JP5194183B1 - Resistance board, slide type variable resistor, and resistance board manufacturing method - Google Patents

Abstract

The present invention provides a resistance substrate or the like that can improve linearity characteristics and also has a good yield during manufacture.
A resistor pattern (31) in which a slider linearly slides and a current collector pattern (32) are printed and separated on an insulating substrate (30). In the resistance substrate (3) for the slide type variable resistor in which the first electrode pattern conducting to one end of (31) and the second electrode pattern conducting to the other end of the resistor pattern (31) are formed. The resistor pattern (31) is characterized by being formed beyond the sliding region (A1) where the slider slides from one end to the other end in the longitudinal direction of the insulating substrate (30).
[Selection] Figure 4

Description

  The present invention relates to a resistance board, a slide type variable resistor, and a method for manufacturing a resistance board, and more particularly to a resistance board having excellent linearity characteristics, a slide type variable resistor, and a method for manufacturing a resistance board.

  Conventionally, a slider having a slider having a pair of sliding contact pieces attached to the lower surface is slid on a resistor substrate having a resistor pattern and a current collector pattern arranged on the upper surface, so that A slide-type variable resistor that changes an output resistance value according to the contact position of the sliding contact piece has been proposed (see, for example, Patent Document 1).

JP 2010-45242 A

  In the slide type variable resistor as described above, the linearity characteristic of the output value is affected by the uniformity of the film thickness of the resistor pattern provided on the resistor substrate. For this reason, if the uniformity of the film thickness of the resistor pattern is not ensured, the linearity characteristic deteriorates. The resistor pattern on the resistor substrate is generally provided by screen printing along the longitudinal direction. When the resistor pattern or the like is provided by screen printing, a situation in which the film thickness of the resistor pattern becomes non-uniform at a printing start position and a printing intermediate position (for example, a resistor pattern forming position) may occur.

  One of the causes of the non-uniform film thickness of the resistor pattern in screen printing is considered to be the difference in frictional resistance (friction coefficient) between the squeegee and the printing mask at the printing location. For example, it is assumed that the friction resistance of the printing mask is low at the printing start position (the end of the resistor pattern), whereas the friction resistance is higher than the printing start position in the resistor pattern formation region. When the frictional resistance fluctuates in this way, the squeegee that contacts the print mask moves while changing the contact angle. For this reason, when the frictional resistance is low, the contact angle becomes relatively large. On the other hand, when the frictional resistance is high, it is estimated that the contact angle becomes relatively small. It is considered that the supply amount of the material constituting the resistor pattern changes with the change of the contact angle, and the film thickness becomes non-uniform.

  In addition, when a highly accurate linearity characteristic is required for a resistance substrate used in such a slide-type variable resistor or the like, a situation where a resistance substrate that does not satisfy a certain reference value is increased, There is also a problem that the yield decreases.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resistance substrate, a slide-type variable resistor, and a resistance substrate manufacturing method that can improve linearity characteristics and have a good yield during manufacturing. To do.

The resistor substrate of the present invention is formed by screen printing on the insulating substrate so that the resistor pattern on which the slider linearly slides and the current collector pattern are spaced apart, and one end of the resistor pattern. In the resistance substrate for a slide type variable resistor in which a first electrode pattern conducting to a portion and a second electrode pattern conducting to the other end of the resistor pattern are formed, the resistor pattern is formed on the insulating substrate. It is characterized by being formed beyond a sliding region where the slider slides from one end to the other end in the longitudinal direction.

  According to this resistor substrate, the resistor pattern is formed beyond the sliding region from one end to the other end in the longitudinal direction of the insulating substrate. Therefore, even when the resistor pattern is screen-printed along the longitudinal direction, the resistor substrate is slid. Since the situation in which the frictional resistance of the printing mask fluctuates in the moving region can be suppressed, the film thickness of the resistor pattern in the sliding region can be formed substantially equal, and the linearity characteristics can be improved. As the linearity characteristic is improved, the production of a resistance substrate that does not satisfy a certain reference value can be suppressed, so that the manufacturing yield can be improved. As a result, it is possible to provide a resistance substrate that can improve linearity characteristics and also has a good yield during manufacturing.

  In the resistance substrate, the first electrode pattern includes a first connection portion connected to one end portion of the resistor pattern, and a first portion corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached. A terminal arrangement portion, and the second electrode pattern is provided on a second connection portion connected to the other end portion of the resistor pattern, and on a portion provided on one end portion of the insulating substrate and to which a terminal member is attached. A corresponding second terminal arrangement portion; and a wiring portion provided between the second connection portion and the second terminal arrangement portion, wherein the first connection portion and the second connection portion are insulated from each other. The resistor patterns are arranged opposite to each other in a state of being separated in the longitudinal direction of the substrate, and the resistor pattern is laminated on the first connection portion and the second connection portion, and at least a part of the wiring portion on the second connection portion side. Is covered with a resistor layer, In serial on the second connecting portion, it is preferable that the resistor pattern and the resistor layer are stacked. In this case, at least a part of the wiring portion on the second connection portion side is covered with the resistor layer, and the resistor pattern and the resistor layer are laminated on the second connection portion, so that the electrode pattern is sulfided. Even if it contains silver particles, the wiring part in the vicinity of the second connection part can be protected by the resistor layer instead of the resistor pattern, so without increasing the width dimension of the resistor pattern in the vicinity of the second connection part, It becomes possible to make the film thickness of the resistor pattern uniform in the sliding area of the slider.

  In the resistance substrate, at one end portion of the resistor pattern, the resistor pattern has a terminal mounting portion corresponding to a portion to which the terminal member is mounted, and is provided on the first terminal arrangement portion. It is preferable that the resistor layers are stacked, and the resistivity of the resistor layer is smaller than the resistivity of the resistor pattern. In this case, since a resistor layer having a specific resistance smaller than the specific resistance of the resistor pattern is laminated on the terminal mounting portion, the metal terminal member and the terminal mounting portion that are mounted by eyelet caulking or the like are stacked. The contact resistance with the resistor layer can be suppressed, and the terminal member and the first electrode pattern can be stably electrically connected with a low resistance value.

  In the resistance substrate, the wiring portion includes a first wiring portion arranged in parallel with the resistor pattern, and a second wiring portion located between the first wiring portion and the second connection portion. The resistor layer is preferably laminated on the second wiring part. In this case, since the resistor layer laminated on the second wiring portion and the resistor layer on the terminal mounting portion can be formed of the same material, the second wiring portion can be made to be a resistor without providing a separate manufacturing process. It becomes possible to protect the body layer.

  In the resistor substrate, it is preferable that the resistor patterns are formed to have substantially the same width at least in a region excluding the terminal attachment portion. In this case, since the resistor pattern is formed to have substantially the same width at least in the region excluding the terminal mounting portion, the situation in which the film thickness of the resistor pattern becomes nonuniform due to the change in the width dimension is suppressed. As a result, the film thickness of the resistor pattern can be made more uniform.

