JP5176190B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a housing and a lid.

  In a power module as an example of a semiconductor device, a substrate on which a semiconductor chip is mounted is mounted in an internal space of a housing, and the internal space is closed with a lid. This lid is fixed to the housing with screws or an adhesive. When the lid is fixed to the housing with screws, a screw tightening method for fixing four diagonal positions of the lid is used. Moreover, when fixing a lid | cover to a housing | casing with an adhesive agent, the adhesive agent system etc. which apply | coat an adhesive agent to a part of each edge | side of a lid | cover, etc. are used.

  As an example of a structure for fixing a lid to a housing with a screw, for example, Japanese Patent Laid-Open No. 10-205830 (Patent Document 1) discloses an inverter control for an air conditioner in which a board on which an electrical component is mounted is attached to a board holder. Circuit devices have been proposed. In this inverter control circuit device for an air conditioner, a plate-like cover member is screwed to the upper opening of the substrate holder so as to close the airtightness of the opening. Further, a convex portion is formed on the opposite side of the side where the screwed portion of the cover member is formed, and the convex portion is fitted into the concave portion formed in the substrate holder.

Japanese Patent Laid-Open No. 10-205830

  In conventional power modules, the screw tightening points or adhesive application points for fixing the lid to the housing are arranged symmetrically or nearly symmetrically with respect to the center of the lid, such as the diagonal or opposite side of the lid. ing. This hinders the reduction of the required number of screws or the required amount of adhesive. In addition, the reduction of screw tightening time or adhesive application time is similarly prevented.

  In the above inverter control circuit device for an air conditioner, the cover member is screwed to the substrate holder in a state in which the convex portion of the cover member is fitted in the concave portion of the substrate holder. Even when the structure of fixing to the substrate holder with screws is applicable to the power module, there are the following problems.

  That is, in the above structure, the opening of the substrate holder and the size of the cover member are equal because of the hermetic structure, and the convex portion is formed so as to protrude from the cover member. Therefore, when fixing the cover member to the substrate holder, it is necessary to fit the convex portion of the cover member into the concave portion of the substrate holder and forcefully fit the cover member into the opening. This fitting is difficult to work and takes time, so productivity is low.

  In addition, in the power module in which the signal terminal protruding from the substrate holder is formed in the vicinity of the opening, it is necessary to attach the lid to the housing so as not to contact the signal terminal. Have difficulty. Therefore, in the above structure, productivity is remarkably lowered.

  The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor device with improved productivity when a lid is attached to a housing.

  The semiconductor device of the present invention has a housing having an internal space that opens to one side and a protruding portion that protrudes toward the internal space, and the internal space can be closed and engaged with the protruding portion in the closed state. Including a first inclined surface that is inclined so that the thickness of the protruding portion decreases toward the tip of the protruding portion in a direction in which the protruding portion protrudes. Includes a second inclined surface that faces the first inclined surface and is inclined so that the thickness of the gradient portion decreases toward the edge of the lid, and is opposite to the inner space of the lid in the closed state. The inclination angle of the first inclined surface with respect to the side surface is configured to be larger than the inclination angle of the second inclined surface.

  According to the semiconductor device of the present invention, the inclined angle of the first inclined surface with respect to the surface opposite to the inner space of the lid in the closed state is configured to be larger than the inclined angle of the second inclined surface. The lid can be slid along the first inclined surface and attached to the housing in a state where the first inclined surface and the second inclined surface are in surface contact with each other. For this reason, the lid can be quickly and accurately attached to the housing with the second inclined surface along the first inclined surface.

  Further, when the lid is attached to the casing, the lid can be inclined and fitted to the casing. Therefore, it is possible to suppress the lid from coming into contact with the signal terminal protruding in the vicinity of the opening of the internal space.

  Further, in the semiconductor device of the present invention, the protruding portion presses the upper side of the lid at the portion where the protruding portion and the gradient portion are engaged in the closed state. Therefore, screwing or bonding with an adhesive is not necessary at the portion where the protrusion and the gradient portion are engaged. Therefore, the required number of screws or the required amount of adhesive can be reduced, and the screw tightening time or adhesive application time can be shortened.

