JP5179166B2 - Deposit removal tool for contact pins - Google Patents

Description

  The present invention relates to a contact pin deposit removing tool for removing deposits attached to contact pins of a continuity testing device.

  Conventionally, continuity testing devices such as various testers have been used for continuity testing of electronic devices such as wiring boards and semiconductor devices on which various electronic components are mounted. As such a continuity testing device, there is a device that inspects continuity between electrodes by bringing a contact pin (probe pin) into contact with a plurality of electrodes on a wiring board or the like.

  When such a continuity test equipment is used to repeatedly conduct continuity tests on wiring boards, dirt and foreign matter adhere to the surface of the contact pins, reducing the continuity of the contact pins and making accurate continuity tests possible. It will disappear.

  In view of this, the contact pin in such a continuity testing device is periodically pressed against an adhesive resin layer (adhesive layer) or the like to remove deposits attached to the contact pin (Patent Literature). 1 and 2).

To remove contact pin deposits with such an adhesive layer, a contact pin deposit remover (hereinafter referred to as a remover) provided with an adhesive layer on an appropriate substrate is used.
JP 2002-214271 A Japanese Patent Laying-Open No. 2005-091213

  When the removal of contact pin deposits is actually repeated using the removal tool as described above, the adhesive layer is deformed to some extent when the contact pin is pressed against the adhesive layer, and at least the tip portion of the contact pin is buried. Of course, it is necessary to bring the deposits on the surface into contact with the adhesive layer, and therefore, it is necessary to have an appropriate flexibility. Moreover, in order to repeatedly remove the deposits using the removing tool, moderate durability is required so that damage does not occur even if the contact pin is repeatedly pressed against the adhesive layer.

  The present invention has been made in view of the above points, and imparts appropriate flexibility and durability to the adhesive layer of the deposit removing tool for contact pins, and is excellent in the ability to remove deposits from the contact pins. It is another object of the present invention to provide a contact pin deposit removing tool that can withstand repeated use.

In the contact pin deposit removing tool according to claim 1, the adhesive layer 3 is provided on the surface of the substrate 2, and the deposit 8 on the contact pin 4 is removed by bringing the adhesive layer 3 into contact with the contact pin 4. It is the deposit | attachment removal tool 1, Comprising: The 1st adhesion layer 3a formed from the thermosetting silicone resin with which the said adhesion layer 3 was directly contacted to the surface of the base material 2, and said 1st adhesion layer The first adhesive layer 3a is more adhesive than the second adhesive layer 3b . The second adhesive layer 3b is formed of a thermosetting silicone resin and is laminated on the 3a. And the thickness of the first pressure-sensitive adhesive layer 3a is larger than the thickness of the second pressure-sensitive adhesive layer 3b, and the thickness of the first pressure-sensitive adhesive layer 3a is 50 to 1000 μm. the thickness of the adhesive layer 3b and the said 1~500μm der Rukoto To do.

The invention according to claim 2 is the deposit removing tool 1 in which the adhesive layer 3 is provided on the surface of the base material 2 and the deposit on the contact pin 4 is removed by bringing the adhesive layer 3 into contact with the contact pin 4. The adhesive layer 3 is provided by laminating the first adhesive layer 3a made of a thermosetting silicone resin, which is in direct contact with the surface of the substrate 2, and the first adhesive layer 3a. was formed from the second adhesive layer 3b formed of a thermosetting silicone resin, said first adhesive layer 3a, the second tack and flexibility than the adhesive layer 3b is rather high, The thickness of the second adhesive layer 3b is thicker than the thickness of the first adhesive layer 3a, the thickness of the second adhesive layer 3b is 50 to 1000 μm, and the thickness of the first adhesive layer 3a is It is 1-500 micrometers .

The invention according to claim 3 is the deposit removing tool 1 in which the adhesive layer 3 is provided on the surface of the base material 2, and the deposit on the contact pin 4 is removed by bringing the adhesive layer 3 into contact with the contact pin 4. The pressure-sensitive adhesive layer 3 is provided by being laminated on the first pressure-sensitive adhesive layer 3a and the first pressure-sensitive adhesive layer 3a formed of a thermosetting silicone resin that is in direct contact with the surface of the base material. , is formed and a second adhesive layer 3b formed of a thermosetting silicone resin, said second adhesive layer 3b is rather high tack and flexibility than the first adhesive layer 3a, the The thickness of the 1st adhesion layer 3a is thicker than the thickness of said 2nd adhesion layer 3b, the thickness of said 1st adhesion layer 3a is 50-1000 micrometers, and the thickness of said 2nd adhesion layer 3b is 1. It is -500 micrometers .

