JP5210313B2 - イオン注入装置のターミナル構造 - Google Patents
イオン注入装置のターミナル構造 Download PDFInfo
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- JP5210313B2 JP5210313B2 JP2009530552A JP2009530552A JP5210313B2 JP 5210313 B2 JP5210313 B2 JP 5210313B2 JP 2009530552 A JP2009530552 A JP 2009530552A JP 2009530552 A JP2009530552 A JP 2009530552A JP 5210313 B2 JP5210313 B2 JP 5210313B2
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- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
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- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/16—Vessels; Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/026—Shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/038—Insulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Insulators (AREA)
- Gas-Insulated Switchgears (AREA)
- Particle Accelerators (AREA)
- Insulating Bodies (AREA)
Description
Claims (25)
- イオンビームを供給するように構成したイオン源と、
キャビティを画成し、該キャビティ内に前記イオン源が少なくとも部分的に配置されるターミナル構造と、
前記ターミナル構造の周りの電界を変えるように前記ターミナル構造の外部に隣接して配置される絶縁導体であって、該絶縁導体の導体の周りに配置される絶縁体の絶縁耐力が、75キロボルト(kV)/インチよりも大きい、絶縁導体と、
前記絶縁体の中に配置される複数のグレーディング導体であって、これら複数のグレーディング導体の各々は、前記ターミナル構造の前記外部からそれぞれ放射状に前記導体から異なる距離のところに配置され、前記複数のグレーディング導体の各々は、弓形形状を有している、複数のグレーディング導体と、
を備えているイオン注入装置。 - 前記導体は、第1の電圧に付勢すべく構成され、前記ターミナル構造も前記第1の電圧に付勢すべく構成される、請求項1に記載のイオン注入装置。
- 前記第1の電圧は、少なくとも400kVである、請求項2に記載のイオン注入装置。
- 前記ターミナル構造及び前記絶縁導体に結合されたブラケットをさらに備え、該ブラケットは、前記ターミナル構造の外部に隣接する前記絶縁導体を支持するように構成される、請求項1に記載のイオン注入装置。
- 前記ブラケットは、前記絶縁導体を前記ターミナル構造の外部から所定距離のところに位置させることができる長さを有する、請求項4に記載のイオン注入装置。
- 前記距離は少なくとも1.5インチである、請求項5に記載のイオン注入装置。
- 前記ブラケットは導電性の材料から成り、該ブラケットは、前記絶縁導体の前記導体に結合される、請求項4に記載のイオン注入装置。
- 前記ブラケットは非導電性の材料から成る、請求項4に記載のイオン注入装置。
- 前記ターミナル構造の外部は、該ターミナル構造の頂縁の周辺部と、前記ターミナル構造の底縁の周辺部とを備え、前記絶縁導体は、前記頂縁の前記周辺部の周りに配置される頂部絶縁導体と、前記底縁の前記周辺部の周りに配置される底部絶縁導体とを備えている、請求項1に記載のイオン注入装置。
- 前記ターミナル構造の外部はさらに、前記頂縁と前記底縁との間に前記ターミナル構造の周辺部を備え、前記絶縁導体はさらに、前記頂縁と前記底縁との間の、前記ターミナル構造の前記周辺部の周りに配置される中間の絶縁導体も備えている、請求項9に記載のイオン注入装置。
- 前記絶縁体は固体絶縁物から成る、請求項1に記載のイオン注入装置。
- 前記複数のグレーディング導体の各々は、異なる弓状の長さを有する、請求項1に記載のイオン注入装置。
- 前記複数のグレーディング導体の各々は、同じ弓状の長さを有する、請求項1に記載のイオン注入装置。
- 前記複数のグレーディング導体の各々は弓状の長さを有し、前記導体から、前記各グレーディング導体の、前記弓状の長さの中心までの放射状の直線が、互いに異なる角度である、請求項1に記載のイオン注入装置。
- 前記複数のグレーディング導体の各々は電気的に浮動している、請求項1に記載のイオン注入装置。
- 前記複数のグレーディング導体は、前記絶縁導体の導体から第1の距離のところに放射状に配置される第1のグレーディング導体と、前記絶縁導体の導体から第2の距離のところに放射状に配置される第2のグレーディング導体と、前記絶縁導体の導体から第3の距離のところに放射状に配置される第3のグレーディング導体とを備え、前記第1の距離は前記第2の距離よりも短く、前記第2の距離は前記第3の距離よりも短く、前記第1のグレーディング導体は、第1のグレーディング電圧を受電すべく構成され、前記第2のグレーディング導体は第2のグレーディング電圧を受電すべく構成され、前記第3のグレーディング導体は第3のグレーディング電圧を受電すべく構成され、前記第1のグレーディング電圧は前記第2のグレーディング電圧よりも大きく、前記第2のグレーディング電圧は前記第3のグレーディング電圧よりも大きい、請求項1に記載のイオン注入装置。
- 前記ターミナル構造の前記外部は前記ターミナル構造の縁部から成り、前記絶縁導体は、前記縁部の周りに配置される少なくとも第1、第2、及び第3の絶縁導体を備えている、請求項1に記載のイオン注入装置。
- 前記第1、第2、及び第3の絶縁導体は、前記ターミナル構造の前記縁部から外側に延在する線形アレイにて位置付けられる、請求項17に記載のイオン注入装置。
- 前記縁部は弓形形状を有し、前記第1、第2、及び第3の絶縁導体は、前記縁部の前記弓形形状に一致する弓形に位置付けられる、請求項17に記載のイオン注入装置。
- 前記絶縁導体の絶縁体は、前記絶縁導体の導体を配置する内側部分を画成する第1の管状部材を備えている、請求項1に記載のイオン注入装置。
- 前記第1の管状部材は、塩素化ポリ塩化ビニル(CPVC)、ポリフッ化ビニリデン(PVDF)、クロロトリフルオロエチレン・エチレン共重合体(ECTFE)、ポリテトラフルオロエチレン(PTFE)、又はポリイミド樹脂から成る、請求項20に記載のイオン注入装置。
