JP5142103B2 - Circuit board, substrate with built-in electronic device, integrated circuit device, optical waveguide with integrated circuit, and method for assembling substrate with built-in electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of miniaturizing an integrated circuit formed by packaging chip-type electronic devices in a multi-layered board, increasing the number of packaged chip-type electronic devices, and achieving cost reduction. <P>SOLUTION: There are provided a board 1 with built-in electronic devices in which chip-type electronic devices 4 are assembled in device packaging holes 31 formed in a circuit board 3, the circuit board 3 in which terminal portions 34 for energizing connections of the chip-type electronic devices 4 protrude in opening portions of the device packaging holes 31, a method for assembling the board 1 with built-in electronic devices, and an optical waveguide 10 with an integrated circuit using the board 1 with built-in electronic devices. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a circuit board on which an electronic device is mounted, an electronic device built-in substrate, an integrated circuit device, an optical waveguide with an integrated circuit, and a method for assembling an electronic device built-in substrate.

Conventionally, chip-type electronic devices such as optical elements and semiconductor packages are mounted on a circuit board by flip chip mounting or wire bonding on the main surface of the circuit board.
By the way, in the case of integrated circuit devices such as LSIs incorporated in electronic equipment, in view of the demand for multi-functionality and miniaturization of electronic equipment, multilayering (adoption of a multilayer substrate), thereby miniaturization and high density. Is progressing. The chip-type electronic device is mounted on a multilayer substrate in which a plurality of circuit boards are stacked. The end surface of the multilayer substrate (device mounting surface) formed by the substrate (one or both of the substrates on both ends of the stack) located on the outermost layer of the multilayer substrate. Flip chip mounting and wire bonding mounting are generally used (for example, Non-Patent Document 1).
Sharifi, H .; Tae-Young Choi; Mohammadi, S .: Self-Aligned Wafer-Level Integration Technology With High-Density Interconnects and Embedded Passives, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging , IEEE Transactions on] Volume: 30, Issue: 1, (2007) Page (s): 11-18

  However, as described above, in the configuration in which the chip-type electronic device is mounted on the substrate located on the outermost layer of the multilayer substrate, the mounted chip-type electronic device exists in a protruding shape on the outside of the multilayer substrate. There is a limit to reducing the size of circuit devices. In addition, there was a complaint that the number of chip-type electronic devices that can be mounted is limited and it is difficult to increase the number of mounted electronic devices. In addition, there is a problem that it is difficult to reduce the cost because complicated packaging is required.

  In view of the above problems, the present invention provides a circuit board and an electronic device that can easily realize downsizing of an integrated circuit device formed by stacking a plurality of circuit boards, increasing the number of mounted chip-type electronic devices, and reducing costs. An object of the present invention is to provide an assembly method for a device-embedded substrate, an integrated circuit device, an optical waveguide with an integrated circuit, and an electronic device-embedded substrate.