The invention according to claim 4 is the deposit removing tool 1 in which the adhesive layer 3 is provided on the surface of the substrate 2 and the deposit on the contact pin 4 is removed by bringing the adhesive layer 3 into contact with the contact pin 4. The pressure-sensitive adhesive layer 3 is provided by being laminated on the first pressure-sensitive adhesive layer 3a and the first pressure-sensitive adhesive layer 3a formed of a thermosetting silicone resin that is in direct contact with the surface of the base material. The second adhesive layer 3b is formed from a thermosetting silicone resin, and the second adhesive layer 3b has higher adhesiveness and flexibility than the first adhesive layer 3a . The thickness of the second adhesive layer 3b is thicker than the thickness of the first adhesive layer 3a, the thickness of the second adhesive layer 3b is 50 to 1000 μm, and the thickness of the first adhesive layer 3a is 1 to It is characterized by being 500 μm.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, a solvent layer 5 in which a solvent is stored is formed on an upper layer of the adhesive layer 3.

  According to the present invention, the adhesive layer is formed of the first adhesive layer and the second adhesive layer, thereby improving the flexibility of the entire adhesive layer and improving the removal performance of deposits from the contact pin by the adhesive layer. It is possible to reduce the impact applied to the adhesive layer when the contact pin is pressed against the adhesive layer, and to improve the durability of the contact pin deposit removing tool.

  In particular, when the first adhesive layer is higher in flexibility and adhesiveness than the second adhesive layer, the first adhesive layer is interposed between the second adhesive layer and the substrate. The second adhesive layer and the base material are joined with high joint strength through the first adhesive layer, and high adhesion between the base material and the adhesive layer is ensured to prevent the adhesive layer from peeling off. Durability can be improved. Moreover, the flexibility of the entire adhesive layer is ensured by the highly flexible first adhesive layer, and when the contact pin is pressed against the adhesive layer, the adhesive layer easily deforms following the shape of the contact pin. By pulling the pin away from the adhesive layer, the deposits on the contact pin can be easily removed. In addition, since the surface layer of the adhesive layer is formed of the second adhesive layer having low flexibility, the impact when the contact pin is repeatedly pressed against the surface of the adhesive layer is difficult to be transmitted to the substrate. In addition to preventing damage, the occurrence of damage to the surface of the adhesive layer when pressing such contact pins or cleaning the surface of the adhesive layer is suppressed, and high durability is also demonstrated in this respect. The Rukoto.

  Also, when the second adhesive layer is higher in flexibility and adhesiveness than the first adhesive layer, the flexibility of the entire adhesive layer is ensured, and when the contact pin is pressed against the adhesive layer, the adhesive layer Can be easily deformed following the shape of the contact pin, and by removing the contact pin from the adhesive layer, the deposits on the contact pin can be easily removed. The adhesive layer makes it difficult for the impact when the contact pins are repeatedly pressed against the surface of the adhesive layer to be transmitted to the base material, thereby preventing the base material from being damaged.

  When the thickness of the first adhesive layer is thicker than the thickness of the second adhesive layer, the flexibility of the entire adhesive layer can be adjusted mainly by the thick first adhesive layer and the second adhesive layer The adhesiveness of the surface of the adhesive layer can be adjusted by the adhesive layer.

  When the thickness of the second adhesive layer is thicker than the thickness of the first adhesive layer, the flexibility of the entire adhesive layer can be adjusted mainly by the thick second adhesive layer and the second adhesive layer can be adjusted. The adhesiveness of the surface of the adhesive layer can be adjusted by the adhesive layer.

  In addition, when the solution layer is provided, the contact pin is brought into contact with the adhesive layer so that the deposit on the surface of the contact pin can be removed by attaching to the adhesive portion, and the flux film is attached to the contact pin. In this case, since the contact pin comes into contact with the solvent layer 5 in advance, the flux is dissolved in the solvent layer 5 and removed, or the flux is swollen with the solvent of the solvent layer 5 so as to be easily removed from the contact pin. Can be removed with an adhesive layer.

  Hereinafter, the best mode for carrying out the present invention will be described.

