JP5206598B2 - LED package - Google Patents

LED package Download PDF

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JP5206598B2
JP5206598B2 JP2009147119A JP2009147119A JP5206598B2 JP 5206598 B2 JP5206598 B2 JP 5206598B2 JP 2009147119 A JP2009147119 A JP 2009147119A JP 2009147119 A JP2009147119 A JP 2009147119A JP 5206598 B2 JP5206598 B2 JP 5206598B2
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lead frame
back surface
led package
coating resin
bonding
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JP2011003811A (en
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稔真 林
英樹 國分
幸弘 出向井
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

本発明は、ＬＥＤパッケージの改良に関する。   The present invention relates to improvements in LED packages.

従来、ＬＥＤチップ、ＬＥＤチップが実装されるリードフレーム、ＬＥＤチップとリードフレームを保持する樹脂ケースからなるＬＥＤチップが搭載されるＬＥＤパッケージにおいて、ＬＥＤパッケージの裏面における被覆樹脂部がリードフレームを部分的に被覆して、リードフレームのＬＥＤチップ搭載部の裏面を露出させるものがある。このようなＬＥＤパッケージの例が特許文献１、２に開示される。特許文献１、２に開示のＬＥＤパッケージでは、リードフレームの露出部全域がＬＥＤパッケージの裏面と面一となっている。これにより、ＬＥＤパッケージを実装基板に実装した状態において、リードフレームの露出部と実装基板とがはんだ等の接着剤を介して接することにより、実装基板への熱の伝搬を促して、放熱性が高まる。また、リードフレームの露出部と実装基板とが接着剤で接合されるため、ＬＥＤパッケージの実装強度が高まる。   Conventionally, in an LED package on which an LED chip, a lead frame on which the LED chip is mounted, and an LED package on which an LED chip made of a resin case that holds the LED chip and the lead frame is mounted, the coating resin portion on the back surface of the LED package partially covers the lead frame. And the back surface of the LED chip mounting portion of the lead frame is exposed. Examples of such LED packages are disclosed in Patent Documents 1 and 2. In the LED packages disclosed in Patent Documents 1 and 2, the entire exposed portion of the lead frame is flush with the back surface of the LED package. As a result, in the state where the LED package is mounted on the mounting board, the exposed portion of the lead frame and the mounting board are in contact with each other via an adhesive such as solder, thereby promoting the propagation of heat to the mounting board, thereby improving the heat dissipation. Rise. Further, since the exposed portion of the lead frame and the mounting substrate are bonded with an adhesive, the mounting strength of the LED package is increased.

特許第３９６４５９０号公報Japanese Patent No. 3964590 特許第３８０８６２７号公報Japanese Patent No. 3808627

特許文献１、２のＬＥＤパッケージは、裏面においてリードフレームの露出部全域が樹脂ケースの被覆樹脂部と面一となっているため、成型時に露出部の周縁の被覆樹脂部にバリが発生しやすい。このようなバリが発生すると、リードフレームの露出部の一部が被覆樹脂で覆われるため、実装基板への放熱性が低下する。また、このようなバリによってはんだにより接着される領域が減少するので、ＬＥＤパッケージの実装強度が低下する。
そこで、リードフレームと、リードフレームを部分的に被覆する被覆する被覆樹脂部とを備えるＬＥＤパッケージにおいて、放熱性の低下が防止される構成を提供することを目的の一つとする。また、リードフレームと、リードフレームを部分的に被覆する被覆樹脂部とを備えるＬＥＤパッケージにおいて、ＬＥＤパッケージの実装強度が低下することが防止される構成を提供することを目的の一つとする。 In the LED packages of Patent Documents 1 and 2, since the entire exposed portion of the lead frame is flush with the coating resin portion of the resin case on the back surface, burrs are likely to occur in the coating resin portion around the exposed portion during molding. . When such a burr | flash generate | occur | produces, since a part of exposed part of a lead frame is covered with coating resin, the heat dissipation to a mounting board | substrate will fall. Moreover, since the area | region adhere | attached with a solder by such a burr | flash reduces, the mounting strength of a LED package falls.
Accordingly, an object of the present invention is to provide a configuration in which a decrease in heat dissipation is prevented in an LED package including a lead frame and a coating resin portion that covers the lead frame partially. Another object of the present invention is to provide a configuration that prevents a reduction in mounting strength of an LED package in an LED package including a lead frame and a coating resin portion that partially covers the lead frame.