In order to solve the above problems, the present invention provides the following configuration.
The present invention relates to a chip-shaped semiconductor substrate having a wiring portion formed on at least one of both surfaces of the semiconductor substrate, a through wiring penetrating the semiconductor substrate, and a through hole penetrating the semiconductor substrate. A device housing hole into which the electronic device is incorporated, and an electrode pad provided in the chip-type electronic device, which projects from one of the wiring portions on both sides of the semiconductor substrate to an opening at one end of the device housing hole And a projecting terminal portion connected so as to be electrically conductive, and the cross-sectional dimension of the device housing hole is perpendicular to the axis of the device housing hole of the chip-type electronic device, The size is increased by 5 to 195% of the size of the contact surface of the electrode pad, and the chip-type electronic device is a square chip, and the chip-type electronic device is accommodated. Said device receiving holes of rectangular cross section which has a length of at least one pair of sides of the mutually parallel two pairs of sides of the cross-section periphery is shorter than the diagonal dimension of the chip-type electronic device, wherein the chip-type electronic The device is capable of rotating within the device storage hole while being set and regulated by the difference between the cross-sectional dimension of the device storage hole and the cross-sectional dimension of the chip-type electronic device, and is centered on the axis of the device storage hole The contact surfaces of all the electrode pads of the chip type electronic device respectively overlap the contact surfaces of the terminal portions in plan view over the entire range of rotational movement of the chip type electronic device in the direction around the axis. A circuit board is provided.
In the present invention, the chip-type electronic device is incorporated in the device housing hole of the circuit board, and the electrode pads of the chip-type electronic device are bonded with a conductive bonding metal material so as to be electrically conductive. An electronic device embedded substrate is provided.
It is preferable that the present invention includes a filling resin portion that fills a space between the inner surface of the device storage hole and the chip-type electronic device in the device storage hole.
In the present invention, an optical element which is a light emitting element or a light receiving element is incorporated in the device housing hole as the chip-type electronic device, and the optical element is provided with the electrode pad bonded to the terminal portion. It is preferable to have a light emitting part or a light receiving part on the pad installation surface.
The present invention includes a filling resin portion that fills a space between the inner surface of the device accommodation hole and the optical element in the device accommodation hole, and is formed on the pad installation surface of the optical element continuously from the filling resin portion. It is preferable that the light emitting part or the light receiving part is covered with the transparent resin layer.
It is preferable that the circuit board is provided with a transparent opening sealing member that closes an opening provided with the terminal portion of the device housing hole.
The circuit board has a plurality of device housing holes, and a light emitting element incorporated in the device housing hole and a light receiving element incorporated in a device housing hole different from the device housing hole in which the light emitting element is incorporated. It is preferable to comprise an element.
A plurality of the device housing holes are formed in the circuit board, a device housing hole in which a light emitting element is incorporated, and a device housing hole in which a driver element for driving the light emitting element is incorporated as the chip-type electronic device, It is preferable that the light emitting element and the driver element are electrically connected via an inter-chip connection wiring formed on the circuit board.
A plurality of device housing holes are formed in the circuit board, a device housing hole in which a light receiving element is incorporated, and a device housing in which a receiver element for converting a light receiving signal of the light receiving element is incorporated as the chip-type electronic device. It is preferable that the light receiving element and the receiver element are electrically connected via an inter-chip connection wiring formed on the circuit board.
It is preferable that at least one of both surfaces of the circuit board includes an electrode pad and a metal bump mounted on the electrode pad.
The chip-type electronic device preferably includes a second electrode pad on a side opposite to the pad installation surface.
It is preferable that metal bumps are mounted on the second electrode pads.
The present invention provides an integrated circuit device comprising a base circuit board, which is the electronic device built-in substrate, and an integrated circuit portion mounted on one side of the base circuit board.
In the present invention, the integrated circuit portion is configured by connecting circuit wirings of an integrated circuit substrate laminated in multiple layers on a base circuit substrate, and the integrated circuit portion is formed of a plurality of integrated circuit substrates constituting the integrated circuit portion. It is preferable that one or more is the electronic device built-in substrate.
In the present invention, one or a plurality of the integrated circuit devices each including a base circuit board which is the electronic device built-in substrate are mounted on a sheet-shaped optical waveguide, and the sheet-shaped optical waveguide is incorporated in the integrated circuit device. An optical path forming mirror for optically connecting the light emitting element and the light receiving element via the sheet-shaped optical waveguide at a position corresponding to the light emitting element and a position corresponding to the light receiving element incorporated in the integrated circuit device. An optical waveguide with an integrated circuit comprising:
The present invention further includes a second circuit board laminated on the side of the sheet-shaped optical waveguide opposite to the base circuit board, and in the bonding material accommodation hole penetrating the sheet-shaped optical waveguide, A bonding metal material that electrically connects a circuit wiring of the second circuit board and an electrode pad provided on the base circuit board of the integrated circuit device is housed, and is electrically connected to the circuit wiring of the second circuit board. It is preferable that the circuits of the plurality of integrated circuit devices connected to each other are electrically connected to each other via circuit wiring of the second circuit board.
The present invention incorporates a chip-type electronic device into the device housing hole of the circuit board, reflows a metal bump previously mounted on an electrode pad provided in the chip-type electronic device, and Provided is an assembling method of an electronic device built-in substrate to be bonded to the terminal portion.
The present invention preferably includes a filling resin portion forming step of forming a filling resin portion that fills a space between the inner surface of the device housing hole and the chip-type electronic device after the electrode pad is bonded to the terminal portion.
According to the present invention, in the filling resin portion forming step, in the state in which the opening portion of the circuit board in which the terminal portion of the device housing hole is provided is closed using an opening portion sealing member. Preferably, the filling resin portion is formed by injecting a liquid resin material into the hole.
In the present invention, it is preferable to use a transparent opening sealing member.
In the present invention, an optical element that is a light receiving element or a light emitting element is used as the chip-type electronic device, and the chip type electronic device is mounted in advance on an electrode pad provided on an end face provided with a light receiving / emitting part of the optical element. It is preferable to reflow the metal bumps and bond the electrode pads to the terminal portions.
In the method for assembling the electronic device built-in substrate according to the method for assembling the electronic device built-in substrate, in the filling resin portion forming step, the transparent covering the end surface of the optical element continuously from the filled resin portion is provided. It is preferable to form a resin layer.

