JP5198394B2 - Proximity illuminance sensor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a proximity illuminance sensor that detects the approach and illuminance of an object and a method for manufacturing the proximity illuminance sensor.

  In recent years, the development of sensor technology has been remarkable, and various sensors are mounted on various electronic devices. The mounting of various sensors on mobile phones is particularly remarkable. For example, in order to reduce power consumption in mobile phones, it is common to control the backlight according to the ambient brightness detected by the illuminance sensor and to turn off the backlight when the proximity sensor detects that a call is in progress It has become. Further, a CCD (Charge Coupled Device) / CMOS (Complementary Metal Oxide Semiconductor) image sensor used for a camera function has an essential configuration for a mobile phone.

  Among such various sensors, an illuminance sensor, an image sensor, a color sensor, or the like needs to have spectral sensitivity characteristics that are close to human visual sensitivity characteristics. Furthermore, there is an increasing demand for various sensors that achieve both the above-described visibility characteristics and downsizing.

  Usually, a silicon photodiode is used for the light receiving portion of the illuminance sensor. However, the wavelength range of sensitivity of silicon is about 300 to 1000 nm, which is greatly different from human visibility. In particular, silicon is sensitive to infrared rays (infrared light) that are not visible to humans. In order to prevent this infrared light from being received by a silicon photodiode, an infrared cut filter, which is a kind of optical filter, is generally used for an illuminance sensor, an image sensor, a color sensor, or the like. There are various forms of this infrared cut filter depending on the application. For example, there are a reflection type that reflects infrared rays or an absorption type that absorbs infrared rays, and a thin film or a film that is formed on a glass substrate. There is also a method of directly depositing an infrared cut filter or a green filter film that absorbs only a part of infrared rays on the light receiving chip.

  In an image sensor, in order to arrange a condensing microlens on a light receiving chip, it is common to fix an infrared cut filter to a holder separated from the light receiving chip.

  In the case of an illuminance sensor, in order to reduce the size of the illuminance sensor as a whole, a general method is to form an optical filter on a light receiving chip by vapor deposition according to human visual sensitivity.

  Patent Document 1 discloses a technique for coating an IR cut filter layer on a glass wafer of a wafer level chip size package for an image sensor module in order to realize lightness, thinness, and miniaturization.

  Patent Document 2 discloses a technique for joining an infrared cut filter substrate to a transparent substrate of a solid-state imaging device.

  In Patent Document 3, in order to match the human visual sensitivity and the light sensitivity obtained by the light receiving element, a part is a first filter having transmission characteristics in the visible light wavelength region, and the other part is a visible light wavelength. A light receiving element including a color filter having a plurality of colors and having a transmission suppression characteristic in a region is disclosed.

  Patent Document 4 discloses a technique for forming a color filter for an illuminance sensor close to the sensitivity of a human eye by adjusting the spectral transmittance.

JP 2007-73958 A (publication date: March 22, 2007) JP 2007-188909 A (publication date: July 26, 2007) JP 2006-313974 A (publication date: November 16, 2006) JP 2007-138135 A (publication date: June 7, 2007)

  However, the above-described prior art has the following problems.

  In the illuminance sensor, as described above, in order to reduce the size of the entire illuminance sensor, it is common to form an optical filter such as an infrared cut filter on the light receiving chip. However, it is practically difficult to match the visual sensitivity characteristics from the infrared region to the ultraviolet region with only one optical filter on the light receiving chip. That is, a deviation from human visibility is caused.

  When an optical filter is mounted on an individual electronic device, it is necessary to change the optical filter formation process or various conditions in the optical filter in order to optimize the sensitivity distribution with respect to the wavelength of incident light. However, it is practically difficult to change the forming process or various conditions, which is technically, timely and expensive.

  The technique described in Patent Document 1 can make the image sensor module light, thin, and small. However, as described above, it is difficult to apply the technology using only this one optical filter to the illuminance sensor so that the visual sensitivity characteristic matches the human visual sensitivity characteristic.

  Moreover, the technique described in Patent Document 2 can reduce the size of the solid-state imaging device. However, like the technique of Patent Document 1, it is difficult to apply this technique to an illuminance sensor so that the visibility characteristic matches the human visibility characteristic.

  Moreover, although the technique described in Patent Document 3 can improve the visibility characteristic by providing a color filter, a technique for realizing coexistence with miniaturization of the illuminance sensor is not disclosed.

  Moreover, although the technique described in Patent Document 4 can improve the visibility characteristics of the illuminance sensor, the technique for realizing compatibility with the miniaturization of the illuminance sensor is disclosed in the same manner as the technique described in Patent Document 3. It has not been.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a proximity illuminance sensor that can achieve both a visibility characteristic matched to a human visibility characteristic and a reduction in size.

