JP3953426B2 - Case for semiconductor device and semiconductor device including the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a case for a semiconductor device for protecting a semiconductor element in which a lid can be easily attached and detached. The present invention also relates to a semiconductor device including a case in which a lid can be easily attached and detached.
[0002]
[Prior art]
In recent years, a power module type semiconductor device including a switching element and a control circuit has been developed as a power device. In the semiconductor device, the switching element and the control circuit are sealed in a case, and the case can be sealed by fixing the element and the circuit to the bottom and attaching a lid to the top.
[0003]
2. Description of the Related Art Conventionally, in a sealing cap used in a ceramic container having a semiconductor element fixed at the bottom and an opening at the top, it is known to form a protrusion at the outer edge of the sealing cap. Since the protruding portion is separated from the container when the sealing cap is fixed to the periphery of the opening of the ceramic container and the container is sealed, the sealing cap is sandwiched with a nipper or the like after sealing. Could be peeled from the container and easily opened (see, for example, Patent Documents 1 and 2).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 02-051256 [Patent Document 2]
Japanese Patent Laid-Open No. 02-148857
[Problems to be solved by the invention]
When a power module type semiconductor device is manufactured, for example, when an operation abnormality due to a defective switching element or control circuit or a failure due to wiring failure occurs, the lid on the top of the case is removed to replace the element or rewire the element. Etc. are repaired. In a device using a conventional cap, the cap cannot be supported by covering the opening of the container, so it is fixed to the container at an appropriate stage. Since the cap can no longer be resealed, it is virtually impossible to reuse the device after the cap is sealed.
[0006]
As another case for a power module type semiconductor device, for example, a structure in which a lid member supporting portion is provided on the inner surface of the opening of the bottomed container and the lid member can be supported while being fitted in the opening. Can be considered. In such a case, the lid member is not fixed and is detachable until it is confirmed that there is no defect in the semiconductor device. The case can be completely sealed by fixing the side surface of the lid member and the inner surface of the container with an adhesive or the like, and fixing the lid and the container with screws or the like.
[0007]
However, in the case where the lid member can be attached and detached, since the lid is fitted into the opening at the top of the container, it is difficult to remove the lid, and the case often has to be turned upside down to remove the lid member. In such a case, it takes time to repair a defective product, which causes a reduction in manufacturing efficiency. Also, if a pin or the like is inserted into the gap between the lid and the container to remove the lid, the lid or the container may be damaged, resulting in a defective product in the case appearance.
[0008]
Furthermore, if the lid is not sufficiently bonded and it is necessary to reapply the adhesive, the lid member can be removed even if the case is turned upside down because part of the lid member is already bonded to the container. As a result, the adhesive may not be reapplied, resulting in a defective product.
[0009]
Therefore, the present invention can remove the lid member quickly and easily without damaging the case with the case placed, and the lid member can be removed even if the lid member is partially bonded to the container. It is an object to provide a case for a semiconductor device that can be separated.
Another object of the present invention is to provide a semiconductor device including a case in which it is easy to expose the inside of the device by removing the lid member as described above.
[0010]
[Means for Solving the Problems]
The present invention energizes a container having an opening in the upper part, a lid member installed in the opening, a support part fixed to the inner surface of the container side wall and supporting the lid member inside the opening, and the inside and outside of the container A case for a semiconductor device for fixing a semiconductor element to a bottom surface of a container, and by pressing an outer edge portion or a corner portion on the surface of the lid member, The outer edge portion or the corner portion facing the pressed portion of the lid member with the contact portion as a fulcrum can be raised upward to tilt the lid member.
[0011]
Since the case of the present invention can lift a part of the lid member by pushing the pressed part of the lid member to open a gap between the container and the lid member, the tweezers etc. are inserted into the gap and the lid member The lid member can be removed by pinching. In the case of the present invention, since the lid member can be easily detached simply by pressing the pressing position of the lid member, there is no need to turn the case upside down and there is no possibility of damaging the case. Furthermore, the case of the present invention allows the lid member to be tilted by adjusting the pressing force even if a part of the lid member is adhered to the container. be able to.