According to the present invention, since the chip-type electronic device is incorporated in the device housing hole of the circuit board and mounted on the circuit board, the overall size of the electronic device built-in substrate including the mounted chip-type electronic device can be reduced. It can be easily realized.
By applying the electronic device built-in substrate according to the present invention as an integrated circuit substrate constituting an integrated circuit (integrated circuit device) formed by laminating a plurality of integrated circuit substrates, the integrated circuit device can be easily downsized. realizable. Furthermore, according to the integrated circuit device of the present invention, the adoption of the device-embedded substrate makes it possible to increase the number of chip-type electronic devices mounted since the chip-type electronic device is built inside the integrated circuit device. realizable. By increasing the number of chip-type electronic devices that can be mounted on one integrated circuit device, the degree of freedom of combination of chip-type electronic devices is improved.
Further, since the chip-type electronic device is built in a circuit board constituting the integrated circuit device, packaging is simplified or packaging is not required, and cost reduction can be easily realized.

Hereinafter, a method for assembling a circuit board, an electronic device built-in board, an integrated circuit device, an optical waveguide with an integrated circuit, and an electronic device built-in board according to the present invention will be described with reference to the drawings.
1 is a front sectional view showing a structure of an electronic device built-in substrate 1 according to the present invention, and FIG. 2 is an enlarged sectional view showing a region A indicated by a virtual line of the electronic device built-in substrate 1 in FIG. 3 is a view showing the chip-type electronic device 4 in the vicinity of the device housing hole 31 (cavity portion) of the circuit board 3 and the device housing hole 31, and FIG. 4 shows the integrated circuit device 5 according to the present invention in the sheet-type optical waveguide 20. FIG. 5 is an enlarged cross-sectional view showing a region B indicated by a virtual line of the optical waveguide with integrated circuit 10 of FIG. 4 in an enlarged manner.
1 to 4, for convenience of explanation, the upper side is described as “upper” and the lower side is described as “lower”. However, this is defined for convenience in order to simply explain the relative relationship of the constituent elements of the present invention, and does not limit the direction during production or use when the present invention is carried out.

  In the optical waveguide with integrated circuit 10 shown in FIGS. 4 and 5, the integrated circuit device 5 mounted on the sheet-shaped optical waveguide 20 is an electronic device-embedded substrate 1 (hereinafter abbreviated as a device-embedded substrate) according to the present invention. The integrated circuit portion 54 formed by laminating a plurality of integrated circuit substrates 51 is mounted on one surface (device mounting surface 1b, upper surface), and is formed in a chip shape as a whole.

