JP5207800B2 - Deposition method - Google Patents

Description

  The present invention relates to a film forming method, and more particularly to a method for forming a film having a large area.

Conventionally, as a general functional film forming technique, film formation using plasma such as sputtering film formation,
Techniques such as spray coating, ink jet coating, printing, chemical resin coating and chemical formation by heating are widely used. For example, a stacked solar cell or the like is also manufactured by a film forming method such as plasma CVD (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2005-86101

  However, in the conventional technique as described above, the area of the functional film that can be manufactured is limited depending on the size of the apparatus for forming the film. That is, when a thin film is formed by spray coating, ink jet coating, printing, or the like, the functional film forming area is limited depending on the movable range of the apparatus and the working place. In addition, as the area of the functional film increases, there is a problem that manufacturing facilities and factories become enormous and costs increase.

  Further, when a plurality of films of the same kind are formed and the plurality of films are connected thereafter, the same kind of films are repeatedly formed and individually mounted, resulting in a significant increase in cost and manufacturing time. That is, the area and type of film that can be formed at one time are limited. To give a specific example, in solar cells, an increase in area is being promoted, and an increase in the area of a functional film having a PN junction is desired. Due to the increase in size, the manufacturing cost increases as the area increases.

  The present invention has been made in view of the above, and an object thereof is to obtain a film forming method capable of forming a functional film having a large area at a low cost.

To solve the above problems and to achieve the object, the film forming method according to the present invention includes a first step of forming a first functional layer, Oite the said first functional film layer a second step of forming a sacrificial layer on the second region excluding the first region on the one end portion of the first functional layer, the first region definitive in the first functional film layer the third step and the first from the first functional film layer over onto the sacrificial layer to form a connection layer for connecting the first functional layer and the second functional layer A fourth step of forming the second functional film layer made of the same material as the functional film layer, and removing the sacrificial layer to planarize the first functional film layer and the second functional film layer. The first functional film layer and the second functional film layer are connected to each other by the connection layer so that a larger area than the first functional film layer is obtained. One and a fifth step of a large area functional film, characterized in that it comprises a.

  According to this invention, the first functional film layer and the second functional film layer are laminated with the sacrificial layer sandwiched therebetween, and the first functional film layer and the second functional film layer are formed by the connection layer. Since the sacrificial film is removed after the connected multilayer structure is formed, there is an effect that a functional film having a large area that cannot be formed by two-dimensional film formation can be formed at low cost. In addition, there is an effect that it is possible to reduce the manufacturing facility and manufacturing space of the functional film, save energy, reduce costs, and shorten manufacturing time.

  Embodiments of a film forming method according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

  In the present invention, for example, a sacrificial layer B (for example, a photoresist) is further applied on a functional film A (for example, a sheet-like film on which nanosilicon is deposited) formed on a base for forming a functional film, and the function is again performed. Film A is formed. At this time, the sacrificial layer B is not applied on the entire surface of the functional film A, but a region (margin) that is not applied on the functional film A is provided.

  Next, the functional film A is applied again on the sacrifice layer B and the margin. In this case, the functional film A applied first and the functional film A formed a second time can be connected via the margin. By repeating such steps, a laminated structure of “functional film A−sacrificial layer B−functional film A−sacrificial layer B−functional film A−sacrificial layer B...” Is formed. It becomes continuous through the margin.

  Next, when the sacrificial layer B (for example, photoresist) is dissolved with a solvent (for example, acetone or isopropyl alcohol (IPA)), the continuous functional film A is completed. According to such a film formation method, it is possible to finally obtain a functional film A having an area proportional to the number of functional film A formations. Also, functional films C and D different from the functional film A may be formed in an arbitrary layer. In this case, a tapestry-like large area functional film is formed. Hereinafter, the embodiment will be described in detail.

Embodiment 1 FIG.
FIG. 1 is a plan view showing an example of a large area functional film manufactured by applying the film forming method according to the first embodiment of the present invention. The large area functional film shown in FIG. 1 is a film (connection functional film) in which three unit functional films A having a reference area S are connected. That is, the large area functional film shown in FIG. 1 is formed by connecting three unit functional films A, which will be described later, a functional film A1, a functional film A4, and a functional film A7, and is approximately three times the reference area S. Having an area of Here, the reference area S is an area where a coating material can be applied to the functional film forming table 10 as a supporting substrate at a time during manufacturing as described later, and the unit functional film A is a function formed by a single application. The film A has a reference area S.