[0012]
The present invention is a semiconductor device including one or more semiconductor elements and the above case that receives and protects the semiconductor elements. Since the semiconductor device of the present invention can remove the lid member of the case as described above, the lid member can be easily attached and detached. Therefore, defective parts and adhesion defects found at the time of manufacturing the semiconductor device can be repaired in a relatively short time, and both the manufacturing efficiency and the yield rate of the semiconductor device can be increased.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1. FIG.
The case for a semiconductor device of the present invention is a case for a semiconductor device comprising a container having a bottom part and a side wall part, and a lid member fitted into the opening on the upper surface of the container, and the lid member is fixed to the inner surface of the container side wall. It is supported by the supported part.
In the present embodiment, an example of a case including a container having a rectangular cross section is shown. The case of this embodiment has a space part in which the lid member can be pushed below the depression part of the lid member, and when the depression part of the lid member is pushed into the space part, the support part and the lid member back surface The position facing the pressing portion of the lid member can be lifted using one point or one line of the contact portion as a fulcrum.
[0014]
A support part is a several step surface with which the container inner wall was equipped, and supports the outer edge part of a cover member. These step surfaces are preferably fixed to the four corners of the inner surface of the container side wall, and the step surfaces of the four corners support the squares of the lid member, so that the lid member can be supported relatively stably. The support portion using the step surface can be provided with a space between the inclined step surface and the lid member by forming at least one step surface to be inclined.
[0015]
The case of the present embodiment is preferably provided with at least one inclined step surface, and the inclination direction of the inclined step surface is preferably lowered toward the corner of the container to which the inclined step surface is fixed. In such a case, the contact surface between the lid member and the step surface can be widened by making the other step surface flat, and the lid member can be supported more stably. The pressing portion is a corner portion of the lid member supported by the inclined step surface, and the top portion of the inclined step surface serves as a fulcrum, and the corner portion of the lid member that is diagonal to the pressing portion can be lifted.
[0016]
In another case of this embodiment, the inclined step surface can be formed at two adjacent corners. The two inclined step surfaces are preferably arranged so as to exist on the same plane and are inclined so as to become lower toward the container side wall. In the case having such a support portion, the pressing portion serves as the outer edge portion of the lid member supported by the inclined step surface, so that a plurality of points of the lid member can be simultaneously pushed and tilted.
[0017]
The case of this embodiment preferably includes an engaging means that allows the lid member to be detachably fixed to the container, and the lid member can be fixed after fixing the semiconductor element or the like. The engaging means includes, for example, screwing, and screws are screwed from the outside of the container side wall to the side surface of the lid member through the side wall. In addition, when the lid member is formed of a thin plate and cannot be engaged with a screw on the side surface of the lid member, a screwing tongue piece can be formed on the outer edge portion of the lid member and screwed.
[0018]
The container constituting the case of the present invention has a semiconductor element and necessary passive elements fixed to the bottom surface. The container bottom plate can mount and fix a substrate such as a printed circuit board having a semiconductor element fixed to the inner surface. Further, the semiconductor element may be fixed to the inner surface using the bottom surface itself as a substrate. The container can be formed integrally by molding the side wall and the bottom plate separately and then fixed with an adhesive or the like, or the side wall and the bottom plate can be formed integrally.
[0019]
The container has an external electrode connected to an external device, an internal electrode connected to the element inside the case by wire bonding or the like, and the electrodes are electrically connected so that the internal element can be electrically connected to the outside. Wiring to be connected. In general, the external electrode is formed on the top of the container side wall, and the internal electrode is formed at an appropriate position on the inner surface of the bottom plate. The wiring generally passes through the inside of the side wall, and one end is connected to the external electrode and the other end is connected to the internal electrode.
When wiring on the container side wall, the position of the screw hole should be set so that the screw that engages the container side wall and the side surface of the lid portion does not contact the wiring or break the wiring.
