JP5154124B2 - Plasma processing equipment - Google Patents

Plasma processing equipment Download PDF

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JP5154124B2
JP5154124B2 JP2007089804A JP2007089804A JP5154124B2 JP 5154124 B2 JP5154124 B2 JP 5154124B2 JP 2007089804 A JP2007089804 A JP 2007089804A JP 2007089804 A JP2007089804 A JP 2007089804A JP 5154124 B2 JP5154124 B2 JP 5154124B2
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processing apparatus
plasma processing
ground electrode
electrode
space
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JP2008251744A (en
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昌伸 本田
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東京エレクトロン株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32559Protection means, e.g. coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • H01J37/32633Baffles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816Pressure
    • H01J37/32834Exhausting

Description

  The present invention relates to a plasma processing apparatus, and more particularly to a plasma processing apparatus having an electrode connected to a DC power source.

  A parallel plate type plasma comprising: a storage chamber for storing a wafer as a substrate; a lower electrode disposed in the storage chamber and connected to a high frequency power source; and an upper electrode disposed to face the lower electrode Processing devices are known. In this plasma processing apparatus, a processing gas is introduced into the accommodation chamber and high-frequency power is supplied into the accommodation chamber. Further, when the wafer is accommodated in the accommodation chamber and placed on the lower electrode, plasma is generated from the introduced processing gas by high-frequency power, and the wafer is subjected to plasma processing, for example, etching processing.

  In recent years, for the purpose of improving plasma processing performance, a plasma processing apparatus has been developed in which an upper electrode is connected to a DC power source and a DC voltage is applied to a storage chamber. In order to apply a DC voltage to the storage chamber, it is necessary to provide a ground electrode (hereinafter simply referred to as “ground electrode”) of the DC voltage applied to the storage chamber, the surface of which is exposed in the storage chamber. However, when plasma processing is performed using a reactive processing gas, a reaction product (depot) may adhere to the surface of the ground electrode to form a deposition film.

  Since the deposition film is insulative, the direct current from the upper electrode to the ground electrode is obstructed, making it impossible to apply a direct current voltage into the storage chamber, resulting in an unstable plasma in the storage chamber. Or, plasma processing characteristics may change.

Correspondingly, the inventor has shown through experiments that the main cause of deposition film formation is cations in the plasma and that there are few cations near the corners formed by the components in the plasma processing apparatus. Based on this knowledge, it was proposed to suppress the formation of a deposition film or the like on the surface of the ground electrode by arranging the ground electrode in the vicinity of the corner (see, for example, Patent Document 1). .)
Japanese Patent Application No. 2006-081352

  However, even if the ground electrode is arranged near the corner, the ground electrode is still exposed in the accommodation chamber, so that some cations reach the ground electrode and form a deposition film on the surface of the ground electrode. Since the deposition film is slowly formed, it is not impossible to immediately apply a DC voltage to the accommodation chamber. For example, when the accumulated time of the plasma treatment passes 70 hours, the value of the DC current flowing through the accommodation chamber is 1. It has been confirmed by the present inventor that the voltage drops from 43A to 1.33A. There is a problem that a decrease in the value of the direct current causes a change in plasma processing characteristics.

  The objective of this invention is providing the plasma processing apparatus which can suppress the fall of the value of the direct current which flows through a storage chamber over a long time.

In order to achieve the above object, a plasma processing apparatus according to claim 1, a storage chamber for storing a substrate and performing plasma processing, a mounting table disposed in the storage chamber for mounting the substrate, and a vent hole the a, a processing space the housing chamber is disposed below the outer periphery of the mounting table and an exhaust plate that partitions into an exhaust space, provided in the mounting table, a first electrode high-frequency power Ru is supplied, provided on the upper wall of the housing chamber so as to face the substrate placed on the mounting table, and a second electrode to which a DC voltage is Ru is applied, the processing space so as to cover the lower portion of the first electrode It is disposed, and the second conductive ground electrode against the electrode, a plasma processing apparatus and an exhaust device for exhausting the housing chamber, along the flow of exhaust toward said vent hole in said processing space , said the flow of the exhaust ground electrode Interposed between, and in cross-section toward the short side upstream of the flow of the exhaust of the elongated groove-shaped space is shaped the long continuous section Ru is formed opening between the ground electrode As described above, a shielding member disposed in the storage chamber is provided.

The plasma processing apparatus according to claim 2 , wherein the substrate is accommodated to perform plasma processing, and the substrate is placed, and a high-frequency voltage is supplied to the conductor portion, whereby the processing space in the accommodation chamber has a high frequency. A first electrode for supplying electric power; a second electrode disposed opposite to the first electrode to which a DC voltage is applied; and a flow path for exhausting gas from the processing space to the outside of the storage chamber Is disposed in the exhaust passage so as to cover the lower side of the first electrode and the exhaust passage formed by the sidewall of the storage chamber and the sidewall of the first electrode, and is applied to the second electrode. A plasma processing apparatus including a ground electrode for a direct current voltage, the plasma processing apparatus including a shielding member that surrounds the ground electrode so that a groove-like space is formed between the ground electrode, and the groove-like space is a flow of the exhaust gas. characterized in that the opening towards the upstream To.

The plasma processing apparatus according to claim 6 is the plasma processing apparatus according to any one of claims 1 to 5 , wherein an end of the shielding member on the opening side of the groove-shaped space is on the opening side. It protrudes along the flow of the exhaust gas from the end of the ground electrode.
The plasma processing apparatus according to claim 7 is the plasma processing apparatus according to claim 6, wherein an amount of protrusion of the end portion of the shielding member on the opening side with respect to the end portion of the ground electrode on the opening side is 3 mm or less. It is characterized by being.

