt compounds include iodonium salts, sulfonium salts (including tetrahydrothiophenium salts), phosphonium salts, diazonium salts, ammonium salts, pyridinium salts, and the like.
As a specific example of the onium salt compound,
Bis (4-t-butylphenyl) iodonium trifluoromethanesulfonate, bis (4-t-butylphenyl) iodonium nonafluoro-n-butanesulfonate, bis (4-t-butylphenyl) iodonium pyrenesulfonate, bis (4-t -Butylphenyl) iodonium n-dodecylbenzenesulfonate, bis (4-tert-butylphenyl) iodonium p-toluenesulfonate, bis (4-tert-butylphenyl) iodoniumbenzenesulfonate, bis (4-tert-butylphenyl) iodonium 10 -Camphorsulfonate, bis (4-t-butylphenyl) iodonium n-octanesulfonate, bis (4-t-butylphenyl) iodonium perfluoro-n-octanesulfonate, bis (4-t-butyl) Eniru) iodonium 2-trifluoromethylbenzene sulfonate, bis (4-t- butylphenyl) iodonium 4-trifluoromethyl benzenesulfonate, bis (4-t- butylphenyl) iodonium 2,4-difluoro benzenesulfonate,
Diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoro-n-butanesulfonate, diphenyliodonium pyrenesulfonate, diphenyliodonium n-dodecylbenzenesulfonate, diphenyliodonium p-toluenesulfonate, diphenyliodoniumbenzenesulfonate, diphenyliodonium 10-camphorsulfonate, diphenyliodonium n-octane sulfonate, diphenyl iodonium perfluoro-n-octane sulfonate, diphenyl iodonium 2-trifluoromethyl benzene sulfonate, diphenyl iodonium 4-trifluoromethyl benzene sulfonate, diphenyl iodonium 2,4-difluorobenzene sulfonate,

Triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium nonafluoro-n-butanesulfonate, triphenylsulfonium pyrenesulfonate, triphenylsulfonium n-dodecylbenzenesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfoniumbenzenesulfonate, triphenylsulfonium 10-camphorsulfonate, triphenylsulfonium n-octanesulfonate, triphenylsulfonium perfluoro-n-octanesulfonate, triphenylsulfonium 2-trifluoromethylbenzenesulfonate, triphenylsulfonium 4-trifluorobenzenesulfonate, triphenylsulfonium 2, 4-difluorobenzenes Phonate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium 1-naphthalenesulfonate, 4-t-butylphenyl diphenylsulfonium trifluoromethanesulfonate, 4-t-butylphenyl diphenylsulfonium nonafluoro-n-butanesulfonate, 4- t-butylphenyl diphenylsulfonium pyrenesulfonate, 4-t-butylphenyl diphenylsulfonium n-dodecylbenzenesulfonate, 4-t-butylphenyl diphenylsulfonium p-toluenesulfonate, 4-t-butylphenyl diphenylsulfoniumbenzenesulfonate 4-t-butylphenyl diphenylsulfonium 10-camphorsulfonate, 4-t-butylphenyl Phenylsulfonium n-octanesulfonate, 4-t-butylphenyl diphenylsulfonium 2-trifluoromethylbenzenesulfonate, 4-t-butylphenyl diphenylsulfonium 4-trifluoromethylbenzenesulfonate, 4-t-butylphenyl diphenylsulfonium 2,4-difluorobenzenesulfonate, 4-t-butoxyphenyl diphenylsulfonium nonafluoro-n-butanesulfonate, 4-hydroxyphenyl benzyl methylsulfonium p-toluenesulfonate cyclohexyl, 2-oxocyclohexyl, methylsulfonium trifluoromethanesulfonate , Dicyclohexyl, 2-oxocyclohexylsulfonium trifluoromethanesulfonate, 2-oxocycle Rohexyldimethylsulfonium trifluoromethanesulfonate,
1-naphthyldimethylsulfonium trifluoromethanesulfonate, 1-naphthyldiethylsulfonium trifluoromethanesulfonate, 4-cyano-1-naphthyldimethylsulfonium trifluoromethanesulfonate, 4-nitro-1-naphthyldimethylsulfonium trifluoromethanesulfonate, 4-methyl-1- Naphthyldimethylsulfonium trifluoromethanesulfonate,
4-cyano-1-naphthyldiethylsulfonium trifluoromethanesulfonate, 4-nitro-1-naphthyldiethylsulfonium trifluoromethanesulfonate, 4-methyl-1-naphthyldiethylsulfonium trifluoromethanesulfonate, 4-hydroxy-1-naphthyldimethylsulfonium trifluoromethane Sulfonate,

4-hydroxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-hydroxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-hydroxy-1-naphthyltetrahydrothiophenium perfluoro-n- Octane sulfonate,
4-methoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-methoxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-methoxy-1-naphthyltetrahydrothiophenium perfluoro-n- Octane sulfonate,
4-ethoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-ethoxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-ethoxy-1-naphthyltetrahydrothiophenium perfluoro-n- Octane sulfonate,
4-n-butoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-n-butoxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-n-butoxy-1-naphthyltetrahydrothiofe Nitroperfluoro-n-octanesulfonate,
4-methoxymethoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-methoxymethoxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-methoxymethoxy-1-naphthyltetrahydrothiophenium perfluoro -N-octane sulfonate,
4-ethoxymethoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-ethoxymethoxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-ethoxymethoxy-1-naphthyltetrahydrothiophenium perfluoro -N-octane sulfonate,

4- (1-methoxyethoxy) -1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4- (1-methoxyethoxy) -1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4- (1-methoxy Ethoxy) -1-naphthyltetrahydrothiophenium perfluoro-n-octanesulfonate,
4- (2-methoxyethoxy) -1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4- (2-methoxyethoxy) -1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4- (2-methoxy Ethoxy) -1-naphthyltetrahydrothiophenium perfluoro-n-octanesulfonate,
4-methoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-methoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-methoxycarbonyloxy-1-naphthyltetrahydrothiophene Nitroperfluoro-n-octanesulfonate,
4-ethoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-ethoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-ethoxycarbonyloxy-1-naphthyltetrahydrothiophene Nitroperfluoro-n-octanesulfonate,
4-n-propoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-n-propoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-n-propoxycarbonyloxy- 1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,
4-i-propoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-i-propoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-i-propoxycarbonyloxy- 1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,

4-n-butoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-n-butoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-n-butoxycarbonyloxy- 1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,
4-t-butoxycarbonyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-t-butoxycarbonyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-t-butoxycarbonyloxy- 1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,
4- (2-tetrahydrofuranyloxy) -1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4- (2-tetrahydrofuranyloxy) -1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4- (2 -Tetrahydrofuranyloxy) -1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,
4- (2-tetrahydropyranyloxy) -1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4- (2-tetrahydropyranyloxy) -1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4- (2-tetrahydropyranyloxy) -1-naphthyltetrahydrothiophenium perfluoro-n-octane sulfonate,
4-benzyloxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate, 4-benzyloxy-1-naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate, 4-benzyloxy-1-naphthyltetrahydrothiophenium perfluoro -N-octane sulfonate,
1- (1-naphthylacetomethyl) tetrahydrothiophenium trifluoromethanesulfonate, 1- (1-naphthylacetomethyl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, 1- (1-naphthylacetomethyl) tetrahydrothiophene Nitroperfluoro-n-octanesulfonate,
1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium trifluoromethanesulfonate, 1- (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, And (3,5-dimethyl-4-hydroxyphenyl) tetrahydrothiophenium perfluoro-n-octane sulfonate.

II. Sulfone compounds:
Examples of the sulfone compound include β-ketosulfone, β-sulfonylsulfone, and α-diazo compounds thereof.
Specific examples of the sulfone compound include phenacylphenylsulfone, mesitylphenacylsulfone, bis (phenylsulfonyl) methane, 4-trisphenacylsulfone, and the like.