[0020]
The container can be formed from an insulating resin such as an epoxy resin and ceramic. The lid member and the support portion can be formed from a resin such as an epoxy resin, a ceramic, a metal thin plate, or the like.
[0021]
The semiconductor device including the case according to the present embodiment has a printed circuit board in which a semiconductor element such as a switching element or a control circuit, or an element such as a passive element such as a capacitor, resistor, or coil is fixed to the inner surface of the bottom plate of the case. An electric circuit is appropriately formed with metal wires or the like. These elements are electrically connected to the external electrode through the internal electrode inside the container.
In the semiconductor device in which the element wiring is completed, the side part of the lid member of the case and the inner surface of the container side wall are fixed with an adhesive, and are further fixed by engagement means using screws or the like to seal the element.
[0022]
As described above, the semiconductor device of the present invention supports the lid member until the lid member is bonded, and the lid member can be easily detached by pressing the pressing portion from the support state. Repair of element defects and wiring defects found in (1) can be performed quickly, and production efficiency and yield are improved. Furthermore, even when only a part of the cover member is bonded due to poor application of the adhesive when the cover member is bonded, the cover member can be removed relatively easily by pressing the pressing portion of the cover member, and the adhesive is reapplied. As a result, the defect rate can be reduced.
[0023]
Embodiment 2. FIG.
In the case of this embodiment, instead of the inclined step surface of the first embodiment, a part of the back surface of the lid member is excised to form a cut inclined portion, and a space portion is formed between the back surface of the lid member and the support portion. Is.
In this embodiment, the back surface of the lid member has a strip-shaped cut inclined portion formed by cutting at least one ridge portion, and the other support portion uses a stepped surface along the inner wall of the container. Is preferred. The step surface of the container is set inside the side wall of the container so as to come into contact with two outer edge portions of the lid member intersecting with the outer edge portion of the lid member on which the cut inclined portion is formed. In this case, a part of the step surface is opposed to the cut inclined portion, and a space for pressing down the lid member is formed.
[0024]
In the case of this embodiment, the pressed part is the outer edge on the surface side of the outer edge of the lid member on which the cutting inclination part is formed, and the fulcrum becomes the boundary line of the cutting inclination part. The lid member can be tilted by pushing, so it is easy to push down, and by widening the excision inclined part, it is easy to widen between the push part and the fulcrum, and the lid member can be tilted with a small pressing force. Can be made. In addition, since the width of the lid member is wider than the interval between the two step surfaces, an accident in which the lid member falls from between the step surfaces is unlikely to occur, and the lid member can be attached and detached with peace of mind.
[0025]
The cutting slope can be formed on one outer edge and can be formed on both opposing outer edges. The lid member can be tilted by depressing the upper part of an arbitrary cutting inclined portion due to the case during the manufacturing process and the state around the case, for example, the restriction of the external space such as a socket connected to the external electrode. .
[0026]
It is preferable that the cutting inclined portion has a cut surface formed into a curved surface and has a thin edge portion, and particularly the width of the cutting inclined portion is preferably widened. The lid member formed in this way can be smoothly inclined when pressed. In such a case, the lid member is likely to be shaken and it is difficult to screw the engagement between the container side wall portion and the lid member. It is preferable to provide a plurality of slide-type stoppers that can hold the surface to the same surface. When tilting the lid member, slide the stopper to the unlocking position so that the lid member moves, and when engaging, slide the stopper to the fixed position to stably fix the lid member. Therefore, the lid can be attached and detached multiple times as necessary.
[0027]
It is more preferable that the cutting inclined portion is formed in a flat plane whose cutting surface is inclined, and the lid member jumps up when the pressing force is too large by limiting the tiltable angle of the lid member by the angle of the cutting surface. Can be prevented. Moreover, it is preferable to adjust the width | variety of a cutting | disconnection inclination part appropriately, and to increase the contact area of a cover member back surface and a step surface, and while being able to support a cover member stably, using a screw, a cover member And the container side wall can be engaged and fixed.
