JP5153498B2 - Resin composition - Google Patents

Description

The present invention relates to a resin composition, an adhesive using the resin composition, and a cured body. For example, the present invention relates to an energy ray curable resin composition.

In the electronics field in recent years, equipment has become more sophisticated. In particular, in bonding of display components such as liquid crystal and organic electroluminescence (hereinafter referred to as organic EL), electronic components such as image sensors such as CCD and CMOS, and device packages used in semiconductor components, etc. Therefore, there is a demand for an adhesive that can be applied with high accuracy.

The amount of adhesive and the bonding area are very small and very small. The properties required for adhesives are high adhesion to various adherends such as glass, ceramics, resin, etc., and low moisture permeability that does not allow moisture to pass through even when exposed to high temperature and high humidity atmosphere. For example, adhesion durability. The demand level is increasing year by year.

In the trend of such technology, thermosetting epoxy adhesives having excellent adhesion and moisture permeability are mainly used as adhesives in this field. However, when mass production is taken into consideration, an energy beam curable adhesive having a fast curing property is desired instead of the conventional thermosetting type. Examples of energy rays include ultraviolet rays.

The energy ray curable epoxy adhesive has low curing shrinkage and is excellent in adhesion to various adherends. Patent Document 1 has a laminate adhesive, Patent Document 2 has a polyolefin adhesive, Patent Document 3 has alkali glass, metal bonding adhesive, Patent Document 4 has a CCD adhesive, Patent Document 5 has As described about the adhesive for sealing an organic EL element, energy ray curable epoxy adhesives are used in various fields.

JP-A-8-231938 JP 2001-131516 A JP 2003-327785 A JP 2004-269554 A JP 2006-169540 A

However, none of the above-described adhesives satisfy the characteristics required for element package adhesives such as CCD, CMOS, and organic EL. Characteristics required for an element package adhesive such as a CCD, CMOS, and organic EL include a minute amount and high-precision coating property.

That is, an object of the present invention is to provide an adhesive having a highly accurate coating property.

The present invention is a resin composition characterized by containing the following components:
(A) (a-1) containing an alicyclic epoxy compound and (a-2) an epoxy resin having an aromatic ring, and in a total amount of 100 parts by mass of (a-1) and (a-2), (A-2) an epoxy compound whose component is 20 to 80 parts by mass ,
(B) novolac resin,
(C) a photocationic polymerization initiator,
(D) Flat talc contained in a proportion of 10 to 60 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B)
It is a resin composition characterized by containing the following components,
(A) (a-1) containing an alicyclic epoxy compound and (a-2) an epoxy resin having an aromatic ring, and (a-1) and (a-2) in a total amount of 100 parts by mass, (A-2) an epoxy compound whose component is 50 to 80 parts by mass,
(B) A novolak resin contained in a proportion of 10 to 25 parts by mass in 100 parts by mass of the total amount of components (A) and (B),
(C) a photocationic polymerization initiator,
(D) The softening point of the flat talc (B) novolac resin contained at a ratio of 10 to 60 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B) is 50 ° C. or higher and 150 ° C. Ri der hereinafter, a hydroxyl equivalent of the novolak resin is a resin composition, wherein the range der Rukoto of 80~130 (g / eq), ( D) the particle size of the filler is 0.1~20μm (D) The resin composition, wherein the filler has a particle size of 0.1 to 2.5 μm, and (E) a silane coupling. And (a-1) the alicyclic epoxy compound is 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexenecarboxylate. The resin composition characterized by Yes, (a-2) an epoxy resin having an aromatic ring, a resin composition which is a bisphenol F type epoxy resin, the viscosity of the resin composition, shear rate: 10 to 100 (1 / S), shear viscosity: a resin composition characterized by a range of 10 to 500 Pa · s. When the velocity gradient of the resin composition is defined by (Equation 1), the velocity gradient Is a resin composition characterized by being in the range of 1-2,
(Formula 1)
Velocity gradient = (shear viscosity at 10 (1 / s)) / (shear viscosity at 100 (1 / s))
An energy ray curable resin composition comprising the resin composition, an adhesive comprising the resin composition, a cured body comprising the resin composition, and the energy ray curable resin. A curing method is characterized in that after the composition is irradiated with light, a post-heating treatment is performed.