III. Sulfonic acid ester compounds:
Examples of the sulfonic acid ester compounds include alkyl sulfonic acid esters, haloalkyl sulfonic acid esters, aryl sulfonic acid esters, and imino sulfonates.
Specific examples of the sulfonate compound include benzoin tosylate, pyrogallol tris (trifluoromethanesulfonate), pyrogallol tris (nonafluoro-n-butanesulfonate), pyrogallol tris (methanesulfonate), nitrobenzyl-9,10-diethoxyanthracene. -2-Sulfonate, α-methylol benzoin tosylate, α-methylol benzoin n-octane sulfonate, α-methylol benzoin trifluoromethane sulfonate, α-methylol benzoin n-dodecane sulfonate and the like.

IV. Sulfonimide compounds:
As a sulfonimide compound, for example, the following formula (7)

(In the formula, V represents a divalent group such as an alkylene group, an arylene group, or an alkoxylen group, and R ₇ represents a monovalent group such as an alkyl group, an aryl group, a halogen-substituted alkyl group, or a halogen-substituted aryl group. .)
The compound represented by these can be mentioned.

As a specific example of the sulfonimide compound,
N- (trifluoromethanesulfonyloxy) succinimide, N- (trifluoromethanesulfonyloxy) phthalimide, N- (trifluoromethanesulfonyloxy) diphenylmaleimide, N- (trifluoromethanesulfonyloxy) bicyclo [2.2.1] hept-5 -Ene-2,3-dicarboximide, N- (trifluoromethanesulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (trifluoromethane Sulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (trifluoromethanesulfonyloxy) naphthylimide,
N- (10-camphorsulfonyloxy) succinimide, N- (10-camphorsulfonyloxy) phthalimide, N- (10-camphorsulfonyloxy) diphenylmaleimide, N- (10-camphorsulfonyloxy) bicyclo [2.2.1 ] Hept-5-ene-2,3-dicarboximide, N- (10-camphorsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (10-camphorsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (10-camphorsulfonyloxy) naphthylimide,

N- (p-toluenesulfonyloxy) succinimide, N- (p-toluenesulfonyloxy) phthalimide, N- (p-toluenesulfonyloxy) diphenylmaleimide, N- (p-toluenesulfonyloxy) bicyclo [2.2.1 ] Hept-5-ene-2,3-dicarboximide, N- (p-toluenesulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (p-toluenesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (p-toluenesulfonyloxy) naphthylimide,
N- (2-trifluoromethylbenzenesulfonyloxy) succinimide, N- (2-trifluoromethylbenzenesulfonyloxy) phthalimide, N- (2-trifluoromethylbenzenesulfonyloxy) diphenylmaleimide, N- (2-trifluoro Methylbenzenesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (2-trifluoromethylbenzenesulfonyloxy) -7-oxabicyclo [2.2.1 ] Hept-5-ene-2,3-dicarboximide, N- (2-trifluoromethylbenzenesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide N- (2-trifluoromethylbenzenesulfonyloxy) naphthylimi ,

N- (4-trifluoromethylbenzenesulfonyloxy) succinimide, N- (4-trifluoromethylbenzenesulfonyloxy) phthalimide, N- (4-trifluoromethylbenzenesulfonyloxy) diphenylmaleimide, N- (4-trifluoro Methylbenzenesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (4-trifluoromethylbenzenesulfonyloxy) -7-oxabicyclo [2.2.1 ] Hept-5-ene-2,3-dicarboximide, N- (4-trifluoromethylbenzenesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide N- (4-trifluoromethylbenzenesulfonyloxy) naphthylimide ,
N- (nonafluoro-n-butanesulfonyloxy) succinimide, N- (nonafluoro-n-butanesulfonyloxy) phthalimide, N- (nonafluoro-n-butanesulfonyloxy) diphenylmaleimide, N- (nonafluoro-n-butanesulfonyloxy) ) Bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (nonafluoro-n-butanesulfonyloxy) -7-oxabicyclo [2.2.1] hept-5 Ene-2,3-dicarboximide, N- (nonafluoro-n-butanesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (nonafluoro- n-butanesulfonyloxy) naphthylimide,

N- (pentafluorobenzenesulfonyloxy) succinimide, N- (pentafluorobenzenesulfonyloxy) phthalimide, N- (pentafluorobenzenesulfonyloxy) diphenylmaleimide, N- (pentafluorobenzenesulfonyloxy) bicyclo [2.2.1] ] Hept-5-ene-2,3-dicarboximide, N- (pentafluorobenzenesulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (pentafluorobenzenesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (pentafluorobenzenesulfonyloxy) naphthylimide,
N- (perfluoro-n-octanesulfonyloxy) succinimide, N- (perfluoro-n-octanesulfonyloxy) phthalimide, N- (perfluoro-n-octanesulfonyloxy) diphenylmaleimide, N- (perfluoro-n -Octanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (perfluoro-n-octanesulfonyloxy) -7-oxabicyclo [2.2.1 ] Hept-5-ene-2,3-dicarboximide, N- (perfluoro-n-octanesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboximide N- (perfluoro-n-octanesulfonyloxy) naphthylimide, N-{(5-methyl-5- Carboxymethyl methane [2.2.1] hept-2-yl) can be mentioned sulfonyloxy} succinimide, and the like.
V. Diazomethane compounds:
As a diazomethane compound, for example, the following formula (8)

(In the formula, R ₈ and R ₉ each independently represent a monovalent group such as an alkyl group, an aryl group, a halogen-substituted alkyl group, and a halogen-substituted aryl group.)
The compound represented by these can be mentioned.

  Specific examples of diazomethane compounds include bis (trifluoromethanesulfonyl) diazomethane, bis (cyclohexanesulfonyl) diazomethane, bis (benzenesulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, methanesulfonyl-p-toluenesulfonyldiazomethane, cyclohexanesulfonyl -1,1-dimethylethylsulfonyldiazomethane, bis (1,1-dimethylethanesulfonyl) diazomethane, bis (3,3-dimethyl-1,5-dioxaspiro [5.5] dodecane-8-sulfonyl) diazomethane, bis ( 1,4-dioxaspiro [4.5] decane-7-sulfonyl) diazomethane and the like.

VI. Disulfonylmethane compounds:
As the disulfonylmethane compound, for example, the following formula (9)

Wherein R ₁₀ and R ₁₁ are each independently a linear or branched monovalent aliphatic hydrocarbon group, cycloalkyl group, aryl group, aralkyl group or other monovalent organic having a hetero atom. X and Y each independently represent an aryl group, a hydrogen atom, a linear or branched monovalent aliphatic hydrocarbon group, or another monovalent organic group having a hetero atom, and X And / or Y is an aryl group, or X and Y are connected to each other to form a monocyclic or polycyclic ring having at least one unsaturated bond, or X and Y are connected to each other And the following formula

(However, X ′ and Y ′ each independently represent a hydrogen atom, a halogen atom, a linear or branched alkyl group, a cycloalkyl group, an aryl group or an aralkyl group, or the same or different carbon atoms. The bonded X ′ and Y ′ are connected to each other to form a carbon monocyclic structure, and a plurality of X ′ and Y ′ may be the same or different from each other, and n is an integer of 2 to 10. is there.)
The group represented by these is formed. )
The compound represented by these can be mentioned.