[0028]
In the semiconductor device including the case according to the present embodiment, an electric circuit is formed so that elements such as a semiconductor element and a passive element have a target function, as in the first embodiment. These elements are electrically connected to the external electrode through the internal electrode inside the container. In the completed semiconductor device, the side part of the case lid member and the inner surface of the container side wall are fixed with an adhesive, and are further engaged and fixed by an engagement means using a slide-type stopper, screws, etc., thereby sealing the element. is doing.
[0029]
In the semiconductor device of this embodiment, the lid member is supported until the lid member is bonded, and the lid member can be easily detached by pressing the pressing portion from the support state. Wiring defects can be repaired and replaced quickly, improving production efficiency. Furthermore, even when only a part is bonded due to poor application of the adhesive during bonding, the lid member can be removed relatively easily by pressing the pressing portion of the lid member, and the adhesive can be reapplied. Therefore, the defect rate can be reduced.
[0030]
Embodiment 3. FIG.
In the case of this embodiment, the support portion supports the back surface of the lid member, and the lid member is tilted by pressing down the upper portion of the non-contact portion of the lid member.
In the present embodiment, the support portion is composed of two or more projecting members projecting inwardly from the inner surfaces of the two opposing side walls of the container, and one or more locking members fixed to the inner surface of the container side wall. . In this case, the outer edge of the lid member that is supported by the two protruding members intersects with the outer edge of the protruding member as a fulcrum by pressing the outer edge of the lid member that is not supported by the locking member. The lid member outer edge is lifted, and the lid member can be inclined. In this case, since the support portion is a protrusion, the ratio of the support portion occupying the space inside the container can be kept low, and in particular, it does not occupy the bottom surface to which the semiconductor element is fixed, and thus does not hinder element placement. ,preferable. Further, in this case, since the pressing portion becomes the outer edge portion of the lid member, the lid member can be tilted by simultaneously pressing a plurality of points of the lid member.
[0031]
The case of this embodiment preferably includes an engaging means that allows the lid member to be detachably engaged with the container. The lid member can be engaged and fixed after fixing the semiconductor element or the like. As the engaging means, there is screwing, for example, a screw can be screwed from the outside of the container side wall to the side surface of the lid member through the side wall. In this embodiment, it is preferable to form the lid member in a thin plate shape, and to form a screw-fastening tongue piece on the outer edge portion of the lid member, and to screw the lid member. Even with a small protruding member, the lid member can be stably supported.
As the locking member of the present embodiment, the stepped surface on the inner surface of the side wall of the first and second embodiments can be used, and a protruding member different from the protruding member can also be used.
[0032]
In the semiconductor device including the case of the present embodiment, an electric circuit is formed so that elements such as a semiconductor element and a passive element have a target function, as in the first and second embodiments. These elements are electrically connected to the external electrode through the internal electrode inside the container.
In the completed semiconductor device, the side portion of the lid member of the case and the inner surface of the container side wall are fixed with an adhesive, and are further engaged and fixed by engagement means using screws or the like to seal the element.
[0033]
The semiconductor device of the present invention supports the lid member until the lid member is bonded, and can be easily removed by tilting the lid member by pushing the pressing part from the supported state. Repair and replacement of the issued element failure and wiring failure can be performed quickly, and the production efficiency is improved. Furthermore, even when only a part is bonded due to poor application of the adhesive during bonding, the lid member can be removed relatively easily by pressing the pressing portion of the lid member, and the adhesive can be reapplied. Therefore, the defect rate can be reduced.
[0034]
【Example】
Example 1.
As shown in FIGS. 1A and 1B, the case 1 for a semiconductor device has inclined stepped surfaces 30 and flat surfaces at the four corners of a bottomed rectangular container in which the side wall 20 and the bottom plate 15 are integrated. A step surface 35 is formed. The lid member 25 is supported by the inclined step surface 30 and the flat step surface 35 so that the surface of the lid member 25 is substantially flush with the upper surface of the container, and is provided in the container opening. An external electrode 75 is formed on the upper surface of the side wall 20 so as to be conductive to the inside of the container through the inside of the side wall 20 to which the electrode is fixed.
