JP5178592B2 - Photoelectric sensor device - Google Patents

Description

  The present invention relates to a photoelectric sensor device that detects an object by either reflection or shielding of visible and invisible light.

  This type of photoelectric sensor device is known to detect an object by either reflection or shading of visible or invisible light, and enable long distance detection. A light emitting diode (light emitting element) or a photodiode (light receiving element) is known. A circuit board on which an optical element is mounted, a circuit board on which the optical element is mounted, a case that houses the circuit board, and a cover that is assembled to the case and includes a lens that determines the optical system of the optical element It is equipped with.

  In addition, a slide adjusting means for moving the optical element or the lens along the optical axis that is the optical central axis of the optical element is provided, and the distance between the optical element and the lens is changed by the slide adjusting means, so that the optical axis can be easily adjusted. A technique for improving the performance of the photoelectric sensor device by performing the technique is disclosed (for example, see Patent Document 1).

JP 2000-2586 A

  However, in the above prior art, the slide adjusting means is composed of a holder, a base that is slidably held inside the holder, and a rotating mechanism that rotates the base, and a circuit board is mounted on the base. Since the distance to the lens is changed via the rotation mechanism, the base, and the circuit board, there is a possibility that the optical axis cannot be adjusted with high accuracy due to the dimensional error and assembly error of each of the above components of the slide adjusting means. There are still issues to be addressed with further performance improvements.

Further, in the above-described prior art, the number of parts of the photoelectric sensor device is increased by the slide adjusting means constituted by each of the above-described components, and the configuration of the photoelectric sensor device becomes complicated, so that the production cost of the photoelectric sensor device increases. There's a problem.
Furthermore, since it is necessary to secure a space for each of the above components of the slide adjusting means in the photoelectric sensor device, there is a problem that the photoelectric sensor device cannot be easily downsized.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a photoelectric sensor device that can be simplified and can realize both downsizing and high performance.

  In order to achieve the above object, a photoelectric sensor device according to claim 1 determines a circuit board on which an optical element is mounted, a case in which the circuit board is accommodated, a case, and an optical system of the optical element. A photoelectric sensor device comprising a cover provided with a lens, comprising a positioning means for defining the distance of the optical element relative to the lens on the case side by assembling and positioning the circuit board with respect to the case, and the positioning means Has a first movable member that is in contact with the optical element and adjusts the distance by moving the circuit board along the optical axis of the optical element.

According to a second aspect of the present invention, in the first aspect, the case has a support portion that supports the first movable member so as to be movable along the optical axis.
Furthermore, the invention according to claim 3 is characterized in that, in claim 2, the support portion is a sliding hole that allows sliding along the optical axis of the first movable member.
Furthermore, the invention according to claim 4 is characterized in that, in claim 2, the support portion is a screw hole that allows screwing along the optical axis of the first movable member.

According to a fifth aspect of the present invention, in the first aspect, the first movable member is made of a magnet, and the positioning means moves the first movable member along the optical axis by a magnetic force generated outside the case. It is characterized by adjusting the distance.
Furthermore, the invention according to claim 6 is characterized in that, in claim 1, the first movable member is composed of a defining portion for defining a distance and a separating portion, and the separating portion is configured to be separable from the defining portion. It is said.

Further, the invention according to claim 7 is characterized in that, in claim 1, the positioning means has a second movable member that is in contact with the circuit board and adjusts the inclination of the circuit board.
The invention according to claim 8 is characterized in that in any one of claims 1 to 7, a fixing means for fixing the first movable member to the case is provided.
Furthermore, the invention described in claim 9 is characterized in that in any one of claims 1 to 8, a plurality of sets of corresponding optical elements, circuit boards, lenses, and positioning means are provided.

  According to the photoelectric sensor device of the present invention, it is provided with positioning means for defining the distance of the optical element with respect to the lens on the case side by assembling and positioning the circuit board with respect to the case, and the positioning means is in contact with the optical element. And a first movable member that adjusts the distance by moving the circuit board along the optical axis of the optical element. Accordingly, since the optical element can be directly moved in the optical axis direction by the first movable member, the distance of the optical element with respect to the lens can be adjusted with high accuracy without requiring a single component. Therefore, it is possible to improve the performance of the photoelectric sensor device while reducing the production cost of the photoelectric sensor device, and it is possible to easily realize both downsizing and higher performance of the photoelectric sensor device.