  Examples of the acid generator (B) include I.I. Onium salt compounds and IV. Sulfonimide compounds are preferred, and in particular, bis (4-t-butylphenyl) iodonium trifluoromethanesulfonate, bis (4-t-butylphenyl) iodonium perfluoro-n-butanesulfonate, bis (4-t-butylphenyl) iodonium. p-toluenesulfonate, bis (4-t-butylphenyl) iodonium 10-camphorsulfonate, bis (4-t-butylphenyl) iodonium 2-trifluoromethylbenzenesulfonate, bis (4-t-butylphenyl) iodonium 4- Trifluoromethylbenzenesulfonate, bis (4-t-butylphenyl) iodonium 2,4-difluorobenzenesulfonate, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium -Fluoro-n-butanesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium 10-camphorsulfonate, triphenylsulfonium 2-trifluoromethylbenzenesulfonate, triphenylsulfonium 4-trifluorobenzenesulfonate, triphenylsulfonium 2,4 -Difluoromethylbenzenesulfonate, N- (trifluoromethanesulfonyloxy) succinimide, N- (trifluoromethanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (10 -Camphorsulfonyloxy) succinimide, N- (10-camphorsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxy Mid and N - {(5-methyl-5-carboxamide methanesulfonate [2.2.1] hept-2-yl) sulfonyloxy} preferable to use at least one selected from the group consisting of succinimide.

<Acid-dissociable group-containing resin>
The acid-dissociable group-containing resin used in the present invention dissociates a hydrogen atom of an acidic functional group in a resin containing one or more acidic functional groups such as a phenolic hydroxyl group and a carboxyl group in the presence of an acid. As such, it is an alkali-insoluble or hardly alkali-soluble resin substituted with one or more acid-dissociable groups. The term “alkali-insoluble or alkali-insoluble” as used herein refers to alkali development that is employed when a resist pattern is formed from a resist film formed using a radiation-sensitive resin composition containing an acid-dissociable group-containing resin. When a film using only an acid-dissociable group-containing resin instead of the resist film is developed under the conditions, it means that 50% or more of the initial film thickness of the film remains after development.

Examples of the acid dissociable group in the acid dissociable group-containing resin include a substituted methyl group, a 1-substituted ethyl group, a 1-substituted-n-propyl group, a 1-branched alkyl group, a silyl group, a germyl group, and an alkoxycarbonyl. Group, acyl group, cyclic acid dissociable group and the like.
Examples of the substituted methyl group include methoxymethyl group, methylthiomethyl group, ethoxymethyl group, ethylthiomethyl group, methoxyethoxymethyl group, benzyloxymethyl group, benzylthiomethyl group, phenacyl group, 4-bromophenacyl group, 4 -Methoxyphenacyl group, 4-methylthiophenacyl group, α-methylphenacyl group, cyclopropylmethyl group, benzyl group, diphenylmethyl group, triphenylmethyl group, 4-bromobenzyl group, 4-nitrobenzyl group, 4 -Methoxybenzyl group, 4-methylthiobenzyl group, 4-ethoxybenzyl group, 4-ethylthiobenzyl group, piperonyl group, methoxycarbonylmethyl group, ethoxycarbonylmethyl group, n-propoxycarbonylmethyl group, i-propoxycarbonylmethyl group , N-but Aryloxycarbonyl methyl group, and a t- butoxycarbonyl methyl group.
Examples of the 1-substituted ethyl group include 1-methoxyethyl group, 1-methylthioethyl group, 1,1-dimethoxyethyl group, 1-ethoxyethyl group, 1-ethylthioethyl group, 1,1- Diethoxyethyl group, 1-phenoxyethyl group, 1-phenylthioethyl group, 1,1-diphenoxyethyl group, 1-benzyloxyethyl group, 1-benzylthioethyl group, 1-cyclopropyloxyethyl group, 1 -Cyclohexyloxyethyl group, 1-phenylethyl group, 1,1-diphenylethyl group, 1-methoxycarbonylethyl group, 1-ethoxycarbonylethyl group, 1-n-propoxycarbonylethyl group, 1-i-propoxycarbonylethyl Groups, 1-n-butoxycarbonylethyl group, 1-t-butoxycarbonylethyl group, etc. Can.

Examples of the 1-substituted-n-propyl group include 1-methoxy-n-propyl group and 1-ethoxy-n-propyl group.
Examples of the 1-branched alkyl group include i-propyl group, sec-butyl group, t-butyl group, 1,1-dimethylpropyl group, 1-methylbutyl group, 1,1-dimethylbutyl group and the like. Can be mentioned.
Examples of the silyl group include trimethylsilyl group, ethyldimethylsilyl group, methyldiethylsilyl group, triethylsilyl group, i-propyldimethylsilyl group, methyldi-i-propylsilyl group, tri-i-propylsilyl group, Examples thereof include a t-butyldimethylsilyl group, a methyldi-t-butylsilyl group, a tri-t-butylsilyl group, a phenyldimethylsilyl group, a methyldiphenylsilyl group, and a triphenylsilyl group.
Examples of the germyl group include a trimethylgermyl group, an ethyldimethylgermyl group, a methyldiethylgermyl group, a triethylgermyl group, an i-propyldimethylgermyl group, a methyldi-i-propylgermyl group, and a trimethylgermyl group. -I-propylgermyl group, t-butyldimethylgermyl group, methyldi-t-butylgermyl group, tri-t-butylgermyl group, phenyldimethylgermyl group, methyldiphenylgermyl group, triphenylgermyl group, etc. be able to.
Examples of the alkoxycarbonyl group include methoxycarbonyl group, ethoxycarbonyl group, i-propoxycarbonyl group, t-butoxycarbonyl group and the like.

Examples of the acyl group include acetyl group, propionyl group, butyryl group, heptanoyl group, hexanoyl group, valeryl group, pivaloyl group, isovaleryl group, laurylyl group, myristoyl group, palmitoyl group, stearoyl group, oxalyl group, and malonyl. Group, succinyl group, glutaryl group, adipoyl group, piperoyl group, suberoyl group, azelaoil group, sebacoyl group, acryloyl group, propioyl group, methacryloyl group, crotonoyl group, oleoyl group, maleoyl group, fumaroyl group, mesaconoyl group, canphoroyl group Benzoyl group, phthaloyl group, isophthaloyl group, terephthaloyl group, naphthoyl group, toluoyl group, hydroatropoyl group, atropoyl group, cinnamoyl group, furoyl group, thenoyl group, nicotinoyl group Isonicotinoyl group, p- toluenesulfonyl group, and mesyl group.
Further, examples of the cyclic acid dissociable group include a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, a cyclohexenyl group, a 4-methoxycyclohexyl group, a tetrahydropyranyl group, a tetrahydrofuranyl group, a tetrahydrothiopyranyl group, and a tetrahydro group. A thiofuranyl group, 3-bromotetrahydropyranyl group, 4-methoxytetrahydropyranyl group, 4-methoxytetrahydrothiopyranyl group, 3-tetrahydrothiophene-1,1-dioxide group and the like can be mentioned.

Among these acid dissociable groups, benzyl group, t-butoxycarbonylmethyl group, 1-methoxyethyl group, 1-ethoxyethyl group, 1-cyclohexyloxyethyl group, 1-ethoxy-n-propyl group, t-butyl Group, 1,1-dimethylpropyl group, trimethylsilyl group, t-butoxycarbonyl group, tetrahydropyranyl group, tetrahydrofuranyl group, tetrahydrothiopyranyl group, tetrahydrothiofuranyl group and the like are preferable.
The acid dissociable group introduction rate in the acid dissociable group-containing resin (the ratio of the number of acid dissociable groups to the total number of acid functional groups and acid dissociable groups in the acid dissociable group-containing resin) is determined by acid dissociation. Although it cannot unconditionally be defined depending on the type of the functional group or the alkali-soluble resin into which the group is introduced, it is preferably 10 to 100%, more preferably 15 to 100%.