  First, an example of the first embodiment will be described.

  As shown in FIG. 1, the contact pin deposit removing tool 1 (hereinafter abbreviated as “removing tool 1”) forms an adhesive layer 3 made of an adhesive resin on one surface of a flat substrate 2. It is a thing.

  Although the base material 2 can be formed of various materials, it is preferable to use a material formed of a material that is difficult to plastically deform. For example, inorganic glasses such as soda lime glass, borosilicate glass, and quartz glass; metals such as Invar alloy, stainless steel, titanium, aluminum, iron, and stainless steel; ceramics such as alumina, zirconia, and silicon nitride; (Hard) Plastic: A substrate 2 formed of a material such as fiber reinforced plastic (FRP) such as glass fiber reinforced resin is preferably used. As this base material 2, a flat plate having a flat surface can be used.

  Moreover, the adhesion layer 3 can be formed with the resin composition for suitable adhesive formation. Although it does not specifically limit as a resin composition for forming the adhesion layer 3, For example, shape | molding the resin composition of suitable thermosetting and active energy ray curable (UV curable, electron beam curable, etc.). Can be formed. At this time, the adhesion layer 3 can be formed using the resin composition containing a urethane resin, an acrylic resin, an epoxy resin, a polysulfide resin, a silicone resin, etc., for example. Among these resin compositions, particularly when a silicone resin-based resin composition is used, the heat resistance of the adhesive layer 3 can be improved.

  The said adhesion layer 3 is formed from the 1st adhesion layer 3a directly contacted to the surface of the base material 2, and the 2nd adhesion layer 3b provided by laminating | stacking on said 1st adhesion layer 3a. The first adhesive layer 3a can be formed so as to have higher adhesiveness and flexibility than the second adhesive layer 3b, but the second adhesive layer 3b is more adhesive than the first adhesive layer 3a. Further, it may be formed so as to increase flexibility. At this time, the first adhesive layer 3a is concealed by the second adhesive layer 3b on the surface of the adhesive layer 3, and only the second adhesive layer 3b is exposed.

  When the pressure-sensitive adhesive layer 3 is formed of the first pressure-sensitive adhesive layer 3a and the second pressure-sensitive adhesive layer 3 as described above, the flexibility of the pressure-sensitive adhesive layer 3 as a whole is improved, and the removal performance of the deposit 8 from the contact pin 4 by the pressure-sensitive adhesive layer 3 is improved. In addition, the impact applied to the adhesive layer 3 when the contact pin 4 is pressed against the adhesive layer 3 can be reduced, and the durability of the removal tool 1 can be improved.

  Here, the removal performance of the deposit 8 from the contact pin 4 by the adhesive layer 3 is also related to the overall thickness of the adhesive layer 3, but if the entire thickness of the adhesive layer 3 is the same, the adhesive layer 3 is removed. Compared with the case where the adhesive layer 3 is formed of a single layer, the removal performance of the deposit 8 is improved when the adhesive layer 3 is formed of the first adhesive layer 3a and the second adhesive layer 3. For this reason, the removal performance of the deposit | attachment 8 excellent in this adhesion layer 3 can be provided, reducing the resource required in order to form the adhesion layer 3. FIG.

  The method for forming such an adhesive layer 3 is not particularly limited. For example, after a resin composition for forming the first adhesive layer 3a is previously formed into a film shape, this is adhered to the surface of the substrate 2. The first adhesive layer 3a can be formed by curing as necessary. Further, the resin composition for forming the first adhesive layer 3a is applied to the surface of the substrate 2 in a liquid or paste state, and is cured and formed as necessary to form the first adhesive layer 3a. Anyway. In particular, when the latter method is employed, the adhesion between the first adhesive layer 3a and the substrate 2 can be improved. Furthermore, for example, after the resin composition for forming the second adhesive layer 3b is previously formed into a film shape, the resin composition is pasted on the surface of the first adhesive layer 3a, and cured and molded as necessary. The second adhesive layer 3b can be formed. In addition, the resin composition for forming the second adhesive layer 3b is applied to the surface of the first adhesive layer 3a in a liquid or pasty state, and cured and molded as necessary to form the second adhesive layer 3b. You may make it form. In particular, when the latter method is employed, the adhesion between the first adhesive layer 3a and the second adhesive layer 3b can be improved.