  In order to solve the above problems, a proximity illuminance sensor according to the present invention includes a substrate, a light emitting element mounted on the substrate, and an optical filter mounted on the same surface of the substrate as the light emitting element. The mounted illuminance sensor light receiving element, the distance detecting light receiving element mounted on the same surface of the substrate as the light emitting element, the first visible light resin molding the illuminance sensor light receiving element, and the first Visible light and infrared cut resin provided on the substrate so as to cover the periphery of the visible light resin, and infrared light mounted so as to cover the entire surface of the first visible light resin facing the surface in contact with the substrate. It is provided with a cut filter.

  According to the above configuration, in the proximity illuminance sensor of the present invention, the illuminance sensor light receiving element mounted on the substrate is molded with the first visible light resin. The visible light and infrared cut resin are provided on the substrate so as to cover the periphery of the first visible light resin. The entire surface of the first visible light resin that faces the surface in contact with the substrate is covered with the infrared cut filter that is an optical filter. With this infrared cut filter, it is possible to prevent the infrared rays radiated from the light emitting element to detect the distance to the object from being reflected by the object and entering the illuminance sensor light receiving element. An optical filter is formed on the surface of the illuminance sensor light receiving element. With the two optical filters described above, the visibility characteristic of the light receiving element of the illuminance sensor can be brought close to the human visibility characteristic.

  Further, since the infrared ray radiated from the light emitting element does not enter the illuminance sensor light receiving element by the infrared cut filter, the illuminance sensor light receiving element is the same as the light emitting element and the distance detecting light receiving element. It can be mounted on a substrate. Therefore, by mounting the light emitting element, the illuminance sensor light receiving element, and the distance detection light receiving element in an integrated package, the entire proximity illuminance sensor can be reduced in size.

  As described above, the proximity illuminance sensor has an effect that it is possible to achieve both the visibility characteristic approaching the human visibility characteristic and the downsizing of the apparatus.

  In order to solve the above problems, a method for manufacturing a proximity illuminance sensor according to the present invention includes a step of mounting a light emitting element on a substrate, and an optical filter mounted on the surface on the same surface as the light emitting element of the substrate. Mounting the illuminance sensor light receiving element, mounting the distance detection light receiving element on the same surface of the substrate as the light emitting element, and molding the illuminance sensor light receiving element with a first visible light resin; A step of forming visible light and infrared cut resin on the substrate so as to cover the periphery of the first visible light resin, and a step of mounting an infrared cut filter on the first visible light resin. It is characterized by that.

  According to said structure, there exists an effect similar to the proximity illumination sensor which concerns on this invention.

  The proximity illuminance sensor according to the present invention is mounted so as to cover the second visible light resin that molds the distance detection light-receiving element and the entire surface of the second visible light resin that faces the surface in contact with the substrate. And a visible light cut filter.

  According to said structure, the visible light cut filter is mounted so that the whole surface facing the surface which contact | connects the said board | substrate in 2nd visible light resin which molds the said light detection element for said distance detection of the said proximity illumination sensor may be mounted. ing. Accordingly, since visible light can be prevented from entering the distance detection light-receiving element, more accurate distance detection can be realized. Therefore, there is a further effect that a proximity illuminance sensor with higher distance detection accuracy can be realized.

  The infrared cut filter in the proximity illuminance sensor according to the present invention has a refractive index close to the refractive index of the first visible light resin at the boundary surface with the first visible light resin. It is preferable that the boundary surface with air, which is the surface facing the visible light resin surface, has a refractive index close to the refractive index of air.

  According to said structure, the difference of the refractive index in the interface of the said infrared cut filter and the said air is small. For this reason, reflection of incident light at the boundary surface can be reduced. Similarly, since the difference in refractive index at the boundary surface between the infrared cut filter and the first visible light resin is small, reflection of incident light at the boundary surface can be reduced. As described above, since reflection of light incident on the illuminance sensor light receiving element can be reduced, the accuracy of illuminance measurement by the illuminance sensor light receiving element is improved. Therefore, there is a further effect that a proximity illuminance sensor with higher illuminance detection accuracy can be realized.

  It is preferable that the infrared cut filter in the proximity illuminance sensor according to the present invention further includes a metal multi-layer that removes infrared rays.

  According to said structure, the said infrared cut filter in the said proximity illumination intensity sensor is equipped with the metal multi-film layer. The metal multilayer film transmits visible light but reflects infrared light. Thereby, since the incidence of infrared rays to the illuminance sensor light receiving element can be further reliably prevented, the accuracy of illuminance measurement by the illuminance sensor light receiving element is improved. Therefore, there is a further effect that a proximity illuminance sensor with higher illuminance detection accuracy can be realized.

  In the proximity illuminance sensor according to the present invention, the infrared cut filter and the first visible light resin have a refractive index between the refractive index of the infrared cut filter and the refractive index of the first visible light resin. It is preferable that it is adhered by an agent.