The acid-dissociable group-containing resin may be, for example, a method of introducing one or more acid-dissociable groups into a previously prepared alkali-soluble resin, or one or more polymerizable unsaturated monomers having an acid-dissociable group. A method of (co) polymerizing, optionally with one or more other polymerizable unsaturated monomers, one or more polycondensation components having acid dissociable groups, optionally one or more other polycondensation Along with the components, it can be produced by a (co) polycondensation method or the like.
The (co) polymerization of a polymerizable unsaturated monomer having an acid dissociable group when producing an acid dissociable group-containing resin is a radical polymerization initiator depending on the type of monomer or reaction medium, A polymerization initiator such as an anionic polymerization catalyst, a coordination anionic polymerization catalyst, a cationic polymerization catalyst, or a polymerization catalyst is appropriately selected, and bulk polymerization, solution polymerization, precipitation polymerization, emulsion polymerization, suspension polymerization, bulk-suspension polymerization, etc. It can be carried out by an appropriate polymerization method, and (co) condensation of the polycondensation component having an acid dissociable group is carried out in an aqueous medium or a mixed medium of water and a hydrophilic solvent in the presence of an acidic catalyst ( It can be produced by co-polycondensation.

The polystyrene-reduced weight molecular weight (hereinafter referred to as “Mw”) of the acid-dissociable group-containing resin measured by gel permeation chromatography is preferably 1,000 to 500,000, more preferably 3,000 to 300,000. It is.
The ratio (Mw / Mn) of the resin Mw and the polystyrene-equivalent molecular weight (hereinafter referred to as “Mn”) measured by gel permeation chromatography (GPC) is usually 1 to 10, preferably 1 to 1. 5.

The acid-dissociable group-containing resin particularly preferably used for the radiation-sensitive resin composition using a KrF excimer laser includes an alkali group containing a repeating unit represented by the following formula (10) and a repeating unit having an acid-dissociable group. A (hard) soluble resin (hereinafter also referred to as “resin (C1)”) is preferred. The resin (C1) can also be suitably used for a radiation sensitive resin composition using an F ₂ excimer laser, an electron beam, or the like.

(In the formula, R ₁₂ represents a hydrogen atom or a monovalent organic group. A and b represent natural numbers of 1 to 3.)

  As the repeating unit represented by the above formula (10), p-hydroxystyrene, m-hydroxystyrene, o-hydroxystyrene, α-methylhydroxystyrene, 3-methyl-4-hydroxystyrene, 2-methyl-4-hydroxystyrene , Non-aromatic double bonds such as 2-methyl 3-hydroxystyrene, 4-methyl 3-hydroxystyrene, 5-methyl 3-hydroxystyrene, 3,4 dihydroxystyrene, 2,4,6-trihydroxystyrene are cleaved Units. Among these, units in which a non-aromatic double bond is cleaved such as p-hydroxystyrene, m-hydroxystyrene, o-hydroxystyrene, α-methylhydroxystyrene and the like are preferable.

  Examples of the repeating unit containing an acid dissociable group include a repeating unit obtained by protecting the phenolic hydroxyl group or carboxyl group of the above repeating unit with the acid dissociable group described above.

  Examples of other repeating units in the resin (C1) include styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2-methoxystyrene, 3-methoxystyrene, and 4-methoxystyrene. 4-t-butoxystyrene, 4-t-butoxycarbonyloxystyrene, 4-t-butoxycarbonylmethyloxystyrene, 4- (2′-t-butoxycarbonylethyloxy) styrene, 4-tetrahydrofuranyloxystyrene, 4 -Vinyl aromatic compounds such as tetrahydropyranyloxystyrene;

Methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, Sec-butyl (meth) acrylate, t-butyl (meth) acrylate, n-pentyl (meth) acrylate, neopentyl (meth) acrylate, n-hexyl (meth) acrylate, 2- (meth) acrylic acid 2- Ethylhexyl, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acryl Norbornyl acid, isobornyl (meth) acrylate, tricyclodecanyl (meth) acrylate (Meth) acrylic acid dicyclopentenyl, (meth) acrylic acid adamantyl, (meth) acrylic acid adamantylmethyl, (meth) acrylic acid tetrahydrofuranyl, (meth) acrylic acid tetrahydropyranyl, (meth) acrylic acid phenyl, (meth) ) (Meth) acrylic acid esters such as benzyl acrylate, phenethyl (meth) acrylate, monomers represented by the following formulas (11) to (13);

(In the formula, n represents a natural number of 1 or more and 6 or less.)

Unsaturated carboxylic acids such as (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, cinnamic acid;
Carboxyalkyl esters of unsaturated carboxylic acids such as 2-carboxyethyl (meth) acrylate, 2-carboxypropyl (meth) acrylate, 3-carboxypropyl (meth) acrylate;
Unsaturated nitrile compounds such as (meth) acrylonitrile, α-chloroacrylonitrile, crotonnitrile, maleinnitrile, fumaronitrile;
Unsaturated amide compounds such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, crotonamide, maleinamide, fumaramide;
Unsaturated imide compounds such as maleimide, N-phenylmaleimide, N-cyclohexylmaleimide;
N-vinyl-ε-caprolactam, N-vinyl pyrrolidone, 2-vinyl pyridine, 3-vinyl pyridine, 4-vinyl pyridine, 2-vinyl imidazole, other nitrogen-containing vinyl compounds such as 4-vinyl imidazole, etc. Examples include units in which a saturated bond is cleaved.

  Among these other repeating units, styrene, α-methylstyrene, 4-t-butoxystyrene, 4-t-butoxycarbonyloxystyrene, 4-t-butoxycarbonylmethyloxystyrene, 4- (2′-t- Butoxycarbonylethyloxy) styrene, t-butyl (meth) acrylate, isobornyl (meth) acrylate, tricyclodecanyl (meth) acrylate, monomers represented by the above formulas (11) and (12), etc. A unit in which the polymerizable unsaturated bond is cleaved is preferred.

The acid dissociable group-containing resin particularly preferably used for the radiation-sensitive resin composition using an ArF excimer laser is represented by the repeating unit represented by the following general formula (14) and / or the following general formula (15). Alkali-insoluble (hard) soluble resin (hereinafter also referred to as “resin (C2)”) is preferable. The resin (C2) can also be suitably used for a radiation sensitive resin composition using an F ₂ excimer laser, an electron beam, or the like.

(In the formula, A and B each independently represent a hydrogen atom or an acid dissociable group, and at least one of A and B is an acid dissociable group, and D and E each independently represent a hydrogen atom or a carbon number of 1 to 4 represents a linear or branched monovalent alkyl group, and n is an integer of 0 to 2.)

(In the formula, R ₁₃ represents a hydrogen atom or a methyl group, and each R ₁₄ independently of each other is a linear or branched alkyl group having 1 to 4 carbon atoms or an optionally substituted 1 having 4 to 20 carbon atoms. A divalent alicyclic group having 4 to 20 carbon atoms, which represents a valent alicyclic hydrocarbon group, or any two of R ₁₄ may be bonded to each other and each may be substituted together with the carbon atoms to which they are bonded. The remaining R ₁₄ is a linear or branched alkyl group having 1 to 4 carbon atoms or an optionally substituted monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms. is there.)

Examples of the repeating unit represented by the general formula (14) include 5-t-butoxycarbonylbicyclo [2.2.1] hept-2-ene, 5- (4-t-butylcyclohexyloxy) carbonylbicyclo [2]. 2.1] hept-2-ene, 5- (1-ethoxyethoxy) carbonylbicyclo [2.2.1] hept-2-ene, 5- (1-cyclohexyloxyethoxy) carbonylbicyclo [2.2. 1] hept-2-ene, 5-t-butoxycarbonylmethoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-tetrahydrofuranyloxycarbonylbicyclo [2.2.1] hept-2-ene, 5-tetrahydropyranyloxycarbonylbicyclo [2.2.1] hept-2-ene, 8-t-butoxycarbonyltetracyclo [4.4 0.1 ^2,5. 1 ^7,10 ] dodec-3-ene, 8- (4-t-butylcyclohexyloxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8- (1-ethoxyethoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8- (1-cyclohexyloxyethoxy) carbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-t-butoxycarbonylmethoxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-tetrahydrofuranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-tetrahydropyranyloxycarbonyltetracyclo [4.4.0.1 ^2,5 . And a unit in which a double bond of a norbornene ring such as ^{17, 10} ] dodec-3-ene is cleaved.