  In the resistance substrate, it is preferable that the resistor pattern is formed to have substantially the same width from one end to the other end of the insulating substrate including the terminal mounting portion. In this case, since the resistor pattern is formed to have substantially the same width from one end to the other end of the insulating substrate including the terminal mounting portion, the thickness of the resistor pattern becomes non-uniform as the width dimension is changed. Therefore, the uniformity of the film thickness of the resistor pattern can be effectively increased.

  In the resistor substrate, the resistor pattern is provided between the current collector pattern and the first wiring part, and the resistor is provided on the current collector pattern and the first wiring part. It is preferable that an overcoat layer made of the same material as the pattern is laminated. In this case, since the overcoat layer made of the same material as the resistor pattern is provided on both sides of the resistor pattern, the resistor pattern and the overcoat layer can be formed by a common printing process. In addition, since the overcoat layer is provided on both sides of the resistor pattern, the operation of the squeegee can be stabilized during screen printing compared to the case where the overcoat layer is provided only on one side of the resistor pattern. The influence on the film thickness of the body pattern can be suppressed.

  The resistor substrate includes an insulating pattern provided on the insulating substrate so as to connect the first connecting portion and the second connecting portion, and the resistor pattern is formed on the insulating pattern. It is preferable that the first connection portion and the second connection portion exposed from the insulating pattern are stacked. In this case, since the insulating pattern is provided between the insulating substrate and the resistor pattern, it is possible to suppress a situation in which minute irregularities on the surface of the insulating substrate affect the resistor pattern, and the sliding with respect to the resistor pattern is possible. It is possible to stabilize the sliding motion of the moving element.

  In the above-described resistance substrate, the insulating substrate is preferably obtained by being divided from a substrate base material on which the resistor patterns on the insulating substrates adjacent in the longitudinal direction are continuously printed. In this case, since the resistor patterns can be continuously provided on a plurality of insulating substrates, it is possible to reduce the number of times the friction resistance of the printing mask fluctuates in units of the substrate base material, and to make the film thickness of the resistor patterns uniform. Therefore, it is possible to improve the linearity characteristic while securing the property.

  The slide type variable resistor according to the present invention includes a resistor substrate according to any one of the above-described aspects, a resistor pattern printed on an insulating substrate included in the resistor substrate, and a slider that slides on a current collector pattern. It is characterized by comprising.

  According to this slide type variable resistor, it is possible to provide a slide type variable resistor that can improve the linearity characteristic and also has a good yield during manufacture since it includes the resistance substrate of any of the above-described aspects. Become.

In the manufacturing method of the resistance substrate for the slide type variable resistor according to the present invention, the resistor pattern on which the slider linearly slides and the current collector pattern are separated and printed on the insulating substrate by screen printing. And a method of manufacturing a resistance substrate for a slide-type variable resistor in which a first electrode pattern conducting to one end of the resistor pattern and a second electrode pattern conducting to the other end of the resistor pattern are formed. The electrode printing step of printing the first electrode pattern and the second electrode pattern on the substrate base material, which can be obtained in the longitudinal direction of the insulating substrate, spaced apart in the longitudinal direction of the insulating substrate And the resistor pattern is continuously marked along the longitudinal direction of the insulating substrate so as to pass over the first electrode pattern and the second electrode pattern disposed on the plurality of insulating substrates. A resistance printing step to be formed, and a resistor in which the resistor pattern is arranged beyond a sliding region in which the slider is slid from one end to the other end in the longitudinal direction of the insulating substrate by dividing the substrate base material And a substrate dividing step for obtaining a substrate.

  According to this method of manufacturing a resistance substrate for a slide type variable resistor, by dividing the substrate base material on which the resistor pattern is continuously printed on the insulating substrate arranged in the longitudinal direction, Even when the resistor pattern is screen-printed along the longitudinal direction, the resistor substrate is obtained in which the resistor pattern is arranged beyond the sliding region where the slider slides from one end to the other end of the direction. Since the situation in which the frictional resistance of the printing mask fluctuates in the sliding region can be suppressed, the film thickness of the resistor pattern in the sliding region can be formed substantially equal, and the linearity characteristics can be improved. As the linearity characteristic is improved, the production of a resistance substrate that does not satisfy a certain reference value can be suppressed, so that the manufacturing yield can be improved. As a result, it is possible to provide a resistance substrate that can improve linearity characteristics and also has a good yield during manufacturing.

  In the manufacturing method of the resistance substrate for the slide type variable resistor, the method further includes a resistor layer printing step of printing and forming a resistor layer having a specific resistance smaller than that of the resistor pattern, and the first electrode pattern includes: A first connection portion connected to one end portion of the resistor pattern; and a first terminal arrangement portion corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached; and the second electrode pattern A second connection portion connected to the other end portion of the resistor pattern, a second terminal arrangement portion corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached, and the second connection And a wiring portion provided between the second terminal arrangement portion, and in the electrode printing step, the first connection portion and the second connection portion are arranged in the longitudinal direction of the insulating substrate. Opposite in a state separated from The resistor pattern is stacked on the first connection portion and the second connection portion in the resistance printing step, and the resistor layer is stacked on the second connection portion in the resistor layer printing step. It is preferable that the resistor layer is printed and formed on at least a part of the wiring portion on the second connection portion side so that the body pattern and the resistor layer are stacked. In this case, at least a part of the wiring portion on the second connection portion side is covered with the resistor layer, and the resistor pattern and the resistor layer are laminated on the second connection portion, so that the electrode pattern is sulfided. Even if it contains silver particles, the wiring part in the vicinity of the second connection part can be protected by the resistor layer instead of the resistor pattern, so without increasing the width dimension of the resistor pattern in the vicinity of the second connection part, It becomes possible to make the film thickness of the resistor pattern uniform in the sliding area of the slider.

  According to the present invention, it is possible to provide a resistance substrate, a slide type variable resistor, and a method for manufacturing a resistance substrate that can improve linearity characteristics and have a good yield during manufacturing.

It is a perspective view of the variable resistor to which the resistance substrate according to the first embodiment is applied. It is a disassembled perspective view of the variable resistor which concerns on 1st Embodiment. It is a disassembled perspective view of the variable resistor which concerns on 1st Embodiment. It is a top view of the resistance substrate according to the first embodiment. It is explanatory drawing of the manufacturing process of the resistance substrate which concerns on 1st Embodiment. It is sectional drawing of the resistance board | substrate which concerns on 1st Embodiment. It is explanatory drawing of the manufacturing process of the resistance board | substrate which concerns on 2nd Embodiment. It is sectional drawing of the resistance board | substrate which concerns on 2nd Embodiment. It is explanatory drawing of the manufacturing process of the resistance substrate which concerns on 3rd Embodiment. It is explanatory drawing of the manufacturing process of the resistance substrate which concerns on 4th Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The resistance substrate according to the present embodiment is suitably used for a slide operation type variable resistor. Further, in the following, the present invention will be described by being embodied on a resistor substrate, but the present invention is not limited to the resistor substrate, and is also applicable to a method for manufacturing the resistor substrate and a variable resistor using the resistor substrate. .