  At this time, as the first adhesive layer 3a and the second adhesive layer 3b, it is preferable to provide those having different flexibility and adhesiveness. In this case, the flexibility of the adhesive layer 3 as a whole can be improved by the highly flexible layer, and when the contact pin 4 is pressed against the adhesive layer 3, the adhesive layer 3 easily deforms following the contact pin 4. Will be able to. In addition, by using a layer with low flexibility, it is possible to mitigate that the impact when the contact pin 4 is pressed against the adhesive layer 3 is transmitted to the base material 2 and to prevent the base material 2 from being damaged. it can.

  Moreover, also when forming the 1st adhesion layer 3a and the 2nd adhesion layer 3b with the same composition, compared with the case where one adhesion layer is formed with the same composition, it depends on the adhesion layer. The removal performance of the deposits from the contact pin can be improved. The reason is unclear, but the first adhesive layer 3a and the second adhesive layer 3b produced when the second adhesive layer 3b is thermoformed after the first adhesive layer 3a is thermoformed. Differences in properties occur between the first adhesive layer 3a and the second adhesive layer 3b due to the difference in heat history between them, or the adhesive layer is formed in two steps even with the same composition Thus, it is considered that the formation of a non-uniform interface between the first adhesive layer 3a and the second adhesive layer 3b has an influence.

  The adhesiveness of the second adhesive layer 3b and the adhesiveness and flexibility of the first adhesive layer 3a are adjusted as appropriate so that the deposit 8 of the contact pin can be removed, but the peel strength is 0.001 to 1N. It is preferable to adjust appropriately in the range of / cm. In particular, the layer having higher adhesiveness is adjusted in the range where the peel strength is 0.1 to 0.5 N / cm, and the layer having lower peel strength is adjusted in the range of 0.1 to 0.001 N / cm. It is preferable. Here, the peel strength is a 180 ° peel strength (line peel strength) measured when a polyimide film having a width of 25 mm, a length of 30 cm, and a thickness of 25 μm is lightly pressed on the surface of a layer to be measured. ).

  The adhesiveness and flexibility of the first adhesive layer 3a and the second adhesive layer 3b can be adjusted by changing the composition of the resin composition for forming them. If the cured product has different flexibility and adhesiveness, the flexibility and adhesiveness can be easily adjusted by mixing the resin composition at an appropriate ratio.

  Although the thickness of the adhesive layer 3 depends on the size of the target contact pin 4, the larger the thickness, the higher the removability of the deposit 8 attached to the contact pin 4. However, the deposit 8 adheres mainly to the portion of the contact pin 4 having a length of about 1 mm or less at the tip portion thereof, and the conductivity is particularly affected by the portion of the order of several tens of μm from the most advanced portion. Therefore, the thickness of the adhesive layer 3 is preferably about several tens of μm to several hundreds of μm so that the deposit 8 can be efficiently removed from this portion. At this time, when the first adhesive layer 3a and the second adhesive layer 3b have a thickness difference, for example, the thickness of the thicker layer is preferably 50 to 1000 μm, more preferably 50 to 500 μm. The thickness of the smaller layer is preferably 1 to 500 μm, more preferably 10 to 300 μm.

  Here, in particular, when the first pressure-sensitive adhesive layer 3a is higher in flexibility and adhesiveness than the second pressure-sensitive adhesive layer 3b, the second pressure-sensitive adhesive layer 3b and the substrate 2 have a high pressure-sensitive adhesive property. It will be in the state joined via the adhesion layer 3a, and the adhesiveness of the adhesion layer 3 with respect to the base material 2 will improve, and it will become difficult to produce peeling of the adhesion layer 3. FIG. Moreover, since the 1st adhesion layer 3a has high adhesiveness, it has a softness | flexibility higher than the 2nd adhesion layer 3b, and keeps the softness | flexibility of the adhesion layer 3 whole with this 1st adhesion layer 3a high. Therefore, it is possible to keep the followability to the contact pin high. Further, the second adhesive layer 3b in the upper layer portion is less flexible than the first adhesive layer 3a and has a higher hardness, so that it is less likely to be damaged and is durable by suppressing the occurrence of damage on the surface of the adhesive layer 3. Can be improved.