  In this large area functional film, the functional film A1 and the functional film A4 are connected via the connection layer 3, and the functional film A4 and the functional film A7 are connected via the connection layer 6. Thus, a large-area functional film is realized in which all the functional films A of the functional film A1, the functional film A4, and the functional film A7 are connected. Here, in the first embodiment, the connection layer 3 and the connection layer 6 are made of the functional film A.

  Next, a manufacturing method of the large area functional film according to the first embodiment configured as described above will be described. FIG. 2 is an intermediate in the production of the large area functional film according to the first embodiment, and the structure of the multilayer structure manufactured by spray coating by applying the film forming method according to the first embodiment of the present invention. It is a schematic diagram which shows a manufacturing method. FIGS. 3-1 to 3-5 are diagrams for explaining the method for producing the large area functional film according to the first embodiment, and are top views for explaining the method for producing the multilayer structure shown in FIG. It is.

  The multilayer structure shown in FIG. 2 has a functional film A1 as a first layer, a sacrificial layer B2 and a connection layer 3 as a second layer, and a functional film as a third layer on a functional film forming base 10 as a base. A4 includes a sacrificial layer B5 and a connection layer 6 as a fourth layer, and a functional film A7 as a fifth layer. Here, the connection layer 3 connects the functional film A1 and the functional film A4. The connection layer 6 connects the functional film A4 and the functional film A7. Thereby, all the functional films A of the first-layer functional film A1, the third-layer functional film A4, and the fifth-layer functional film A7 are connected.

  In order to produce the large area functional film according to the first embodiment, first, this multilayer structure is produced. First, the nanoparticles are spray-applied from the spray application nozzle 8 onto the functional film forming table 10 in a spray form. Then, the application particles 9 such as nanoparticles applied in a spray form by spray application are deposited and bonded on the surface of the functional film forming table 10, and the first layer of the multilayer structure is shown in FIG. As a result, the functional film A1 is formed. In the present embodiment, silicon (Si) nanoparticles are spray-coated as nanoparticles to form the functional film A1. The functional film forming platform 10 is one in which the functional film A1 is bonded to the entire surface or a part thereof by van der Waals force or the like. As such a functional film forming table 10, for example, a glass substrate, a silicon substrate, a resin substrate, or the like can be used.

  Further, depending on the coating material to be applied by spraying, it may be better to heat in order to uniformly diffuse the spray material. Therefore, the spraying may be performed while heating as necessary. Here, if the heating is performed up to about 120 ° C., the properties of the sacrificial layer B2 using the photoresist are less affected as will be described later, so that it can be dissolved well.

  Next, a photoresist is applied by spray coating on the functional film forming table 10 on which the functional film A1 is formed, and as a second layer of the multilayer structure on the functional film A1 as shown in FIG. 3-2. A sacrificial layer B2 is formed. Here, the sacrificial layer B2 is applied except for the formation region of the connection layer 3, which is a partial region on the functional film A1. In FIG. 3B, the right end region of the functional film A <b> 1 is a region where the connection layer 3 is formed.

  Next, silicon (Si) nanoparticles are applied by spray coating on the functional film forming platform 10 on which the sacrificial layer B2 is formed, and the functional film A4 is formed on the sacrificial layer B2 as the third layer of the multilayer structure. Form. At this time, silicon (Si) nanoparticles are also applied to a region where the sacrificial layer B2 is not formed in the second layer (a region where the connection layer 3 is formed). As a result, the second connection layer 3 is formed on the right end region on the first functional film A1 as shown in FIG. 3-3, and the connection layer 3 and the second layer are formed. A third functional film A4 of the multilayer structure is formed on the sacrificial layer B2. Here, the functional film A1 of the first layer and the functional film A4 of the third layer are connected via the connection layer 3 of the second layer that is a connection layer.

  Next, a photoresist is applied by spray coating on the functional film forming table 10 on which the functional film A4 is formed, and as a fourth layer of the multilayer structure on the functional film A4 as shown in FIG. 3-4. A sacrificial layer B5 is formed. Here, the sacrificial layer B5 is applied except for the formation region of the connection layer 6 which is a partial region on the functional film A4. In FIG. 3-4, the left end region of the functional film A1 is a region where the connection layer 6 is formed.