A plasma processing apparatus according to claim 8 is provided in a storage chamber for storing a substrate and performing plasma processing, a mounting table disposed in the storage chamber and mounting the substrate, and provided in the mounting table. A first electrode to be supplied; a second electrode provided on an upper wall of the accommodation chamber so as to face the substrate placed on the mounting table; and a second electrode to which a DC voltage is applied; and provided in the accommodation chamber A plasma processing apparatus, comprising: a ground electrode for the second electrode exposed on a surface of a configured component; and an exhaust device for exhausting the chamber. The plasma processing apparatus includes a surface along the surface of the component in the chamber. A shielding member is disposed so that a groove-like space having a long cross section is formed between the ground electrode and a short side of the long cross section that is open toward the upstream of the flow of the exhaust gas. It is characterized by providing .

The plasma processing apparatus according to claim 9 is the plasma processing apparatus according to any one of claims 1 to 8, wherein a gap between the ground electrode forming the groove-like space and the shielding member is 0.5 mm. It is characterized by being larger than.
The plasma processing apparatus according to claim 10 is the plasma processing apparatus according to claim 9, wherein the gap is 2.5 mm or more and 5.0 mm or less.
The plasma processing apparatus according to claim 11 is the plasma processing apparatus according to claim 10, wherein the gap is 3.5 mm or more.
The plasma processing apparatus according to claim 12 is the plasma processing apparatus according to any one of claims 1 to 11 , wherein an aspect ratio in a cross section of the groove-shaped space is 3.0 or more.

14. The plasma processing apparatus according to claim 13 , wherein a storage chamber for storing a substrate and performing plasma processing, a susceptor provided in the storage chamber for mounting the substrate, and a shower head disposed opposite to the susceptor. A first electrode provided in the susceptor to which high-frequency power is supplied; a second electrode provided in the shower head to which a DC voltage is applied; an inner wall of the housing chamber; and a side surface of the susceptor An exhaust passage formed between the exhaust passage, a ground electrode for the second electrode, and an exhaust device for exhausting the gas in the storage chamber to the outside through the exhaust passage. A plasma processing apparatus comprising: a shielding member interposed between the exhaust flow in the exhaust flow path and the ground electrode; and the shielding member places a predetermined gap between the ground electrode. Disposed Te, height in the exhaust flow direction is equal to or higher than the ground electrode.

  According to the plasma processing apparatus of claim 1, the shielding member is disposed along the flow of the exhaust and between the flow of the exhaust and the ground electrode in the accommodating chamber in which the direct current is applied and the direct current flows. A groove-shaped space having a long cross section is formed between the ground electrode and the ground electrode. In the storage chamber, the plasma is distributed along the flow of the exhaust gas, and the positive ions move from the plasma toward the components including the ground electrode, but the shielding member is interposed between the exhaust flow and the ground electrode, The shielding member shields the ground electrode from moving cations. Further, since radicals in the plasma easily adhere to the member, the radicals adhere to both wall surfaces in the vicinity of the opening of the groove-like space having a long cross section, and hardly enter the groove-like space. Therefore, cations and radicals do not reach the ground electrode in the groove-like space, and as a result, no deposit film due to cations or radicals is formed on the ground electrode for a long time. On the other hand, since electrons in the plasma move freely, they enter the groove-like space and reach the ground electrode. As described above, it is possible to maintain the arrival of electrons at the ground electrode for a long time, and thus it is possible to suppress a decrease in the value of the direct current flowing through the accommodation chamber for a long time.

According to the plasma processing apparatus of the ninth aspect, the gap between the ground electrode forming the groove-like space and the shielding member is larger than 0.5 mm. Usually, since the thickness of the sheath existing between the plasma and the component is about 0.5 mm, when the gap is larger than 0.5 mm, the opening in the groove-like space can face the plasma. Thus, electrons can be moved from the plasma to the ground electrode through the opening, and thus a direct current can be reliably passed into the accommodation chamber.

According to the plasma processing apparatus of claim 10, since the gap between the ground electrode forming the groove-like space and the shielding member is 2.5 mm or more and 5.0 mm or less, radicals enter the groove-like space. While preventing, the penetration | invasion of the electron to this groove-shaped space is not inhibited. Therefore, it is possible to reliably suppress a decrease in the value of the direct current flowing through the accommodation chamber over a long period of time.

According to the plasma processing apparatus of the eleventh aspect, since the gap between the ground electrode forming the groove-like space and the shielding member is 3.5 mm or more, the opening of the groove-like space becomes wide, and the groove-like space is formed. Electrons can smoothly enter, and plasma oscillation can be prevented.

According to the plasma processing apparatus of claim 12, since the aspect ratio in the cross section of the groove-like space is 3.0 or more, the radicals enter the groove before entering the depth of the groove-like space having a long cross section. It adheres to both wall surfaces in the vicinity of the opening of the space. As a result, radicals do not enter the interior of the groove-like space, and thus it is possible to prevent the entire surface of the ground electrode from being covered with the deposition film for a long period of time.

  According to the plasma processing apparatus of claim 6, since the end of the shielding member on the opening side of the groove-like space protrudes along the flow of exhaust gas from the end of the ground electrode on the opening side, the opening It is possible to positively attach radicals that are about to enter the groove-like space from the shielding member. As a result, it is possible to prevent the ground electrode from being covered with the deposition film over a long period of time.