  In this case, in particular, when the thickness of the first adhesive layer 3a is larger than the thickness of the second adhesive layer 3b, the ratio of the first flexible adhesive layer 3a having high flexibility in the entire adhesive layer 3 is increased. In addition, since the thickness of the second adhesive layer 3b having low flexibility is reduced, the second adhesive layer 3b can be easily deformed, and the flexibility of the entire adhesive layer 3 can be further increased. The followability to the pin can be further improved.

  An example of the removal of the deposit 8 from the contact pin 4 of the continuity testing device using such a removal tool 1 will be described.

  Examples of the continuity inspection device include an inspection jig having a contact pin 4, a voltage applied to the contact pin 4 and a current generated between the contact pins 4 being measured. As an inspection jig, for example, one having a flat lower surface and a plurality of contact pins 4 projecting from the lower surface can be mentioned. The number and position of the contact pins 4 are provided so as to match the number and position of the terminals on the printed wiring board or the like to be inspected.

  A continuity test is performed in a state in which such an inspection jig is arranged so that each contact pin 4 is in contact with a terminal in the test target with respect to the test target such as a printed wiring board.

  When the continuity test using the continuity test equipment is repeated and the deposit 8 adheres to the contact pin 4, the deposit 8 on the contact pin 4 is removed by the removing tool 1.

  At this time, the contact pin 4 is first disposed above the removal tool 1 as shown in FIG. 2A, and in this state, the contact pin 4 is brought close to the removal tool 1 as shown in FIG. As a result, the contact pins 4 are pressed against the adhesive layer 3. At this time, if the first adhesive layer 3a has higher adhesiveness and flexibility than the second adhesive layer 3b, the entire adhesive layer 3 is highly flexible by the first adhesive layer 3a as described above. In addition, even if the second adhesive layer 3b is higher in adhesiveness and flexibility than the first adhesive layer 3a, the entire adhesive layer 3 is improved in flexibility, so that the adhesive layer 3 Is easily deformed following the contact pin 4 so that the contact pin 4 is embedded in the adhesive layer 3. Thereafter, the contact pin 4 is separated from the removal tool 1 as shown in FIG.

  When the deposit 8 is removed from the surface of the contact pin 4 in this way, the surface of the contact pin 4 comes into contact with the adhesive layer 3, and when the contact pin 4 is further separated from the adhesive layer 3, the adhesion is mainly performed. The contact pin 4 is based on the adhesive force of the second adhesive layer 3b on the surface of the layer 3 and the frictional force acting between the contact pin 4 embedded in the adhesive layer 3 when the contact pin 4 is pulled away from the adhesive layer 3. The deposit 8 that has adhered to the surface adheres to the adhesive layer 3 and is removed.

  Next, an example of the second embodiment will be described.

  In this embodiment, the removal tool 1 is provided with a solvent layer 5 in which a solvent is stored in the upper layer of the adhesive layer 3.

  For example, in the example shown in FIG. 3, the recessed part 6 is provided in the site | part which forms the adhesion layer 3 in the base material 2. FIG. The depth of the concave portion 6 is formed so as to be deeper than the thickness of the pressure-sensitive adhesive layer 3, and may be, for example, 0.1 mm or more, preferably 0.1 to 2 mm.

  The adhesive layer 3 composed of the first adhesive layer 3a and the second adhesive layer 3b is formed inside the recess 6 by the method as described above.

  Next, the solvent is stored in the recess 6 above the adhesive layer 3 to form the solvent layer 5. As the solvent, for example, a solvent capable of dissolving a flux can be used. At this time, an appropriate solvent capable of dissolving a rosin-based flux, a synthetic resin-based flux, or the like applied to an object for continuity inspection is used. Can do. In addition, it is preferable to use a solvent that does not attack the adhesive layer 3 in a short time in contact with the adhesive layer 3, and the solvent is quickly dried and removed from the contact pin 4 after the deposit 8 is removed. As such, it is preferably highly volatile. Specific examples of the solvent include alcohols such as isopropyl alcohol, esters such as ethyl acetate, ketones such as acetone, and appropriate organic solvents such as aromatics such as toluene. It can also be used as a mixed solvent in which two or more are mixed. Furthermore, what added water to the above organic solvents can also be used. In particular, it is preferable to use isopropyl alcohol, which is often used as a solvent for the flux and has little possibility of attacking the adhesive layer 3, or to use a solvent containing this isopropyl alcohol.