  Accordingly, it is possible to provide a semiconductor device with improved productivity when the lid is attached to the housing.

1A is a schematic plan view (A), a schematic side view (B), and a schematic front view (C) of a semiconductor device according to a first embodiment of the present invention; 1 is a schematic perspective view of a semiconductor device according to a first embodiment of the present invention. It is a schematic sectional drawing in alignment with the III-III line of FIG. It is a schematic sectional drawing which shows the P section of FIG. It is a schematic perspective view which shows the operation | movement at the time of attaching the cover of the semiconductor device in Embodiment 1 of this invention to a housing | casing. It is a schematic plan view of the modification of the semiconductor device in Embodiment 1 of this invention. It is a schematic perspective view of the modification of the semiconductor device in Embodiment 1 of this invention. It is a schematic sectional drawing which follows the VIII-VIII line of FIG. It is a schematic plan view which shows the state before adhere | attaching a lid | cover on the housing | casing of the modification of the semiconductor device in Embodiment 1 of this invention. It is a schematic perspective view which shows the operation | movement at the time of attaching the cover of the modification of the semiconductor device in Embodiment 1 of this invention to a housing | casing. FIG. 6 is a schematic plan view (A), a schematic side view (B), and a schematic front view (C) of the semiconductor device of Comparative Example 1; 7 is a schematic perspective view of a semiconductor device of Comparative Example 1. FIG. It is a schematic sectional drawing which follows the XIII-XIII line | wire of FIG. 10 is a schematic perspective view illustrating an operation when a lid of the semiconductor device of Comparative Example 1 is attached to a housing. FIG. 10 is a schematic plan view showing a state before a lid is bonded to the casing of Comparative Example 2. FIG. 12 is a schematic perspective view showing an operation when a lid of a semiconductor device of Comparative Example 2 is attached to a housing. FIG. It is a schematic plan view of the semiconductor device in Embodiment 2 of this invention. It is a schematic plan view of the modification of the semiconductor device in Embodiment 2 of this invention.

Hereinafter, semiconductor devices according to embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the semiconductor device according to the first embodiment of the present invention will be described.

  Referring to FIGS. 1A to 1C and FIG. 2, semiconductor device 1 of the present embodiment mainly has a housing 2 and a lid 3. The lid 3 is attached to the housing 2 by the protrusion 12 and the screw 11 of the housing 2. An electrode 7 and a signal terminal 8 are arranged on the housing 2 so as to surround the outer edge of the lid 3. The electrode 7 is provided with a nut 9.

  Referring to FIG. 3, the housing 2 has a case 2a and a metal base plate 2b. The case 2a is bonded to the outer edge portion of the metal base plate 2b with an adhesive so as to surround one surface of the metal base plate 2b. A space surrounded by the inner peripheral surface of the case 2a and one surface of the metal base plate 2b forms an internal space 4. One side of the internal space 4 opposite to the metal base plate 2b is open.

  An insulating substrate 6 with a metal thick foil is disposed in the internal space 4. The insulating substrate 6 with the metal thick foil is soldered to the metal base plate 2b. A semiconductor chip 6a is soldered to the surface opposite to the surface soldered to the metal base plate 2b of the insulating substrate 6 with a thick metal foil.

  The electrode 7 and the signal terminal 8 are attached to the case 2a by insert or outsert. The electrode 7 and the signal terminal 8 are electrically connected to the insulating substrate 6 with a metal thick foil or the semiconductor chip 6a by a metal wire 6b or solder to constitute a circuit.

  The internal space 4 is filled with silicone gel 5 so as to cover the insulating substrate 6 with thick metal foil, the semiconductor chip 6a, and the metal wire 6b. The silicone gel 5 is cured. The semiconductor gel 6a is protected by the silicone gel 5, and the different electrodes are insulated.