  Preferred examples of the repeating unit represented by the general formula (15) include a repeating unit derived from t-butoxycarbonyl (meth) acrylate, and a repeating unit represented by the following formula.

(In the formula, R ₁₃ is a hydrogen atom or a methyl group.)

Examples of other repeating units in the resin (C2) include norbornene (bicyclo [2.2.1] hept-2-ene), 5-methylbicyclo [2.2.1] hept-2-ene, 5- Ethylbicyclo [2.2.1] hept-2-ene, 5-hydroxybicyclo [2.2.1] hept-2-ene, 5-fluorobicyclo [2.2.1] hept-2-ene, tetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-methyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-ethyltetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-hydroxytetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodec-3-ene, 8-fluorotetracyclo [4.4.0.1 ^2,5 . A monomer having a norbornene skeleton such as ^{17, 10} ] dodec-3-ene;
Acid anhydrides such as maleic anhydride and itaconic anhydride;
Examples of other repeating units in the resin (C1) include units in which a polymerizable unsaturated bond such as (meth) acrylate represented by the following formula (i) is cleaved in addition to the above-mentioned (meth) acrylate. Can do.

(In the formula, R ₁₃ is a hydrogen atom or a methyl group.)

  In particular, the resin (C2) having a repeating unit represented by the general formula (14) preferably has a repeating unit derived from maleic anhydride as another repeating unit.

The acid-dissociable group-containing resin particularly preferably used for the radiation-sensitive resin composition using the F ₂ excimer laser has a repeating unit represented by the following general formula (16) and / or the following general formula (17). Alkali-insoluble (hard) soluble polysiloxane (hereinafter also referred to as “resin (C3)”) is preferable. The resin (C3) can also be suitably used for a radiation sensitive resin composition using an ArF excimer laser, an electron beam, or the like.

(In the formula, A represents a monovalent organic group having an acid dissociable group independently of each other, and R ₁₄ represents an optionally substituted linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms. Show.)

  As A in the general formulas (16) and (17), an alicyclic hydrocarbon group such as a cycloalkyl group, a tricyclodecanyl group, a tetracyclododecyl group, an adamantyl group, or a halogenated aromatic hydrocarbon group is used. The group having is preferable. In particular, the repeating unit represented by the above formula (16) is preferable, and specific preferred examples include the repeating units represented by the following formulas (ii) to (v).

As another repeating unit in the resin (C3), for example, a repeating unit having a structure obtained by hydrolyzing an alkylalkoxysilane such as methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, or ethyltriethoxysilane;
Preferred examples include repeating units represented by the following formulas (vi) to (ix).

  The resin (C3) can be obtained by co-condensing a silane compound containing an acid dissociable group or by introducing an acid dissociable group into polysiloxane. When co-condensing a silane compound containing an acid dissociable group, it is preferable to use an acidic catalyst as the catalyst. In particular, it is preferable that the silane compound is polycondensed in the presence of an acidic catalyst and then further reacted by adding a basic catalyst.

  Examples of the acidic catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, boric acid, phosphoric acid, titanium tetrachloride, zinc chloride, and aluminum chloride; formic acid, acetic acid, n-propionic acid, butyric acid, valeric acid, oxalic acid, malonic acid Organic acids such as succinic acid, maleic acid, fumaric acid, adipic acid, phthalic acid, terephthalic acid, acetic anhydride, maleic anhydride, citric acid, benzenesulfonic acid, p-toluenesulfonic acid, methanesulfonic acid, etc. it can. Of these, hydrochloric acid, sulfuric acid, acetic acid, oxalic acid, malonic acid, maleic acid, fumaric acid, acetic anhydride, maleic anhydride and the like are preferable.

  Examples of the basic catalyst include inorganic bases such as lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium carbonate, potassium carbonate; triethylamine, Examples thereof include organic bases such as tri-n-propylamine, tri-n-butylamine and pyridine.

<Alkali-soluble resin>
The alkali-soluble resin used as the components (C), (b) and (D) of the present invention has a functional group having an affinity for an alkali developer, for example, an acidic functional group such as a phenolic hydroxyl group or a carboxyl group. It is a resin soluble in an alkali developer having at least seeds.
Examples of such alkali-soluble resins include addition polymerization resins having one or more repeating units represented by the following formulas (18) to (20), and one repeating unit represented by the following formula (21). Examples thereof include the polycondensation resins described above.

(Wherein R ₁₅ represents a hydrogen atom or a methyl group, R ₁₆ represents a hydroxyl group, a carboxyl group, —R ₁₇ COOH, —OR ₁₇ COOH, —OCOR ₁₇ COOH, or —COOR ₁₇ COOH (where R ₁₇ represents — ( CH _{2) g} - indicates, g represents an an integer of 1 to 4))..

(In the formula, each R ₁₈ independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)

When the alkali-soluble resin is an addition polymerization resin, it may be composed only of repeating units represented by the above formulas (18) to (20), but as long as the produced resin is soluble in an alkali developer. It may further have one or more other repeating units.
Examples of such other repeating units include other repeating units in the resin (C1) described above.
The addition polymerization resin (co) polymerizes, for example, a monomer corresponding to the repeating unit represented by the formulas (18) to (20) together with a monomer that forms the other repeating unit. Can be manufactured.
These (co) polymerizations are carried out by appropriately using a polymerization initiator such as a radical polymerization initiator, an anionic polymerization catalyst, a coordination anionic polymerization catalyst, a cationic polymerization catalyst or a polymerization catalyst depending on the type of monomer and reaction medium. It can be selected and carried out by an appropriate polymerization method such as bulk polymerization, solution polymerization, precipitation polymerization, emulsion polymerization, suspension polymerization, bulk-suspension polymerization.

Further, when the alkali-soluble resin is a polycondensation resin, it may be composed of only the repeating unit represented by the above formula (21), but as long as the produced resin is soluble in an alkali developer, 1 It can also have other repeating units of species or more. Such a polycondensation resin comprises a phenol and an aldehyde corresponding to the repeating unit represented by the formula (21), optionally together with a polycondensation component capable of forming another repeating unit, in the presence of an acidic catalyst. It can be produced by (co) polycondensation in an aqueous medium or in a mixed medium of water and a hydrophilic solvent.
Examples of the phenols include o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol and the like can be mentioned. Examples of the aldehydes include formaldehyde, trioxane, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde and the like. Can be mentioned.

The content of the repeating unit represented by the formulas (18) to (21) in the alkali-soluble resin cannot be defined unconditionally depending on the type of the other repeating unit contained in some cases, but is preferably 10 to 100 mol%. More preferably, it is 20-100 mol%.
When the alkali-soluble resin has a repeating unit containing a carbon-carbon unsaturated bond represented by the formula (18), the formula (21) or the like, it can also be used as a hydrogenated product. The hydrogenation rate in this case is usually 70% or less, preferably 50% or less, more preferably 50% or less, of the carbon-carbon unsaturated bond contained in the repeating unit represented by formula (18), formula (21), or the like. Is 40% or less. In this case, if the hydrogenation rate exceeds 70%, the developability of the alkali-soluble resin with an alkali developer may be lowered.