  The thickness of the solvent layer 5, that is, the depth of the solvent stored above the adhesive layer 3 is appropriately set, but when the contact pin 4 is brought into contact with the solvent layer 5, the tip of the contact pin 4 is a solvent. The wetness is sufficient, and depending on the structure and dimensions of the contact pin 4, it is preferable that the solvent does not come into contact with a member such as a spring on the proximal end side of the contact pin 4. For example, this thickness can be in the range from the extent that the surface of the adhesive layer 3 is wet with a solvent to 3 mm, preferably in the range of about 0.1 to 3 mm, and more preferably in the range of 0.1 to 1 mm.

  When the removing tool 1 having such a solvent layer 5 is used, the flux can be easily removed when the flux is adhered as the deposit 8 on the surface of the contact pin 4. Here, the flux is applied to the surface of the conductor wiring for the purpose of preventing the oxidation of the conductor wiring, and the flux is applied to the surface of the contact pin 4 by conducting a continuity test of the conductor wiring. May adhere. The adhesion of this flux leads to a decrease in the continuity of the contact pin, and further foreign matter tends to adhere to the adhered flux and causes a further decrease in conductivity. By using the contact pin deposit 8 to remove the foreign matter including the flux, it is possible to remove the foreign matter including the flux more easily than when no solvent is used.

  The removal of the deposits 8 from the contact pins 4 of the continuity testing device using such a removal tool 1 will be described.

  First, the contact pin 4 is disposed above the removal tool 1 as shown in FIG. 4A, and in this state, the contact pin 4 is brought close to the removal tool 1 as shown in FIG. As a result, the contact pin 4 is immersed in the solvent layer 5 and then the contact pin 4 comes into contact with the adhesive layer 3 as shown in FIG. Thereafter, the contact pin 4 is separated from the removal tool 1 as shown in FIG.

  When the deposit 8 is removed from the surface of the contact pin 4 in this manner, the deposit 8 that has adhered to the surface of the contact pin 4 when the surface of the contact pin 4 comes into contact with the adhesive layer 3 is removed. As in the case of one embodiment, the adhesive layer 3 is adhered and removed. Further, when the flux is adhered as the deposit 8 on the surface of the contact pin 4, the flux is dissolved in the solvent layer 5 when the contact pin 4 is immersed in the solvent layer 5, or the flux is It swells with a solvent while attached to the contact pin 4. Thus, the flux can be removed by dissolving the flux in the solvent layer 5, and even if the flux swells while adhering to the contact pin 4, the contact pin 4 is swollen in this way. Therefore, when the surface of the contact pin 4 comes into contact with the adhesive layer 3, the swollen flux adheres to the adhesive layer 3 and is easily removed.

  Hereinafter, the present invention will be described in more detail based on examples.

(Examples 1-14, Comparative Examples 1-7)
A glass epoxy resin substrate (FR-4 type) having dimensions of 300 mm × 300 mm × 1.6 mm is used as the base material 2, and the first adhesive layer 3a is formed on one surface of the base material 2, or the second adhesive layer 3b is further formed. Formed. The first pressure-sensitive adhesive layer 3a and the second pressure-sensitive adhesive layer 3b are formed by applying the resin compositions shown in Tables 1 to 5 by a screen printing method and performing a heat treatment at 150 ° C. for 20 minutes, respectively. It was made to fall within the range of ± 10% of the values shown in 1-5.

  Here, among the resin compositions in the table, the low-adhesive adhesive refers to a thermosetting silicone resin (product number “ADF-18”) manufactured by Toyo Chemical Co., Ltd. Further, the high-tack adhesive is a thermosetting silicone resin (product number “ADF-18”) manufactured by Kyoyo Chemical Industry Co., Ltd. )) Is mixed so that the weight ratio of the former to the latter is 8: 2.

  The peel peel strength was 180 ° peel strength (line peel strength) measured when a polyimide film having a width of 25 mm, a length of 30 cm and a thickness of 25 μm was lightly pressed on the surface of the formed adhesive layer 3. Indicates.

(Evaluation Test 1)
The following evaluation tests were performed on Examples 1 to 8 and Comparative Examples 1 to 5.

(1) Foreign matter removal property and continuity evaluation A printed wiring board for testing in which electronic components are mounted by solder reflow processing is manufactured, and “Y-1. 4HN "was measured with a load measuring instrument (" MODEL-L100E1840N "manufactured by Aiko Engineering Co., Ltd.) using the" 3540 milliohm HiTester "manufactured by Hioki Electric Co. The load was pressed so that the average load was 1.47 N, and a continuity test was performed by the voltage drop method (four-terminal method).