  According to said structure, the difference of the refractive index in the interface of the said adhesive agent and the said infrared cut filter is small. Further, the difference in refractive index at the boundary surface between the adhesive and the first visible light resin is small. As described above, since the reflectance of light incident on the adhesive layer can be reduced, reflection of light incident on the illuminance sensor light receiving element can be reduced. Since the reflection of light is reduced, the accuracy of illuminance measurement by the illuminance sensor light receiving element is improved. Therefore, there is a further effect that a proximity illuminance sensor with higher illuminance detection accuracy can be realized.

  The adhesive in the proximity illuminance sensor according to the present invention is preferably visible light transmissive and UV curable or thermosetting.

  According to said structure, the said adhesive agent is UV curable or thermosetting. For this reason, the UV irradiation or heating simplifies the manufacturing process and enables strong bonding in a shorter time than using a room temperature curable adhesive. Therefore, there is a further effect that the productivity of the proximity illuminance sensor is improved.

  In the proximity illuminance sensor according to the present invention, it is preferable that the infrared cut filter and the first visible light resin are bonded to each other by a double-sided tape that is visible light transmissive.

  According to said structure, the said infrared cut filter and said 1st visible light resin are adhere | attached with the double-sided tape which is visible-light transmissive. The double-sided tape can be bonded in advance to the entire infrared cut filter, and then cut to a size that uses the infrared cut filter. Thereby, a manufacturing process is simplified and the whole operation time can be shortened. Therefore, there is a further effect that the productivity of the proximity illuminance sensor is improved.

  The visible light and infrared cut resin in the proximity illuminance sensor according to the present invention are preferably provided so as to cover the periphery of the infrared cut filter.

  According to said structure, visible light and infrared cut resin are provided so that the circumference | surroundings of the said infrared cut filter may be covered. For this reason, incidence of infrared rays from the side surface of the infrared cut filter can be prevented. Since the incidence of infrared rays can be more reliably prevented, the accuracy of illuminance measurement by the illuminance sensor light receiving element is improved. Therefore, there is a further effect that a proximity illuminance sensor with higher illuminance detection accuracy can be realized.

  The infrared cut filter in the proximity illuminance sensor according to the present invention preferably has a disk shape.

  According to said structure, the said infrared cut filter in the said proximity illumination intensity sensor is disk shape. Therefore, in order to mount the infrared cut filter on the first visible light resin, even if the infrared cut filter rotates in the step of sucking and transporting to the collet or the like, the relative position between the collet and the infrared cut filter Does not change. Therefore, even if the infrared cut filter rotates, there is a further effect that the mounting of the infrared cut filter is not affected at all.

  In the illuminance sensor light receiving element in the proximity illuminance sensor according to the present invention, a through electrode is formed in a direction perpendicular to the substrate, and the surface of the illuminance sensor light receiving element facing the surface in contact with the substrate is An infrared cut filter is mounted, and the first visible light resin molds the entire illuminance sensor light receiving element, and a metal case is formed on the substrate so as to cover the periphery of the first visible light resin. It is preferable to be provided.

  According to said structure, the penetration electrode is formed in the said illumination intensity sensor light receiving element. Since a through electrode is formed in the illuminance sensor light receiving element, there is no need to wire bond with a gold wire in order to electrically connect the substrate and the illuminance sensor light receiving element. Since a gold wire is unnecessary, the proximity illuminance sensor can be further downsized. The terminals formed on the illuminance sensor light receiving element are not formed on the surface of the illuminance sensor light receiving element that faces the surface in contact with the substrate. Thereby, an infrared cut filter can be mounted on the surface facing the surface in contact with the substrate.

  In addition, a metal case is provided so as to cover the periphery of the visible light resin molding the entire illuminance sensor light receiving element. Thereby, while being able to prevent infrared rays from entering the illuminance sensor light receiving element, there is an additional effect that resistance of the proximity illuminance sensor to noise is improved.

  In the proximity illuminance sensor according to the present invention, the center of the distance detection light-receiving element in the vertical direction of the substrate is the opening in which the visible light and infrared cut resin are not provided in the vertical direction of the light-emitting element and the substrate. It is preferable to be between the center of the part.

  According to said structure, the center of the opening part in which the said visible light and infrared rays cut resin are not provided exists in the position away from the said light emitting element rather than the center of the said light receiving element for distance detection. Thereby, the infrared rays radiated from the light emitting element can be prevented from being reflected by the transparent panel for protecting the proximity illuminance sensor and entering the light receiving element for distance detection. Since the proximity illuminance sensor can prevent malfunction due to the incidence of infrared rays, it can realize more accurate distance detection. Therefore, there is a further effect that a proximity illuminance sensor with higher distance detection accuracy can be realized.

  As described above, the proximity illuminance sensor according to the present invention includes a substrate, a light emitting element mounted on the substrate, and an optical filter mounted on the surface mounted on the same surface as the light emitting element on the substrate. An illuminance sensor light receiving element, a distance detection light receiving element mounted on the same surface of the substrate as the light emitting element, a first visible light resin for molding the illuminance sensor light receiving element, and the first visible light resin A visible light and infrared cut resin provided on the substrate so as to cover the periphery of the substrate, and an infrared cut filter mounted so as to cover the entire surface of the first visible light resin facing the surface in contact with the substrate. It has. Therefore, it is possible to realize a proximity illuminance sensor that can achieve both a visibility characteristic adapted to a human visibility characteristic and a reduction in size.