According to the invention of the present application, it has high-precision applicability.

<Explanation of terms>
In the present specification, the energy ray curable resin composition means a resin composition that can be cured by irradiation with energy rays. Here, the energy rays mean energy rays typified by ultraviolet rays and visible rays.

  In the present specification, the symbol “to” means “above” and “below”. For example, “A to B” means not less than A and not more than B.

Hereinafter, embodiments of the present invention will be described in detail.

As the resin composition according to this embodiment, an energy ray curable resin composition is preferable. The energy ray-curable resin composition contains (A) an epoxy compound, (B) a novolak resin, (C) a photocationic polymerization initiator, and (D) a filler.

Next, components of the energy beam curable resin composition according to the present embodiment will be described.

((A) Epoxy compound)
The energy beam curable resin composition according to this embodiment includes (A) an epoxy compound as an essential component. By using an epoxy compound, the energy ray-curable resin composition according to the present embodiment exhibits excellent adhesion, low moisture permeability, and adhesion durability.

(A) As an epoxy compound, (a-1) an alicyclic epoxy compound and (a-2) an epoxy resin having an aromatic ring can provide excellent adhesion, low moisture permeability, and adhesion durability. Are preferably used.

(A-1) As an alicyclic epoxy compound, a compound having at least one cyclohexene or a cycloalkane ring such as a cyclopentene ring or a pinene ring is treated with an appropriate oxidizing agent such as hydrogen peroxide or peracid. And alicyclic epoxy compounds such as hydrogenated epoxy compounds obtained by hydrogenating aromatic epoxy compounds such as bisphenol A type epoxy compounds. These compounds may be used alone or in combination of two or more.

Here, in particular, an alicyclic epoxy compound containing one or more epoxy groups and one or more ester groups in one molecule is preferable. Such an alicyclic epoxy compound is particularly preferable because of excellent adhesion and photocurability.

Examples of the alicyclic epoxy compound include 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexenecarboxylate, 3,4-epoxycyclohexylmethyl methacrylate, and the like.

(A-2) As an epoxy resin having an aromatic ring, any of a monomer, an oligomer or a polymer can be used, and bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, Naphthalene type epoxy resin, fluorene type epoxy resin, novolac phenol type epoxy resin, cresol novolak type epoxy resin, and modified products thereof may be mentioned. These epoxy resins may be used alone or in combination of two or more. Particularly preferably, one or more members selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and biphenyl type epoxy resin are preferable because they are excellent in adhesiveness and low moisture permeability.

  The (a-1) alicyclic epoxy compound and the (a-2) epoxy resin having an aromatic ring can be used alone or in combination of two or more. In consideration of the balance of photocurability, high-precision applicability, adhesion, moisture permeability, and adhesion durability, component (a-2) in the total amount of 100 parts by mass of (a-1) and (a-2) Is preferably in the range of 20 to 80 parts by mass, particularly preferably in the range of 40 to 60 parts by mass.

((B) Novolac resin)
The energy beam curable resin composition according to the present embodiment can have both excellent high-precision applicability and low moisture permeability by further containing a novolac resin.

As the novolac resin, a known novolac resin can be applied. Examples of the novolak resin include phenol novolak resin, cresol novolak resin, bisphenol A type novolak resin, and the like. These novolac resins may be used alone or in combination of two or more. In particular, a phenol novolac resin is preferable because of excellent coating properties.

As the phenol novolak resin, a phenol novolak resin having a softening temperature of 50 ° C. or higher and 150 ° C. or lower is preferable, and a phenol novolak resin having a softening temperature of 70 ° C. or higher and 100 ° C. or lower is particularly preferable. Examples of the phenol novolak resin having a softening temperature of 50 ° C. or higher and 150 ° C. or lower include PHENOLITE TD-2131, TD-2106, TD-2093, TD-2091, and TD-2090 manufactured by Dainippon Ink & Chemicals, Inc. These phenol novolac resins may be used alone or in combination of two or more.

  The hydroxyl equivalent of the novolak resin is preferably in the range of 80 to 130 (g / eq) from the viewpoint of compatibility with the epoxy compound (A) and low moisture permeability, and particularly preferably 100 to 120. A range of (g / eq) is preferred.