  The integrated circuit portion 54 includes a circuit formed by electrically connecting circuit wirings 52 (conductor circuits) of the integrated circuit substrate 51. In FIG. 4, reference numeral 53 denotes a via wiring, which realizes electrical connection between the circuit wirings 52 between the integrated circuit substrates 51. The integrated circuit device 5 is configured by electrically connecting the conductor circuit of the device-embedded substrate 1 and the circuit of the integrated circuit unit 54. Hereinafter, the integrated circuit device 5 is also referred to as an LSI.

The LSI 5 has a surface on the opposite side of the integrated circuit portion 54 of the device-embedded substrate 1 (a surface opposite to the device mounting surface 1b in the device-embedded substrate 1; a bottom-side mounting surface 1a, a bottom surface) on the sheet-type optical waveguide 20. And mounted on the sheet-shaped optical waveguide 20.
As shown in FIGS. 1 and 5, the bottom side mounting surface 1 a of the device-embedded substrate 1 exemplified here is attached to a circuit board 3 (specifically, a first main surface 3 a (described later) of the circuit board 3). The surface formed by the sheet-like (or plate-like) opening sealing member 2, specifically, the surface opposite to the circuit board 3 of the opening sealing member 2. The device-embedded substrate 1 is attached to the sheet-shaped optical waveguide 20 so that the bottom side mounting surface 1 a is superimposed on the sheet-shaped optical waveguide 20.
The opening sealing member 2 is formed transparent.

In FIG. 4, the LSI 5 is mounted at a plurality of locations on the sheet-shaped optical waveguide 20.
The device built-in substrate 1 functions as a base circuit substrate according to the present invention in the LSI 5.

The device-embedded substrate 1 illustrated in FIGS. 1 to 3 is obtained by mounting an optical element as a chip-type electronic device 4 in a device housing hole 31 formed in the circuit substrate 3.
Hereinafter, when the chip-type electronic device 4 refers to an optical element, it may be referred to as an optical element. Further, reference numeral 40 in the figure is attached to the optical element.
Hereinafter, the chip-type electronic device is also simply referred to as a chip or a chip-type device.

The device housing holes 31 are formed at a plurality of locations on the circuit board 3. However, only one device storage hole 31 may be formed.
In one device housing hole 31, a light emitting element 41 or a light receiving element 42 is incorporated as a chip-type device 4 (optical element).
The light emitting element 41 is a semiconductor laser such as a VCSEL (Vertical Cavity Surface Emitting LASER). The light receiving element 42 is, for example, a PD (photodiode).

As shown in FIGS. 4 and 5, each optical element 40 has a light receiving / emitting unit 401 (the light emitting unit 411 of the light emitting element 41 or the light receiving unit 421 of the light receiving element 42) facing the sheet-shaped optical waveguide 20. It is incorporated in the device storage hole 31.
In the sheet-shaped optical waveguide 20, a mirror unit 24 for optical coupling between the light-receiving / emitting unit 401 and the sheet-shaped optical waveguide 20 (specifically, the optical path H <b> 1) is located at a position corresponding to the light receiving / emitting unit 401 of the optical element 40. Is formed. In this optical waveguide with integrated circuit 10, the mirror section 24 bends the optical path H 1 of the sheet-shaped optical waveguide 20 at a right angle, and between the mirror section 24 and the light receiving / emitting section 401 of the optical element 40, An optical path H2 perpendicular to the optical path H1 of the waveguide 20 is formed. The light receiving / emitting unit 401 of the optical element 40 is optically coupled to the optical path H <b> 1 of the sheet-shaped optical waveguide 20 through the mirror unit 24. Specifically, the mirror part 24 is configured by a recess formed in the sheet-shaped optical waveguide 20 so as to be recessed from the side opposite to the circuit board 3. The mirror part 24 is formed so as to be interposed in the middle of the core part 22 of the sheet-shaped optical waveguide 20.