上記目的の少なくとも一つを達成するため、本発明は以下の構成からなる。即ち、
リードフレームと該リードフレームを部分的に被覆する被覆樹脂部とを備えるＬＥＤパッケージであって、
前記リードフレームは、ＬＥＤチップが搭載される凹部、平坦なボンディング部並びに前記凹部と前記ボンディング部とをつなぐ傾斜部を備え、
前記被覆樹脂部は前記リードフレームの表面側において、前記凹部の表面及びボンディング部の表面を表出させ、
前記被覆樹脂部は前記リードフレームの裏面側において、前記凹部の裏面、前記傾斜部の裏面及び前記傾斜部周囲におけるボンディング部の裏面の一部を表出させ、かつ前記被覆樹脂部の底面が前記凹部の裏面と同一平面上に位置する、ことを特徴とするＬＥＤパッケージである。 In order to achieve at least one of the above objects, the present invention has the following configuration. That is,
An LED package comprising a lead frame and a coating resin portion that partially covers the lead frame,
The lead frame includes a concave portion on which the LED chip is mounted, a flat bonding portion, and an inclined portion that connects the concave portion and the bonding portion,
The coating resin portion exposes the surface of the concave portion and the surface of the bonding portion on the surface side of the lead frame,
The coating resin portion exposes a part of the back surface of the recess, the back surface of the inclined portion, and the back surface of the bonding portion around the inclined portion on the back surface side of the lead frame, and the bottom surface of the coating resin portion The LED package is located on the same plane as the back surface of the recess.

本発明のＬＥＤパッケージによれば、リードフレームの裏面側において、リードフレームの凹部の裏面、傾斜部の裏面及び傾斜部周囲のボンディング部の裏面の一部が表出するため、被覆樹脂部のエッジ（縁部）がボンディング部の裏面上に位置することとなる。さらにリードフレームの凹部の裏面と被覆樹脂部の底面が同一平面上に位置する。これらにより、リードフレームの凹部の裏面に被覆樹脂部のバリが発生することが防止され、リードフレームの凹部の裏面が表出領域が十分に確保される。その結果、実装基板への熱の伝搬が十分に行われて、放熱性の低下が防止される。また、実装基板との接合領域が確保されるため、ＬＥＤパッケージの実装強度の低下が防止される。   According to the LED package of the present invention, on the back surface side of the lead frame, the back surface of the concave portion of the lead frame, the back surface of the inclined portion, and a part of the back surface of the bonding portion around the inclined portion are exposed. (Edge part) will be located on the back surface of a bonding part. Furthermore, the back surface of the concave portion of the lead frame and the bottom surface of the coating resin portion are located on the same plane. As a result, the occurrence of burrs in the coating resin portion on the back surface of the recess of the lead frame is prevented, and a sufficient exposed area is secured on the back surface of the recess of the lead frame. As a result, heat is sufficiently propagated to the mounting substrate, and a reduction in heat dissipation is prevented. Moreover, since a joining area | region with a mounting board is ensured, the fall of the mounting strength of a LED package is prevented.

図１Ａは本発明の実施例であるＬＥＤパッケージ１の表面側斜視図であり、図１Ｂは裏面側斜視図である。1A is a front side perspective view of an LED package 1 according to an embodiment of the present invention, and FIG. 1B is a rear side perspective view. 図２Ａは図１ＡにおけるＸ−Ｘ線断面図であり、図２Ｂは図１ＡにおけるＹ−Ｙ線断面図である。2A is a sectional view taken along line XX in FIG. 1A, and FIG. 2B is a sectional view taken along line YY in FIG. 1A. 図３Ａは本発明の変形例であるＬＥＤパッケージ１００の表面側斜視図であり、図３Ｂは裏面側斜視図である。3A is a front side perspective view of an LED package 100 which is a modification of the present invention, and FIG. 3B is a rear side perspective view. 図４Ａは図３ＡにおけるＸ’−Ｘ’線断面図であり、図４Ｂは図３ＡにおけるＹ’−Ｙ’線断面図である。4A is a cross-sectional view taken along line X′-X ′ in FIG. 3A, and FIG. 4B is a cross-sectional view taken along line Y′-Y ′ in FIG. 3A.