  Next, silicon (Si) nanoparticles are applied by spray coating on the functional film forming platform 10 on which the sacrificial layer B5 is formed, and the functional film A7 is formed on the sacrificial layer B5 as the fifth layer of the multilayer structure. Form. At this time, silicon (Si) nanoparticles are also applied to a region where the sacrificial layer B5 is not formed in the fourth layer (a region where the connection layer 6 is formed). As a result, as shown in FIG. 3-5, the fourth connection layer 6 is formed on the left end region on the third functional film A4, and the connection layer 6 and the fourth layer are formed. On the sacrificial layer B5, the fifth-layer functional film A7 of the multilayer structure is formed. Here, the functional film A4 of the third layer and the functional film A7 of the fifth layer are connected via the fourth connection layer 6 which is a connection layer. As described above, a multilayer structure in which the functional films A and the sacrificial layers B are alternately stacked as shown in FIG. 1 is obtained.

  As described above, the first functional film A1 and the third functional film A4 are connected via the second connection layer 3, and the third functional film A4 is connected to the third functional film A4. Since the fifth-layer functional film A7 is connected via the fourth-layer connecting layer 6, the first-layer functional film A1, the third-layer functional film A4, and the fifth-layer function film All the functional films A are connected to the film A7.

  In the above description, a method for manufacturing a five-layered multilayer structure in which the functional films A and the sacrificial layers B are alternately stacked has been described. However, when a multilayered multilayer structure is further manufactured, as described above. This process is repeated an arbitrary number of times for the area of the desired functional film.

  Next, the sacrificial layer B is removed from the multilayer structure thus manufactured. FIG. 4 is a diagram for explaining the manufacturing method of the large area functional film according to the first embodiment, and a process of removing each sacrificial layer B (sacrificial layer B2, sacrificial layer B5) from the multilayer structure of FIG. It is sectional drawing for demonstrating. The sacrificial layer B is removed by immersing the multilayer structure in a container 12 filled with a resin removing solution 11 (acetone or the like) used for the sacrificial layer B, so that each sacrificial layer B (sacrificial layer B2, sacrificial layer B5) is immersed. It is performed by dissolving in the removal solution 11. The removal solution 11 can be regenerated by collecting and separating.

  When each sacrificial layer B (sacrificial layer B2, sacrificial layer B5) is dissolved in the removal solution 11, the functional film A develops in the removal solution 11 by gravity in the container 12 as shown in FIG. The connection with the functional film A4 is maintained by the connection layer 3, and the connection between the functional film A4 and the functional film A7 is maintained by the connection layer 6. For this reason, after each sacrificial layer B (sacrificial layer B2, sacrificial layer B5) is dissolved in the removing solution 11, the functional film A1, the functional film A4, and the functional film A7 finally become one functional film A.

  Thereafter, the functional film forming platform 10 is pulled up, and the functional film A is washed or dried to obtain the large area functional film A. The functional film forming platform 10 serves as a functional film support. Thereby, a functional film A having a large area as shown in FIG. 1 can be obtained. The large area functional film A may be held in an expanded state as shown in FIG.

  Assuming that the area (reference area) of the unit functional film A that can be applied to the functional film forming base 10 at once is S, the functional film A is n times (n is an integer of 2 or more), and the sacrificial layer B is (n-1) If the coating is applied alternately, the area of the functional film A finally obtained is about n × S. Thereby, it is possible to form a functional film A having a large area that cannot be formed by a single application.

  For example, when n = 2, the functional film A is applied twice and the sacrificial film B is applied once alternately. In this case, the area of the functional film A to be obtained is 2 × S, and a functional film having an area approximately twice that of a normal film can be obtained. For example, when n = 3, the functional film A is applied alternately three times and the sacrificial film B is applied twice. In this case, the area of the functional film A to be obtained is 3 × S, and a functional film having an area approximately three times that of a normal film can be obtained. For example, when n = 4, the functional film A is applied alternately four times and the sacrificial film B is applied three times. In this case, the area of the functional film A to be obtained is 4 × S, and a functional film having an area about four times the normal area can be obtained.