[0035]
Specifically, each step surface has an inclined step surface 30 in which the support portion of the lid member as shown in FIG. 2A is inclined, and the support portion of the lid member as shown in FIG. 2B is flat. There is a flat step surface 35, and the inclination direction of the inclined step surface 30 is lowered toward the corner of the side wall 20 as shown in FIG. The height from the top 31 of the inclined step surface 30 to the container bottom plate 15 is equal to the height from the flat step surface 35 to the container bottom plate 15, and the lid member 25 is flat with the top 31 of the inclined step surface 30. It is supported by the step surface 35.
[0036]
In the case 1 of this embodiment, a space 90 is formed below the position P of the lid member 25 in FIG. 1B, and the position P is pushed down to the position P ′ by pushing down the position P. At this time, the top portion 31 of the inclined step surface 30 serves as a fulcrum, and the position Q that is diagonal to the pressed position P is lifted to the position Q ′, so that a gap is formed between the lid member 25 and the container. The lid member 25 can be easily removed by picking up the position Q ′ with tweezers or the like.
[0037]
In this embodiment, as shown in FIG. 1A, a desired semiconductor element 85 is fixed to the inner surface of the bottom plate 15 of the case 1, and a semiconductor device electrically connected to the external electrode 75 by an appropriate method is obtained. Can do.
[0038]
Example 2
As shown in FIGS. 3 and 4A, the semiconductor device case 1 according to the present embodiment is a container having a side wall 20 and a bottom plate 15, and a stage fixed along the inner surfaces of the two side walls 20 facing each other. A surface 40 is provided. The cover member 25 is flat on the front surface 28 side, the outer edge portions 26 and 26 facing the back surface 29 side are cut off, and the entire back surface 29 is formed in a curved surface, and can be shaken along the step surface 40 which is a support portion. It is supported. In this example, the case 1 is provided with four slidable stoppers 45 on the upper surface of the side wall 20 facing each other. The stopper 45 is in a fixed release position in FIG. 3, and is in a fixed position in FIG. 4 (A). An external electrode 75 is formed on the upper surface of the side wall 20 so as to be conductive to the inside of the container through the inside of the side wall 20 to which the electrode is fixed.
[0039]
In the case of this embodiment, as shown in FIG. 4B, after the stopper 45 in the fixed position is slid to the fixed release position 45 ′, the outer edge 26 on the left side of the lid member 25 in the drawing is placed in the space portion. By pushing it into 90 to the position 26 ', the outer edge 26 on the right side of the drawing is lifted up to 26' and a gap is formed between the lid member 25 and the container. The lid member 25 can be easily removed by picking up the outer edge portion 26 ′ with tweezers or the like.
[0040]
In this embodiment, as in FIG. 1A, a semiconductor device in which a desired semiconductor element is fixed to the inner surface of the bottom plate 15 of the case 1 and electrically connected to the external electrode 75 by an appropriate method can be obtained. .
[0041]
Example 3
As shown in FIGS. 5 and 6A, the semiconductor device case of the present embodiment includes a container including a side wall 20 and a bottom plate 15, and a step surface 40 fixed to the inner surfaces of the two side walls 20 facing each other. It has. The cover member 25 has a flat surface on the front surface 23 side, and the outer edge portion 21 facing the back surface 24 side is cut off to form a stepped surface. The lid member 25 is supported by the container by a contact surface between the flat portion of the back surface 24 of the lid member 25 and the step surface 40 that is a support member. A through hole 55 penetrating in the thickness direction is formed in the container side wall 20, and a screw hole 50 corresponding to the position of the through hole 55 is formed in the side surface 22 of the lid member 25. An external electrode 75 is formed on the upper surface of the side wall 20 to which the through-hole 55 is not fixed, and can be conducted to the inside of the container through the inside of the side wall 20 to which the electrode is fixed.