(First embodiment)
FIG. 1 is a perspective view of a slide type variable resistor (hereinafter simply referred to as “variable resistor”) 1 to which a resistance substrate according to a first embodiment of the present invention is applied. 2 and 3 are exploded perspective views of the variable resistor 1 according to the first embodiment. In the following, for convenience of explanation, the upper side shown in FIG. 1 is referred to as “the upper side of the variable resistor 1”, and the lower side shown in FIG. 1 is referred to as “the lower side of the variable resistor 1”. . In FIG. 2, the variable resistor 1 is shown from the upper side, and in FIG. 3, the variable resistor 1 is shown from the lower side.

  As shown in FIGS. 2 and 3, the variable resistor 1 according to the first embodiment includes an attachment member 2 for attaching the variable resistor 1 itself to an external device, and a resistance substrate 3 disposed on the attachment member 2. And a slider 4 that is slidably held on the resistance board 3, a slider 5 that is fixed to the lower surface of the slider 4, and the resistance board 3 and the slider 4 that are fixed to the attachment member 2 while being accommodated. And a case 6.

  The mounting member 2 is formed, for example, by performing blanking and bending on a metal plate material, and has a flat plate-shaped substrate holding portion 21 and a long shape connected to the side of the substrate holding portion 21. Part 22. On the outer edge portion of the substrate holding portion 21, there are an accommodation groove portion 21a disposed at a position corresponding to a positioning piece 62a of the case 6 described later, and an engagement groove portion 21b engaged with an engagement piece 62b of the case 6 described later. Is formed. Positioning openings are formed at predetermined positions of the substrate holding part 21 and the holding part 22.

  The resistance substrate 3 includes an insulating substrate 30 having a flat plate shape. The insulating substrate 30 is made of an insulating glass epoxy substrate and has a rectangular shape when viewed from above. On the side edge in the longitudinal direction of the insulating substrate 30, an accommodation groove 30 a disposed at a position corresponding to a positioning piece 62 a of the case 6 described later, and an engagement groove that engages with an engagement piece 62 b of the case 6 described later. 30b.

  On the upper surface of the insulating substrate 30, a resistor pattern 31, a current collector pattern 32, and a lead pattern 33 are provided along the longitudinal direction. The resistor pattern 31, the current collector pattern 32, and the lead pattern 33 are printed at predetermined positions on the insulating substrate 30 by screen printing, as will be described in detail later. The resistor pattern 31 is provided substantially at the center of the insulating substrate 30. The current collector pattern 32 and the lead pattern 33 are provided separately from the resistor pattern 31. The lead pattern 33 is provided on the side opposite to the current collector pattern 32 with the resistor pattern 31 interposed therebetween. The configuration of the resistor pattern 31, the current collector pattern 32, and the lead pattern 33 will be described later.

  A terminal member 34 is fixed to one end of the resistor pattern 31, the current collector pattern 32, and the lead pattern 33. The terminal member 34 is made of a metal material, and includes a plate-like portion 341 disposed on the lower side of the insulating substrate 30, a cylindrical portion (not shown) provided to project upward from the plate-like portion 341, and the tube. And a caulking portion 342 provided at the upper end of the shape portion. The terminal member 34 is composed of a plate-shaped portion 341 and a cylindrical portion in an initial state (state before processing). After the cylindrical portion is inserted into a through-hole 351 (see FIG. 4) formed in the insulating substrate 30 from below, a crimping portion 342 is formed by performing processing such as eyelet caulking on the tip portion, thereby insulating the cylindrical portion. Fixed to the substrate 30. At one end of the plate-like portion 341, an output terminal portion 341a is provided.

  The slider 4 is formed of, for example, an insulating resin material, and has a base 41 having a square shape when viewed from above, a columnar lever portion 42 provided substantially at the center of the upper surface of the base 41, and a lower surface of the base 41 Projecting piece 43 provided at the approximate center. The lever portion 42 is erected on a rectangular pedestal portion 42 a provided on the upper surface of the base portion 41. The protruding piece 43 is provided so as to protrude slightly downward from the lower surface of the base 41. A housing portion 44 that houses the slider 5 is provided around the protruding piece 43.

  The slider 5 is formed by performing blanking and bending on a metal plate material having elasticity, a base 51 having a generally flat plate shape, and a pair of sliding pieces 52a provided by folding back from the end of the base 51. , 52b. The base 51 has a generally rectangular shape when viewed from above, and an opening 51a is formed in a part thereof. The opening 51 a is provided with a size that can be engaged with the protruding piece 43 of the slider 4. The pair of sliding pieces 52a and 52b are provided to slightly extend downward. A sliding contact portion 53 is provided at each end of the pair of sliding pieces 52a and 52b. The pair of slidable contact portions 53 are arranged so as to be slidably contactable with the resistor pattern 31 and the current collector pattern 32 of the resistor substrate 3 in a state where the variable resistor 1 is assembled.

  The case 6 is formed by subjecting a metal plate material to blanking and bending, and an upper surface portion 61 that has a generally rectangular shape when viewed from above, and a pair of side surface portions that are provided to hang from the side edges of the upper surface portion 61. 62. An opening 61a is formed in the upper surface portion 61 along the longitudinal direction. In the center of each side surface portion 62, a positioning piece 62a extending from the side surface portion 62 is provided, and a pair of engaging pieces 62b are provided with the positioning piece 62a interposed therebetween. 2 and 3 show a state in which the engagement piece 62b is bent for convenience of explanation.

  When these constituent members are assembled, as shown in FIG. 1, the resistance substrate 3 is placed on the substrate holding portion 21 of the mounting member 2, and the slider 4 with the slider 5 fixed to the lower surface is placed on the resistance substrate 3. Placed on. The case 6 is covered from above, and the positioning piece 62a is accommodated in the accommodation groove portions 30a and 21a of the insulating substrate 30 and the substrate holding portion 21, while the engaging piece 62b is the engagement groove portion of the insulating substrate 30 and the substrate holding portion 21 It is fixed to the attachment member 2 by engaging with 30b, 21b. Thus, in the state integrated by the case 6, the base part 42a of the slider 4 is exposed from the opening part 61a of the case 6, and the lever part 42 protrudes from the upper surface part 61.

  Here, the structure of the resistor pattern 31, the current collector pattern 32, and the lead pattern 33 on the resistance substrate 3 included in the variable resistor 1 will be described. FIG. 4 is a top view of the resistance substrate 3 according to the first embodiment. In FIG. 4, for convenience of explanation, the terminal member 34 fixed to the resistance substrate 3 is omitted.