  As described above, according to the film forming method according to the present embodiment, the multilayer structure in which the functional films A and the sacrificial layers B are alternately stacked so that the plurality of unit functional films A are connected by the connection layers. After the production, the sacrificial layer B is removed, so that it is possible to form a functional film A having a large area that cannot be formed by two-dimensional film formation by one application. Moreover, the functional film A having a large area can be manufactured by an apparatus capable of producing the reference area S of the unit functional film A, and the manufacturing facility can be reduced and the manufacturing space can be saved.

  Therefore, according to the film forming method according to the present embodiment, in the production of a large area functional film, the functional film production equipment and the production space can be reduced, energy saving, cost reduction and production time can be reduced. Is possible. Also, compared with a manufacturing method in which a plurality of functional films A are manufactured by dividing the functional film A and then the plurality of functional films A are connected, the mounting cost is significantly reduced, and the cost can be reduced.

  In the above-described film forming method, the method of spray-coating nanoparticles in a spray form has been described as an example. However, other methods may be used as long as the functional film can be continuously formed. For example, the nanoparticles may be deposited by sputtering, vapor deposition, or chemical vapor deposition. Also, the photoresist coating is not limited to spray coating, and a technique generally used in the semiconductor industry such as a spin coating method can be employed.

Embodiment 2. FIG.
FIG. 5 is a modification of the first embodiment, and is a plan view showing a large area functional film manufactured by the film forming method according to the second embodiment. The large area functional film shown in FIG. 5 is formed by connecting three unit functional films A having a reference area S. That is, the large area functional film shown in FIG. 5 is formed by connecting three unit functional films A of the functional film A1, the functional film A4, and the functional film A7, and has an area approximately three times the reference area S. Have

  In this large area functional film, the functional film A1 and the functional film A4 are connected via the connection layer 3, and the functional film A4 and the functional film A7 are connected via the connection layer 6. Thus, a large-area functional film is realized in which all the functional films A of the functional film A1, the functional film A4, and the functional film A7 are connected. Here, in the second embodiment, the connection layer 3 and the connection layer 6 are made of the functional film A.

  The large-area functional film shown in FIG. 1 has a rectangular shape with three unit functional films A connected in the same direction, but the large-area functional film A shown in FIG. The functional film A is connected in different directions to form an L shape.

  Next, a method for producing a large area functional film according to the second embodiment configured as described above will be described. FIG. 6 is a cross-sectional view showing the structure of a multilayer structure produced by spray coating, which is an intermediate during the production of the large area functional film according to the second embodiment. FIG. 7 is a cross-sectional view of the multilayer structure shown in FIG. 6 as viewed from the right direction in the drawing. FIGS. 8-1 to 8-5 are diagrams for explaining the method for producing the large area functional film according to the second embodiment, and for explaining the method for producing the multilayer structure shown in FIGS. 6 and 7. FIG.

  The multilayer structure shown in FIGS. 6 and 7 has a functional film A1 as a first layer, a sacrificial layer B2 and a connection layer 3 as a second layer, and a third layer on a functional film forming base 10 as a base. As a fourth layer, a sacrificial layer B5 and a connection layer 6 as a fourth layer, and a functional film A7 as a fifth layer. Here, the connection layer 3 connects the functional film A1 and the functional film A4. The connection layer 6 connects the functional film A4 and the functional film A7. Thereby, all the functional films A of the first-layer functional film A1, the third-layer functional film A4, and the fifth-layer functional film A7 are connected.

  In order to produce the large area functional film according to the second embodiment, first, this multilayer structure is produced. First, the nanoparticles are spray-applied from the spray application nozzle 8 onto the functional film forming table 10 in a spray form. Then, the application particles 9 such as nanoparticles applied in a spray form by spray application are deposited and bonded on the surface of the functional film forming table 10, and the first layer of the multilayer structure is shown in FIG. As a result, the functional film A1 is formed. In the present embodiment, silicon (Si) nanoparticles are spray-coated as nanoparticles to form the functional film A1.

  Next, a photoresist is applied by spray coating on the functional film forming table 10 on which the functional film A1 is formed, and as a second layer of the multilayer structure on the functional film A1 as shown in FIG. 8-2. A sacrificial layer B2 is formed. Here, the sacrificial layer B2 is applied except for the formation region of the connection layer 3, which is a partial region on the functional film A1. In FIG. 8B, the upper end region of the functional film A1 is a region where the connection layer 3 is formed.