In the optical waveguide with integrated circuit 10 (see FIG. 4) described here, a light emitting element 41 and a light receiving element that are optically connected to each other via a sheet-shaped optical waveguide 20 (specifically, an optical path H1 of the sheet-shaped optical waveguide 20). There are 42 pairs.
In the optical waveguide with integrated circuit 10, the electronic circuit and the light reception on the light emitting element 41 side are received by a signal transmission system constituted by a pair of the light emitting element 41 and the light receiving element 42 optically connected via the sheet-shaped optical waveguide 20. Signal transmission with the electronic circuit on the element 42 side can be performed at high speed. For example, the signal transmission system of the pair of optical elements 40 described above is applied to signal transmission between the integrated circuit devices 5 mounted at a plurality of locations of the sheet-shaped optical waveguide 20 to increase the speed of signal transmission. Yes.

  4 and 5 schematically show the formation positions of the mirror portions 24 formed at a plurality of locations of the sheet-shaped optical waveguide 20, and all the mirror portions 24 in the figure have branch portions. It does not mean the structure formed about the one core part 22 which is not. The aspect in which three or more mirror parts 24 are formed in the sheet-shaped optical waveguide 20 is different from the sheet-shaped optical waveguide 20 having the core part 22 having the branching part or the sheet-shaped optical waveguide 20 having the plurality of core parts 22. Realized. The mirror part 24 is provided to optically connect the light emitting element 41 and the light receiving element 42 via the core part 22 of the sheet-shaped optical waveguide 20, and the formation position of the mirror part 24 in the sheet-shaped optical waveguide 20 is The optical connection between the light emitting element 41 and the light receiving element 42 is set to be realized.

(Circuit board, device built-in board, device built-in board assembly method)
The device-embedded substrate 1 according to the present invention has a configuration in which a chip-type electronic device 4 is incorporated in a device housing hole 31 formed in the circuit substrate 3.
However, the chip-type device 4 incorporated in the device housing hole 31 of the circuit board 3 is not limited to an optical element. The chip device 4 incorporated in the circuit board 3 may be, for example, a semiconductor element other than an optical element, a packaged IC chip, or the like.
Note that only one chip-type device 4 is incorporated in one device storage hole 31.

FIG. 6 shows a chip-type device 4 including a light emitting element 41, a driver element 46 for driving the light emitting element 41, a light receiving element 42, and a receiver element 47 (amplifier) for converting a received light signal of the light receiving element 42. 3A illustrates a device built-in substrate 1A having a configuration incorporated in FIG.
7 shows that a device-embedded substrate in which a chip-type device 4 other than an optical element is incorporated in a circuit substrate is one of a plurality of integrated circuit substrates 51 constituting the integrated circuit portion 54 of the integrated circuit device 5. The applied configuration is illustrated. As the chip-type device 4, for example, the driver element 46 and the receiver element 47 described above can be employed. In FIG. 7, the integrated circuit device 5 is denoted by reference numeral 5A, and the integrated circuit portion 54 is denoted by reference numeral 54A.

The device housing hole 31 of the circuit board 3 is a through hole that penetrates the circuit board 3 and opens on both surfaces (both main surfaces; the first main surface 3a and the second main surface 3b) of the circuit board 3.
1-3, the code | symbol 39 is a semiconductor substrate which comprises the circuit board 3. In FIG. The device housing hole 31 is formed through the semiconductor substrate 39.