  3 and 4, the housing 2 has an internal space 4 that opens to one side, and a protrusion 12 that protrudes toward the internal space 4 at the opening.

  The lid 3 is configured to be able to close the internal space 4 by covering the opening of the internal space 4. As a result, the lid 3 can protect the internal space 4 from dust and protection. The lid 3 has a gradient portion 13 that engages with the protrusion 12 in a state in which the internal space 4 is closed.

  The protrusion 12 includes a first inclined surface 12a that is inclined so that the thickness of the protrusion 12 decreases toward the tip of the protrusion 12 in the direction in which the protrusion 12 protrudes. That is, the protruding portion 12 has a tapered shape that tapers toward the tip of the protruding portion 12. The length L in the protruding direction of the protrusion 12 may be formed to be 1 mm or more and 1.5 mm or less, for example.

  The gradient portion 13 includes a second inclined surface 13a that faces the first inclined surface 12a and is inclined so that the thickness of the gradient portion 13 decreases toward the edge of the lid 3. That is, the gradient portion 13 has a tapered shape that tapers toward the edge of the lid 3.

  In a state where the internal space 4 is closed, the inclination angle θ1 of the first inclined surface 12a with respect to the surface 3a opposite to the internal space 4 of the lid 3 is configured to be larger than the inclination angle θ2 of the second inclined surface 13a. ing. Thereby, the lid | cover 3 can be moved with respect to the housing | casing 2 in the state which the 1st inclined surface 12a and the 2nd inclined surface 13a contacted each other in the surface. Further, the lid 3 and the housing 2 can be fitted in a state where the lid 3 is inclined obliquely with respect to the housing 2.

  The inclination angle θ1 of the first inclined surface 12a and the inclination angle θ2 of the second inclined surface 13a are such that the lid 3 is inclined with respect to the housing 2 when the lid 3 is attached to the housing 2. Thus, the lid 3 is formed at such an angle that it does not contact the signal terminal 8 in the vicinity of the opening. For example, the inclination angle θ1 of the first inclined surface 12a may be 30 °, and the inclination angle θ2 of the second inclined surface 13b may be 25 °.

  In a state in which the internal space 4 is closed, the protruding portion 12 of the housing 2 is such that the first inclined surface 12a faces the inside of the internal space 4 and the second inclined surface 13a faces the outside of the internal space 4. And the slope portion 13 of the lid 3 are engaged.

  The lid 3 is configured so that it can be screwed to the housing with screws 11 at portions other than the gradient portion 13. A screw 11 is screwed from a surface 3 a opposite to the inner space 4 of the lid 3. Thereby, it is possible to prevent the lid 3 from dropping from the housing 2. In addition, in this Embodiment, although the screw 11 is screwed in two places, what is necessary is just to be screwed in at least one place.

Next, an operation when the lid of the semiconductor device of this embodiment is attached to the housing will be described.
Referring to FIG. 5, the second inclined surface 13 a of the slope portion 13 (FIG. 3) of the lid 3 and the first inclined surface 12 a of the projection portion 12 of the housing 2 are brought into surface contact, and the above surface contact is made. In this state, the lid 3 is attached to the housing 2 by sliding along the first inclined surface 12a. At this time, the slope portion 13 of the lid 3 is fitted to the protrusion 12 of the housing 2 in a state where the lid 3 is inclined obliquely with respect to the housing 2.

  Thereafter, the lid 3 closes the inner space 4 (FIG. 3) so that one side of the lid 3 on which the slope portion 13 is provided and the other side of the opposite side are attached to the housing 2 with the slope portion 13 of the lid 3 as a fulcrum. It attaches to the housing | casing 2 so that a circular arc may be drawn. With the internal space 4 closed, screws 11 are screwed to two locations near the other side of the lid 3. Thereby, as shown in FIG. 3, the lid 3 is screwed to the housing 2 while the protrusion 12 and the gradient portion 13 are engaged.