  Next, silicon (Si) nanoparticles are applied by spray coating on the functional film forming platform 10 on which the sacrificial layer B2 is formed, and the functional film A4 is formed on the sacrificial layer B2 as the third layer of the multilayer structure. Form. At this time, silicon (Si) nanoparticles are also applied to a region where the sacrificial layer B2 is not formed in the second layer (a region where the connection layer 3 is formed). As a result, as shown in FIG. 8C, the second connection layer 3 is formed on the upper end region on the first functional film A1, and the connection layer 3 and the second layer are formed. A third functional film A4 of the multilayer structure is formed on the sacrificial layer B2. Here, the functional film A1 of the first layer and the functional film A4 of the third layer are connected via the connection layer 3 of the second layer that is a connection layer.

  Next, a photoresist is applied by spray coating on the functional film forming table 10 on which the functional film A4 is formed, and as a fourth layer of the multilayer structure on the functional film A4 as shown in FIG. 8-4. A sacrificial layer B5 is formed. Here, the sacrificial layer B5 is applied except for the formation region of the connection layer 6 which is a partial region on the functional film A4. In FIG. 8-4, the left end region of the functional film A <b> 1 extending in a direction substantially perpendicular to the connection layer 3 is a region where the connection layer 6 is formed.

  Next, silicon (Si) nanoparticles are applied by spray coating on the functional film forming platform 10 on which the sacrificial layer B5 is formed, and the functional film A7 is formed on the sacrificial layer B5 as the fifth layer of the multilayer structure. Form. At this time, silicon (Si) nanoparticles are also applied to a region where the sacrificial layer B5 is not formed in the fourth layer (a region where the connection layer 6 is formed). As a result, as shown in FIG. 8-5, the fourth connection layer 6 is formed on the left end region on the third functional film A4, and the connection layer 6 and the fourth layer are formed. On the sacrificial layer B5, the fifth-layer functional film A7 of the multilayer structure is formed. Here, the functional film A4 of the third layer and the functional film A7 of the fifth layer are connected via the fourth connection layer 6 which is a connection layer. As described above, a multilayer structure in which the functional films A and the sacrificial layers B as shown in FIGS. 6 and 7 are alternately laminated is obtained.

  As described above, the first functional film A1 and the third functional film A4 are connected via the second connection layer 3, and the third functional film A4 is connected to the third functional film A4. Since the fifth-layer functional film A7 is connected via the fourth-layer connecting layer 6, the first-layer functional film A1, the third-layer functional film A4, and the fifth-layer function film All the functional films A are connected to the film A7.

  Next, as in the case of the first embodiment, the multilayer structure is immersed in a container 12 filled with a removing solution 11 (acetone or the like) such as a resin used for the sacrificial layer B, and each sacrificial layer B (sacrificial layer B2) is immersed. The sacrificial layer B5) is dissolved in the removing solution 11 to remove the sacrificial layer B. Here, the connection between the functional film A1 and the functional film A4 is maintained by the connection layer 3, and the connection between the functional film A4 and the functional film A7 is maintained by the connection layer 6. For this reason, after each sacrificial layer B (sacrificial layer B2, sacrificial layer B5) is dissolved in the removing solution 11, the functional film A1, the functional film A4, and the functional film A7 finally become one functional film A. Thereafter, the functional film A is washed or dried to obtain a large area functional film A. Thereby, a functional film A having a large area as shown in FIG. 5 can be obtained.

  As described above, according to the film forming method according to the present embodiment, the multilayer structure in which the functional films A and the sacrificial layers B are alternately stacked so that the plurality of unit functional films A are connected by the connection layers. After the production, the sacrificial layer B is removed, so that it is possible to form a functional film A having a large area that cannot be formed by two-dimensional film formation by one application.

  Moreover, the functional film A having a large area can be manufactured by an apparatus capable of manufacturing the reference area S, and the manufacturing facility can be reduced and the manufacturing space can be saved. Further, according to the film forming method according to the present embodiment, by changing the formation position of the connection layer on the functional film A, the connection direction between the functional film A and the other functional film A is controlled, The shape of the functional film A having the area can be controlled, and the large-area functional film A continuous in a free shape can be manufactured on the two-dimensional plane.