It is a disassembled perspective view which shows the structure of the photoelectric sensor apparatus which concerns on 1st Embodiment of this invention. It is a longitudinal cross-sectional view which shows the assembly state of the photoelectric sensor apparatus seen from the AA direction of FIG. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which concerns on 3rd Embodiment of this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which concerns on 4th Embodiment of this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which concerns on 5th Embodiment of this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which concerns on the modification of this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which shows another fixing means of the positioning mechanism based on this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which shows the fixing means different from FIG. 8 of the positioning mechanism based on this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which shows the fixing means different from FIG. 9 of the positioning mechanism based on this invention. It is a longitudinal cross-sectional view of the photoelectric sensor apparatus which shows the fixing means different from FIG. 10 of the positioning mechanism based on this invention.

Hereinafter, a photoelectric sensor device according to an embodiment of the present invention will be described from the first embodiment with reference to the drawings.
FIG. 1 is an exploded perspective view showing the structure of the photoelectric sensor device 1 according to this embodiment.
The photoelectric sensor device 1 is a detector that detects an object via the optical element 2 by either reflection or shading of visible or invisible light, and the optical element 2 is electrically mounted to form a wiring pattern. The circuit board 4, a case 6 that accommodates the circuit board 4, and a cover 8 that is assembled to the case 6 are schematically configured.

  The optical element 2 is a surface-mount package component in which an electronic component is mounted on a substrate such as silicon and the surface is sealed with an epoxy resin or the like, and is used as a light emitting diode (light emitting element), a photodiode (light receiving element), or the like. 1 has an external dimension of about 2 mm in length and width and about 0.4 mm in height, for example, and is mounted on the circuit board 4 at substantially the center of the mounting surface 4a on which the optical element 2 is mounted.

Each of the case 6 and the cover 8 is formed in a box from a synthetic resin or the like, and has outer dimensions of, for example, a vertical width of 10 mm, a horizontal width of 20 mm, and a height of 4 mm in the direction of FIG.
Referring also to the longitudinal sectional view showing the assembled state of the photoelectric sensor device 1 as viewed from the AA direction in FIG. 2, the cover 8 is provided with a lens 10 on the bottom surface 8 a of the box, and the optical element 2. Together with this, an optical system is formed. In the case of this embodiment, the lens 10 is positioned to face the optical element 2 in the height direction of the case 6 and the cover 8, and thereby the light emission and light reception of the optical element 2 are parallel to the mounted surface 4 a. The so-called flat-view type photoelectric sensor device 1 is configured.

By the way, in this embodiment, a positioning mechanism (positioning means) 12 is provided that defines the distance D of the optical element 2 with respect to the lens 10 on the case 6 side by assembling and positioning the circuit board 4 with respect to the case 6. .
The positioning mechanism 12 is brought into contact with the optical element 2, preferably a back surface 2b opposite to the surface (optical surface) 2a on which electronic components for emitting or receiving light from the optical element 2 are mounted. The positioning mechanism 12 includes, for example, a resin cylindrical movable pin (first movable member) 16 that adjusts the distance D by moving the circuit board 4 along the optical axis 14 that is the optical center axis of the optical element 2. The upper end surface 16a of the movable pin 16 is in contact with and fixed to the back surface 2b of the optical element 2.

Further, the movable pin 16 is fitted into the bottom wall 6a of the case 6 with a predetermined fit, preferably a sliding hole (support portion) 18 having a diameter that can be fitted with an intermediate fit between the clearance fit and the fit fit. The fitting sliding hole 18 supports the movable pin 16 so as to be movable along the optical axis 14 and allows the movable pin 16 to slide along the optical axis 14.
Further, a through hole 20 having a diameter that is the same as or slightly larger than that of the sliding hole 18 is formed in the circuit board 4, and the through hole 20 directly contacts the back surface 2 b of the movable pin 16 fitted in the sliding hole 18. Contact is possible.

Here, the upper end surface 16a may be bonded in advance to the back surface 2b with an adhesive or the like before the photoelectric sensor device 1 is assembled, or after the photoelectric sensor device 1 is assembled, an adhesive or the like is applied to the upper end surface 16a. The movable pin 16 may be fitted in the sliding hole 18 and brought into contact with the back surface 2b for bonding.
Thus, in the case of this embodiment, the positioning mechanism 12 is comprised only by the movable pin 16, the movable pin 16 and the sliding hole 18 are provided on the optical axis 14 of the optical element 2, and the optical axis 14 is light. The element 2 is positioned approximately at the center in plan view. In other words, as described above, the lens 10 is in a positional relationship facing the optical element 2, and the optical axis 14 of the optical element 2 coincides with the optical axis of the lens 10, so that the movable pin 16 and the sliding hole 18 are aligned. Can be said to be provided on the common optical axis 14 of the optical element 2 and the lens 10.