  Although the case where the lid 3 is screwed to the housing 2 with the screw 11 has been described above, the lid 3 may be bonded to the housing 2 with an adhesive.

  With reference to FIGS. 6 to 8, in the semiconductor device 1 of the modification of the present embodiment, the lid 3 is bonded to the housing 2 with an adhesive 14. Referring to FIGS. 8 and 9, the housing 2 and the lid 3 are bonded so that the adhesive 14 is sandwiched between one side where the protrusion 12 of the internal space 4 of the housing 2 is provided and the other side of the opposite side. An agent 14 is applied to the housing 2. The lid 3 is bonded to the housing 2 at a portion other than the gradient portion 13.

  Referring to FIG. 10, gradient portion 13 (FIG. 8) of lid 3 is fitted to protrusion 12 of housing 2 in a state where lid 3 is tilted with respect to housing 2. Thereafter, the lid 3 closes the internal space 4 (FIG. 8) so that one side of the lid 3 provided with the gradient portion 13 and the other side of the opposite side are attached to the housing 2 with the gradient portion 13 of the lid 3 as a fulcrum. It attaches to the housing | casing 2 so that a circular arc may be drawn. In the state where the internal space 4 is closed, the other end of the lid 3 is bonded to the housing 2 with an adhesive 14. As a result, as shown in FIG. 8, the lid 3 is bonded to the housing 2 with the adhesive 14 while the protrusion 12 and the gradient portion 13 are engaged.

Next, the function and effect of the semiconductor device of this embodiment will be described in comparison with a comparative example.
With reference to FIGS. 11A to 11C, FIG. 12, and FIG. 13, in semiconductor device 1 of Comparative Example 1, screws 11 are screwed at four diagonal positions of lid 3. Thereby, the lid 3 is screwed to the housing 2. In the semiconductor device 1 of the comparative example 1, the protruding portion 12 of the housing 2 and the gradient portion 13 of the lid 3 are not formed as compared with the semiconductor device 1 of the present embodiment.

  Referring to FIG. 14, lid 3 is attached to casing 2 so that lid 3 closes internal space 4 (FIG. 13) in a state where lid 3 is parallel to casing 2. Screws 11 are screwed to four diagonal positions of the lid 3 in a state where the internal space 4 is closed.

  Referring to FIGS. 15 and 16, in the semiconductor device 1 of the comparative example 2, the adhesive 14 is applied to a part of each of the four sides of the internal space 4. As shown in FIG. 16, the lid 3 is attached to the casing 2 so that the lid 3 closes the internal space 4 (FIG. 15) in a state where the lid 3 is parallel to the casing 2. The four sides of the lid 3 are bonded with an adhesive 14 in a state where the internal space 4 is closed.

  In Comparative Example 1, the lid 3 is screwed to the housing 2 at four diagonal positions of the lid 3. In Comparative Example 2, the lid 3 is bonded to the housing 2 at four sides of the lid 3.

  In contrast, according to the semiconductor device 1 of the first embodiment, the inclination angle θ1 of the first inclined surface 12a with respect to the surface 3a opposite to the inner space 4 of the lid 3 in the closed state is the second inclination. The surface 13a is configured to be larger than the inclination angle θ2.

  Therefore, the lid 3 can be attached to the housing 2 by sliding along the first inclined surface 12a in a state where the first inclined surface 12a and the second inclined surface 13a are in surface contact with each other. For this reason, the lid 3 can be quickly and accurately attached to the housing 2 along the second inclined surface 13a along the first inclined surface 12a.

  In addition, when the lid 3 is attached to the housing 2, the lid 3 can be inclined and fitted to the housing 2. Therefore, it is possible to suppress the lid 3 from coming into contact with the signal terminal 8 or the like protruding in the vicinity of the opening of the internal space 4.

  In the semiconductor device 1 according to the first embodiment, the lid 3 is slid along the first inclined surface 12a in a state where the first inclined surface 12a and the second inclined surface 13a are in surface contact with each other, and the gradient is increased. The lid 3 is moved by the housing 2 with the portion 13 as a fulcrum to close the internal space 4.