The alkali-soluble resin used in the present invention is mainly poly (p-hydroxystyrene), p-hydroxystyrene / p-hydroxy-α-methylstyrene copolymer, p-hydroxystyrene / styrene copolymer, etc. A resin as a component is preferable.
The Mw of the alkali-soluble resin varies depending on the desired properties of the radiation-sensitive resin composition, but is preferably 1,000 to 150,000, more preferably 3,000 to 100,000.
The alkali-soluble resins can be used alone or in admixture of two or more.

Alkali Solubility Control Agent Examples of the alkali solubility control agent used in the present invention include compounds in which hydrogen atoms of acidic functional groups such as phenolic hydroxyl groups and carboxyl groups are substituted with acid dissociable groups.
Examples of such acid dissociable groups include substituted methyl groups, 1-substituted ethyl groups, 1-substituted n-propyl groups, 1-branched alkyl groups, and silyl groups exemplified for the above acid dissociable group-containing resins. And groups similar to acid dissociable groups such as germyl group, alkoxycarbonyl group, acyl group and cyclic acid dissociable group.
The alkali solubility control agent may be a low molecular compound or a high molecular compound, but specific examples of the low molecular compound include compounds represented by the following formulas (22) to (26).

(In the formula, R ₁₉ independently represents an acid dissociable substituent, R ₂₀ independently represents a C 1-4 alkyl group, a phenyl group or a 1-naphthyl group, R ₂₁ represents a hydrogen atom, C represents an alkyl group having 1 to 4 carbon atoms or a phenyl group, and A represents a single bond, —O—, —S—, —CO—, —COO—, —SO—, —SO 2 —, —C (R ₂₂ ) ( R ₂₃ ) — (wherein R ₂₂ and R ₂₃ each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 11 carbon atoms, a phenyl group or a 1-naphthyl group) or a substituent And p, q, r, s, t, u, v, and w are each an integer of 0 or more (provided that p in Formula (22) is an integer of 1 or more).

  In addition, as the polymer alkali solubility control agent, for example, the acid-dissociable group-containing resin described above can be used.

Cross-linking agent (E)
As a crosslinking agent used in the negative radiation sensitive resin composition of the present invention, for example, one or more functional groups having crosslinking reactivity with an alkali-soluble resin (hereinafter referred to as “crosslinkable functional group”). The compound which has can be mentioned.

  Specific examples of the crosslinkable functional group include glycidyl ether group, glycidyl ester group, glycidyl amino group, methoxymethyl group, ethoxymethyl group, benzyloxymethyl group, acetoxymethyl group, benzoyloxymethyl group, formyl group, acetyl group Group, vinyl group, isopropenyl group, dimethylaminomethyl group, diethylaminomethyl group, dimethylolaminomethyl group, diethylolaminomethyl group, morpholinomethyl group and the like.

  Examples of the compound having a crosslinkable functional group include a bisphenol A epoxy compound, a bisphenol F epoxy compound, a bisphenol S epoxy compound, a novolac resin epoxy compound, a resole resin epoxy compound, and a poly (hydroxystyrene) epoxy. Compound, methylol group-containing melamine compound, methylol group-containing benzoguanamine compound, methylol group-containing urea compound, methylol group-containing phenol compound, alkoxyalkyl group-containing melamine compound, alkoxyalkyl group-containing benzoguanamine compound, alkoxyalkyl group-containing urea compound, alkoxyalkyl group -Containing phenol compound, carboxymethyl group-containing melamine resin, carboxymethyl group-containing benzoguanamine resin, carboxymethyl group-containing urea resin Carboxymethyl group-containing phenol resin, carboxymethyl group-containing melamine compounds, carboxymethyl group-containing benzoguanamine compounds, carboxymethyl group-containing urea compounds, mention may be made of carboxymethyl group-containing phenol compounds and the like.

  Among these compounds having a crosslinkable functional group, a methylol group-containing phenol compound, a methoxymethyl group-containing melamine compound, a methoxymethyl group-containing phenol compound, a methoxymethyl group-containing glycoluril compound, a methoxymethyl group-containing urea compound, and an acetoxymethyl group Containing phenol compounds are preferred, and more preferred are methoxymethyl group-containing melamine compounds (for example, hexamethoxymethyl melamine), methoxymethyl group-containing glycoluril compounds, methoxymethyl group-containing urea compounds, and the like. The methoxymethyl group-containing melamine compound is a trade name such as CYMEL300, CYMEL301, CYMEL303, CYMEL305 (manufactured by Mitsui Cyanamid Co., Ltd.), and the methoxymethyl group-containing glycoluril compound is a trade name such as CYMEL1174 (manufactured by Mitsui Cyanamid Co., Ltd.). The methoxymethyl group-containing urea compounds are commercially available under trade names such as MX290 (manufactured by Sanwa Chemical Co., Ltd.).

  As the cross-linking agent, a compound having a property as a cross-linking agent obtained by substituting the hydrogen atom of the acidic functional group in the alkali-soluble resin with the cross-linking functional group can also be preferably used. In this case, the rate of introduction of the crosslinkable functional group cannot be unconditionally defined by the type of the crosslinkable functional group or the alkali-soluble resin into which the group is introduced. 5 to 60 mol%, preferably 10 to 50 mol%, more preferably 15 to 40 mol%. In this case, if the introduction ratio of the crosslinkable functional group is less than 5 mol%, the remaining film ratio tends to decrease, the pattern meanders or swells easily, and if it exceeds 60 mol%, the development of the exposed area tends to occur. Tend to decrease.

  As the crosslinking agent in the present invention, a methoxymethyl group-containing compound such as dimethoxymethylurea, tetramethoxymethylglycoluril and the like are particularly preferable. A crosslinking agent can be used individually or in mixture of 2 or more types.

The blending ratio of each component constituting the positive radiation-sensitive resin composition and the negative radiation-sensitive resin composition of the present invention varies depending on the desired characteristics of the resist. Preferred blending ratios are as follows. is there.
First, in the positive radiation sensitive resin composition, the compounding amount of the compound (A) is preferably 0.001 to 15 parts by weight, more preferably 0, per 100 parts by weight of the acid-dissociable group-containing resin or alkali-soluble resin. 0.001 to 10 parts by weight, particularly preferably 0.005 to 5 parts by weight. In this case, when the compounding amount of the compound (A) is less than 0.001 part by weight, the effect of the present invention may not be sufficiently obtained. On the other hand, when it exceeds 15 parts by weight, the sensitivity and developability of the exposed part are deteriorated. Tend.
The amount of the acid generator (B) is preferably 0.01 to 70 parts by weight, more preferably 0.1 to 50 parts by weight, especially 100 parts by weight of the acid-dissociable group-containing resin or alkali-soluble resin. Preferably it is 0.5-20 weight part. In this case, if the blending amount of the acid generator (B) is less than 0.01 parts by weight, the sensitivity and resolution tend to decrease. On the other hand, if it exceeds 70 parts by weight, the resist coatability and pattern shape deteriorate. It tends to be easy to do.
The blending amount of the alkali solubility control agent is preferably 5 to 150 parts by weight, more preferably 5 to 100 parts by weight, and particularly preferably 5 to 50 parts by weight per 100 parts by weight of the alkali-soluble resin. In this case, if the blending amount of the alkali solubility control agent is less than 5 parts by weight, the remaining film rate tends to decrease and the pattern swells easily. There is a tendency to cause a decrease in strength.