(B) The composition ratio of the novolak resin having a softening point of 50 ° C. or higher and 150 ° C. or lower is contained in a ratio of 10 to 30 parts by mass of the component (B) in 100 parts by mass of the total amount of the components (A) and (B). Since it is possible to obtain excellent high-precision applicability and low moisture permeability in a well-balanced manner, it is particularly preferable to contain them in a proportion of 15 to 25 parts by mass.

((C) Photocationic polymerization initiator)
The energy beam curable resin composition according to the present embodiment contains (C) a photocationic polymerization initiator. By using a cationic photopolymerization initiator, the energy ray-curable resin composition according to this embodiment can be cured by irradiation with energy rays such as ultraviolet rays.

(C) As the cationic photopolymerization initiator, arylsulfonium salt derivatives (for example, Cyracure UVI-6990, Cyracure UVI-6974, manufactured by Dow Chemical Company, Adekaoptomer SP-150, Adekaoptomer SP, manufactured by Asahi Denka Kogyo Co., Ltd.) -152, Adekaoptomer SP-170, Adekaoptomer SP-172, CPI-100P, CPI-101A, CPI-200K, CPI-210S, Ciba-210S manufactured by San Apro, etc. (For example, Irgacure 250 manufactured by Ciba Specialty Chemicals, RP-2074 manufactured by Rhodia Japan), acid generators such as allene-ion complex derivatives, diazonium salt derivatives, triazine initiators and other halides, etc. Raising It is. These photocationic polymerization initiators may be used alone or in combination of two or more.

(C) Examples of the anionic species of the cationic photopolymerization initiator include halides such as boron compounds, phosphorus compounds, antimony compounds, arsenic compounds, and alkyl sulfonic acid compounds. These anionic species may be used alone or in combination of two or more. Fluoride is preferable from the viewpoint of excellent photocurability and improved adhesion and adhesion durability.

(C) It is preferable to contain a photocationic polymerization initiator in the ratio of 0.01-5 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, and especially 0.05- It is preferable to make it contain in the ratio of 3 mass parts. If the content of the cationic photopolymerization initiator is 0.01 parts by mass or more, the photocurability is not deteriorated, and if it is 5 parts by mass or less, the adhesion durability is not lowered.

(C) In order to improve the sensitivity of the photocationic polymerization initiator, various photosensitizers may be used in combination.

((D) filler)
The energy beam curable resin composition according to the present embodiment contains (D) a filler. (D) By containing a filler, the energy-beam curable resin composition which concerns on this embodiment can provide the outstanding high precision applicability | paintability, adhesiveness, low moisture permeability, and adhesive durability.

The particle diameter of the filler is preferably 0.1 to 20 μm, and preferably 1 to 10 μm because it is excellent in high-precision coating properties.

As the filler, a flat filler is preferable. A flat filler means a flat filler. The flat filler preferably has a plane diameter of 0.5 to 10 μm, particularly 1 to 5 μm, and a thickness of 0.001 to 1 μm, particularly 0.01 to 0.1 μm. Is preferable. Examples of the flat filler include natural minerals such as talc and mica, and ceramics such as boron nitride. Talc is preferred because it is excellent in both high precision applicability and low moisture permeability.

Here, talc means, for example, talc having a purity of 99% or more represented by MgO.SiO _X (1 ≦ X ≦ 2) as a chemical composition.

(D) The flat talc is preferably contained in a proportion of 10 to 60 parts by mass, particularly 15 to 55 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable to make it contain in a ratio. If it is 15 parts by mass or more, excellent low moisture permeability can be obtained, and if it is 60 parts by mass or less, high-precision applicability and adhesiveness are not deteriorated.

((E) Silane coupling agent)
The energy beam curable resin composition according to the present embodiment may contain a silane coupling agent. By containing a silane coupling agent, the energy ray-curable resin composition according to the present embodiment exhibits excellent adhesion and adhesion durability.

Examples of silane coupling agents include γ-chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyl-tris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ -Acryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N -Β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-ureidopropyltriethoxysilane, and the like, preferably β- (3,4 -Epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and the like. These silane coupling agents may be used alone or in combination of two or more.