  In the resistance substrate 3 shown in FIG. 4, the resistor pattern 31 is made of a material containing carbon particles and a phenol resin as a binder resin. The current collector pattern 32 is made of a material containing silver particles and a phenol resin as a binder resin. Similarly to the current collector pattern 32, the lead pattern 33 is made of a material containing silver particles and a phenol resin as a binder resin. The current collector pattern 32 and the lead pattern 33 are covered with an overcoat layer made of the same material as that of the resistor pattern 31 in order to prevent silver particles contained therein and silver migration (silver migration). Yes.

  As shown in FIG. 4, the resistor pattern 31, the current collector pattern 32, and the lead pattern 33 are formed along the longitudinal direction of the insulating substrate 30 from one end (right end) to the other end (left end). It is provided over. Terminal attachment portions 35 (35a to 35c) to which the above-described terminal members 34 are attached are provided at one end portions (right end portions) of the resistor pattern 31, the current collector pattern 32, and the lead pattern 33, respectively. These terminal attachment portions 35 are formed with through holes 351 through which the cylindrical portions of the terminal members 34 are inserted.

  An insulating pattern 36 is provided between the surface of the insulating substrate 30 and the resistor pattern 31. The insulating pattern 36 is disposed at a part of the central portion of the resistor pattern 31. A part of the resistor pattern 31 laminated on the insulating pattern 36 constitutes a sliding area A1 of the slider 5. The sliding area A1 of the slider 5 is constituted by a certain area of the resistor pattern 31 disposed slightly inside the insulating pattern 36. That is, the slider 5 is configured to be slidable on the resistor pattern 31 in an inner region in the longitudinal direction (left-right direction) of the insulating pattern 36. The resistor pattern 31 is provided from one end side (right end side) to the other end side (left end side) of the insulating substrate 30 beyond the sliding area A1 of the slider 5.

  The resistor pattern 31 and the lead pattern 33 are connected by a second wiring portion 723b, which will be described later, provided at a position on the left side of the insulating pattern 36. Note that a resistor layer having a specific resistance (electric resistivity) smaller than that of the resistor pattern 31 is laminated on the second wiring portion 723b and the terminal attachment portion 35. Thus, since the resistor layer smaller than the specific resistance of the resistor pattern 31 is provided in the terminal attachment portion 35, a low resistance value is provided between the terminal member 34 attached by eyelet caulking or the like and the terminal attachment portion 35. It can be stably connected electrically.

  In the resistance substrate 3 configured as described above, the space between the terminal member 34 disposed on the terminal mounting portion 35 a on the resistor pattern 31 and the terminal member 34 disposed on the terminal mounting portion 35 c on the lead pattern 33 is between. By applying a voltage to the slider 5 and sliding the slider 5 on the resistor pattern 31 and the current collector pattern 32, an output voltage that changes in accordance with the position of the slider 5 is changed. It can be obtained from the terminal member 34 arranged in the upper terminal mounting portion 35b.

  Next, a method for manufacturing the resistance substrate 3 according to the first embodiment will be described with reference to FIGS. FIG. 5 is an explanatory diagram of the manufacturing process of the resistance substrate 3 according to the first embodiment. In the following description, different symbols are used as appropriate even in the configuration common to the resistor substrate 3 described above. In FIG. 5, the substrate base material 7 capable of acquiring six resistance substrates 3 will be described as an example. However, the number of acquisition is not limited to this and can be changed as appropriate. The substrate base material 7 can take an arbitrary configuration on the assumption that at least a plurality of insulating substrates 30 for the resistance substrate 3 can be obtained in the longitudinal direction of the insulating substrate 30.

  As shown in FIG. 5, in the method of manufacturing the resistance substrate 3 according to the first embodiment, an electrode printing process (FIG. 5A) for printing an electrode pattern and an undercoat printing process (FIG. 5B) for printing an insulating pattern. ), A resistance printing step (FIG. 5C) for printing the resistor pattern, a resistor layer printing step (FIG. 5D) for printing the resistor layer, and a substrate division for dividing the substrate base material 7 into a plurality of resistance substrates 3 An outline processing step (FIG. 5E) as a step is executed. In these electrode printing process, resistance printing process, and resistor layer printing process, screen printing is used. For example, in these electrode printing process, resistance printing process, and resistor layer printing process, screen printing is performed from one end (right end) to the other end (left end) of the substrate base material 7 shown in FIG. 5A. Is called. The screen printing direction is not limited to this, and screen printing may be performed from the other end (left end) of the substrate base material 7 toward one end (right end).

  In the electrode printing process, as shown in FIG. 5A, a plurality (six in FIG. 5) of electrode patterns 700 are printed at predetermined positions on the substrate base material 7 while being separated from each other. More specifically, a conductive paste in which silver particles are mixed in a binder resin (for example, phenol resin) solution dissolved in a solvent such as carbitol is screen-printed in the shape of the electrode pattern 700. Then, heat treatment is performed on the printed conductive paste to obtain a solidified electrode pattern 700. In addition, the heat processing in each process including an electrode printing process is performed by putting the board | substrate base material 7 in a baking furnace, for example.

  The electrode pattern 700 includes a first electrode pattern 710 that conducts to one end (right end) of the resistor pattern 31 and a second electrode pattern 720 that conducts to the other end (left end) of the resistor pattern 31 described above. And the third electrode pattern 730 constituting the current collector pattern 32 described above. The first electrode pattern 710 and the second electrode pattern 720 are printed and separated from each other in the longitudinal direction of the insulating substrate 30 obtained from the substrate base material 7 (that is, the left-right direction shown in FIG. 5). In the present embodiment, three such electrode patterns 700 are arranged in the screen printing direction, while two electrode patterns 700 are arranged in a direction orthogonal to the screen printing direction.

  The first electrode pattern 710 has a first terminal arrangement corresponding to a portion where the first connecting portion 711 electrically connected to one end portion (right end portion) of the resistor pattern 31 described above and the terminal member 34 described above are attached. Part 712. The 2nd electrode pattern 720 is the 2nd terminal corresponding to the part to which the 2nd connection part 721 electrically connected to the other end part (left end part) of the above-mentioned resistor pattern 31 and the above-mentioned terminal member 34 is attached. It has the arrangement | positioning part 722, and the wiring part 723 provided between the 2nd connection part 721 and the 2nd terminal arrangement | positioning part 722. FIG. The first connection portion 711 and the second connection portion 721 are disposed to face each other while being separated in the longitudinal direction of the insulating substrate 30. The 3rd electrode pattern 730 has the 3rd terminal arrangement part 731 corresponding to the portion where the above-mentioned terminal member 34 is attached.