  According to the plasma processing apparatus of the seventh aspect, since the protruding amount of the end portion of the shielding member on the opening side with respect to the end portion of the ground electrode on the opening side is 3 mm or less, the protruding portion of the shielding member has a groove shape. It is possible to suppress the inhibition of the entry of electrons into the space, thereby preventing the occurrence of plasma shaking.

  According to the plasma processing apparatus of claim 8, the shielding member is between the ground electrode along the surface of the component part and exposed to the surface of the component part in the accommodation chamber in which the direct current is applied and the direct current flows. The cross section is disposed so as to form a long groove-like space. In the storage chamber, the plasma is distributed along the surface of the component, and the cation moves from the plasma toward the component including the ground electrode, but the shielding member is arranged along the surface of the component. The shielding member shields the ground electrode from moving cations. Further, since radicals in the plasma easily adhere to the member, the radicals adhere to both wall surfaces in the vicinity of the opening of the groove-like space having a long cross section, and hardly enter the groove-like space. Therefore, cations and radicals do not reach the ground electrode in the groove-like space, and as a result, no deposit film due to cations or radicals is formed on the ground electrode for a long time. On the other hand, since electrons in the plasma move freely, they enter the groove-like space and reach the ground electrode. As described above, it is possible to maintain the arrival of electrons at the ground electrode for a long time, and thus it is possible to suppress a decrease in the value of the direct current flowing through the accommodation chamber for a long time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a schematic configuration of the plasma processing apparatus according to the present embodiment. This plasma processing apparatus is configured to perform an etching process on a semiconductor wafer W as a substrate.

  In FIG. 1, a plasma processing apparatus 10 has a substantially cylindrical storage chamber 11 for storing a semiconductor wafer W (hereinafter simply referred to as “wafer W”). Indoor). Plasma to be described later is generated in the processing space PS. A cylindrical susceptor 12 as a mounting table on which the wafer W is mounted is disposed in the storage chamber 11. The inner wall side surface of the storage chamber 11 is covered with a side wall member 13, and the upper surface of the inner wall of the storage chamber 11 is covered with an upper wall member 14. The side wall member 13 and the upper wall member 14 are made of aluminum, and the surface facing the processing space PS is coated with yttria or alumite having a predetermined thickness. Since the storage chamber 11 is electrically grounded, the potentials of the side wall member 13 and the upper wall member 14 are ground potential. The susceptor 12 includes a conductive portion 15 made of a conductive material, for example, aluminum, a side surface covering member 16 (component) made of an insulating material that covers the side surface of the conductive portion 15, and the side surface covering member. 16 and an enclosure member 17 made of quartz (Qz).

  In the plasma processing apparatus 10, an exhaust channel 18 (accommodating chamber) that functions as a channel for exhausting the gas in the processing space PS to the outside of the accommodating chamber 11 is formed by the inner wall of the accommodating chamber 11 and the side surface of the susceptor 12. The An exhaust plate 19 that is a plate-like member having a large number of ventilation holes is disposed in the exhaust flow path 18. The exhaust plate 19 partitions an exhaust space ES that is a lower space of the exhaust flow path 18 and the storage chamber 11. Here, the exhaust passage 18 communicates the exhaust space ES and the processing space PS. Further, the roughing exhaust pipe 20 and the main exhaust pipe 21 are opened in the exhaust space ES. A DP (Dry Pump) (not shown) is connected to the roughing exhaust pipe 20, and a TMP (Turbo Molecular Pump) (not shown) is connected to the main exhaust pipe 21.

  The roughing exhaust pipe 20, the main exhaust pipe 21, DP, TMP and the like constitute an exhaust device. The rough exhaust pipe 20 and the main exhaust pipe 21 pass the gas in the processing space PS through the exhaust passage 18 and the exhaust space ES. Exhaust to the outside of the storage chamber 11. Specifically, the roughing exhaust pipe 20 depressurizes the processing space PS from atmospheric pressure to a low vacuum state, and the main exhaust pipe 21 cooperates with the roughing exhaust pipe 20 to reduce the processing space PS from the atmospheric pressure to a low vacuum state. The pressure is reduced to a high vacuum state (for example, 133 Pa (1 Torr or less)) which is a lower pressure.

  A high frequency power source 22 is connected to the conductor portion 15 of the susceptor 12 via a matching unit 23, and the high frequency power source 22 supplies a relatively high frequency, for example, high frequency power of 40 MHz to the conductor portion 15. Thereby, the susceptor 12 functions as a high-frequency electrode and supplies high-frequency power of 40 MHz to the processing space PS. The matching unit 23 reduces the reflection of the high frequency power from the conductor portion 15 to maximize the supply efficiency of the high frequency power to the conductor portion 15.

  Further, another high-frequency power source 24 is connected to the conductor portion 15 via a matching unit 25. The other high-frequency power source 24 has a frequency lower than the high-frequency power supplied by the high-frequency power source 22, for example, 2 MHz. Is supplied to the conductor 15.

  An electrostatic chuck 27 having an electrostatic electrode plate 26 therein is disposed on the susceptor 12. The electrostatic chuck 27 has a shape in which an upper disk-shaped member having a diameter smaller than that of the lower disk-shaped member is stacked on a lower disk-shaped member having a certain diameter. A power supply 28 is electrically connected. When the susceptor 12 places the wafer W, the wafer W is placed on the electrostatic chuck 27. At this time, when a negative DC voltage is applied to the electrostatic electrode plate 26, a positive potential is generated on the back surface of the wafer W. Therefore, a potential difference is generated between the electrostatic electrode plate 26 and the back surface of the wafer W. The wafer W is attracted and held on the upper surface of the electrostatic chuck 27 by Coulomb force or Johnson-Rahbek force resulting from the potential difference.