  In addition, as described above, the method for manufacturing a proximity illuminance sensor according to the present invention includes a step of mounting a light emitting element on a substrate, and an illuminance in which an optical filter is mounted on the surface of the substrate on the same surface as the light emitting element. Mounting the sensor light receiving element, mounting the distance detecting light receiving element on the same surface of the substrate as the light emitting element, molding the illuminance sensor light receiving element with a first visible light resin, A step of forming visible light and infrared cut resin on the substrate so as to cover the periphery of the first visible light resin, and a step of mounting an infrared cut filter on the first visible light resin. Therefore, it is possible to realize a proximity illuminance sensor that can achieve both a visibility characteristic adapted to a human visibility characteristic and a reduction in size.

FIG. 1 shows an embodiment of the present invention and is a cross-sectional view showing a configuration of a proximity illuminance sensor. FIG. 2 shows an embodiment of the present invention and is a cross-sectional view showing another configuration of the proximity illuminance sensor. FIG. 3 shows an embodiment of the present invention, and is a cross-sectional view showing the configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 4 shows an embodiment of the present invention and is a cross-sectional view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 5 shows an embodiment of the present invention and is a cross-sectional view showing a configuration of an infrared cut filter. FIG. 6 shows an embodiment of the present invention and is a cross-sectional view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 7 shows an embodiment of the present invention and is a cross-sectional view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 8 shows an embodiment of the present invention and is a cross-sectional view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 9 shows an embodiment of the present invention, and is a top view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 10 shows an embodiment of the present invention and is a cross-sectional view showing another configuration around the illuminance sensor light receiving element of the proximity illuminance sensor. FIG. 11 shows an embodiment of the present invention and is a cross-sectional view showing another configuration of the proximity illuminance sensor.

Embodiment 1
An embodiment of a proximity illuminance sensor 1 according to the present invention will be described below with reference to the drawings.

(Configuration of proximity illuminance sensor 1)
First, the configuration of the proximity illuminance sensor 1 according to the present embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing the configuration of the proximity illuminance sensor 1. As shown in this figure, the proximity illuminance sensor 1 includes a glass epoxy resin substrate 4, an illuminance sensor light receiving element 6, a distance detection light receiving element 8, an infrared light emitting element 10, a gold wire 12, a visible light resin 14, and an infrared cut resin 16. , And an infrared cut filter 18. In the proximity illuminance sensor 1, the distance is detected when the infrared light emitted from the infrared light emitting element 10 and reflected by the object is incident on the distance detecting light receiving element 8. The illuminance sensor unit 2 includes a glass epoxy resin substrate 4, an illuminance sensor light receiving element 6, a gold wire 12, a visible light resin 14, an infrared cut resin 16, and an infrared cut filter 18, and details thereof are referred to. Will be described later.

  The proximity illuminance sensor 1 is mounted on the same surface of the glass epoxy resin substrate 4 so that the illuminance sensor light receiving element 6, the distance detecting light receiving element 8, and the infrared light emitting element 10 do not contact each other. The illuminance sensor light receiving element 6, the distance detecting light receiving element 8, and the infrared light emitting element 10 are electrically connected to the glass epoxy resin substrate 4 by a gold wire 12.

  The illuminance sensor light receiving element 6, the distance detecting light receiving element 8, and the infrared light emitting element 10 are each molded with a visible light resin 14. The distance detection light-receiving element 8 and the infrared light-emitting element 10 are molded in a lens shape with a visible light resin 14 on the surface facing the surface in contact with the substrate 4. Visible light and infrared cut resin 16 is provided on glass epoxy resin substrate 4 so as to cover the periphery of visible light resin 14 molding illuminance sensor light receiving element 6, distance detecting light receiving element 8 and infrared light emitting element 10. ing. In other words, visible light and infrared cut resin 16 are provided on the surface of the visible light resin 14 other than the surface in contact with the glass epoxy resin substrate 4 and the surface opposite to the surface in contact with the glass epoxy resin substrate 4. As a result, the illuminance sensor light receiving element 6, the distance detecting light receiving element 8, and the infrared light emitting element 10 block visible light and infrared light from each other. For example, the infrared rays emitted from the infrared light emitting element 10 do not directly enter the illuminance sensor light receiving element 6 or the distance detecting light receiving element 8.

  The visible light resin 14 on the surface facing the surface in contact with the glass epoxy resin substrate 4 in the illuminance sensor light receiving element 6 is covered with an infrared cut filter 18 that is an optical filter. The infrared cut filter 18 can prevent the infrared light emitted from the infrared light emitting element 10 from being reflected by the object and entering the illuminance sensor light receiving element 6. Although not shown, an optical filter for adjusting to human visibility is mounted on the surface of the illuminance sensor light receiving element 6. With these two optical filters, the visual sensitivity characteristic of the illuminance sensor light receiving element 6 can be brought close to the human visual sensitivity characteristic. In addition, the dynamic range of the illuminance sensor light receiving element 6 can be improved.