  The wiring part 723 constituting the second electrode pattern 720 includes a first wiring part 723a arranged in parallel to the resistor pattern 31 and a first wiring part 723a located between the first wiring part 723a and the second connection part 721. 2 wiring parts 723b, and generally has an L shape. The first wiring portion 723a is provided to extend along the screen printing direction. On the other hand, the second wiring portion 723b is provided to extend along a direction intersecting (orthogonal) with the screen printing direction.

  In the undercoat printing process, as shown in FIG. 5B, the substrate is arranged such that both ends overlap the first connection portion 711 of the first electrode pattern 710 and the second connection portion 721 of the second electrode pattern 720. An insulating pattern 740 is printed on the base material 7. More specifically, for example, a resin paste in which an epoxy resin is dissolved in a solvent such as carbitol is screen-printed in the shape of the insulating pattern 740. And the heat processing is performed with respect to the resin paste after printing, and the solidified insulating pattern 740 is obtained.

  In this way, in the undercoat printing process, since the insulating pattern 740 is provided between the substrate base material 7 (insulating substrate 30) and the resistor pattern 750 prior to the resistance printing step, the substrate base material 7 (insulating substrate 30) is provided. ) Can be prevented from affecting the resistor pattern 750, and the sliding operation of the slider 5 with respect to the resistor pattern 750 can be stabilized.

  In the resistance printing step, as shown in FIG. 5C, the resistor pattern 750 is continuously stacked on the insulating pattern 740 and on the first connection portion 711 and the second connection portion 721 exposed from the insulation pattern 740. And printed. In other words, in the resistance printing process, the insulating substrate obtained from the substrate base material 7 so as to pass over the insulating pattern 740, the first connection portion 711, and the second connection portion 721 disposed on the plurality of insulating substrates 30. A resistor pattern 750 is continuously printed along the longitudinal direction of 30 (ie, the left-right direction shown in FIG. 5). More specifically, a carbon paste mixed with carbon particles in a binder resin solution such as a phenol resin dissolved in a solvent such as carbitol is screen-printed in the shape of the resistor pattern 750. Then, the carbon paste after printing is subjected to heat treatment to obtain a solidified resistor pattern 750.

  In the resistance printing step, an overcoat layer made of the same material as the resistor pattern 750 is continuously printed on the first wiring part 723a and the third electrode pattern 730 of the second electrode pattern 720. Thus, since the 1st wiring part 723a and silver electrode 730 which contain silver particles in a constituent material are coat | covered with a carbon pattern, sulfidation and silver migration (silver migration) of silver particles can be prevented. In the following, for convenience of explanation, these overcoat layers will be described as part of the resistor pattern 750.

  In the resistance printing process, the first terminal arrangement portion 712 of the first electrode pattern 710, the second terminal arrangement portion 722 of the second electrode pattern 720, and the third terminal arrangement portion 731 of the third electrode pattern 730 are covered. A resistor pattern 750 is formed on the substrate. A part of the resistor pattern 750 that covers the first terminal arrangement part 712, the second terminal arrangement part 722, and the third terminal arrangement part 731 is a terminal attachment part 751 corresponding to a part (location) to which the terminal member 34 is attached. Composed. The resistor pattern 750 is formed to have substantially the same width in a region excluding the first terminal arrangement portion 712, the second terminal arrangement portion 722, and the third terminal arrangement portion 731.

  As described above, in the method of manufacturing the resistance substrate 3 according to the first embodiment, since the resistor pattern 750 is formed to have substantially the same width in the region excluding the terminal mounting portion 751, the change in the width dimension is caused. Accordingly, it is possible to suppress the situation where the film thickness of the resistor pattern 750 becomes non-uniform, so that the film thickness of the resistor pattern 750 can be made more uniform. In this case, a part of the insulating pattern 740 is exposed from the resistor pattern 750. In addition, a part of the second wiring part 723 b of the second electrode pattern 720 is exposed from the resistor pattern 750.

  In the resistor layer printing step, as shown in FIG. 5D, the first terminal arrangement portion 712, the second terminal arrangement portion 722, the third terminal arrangement portion 731 and the second wiring portion 723b exposed from the resistor pattern 750 are provided. The resistor layer 760 is printed and formed so as to be laminated at a position corresponding to a part of the layer. More specifically, a carbon paste mixed with carbon particles in a binder resin solution such as a phenol resin dissolved in a solvent such as carbitol is screen-printed in the shape of the resistor layer 760. Then, the carbon paste after printing is subjected to heat treatment to obtain a solidified resistor layer 760. In addition, the ratio of the carbon particles in the carbon paste forming the resistor layer 760 is mixed higher than the ratio of the carbon particles in the carbon paste forming the resistor pattern 750. Therefore, the specific resistance of the resistor layer 760 is smaller than the specific resistance of the resistor pattern 750.

  The resistor layer 760 includes a first resistor layer 760 a stacked on the first terminal arrangement portion 712, the second terminal arrangement portion 722, and the third terminal arrangement portion 731, and a second wiring portion 723 b exposed from the resistor pattern 750. The second resistor layer 760b is laminated at a position corresponding to a part of the second resistor layer 760b. Since the second resistor layer 760b is laminated at a position corresponding to a part of the second wiring part 723b exposed from the resistor pattern 750, the second electrode pattern 720 is not exposed on the surface of the resistor substrate 3. Further, the second resistor layer 760 b is stacked not only on a part of the second wiring part 723 b exposed from the resistor pattern 750 but also on the second connection part 721. For this reason, the resistor pattern 750 and the resistor layer 760 are stacked on the second connection portion 721.

  As described above, in the method of manufacturing the resistance substrate 3 according to the first embodiment, at least a part of the wiring part 723 on the second connection part 721 side is covered with the resistor layer 760 and on the second connection part. Since the resistor pattern 750 and the resistor layer 760 are stacked, the wiring portion 723 in the vicinity of the second connection portion 721 is not the resistor pattern 750 even when the electrode pattern 700 includes silver particles that are sulfided. Since it can be protected by the resistor layer 760, the film thickness of the resistor pattern 750 in the sliding region A1 can be made uniform without increasing the width of the resistor pattern 750 in the vicinity of the second connection portion 721.

  In the above description, the case where the second resistor layer 760b is stacked on the resistor pattern 750 in the second connection portion 721 has been described. However, the stacking order is limited to this. It is not a thing and it can change suitably. For example, the resistor pattern 750 may be laminated on the second resistor layer 760b.

  In the method for manufacturing the resistance substrate 3 according to the first embodiment, the second resistor layer 760b stacked on the second wiring portion 723b is replaced with the first resistor stacked on the terminal mounting portion 751. Since it can be formed of the same material as the layer 760a, the second wiring portion 723b can be protected by the resistor layer 760 without providing a manufacturing process separately.