Hereinafter, the assembly adjustment procedure of the photoelectric sensor device 1 will be described.
First, the circuit board 4 is placed on the bottom surface 6b of the case 6 from the back surface 4b, which is the surface opposite to the mounting surface 4a, and is accommodated in the case 6. At this time, when the movable pin 16 is bonded in advance to the back surface 2 b, the movable pin 16 is fitted into the sliding hole 18.
Next, the opening end surfaces 6c and 8b of the case 6 and the cover 8 are brought into contact with each other, and the outer peripheral portions of the case 6 and the cover 8 are fixed with jigs, for example, between the opening end surfaces 6b and 8b. The contact surfaces of the case 6 and the cover 8 are joined by an appropriate joining method such as laser welding, for example, so that no large assembly error occurs in the assembly of the case 6 and the cover 8. That is, the cover 8 is assembled to the case 6 based on the mutual external shape reference with the case 6, and the assembly of the photoelectric sensor device 1 is completed.

Next, in the photoelectric sensor device 1 that has been assembled, the movable pin 16 is pushed into and pulled out of the sliding hole 18 by manually operating a predetermined jig (not shown) locked to the movable pin 16. The distance D is adjusted, and the optical axis adjustment of the photoelectric sensor device 1 is completed.
When the photoelectric sensor device 1 is assembled, the distance D may be adjusted only by pressing the movable pin 16 by setting the insertion length of the movable pin 16 to the sliding hole 18 to a predetermined length in advance. Alternatively, after the assembly of the photoelectric sensor device 1 is completed, the movable pin 16 is inserted from the sliding hole 18 to position the circuit board 4 and is in contact with and fixed to the back surface 2b, and the distance D is adjusted only by pressing the movable pin 16. You may be able to do it.

  As described above, the present embodiment includes the positioning mechanism 12 that defines the distance D of the optical element 2 with respect to the lens 10 on the case 6 side by assembling and positioning the circuit board 4 with respect to the case 6. Reference numeral 12 denotes a movable pin 16 which is in contact with the back surface 2b opposite to the optical surface 2a of the optical element 2 and adjusts the distance D by moving the circuit board 4 in the direction of the optical axis 14 of the optical element 2. Thereby, since the optical element 2 can be directly moved in the direction of the optical axis 14 only by the movable pin 16, the distance D can be adjusted with high accuracy.

  The case 6 is formed with a sliding hole 18 that supports the movable pin 16 so as to be movable along the optical axis 14. The sliding hole 18 allows the movable pin 16 to slide along the optical axis 14. The movable pin 16 is supported by the sliding hole 18. Thereby, the positioning mechanism 12 can be comprised without requiring a space only by the movable pin 16 as a member. Therefore, it is possible to improve the performance of the photoelectric sensor device 1 while reducing the production cost of the photoelectric sensor device 1, and it is possible to realize both downsizing and higher performance of the photoelectric sensor device 1 in a simple manner. .

Next, a second embodiment of the present invention will be described with reference to FIG.
In the second embodiment, a positioning mechanism 12 different from the first embodiment is configured, and the other configuration is the same as that of the first embodiment.
Referring to the longitudinal sectional view of the optical sensor device 1 shown in FIG. 3, the positioning mechanism 12 is in contact with the back surface 2 b and moves the circuit board 4 along the optical axis 14 to adjust the distance D (first screw). 1, a screw hole (support) that supports the screw 22 movably along the optical axis 14 and allows the screw 22 to advance along the optical axis 14. Part) 24 is threaded through.

In the optical axis adjustment of the present embodiment, the distance D can be adjusted more strictly by adjusting the screwing of the screw 22 with a predetermined jig.
Next, a third embodiment of the present invention will be described with reference to FIG.
In the third embodiment, a positioning mechanism 12 different from each of the above embodiments is configured, and the other configuration is the same as that of each of the above embodiments.

  Referring to the longitudinal sectional view of the optical sensor device 1 shown in FIG. 4, the positioning mechanism 12 is in contact with the back surface 2 b and is a movable pin (moving the circuit board 4 along the optical axis 14 to adjust the distance D). A first movable member 26 is formed of a magnet, and a concave portion (supporting portion) 28 in which the lower end portion 26a of the movable pin 26 is fitted to the bottom wall 6a of the case 6 by an intermediate fit or the like. Is recessed.