  In addition, since the infrared ray radiated from the infrared light emitting element 10 can be prevented from entering the illuminance sensor light receiving element 6 by the infrared cut filter 18, the illuminance sensor light receiving element 6 is connected to the infrared light emitting element 10 and the distance detecting light receiving element 8. Can be mounted on the same substrate. Thereby, the light emitting element 10, the illuminance sensor light receiving element 6, and the distance detecting light receiving element 8 can be mounted in an integrated package. Therefore, the entire proximity illuminance sensor 1 can be downsized.

  Further, it is preferable that a visible light cut filter 20 is mounted on the light-receiving element 8 for distance detection of the proximity illuminance sensor 1. This will be described with reference to FIG. In the proximity illuminance sensor 1 ′ shown in FIG. 2, a visible light cut filter 20 is mounted so as to cover the entire surface of the distance detection light receiving element 8 that faces the surface in contact with the glass epoxy resin substrate 4. By mounting the visible light cut filter 20, it is possible to prevent visible light from entering the distance detection light receiving element 8. Thereby, the light receiving element 8 for distance detection can detect the approach of the object with higher accuracy.

  Next, a manufacturing method around the illuminance sensor light receiving element 6 of the proximity illuminance sensor 1 will be described with reference to FIG. FIG. 3 is a cross-sectional view showing the illuminance sensor unit 2 around the illuminance sensor light receiving element 6 of the proximity illuminance sensors 1 and 1 ′. In the manufacture of the illuminance sensor unit 2, first, the illuminance sensor light receiving element 6, which is an element combining a photodiode and a light reception current amplification circuit, is die-bonded on the glass epoxy resin substrate 4. The illuminance sensor light receiving element 6 may be an element combining arithmetic circuits, or may be a photodiode itself.

  Next, the glass epoxy resin substrate 4 and the illuminance sensor light receiving element 6 are wire-bonded using a gold wire 12. Thereby, the glass epoxy resin board | substrate 4 and the illumination intensity sensor light receiving element 6 are electrically connected. After wire bonding the glass epoxy resin substrate 4 and the illuminance sensor light receiving element 6, the illuminance sensor light receiving element 6 is molded with the visible light resin 14.

  Next, visible light and infrared cut resin 16 are formed on the visible light resin 14 so as to cover a surface other than the surface facing the glass epoxy resin substrate 4 in the visible light resin 14. When the visible light and infrared cut resin 16 is formed, the visible light resin 14 and the visible light and infrared cut resin 16 are provided flat at a distance equal to the vertical direction from the glass epoxy resin substrate 4.

  The illuminance sensor light receiving element 6 needs to take in light from above. For this reason, when the visible light and infrared cut resin 16 is formed, the visible light resin 14 is suppressed by a mold so that the upper part of the illuminance sensor light receiving element 6 is not covered with the visible light and infrared cut resin 16. The visible light resin 14 and the visible light / infrared cut resin 16 are thermosetting resins such as epoxy resins.

  After the visible light resin 14 and the visible light / infrared cut resin 16 are formed, the infrared cut filter 18 is mounted on the visible light resin 14 on the surface opposite to the surface in contact with the glass epoxy resin substrate 4 in the illuminance sensor light receiving element 6. .

  The infrared cut filter 18 may be an infrared cut filter 18a that is a glass material in which the refractive index of glass changes in a direction perpendicular to the glass epoxy resin substrate 4. This will be described with reference to FIG. FIG. 4 is a cross-sectional view of the illuminance sensor unit 2a using the infrared cut filter 18a in which the refractive index of glass changes. The refractive index of the infrared cut filter 18a, which is a glass material, is a refractive index of air, that is, a value close to 1 at the boundary surface with air, which is a surface facing the glass epoxy resin substrate 4, and the visible light resin 14 It gradually increases as it approaches the surface, and on the surface of the visible light resin 14, the value is close to the refractive index of the visible light resin 14. Since the visible light resin 14 which is an epoxy resin has a refractive index of about 1.5 to 1.6, the refractive index of the infrared cut filter 18a continuously changes from 1 to 1.5.

  On the boundary surface of substances having different refractive indexes, the greater the refractive index difference, the greater the light reflectance. As described above, the infrared cut filter 18a reduces the difference in refractive index at the interface with the visible light resin 14 or air. In addition, the refractive index is continuously changed inside. As described above, reflection of light incident on the illuminance sensor light receiving element can be reduced. Therefore, it is possible to make light incident closer to human visual sensitivity characteristics.