- 前記絶縁体はさらに、前記第1の管状部材の内側部分に配置される充填絶縁体も備えている、請求項20に記載のイオン注入装置。
- 前記充填絶縁体は圧縮空気から成る、請求項22に記載のイオン注入装置。
- 前記絶縁体はさらに、第2の管状部材を備え、該第2の管状部材は、前記第1の管状部材の前記内側部分に配置される、請求項20に記載のイオン注入装置。
- 前記絶縁体はさらに、第3の管状部材を備え、該第3の管状部材は、前記第1の管状部材の内側部分に配置され、前記第2の管状部材は、前記第3の管状部材によって画成される内側部分に配置される、請求項24に記載のイオン注入装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/527,842 US7675046B2 (en) | 2006-09-27 | 2006-09-27 | Terminal structure of an ion implanter |
US11/527,842 | 2006-09-27 | ||
PCT/US2007/079371 WO2008039745A2 (en) | 2006-09-27 | 2007-09-25 | Terminal structure of an ion implanter |
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JP2010505237A JP2010505237A (ja) | 2010-02-18 |
JP5210313B2 true JP5210313B2 (ja) | 2013-06-12 |
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JP2009530552A Active JP5210313B2 (ja) | 2006-09-27 | 2007-09-25 | イオン注入装置のターミナル構造 |
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US (2) | US7675046B2 (ja) |
JP (1) | JP5210313B2 (ja) |
KR (1) | KR101365099B1 (ja) |
CN (1) | CN101563749B (ja) |
TW (1) | TWI431671B (ja) |
WO (1) | WO2008039745A2 (ja) |
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US20090057573A1 (en) * | 2007-08-29 | 2009-03-05 | Varian Semiconductor Equipment Associates, Inc. | Techniques for terminal insulation in an ion implanter |
US7999239B2 (en) * | 2007-12-10 | 2011-08-16 | Varian Semiconductor Equipment Associates, Inc. | Techniques for reducing an electrical stress in an acceleration/deceleraion system |
US20100316904A1 (en) * | 2009-06-11 | 2010-12-16 | Gui Ping Zhang | Self flame-retardant lithium ion battery and case thereof made of plastic with helogens |
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US9212785B2 (en) * | 2012-10-11 | 2015-12-15 | Varian Semiconductor Equipment Associates, Inc. | Passive isolation assembly and gas transport system |
CN103928281B (zh) * | 2013-12-16 | 2017-08-25 | 宁波瑞曼特新材料有限公司 | 高压加速器的高压舱结构 |
US10847339B2 (en) | 2018-01-22 | 2020-11-24 | Axcelis Technologies, Inc. | Hydrogen generator for an ion implanter |
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-
2006
- 2006-09-27 US US11/527,842 patent/US7675046B2/en active Active
-
2007
- 2007-09-25 KR KR1020097007921A patent/KR101365099B1/ko active IP Right Grant
- 2007-09-25 WO PCT/US2007/079371 patent/WO2008039745A2/en active Application Filing
- 2007-09-25 CN CN2007800431937A patent/CN101563749B/zh active Active
- 2007-09-25 JP JP2009530552A patent/JP5210313B2/ja active Active
- 2007-09-27 TW TW096135914A patent/TWI431671B/zh active
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2010
- 2010-03-02 US US12/715,735 patent/US20110056746A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20080073578A1 (en) | 2008-03-27 |
KR101365099B1 (ko) | 2014-02-19 |
CN101563749A (zh) | 2009-10-21 |
WO2008039745A3 (en) | 2008-06-26 |
CN101563749B (zh) | 2012-09-26 |
US7675046B2 (en) | 2010-03-09 |
KR20090074770A (ko) | 2009-07-07 |
US20110056746A1 (en) | 2011-03-10 |
TWI431671B (zh) | 2014-03-21 |
WO2008039745A2 (en) | 2008-04-03 |
TW200816285A (en) | 2008-04-01 |
JP2010505237A (ja) | 2010-02-18 |
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