  In the optical axis adjustment of this embodiment, the magnetic body 30 that generates a predetermined magnetic force against the fitting force of the movable pin 26 in the recess 28 is moved closer to or away from the movable pin 26 side outside the case 6, By operating the movable pin 26, the distance D can be adjusted while the case 6 is kept sealed, so that the waterproofness of the photoelectric sensor device 1 can be improved.

Next, a fourth embodiment of the present invention will be described with reference to FIG.
In the fourth embodiment, a movable pin (first movable member) 32 different from that in the first embodiment is configured, and the other configurations are the same as those in the first embodiment.
Referring to the longitudinal sectional view of the optical sensor device 1 shown in FIG. 5, the movable pin 32 has a handle portion (detachment) for easily pushing and pulling the movable pin 32 with respect to the sliding hole 18 without using a jig. Portion) 32a, and the movable pin 32 is formed by reducing the diameter between the handle portion 32a and the defining portion 32b fixed to the case 6 so as to define the distance D.

  In the optical axis adjustment of the present embodiment, the movable pin 16 can be easily pushed or pulled out by pushing in and pulling out the handle portion 32a, and after the optical axis adjustment, the specified portion is pulled by pulling the handle portion 32a. Only the handle portion 32a can be detached from the movable pin 32, leaving 32b. Accordingly, the distance D can be easily adjusted by using a jig integrated with the movable pin 32 without using a separate jig.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
The fifth embodiment includes a movable pin (second movable member) 34 having a function different from that of the movable pin 16 of the first embodiment, and constitutes a positioning mechanism 12 different from each of the embodiments. In other respects, the configuration is the same as that of the first embodiment.
Referring to the longitudinal sectional view of the optical sensor device 1 shown in FIG. 6, the upper end surface 34a of the movable pin 34 is in contact with and fixed to the back surface 4b of the circuit board 4, preferably in the vicinity of the side surface 4c.

Further, a sliding hole (supporting portion) having a diameter in which the movable pin 34 can be fitted by an intermediate fit or the like in the bottom wall 6a of the case 6, preferably in the vicinity of the side wall 6c of the case 6, similarly to the sliding hole 18. 36 is perforated, and the sliding hole 36 supports the movable pin 34 so as to be movable in parallel with the optical axis 14 and allows the movable pin 16 to slide.
Here, the upper end surface 34a may be bonded in advance to the back surface 4b with an adhesive or the like before the photoelectric sensor device 1 is assembled, or after the photoelectric sensor device 1 is assembled, an adhesive or the like is applied to the upper end surface 34a. The movable pin 34 may be fitted into the sliding hole 36 and brought into contact with the back surface 4b to be bonded.

  As described above, in this embodiment, the positioning mechanism 12 is configured to further include the movable pin 34 in addition to the movable pin 16, and pushes the movable pin 34 into and out of the sliding hole 36. Thus, the inclination of the circuit board 4 can be adjusted. Thereby, since the inclination angle of the optical axis 14 of the optical element 2 with respect to the optical axis of the lens 10 can be adjusted, the optical axis can be adjusted more strictly. In particular, the photoelectric sensor device 1 is an oblique projection type or This is suitable for adjusting the optical axis in the case of the side view type.

Although the description of one embodiment of the present invention has been completed above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, in each of the embodiments described above, the optical element 2 is mounted on the mounting surface 4a that is the upper surface of the circuit board 4, but not limited to this, as shown in the longitudinal sectional view of the photoelectric sensor device 1 in FIG. The optical element 2 may be mounted on the back surface 4b of the circuit board 4. In this case, by providing an opening 38 in the circuit board 4 so that at least the central part of the optical surface 2a of the optical element 2 faces the lens 10 without being covered by the circuit board 4, the distance is set by the movable pin 16. D can be defined.

Moreover, in each said embodiment, although the movable pin 16 is being fixed by the fitting with the sliding hole 18, and the screw hole 24, it shows not only in this but in the longitudinal cross-sectional view of the photoelectric sensor apparatus 1 of FIGS. As described above, after the distance D is adjusted, the movable pin 16 may be fixed by secondary molding of the adhesive or the case 6 (fixing means).
Specifically, as shown in FIG. 8, when the photoelectric sensor device 1 is assembled, an adhesive is injected from the injection hole 40 drilled in the side wall 6 c of the case 6, and the adhesive portion 42 is inserted into the sliding hole 18. And the movable pin 16 may be fixed as the adhesive portion 42 is formed.