本発明のＬＥＤパッケージは、リードフレームと該リードフレームを部分的に被覆する被覆樹脂部とを備える。リードフレームはＬＥＤチップが搭載される凹部、平坦なボンディング部並びに凹部とボンディング部とをつなぐ傾斜部を備える。リードフレームはプレス加工等により金属板を切り抜いて、成形して形成することができる。リードフレームは外部の電極と接続するための端子となるアウターリードをさらに備えていて良い。   The LED package of the present invention includes a lead frame and a coating resin portion that partially covers the lead frame. The lead frame includes a concave portion on which the LED chip is mounted, a flat bonding portion, and an inclined portion that connects the concave portion and the bonding portion. The lead frame can be formed by cutting and molding a metal plate by pressing or the like. The lead frame may further include an outer lead serving as a terminal for connecting to an external electrode.

リードフレームの凹部は、ＬＥＤパッケージの表面側（光放出側）に開口し、表面側の底面とその裏面が平面となる形状である。当該凹部の表面側の底面にＬＥＤチップが搭載される。ＬＥＤチップの種類は特に限定されず、所望のＬＥＤチップを採用することができる。ボンディング部は平坦に形成され、ＬＥＤチップとワイヤボンディングされる。傾斜部はボンディング部と凹部と連続する傾斜面を有する。   The concave portion of the lead frame is open to the front surface side (light emission side) of the LED package, and has a shape in which the bottom surface on the front surface side and the back surface thereof are flat. An LED chip is mounted on the bottom surface on the surface side of the recess. The kind of LED chip is not particularly limited, and a desired LED chip can be adopted. The bonding part is formed flat and is wire bonded to the LED chip. The inclined portion has an inclined surface that is continuous with the bonding portion and the recess.

被覆樹脂部はリードフレームを部分的に被覆して、ＬＥＤパッケージの樹脂ケースを構成する。被覆樹脂部はリードフレームの表面側において、凹部の表面及びボンディング部の表面を表出させる。一方、被覆樹脂部はリードフレームの裏面側において、凹部の裏面、傾斜部の裏面及び傾斜部周囲におけるボンディング部の裏面の一部を表出させ、かつ被覆樹脂部の底面は凹部の裏面と同一平面上に位置する。これにより、ＬＥＤパッケージの裏面において、被覆樹脂部のエッジがボンディング部の裏面上に位置することとなる。なお、本明細書において「被覆樹脂部のエッジ」とは、ＬＥＤパッケージの裏面におけるリードフレームの表出領域と被覆樹脂部との境界部分及び境界部を含む端面をさす。
当該エッジは、ボンディング部の裏面に対して垂直に形成されていることが好ましい。被覆樹脂部の形成時において、当該エッジで被覆樹脂を切ることが容易となり、当該エッジにバリが発生することが一層防止されるからである。 The covering resin part partially covers the lead frame to constitute a resin case of the LED package. The coating resin portion exposes the surface of the recess and the surface of the bonding portion on the surface side of the lead frame. On the other hand, the coating resin portion exposes the back surface of the recess, the back surface of the inclined portion, and the back surface of the bonding portion around the inclined portion on the back surface side of the lead frame, and the bottom surface of the covering resin portion is the same as the back surface of the recess portion. Located on a plane. Thereby, in the back surface of an LED package, the edge of a coating resin part will be located on the back surface of a bonding part. In this specification, the “edge of the coating resin portion” refers to a boundary portion between the exposed region of the lead frame and the coating resin portion on the back surface of the LED package and an end surface including the boundary portion.
The edge is preferably formed perpendicular to the back surface of the bonding portion. This is because, when the coating resin portion is formed, it is easy to cut the coating resin at the edge, and the generation of burrs at the edge is further prevented.