An annular focus ring 29 is disposed on the susceptor 12 so as to surround the wafer W attracted and held on the upper surface of the susceptor 12. The focus ring 29 is made of silicon (Si) or silica (SiO 2 ), is exposed to the processing space PS, converges the plasma in the processing space PS toward the surface of the wafer W, and improves the efficiency of the etching process. An annular cover ring 30 made of quartz is disposed around the focus ring 29 to protect the side surface of the focus ring 29.

  Inside the susceptor 12, for example, an annular refrigerant chamber 31 extending in the circumferential direction is provided. A refrigerant having a predetermined temperature, for example, cooling water or a Galden (registered trademark) liquid, is circulated and supplied to the refrigerant chamber 31 from a chiller unit (not shown) via a refrigerant pipe 32, and is supplied to the upper surface of the susceptor 12 by the refrigerant. The processing temperature of the wafer W held by suction is controlled.

  Further, a plurality of heat transfer gas supply holes 33 are opened in a portion where the wafer W on the upper surface of the susceptor 12 is adsorbed and held (hereinafter referred to as “adsorption surface”). The plurality of heat transfer gas supply holes 33 are connected to a heat transfer gas supply unit (not shown) via a heat transfer gas supply line 34 disposed inside the susceptor 12, and the heat transfer gas supply unit Helium (He) gas as gas is supplied to the gap between the adsorption surface and the back surface of the wafer W through the heat transfer gas supply hole 33.

  Further, a plurality of pusher pins 35 serving as lift pins that can protrude from the upper surface of the susceptor 12 are arranged on the suction surface of the susceptor 12. These pusher pins 35 protrude freely from the suction surface. The pusher pin 35 is accommodated in the susceptor 12 when the wafer W is held by suction on the suction surface in order to perform the etching process on the wafer W, and the pusher pin is moved when the wafer W subjected to the etching process is carried out of the storage chamber 11. The pins 35 protrude from the suction surface and lift the wafer W upward.

  A shower head 36 is disposed on the ceiling of the storage chamber 11 so as to face the susceptor 12. The shower head 36 includes a disk-shaped cooling plate 38 made of an insulating material, in which a buffer chamber 37 is formed, an upper electrode plate 39 supported by the cooling plate 38, and a lid that covers the cooling plate 38. 40. The upper electrode plate 39 is a disk-shaped member made of a conductive material such as silicon, with the lower surface exposed to the processing space PS. The peripheral edge of the upper electrode plate 39 is covered with an annular shield ring 41 made of an insulating material. That is, the upper electrode plate 39 is electrically insulated by the cooling plate 38 and the shield ring 41 from the wall portion of the storage chamber 11 that is at the ground potential.

  The upper electrode plate 39 is electrically connected to the upper DC power source 42, and a negative DC voltage is applied to the upper electrode plate 39. Accordingly, the upper electrode plate 39 applies a DC voltage to the processing space PS. Since a DC voltage is applied to the upper electrode plate 39, it is not necessary to arrange a matching unit between the upper electrode plate 39 and the upper DC power source 42, and the matching unit is provided on the upper electrode plate as in the conventional plasma processing apparatus. The structure of the plasma processing apparatus 10 can be simplified as compared with the case where a high frequency power source is connected via the terminal.

  A processing gas introduction pipe 43 from a processing gas supply unit (not shown) is connected to the buffer chamber 37 of the cooling plate 38. The shower head 36 also has a plurality of through gas holes 44 that allow the buffer chamber 37 to communicate with the processing space PS. The shower head 36 supplies the processing gas supplied from the processing gas introduction pipe 43 to the buffer chamber 37 to the processing space PS through the through gas hole 44.

  The plasma processing apparatus 10 further includes an annular ground ring 45 (ground electrode) that is disposed in the exhaust flow path 18 and has an L-shaped cross section. The ground ring 45 is made of a conductive material, for example, silicon, and functions as a ground electrode for a DC voltage applied by the upper electrode plate 39. The ground ring 45 is disposed below the side surface covering member 16 of the susceptor 12 so as to cover the side surface of the susceptor base portion 15a. That is, when it is assumed that the shielding member 46 described later does not exist, when the susceptor 12 is viewed from the side, the grounding ring 45 appears to be exposed on the surface of the side surface covering member 16. Electrons emitted from the upper electrode plate 39 reach the ground ring 45, and a direct current flows through the processing space PS.

  In this plasma processing apparatus 10, by supplying high-frequency power to the processing space PS, high-density plasma is generated from the processing gas supplied from the shower head 36 in the processing space PS, and a direct current in the processing space PS is further generated. The plasma generated by the above is maintained in a desired state, and the wafer W is etched by the plasma.

  By the way, radicals, cations and electrons which are activated neutral particles are mixed in the generated plasma. When cations and radicals, especially CF-based cations and radicals reach and adhere to the ground ring 45, a deposit film may be formed on the surface of the ground ring 45.

  In general, in order not to cover the surface of the member with a deposition film, (1) a method of removing the formed deposition film by sputtering with ions, or (2) a method of preventing cations and radicals from reaching the surface of the member. Either of these is used. Here, since it is necessary to provide a sputtering process in the method (1), the etching process of the wafer is complicated, and there is a possibility that the deposits sputtered and peeled off from the member surface become particles. Therefore, in this embodiment, the deposition film is prevented from being formed on the surface of the ground ring 45 by the method (2).

  Here, cations, radicals, and electrons in the plasma have the following movement characteristics.