It is preferable to contain a silane coupling agent in the ratio of 0.1-10 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, especially 0.5-5 mass parts. It is more preferable to make it contain in a ratio. If content of a silane coupling agent is 0.1 mass part or more and 10 mass parts or less, suitable adhesiveness and adhesion durability can be obtained.

(Other cationic polymerizable compounds)
The energy beam curable resin composition according to the present embodiment may contain other cationically polymerizable compounds such as aliphatic epoxy compounds, oxetane compounds, vinyl ether compounds, and the like within a range that does not impair the intended physical properties.

The energy ray curable resin composition according to the present embodiment is within a range that does not impair the intended physical properties of the present embodiment, various elastomers such as acrylic rubber and urethane rubber, methyl methacrylate-butadiene-styrene graft copolymer, Additives such as graft copolymers such as acrylonitrile-butadiene-styrene graft copolymers, inorganic fillers, solvents, extenders, reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants and surfactants Can be used.

The energy ray-curable resin composition having the above-described configuration may be cured by irradiation with energy rays to form a cured body.

Moreover, you may use the energy-beam curable resin composition which consists of the said structure as an adhesive agent. This adhesive can be suitably used for bonding display components such as liquid crystal and organic EL, electronic components such as image sensors such as CCD and CMOS, and element packages used for semiconductor components.

[Production method]
About the manufacturing method of the energy-beam curable resin composition which concerns on this embodiment, if said material can fully be mixed, there will be no restriction | limiting in particular. Examples of the mixing method of the material include a stirring method using a stirring force accompanying rotation of the propeller, a roll kneading mixing method, a mixing method using a normal disperser such as a sand mill or a planetary stirrer by rotation revolution, and the like. . These mixing methods are preferable because stable mixing can be performed at low cost.

  After performing the above mixing, the energy ray curable resin composition may be cured by irradiation with energy rays using the following light source.

[light source]
In the present embodiment, the light source used for curing and bonding the energy ray curable resin composition includes a halogen lamp, a metal halide lamp, a high power metal halide lamp (containing indium, etc.), a low pressure mercury lamp, a high pressure mercury lamp, Examples thereof include a high-pressure mercury lamp, a xenon lamp, a xenon excimer lamp, a xenon flash lamp, and a light emitting diode (hereinafter referred to as LED). These light sources are preferable because they can efficiently irradiate energy rays corresponding to the reaction wavelengths of the respective photopolymerization initiators.

Each of the light sources has a different emission wavelength and energy distribution. Therefore, the light source is appropriately selected depending on the reaction wavelength of the photopolymerization initiator. Natural light (sunlight) can also be a reaction initiation light source.

The light source may perform direct irradiation, condensing irradiation using a reflecting mirror, or condensing irradiation using a fiber or the like. A low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like can also be used.

  In addition, the energy beam curable resin composition of the present invention may be subjected to post-heating treatment in order to accelerate the curing rate after light irradiation. In view of application to sensor element packages such as organic EL, CCD, and CMOS, the post-heating temperature is preferably 120 ° C. or less, particularly preferably 80 ° C. or less, from the viewpoint of not damaging the element.

[viscosity]
In the present embodiment, the viscosity of the energy beam curable resin composition is in the range of shear rate: 10 to 100 (1 / s) and shear viscosity: 10 to 500 Pa · s in order to obtain excellent high precision applicability. It is preferable that it is the range of 20-400 Pa.s in particular. If the shear viscosity is 10 Pa · s or more, the adhesive does not spread more than necessary, and if it is 500 Pa · s or less, it can be applied with high accuracy using a commercially available application device such as a dispenser. Become.

In order to have high-precision applicability, it is preferable that the shear rate dependency (hereinafter referred to as a velocity gradient) is a certain value or less. When the velocity gradient is defined by the following formula, the value is preferably in the range of 1 to 2, and more preferably in the range of 1.0 to 1.6. If the speed gradient is 1 or more and 2 or less, it can be applied with a small amount and a very small area with high accuracy without using a commercially available coating apparatus such as a dispenser.

(Formula 1)
Velocity gradient = (shear viscosity at 10 (1 / s)) / (shear viscosity at 100 (1 / s))

A known apparatus can be used for the measurement of the shear viscosity. In particular, a rheometer (for example, “MCR-301” manufactured by Nippon Siebel Hegner Co., Ltd.) can accurately measure the speed dependence of the shear viscosity.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto. Unless otherwise stated, the test was performed at 23 ° C. and a relative humidity of 50% by mass.