  After performing the above-described continuity test using the same contact pin 4, if a measurement error caused by the adhesion of the deposit 8 to the contact pin 4 occurs, the test is interrupted, and each of the examples and comparative examples Using the removing tool 1 obtained in Step 1, the deposit 8 attached to the contact pin 4 was removed in a state where the back surface of the removing tool 1 was fixed on a jig with a double-sided adhesive tape.

The appearance of the tip of the contact pin 4 before and after the removal of the deposit 8 from the contact pin 4 was visually observed, and the degree of removal of the deposit 8 from the contact pin 4 was evaluated according to the following criteria.
A: Good.
○: No problem.
Δ: There is some foreign matter residue.
X: There is a foreign substance residue.

  At this time, in Comparative Example 4, the adhesive force between the contact pin 4 and the adhesive layer 3 caused a phenomenon that the substrate 5 was partially lifted when the contact pin 4 was removed.

Moreover, after removing the deposit | attachment 8 with the removal tool 1 as mentioned above, based on the measurement result at the time of performing the said conduction | electrical_connection test again, the electrical conductivity of the contact pin 4 was evaluated on the following reference | standard.
○: Good conductivity.
Δ: Unstable conductivity.
X: Poor conductivity.

(2) Adhesive layer durability test After pressing the contact pin 4 continuously 500 times to the same position on the surface of the adhesive layer 3 of the removal tool 1 obtained in each Example and Comparative Example, The surface state was visually observed and the durability was evaluated according to the following criteria.
A: Good with little roughness on the surface B: Good B: Slightly rough ×: Rough and partially peeled The above results are shown in Tables 1-3. Table 1 shows the results when the adhesive layer has a total thickness of 60 μm, Table 2 shows the results when the total thickness is 150 μm, and Table 3 shows the results when the total thickness is 300 μm.

(Evaluation test 2)
The following evaluation tests were conducted on Examples 9 to 14 and Comparative Examples 6 and 7.

(1) Foreign matter removal property and continuity evaluation Similar to the foreign matter removal property and continuity evaluation in Evaluation Test 1, except that a post-flux was attached to the contact pin 4 and then air-dried was used. The deposits were removed from the contact pins 4 after the measurement error was generated, and the degree of removal of deposits from the contact pins 4 was evaluated according to the following criteria.
A: Good.
○: No problem.
Δ: There is some foreign matter residue.
X: There is a foreign substance residue.

Moreover, after the removal of the post flux by the removal tool 1, the continuity test was performed, and the continuity was evaluated according to the following evaluation criteria based on the measured electric resistance value.
○: Good conductivity.
Δ: Unstable conductivity.
X: Poor conductivity.

(2) Adhesive layer durability test After pressing the contact pin 4 continuously 500 times to the same position on the surface of the adhesive layer 3 of the removal tool 1 obtained in each Example and Comparative Example, The surface state was visually observed and the durability was evaluated according to the following criteria.
A: Good with little roughness on the surface B: Good B: Slightly rough ×: Rough and partially peeled The above test results are also shown in Table 4.

  From the above results, if the total thickness of the pressure-sensitive adhesive layer is approximately the same, the pressure-sensitive adhesive layer of each example constituted by laminating the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is that of each comparative example. It was confirmed that it had superior foreign substance removal properties, electrical conductivity, and adhesive layer durability than those.

(Examples 15 to 17)
A flat plate made of aluminum having a size in plan view of 300 mm × 300 mm was used as the base material 5, and a recess 6 having dimensions of 270 mm × 270 mm in plan view and a depth of 1.2 mm was formed on the base material 5.

  A first adhesive layer 3 a and a second adhesive layer 3 b were formed on the bottom surface of the recess 6 of the substrate 5. The first pressure-sensitive adhesive layer 3a and the second pressure-sensitive adhesive layer 3b are formed by applying the resin composition shown in Table 5 by screen printing and performing heat treatment at 150 ° C. for 20 minutes, and the thickness is shown in Table 5. It was made to be within the range of ± 10% of the value.

  The peel peel strength was 180 ° peel strength (line peel strength) measured when a polyimide film having a width of 25 mm, a length of 30 cm and a thickness of 25 μm was lightly pressed on the surface of the formed adhesive layer 3. Indicates.