Next, in the negative radiation sensitive resin composition, the compounding amount of the compound (A) is preferably 0.001 to 15 parts by weight, more preferably 0.001 to 10 parts by weight, per 100 parts by weight of the alkali-soluble resin. Particularly preferred is 0.005 to 5 parts by weight. In this case, when the compounding amount of the compound (A) is less than 0.001 part by weight, the effect of the present invention may not be sufficiently obtained. On the other hand, when it exceeds 15 parts by weight, the sensitivity and developability of the exposed part are deteriorated. Tend.
The amount of the acid generator (B) is preferably 0.01 to 70 parts by weight, more preferably 0.1 to 50 parts by weight, particularly preferably 0.5 to 20 parts per 100 parts by weight of the alkali-soluble resin. Parts by weight. In this case, if the blending amount of the acid generator (B) is less than 0.01 parts by weight, the sensitivity and resolution tend to decrease. On the other hand, if it exceeds 70 parts by weight, the resist coatability and pattern shape deteriorate. It tends to be easy to do.
Moreover, the compounding quantity of a crosslinking agent becomes like this. Preferably it is 5-95 weight part per 100 weight part of alkali-soluble resin, More preferably, it is 15-85 weight part, Most preferably, it is 20-75 weight part. In this case, if the blending amount of the cross-linking agent is less than 5 parts by weight, the remaining film ratio tends to decrease, the pattern meanders or swells easily, and if it exceeds 95 parts by weight, the developability of the exposed part is increased. There is a tendency to decrease.

Additives In the radiation-sensitive resin composition of the present invention, an acid diffusion control agent other than the compound (A) (hereinafter referred to as “other acid diffusion control agent”), a surfactant, and a sensitization, as necessary. Various additives such as an agent can be blended. In addition, the alkali-soluble resin and / or the alkali-solubility control agent can be further blended with the positive radiation-sensitive resin composition using the acid-dissociable group-containing resin.
Examples of other acid diffusion control agents include the above-described nitrogen-containing compound (a) and compounds in which a hydrogen atom bonded to the nitrogen atom of the nitrogen-containing compound (a) is substituted with a t-butoxycarbonyl group. it can. These acid diffusion control agents can be used alone or in admixture of two or more.
The blending amount of the other acid diffusion control agent is usually 90% by weight or less, preferably 70% by weight or less, particularly preferably 50% by weight or less, based on the total of the compound (A) and the other acid diffusion control agent. It is. In this case, if the blending amount of the other acid diffusion control agent exceeds 90% by weight, the intended effect in the present invention may be impaired.

Moreover, the said surfactant shows the effect | action which improves the applicability | paintability, striation, developability, etc. of a radiation sensitive resin composition. As such a surfactant, any of anionic, cationic, nonionic or amphoteric can be used, but a preferred surfactant is a nonionic surfactant.
Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, polyethylene glycol higher fatty acid diesters, and the following trade names: KP (manufactured by Shin-Etsu Chemical) , Polyflow (manufactured by Kyoeisha Yushi Chemical Co., Ltd.), F Top (manufactured by Tokemu Products), Mega Fuck (manufactured by Dainippon Ink & Chemicals), Florard (manufactured by Sumitomo 3M), Asahi Guard, Surflon (manufactured by Asahi Glass), etc. Can be mentioned.
The said surfactant can be used individually or in mixture of 2 or more types. The compounding amount of the surfactant is usually 2 parts by weight or less as an active ingredient of the surfactant per 100 parts by weight of the total resin components in the radiation-sensitive resin composition.

The sensitizer absorbs radiation energy and transmits the energy to the acid generator (B), thereby increasing the amount of acid produced. The radiation-sensitive resin composition It has the effect of improving the apparent sensitivity.
Preferred sensitizers are acetophenones, benzophenones, naphthalenes, biacetyl, eosin, rose bengal, pyrenes, anthracenes, phenothiazines and the like.
The above sensitizers can be used alone or in admixture of two or more.
The blending amount of the sensitizer is usually 50 parts by weight or less, preferably 30 parts by weight or less per 100 parts by weight of the total resin components in the radiation-sensitive resin composition.
Also, by blending dyes and / or pigments, the latent image of the exposed area can be visualized, and the influence of halation during exposure can be mitigated. By blending an adhesion aid, adhesion to the substrate is improved. be able to.
Furthermore, examples of other additives include an antihalation agent, a storage stabilizer, an antifoaming agent, a shape improving agent, and the like, specifically 4-hydroxy-4′-methylchalcone.

Solvent When the radiation sensitive resin composition of the present invention is used, it is dissolved in a solvent such that the solid content concentration is, for example, 2 to 50% by weight, and then filtered through a filter having a pore size of about 0.2 μm, Prepared as a composition solution.
Examples of the solvent include ethers, esters, ether esters, ketone esters, ketones, amides, amide esters, lactams, lactones, and (halogenated) hydrocarbons. More specifically, ethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ether acetates, acetate esters , Hydroxyacetic acid esters, alkoxyacetic acid esters, acetoacetic acid esters, propionic acid esters, lactic acid esters, alkoxypropionic acid esters, butyric acid esters Pyruvates, (non-) cyclic ketones, N, N-dialkylformamides, N, N-dialkylacetamides, N-alkylpyrrolidones, γ-lactones, (halogenated) aliphatic hydrocarbons, (Halogenated) aromatic hydrocarbons can be mentioned.

Specific examples of such solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol di-n- Propyl ether, diethylene glycol di-n-butyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-propyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol mono- n-propyl ether ace , Ethyl acetate, n-propyl acetate, n-butyl acetate, isopropenyl acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl hydroxyacetate, ethyl ethoxyacetate, methyl acetoacetate, acetoacetic acid Ethyl, isopropenyl propionate, 3-methyl-3-methoxybutylpropionate, ethyl lactate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3-ethoxy Methyl propionate, ethyl 3-ethoxypropionate, 3-methyl-3-methoxybutyl butyrate, methyl 2-hydroxy-3-methylbutyrate, methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, 4-heptanone, N, N-dimethyl Formamide, N, N- dimethylacetamide, N- methylpyrrolidone, toluene, xylene and the like.
Of these solvents, propylene glycol monoalkyl ether acetates, lactic acid esters, 3-alkoxypropionic acid esters, (non) cyclic ketones, and the like are preferable.
The said solvent can be used individually or in mixture of 2 or more types.

  Further, the above solvents include benzyl ethyl ether, di-n-hexyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, acetonyl acetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol as necessary. One or more high-boiling solvents such as benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol monophenyl ether acetate can be added.

Formation of resist pattern When forming a resist pattern from the radiation-sensitive resin composition of the present invention, the composition solution prepared as described above is applied by means such as spin coating, cast coating, roll coating, etc. For example, a resist film is formed by coating on a substrate such as a silicon wafer or a wafer coated with aluminum, and then a heat treatment (hereinafter referred to as “PB”) is performed, followed by a predetermined mask pattern. The resist film is exposed. Examples of radiation that can be used in this case include a far ultraviolet ray such as an emission line spectrum of a mercury lamp (wavelength 254 nm), a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), an F ₂ excimer laser (wavelength 157 nm). Although preferable, depending on the type of the acid generator (B), X-rays such as synchrotron radiation, charged particle beams such as electron beams, and the like can also be used. In addition, exposure conditions such as radiation dose are appropriately selected according to the composition of the radiation-sensitive resin composition, the type of additive, and the like.
After the exposure, in order to improve the apparent sensitivity of the resist, it is preferable to perform a heat treatment (hereinafter referred to as “PEB”). The heating conditions vary depending on the composition of the radiation-sensitive resin composition, the type of additive, and the like, but are usually 30 to 200 ° C, preferably 50 to 150 ° C.
Then, a predetermined resist pattern is formed by developing with an alkaline developer.
Examples of the alkali developer include alkali metal hydroxide, aqueous ammonia, alkylamines, alkanolamines, heterocyclic amines, tetraalkylammonium hydroxides, choline, 1,8-diazabicyclo [5.4. .0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonene and the like, usually 1 to 10% by weight, preferably 2 to 5% by weight. An alkaline aqueous solution dissolved so as to have a concentration is used. A particularly preferred alkaline developer is an aqueous solution of tetraalkylammonium hydroxides. In addition, an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like can be added to the developer composed of the alkaline aqueous solution.
In addition, when using the developing solution which consists of alkaline aqueous solution in this way, generally it wash | cleans with water after image development.