  Therefore, according to the film forming method according to the present embodiment, in the production of a large area functional film, the functional film production equipment and the production space can be reduced, energy saving, cost reduction and production time can be reduced. Is possible. Also, compared with a manufacturing method in which a plurality of functional films A are manufactured by dividing the functional film A and then the plurality of functional films A are connected, the mounting cost is significantly reduced, and the cost can be reduced.

Embodiment 3 FIG.
FIG. 9 is a plan view showing an example of a large-area functional film that is a modification of the first embodiment and is manufactured by applying the film forming method according to the third embodiment. FIG. 10 is a cross-sectional view showing the structure of a multilayer structure produced by spray coating, which is an intermediate during the production of the large area functional film according to the third embodiment. The large area functional film shown in FIG. 9 is formed by connecting a unit functional film A having a reference area S, a unit functional film C having a reference area S, and a unit functional film D having a reference area S. is there. That is, the large area functional film shown in FIG. 9 is a large area heterogeneous functional film in which three different types of unit functional films of the functional film A1, the functional film C13, and the functional film D14 are connected. About 3 times as large as The functional film C and the functional film D are different types of functional films from the functional film A, respectively.

  In this large-area functional film, the functional film A1 and the functional film C13 are connected via the connection layer 3, and the functional film C13 and the functional film D14 are connected via the connection layer 6. As a result, a large-area functional film in which different types of functional films of the functional film A1, the functional film A4, and the functional film D14 are connected is realized. Here, in the third embodiment, the connection layer 3 and the connection layer 6 are made of the functional film A.

  In the large-area functional film according to the third embodiment configured as described above, the coating material for the functional film C is applied by spray coating on the functional film forming base 10 on which the sacrificial layer B2 is formed, and the sacrificial layer B5. It can be manufactured in the same manner as in the first embodiment except that the coating material for the functional film D is applied by spray coating on the functional film forming platform 10 on which is formed.

  As described above, according to the film forming method of the present embodiment, the functional film A, the functional film C, and the unit functional film A, the unit functional film C, and the unit functional film D are connected by the connection layer. Different types of functions that cannot be formed by two-dimensional film forming by one application by removing the sacrificial layer B after producing a multilayer structure in which the functional film D is laminated in order with the sacrificial layer B interposed therebetween. It is possible to form a large-area functional film in which the film is arranged at an arbitrary position.

  Further, a functional film having a large area can be manufactured by an apparatus capable of producing the reference area S, and the manufacturing equipment can be reduced and the manufacturing space can be saved. In addition, according to the film forming method according to the present embodiment, a large-area functional film in which different types of functional films are continuously formed in a free shape on the two-dimensional plane as in the second embodiment can be manufactured. Is possible.

  Therefore, according to the film forming method according to the present embodiment, in the manufacture of a large-area functional film in which different types of functional films are arranged at arbitrary positions, the functional film manufacturing equipment and the manufacturing space can be reduced and the energy can be saved. Therefore, it is possible to reduce costs and shorten manufacturing time. Also, compared with a manufacturing method in which a plurality of functional films A are manufactured by dividing the functional film A and then the plurality of functional films A are connected, the mounting cost is significantly reduced, and the cost can be reduced.

Embodiment 4 FIG.
FIG. 11 is a plan view showing an example of a large area functional film produced by applying the film forming method according to the fourth embodiment, which is a modification of the first embodiment. The large-area functional film shown in FIG. 11 is formed by connecting a functional film F16 having a reference area S and a functional film G18 having a reference area S, and has an area approximately twice the reference area S. Further, the functional film E15 is bonded to one surface side (the back surface side in FIG. 11) of the functional film F16. A functional film H19 is bonded to one surface side of the functional film G18 (the back surface side in FIG. 11).

  Here, the functional film E15 is a functional film made of P-type Si grains, the functional film F16 is a functional film made of N-type silicon (Si) particles, and the functional film F16 and the functional film E15 constitute a PN junction. ing. The functional film G18 is a functional film made of N-type silicon (Si) particles, and the functional film H19 is a functional film made of P-type silicon (Si) particles. The functional film G18 and the functional film H19 form a PN junction. It is configured. By using such a large-area functional film shown in FIG. 11, a large-area PN junction solar battery cell can be formed.

  Next, a method for producing a large area functional film according to the fourth embodiment configured as described above will be described. FIG. 12 is a cross-sectional view showing the structure of a multilayer structure produced by spray coating, which is an intermediate during production of the large area functional film according to the fourth embodiment. FIGS. 13-1 to 13-5 are diagrams for explaining the method for producing the large area functional film according to the fourth embodiment, and are top views for explaining the method for producing the multilayer structure shown in FIG. It is.