  Next, isopropyl alcohol was stored as a solvent on the pressure-sensitive adhesive layer 3 in the recess 6 to form the solvent layer 5 having the thickness shown in Table 5 to obtain the deposit removing tool 1.

(Evaluation Test 3)
About Examples 15-17, the same evaluation test as the above-mentioned evaluation test 1 was done. The results are shown in Table 5.

  Thus, in Examples 15 and 16 in which the solvent layer 5 was provided among the Examples 15 to 17 in which the adhesive layer 3 having the same thickness was formed, the evaluation superior to Example 17 in which the solvent layer 5 was not provided. Obtained.

It is sectional drawing which shows an example of 1st embodiment of this invention. (A) thru | or (c) is sectional drawing which shows the operation | movement in embodiment same as the above. It is sectional drawing which shows an example of 2nd embodiment of this invention. (A) And (b) is sectional drawing which shows the operation | movement in embodiment same as the above. (A) And (b) is sectional drawing which shows the operation | movement in embodiment same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive removal tool for contact pins 2 Base material 3 Adhesive layer 3a First adhesive layer 3b Second adhesive layer 4 Contact pin 5 Solvent layer 8 Adherent

Claims (5)

An adhesive layer is provided on the surface of the base material, and the adhesive layer removes the adhesive material on the contact pin by bringing the adhesive layer into contact with the contact pin. The adhesive layer directly contacts the surface of the base material. It is, a first adhesive layer formed of a thermosetting silicone resin, provided by laminating the first adhesive layer, a second adhesive layer formed of a thermosetting silicone resin The first adhesive layer is higher in adhesiveness and flexibility than the second adhesive layer, and the thickness of the first adhesive layer is thicker than the thickness of the second adhesive layer, the first is the thickness of the adhesive layer is 50 to 1000 [mu] m, the second adhesive layer adhered material removal device contact pin thickness and wherein 1~500μm der Rukoto of. An adhesive layer is provided on the surface of the base material, and the adhesive layer removes the adhesive material on the contact pin by bringing the adhesive layer into contact with the contact pin. The adhesive layer directly contacts the surface of the base material. A first pressure-sensitive adhesive layer formed from a thermosetting silicone resin, and a second pressure-sensitive adhesive layer formed from a thermosetting silicone resin provided on the first pressure-sensitive adhesive layer. is formed from the first adhesive layer, the second than the adhesive layer rather high tackiness and flexibility, the thickness of the second adhesive layer is thicker than the thickness of the first adhesive layer the thickness of the second adhesive layer is 50 to 1000 [mu] m, co Ntakutopin for deposit removing device the thickness of the first adhesive layer and said 1~500μm der Rukoto. An adhesive layer is provided on the surface of the base material, and the adhesive layer removes the adhesive material on the contact pin by bringing the adhesive layer into contact with the contact pin. The adhesive layer directly contacts the surface of the base material. A first pressure-sensitive adhesive layer formed from a thermosetting silicone resin, and a second pressure-sensitive adhesive layer formed from a thermosetting silicone resin provided on the first pressure-sensitive adhesive layer. is formed from the second adhesive layer, said first adhesive and flexibility than the adhesive layer is rather high, the thickness of the first adhesive layer is thicker than the thickness of the second adhesive layer the thickness of the first adhesive layer is 50 to 1000 [mu] m, co Ntakutopin for deposit remover, wherein the thickness of said second adhesive layer is 1 to 500 [mu] m. An adhesive layer is provided on the surface of the base material, and the adhesive layer removes the adhesive material on the contact pin by bringing the adhesive layer into contact with the contact pin. The adhesive layer directly contacts the surface of the base material. A first pressure-sensitive adhesive layer formed from a thermosetting silicone resin, and a second pressure-sensitive adhesive layer formed from a thermosetting silicone resin provided on the first pressure-sensitive adhesive layer. The second adhesive layer is higher in adhesiveness and flexibility than the first adhesive layer, and the thickness of the second adhesive layer is thicker than the thickness of the first adhesive layer, The contact pin deposit removing tool, wherein the second adhesive layer has a thickness of 50 to 1000 µm, and the first adhesive layer has a thickness of 1 to 500 µm. The contact pin deposit removing tool according to any one of claims 1 to 4 , wherein a solvent layer in which a solvent is stored is formed on the adhesive layer.

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