Cations: move from plasma toward the member facing the plasma Radicals: easy to be trapped on the surface of the member, the tendency is remarkable with highly reactive radicals Electrons: There is no directionality in movement, each electron In this embodiment, in consideration of the cation, radical, and electron movement characteristics described above, the grounding ring 45 is shielded from the cation moving from the plasma and the member for capturing the radical is grounded. Provided in the vicinity of the ring 45. Specifically, a shielding member 46 described in detail below that shields the ground ring 45 in FIG. 1 is provided in the exhaust flow path 18 of the plasma processing apparatus 10.

  FIG. 2 is an enlarged cross-sectional view illustrating a schematic configuration of the grounding ring and the shielding member that shields the grounding ring in FIG. 1.

  In FIG. 2, an annular shielding member 46 is placed on the lower extension 45 a of the ground ring 45 having an L-shaped cross section. The shielding member 46 is made of an insulating material, for example, quartz, and is arranged concentrically with the grounding ring 45. Further, in the cross section along the radial direction of the grounding ring 45 (shielding member 46) (that is, the cross section shown in FIG. 2), the shielding member 46 is disposed along the surface of the side surface covering member 16 and A groove-like space 47 having a long cross section is formed therebetween. Here, since the flow of exhaust gas in the exhaust flow path 18 (indicated by the white arrow in the figure) is along the surface of the side surface covering member 16, the shielding member 46 is also along the flow of exhaust gas in the cross section. Since the groove-shaped space 47 is sandwiched between the ground ring 45 exposed on the surface of the side surface covering member 16 and the shielding member 46 along the flow of exhaust, the groove-shaped space 47 also follows the flow of exhaust. Between the current flow and the ground ring 45. The groove-like space 47 opens toward the upstream of the exhaust flow.

  Further, the end 46 a of the shielding member 46 on the opening side in the groove-like space 47 (hereinafter simply referred to as “opening side”) is more exhausted than the end 45 b of the grounding ring 45 on the opening side. It protrudes along, specifically toward the upstream of the flow of exhaust.

  In the exhaust flow path 18, the plasma 48 is distributed along the flow of the exhaust gas and along the surface of the component such as the side surface covering member 16. The cations indicated by “◯” in the figure move from the plasma 48 toward the side surface covering member 16 and the ground ring 45, but the shielding member 46 is interposed between the exhaust flow (that is, the plasma 48) and the ground ring 45. Therefore, the shielding member 46 shields the ground ring 45 from moving cations.

  Further, radicals indicated by “Δ” in the figure try to enter the groove-like space 47 from the plasma 48, but the radicals move along the flow of the exhaust gas, so the radicals are opened only upstream of the exhaust gas flow. It is difficult to enter the groove-shaped space 47 to be moved. Furthermore, since radicals are easily captured on the surface of the member, they adhere to both wall surfaces near the opening of the groove-like space 47. As a result, radicals hardly enter the groove-like space 47. In particular, in the plasma processing apparatus 10, since the end 46a of the shielding member 46 on the opening side protrudes more upstream of the exhaust flow than the end 45b of the grounding ring 45 on the opening side, the radical is a shielding member. 46 positively adheres.

  Therefore, cations and radicals do not reach the ground electrode surface 45c of the ground ring 45 in the groove-like space 47, and as a result, a deposit film caused by cations and radicals is formed on the ground electrode surface 45c for a long time. It is never formed.

  On the other hand, since the electrons indicated by “x” in the figure move freely, they enter the groove-like space 47 from the plasma 48 and reach the ground electrode surface 45c. As a result, a direct current can flow through the processing space PS and the exhaust passage 18.

  By the way, in the plasma processing apparatus 10, as shown in FIG. 3, the gap t between the ground electrode surface 45 c of the ground ring 45 forming the groove-like space 47 and the shielding member 46 is between the side surface covering member 16 and the plasma 48. If it is set to be smaller than the thickness ts of the existing sheath 49, the opening of the groove-like space 47 cannot face the plasma 48. As a result, electrons in the plasma 48 (indicated by “x” in the figure) are difficult to enter the groove-like space 47, and the electrons do not reach the ground electrode surface 45c. No direct current particles flow through 18.

  Therefore, in the present embodiment, the gap t between the ground electrode surface 45 c and the shielding member 46 is set to be larger than the thickness ts of the sheath 49. Thereby, the opening of the groove-like space 47 can face the plasma 48. Since the thickness of the sheath is usually about 0.5 mm, the gap t is set larger than 0.5 mm.

  Further, the thickness of the shielding member 46 in the radial direction is set to a thickness that can ensure rigidity, for example, 5 mm or more from the viewpoint of preventing the shielding member 46 from being damaged and facilitating handling.

  According to the plasma processing apparatus 10 according to the present embodiment, in the exhaust flow path 18, the shielding member 46 is along the surface of the side surface covering member 16 and the like and along the flow of the exhaust. Since it is disposed so as to form a groove-like space 47 having a long cross section between the ground ring 45 and the ground ring 45, the arrival of electrons to the ground electrode surface 45 c is maintained for a long time. Therefore, a decrease in the value of the direct current flowing through the processing space PS and the exhaust passage 18 can be suppressed for a long time.

  Further, in the plasma processing apparatus 10, the end 46 a of the shielding member 46 on the opening side protrudes more upstream of the exhaust flow than the end 45 b of the grounding ring 45 on the opening side. Radicals that are about to enter the space 47 can be positively attached to the shielding member 46 in the vicinity of the opening of the groove space 47. As a result, it is possible to prevent the ground electrode surface 45c from being covered with the deposition film over a long period of time.