  The multilayer structure shown in FIG. 12 has a functional film E15 as a first layer, a functional film F16 as a second layer, a sacrificial layer B2 and a connection layer 17 as a third layer on a functional film forming base 10 as a base. However, the functional film G18 is laminated as the fourth layer, and the functional film H19 is laminated as the fifth layer. Here, the connection layer 17 connects the functional film F16 and the functional film G18.

  In order to produce a large-area functional film according to the fourth embodiment, first, this multilayer structure is produced. First, P-type silicon (Si) particles are spray-coated on the functional film forming table 10 from the spray coating nozzle 8 in a spray form. Then, P-type silicon (Si) particles applied in a spray form by spray coating are deposited and bonded on the surface of the functional film forming table 10, and the first layer of the multilayer structure as shown in FIG. As a result, the functional film E15 is formed.

  Next, N-type silicon (Si) particles are spray-coated on the functional film forming table 10 on which the functional film E15 is formed in a spray form. Then, N-type silicon (Si) particles applied in a spray form by spray application are deposited and bonded on the surface of the functional film E15, and the functional film is used as the second layer of the multilayer structure as shown in FIG. 13-2. F16 is formed.

  Next, a photoresist is applied by spray coating on the functional film forming base 10 on which the functional film F16 is formed, and as a third layer of the multilayer structure on the functional film F16 as shown in FIG. A sacrificial layer B2 is formed. Here, the sacrificial layer B2 is applied except for the formation region of the connection layer 17 which is a partial region on the functional film F16. In FIG. 13C, the left end region of the functional film F16 is a region where the connection layer 17 is formed.

  Next, N-type silicon (Si) particles are applied by spray coating on the functional film forming platform 10 on which the sacrificial layer B2 is formed, and the functional film G18 is formed as the fourth layer of the multilayer structure on the sacrificial layer B2. Form. At this time, the N-type silicon (Si) particles are also applied to a region where the sacrificial layer B2 is not formed in the third layer (a region where the connection layer 17 is formed). As a result, as shown in FIG. 13-4, the third connection layer 17 is formed on the left end region on the second functional film F16, and the connection layer 17 and the third layer are formed. A fourth functional film G18 of the multilayer structure is formed on the sacrificial layer B2. Here, the second-layer functional film F16 and the fourth-layer functional film G18 are connected via a third-layer connection layer 17 which is a connection layer.

  Next, P-type silicon (Si) particles are applied by spray coating on the functional film forming platform 10 on which the functional film G18 is formed, and the functional film H19 is formed on the functional film G18 as the fifth layer of the multilayer structure. Form. As described above, a multilayer structure in which the functional film E15, the functional film F16, the connection layer 17, the functional film G18, and the functional film H19 are stacked as shown in FIG. 12 is obtained.

  Next, as in the case of the first embodiment, the multilayer structure is immersed in a container 12 filled with a removal solution 11 (acetone or the like) such as a resin used for the sacrificial layer B2, and the sacrificial layer B2 is added to the removal solution 11. The sacrificial layer B2 is removed by dissolving. Here, the connection between the functional film F16 and the functional film G18 is maintained by the connection layer 17. A functional film E15 is bonded to one surface side of the functional film F16, and a functional film H19 is bonded to one surface side of the functional film G18. For this reason, after the sacrificial layer B2 is dissolved in the removal solution 11, the functional film E15, the functional film F16, the functional film G18, and the functional film H19 finally become one functional film. Thereafter, the functional film is washed or dried to obtain a large area functional film. Thereby, a large-area functional film having a PN junction as shown in FIG. 11 can be obtained.

  As described above, according to the film forming method of the present embodiment, it is possible to form a large-area functional film having a PN junction that cannot be formed by a single application. In order to manufacture a large-area solar cell, a very large manufacturing apparatus is required, and the manufacturing factory is enlarged. Moreover, the method of mounting separately produced photovoltaic cells and making a panel with a large area as a whole has a high individual mounting cost.