The circuit board 3 includes a device housing hole 31 in the semiconductor substrate 39, a wiring portion 32 (conductor circuit) formed on one surface of the semiconductor substrate 39, and an electric connection between the semiconductor substrate 39 and the wiring portion 32. And a protruding terminal portion 34 protruding from the wiring portion 32 at the opening of the device housing hole 31 on the surface of the semiconductor substrate 39 on which the wiring portion 32 is formed. It is the structure (substrate with a device accommodation hole).
The terminal portion 34 extends from the wiring portion 32 along the first main surface 3a of the circuit board 3 (on the virtual extension of the first main surface 3a with respect to the opening of the device housing hole 31).

  In the present specification, of the two main surfaces 3a and 3b of the circuit board 3, the surface on which the wiring portion 32 is formed is the first main surface 3a, and the opposite surface is the second main surface. The surface 3b will be described.

Further, the device built-in substrate 1 illustrated in FIG. 1 includes a second through wiring 11 penetrating the circuit board 3 (more specifically, the semiconductor substrate 39).
In FIG. 1, the first metal bump 12 (bottom side metal bump) is mounted on the first main surface 3a of the circuit board 3, and the second metal bumps 13 and 351 (devices) are mounted on the second main surface 3b of the circuit board 3. A device-embedded substrate 1 having a configuration in which a mounting-side metal bump) is mounted is illustrated.

  The metal bumps (here, the first metal bump and the second metal bump) refer to bumps formed of a bonding metal material such as solder.

The first metal bump 12 is mounted on an electrode pad 14 provided on the first main surface 3 a of the circuit board 3, and is electrically connected to the second through wiring 11 through the electrode pad 14.
Of the second metal bumps 13 and 351, the second metal bump 351 is mounted on the end of the through wiring 33 on the second main surface 3 b side of the circuit board 3. The second metal bump denoted by reference numeral 13 is mounted on the end of the second through wiring 11 on the second main surface 3 b side of the circuit board 3.

  However, these metal bumps are provided as necessary and can be omitted. The device-embedded substrate 1 has no metal bumps, only electrode pads for bonding with electronic components (bonding using a bonding metal material), and both main surfaces 3a and 3b of the circuit board 3. A configuration in which metal bumps are mounted on only one of them can also be employed.

  The installation positions of the first metal bumps 12 and the electrode pads 14 for mounting the first metal bumps 12 on the first main surface 3 a of the circuit board 3 are not necessarily on the first main surface 3 a side of the second through wiring 11. It is not limited to the position (refer FIG. 1) corresponding to an edge part. On the first main surface 3a of the circuit board 3, the electrode pads 14 and the first metal bumps 12 provided at positions separated from the end of the second through wiring 11 on the first main surface 3a side are connected to the first main surface 3a. The structure electrically connected with the 2nd penetration wiring 11 via the wiring part currently formed in this may be sufficient. In this case, on the first main surface 3a of the circuit board 3, in addition to the wiring portion 32 that electrically connects the through wiring 32 and the terminal portion 34, the electrode pad 14, the first metal bump 12, and the second through wiring. 11 is provided.

  Regarding the placement of the second metal bumps 13 and 351 on the second main surface 3 b of the circuit board 3, the end of the through wiring 33 on the second main surface 3 b side of the circuit board 3 and the circuit board 3 of the second through wiring 11 are also provided. It is not limited to the end on the second main surface 3b side. The second metal bump 351 and the through wiring 33 mounted on the second main surface 3b at a position separated from the end of the through wiring 33 on the second main surface 3b side are interposed through the wiring portion formed on the second main surface 3b. The second metal bumps 13 and the second through-wiring 11 mounted at positions separated from the end of the second through-hole wiring 11 on the second main surface 3b side in the second main surface 3b, It is also possible to electrically connect via a wiring portion formed on the second main surface 3b.

Here, the semiconductor substrate 39 is specifically a silicon substrate.
Reference numeral 39a in the drawing denotes an oxide film (silicon oxide film) formed on the surface of the semiconductor substrate 39. The wirings formed on the circuit board 3, such as the through wiring 33, the wiring portion 32, and the second through wiring 11, and the semiconductor. Electrical insulation with the substrate 39 is ensured.