被覆樹脂部はリードフレームの表面側において、ボンディング部を傾斜部近傍まで被覆することが好ましい。被覆樹脂部による被覆面積が増加するとともに被覆樹脂部によりリードフレームが上下から挟み込まれるため、ＬＥＤパッケージの強度が増すからである。また、リードフレームの劣化が防止される。特にリードフレームがＡｇ製の場合に劣化により黒色化して光反射性が低下することが防止される。さらに、被覆樹脂部とリードフレームとの接着面積が増すため、リードフレームが被覆樹脂部から剥離することが低減される。
以下本発明の実施例について、より詳細に説明する。 The coating resin portion preferably covers the bonding portion to the vicinity of the inclined portion on the surface side of the lead frame. This is because the area covered by the coating resin portion increases and the lead frame is sandwiched from above and below by the coating resin portion, so that the strength of the LED package is increased. Further, the deterioration of the lead frame is prevented. In particular, when the lead frame is made of Ag, it is possible to prevent the light reflectivity from being reduced due to deterioration due to blackening. Furthermore, since the adhesion area between the coating resin portion and the lead frame is increased, the lead frame is reduced from being peeled off from the coating resin portion.
Examples of the present invention will be described in detail below.

本発明の実施例であるＬＥＤパッケージ１の表面側斜視図を図１Ａに示し、裏面側斜視図を図１Ｂに示す。図１Ａに示すように、ＬＥＤパッケージ１は平面視略矩形の薄型ＬＥＤパッケージであって、ケースを形成する被覆樹脂部１０と、被覆樹脂部１０に部分的に被覆されるリードフレーム２と、ＬＥＤパッケージ１の中央に設けられるＬＥＤチップ３とを備える。リードフレーム２の一部がＬＥＤパッケージ１の側面から引き出されてアウターリード２１を形成している。ＬＥＤパッケージ１の裏面側には、図１Ｂに示すように、リードフレーム２の一部が表出して円形の表出部２２が形成されている。   FIG. 1A shows a front perspective view of an LED package 1 according to an embodiment of the present invention, and FIG. 1B shows a rear perspective view thereof. As shown in FIG. 1A, the LED package 1 is a thin LED package having a substantially rectangular shape in plan view, and includes a coating resin portion 10 that forms a case, a lead frame 2 that is partially covered with the coating resin portion 10, and an LED. The LED chip 3 provided in the center of the package 1 is provided. A part of the lead frame 2 is pulled out from the side surface of the LED package 1 to form an outer lead 21. As shown in FIG. 1B, a part of the lead frame 2 is exposed to form a circular exposed portion 22 on the back surface side of the LED package 1.

図１ＡにおけるＸ−Ｘ線断面図を図２Ａに示し、図１ＡにおけるＹ−Ｙ線断面図を図２Ｂに示す。リードフレーム２はＣｕ、ＡＬにＡｇメッキを施したものであって、図２Ａに示すように、凹部２３、ボンディング部２４、傾斜部２５、インナーリード部２６を備える。凹部２３はＬＥＤパッケージ１の光放出側（図２Ａにおける紙面上方）に開口するカップ状である。凹部２３の内側底面２３ａは略円形の平面に形成される。ボンディング部２４は凹部２３の周囲を囲むように形成されている。ボンディング部２４はアウターリード２１と電気的に連続しており、ボンディングワイヤ３１によりＬＥＤチップ３と電気的に接続されている。凹部２３とボンディング部２４とは傾斜部２５によりつながっている。但し、一方のボンディング部２４にはセパレーション２７が形成されており、凹部２３とは電気的には連結していない。インナーリード部２６はボンディング部２４とアウターリード２１につながっており、ボンディング部２４とアウターリード２１とを電気的に連結している。   A cross-sectional view taken along line XX in FIG. 1A is shown in FIG. 2A, and a cross-sectional view taken along line YY in FIG. 1A is shown in FIG. 2B. The lead frame 2 is obtained by applying Ag plating to Cu and AL, and includes a concave portion 23, a bonding portion 24, an inclined portion 25, and an inner lead portion 26 as shown in FIG. 2A. The recess 23 has a cup shape that opens to the light emitting side of the LED package 1 (upward in the drawing in FIG. 2A). The inner bottom surface 23a of the recess 23 is formed in a substantially circular plane. The bonding part 24 is formed so as to surround the periphery of the recess 23. The bonding portion 24 is electrically continuous with the outer lead 21 and is electrically connected to the LED chip 3 by a bonding wire 31. The concave portion 23 and the bonding portion 24 are connected by an inclined portion 25. However, a separation 27 is formed on one bonding portion 24 and is not electrically connected to the recess 23. The inner lead portion 26 is connected to the bonding portion 24 and the outer lead 21, and electrically connects the bonding portion 24 and the outer lead 21.