[0042]
In the case of the present embodiment, the cut portion is the space portion 90, and the outer edge portion 21 on the left side of the lid member in the drawing as shown in FIG. The outer edge portion 21 on the right side of the drawing is lifted up to 21 ′ and a gap is formed between the lid member 25 and the container. The lid member 25 can be easily removed by picking up the outer edge portion 21 ′ with tweezers or the like.
[0043]
In this embodiment, as in FIG. 1A, a semiconductor device in which a desired semiconductor element is fixed to the inner surface of the bottom plate 15 of the case and electrically connected to the external electrode 75 by an appropriate method can be obtained.
[0044]
Example 4
As shown in FIGS. 7, 8 </ b> A and 8 </ b> B, the semiconductor device case of the present example was fixed to the container including the side wall 20 and the bottom plate 15 and the inner surfaces of the two side walls 20 facing each other. And a support portion made of a protruding member 60. In this example, four projecting members 60 are fixed and also function as locking members. A screw hole 55 penetrating in the thickness direction is formed in the container side wall 20. The lid member is formed from a relatively thin flat plate, and tongue pieces 65 that protrude in the back surface direction of the lid member and have screw holes 50 are formed on two opposing outer edge portions 67 thereof. The tongue piece 65 is arranged so that the screw hole 50 of the tongue piece 65 corresponds to the through hole 55 of the container side wall 20.
An external electrode 75 is formed on the upper surface of the side wall 20 to which the through-hole 55 is not fixed, and can be conducted to the inside of the container through the inside of the side wall 20 to which the electrode is fixed.
[0045]
In the case of this embodiment, the outer edge portion 66 where the tongue portion 65 is not formed can be pressed or raised. In the state where the screw is removed, as shown in FIG. 8C, the outer edge 66 on the left side of the lid member is pushed down to the position 66 'so that the outer edge 66 on the right side of the figure is 66'. And a gap is formed between the lid member 25 and the container. The lid member 25 can be easily removed by picking up the outer edge portion 66 ′ with tweezers or the like.
[0046]
In this embodiment, as in FIG. 1A, a semiconductor device in which a desired semiconductor element is fixed to the inner surface of the bottom plate 15 of the case and electrically connected to the external electrode 75 by an appropriate method can be obtained.
[0047]
【The invention's effect】
The case for a semiconductor device of the present invention has an outer edge portion or a corner portion that faces the pressing portion of the lid member with the contact portion between the back surface of the lid member and the support portion as a fulcrum by pressing the outer edge portion or corner portion of the lid member surface. The lid is tilted upward and the lid member tilts, so that the lid member fitted in the container can be easily removed without turning the case upside down and fixed in the case. The time required for reworking can be shortened. Further, since there is no possibility of damaging the case, it is possible to substantially eliminate defective products resulting from removal of the lid member during repair. Further, the case of the present invention can improve the adhesion failure between the lid member and the container, which has been a defective product in the past, by re-adhering, so the yield of defective products is reduced and the yield is reduced. Can be better.
[0048]
Since the semiconductor device of the present invention includes the above-described case, it is possible to repair defective parts and adhesion defects found during the manufacture of the semiconductor device in a relatively short time, and the semiconductor device manufacturing efficiency and non-defective rate Both can be raised and the cost of the semiconductor device can be reduced.
[Brief description of the drawings]
1A is a top view of a semiconductor device case according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line XX in FIG.
FIG. 2 is a partial perspective view showing an example of fixing an inclined step surface (A), a flat step surface (B), and an inclined step surface according to an embodiment of the present invention.
FIG. 3 is an exploded view of the semiconductor device case according to the embodiment of the present invention.
4A is a top view of a semiconductor device case according to an embodiment of the present invention, and FIG. 4B is a cross-sectional view taken along line YY in FIG.
FIG. 5 is an exploded view of the semiconductor device case according to the embodiment of the present invention.
6A is a top view of a semiconductor device case according to an embodiment of the present invention, and FIG. 6B is a cross-sectional view taken along line ZZ in FIG. 4A.