  The protrusion 12 presses the upper side of the lid 3 at the portion where the protrusion 12 and the gradient portion 13 are engaged in the closed state. Therefore, in the part where the projection part 12 and the inclination part 13 engage, screwing or adhesion | attachment by an adhesive agent becomes unnecessary. For this reason, compared with Comparative Example 1 or Comparative Example 2, in the semiconductor device 1 of the present embodiment, the required number of screws 11 or the required amount of the adhesive 14 can be reduced, and the screw tightening time or adhesion can be reduced. The agent application time can be shortened. Therefore, the lid 3 can be easily attached to the housing 2.

  As a result, a semiconductor device with improved productivity when the lid 3 is attached to the housing 2 can be provided.

  According to the semiconductor device 1 of the present embodiment, the lid 3 may be configured to be screwed to the housing 2 at a portion other than the gradient portion 13. As a result, the lid 3 is screwed to the housing 2 at a portion other than the slope portion 13 while the slope portion 13 is engaged with the protruding portion 12, so that the productivity of the lid 3 from the housing 2 is improved. Dropping and floating can be prevented.

  According to the semiconductor device 1 of the present embodiment, the lid 3 may be bonded to the housing 2 at a portion other than the gradient portion 13. As a result, the lid 3 is bonded to the housing 2 at a portion other than the slope portion 13 while the slope portion 13 is engaged with the projecting portion 12, so that the productivity of the lid 3 from the housing 2 is improved. Dropping and floating can be prevented.

(Embodiment 2)
The second embodiment of the present invention is mainly different from the first embodiment in that a plurality of protrusions and gradient portions are provided.

  Referring to FIG. 17, in semiconductor device 1 of the present embodiment, opening 10 in internal space 4 (FIG. 3) includes one side 10a and another side 10b that intersects one side 10a. Yes. The protruding portion 12 includes a first protruding piece 12f provided on one side 10a and a second protruding piece 12s provided on the other side 10b. The first projecting piece 12f and the second projecting piece 12s have the same structure as the projecting portion 12 of the first embodiment.

  The gradient portion 13 includes a first gradient portion 13f that engages with the first projection piece 12f and a second gradient portion 13s that engages with the second projection piece 12s. The first gradient portion 13f and the second gradient portion 13s have the same structure as the gradient portion 13 of the first embodiment.

  The first protruding piece 12f and the first gradient portion 13f are engaged, and the second protruding piece 12s and the second gradient portion 13s are engaged. The lid 3 is screwed to the housing 2 at two locations in the vicinity of one side where the first gradient portion 13f of the lid 3 is provided and the other side of the opposite side.

  In addition, since the structure other than this of this Embodiment is the same as the structure of Embodiment 1 mentioned above, about the same element, the same code | symbol is attached | subjected and the description is not repeated.

  In the semiconductor device 1 of the present embodiment, the engagement between the first protruding piece 12f and the first gradient portion 13f and the engagement between the second protruding piece 12s and the second gradient portion 13s are performed simultaneously. Is called. Therefore, each of the first protrusions 12f and the second protrusions 12s is first in a state where the two sides of the lid 3 corresponding to the one side 10a and the other side 10b of the opening 10 are inclined obliquely. The lid 3 is attached to the housing 2 along the inclined surface 12a. Thereafter, the lid 3 is attached toward the housing 2 with the first gradient portion 13f and the second gradient portion 13f as fulcrums so that the lid 3 closes the internal space 4 (FIG. 3). With the internal space 4 (FIG. 3) closed, the screws 11 are screwed at two locations near the other side of the lid 3. Accordingly, as shown in FIG. 17, the first protrusion 12f and the first gradient portion 13f are engaged, and the second protrusion 12s and the second gradient portion 13s are engaged while the lid 3 is engaged. Is screwed to the housing 2.