Further, as shown in FIG. 9, an elastic member 44 made of rubber, an elastomer, or a spring that generates a predetermined elastic force is provided at an appropriate position between the cover 8 and the circuit board 4, and the circuit board 4 is attached to the case 6. In addition to fixing the movable pin 16 in FIG. 8, the circuit board 4 may be fixed by pressing to the side.
Further, as shown in FIG. 10, an adhesive portion 46 made of UV (ultraviolet) adhesive is interposed in advance between the side surface 4 c of the circuit board 4 and the side wall 6 c of the case 6, and the adhesive portion is assembled after the photoelectric sensor device 1 is assembled. The circuit board 4 and thus the movable pin 16 may be fixed by irradiating 46 with ultraviolet rays and curing the bonding portion 46.

Furthermore, as shown in FIG. 11, after the bonding portion 46 is formed and the distance D is defined, the movable pin 16 may be pulled out and removed. In this case, the movable pin 16 is removed from the sliding hole 18. It is preferable to form with the fitting dimension which can be pulled out easily.
In addition to the photoelectric sensor device 1 in each of the above embodiments, the lens 10 is provided on the outer surface of the cover 8 or at a position not facing the lens 10, and the optical element 2 and the lens 10 are further provided on the cover 8. It is also applicable to a photoelectric sensor device that is provided with a light guide member that performs light guide between them and that can emit and receive light from the optical element 2 in a horizontal or oblique direction.

  Finally, in each of the above embodiments, one set of corresponding optical element 2, circuit board 4, lens 10, and positioning mechanism 12 is provided, but not limited to this, a plurality of sets of corresponding optical element 2, circuit board 4 are provided. The lens 10 and the positioning mechanism 12 may be provided. For example, a light emitting element and its corresponding circuit board, lens, positioning mechanism, and a light receiving element and its corresponding circuit board, lens, positioning mechanism may be provided, or one circuit board is arranged for each positioning mechanism. In order to avoid the displacement interference of each positioning mechanism, each part may be connected by a flexible connecting member that can be displaced for each part.

DESCRIPTION OF SYMBOLS 1 Photoelectric sensor apparatus 2 Optical element 4 Circuit board 6 Case 8 Cover 10 Lens 12 Positioning mechanism (positioning means)
14 Optical axis 16 Movable pin (first movable member)
18 Sliding hole (support part)
22 Screw (first movable member)
24 Screw hole (support)
26 Movable pin (first movable member)
28 Concave part (support part)
32 Movable pin (first movable member)
32a Handle part (detachment part)
32b defining part 34 movable pin (second movable member)
36 Sliding hole (support part)

Claims (9)

A photoelectric sensor device comprising: a circuit board on which an optical element is mounted; a case in which the circuit board is accommodated; and a cover that is assembled to the case and provided with a lens that determines an optical system of the optical element. And
Positioning means for defining the distance of the optical element with respect to the lens on the case side by assembling and positioning the circuit board with respect to the case;
The photoelectric sensor device, wherein the positioning means includes a first movable member that is in contact with the optical element and adjusts the distance by moving the circuit board along the optical axis of the optical element.   The photoelectric sensor device according to claim 1, wherein the case includes a support portion that supports the first movable member so as to be movable along the optical axis.   The photoelectric sensor device according to claim 2, wherein the support portion is a slide hole that allows the first movable member to slide along the optical axis.   The photoelectric sensor device according to claim 2, wherein the support portion is a screw hole that allows the first movable member to be screwed along the optical axis. The first movable member comprises a magnet;
2. The photoelectric sensor device according to claim 1, wherein the positioning unit adjusts the distance by moving the first movable member along the optical axis by a magnetic force generated outside the case. 3.   2. The photoelectric sensor device according to claim 1, wherein the first movable member includes a defining portion that defines the distance and a separating portion, and the separating portion is configured to be separable from the defining portion. .   The photoelectric sensor device according to claim 1, wherein the positioning unit includes a second movable member that is in contact with the circuit board and adjusts an inclination of the circuit board.   The photoelectric sensor device according to claim 1, further comprising a fixing unit that fixes the first movable member to the case.   The photoelectric sensor device according to claim 1, comprising a plurality of sets of the corresponding optical elements, the circuit board, the lens, and the positioning unit.

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