JP5235250B2 - 分光モジュール - Google Patents
分光モジュール Download PDFInfo
- Publication number
- JP5235250B2 JP5235250B2 JP2013030219A JP2013030219A JP5235250B2 JP 5235250 B2 JP5235250 B2 JP 5235250B2 JP 2013030219 A JP2013030219 A JP 2013030219A JP 2013030219 A JP2013030219 A JP 2013030219A JP 5235250 B2 JP5235250 B2 JP 5235250B2
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- JP
- Japan
- Prior art keywords
- light
- side portion
- spectroscopic
- substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 75
- 238000001514 detection method Methods 0.000 claims description 47
- 239000010410 layer Substances 0.000 description 42
- 239000004065 semiconductor Substances 0.000 description 26
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 18
- 239000000463 material Substances 0.000 description 13
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- 230000031700 light absorption Effects 0.000 description 11
- 230000003595 spectral effect Effects 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 239000003513 alkali Substances 0.000 description 9
- 238000001312 dry etching Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- 229910018885 Pt—Au Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000820 replica moulding Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Description
[第1の実施形態]
[第2の実施形態]
Claims (1)
- 入射した光を分光すると共に反射する分光部と、前記分光部によって分光された光を検出する光検出素子と、を備える分光モジュールであって、
前記光検出素子は、前記分光部に進行する光が通過する光通過孔が形成された基板部を有し、
前記光通過孔は、前記基板部の一方の主面に光入射開口を画定する光入射側部、及び前記基板部の他方の主面に光出射開口を画定する光出射側部を含み、
前記光入射側部は、前記一方の主面と略平行な底面を有し且つ前記他方の主面に向かって先細りとなるように形成され、
前記光出射側部は、前記他方の主面と略垂直な側面を有し且つ前記底面と対向するように形成され、
前記光入射側部の側面には、遮光層が形成されていることを特徴とする分光モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013030219A JP5235250B2 (ja) | 2008-05-15 | 2013-02-19 | 分光モジュール |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008128687 | 2008-05-15 | ||
JP2008128687 | 2008-05-15 | ||
JP2013030219A JP5235250B2 (ja) | 2008-05-15 | 2013-02-19 | 分光モジュール |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008311087A Division JP5207938B2 (ja) | 2008-05-15 | 2008-12-05 | 分光モジュール及び分光モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013092541A JP2013092541A (ja) | 2013-05-16 |
JP5235250B2 true JP5235250B2 (ja) | 2013-07-10 |
Family
ID=47789029
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012248741A Active JP5162049B2 (ja) | 2008-05-15 | 2012-11-12 | 分光モジュール及び分光モジュールの製造方法 |
JP2013030219A Active JP5235250B2 (ja) | 2008-05-15 | 2013-02-19 | 分光モジュール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012248741A Active JP5162049B2 (ja) | 2008-05-15 | 2012-11-12 | 分光モジュール及び分光モジュールの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP5162049B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015106106A (ja) | 2013-12-02 | 2015-06-08 | セイコーエプソン株式会社 | 電子デバイスおよび電子機器 |
FR3035716B1 (fr) * | 2015-04-30 | 2019-06-21 | Biomerieux | Machine et procede pour la detection automatisee in vitro d'analytes mettant en oeuvre une decomposition spectrale chromatique d'une reponse optique |
JP7388815B2 (ja) | 2018-10-31 | 2023-11-29 | 浜松ホトニクス株式会社 | 分光ユニット及び分光モジュール |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06167637A (ja) * | 1992-11-30 | 1994-06-14 | Hitachi Ltd | 多芯光コネクタ |
DE69712115T2 (de) * | 1997-11-28 | 2002-09-26 | Hamamatsu Photonics Kk | Festkörperbildaufnahmevorrichtung für analysevorrichtung |
JP2003139611A (ja) * | 2001-11-06 | 2003-05-14 | Olympus Optical Co Ltd | 分光光度計 |
JP4409860B2 (ja) * | 2003-05-28 | 2010-02-03 | 浜松ホトニクス株式会社 | 光検出器を用いた分光器 |
EP2063239A4 (en) * | 2007-06-08 | 2013-12-25 | Hamamatsu Photonics Kk | SPECTROSCOPIC MODULE |
-
2012
- 2012-11-12 JP JP2012248741A patent/JP5162049B2/ja active Active
-
2013
- 2013-02-19 JP JP2013030219A patent/JP5235250B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013092541A (ja) | 2013-05-16 |
JP2013033067A (ja) | 2013-02-14 |
JP5162049B2 (ja) | 2013-03-13 |
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