  In the outer shape processing step, as shown in FIG. 5E, a resistance substrate 770 is formed by dividing the substrate base material 7 by blank processing or the like by pressing with respect to the substrate base material 7 that has been completed up to the resistor layer printing step. Is done. In this outer shape processing step, the substrate base material 7 is divided and the resistance body 770 is moved beyond the sliding region A1 where the slider 5 slides from one end (right end) in the longitudinal direction to the other end (left end). A resistance substrate 770 on which the pattern 750 is arranged is obtained. In this outer shape processing step, a through hole 771 is formed in the terminal attachment portion 751 through which the cylindrical portion of the terminal member 34 is inserted. The resistance substrate 770 acquired in the outer shape processing step corresponds to the resistance substrate 3 shown in FIG.

  FIG. 6 is an explanatory diagram of a cross section of the resistance substrate 770 (3) according to the first embodiment. FIG. 6 shows a side cross section passing through the resistor pattern 750 of the resistor substrate 770. As shown in FIG. 6, in the resistance substrate 770, a first connection portion 711 and a first terminal arrangement portion 712 constituting the first electrode pattern 710 are provided at the right end portion of the upper surface (front surface) of the insulating substrate 30. . On the other hand, in the resistance substrate 770, a second connection portion 721 configuring the second electrode pattern 720 is provided at a position slightly inside the left end portion of the upper surface (front surface) of the insulating substrate 30.

  In the cross section passing through the resistor pattern 750, the first electrode pattern 710 has a first connection portion 711 and a first terminal arrangement portion 712, as shown in FIG. Similarly, the second electrode pattern 720 includes a second connection portion 721 and a second wiring portion 723b as shown in FIG. In FIG. 6, for convenience of explanation, broken lines are shown at the boundary between the first connection portion 711 and the first terminal arrangement portion 712 and at the boundary portion between the second connection portion 721 and the second wiring portion 723 b. Show. The region of the first connection part 711 in the first electrode pattern 710 and the region of the second connection part 721 in the second electrode pattern 720 can be changed as appropriate on the assumption that the resistor pattern 750 is stacked. is there.

  In addition, an insulating pattern 740 is provided on the upper surface (front surface) of the insulating substrate 30 so as to connect the first connecting portion 711 and the second connecting portion 721. In a state where the insulating pattern 740 is laminated, a part of the first connection portion 711 and the second connection portion 721 is exposed from the insulating pattern 740. A resistor pattern 750 is stacked on the first connection portion 711 and the second connection portion 721 and the insulation pattern 740 exposed from the insulation pattern 740. The resistor pattern 750 is continuously provided from one end (right end) to the other end (left end) of the insulating substrate 30.

  A first resistor layer 760a is provided on the upper side of the first electrode pattern 710 (the first connection portion 711 and the first terminal arrangement portion 712). A second resistor layer 760b is provided on the upper side of the second wiring part 723b constituting the second electrode pattern 720. Further, a through hole 771 is formed in the first terminal arrangement portion 712 constituting the first electrode pattern 710. The through hole 771 is formed to penetrate the first resistor layer 760 a, the resistor pattern 750, and the insulating substrate 30 that are arranged corresponding to the first terminal arrangement portion 712.

  In the resistance substrate 770 (3) thus provided, as shown in FIG. 6, the sliding area A1 in which the slider 5 slides is the resistor pattern 750 arranged on the insulating pattern 740. The insulating pattern 740 is disposed slightly inside the end portion. More specifically, in the resistor pattern 750 laminated on the insulating pattern 740, the sliding region A1 is not affected by the first electrode pattern 710 and the second electrode pattern 720 and the flatness is ensured. Is arranged.

  Through these series of manufacturing steps, the resistance substrate 3 according to the first embodiment is formed. In the resistance substrate 3 manufactured in the manufacturing process according to the first embodiment, the resistor pattern 31 is formed beyond the sliding region A1 from one end to the other end in the longitudinal direction of the insulating substrate 30. Even when the resistor pattern 31 is screen-printed along the longitudinal direction, a situation in which the frictional resistance of the printing mask fluctuates in the sliding region A1 can be suppressed, so that the film thickness of the resistor pattern 31 in the sliding region A1 is substantially equal. Can be formed, and linearity characteristics can be improved. As the linearity characteristics are improved, the production of the resistance substrate 3 that does not satisfy a certain reference value can be suppressed, so that the yield during production can also be improved. As a result, it is possible to provide the resistance substrate 3 that can improve the linearity characteristic and also has a good yield during manufacture.

  In the resistor substrate 3 according to the first embodiment, since the overcoat layer made of the same material as the resistor pattern 750 is provided on both sides of the resistor pattern 750, the resistor pattern 750, the overcoat layer, Can be formed by a common printing process. Further, since the overcoat layer is provided on both sides of the resistor pattern 750, the operation of the squeegee during screen printing can be stabilized as compared with the case where the overcoat layer is provided only on one side of the resistor pattern 750. It is possible to suppress the influence on the film thickness of the resistor pattern 750.

  Furthermore, in the resistance substrate 3 according to the first embodiment, the insulating substrate 30 is obtained by being divided from the substrate base material 7 on which the resistor patterns 750 on the adjacent insulating substrates 30 are continuously printed. . In this case, since the resistor patterns 750 can be continuously provided on the plurality of insulating substrates 30, the number of times that the frictional resistance of the printing mask fluctuates in units of the substrate base material 7 can be reduced. It becomes possible to ensure the uniformity of the film thickness and improve the linearity characteristics.

(Second Embodiment)
The variable resistor 1 according to the second embodiment is different from the variable resistor 1 according to the first embodiment only in the configuration of the resistance substrate 3. Hereinafter, the resistance substrate 3 according to the second embodiment will be described focusing on differences from the resistance substrate 3 according to the first embodiment. In the following description, the same reference numerals are assigned to configurations common to the resistance substrate 3 according to the first embodiment, and the description thereof is omitted.

  FIG. 7 is an explanatory diagram of the manufacturing process of the resistance substrate 3 according to the second embodiment. As shown in FIG. 7, in the manufacturing process of the resistance substrate 3 according to the second embodiment, there is no undercoat printing process, and the shape of the resistor pattern 750 formed in the resistance printing process is as follows. The difference is that the manufacturing process of the resistance substrate 3 according to the first embodiment is different. The electrode printing process, the resistor layer printing process, and the outer shape processing process are the same as the manufacturing process of the resistance substrate 3 according to the first embodiment.

  In the resistance printing process of the resistance substrate 3 according to the second embodiment, as shown in FIG. 7B, terminal attachment portions corresponding to the first terminal arrangement portion 712, the second terminal arrangement portion 722, and the third terminal arrangement portion 731. Resistor patterns 750 are formed in substantially the same width in the entire region including 751. Here, the resistor pattern 750 is set to have the same width as the first connection portion 711 and the second connection portion 721. For this reason, a part of the first terminal arrangement portion 712, the second terminal arrangement portion 722, and the third terminal arrangement portion 731 is exposed from the resistor pattern 750. These exposed portions are covered with the resistor layer 760a laminated in the resistor layer printing step (see FIG. 7C). Then, the resistance substrate 770 is formed by dividing the substrate base material 7 by the outer shape processing step.