図２Ａ，及び図２Ｂに示すように、リードフレーム２の表面側において、凹部２３の表面は被覆樹脂部１０により被覆されておらず、凹部２３の内側底面２３ａがＬＥＤパッケージ１の光放出側に表出している。当該内側底面２３ａにはＬＥＤチップ３が配置される。また、ボンディング部２４の表面２４ａは被覆樹脂部１０に被覆されておらず、ＬＥＤパッケージ１の光放出側に表出している。また、傾斜部２５の表面２５ａは全域が被覆樹脂部１０により被覆されておらず、ＬＥＤパッケージ１の光放出側に表出している。一方、インナーリード部２６の表面２６ａは被覆樹脂部１０によって被覆されている。当該被覆部位の被覆樹脂部１０の表面（符号１０ｃで示す）はＬＥＤチップ３の光軸及び凹部２３の内側底面２３ａに対して傾斜しており、ＬＥＤチップ３の光をＬＥＤパッケージ１の光放出側に反射する反射面１０ｃとなっている。図１Ａに示すように、反射面１０ｃはＬＥＤチップ３を中心とする平面視環状に連続して形成される。これにより、ＬＥＤパッケージ１の光放出側が凹形状に形成され、ここに封止樹脂３０がポッティングされて、ＬＥＤチップ３が封止されている。   2A and 2B, on the surface side of the lead frame 2, the surface of the recess 23 is not covered with the coating resin portion 10, and the inner bottom surface 23a of the recess 23 is on the light emitting side of the LED package 1. It is exposed. The LED chip 3 is disposed on the inner bottom surface 23a. Further, the surface 24 a of the bonding portion 24 is not covered with the coating resin portion 10 and is exposed to the light emitting side of the LED package 1. Further, the entire surface 25 a of the inclined portion 25 is not covered with the coating resin portion 10 and is exposed to the light emitting side of the LED package 1. On the other hand, the surface 26 a of the inner lead portion 26 is covered with the coating resin portion 10. The surface (indicated by reference numeral 10 c) of the coating resin portion 10 in the coating portion is inclined with respect to the optical axis of the LED chip 3 and the inner bottom surface 23 a of the recess 23, and the light emitted from the LED chip 3 is emitted from the LED package 1. The reflection surface 10c reflects to the side. As shown in FIG. 1A, the reflecting surface 10c is continuously formed in an annular shape in plan view with the LED chip 3 as the center. Thereby, the light emission side of the LED package 1 is formed in a concave shape, and the sealing resin 30 is potted here, and the LED chip 3 is sealed.

一方、リードフレーム２の裏面側において、凹部２３の裏面２３ｂ、傾斜部２５の裏面２５ｂ及び傾斜部２４周囲におけるボンディング部の裏面２４ｂは被覆樹脂部１０に被覆されず表出している。これらの表出領域により、ＬＥＤパッケージ１裏面の表出部２２が形成される。さらに、被覆樹脂部１０の底面１０ａと凹部２３の裏面２３ｂとが同一平面上に位置している。また、ＬＥＤパッケージ１裏面における被覆樹脂部１０のエッジ１０ｂはボンディング部２４の裏面２４ｂに対して垂直に形成されている。これにより、ＬＥＤパッケージ１裏面には、平面視環状の凹部Ｐが形成されることとなる。ＬＥＤパッケージ１は、はんだを介して、その裏面が実装基板（図示せず）と対向するように実装される。
On the other hand, on the back surface side of the lead frame 2, the back surface 23 b of the recess 23, the back surface 25 b of the inclined portion 25, and the back surface 24 b of the bonding portion around the inclined portion 24 are exposed without being covered with the coating resin portion 10. The exposed portion 22 on the back surface of the LED package 1 is formed by these exposed regions. Furthermore, the bottom surface 10a of the coating resin portion 10 and the back surface 23b of the recess 23 are located on the same plane. Further, the edge 10 b of the coating resin portion 10 on the back surface of the LED package 1 is formed perpendicular to the back surface 24 b of the bonding portion 24. As a result, an annular recess P in plan view is formed on the back surface of the LED package 1. The LED package 1 is mounted via solder so that the back surface of the LED package 1 faces a mounting substrate (not shown).