  Moreover, you may use the infrared cut filter 18b by which the metal multilayer thin film 22 was formed on the glass plate. This will be described with reference to FIG. FIG. 5 is a cross-sectional view of the infrared cut filter 18 b in which the metal multilayer thin film 22 is formed on the glass plate 24. The infrared cut filter 18b includes a metal multilayer thin film 22 and a glass plate 24, which is the same material as the infrared cut filter 18a, from the light incident side. First, of incident light from the outside, visible light is transmitted through the metal multilayer thin film 22, while infrared light is reflected by the metal multilayer thin film 22. The reflectance of visible light transmitted through the metal multilayer thin film 22 is reduced by the glass plate 24. As described above, the infrared cut filter 18b makes it more difficult to transmit infrared light than the infrared cut filter 18a, and reduces the reflectance of visible light. Thereby, the infrared cut filter 18b can make the transmitted light closer to human visual sensitivity characteristics than the infrared cut filter 18a. Therefore, the proximity illuminance sensors 1 and 1 ′ with higher accuracy can be realized.

[Embodiment 2]
Next, another manufacturing method in the illuminance sensor section 2 of the proximity illuminance sensors 1 and 1 ′ will be described with reference to FIG. The illuminance sensor unit 2b shown in FIG. 6 is different from the illuminance sensor unit 2 of the first embodiment in that the infrared cut filter 18 is bonded by an adhesive 26. In the illuminance sensor unit 2b, the description of the same parts as the illuminance sensor unit 2 is omitted.

  The adhesive 26 has a refractive index between the infrared cut filter 18 and the visible light resin 14. As a result, the difference in refractive index at the boundary surface is reduced, so that the reflectance of light incident on the adhesive layer 26 can be reduced.

  The adhesive 26 that bonds the infrared cut filter 18 in the illuminance sensor 2b is visible light transmissive. Further, a room temperature curable resin, a UV curable resin, or a thermosetting resin can be used. By using a UV curable resin or a thermosetting resin, it can be strongly bonded in a short time by UV irradiation or heating. Further, instead of the adhesive, a visible light transmissive double-sided tape having heat resistance to the reflow process may be used. The double-sided tape can be attached in advance to the infrared cut filter 18 before cutting. For this reason, a manufacturing process can be simplified compared with the case where the adhesive agent 26 is used. Note that the cost can be reduced depending on the material of the adhesive or the double-sided tape.

[Embodiment 3]
Next, another manufacturing method in the illuminance sensor section 2 of the proximity illuminance sensors 1 and 1 ′ will be described with reference to FIG. The illuminance sensor unit 2c shown in FIG. 7 differs from the illuminance sensor unit 2b of the second embodiment in the shapes of visible light and infrared cut resin 16. In the illuminance sensor unit 2c, the description of the same parts as the illuminance sensor unit 2b is omitted.

  In the illuminance sensor portion 2c, the visible light and infrared cut resin 16 are formed with a step as shown in FIG. That is, the visible light and infrared cut resin 16 near the illuminance sensor light receiving element 6 is formed at the same height as the visible light resin 14, and the visible light and infrared cut resin 16 further away from the illuminance sensor light receiving element 6 is visible resin. Higher than 14.

  Next, an adhesive 26 is applied onto the visible light resin 14 and the visible light and infrared cut resin 16 formed at the same height as the visible light resin 14, and the infrared cut filter 18 is bonded. With this configuration, the periphery of the infrared cut filter 18, that is, the surface other than the surface facing the first visible light resin 14 in the infrared cut filter 18 is covered with the visible light and infrared cut resin 16. For this reason, it is possible to more reliably prevent infrared rays from entering the illuminance sensor light receiving element 6 from the side surface of the infrared cut filter 18. Therefore, the proximity illuminance sensors 1 and 1 ′ with higher accuracy can be realized.

  Further, in the illuminance sensor unit 2c, the visible light and infrared cut resin 16 were formed, and then the infrared cut filter 18 was bonded. However, the visible light and infrared cut resin 16 may be formed after the infrared cut filter 18 is bonded. This will be described with reference to FIG. The illuminance sensor unit 2 d shown in FIG. 8 forms the visible light and the infrared cut resin 16 so as to cover the infrared cut filter 18 and the visible light resin 14 after the infrared cut filter 18 is bonded onto the visible light resin 14. With this configuration, an effect similar to that of the illuminance sensor unit 2c is obtained.

  The infrared cut filter 18 is preferably disk-shaped. This will be described with reference to FIG. FIG. 9 is a top view of the illuminance sensor unit 2e using the infrared cut filter 18 having a disk shape. Usually, the infrared cut filter 18 is conveyed by being attracted to a collet or the like and mounted on the visible light resin 14. If the infrared cut filter 18 has a disc shape, even if the infrared cut filter 18 rotates in the process of being attracted and transported to a collet or the like, mounting is not affected at all.