In the examples and comparative examples, the following compounds were used.
The following was used as the epoxy compound of component (A).
(A-1) 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate (“Celoxide 2021P” manufactured by Daicel Chemical Industries)
(A-2) Bisphenol F type epoxy resin ("YL-938U" manufactured by Japan Epoxy Resin Co., Ltd.)

(B) The following was used as a novolak resin having a softening point of 50 ° C. or higher and 150 ° C. or lower. The softening point and hydroxyl equivalent are shown in Table 1.
(B-1) Phenol novolac resin (“TD-2131” manufactured by Dainippon Ink and Chemicals, Inc.)
(B-2) Phenol novolac resin (“TD-2090” manufactured by Dainippon Ink and Chemicals, Inc.)
(B-3) Bisphenol A type novolak resin ("KH-6021" manufactured by Dainippon Ink & Chemicals, Inc.)

The following was used as the photocationic polymerization initiator of component (C).
(C-1) Triarylsulfonium salt hexafluoroantimonate (“ADEKA OPTMER SP-170” manufactured by ADEKA)

(D) The following was used as flat talc. The average particle diameter is shown in Table 2. The average particle size was measured using a laser diffraction particle size distribution analyzer, SALD-2200 “manufactured by Shimadzu Corporation”.
(D-1) High filler 5000PJ (Matsumura Sangyo Co., Ltd.)
(D-2) SG-95 (Nippon Talc Co., Ltd.)
(D-3) Mistron vapor (manufactured by Nippon Mistron)

For comparison, the following spherical silica was used.
(D-4) Spherical silica (“DENKA Fused Silica FB-5SDX” manufactured by Denki Kagaku Kogyo Co., Ltd.)

The following was used as the silane coupling agent of component (E).
(E-1) γ-Glycidoxypropyltrimethoxysilane (“KBM-403” manufactured by Shin-Etsu Silicone)

The raw materials of the types shown in Tables 3 and 4 were mixed at the composition ratios shown in Tables 3 and 4, and resin compositions of Examples 1 to 9 and Comparative Examples 1 to 4 were prepared. The unit of the composition ratio is part by mass.

The following measurements were performed on the resin compositions of Examples and Comparative Examples. The results are shown in Tables 3 and 4.

〔viscosity〕
Viscosity was measured using a rheometer (“MCR-301” manufactured by Nippon Shibel Hegner) under the following conditions and the shear viscosity at shear rates of 10 (1 / s) and 100 (1 / s).
・ Plate: Circular flat plate 25mmφ
・ Sample thickness: 0.1 mm
・ Normal force: 0N
・ Temperature: 25 ± 0.5 ℃

In order to evaluate the shear rate dependency, the velocity gradient was obtained by the following equation, and the velocity gradient of 2 or less was considered good.
(Formula 2)
Velocity gradient = (shear viscosity at 10 (1 / s)) / (shear viscosity at 100 (1 / s))

[Curing conditions]
In evaluating the cured properties and adhesiveness of the resin composition, the resin composition was cured under the following light irradiation conditions.
After photocuring under the condition of an integrated light amount of 4,000 mJ / cm ² with a wavelength of 365 nm by a UV curing device equipped with an electrodeless discharge metal halide lamp (manufactured by Fusion), post-heating in an oven at 80 ° C. for 30 minutes Processing was carried out.

[Evaluation of moisture permeability]
A sheet-like adhesive cured body having a thickness of 0.1 mm was prepared under the above-mentioned photocuring conditions, and calcium chloride (anhydrous) as a hygroscopic agent in accordance with JIS Z0208 “Method of testing moisture permeability of moisture-proof packaging material (cup method)” Was used under the conditions of an atmospheric temperature of 60 ° C. and a relative humidity of 90%.

[Evaluation of tensile shear bond strength (initial)]
Use two borosilicate glass test pieces "25 mm long x 25 mm wide x 2.0 mm thick, Tempax (registered trademark)", cure the adhesive under the above-mentioned photocuring conditions with a bonding area of 0.5 cm ² and a bonding thickness of 80 μm. I let you. After curing, using a test piece joined with an adhesive, the tensile shear adhesive strength (unit: MPa) was measured at an elongation of 10 mm / min in an environment of a temperature of 23 ° C. and a relative humidity of 50%.