ＬＥＤパッケージ１によれば、リードフレーム２の裏面側において、被覆樹脂部１０のエッジ１０ｂはボンディング部２４の裏面２４ｂ上に位置してボンディング部２４の裏面２４ｂに対して垂直に形成されるため、リードフレーム２の凹部２３の裏面２３ｂに被覆樹脂部１０のバリが発生することが防止される。これにより、リードフレーム２の凹部２３の裏面２３ｂの表出部２２が十分に確保され、実装基板への熱の伝搬が十分に行われて、放熱性の低下が防止される。また、実装基板へ実装する際に、はんだが環状の凹部Ｐに入り込んで、傾斜部２５の裏面２５ｂと実装基板との間にはんだフィレットが形成され、ＬＥＤパッケージ１の実装強度が向上する。
According to the LED package 1, since the edge 10b of the coating resin portion 10 is located on the back surface 24b of the bonding portion 24 on the back surface side of the lead frame 2, it is formed perpendicular to the back surface 24b of the bonding portion 24. It is possible to prevent the burrs of the coating resin portion 10 from being generated on the back surface 23b of the recess 23 of the lead frame 2. Thereby, the exposed portion 22 of the back surface 23b of the concave portion 23 of the lead frame 2 is sufficiently secured, heat is sufficiently propagated to the mounting substrate, and the heat dissipation is prevented from being lowered. Further, when mounting on the mounting substrate, the solder enters the annular recess P, and a solder fillet is formed between the back surface 25b of the inclined portion 25 and the mounting substrate, and the mounting strength of the LED package 1 is improved.

ＬＥＤパッケージ１の変形例であるＬＥＤパッケージ１００の表面側斜視図を図３Ａに示し、裏面側斜視図を図３Ｂに示す。さらに、図３ＡにおけるＸ’−Ｘ’線断面図を図４Ａに示し、図３ＡにおけるＹ’−Ｙ’線断面図を図４Ｂに示す。なお、ＬＥＤパッケージ１と同等の部材には、同一の符号を付し、その説明を省略する。図３Ａに示すように、ＬＥＤパッケージ１００は被覆樹脂部１０で形成される反射面１００ｃを備える。反射面１００ｃを構成する被覆樹脂部１０は、ボンディング部２４におけるボンディングワイヤ３１の接続部近傍領域を除いて、ボンディング部２４の表面を、傾斜部２４近傍まで被覆している（図４Ａ及び図４Ｂを参照）。これにより、被覆樹脂部１０とリードフレーム２との接着面積が増すため、リードフレーム２が被覆樹脂部１０から剥離することが低減される。また、被覆樹脂部１０と封止樹脂３０との接着面積も増すため、封止樹脂３０の剥離が防止される。さらに、被覆樹脂部１０によって被覆面積が増加するとともに被覆樹脂部１０によりリードフレーム２が上下から挟み込まれるため、ＬＥＤパッケージ１００の強度が増す。また、Ａｇメッキが施されたリードフレーム２の劣化が防止され、当該劣化に伴う光反射性の低下が防止される。なお、ＬＥＤパッケージ１００においてもＬＥＤパッケージ１と同等の効果を奏する。   A front side perspective view of an LED package 100 which is a modification of the LED package 1 is shown in FIG. 3A, and a rear side perspective view is shown in FIG. 3B. Further, a cross-sectional view taken along line X′-X ′ in FIG. 3A is shown in FIG. 4A, and a cross-sectional view taken along line Y′-Y ′ in FIG. 3A is shown in FIG. 4B. In addition, the same code | symbol is attached | subjected to the member equivalent to the LED package 1, and the description is abbreviate | omitted. As shown in FIG. 3A, the LED package 100 includes a reflective surface 100 c formed of the coating resin portion 10. The coating resin portion 10 constituting the reflecting surface 100c covers the surface of the bonding portion 24 to the vicinity of the inclined portion 24 except for the region near the connection portion of the bonding wire 31 in the bonding portion 24 (FIGS. 4A and 4B). See). Thereby, since the adhesion area of the coating resin part 10 and the lead frame 2 increases, peeling of the lead frame 2 from the coating resin part 10 is reduced. Moreover, since the adhesion area of the coating resin part 10 and the sealing resin 30 increases, peeling of the sealing resin 30 is prevented. Furthermore, since the covering area is increased by the covering resin portion 10 and the lead frame 2 is sandwiched from above and below by the covering resin portion 10, the strength of the LED package 100 is increased. Further, deterioration of the lead frame 2 subjected to Ag plating is prevented, and a decrease in light reflectivity due to the deterioration is prevented. Note that the LED package 100 has the same effect as the LED package 1.