FIG. 7 is an exploded view of the semiconductor device case according to the embodiment of the present invention.
8A is a top view of a semiconductor device case according to an embodiment of the present invention, FIG. 4B is a cross-sectional view along YY in FIG. 4A, and a cross-sectional view along ZZ (C). ).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor device case 15 Bottom plate 20 Side wall 25 Lid member 30 Inclined step surface 35 Flat step surface 40 Step surface 45 Stopper 50 Screw hole 55 Through hole 60 Projection member 65 Tongue piece 75 External electrode 85 Semiconductor element 90 Space part

Claims (10)

A container having an opening in the upper part, a lid member housed in the opening, a support part that is fixed to the inner surface of the container side wall and supports the lid member inside the opening, and electricity that enables electrical conduction between the inside and outside of the container A case for a semiconductor device comprising a wiring, and fixing a semiconductor element to the bottom of the container,
By pressing the outer edge or corner of the lid member surface, the outer edge or corner facing the pressed part of the lid member rises upward with the contact portion between the back surface of the lid member and the support as a fulcrum and tilts the lid member A semiconductor device case. 2. The semiconductor device according to claim 1, wherein the support portion has an inclined portion in which a part thereof is inclined, and a space portion is formed between the inclined portion and the lid member so as to receive a depressed portion of the lid member. For case. The support part is composed of a plurality of step surfaces fixed to corners of the inner surface of the container side wall, and at least one of the plurality of step surfaces is an inclined step surface in which an inclined part is formed. Case for semiconductor devices. The semiconductor device case according to claim 3, wherein the inclined step surface is inclined so as to be lowered toward a corner portion of the container to which the step surface is fixed. A step surface in which the lid member has a strip-shaped cut inclined portion formed by cutting out the outer edge portion of the back surface of the lid member, and the support portion is disposed and fixed on the inner surface of the container side wall in a direction intersecting the longitudinal direction of the cut inclined portion. Consisting of
The case for a semiconductor device according to claim 1, wherein a space that can receive a depressed portion of the lid member is formed between the cut inclined portion and the lid member. The support portion is composed of two or more projecting members projecting inwardly from the inner surfaces of two opposing side walls of the container side wall, and one or more locking members fixed to the inner surface of the container side wall, and is supported by the projecting member. The case for a semiconductor device according to claim 1, wherein the lid member can be tilted about the protrusion as a fulcrum by pressing down the lid member outer edge that intersects the two lid member outer edges. A semiconductor device comprising one or more semiconductor elements and a case for receiving and protecting the semiconductor elements,
A container in which the case has an opening at the top and fixes the semiconductor element on the bottom; a lid member housed in the opening; a support that is fixed to the inner surface of the container side wall and supports the lid member inside the opening; Comprising electrical wiring capable of energizing the inside and outside of the container,
By pressing the outer edge or corner of the lid member surface, the outer edge or corner facing the pressed part of the lid member rises upward with the contact portion between the back surface of the lid member and the support as a fulcrum and tilts the lid member A semiconductor device in which the lid member can be easily attached and detached. 8. The support portion of the case has a cut-out portion with a part cut away, and a space portion is formed between the cut-out portion and the lid member so as to receive a depressed portion of the lid member. Semiconductor device. The lid member of the case has a strip-shaped cut inclined portion formed by cutting the outer edge portion of the back surface of the case, and the support portion is arranged and fixed on the inner surface of the container side wall in the direction intersecting the longitudinal direction of the cut inclined portion. Consisting of a stepped surface,
The semiconductor device according to claim 7, wherein a space that can receive a depressed portion of the lid member is formed between the cut inclined portion and the lid member. The support portion of the case includes two or more projecting members projecting inwardly from the inner surfaces of two opposing side walls of the container side wall, and one or more locking members fixed to the inner surface of the container side wall. The semiconductor device according to claim 7, wherein the lid member can be tilted with the protrusion as a fulcrum by pressing down the lid member outer edge that intersects the two supported lid member outer edges.

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