  However, by using the above-described film forming method, a large-area functional film having a PN junction can be manufactured with an apparatus capable of manufacturing the reference area S, thereby reducing the manufacturing equipment and saving the manufacturing space. Is possible. In addition, according to the film forming method according to the present embodiment, it is possible to manufacture a large-area functional film continuous in a free shape on the two-dimensional plane as in the second embodiment.

  Therefore, according to the film forming method according to the present embodiment, in the manufacture of a large-area functional film having a PN junction, the functional film manufacturing equipment and manufacturing space can be reduced, energy saving, cost reduction, and manufacturing time can be reduced. It becomes possible to shorten. In addition, compared with a manufacturing method in which a plurality of functional films are manufactured by dividing the functional film and then the plurality of functional films are connected, the mounting cost is significantly reduced, and the cost can be reduced.

  As described above, the film forming method according to the present invention is useful when forming a large-area functional film at a low cost.

It is a top view which shows an example of the large area functional film produced by applying the film-forming method concerning Embodiment 1 of this invention. It is a schematic diagram which shows the structure of the multilayer structure which is an intermediate body at the time of manufacture of the large area functional film concerning Embodiment 1 of this invention, and a manufacturing method. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 1 of this invention, and sectional drawing for demonstrating the process of removing each sacrificial layer B from the multilayer structure of FIG. It is a top view which shows an example of the large area functional film produced by applying the film-forming method concerning Embodiment 2 of this invention. It is sectional drawing which shows the structure of the multilayered structure which is an intermediate body at the time of manufacture of the large area functional film concerning Embodiment 2 of this invention. It is sectional drawing which looked at the multilayer structure shown in FIG. 6 from the right direction in the figure. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 2 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. 6 and FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 2 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. 6 and FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 2 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. 6 and FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 2 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. 6 and FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 2 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. 6 and FIG. It is a top view which shows an example of the large area functional film produced by applying the film-forming method concerning Embodiment 3 of this invention. It is sectional drawing which shows the structure of the multilayered structure which is an intermediate body at the time of manufacture of the large area functional film concerning Embodiment 3 of this invention. It is a top view which shows an example of the large area functional film produced by applying the film-forming method concerning Embodiment 4 of this invention. It is sectional drawing which shows the structure of the multilayered structure which is an intermediate body at the time of manufacture of the large area functional film concerning Embodiment 4 of this invention. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 4 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 4 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 4 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 4 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG. It is a figure for demonstrating the manufacturing method of the large area functional film concerning Embodiment 4 of this invention, and is a top view for demonstrating the manufacturing method of the multilayered structure shown in FIG.

Explanation of symbols

1 Functional membrane A
2 Sacrificial layer B
3 Connection layer 4 Functional membrane A
5 Sacrificial layer B
6 Connection layer 7 Functional membrane A
8 Nozzle for spray coating 9 Coating particle 10 Base for functional film formation 11 Removal solution 12 Container 13 Functional film C
14 Functional membrane D
15 Functional membrane E
16 Functional membrane F
17 Connection layer 18 Functional membrane G
19 Functional membrane H

Claims (4)

A first step of forming a first functional film layer;
A second step of forming a sacrificial layer on the second region excluding the first region on the one end portion of Oite the first functional layer to said first functional film layer,
A third step of forming a connection layer for connecting the first functional layer and the second functional layer to said first region definitive in the first functional film layer,
A fourth step of forming the second functional layer made of the same material as the first functional layer over from the first functional film layer on the sacrificial layer,
By removing the sacrificial layer and developing the first functional film layer and the second functional film layer in a plane, the first functional film layer and the second functional film layer are connected to each other. A fifth step of forming one large area functional film having a larger area than the first functional film layer connected by the layers ;
A film forming method comprising : By changing the formation position of the connection layer on the first functional film layer, the connection direction between the first functional film layer and the second functional film layer is controlled to be connected and expanded. Controlling the shape of one large area functional membrane,
The film forming method according to claim 1. A sixth step of forming a third functional film layer having the same material as the first functional film layer but having a different conductivity type before the first step;
Forming a fourth functional film layer having the same material and different conductivity type as the second functional film layer on the second functional film layer between the fourth process and the fifth process; 7 steps,
Forming the first functional film layer on the third functional film layer in the first step;
The film forming method according to claim 1 or 2, characterized in. Said a first functional film layer and the second functional layer, a material are the same, and conductivity is also a functional film is the same,
The film forming method according to claim 1 or 2, characterized in.

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