[Evaluation of adhesion durability (PCT)]
Use two borosilicate glass test pieces "25 mm long x 25 mm wide x 2.0 mm thick, Tempax (registered trademark)", cure the adhesive under the above-mentioned photocuring conditions with a bonding area of 0.5 cm ² and a bonding thickness of 80 μm. I let you. After curing, a test piece bonded with an adhesive was used and exposed to a pressure cooker (hereinafter referred to as PCT) 121 ° C., 100% RH, 2 atm for 10 hours, and the tensile shear bond strength of the test piece after exposure ( (Unit: MPa) is measured at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and the adhesion retention is determined by the following formula. did.

(Formula 3)
Adhesion retention (%) = (Tensile shear adhesive strength after PCT) ÷ (Initial tensile shear adhesive strength) × 100

The following can be seen from the above examples. The present invention can provide an energy ray-curable resin composition that is excellent in coating properties, adhesiveness, low moisture permeability, and adhesion durability with a small amount of use. Having high-precision applicability is supported by the fact that the velocity gradient is in the range of 1-2. Having low moisture permeability is supported by low moisture permeability.

The present invention can be suitably applied to bonding of electronic products, particularly display components such as liquid crystal and organic EL, electronic components such as image sensors such as CCD and CMOS, and device packages used in semiconductor components. it can.

Claims (14)

A resin composition comprising the following components:
(A) (a-1) containing an alicyclic epoxy compound and (a-2) an epoxy resin having an aromatic ring, and in a total amount of 100 parts by mass of (a-1) and (a-2), (A-2) an epoxy compound whose component is 20 to 80 parts by mass ,
(B) novolac resin,
(C) a photocationic polymerization initiator,
(D) Flat talc contained in a proportion of 10 to 60 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B) A resin composition comprising the following components:
(A) (a-1) containing an alicyclic epoxy compound and (a-2) an epoxy resin having an aromatic ring, and (a-1) and (a-2) in a total amount of 100 parts by mass, (A-2) an epoxy compound whose component is 50 to 80 parts by mass ,
(B) A novolak resin containing 10 to 25 parts by mass in 100 parts by mass of the total amount of components (A) and (B) ,
(C) a photocationic polymerization initiator,
(D) Flat talc contained in a proportion of 10 to 60 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B) (B) softening point of the novolak resin Ri der 50 ° C. or higher 0.99 ° C. or less, the novolak resin hydroxyl equivalent, 80~130 (g / eq) according to claim 1 or 2, characterized in range der Rukoto of The resin composition according to any one of the above. The resin composition according to any one of claims 1 to 3, wherein (D) the filler has a particle size of 0.1 to 20 µm. The resin composition according to any one of claims 1 to 3, wherein (D) the filler has a particle size of 0.1 to 2.5 µm. The resin composition according to any one of claims 1 to 5 , further comprising (E) a silane coupling agent. The (a-1) alicyclic epoxy compound is 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexenecarboxylate, according to any one of claims 1 to 6. Resin composition. (A-2) The epoxy resin having an aromatic ring is a bisphenol F type epoxy resin, The resin composition according to any one of claims 1 to 7. The viscosity of the resin composition according to any one of claims 1 to 8, wherein the shear rate is in the range of 10 to 100 (1 / s) and the shear viscosity is in the range of 10 to 500 Pa · s. A resin composition. A resin composition characterized by having a velocity gradient in the range of 1 to 2 when the velocity gradient of the resin composition according to any one of claims 1 to 9 is defined by (Equation 1).
(Formula 1)
Velocity gradient = (shear viscosity at 10 (1 / s)) / (shear viscosity at 100 (1 / s)) An energy ray-curable resin composition comprising the resin composition according to any one of claims 1 to 10. An adhesive comprising the resin composition according to any one of claims 1 to 10. A cured body comprising the resin composition according to any one of claims 1 to 10. A curing method comprising performing post-heating treatment after irradiating the energy ray-curable resin composition according to claim 11 with light.