[Embodiment 4]
Next, another manufacturing method in the illuminance sensor section 2 of the proximity illuminance sensors 1 and 1 ′ will be described with reference to FIG. In the illuminance sensor unit 2 f shown in FIG. 10, the through electrode 28 is formed in the illuminance sensor light receiving element 6. Accordingly, the illuminance sensor light receiving element 6 can be electrically connected to the glass epoxy resin substrate 4 without wire bonding using the gold wire 12. For this reason, the proximity illuminance sensor 1 can be further downsized.

  In the illuminance sensor unit 2 f, the infrared cut filter 18 is bonded to the glass epoxy resin substrate 4 using an adhesive 26. Next, the illuminance sensor light receiving element 6 and the entire infrared cut filter 18 are molded with the visible light resin 14. Next, although not shown, a metal case is provided on the glass epoxy resin substrate 4 so as to cover the periphery of the visible light resin 14. With this metallic case, it is possible to prevent infrared rays from entering the illuminance sensor light receiving element 6 and to improve resistance to noise.

  As described above, in the illuminance sensor unit 2f, since it is not necessary to use the gold wire 12, the whole can be reduced in size. Further, since the wire bonding process is unnecessary, the manufacturing becomes easy.

[Embodiment 5]
Next, another method for manufacturing the proximity illuminance sensor 1 will be described with reference to FIG. The proximity illuminance sensor 1 '' shown in FIG. 11 is different from the proximity illuminance sensor 1 of the first embodiment in the position of the opening of the light receiving element 8 for distance detection. In the proximity illuminance sensor 1 '', the description of the same parts as the proximity illuminance sensor 1 is omitted.

  In the proximity illuminance sensor 1 ″, the center 32 of the opening where the visible light and the infrared cut resin 16 are not provided is located farther from the infrared light emitting element 10 than the center 30 of the distance detecting light receiving element 8. Accordingly, it is possible to prevent the infrared rays emitted from the infrared light emitting element 10 from being reflected on the panel 34 for protecting the proximity illuminance sensor 1 ″ and entering the distance detecting light receiving element 8. Therefore, it is possible to prevent malfunction caused by the light emitted from the infrared light emitting element 10 entering the light receiving element 8 for distance detection. In the proximity illuminance sensor 1 ″, the visible light cut filter 20 may be mounted on the surface opposite to the surface in contact with the glass epoxy resin substrate 4 of the distance detection light receiving element 8 as in the proximity illuminance sensor 1 ′. Good.

(Additional notes)
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can also be expressed as follows, for example.

  1. A light-emitting element and a light-receiving element that detects illuminance, and a light-receiving element that detects a distance to a nearby object are mounted on a substrate, and the light-emitting element and the light-receiving element are each molded with a visible light resin, and around the visible light resin Is molded with a visible light and infrared cut resin, and a light receiving element for detecting illuminance is molded in a proximity illuminance sensor in which a surface of the visible light resin through which light from the light emitting element and the light receiving element passes is opened. A proximity illuminance sensor, wherein an infrared cut filter is formed on a visible light resin, and the infrared cut filter is incident on a light receiving portion without attenuation of visible light and at the same time, infrared light does not enter the light receiving portion.

  2. A light-emitting element and a light-receiving element that detects illuminance, and a light-receiving element that detects a distance to a nearby object are mounted on a substrate, and the light-emitting element and the light-receiving element are each molded with a visible light resin, and around the visible light resin Is molded with a visible light and infrared cut resin, and a light receiving element for detecting illuminance is molded in a proximity illuminance sensor in which a surface of the visible light resin through which light from the light emitting element and the light receiving element passes is opened. An infrared cut filter is formed on the visible light resin, and the infrared cut filter detects the distance to a nearby object at the same time when the infrared light enters the light receiving unit without being attenuated. A proximity illuminance sensor, wherein a visible light cut filter is formed on a visible light resin for molding a light receiving element.

  3. The proximity illuminance sensor according to 1 or 2, wherein the infrared cut filter has a larger refractive index distribution in a portion closer to the light receiving portion.

  In the proximity illuminance sensor of 4.1 to 3, the infrared cut filter is made of glass and a metal multilayer film, and the glass has a larger refractive index distribution in a portion closer to the light receiving portion and is formed on the glass. A proximity illuminance sensor, wherein the metal multilayer film is configured to remove infrared rays.

  In the proximity illuminance sensor of 5.1 to 4, the infrared cut filter and the visible light transmitting resin are bonded with an adhesive, and the refractive index of the adhesive is the refractive index on the bonding surface side of the infrared cut filter and the visible light transmission. Proximity illuminance sensor, characterized by being between the refractive indices of the functional resin.

  The proximity illuminance sensor according to 6.1 to 5, wherein the adhesive is UV curable or thermosetting, and visible light transmissive.

  7. The proximity illuminance sensor according to 1 to 4, wherein the infrared cut filter and the visible light transmissive resin are bonded with a visible light transmissive double-sided tape.

  8. The proximity illuminance sensor according to 8.1 to 6, comprising a visible light and infrared cut resin opening, having a recess larger than the infrared cut filter and having a depth greater than or equal to the thickness of the infrared cut filter.