  FIG. 8 is an explanatory diagram of a cross section of the resistance substrate 770 (3) according to the second embodiment. FIG. 8 shows a side cross section that passes through the resistor pattern 750 of the resistor substrate 770. In FIG. 8, the same reference numerals are assigned to components common to the resistor substrate 770 (3) shown in FIG.

  As shown in FIG. 8, in the resistive substrate 770 (3) according to the second embodiment, since there is no undercoat printing process, the resistive substrate shown in FIG. 6 is not provided with an insulating pattern 740. This is different from 770 (3). That is, in the resistance substrate 770 (3) according to the second embodiment, the resistor pattern 750 is provided on the insulating substrate 30 provided with the first electrode pattern 710 and the second electrode pattern 720 without the insulating pattern 740 interposed. Are stacked.

  Through these series of manufacturing steps, the resistance substrate 3 according to the second embodiment is formed. Also in the resistance substrate 3 manufactured in the manufacturing process according to the second embodiment, the resistor pattern 31 (750) is formed beyond the sliding region A1 from one end to the other end in the longitudinal direction of the insulating substrate 30. Therefore, even when the resistor pattern 31 is screen-printed along the longitudinal direction, the situation in which the frictional resistance of the printing mask fluctuates in the sliding area A1 can be suppressed, so the film thickness of the resistor pattern 31 in the sliding area A1. Can be formed substantially equal to each other, the linearity characteristics can be improved, and the manufacturing yield can also be improved.

  In particular, in the method of manufacturing the resistance substrate 3 according to the second embodiment, in the resistance printing step, the resistor pattern 750 is formed to have substantially the same width from one end to the other end of the insulating substrate 30 including the terminal mounting portion 751. As a result, it is possible to reliably prevent a situation in which the film thickness of the resistor pattern 750 becomes non-uniform with the change in the width dimension, so that the uniformity of the film thickness of the resistor pattern 750 can be effectively increased. It becomes.

(Third embodiment)
The variable resistor 1 according to the third embodiment is different from the variable resistor 1 according to the first embodiment only in the configuration of the resistance substrate 3. Hereinafter, the resistance substrate 3 according to the third embodiment will be described focusing on differences from the resistance substrate 3 according to the first embodiment. In the following description, the same reference numerals are assigned to configurations common to the resistance substrate 3 according to the first embodiment, and the description thereof is omitted.

  FIG. 9 is an explanatory diagram of the manufacturing process of the resistance substrate 3 according to the third embodiment. As shown in FIG. 9, in the manufacturing process of the resistance substrate 3 according to the third embodiment, the first embodiment is different in that the shape of the resistor pattern 750 formed in the resistance printing process is different. This is different from the manufacturing process of the resistance substrate 3 according to FIG. The electrode printing process, the undercoat printing process, the resistor layer printing process, and the outer shape processing process are the same as the manufacturing process of the resistance substrate 3 according to the first embodiment.

  In the resistance printing process of the resistance substrate 3 according to the third embodiment, as shown in FIG. 9C, only the resistor pattern 750a passing through the first connection portion 711 and the second connection portion 721 is continuously printed. On the other hand, the resistor patterns 750b and 750c corresponding to the first wiring part 723a and the third electrode pattern 730 of the second electrode pattern 720 are printed and formed without being continuous. That is, in the resistance printing process, the resistor pattern 750b corresponding to the first wiring part 723a is printed and formed only on a portion where the first wiring part 723a exists. Similarly, the resistor pattern 750c corresponding to the third electrode pattern 730 is printed only on a portion where the third electrode pattern 730 exists. Then, after the resistor layer 760 is printed and formed in the resistor layer printing step, the resistor substrate 770 is formed by dividing the substrate base material 7 in the outer shape processing step. Note that the cross section passing through the resistor pattern 750a in the resistor substrate 770 (3) according to the third embodiment is the same as the cross section of the resistor substrate 770 (3) shown in FIG.

  Through these series of manufacturing steps, the resistance substrate 3 according to the third embodiment is formed. Also in the resistance substrate 3 manufactured in the manufacturing process according to the third embodiment, the resistor pattern 31 (750a) is formed beyond the sliding region A1 from one end to the other end in the longitudinal direction of the insulating substrate 30. Therefore, even when the resistor pattern 31 is screen-printed along the longitudinal direction, the situation in which the frictional resistance of the printing mask fluctuates in the sliding area A1 can be suppressed, so the film thickness of the resistor pattern 31 in the sliding area A1. Can be formed substantially equal to each other, the linearity characteristics can be improved, and the manufacturing yield can also be improved.

(Fourth embodiment)
The variable resistor 1 according to the fourth embodiment is different from the variable resistor 1 according to the first embodiment only in the configuration of the resistance substrate 3. Hereinafter, the resistance substrate 3 according to the fourth embodiment will be described focusing on differences from the resistance substrate 3 according to the first embodiment. In the following description, the same reference numerals are assigned to configurations common to the resistance substrate 3 according to the first embodiment, and the description thereof is omitted.

  FIG. 10 is an explanatory diagram of the manufacturing process of the resistance substrate 3 according to the fourth embodiment. As shown in FIG. 10, in the manufacturing process of the resistance substrate 3 according to the fourth embodiment, there is no undercoat printing process, and the shape of the resistor pattern 750 formed in the resistance printing process is different. This is different from the manufacturing process of the resistor substrate 3 according to the first embodiment in that the resistor layer 760 formed in the resistor layer printing process is different in point. The electrode printing process and the outer shape processing process are the same as the manufacturing process of the resistance substrate 3 according to the first embodiment.

  In the resistance printing process of the resistance substrate 3 according to the fourth embodiment, as shown in FIG. 10B, the first connection portion 711 of the first electrode pattern 710 and the second connection portion 721 of the second electrode pattern 720 are provided. Only the resistor pattern 750d passing through and the resistor pattern 750e passing through the third electrode pattern 730 are continuously printed and formed, while the resistor pattern 750 corresponding to the first wiring portion 723a and the second terminal arrangement portion 722 is formed. The print is not formed. Therefore, the first wiring part 723a and the second terminal arrangement part 722 are exposed from the resistor pattern 750. In addition, this exposed part is covered by laminating the resistor layer 760c in the resistor layer printing step. Then, the resistance substrate 770 is formed by dividing the substrate base material 7 by the outer shape processing step. Note that the cross section passing through the resistor pattern 750d in the resistor substrate 770 (3) according to the fourth embodiment is the same as that of the resistor substrate 770 (3) shown in FIG.