本発明のＬＥＤパッケージは、様々な装置の光源として利用することができる。   The LED package of the present invention can be used as a light source for various devices.

１、１００ ＬＥＤパッケージ
１０ 被覆樹脂部
１０ 裏面
１０ｂ エッジ
１０ｃ 反射面
１１ 封止樹脂
２ リードフレーム
２１ アウターフレーム
２２ 表出部
２３ 凹部
２４ ボンディング部
２５ 傾斜部
２６ インナーリード部
３ ＬＥＤチップ
３１ ボンディングワイヤ
Ｐ ＬＥＤパッケージ１，１００の裏面の凹部
DESCRIPTION OF SYMBOLS 1,100 LED package 10 Cover resin part 10 Back surface 10b Edge 10c Reflective surface 11 Sealing resin 2 Lead frame 21 Outer frame 22 Exposed part 23 Recessed part 24 Bonding part 25 Inclined part 26 Inner lead part 3 LED chip 31 Bonding wire
Recesses on the back of the LED package 1,100

Claims (3)

リードフレームと該リードフレームを部分的に被覆する被覆樹脂部とを備えるＬＥＤパッケージであって、
前記リードフレームは、ＬＥＤチップが搭載される凹部と、平坦なボンディング部と、前記凹部と前記ボンディング部とをつなぐ傾斜部とを備え、
前記被覆樹脂部は前記リードフレームの表面側において、前記凹部の表面及びボンディング部の表面を表出させ、
前記被覆樹脂部は前記リードフレームの裏面側において、前記凹部の裏面、前記傾斜部の裏面及び前記傾斜部周囲における前記ボンディング部の裏面の一部を表出させ、かつ前記被覆樹脂部の底面が前記凹部の裏面と同一平面上に位置し、
前記被覆樹脂部において前記ボンディング部の裏面を被覆する部分のエッジ部は、前記ボンディング部の裏面上に位置して前記ボンディング部の平坦な裏面に対して垂直に形成され、かつ前記エッジ部は前記傾斜部の裏面には掛からないように形成されているＬＥＤパッケージ。 An LED package comprising a lead frame and a coating resin portion that partially covers the lead frame,
The lead frame is provided with a recess in which the LED chip is mounted, and a flat bonding portion and an inclined portion connecting the said and the concave bonding portion,
The coating resin portion exposes the surface of the concave portion and the surface of the bonding portion on the surface side of the lead frame,
In the coating resin portion rear surface side of the lead frame, the back surface of the recess, to expose the part of the back surface of the bonding portion on the back surface and the inclined portion around the inclined portion, and the bottom surface of the coating resin portion Located on the same plane as the back surface of the recess ,
Edge of the portion covering the back surface of the bonding portion in the coating resin portion is formed vertically positioned on the back surface of the bonding portion to the flat rear surface of the bonding portion, and the edge portion is the An LED package formed so as not to hang on the back surface of the inclined portion . 前記リードフレームの前記傾斜部の裏面と、前記被覆樹脂部の前記エッジ部とにより、ＬＥＤパッケージの裏面に円環状の凹部が形成されている、請求項１記載のＬＥＤパッケージ。The LED package according to claim 1, wherein an annular recess is formed on the back surface of the LED package by the back surface of the inclined portion of the lead frame and the edge portion of the coating resin portion. 前記被覆樹脂部は前記リードフレームの表面側において、前記ボンディング部を前記傾斜部近傍まで被覆する、請求項１又は２に記載のＬＥＤパッケージ。
The LED package according to claim 1 , wherein the coating resin portion covers the bonding portion to the vicinity of the inclined portion on the surface side of the lead frame.
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