  The proximity illuminance sensor according to 9.8, wherein the infrared cut filter has a disk shape.

  In the proximity illuminance sensor of 10.1 to 9, the infrared cut filter is between visible light resin and visible light and infrared cut resin, and the edge of the infrared cut filter is covered with visible light and infrared cut resin. Proximity illuminance sensor.

  11. In the proximity illuminance sensor of 11.1 to 7, the light receiving element for detecting the illuminance has a through electrode formed on the light receiving chip, and no wire bonding is required by taking out the electrode from the back surface of the chip, and an infrared cut filter is provided on the light receiving surface. A proximity illuminance sensor, characterized in that it is bonded and the outside is covered with a visible light resin for protecting the chip.

  12. In the proximity illuminance sensors of 12.1 to 11, the light receiving element that detects the distance to the proximity object has the center axis of the opening of the visible light and infrared cut resin with respect to the center axis of the light receiving surface of the light receiving element. A proximity illuminance sensor, which is deviated by a certain distance in a direction opposite to the side where the element is arranged.

  The proximity illuminance sensor of the present invention can be suitably used in general electronic devices that need to detect the approach and illuminance of an object.

1 Proximity illuminance sensor 2 Illuminance sensor part 4 Glass epoxy resin substrate (substrate)
6 Illuminance sensor light receiving element 8 Distance detecting light receiving element 10 Infrared light emitting element (light emitting element)
12 Gold wire 14 Visible light resin (1st visible light resin 2nd visible light resin)
16 Visible light and infrared cut resin 18, 18a, 18b Infrared cut filter 20 Visible light cut filter 22 Metal multilayer thin film (metal multilayer film)
24 Glass plate 26 Adhesive 28 Through electrode 30 Center of distance detecting light receiving element 32 Center of opening of infrared cut resin (center of opening)

Claims (12)

A substrate,
A light emitting device mounted on the substrate;
An illuminance sensor light-receiving element mounted on the same surface as the light-emitting element on the substrate and having an optical filter mounted on the surface;
A light-receiving element for distance detection mounted on the same surface as the light-emitting element on the substrate;
A first visible light resin for molding the illuminance sensor light receiving element;
Visible light and infrared cut resin provided on the substrate so as to cover the periphery of the first visible light resin;
A proximity illuminance sensor, comprising: an infrared cut filter mounted so as to cover the entire surface facing the substrate in the first visible light resin. A second visible light resin that molds the distance detection light-receiving element;
2. The proximity illuminance sensor according to claim 1, further comprising a visible light cut filter mounted so as to cover an entire surface of the second visible light resin that faces the surface in contact with the substrate.   The infrared cut filter has a refractive index close to the refractive index of the first visible light resin at a boundary surface with the first visible light resin, and a surface in contact with the first visible light resin; 3. The proximity illuminance sensor according to claim 1, wherein a boundary surface with air that is an opposing surface has a refractive index close to a refractive index of air.   4. The proximity illuminance sensor according to claim 1, wherein the infrared cut filter further includes a metal multi-layer that removes infrared rays. 5.   The infrared cut filter and the first visible light resin are bonded by an adhesive having a refractive index between the refractive index of the infrared cut filter and the refractive index of the first visible light resin. The proximity illuminance sensor according to any one of claims 1 to 4, characterized in that:   The proximity illuminance sensor according to claim 5, wherein the adhesive is visible light transmissive and is UV curable or thermosetting.   5. The proximity illuminance sensor according to claim 1, wherein the infrared cut filter and the first visible light resin are bonded to each other by a double-sided tape that is transmissive to visible light.   8. The proximity illuminance sensor according to claim 1, wherein the visible light and the infrared cut resin are provided so as to cover a periphery of the infrared cut filter.   The proximity illuminance sensor according to any one of claims 1 to 8, wherein the infrared cut filter has a disk shape. In the illuminance sensor light receiving element, a through electrode is formed in a direction perpendicular to the substrate,
The infrared cut filter is mounted on a surface facing the substrate in the illuminance sensor light receiving element,
The first visible light resin molds the entire illuminance sensor light receiving element,
The proximity illuminance sensor according to any one of claims 1 to 9, wherein a metal case is provided on the substrate so as to cover the periphery of the first visible light resin.   The center of the distance detecting light receiving element in the vertical direction of the substrate is between the light emitting element and the center of the opening in the vertical direction of the substrate where the visible light and infrared cut resin are not provided. The proximity illuminance sensor according to any one of claims 1 to 10, wherein: Mounting a light emitting element on a substrate;
Mounting an illuminance sensor light receiving element having an optical filter mounted on the surface thereof on the same surface of the substrate as the light emitting element;
Mounting a light-receiving element for distance detection on the same surface of the substrate as the light-emitting element;
Molding the illuminance sensor light receiving element with a first visible light resin;
Forming visible light and infrared cut resin on the substrate so as to cover the periphery of the first visible light resin;
And a step of mounting an infrared cut filter on the first visible light resin.

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