  Although the case where the lid 3 is screwed to the housing 2 with the screw 11 has been described above, the lid 3 may be bonded to the housing 2 with an adhesive as in the first embodiment.

  Referring to FIG. 18, in the semiconductor device 1 according to the modification of the present embodiment, the lid 3 is bonded to the housing 2 with an adhesive 14 (FIG. 8) at a portion other than the gradient portion 13. Since other configurations of the modification of the present embodiment are the same as the configurations of the present embodiment described above, the same elements are denoted by the same reference numerals, and description thereof is not repeated.

  According to the semiconductor device 1 of the present embodiment, the opening 10 of the internal space 4 includes one side 10a and another side 10b that intersects the one side 10a, and the protrusion 12 is provided on the one side 10a. The first protruding piece 12f and the second protruding piece 12s provided on the other side 10b, and the gradient portion 13 includes a first gradient portion 13f and a second gradient portion 13f that engage with the first protruding piece 12f. And a second gradient portion 13s that engages with the protruding piece 12s.

  Therefore, the lid 3 has two housings at two locations by engaging the first projecting piece 12f with the first gradient portion 13f and engaging the second projecting piece 12s with the second gradient portion 13s. 2 is engaged. Therefore, compared with the case where it engages at one place, the lid | cover 3 can be firmly engaged with the housing | casing 2. FIG.

  In addition, since the engagement between the first protruding piece 12f and the first gradient portion 13f and the engagement between the second protruding piece 12s and the second gradient portion 13s are performed at positions intersecting each other, the first The engagement between the protruding piece 12f and the first gradient portion 13f and the engagement between the second protruding piece 12s and the second gradient portion 13s can be performed simultaneously. Therefore, the lid 3 can be quickly attached while being firmly engaged with the housing 2.

  In addition, in the state where the two sides of the lid 3 corresponding to the one side 10a and the other side 10b of the opening 10 are both inclined obliquely, the first projection piece 12f and the second projection piece 12s are The lid 3 can be attached to the housing 2 along one inclined surface 12a. Accordingly, the lid 3 can be prevented from coming into contact with the signal terminals 8 and the like in the vicinity of the opening while the lid 3 is firmly engaged with the casing 2.

The above embodiments can be combined in a timely manner.
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Semiconductor device, 2 housing | casing, 2a case, 2b metal base board, 3 lid | cover, 3a surface opposite to internal space, 4 internal space, 5 silicone gel, 6 insulating board with metal thick foil, 6a semiconductor chip, 6b metal Wire, 7 electrode, 8 signal terminal, 9 nut, 10 opening, 10a one side, 10b other side, 11 screw, 12 protrusion, 12a first inclined surface, 12f first protrusion, 12s second Projecting piece, 13 slope portion, 13a second slope surface, 13f first slope portion, 13s second slope portion, 14 adhesive.

Claims (4)

A housing having an internal space opening on one side and having a protrusion protruding toward the internal space;
A lid that can close the internal space and has a slope portion that engages with the protrusion in the closed state;
The protrusion includes a first inclined surface that is inclined so that the thickness of the protrusion decreases toward the tip of the protrusion in a direction in which the protrusion protrudes,
The gradient portion includes a second inclined surface that faces the first inclined surface and is inclined so that the thickness of the gradient portion decreases toward the edge of the lid,
The semiconductor device is configured such that, in the closed state, an inclination angle of the first inclined surface with respect to a surface of the lid opposite to the internal space is larger than an inclination angle of the second inclined surface. The opening of the internal space includes one side and another side intersecting the one side;
The protruding portion includes a first protruding piece provided on the one side and a second protruding piece provided on the other side,
2. The semiconductor according to claim 1, wherein the gradient portion includes the first gradient portion that engages with the first protrusion piece and the second gradient portion that engages with the second protrusion piece. apparatus.   The semiconductor device according to claim 1, wherein the lid is configured to be screwed to the casing at a portion other than the slope portion.   The semiconductor device according to claim 1, wherein the lid is bonded to the housing at a portion other than the slope portion.

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