  Furthermore, in the plasma processing apparatus 10, the gap t between the ground electrode surface 45c and the shielding member 46 is set to be larger than 0.5 mm, so that the opening of the groove-shaped space 47 can be opposed to the plasma 48, Accordingly, since electrons can be moved from the plasma 48 to the ground electrode surface 45c through the opening, a direct current can be reliably supplied to the processing space PS and the exhaust flow path 18.

  The shielding member 46 described above is placed on the lower extension 45a of the grounding ring 45. However, the shielding member 46 is provided with an engaging part that engages with the outer periphery of the grounding ring 45, and the grounding ring 45 and The shielding member 46 may be engaged.

  The ground ring 45 and the shielding member 46 are provided in the vicinity of the exhaust plate 19 of the exhaust passage 18, but may be provided anywhere in the processing space PS and the exhaust passage 18 as long as they are in the vicinity of the plasma. However, the shielding member that forms the groove-like space having a long cross section together with the grounding ring needs to follow the flow of exhaust gas or the surface of the component.

  Although the ground ring 45 is made of silicon, it may be made of silicon carbide, and the shielding member 46 may be made of not only quartz but also a metal member having an insulating film sprayed on the surface.

  Further, the ground electrode is not limited to the annular member such as the ground ring 45, and the ground electrode may be constituted by a plurality of conductive members arranged around the susceptor 12.

  In the plasma processing apparatus 10 described above, two types of high frequency power are supplied to the conductor portion 15 of the susceptor 12, but one type of high frequency power is supplied to the conductor portion 15 of the susceptor 12 and the upper electrode plate 39 of the shower head 36. Electric power may be supplied. In this case, the same effect as described above can be obtained.

  Next, examples of the present invention will be described.

  First, the inventor confirmed the influence of the presence or absence of the shielding member 46 in the plasma processing apparatus 10 on the rate of decrease (deterioration rate) of the value of the direct current flowing through the processing space PS.

Example 1
In the plasma processing apparatus 10, the gap t between the ground electrode surface 45 c of the ground ring 45 and the shielding member 46 is set to 2.5 mm, and the ground ring 45 on the opening side of the end portion 46 a of the shielding member 46 on the opening side is set. The protrusion amount T from the end 45b (see FIG. 2, hereinafter simply referred to as “the protrusion amount T of the shielding member 46”) was set to 0 mm.

  Thereafter, the plasma processing apparatus 10 repeats the etching process on the wafer W, measures the value of the direct current flowing through the processing space PS in each etching process, and displays the measured direct current value in the graph of FIG. ". Then, an approximate expression of the rate of decrease of the direct current value of Example 1 in the graph of FIG. 4 (hereinafter simply referred to as “decrease rate”) was calculated, and the following equation (1) was obtained.

DC current value = -1.75 × 10 −5 × number of processed wafers + 1.33 (1)
Here, “−1.75 × 10 −5 ” corresponds to the decrease rate.

Example 2
In the plasma processing apparatus 10, the gap t was set to 3.5 mm, and the protrusion amount T of the shielding member 46 was set to 3.0 mm.

  Thereafter, similarly to the first embodiment, the plasma processing apparatus 10 repeatedly performs the etching process on the wafer W, measures the value of the direct current flowing through the processing space PS in each etching process, and determines the measured direct current value. Indicated by “Δ” in the graph of FIG. And when the approximate expression of the decreasing speed of Example 2 in the graph of FIG. 4 was computed, following formula (2) was obtained.

DC current value = −6.04 × 10 −6 × number of processed wafers + 1.39 (2)
Here, “−6.04 × 10 −6 ” corresponds to the decrease rate (deterioration rate).

Comparative Example 1
In the plasma processing apparatus 10, the shielding member 46 is removed, and in the same manner as in the first embodiment, the etching process on the wafer W is repeated in the plasma processing apparatus 10, and the value of the direct current flowing through the processing space PS in each etching process is measured. The measured direct current value is indicated by “◯” in the graph of FIG. And when the approximate formula of the decreasing speed of the comparative example 1 in the graph of FIG. 4 was computed, following formula (3) was obtained.

DC current value = −1.21 × 10 −4 × number of processed wafers + 1.44 (3)
Here, “−1.21 × 10 −4 ” corresponds to the decrease rate (deterioration rate).

  In the graph of FIG. 4, when the direct current reductions of Examples 1 and 2 and Comparative Example 1 are compared, the reduction rate of Example 1 is improved to about 1/7 of the reduction rate of Comparative Example 1, and further, Example 2 It was found that the rate of decrease was improved to about 1/20 of the rate of decrease in Comparative Example 1.

  Next, the present inventor confirmed the influence of the gap t on the rate of decrease of the direct current value.

Example 3
In the plasma processing apparatus 10, the gap t was set to 4.0 mm, and the protrusion amount T of the shielding member 46 was set to 3.0 mm.

  Thereafter, similarly to the first embodiment, the plasma processing apparatus 10 repeatedly performs the etching process on the wafer W, measures the value of the direct current flowing through the processing space PS in each etching process, and determines the measured direct current value. Indicated by “□” in the graph of FIG.

Example 4
In the plasma processing apparatus 10, the gap t was set to 5.0 mm, and the protrusion amount T of the shielding member 46 was set to 3.0 mm.

  Thereafter, similarly to the first embodiment, the plasma processing apparatus 10 repeatedly performs the etching process on the wafer W, measures the value of the direct current flowing through the processing space PS in each etching process, and determines the measured direct current value. In the graph of FIG.

  The measured direct current value in Example 2 (gap t is 3.5 mm) is also indicated by “Δ” in the graph of FIG.