  Hereinafter, the embodiment of the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

[Synthesis of Compound (A)]
Synthesis example 1
194 g of 2-phenylbenzimidazole, 150 g of t-butyldimethylsilyl chloride and 64 g of n-butyllithium were reacted in DMF at 0 ° C. for 2 hours, then heated to 25 ° C. and stirred for 4 hours. The solvent was distilled off with an evaporator and extracted with hexane. Thereafter, it was cooled to 0 degree and recrystallized to obtain 180 g of a white solid represented by the following formula. This compound is defined as (α1).

Synthesis example 2
194 g of 2-phenylbenzimidazole and 40 g of sodium hydroxide were stirred in THF at 0 degree for 1 hour, and then 80 g of methoxymethyl chloride was added and stirred for 48 hours. The solvent was distilled off with an evaporator and extracted with hexane. Thereafter, it was cooled to 0 degree and recrystallized to obtain 130 g of a white solid represented by the following formula. This compound is defined as (α2).

[Synthesis of acid-dissociable group-containing resin]
Measurement of Mw and Mn of the resin obtained in the following Synthesis Example 3, Tosoh Corporation GPC column (G2000H _XL 2 present, G3000H _XL 1 present, G4000H _XL 1 present) using, Flow rate: 1.0 ml / min Measurement was performed by gel permeation chromatography (GPC) using monodisperse polystyrene as a standard under the analysis conditions of elution solvent tetrahydrofuran and column temperature of 40 ° C.

Synthesis example 3
After dissolving 101 g of p-acetoxystyrene, 5 g of styrene, 42 g of pt-butoxystyrene, 6 g of AIBN and 1 g of t-dodecyl mercaptan in 160 g of propylene glycol monomethyl ether, the reaction temperature is maintained at 70 ° C. under a nitrogen atmosphere. Polymerized for 16 hours. After the polymerization, the reaction solution was dropped into a large amount of hexane to coagulate and purify the resulting resin. Next, 150 g of propylene glycol monomethyl ether was added to the purified resin, and then 300 g of methanol, 80 g of triethylamine and 15 g of water were further added, and a hydrolysis reaction was performed for 8 hours while refluxing at the boiling point. After the reaction, the solvent and triethylamine were distilled off under reduced pressure, and the resulting resin was dissolved in acetone, then dropped into a large amount of water to solidify, and the resulting white powder was filtered and dried at 50 ° C. under reduced pressure overnight. did.
The obtained resin has Mw of 16,000 and Mw / Mn of 1.7. As a result of ¹³ C-NMR analysis, the copolymerization molar ratio of p-hydroxystyrene, styrene and pt-butoxystyrene is as follows. 72: 5: 23. This resin is referred to as “resin (C-1)”.

[Chemically amplified radiation-sensitive resin composition]
Examples and Comparative Examples The components shown in Table 1 (where parts are based on weight) were mixed to form a uniform solution, and then filtered through a membrane filter having a pore size of 0.2 μm to prepare a composition solution. Then, after spin-coating each composition solution on a silicon wafer, PB was performed at 120 ° C. for 90 seconds to form a resist film having a thickness of 5000 mm.

  Subsequently, after performing exposure using Nikon Corporation stepper NSR2205 EX12B (numerical aperture 0.55), PEB was performed at 130 ° C. for 90 seconds. Thereafter, a 2.38 wt% tetramethylammonium hydroxide aqueous solution was used and developed by the paddle method at 23 ° C. for 1 minute, and then washed with pure water and dried to form a resist pattern. The evaluation results of each resist are also shown in Table 1.

Here, each resist was evaluated in the following manner.
sensitivity:
The resist film formed on the silicon wafer is exposed to light, immediately subjected to PEB, alkali-developed, washed with water, and dried to form a resist pattern. When a resist pattern is formed, a line-and-space pattern with a line width of 0.22 μm ( 1L1S) was formed as an optimum exposure dose, and the sensitivity was evaluated based on this optimum exposure dose.
resolution:
The minimum dimension (μm) of the line-and-space pattern (1L1S) resolved when exposed at the optimum exposure amount was taken as the resolution.
[PED stability]
In the formation of the resist pattern, after the coating film formed on the substrate is exposed, the substrate is left in a chamber in which the ammonia concentration is controlled to 5 ppb for 2 hours. A line and space pattern having a design line width of 0.26 μm was formed in the same manner except that baking was performed, and the line width at the upper end of the pattern was set to La and evaluated according to the following criteria.
Good: When 0.85 × 0.26 μm <La <1.1 × 0.26 μm,
Defect a (thinning defect): When La ≦ 0.85 × 0.26 μm,
Defect B (thickness defect): When La ≧ 1.1 × 0.26 μm [Storage stability]
When the resist composition was prepared by the above method, the test sample for which the sensitivity was calculated was allowed to stand at room temperature for 1 month, and the sensitivity was calculated again, the sensitivity changed by 10% or more compared to the initially calculated sensitivity. Those that were “bad” and those that were not changed were “good”.

  The acid generator (B) and the solvent are as follows.

Acid generator (B):
B-1: n-trifluoromethanesulfonyloxy-5-norbornene-2,3-dicarboximide solvent:
G-1: Ethyl lactate G-2: Propylene glycol monomethyl ether acetate

Claims (4)

(A) a compound represented by the following formula (3) (excluding a compound represented by the following formula (a)) ,
(B) a radiation-sensitive acid generator, and (C) (i) an alkali-insoluble or alkali-insoluble resin protected with an acid-dissociable group, which is alkali-soluble when the acid-dissociable group is dissociated. Or (b) an alkali-soluble resin and an alkali-solubility control agent.

(In the formula, R ₁ and R ₂ each independently represent a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted with the following substituent, R ₅ And R ₆ each independently represent a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted with the following substituents, and R ₁ , R ₂ , R ₅ And at least two groups of R ₆ may be linked to each other to form a ring, and the substituent is a hydroxyl group; A cyano group; a cyanoalkyl group having 2 to 5 carbon atoms; an alkoxycarbonyl group; and an alkoxycarbonylalkoxy group.
(A) a compound represented by the following formula (3) (excluding a compound represented by the following formula (a)) ,
(B) a radiation sensitive acid generator,
A positive radiation-sensitive resin composition comprising (D) an alkali-soluble resin and (E) a compound capable of crosslinking the alkali-soluble resin in the presence of an acid.

(In the formula, R ₁ and R ₂ each independently represent a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted with the following substituent, R ₅ And R ₆ each independently represent a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may be substituted with the following substituents, and R ₁ , R ₂ , R ₅ And at least two groups of R ₆ may be linked to each other to form a ring, and the substituent is a hydroxyl group, a carboxyl group, a hydroxyalkyl group having 1 to 4 carbon atoms, or an alkoxyl having 1 to 4 carbon atoms. A cyano group; a cyanoalkyl group having 2 to 5 carbon atoms; an alkoxycarbonyl group; and an alkoxycarbonylalkoxy group.
(A) In the compound, R in the above formula (3) ₁ And R ₂ The positive-type radiation-sensitive resin composition according to claim 1, wherein are linked together to form a saturated or unsaturated nitrogen-containing heterocycle having 2 to 20 carbon atoms. (A) In the compound, R in the above formula (3) ₁ And R ₂ The positive-type radiation-sensitive resin composition according to claim 2, which are connected to each other to form a saturated or unsaturated nitrogen-containing heterocyclic ring having 2 to 20 carbon atoms.