  Through these series of manufacturing steps, the resistance substrate 3 according to the fourth embodiment is formed. Also in the resistance substrate 3 manufactured in the manufacturing process according to the fourth embodiment, the resistor pattern 31 (750d) is formed beyond the sliding region A1 from one end to the other end in the longitudinal direction of the insulating substrate 30. Therefore, even when the resistor pattern 31 is screen-printed along the longitudinal direction, the situation in which the frictional resistance of the printing mask fluctuates in the sliding area A1 can be suppressed, so the film thickness of the resistor pattern 31 in the sliding area A1. Can be formed substantially equal to each other, the linearity characteristics can be improved, and the manufacturing yield can also be improved.

  In addition, this invention is not limited to the said embodiment, It can implement by changing suitably. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited thereto, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above embodiment, the resistor pattern 31 (750) is disposed between the current collector pattern 32 (third electrode pattern 730) and the lead pattern 33 (first wiring portion 723a). However, the arrangement order of these patterns is not limited to this. That is, the order in which the resistor patterns 31 are not arranged in the center may be used.

DESCRIPTION OF SYMBOLS 1 Variable resistor 2 Mounting member 21 Board | substrate holding part 22 Holding part 3 Resistance board 30 Insulating board 31 Resistor pattern 32 Current collector pattern 33 Lead pattern 34 Terminal member 35, 35a-35c Terminal mounting part 36 Insulating pattern 37 Connection part 4 Slider 5 Slider 52a, 52b Sliding piece 53 Sliding contact part 6 Case 61 Upper surface part 61a Opening part 7 Substrate base material 700 Electrode pattern 710 First electrode pattern 711 First connection part 712 First terminal arrangement part 720 Second electrode Pattern 721 2nd connection part 722 2nd terminal arrangement part 723 Wiring part 723a 1st wiring part 723b 2nd wiring part 730 3rd electrode pattern 731 3rd terminal arrangement part 740 Insulation pattern 750, 750a-750e Resistor pattern 751 Terminal attachment Part 760 resistor layer 760a first resistor layer 760 b Second resistor layer 770 Resistance substrate 771 Through hole

Claims (12)

A resistor pattern on which the slider linearly slides on the insulating substrate and a current collector pattern are separated and printed by screen printing , and the first electrode is electrically connected to one end of the resistor pattern. In a resistance substrate for a slide-type variable resistor in which a pattern and a second electrode pattern that conducts to the other end of the resistor pattern are formed, the resistor pattern extends from one end to the other end in the longitudinal direction of the insulating substrate. A resistance substrate characterized by being formed beyond a sliding area where the slider slides.   The first electrode pattern includes a first connection portion connected to one end portion of the resistor pattern, and a first terminal arrangement portion corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached. The second electrode pattern includes a second connection portion connected to the other end portion of the resistor pattern, and a second terminal corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached. An arrangement portion, and a wiring portion provided between the second connection portion and the second terminal arrangement portion, and the first connection portion and the second connection portion are arranged in a longitudinal direction of the insulating substrate. The resistor patterns are stacked on the first connection part and the second connection part, and at least a part of the wiring part on the second connection part side is a resistor layer. Covered and smelled on the second connection , Resistor board according to claim 1, wherein the said resistor pattern and the resistor layer are stacked.   One end portion of the resistor pattern is provided on the first terminal arrangement portion, and has a terminal attachment portion corresponding to a portion to which a terminal member is attached, and the resistor layer is provided on the terminal attachment portion. 3. The resistance substrate according to claim 2, wherein the resistance substrate is laminated, and a resistivity of the resistor layer is smaller than a resistivity of the resistor pattern.   The wiring portion includes a first wiring portion arranged in parallel with the resistor pattern, and a second wiring portion located between the first wiring portion and the second connection portion, and the second wiring 4. The resistance substrate according to claim 3, wherein the resistor layer is laminated on the part.   5. The resistance substrate according to claim 3, wherein the resistor patterns are formed to have substantially the same width at least in a region excluding the terminal attachment portion.   6. The resistance substrate according to claim 5, wherein the resistor pattern is formed to have substantially the same width from one end to the other end of the insulating substrate including the terminal mounting portion.   The resistor pattern is provided between the current collector pattern and the first wiring portion, and is made of the same material as the resistor pattern on the current collector pattern and on the first wiring portion. The resistance substrate according to claim 4, wherein overcoat layers are respectively laminated.   An insulating pattern provided on the insulating substrate is provided so as to connect the first connecting portion and the second connecting portion, and the resistor pattern is exposed on the insulating pattern and from the insulating pattern. The resistance substrate according to claim 2, wherein the resistance substrate is laminated on the first connection portion and the second connection portion.   The said insulating substrate is obtained by dividing | segmenting from the board | substrate base material by which the said resistor pattern on the said insulating substrate adjacent in a longitudinal direction was continuously printed and formed. A resistance substrate according to any one of the above.   A resistor board according to any one of claims 1 to 9, and a resistor pattern printed on an insulating substrate included in the resistor board and a slider that slides on a current collector pattern. This is a slide type variable resistor. A resistor pattern on which the slider linearly slides on the insulating substrate and a current collector pattern are separated and printed by screen printing , and the first electrode is electrically connected to one end of the resistor pattern. In the method of manufacturing a resistance substrate for a slide-type variable resistor in which a pattern and a second electrode pattern that conducts to the other end of the resistor pattern are formed,
An electrode printing step of printing and forming the first electrode pattern and the second electrode pattern spaced apart in the longitudinal direction of the insulating substrate on a substrate base material in which a plurality of the insulating substrates can be obtained in the longitudinal direction of the insulating substrate; A resistance printing step of continuously printing the resistor pattern along the longitudinal direction of the insulating substrate so as to pass over the first electrode pattern and the second electrode pattern disposed on the plurality of insulating substrates; A substrate dividing step of dividing the substrate base material to obtain a resistance substrate in which the resistor pattern is arranged beyond a sliding region where the slider slides from one end to the other end in the longitudinal direction of the insulating substrate. And a method of manufacturing a resistance substrate for a slide type variable resistor. Prior to the substrate dividing step, further comprising a resistor layer printing step of printing a resistor layer having a smaller specific resistance than the resistor pattern,
The first electrode pattern includes a first connection portion connected to one end portion of the resistor pattern, and a first terminal arrangement portion corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached. The second electrode pattern includes a second connection portion connected to the other end portion of the resistor pattern, and a second terminal corresponding to a portion provided at one end portion of the insulating substrate and to which a terminal member is attached. An arrangement portion, and a wiring portion provided between the second connection portion and the second terminal arrangement portion,
In the electrode printing step, the first connection portion and the second connection portion are arranged to face each other in a state of being separated in the longitudinal direction of the insulating substrate, and in the resistance printing step, the first connection portion and the second connection portion are arranged. The resistor pattern is laminated on the second connection portion, and the resistor pattern and the resistor layer are laminated on the second connection portion in the resistor layer printing step. 12. The method of manufacturing a resistance substrate for a slide type variable resistor according to claim 11, wherein the resistor layer is printed and formed at least on a part of the second connection portion side.

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