  In the graph of FIG. 5, when the DC current values of Examples 2, 3, and 4 are compared, the DC current value hardly changes in any of the Examples, and the rate of decrease in the DC current value is any of the Examples. But it turned out to be almost zero.

  As described above, from Examples 1 to 4, it was found that if the gap t is 2.5 mm or more and 5.0 mm or less, a decrease in the value of the direct current flowing in the processing space PS can be suppressed for a long time. . This is to prevent the entry of electrons into the grooved space 47 while preventing the entry of radicals into the grooved space 47 by setting the gap t to any of 2.5 mm to 5.0 mm. It was guessed that there was not.

  In addition, when the gap t is increased, radicals easily enter the groove-like space 47, and a deposition film is formed on the ground electrode surface 45c, which may reduce the value of the direct current flowing through the processing space PS. As shown in FIG. 4, even when the gap t is 5.0 mm, the value of the direct current hardly changed. Therefore, at least if the gap t is 5.0 mm, the radical enters the depth of the groove-like space 47. As a result, it was found that, before reaching the ground electrode surface 45 c, it adheres to both wall surfaces in the vicinity of the opening of the groove-like space 47. Here, since the length L (see FIG. 2) along the flow of the exhaust gas of the shielding member 46 is 15 mm, the aspect ratio in the cross section of the groove-like space 47 is 3.0. Therefore, if the aspect ratio in the cross section of the groove-like space 47 is 3.0 or more, radicals do not enter the depth of the groove-like space 47, and the entire surface of the ground electrode surface 45c is covered with the deposition film. It has been found that it can be prevented over time.

  By the way, when the gap t is reduced or the aspect ratio in the cross section of the grooved space 47 is increased (that is, the protruding amount T of the shielding member 46 is increased), not only radicals but also electrons enter the grooved space 47. It becomes difficult to do. If electrons are difficult to enter, direct current is less likely to flow through the processing space PS. Therefore, the present inventor examined the influence of the gap t and the protrusion amount T on the ease of flow of the direct current.

  Specifically, since the plasma in the processing space PS fluctuates when it becomes difficult for a direct current to flow in the processing space PS, the values of the gap t and the protrusion amount T are changed to various values, and the plasma fluctuation is observed.

Examples 5-13
First, in the plasma processing apparatus 10 including the new grounding ring 45, during the etching process, the values of the gap t and the protrusion amount T were changed to various values, and plasma fluctuations were observed. The observation results are summarized in the table shown in FIG.

  From the table of FIG. 6, it was found that as the gap t becomes larger, the plasma does not easily sway, and if the gap t is 3.5 mm, the plasma sway does not occur much. This is presumed to be because the opening of the space formed by the grounding ring 45 and the shielding member 46 becomes wide and electrons can smoothly enter the space.

  It is also found that if the space formed by the ground ring 45 and the shielding member 46 has an L-shaped cross section, plasma fluctuations are likely to occur, but if at least the space is a grooved space, plasma fluctuations do not occur. It was.

  As described above, if the grounding ring 45 and the shielding member 46 form a groove-like space and the gap t between the grounding ring 45 and the shielding member 46 is 3.5 mm or more, it is possible to prevent the occurrence of plasma fluctuation. I understood.

Examples 14-20
Next, in the plasma processing apparatus 10, after etching the wafer W for 50 hours, during the etching process, the values of the gap t and the protrusion amount T were changed to various values, and plasma fluctuations were observed. The observation results are summarized in the table shown in FIG.

  From the table of FIG. 7, it was found that the greater the protrusion amount T, the easier the plasma sway. This is presumed to be because the end portion 46 a of the shielding member 46 hinders the entry of electrons into the groove-like space 47 when the protruding amount T is large. In particular, when the gap t is 4.0 mm, the plasma fluctuation occurs when the protrusion amount T is 6.5 mm, whereas the plasma fluctuation does not occur when the protrusion amount T is 3 mm. Has been found to be preferably 3 mm or less.

  From the above, it has been found that if the protrusion amount T is 3 mm or less, the occurrence of plasma fluctuation can be prevented.

  In the table of FIG. 7, as in the table of FIG. 6, it was confirmed that the fluctuation of the plasma is less likely to occur as the gap t becomes larger.

It is sectional drawing which shows schematic structure of the plasma processing apparatus which concerns on embodiment of this invention. It is an expanded sectional view which shows schematic structure of the grounding ring in FIG. 1, and the shielding member which shields this grounding ring. It is a figure for demonstrating the relationship between the thickness of a sheath, and the clearance gap between a ground electrode surface and a shielding member. It is a graph which shows the influence which the presence or absence of a shielding member has on the fall rate of the value of the direct current which flows in the processing space. It is a graph which shows the influence which the clearance gap between the surface of a ground electrode and a shielding member has on the fall rate of the value of the direct current which flows in the process space. In the plasma processing equipment with a new grounding ring, the results of observing plasma fluctuation by changing the gap between the ground electrode surface and the shielding member and the protruding amount of the end of the shielding member to various values are summarized. It is a table. Summary of the results of observing plasma fluctuations by changing the values of the gap between the ground electrode surface and the shielding member and the protruding amount of the end of the shielding member to various values in the plasma processing apparatus that has been etched for 50 hours It is a table.

Explanation of symbols

W Wafer PS Processing space 10 Plasma processing apparatus 11 Storage chamber 12 Susceptor 16 Side surface covering member 18 Exhaust flow path 39 Upper electrode plate 42 Upper DC power supply 45 Grounding ring 45c Ground electrode surface 46 Shielding member 46a End portion 47 Grooved space 48 Plasma 49 sheath

Claims (18)

  1. A storage chamber for storing a substrate and performing plasma treatment;
    A mounting table disposed in the housing chamber and mounting the substrate;
    An exhaust plate that has a vent hole and is disposed on the lower outer periphery of the mounting table to partition the storage chamber into a processing space and an exhaust space;
    Provided the mounting table, a first electrode high-frequency power Ru is supplied,
    Provided on the upper wall of the housing chamber so as to face the substrate placed on the mounting table, and a second electrode to which a DC voltage is Ru is applied,
    And a ground electrode wherein is arranged in the processing space so as to cover the lower portion of the first electrode, against the second electrodes,
    A plasma processing apparatus comprising an exhaust device for exhausting the storage chamber,
    Wherein in the processing space along the flow of exhaust toward said vent holes, interposed between the ground electrode and the flow of the exhaust gas, and, in cross-section elongated groove-shaped space between the ground electrode is the the plasma processing apparatus characterized in that it comprises a shielding member which short sides of the elongated cross section is disposed in the housing chamber so that the formed opening toward the upstream of the flow of the exhaust.
  2. A storage chamber for storing a substrate and performing plasma treatment;
    A first electrode that mounts the substrate and supplies high-frequency power to a processing space in the accommodation chamber by supplying a high-frequency voltage to the conductor;
    A second electrode disposed opposite to the first electrode to which a DC voltage is applied;
    An exhaust flow path that forms a flow path for exhausting gas from the processing space to the outside of the storage chamber by a side wall of the storage chamber and a side wall of the first electrode;
    A plasma processing apparatus comprising: a ground electrode for a direct current voltage applied to the second electrode, disposed in the exhaust flow path so as to cover a lower portion of the first electrode;
    A plasma processing apparatus, comprising: a shielding member that surrounds the ground electrode so that a groove-like space is formed between the ground electrode, and the groove-like space opens toward the upstream of the exhaust flow.
  3. The plasma processing apparatus according to claim 2, wherein the ground electrode has an annular shape and has an L-shaped cross section.
  4. The plasma processing apparatus according to claim 2, further comprising a covering member made of an insulating material and disposed so as to cover the conductor portion.
  5. 5. The plasma processing apparatus according to claim 2, further comprising a plate-shaped exhaust plate having a large number of ventilation holes arranged in the exhaust flow path.
  6. 6. The end of the shielding member on the opening side of the groove-shaped space protrudes along the flow of the exhaust gas from the end of the ground electrode on the opening side. The plasma processing apparatus of any one of Claims.
  7. The plasma processing apparatus according to claim 6, wherein a protruding amount of an end portion of the shielding member on the opening side with respect to an end portion of the ground electrode on the opening side is 3 mm or less.
  8. A storage chamber for storing a substrate and performing plasma treatment;
    A mounting table disposed in the housing chamber and mounting the substrate;
    Provided the mounting table, a first electrode high-frequency power Ru is supplied,
    Provided on the upper wall of the housing chamber so as to face the substrate mounted on the mounting table, and a second electrode to which a DC voltage is Ru is applied,
    Exposed on the surface of the component provided in the housing chamber, and the ground electrode against the front Stories second electrodes,
    A plasma processing apparatus comprising an exhaust device for exhausting the storage chamber,
    In the storage chamber, a groove-like space having a long cross section is formed along the surface of the component and between the ground electrode, and a short side of the long cross section is opened toward the upstream of the flow of the exhaust gas. the plasma processing apparatus characterized in that it comprises a shielding member disposed so that formed by.
  9. The plasma processing apparatus according to any one of claims 1 to 8 gap between the shielding member and the ground electrode forming the groove-shaped space may be greater than 0.5 mm.
  10. The plasma processing apparatus according to claim 9, wherein the gap is 2.5 mm or more and 5.0 mm or less.
  11. The plasma processing apparatus according to claim 10 , wherein the gap is 3.5 mm or more.
  12. The plasma processing apparatus according to any one of claims 1 to 11, wherein the aspect ratio in the cross section of the groove-shaped space is 3.0 or more.
  13. A storage chamber for storing a substrate and performing plasma treatment;
    A susceptor provided in the housing chamber and on which the substrate is placed;
    A shower head disposed opposite the susceptor;
    A first electrode provided in the susceptor and supplied with high-frequency power;
    A second electrode provided in the showerhead to which a DC voltage is applied;
    An exhaust passage formed between the inner wall of the storage chamber and the side surface of the susceptor;
    A ground electrode disposed in the exhaust flow path, with respect to the second electrode;
    A plasma processing apparatus comprising an exhaust device that exhausts the gas in the accommodation chamber to the outside through the exhaust flow path,
    A shielding member interposed between the exhaust flow in the exhaust flow path and the ground electrode, and the shielding member is disposed with a predetermined gap between the ground electrode and in the exhaust flow direction. A plasma processing apparatus having a height higher than that of a ground electrode.
  14. The side surface of the susceptor is covered with a covering member,
    The plasma processing apparatus according to claim 13, wherein the ground electrode is exposed on a surface of the covering member of the susceptor.
  15. The plasma processing apparatus according to claim 13, wherein an amount of protrusion of the end of the shielding member on the opening side with respect to the end of the ground electrode on the opening side is 3 mm or less.
  16. The plasma processing apparatus according to claim 1, wherein the ground electrode is silicon or silicon carbide.
  17. The plasma processing apparatus according to claim 1, wherein the shielding member is a metal member sprayed with quartz or an insulating film.
  18. The plasma processing apparatus according to claim 1, wherein the shielding member is disposed concentrically with the ground electrode.
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