The wiring (including the wiring portion 32, the through wiring 33, the terminal portion 34, and the second through wiring 11) formed on the circuit board 3 of the device built-in substrate 1 is formed of a conductive metal such as copper or a copper alloy. .
As the conductor metal, for example, gold, aluminum or the like can be used.
Further, the circuit board 3 can be provided with a diffusion preventing film for the purpose of preventing the conductor metal forming the wiring from diffusing (metal is transferred) into the semiconductor substrate 39. The diffusion prevention film is interposed between the conductor metal forming the wiring and the semiconductor substrate 39. Examples of the metal for the diffusion prevention film include Ta, TiN, SiN and the like.

The chip-type device 4 incorporated in the circuit board 3 has a rectangular parallelepiped appearance (cubic or square plate shape). In addition, as shown in FIGS. 2, 3, 10, etc., the chip type device 4 has a configuration in which one of the six outer wall surfaces is a pad installation surface 43 provided with electrode pads 44. Can be used. The electrode pad 44 is connected to the terminal portion 34 of the circuit board 3 so as to be electrically conductive by bonding (bonding using a bonding metal material).
Further, as the chip-type device 4, here, a flip-chip type device in which metal bumps 45 are mounted on the electrode pads 44 on the pad installation surface 43 is employed as shown in FIG. 3 and the like.

  As shown in FIG. 11 and the like, the device housing hole 31 has a square hole shape (specifically, in FIG. 11, a square through-hole in plan view). The chip-type device 4 is incorporated in the device housing hole 31 so that the pad installation surface 43 is perpendicular to the axis 31 a (center axis) of the device housing hole 31 of the circuit board 3.

The chip-type device 4 shown in FIG. 3 has a configuration in which metal bumps 45 are mounted on the electrode pads 44 on the pad installation surface 43.
In order to incorporate this chip-type device 4 into the device storage hole 31 of the circuit board 3 and mount it on the circuit board 3, the chip-type device 4 is inserted into the device storage hole 31 from the second main surface 3b side of the circuit board 3 and stored. The metal bump 45 of the chip-type device 4 is brought into contact with the terminal portion 34 of the circuit board 3, and in this state, the metal bump 45 is reflowed and cooled and solidified, whereby the electrode pad 44 is attached to the terminal portion 34 of the circuit board 3. Bond.

Reference numeral 36 in FIG. 2 denotes a bonding metal portion in which the electrode pad 44 of the chip-type device 4 and the terminal portion 34 of the circuit board 3 are bonded and electrically connected. The bonding metal portion 36 is formed of a conductive bonding metal material.
Here, the bonding metal portion 36 is formed by reflowing and cooling and solidifying the metal bump 45. However, the technique for realizing the bonding between the electrode pad 44 of the chip-type device 4 and the terminal portion 34 of the circuit board 3 is not limited to this, and for example, a metal that has been installed on the terminal portion 34. It can also be realized by reflowing bumps.

For example, solder can be used as the bonding metal material. In the case of solder, the metal bumps are solder bumps, and the bonding between the electrode pads 44 and the terminal portions 34 is soldering.
Metal bumps for bonding the electrode pads 44 and the terminal portions 34 are formed of a bonding metal material.

As the metal material for bonding, for example, Au (gold), InAu alloy, and other low melting point alloys can be used in addition to solder. The metal material for bonding refers to a material made entirely of a conductive metal (including an alloy) or a material mainly composed of a metal (including an alloy; having conductivity). The latter contains a trace amount of additives such as flux.
As a bonding metal material that forms a metal bump for bonding the electrode pad 44 and the terminal portion 34, a material that can realize brazing between the electrode pad 44 and the terminal portion 34 is preferable.

Metal bumps for bonding (for example, reference numerals 12, 12, etc.) for electrically connecting the through wirings 11, 33 and circuits of electronic components (for example, an integrated circuit unit 54, an electronic device such as a semiconductor package, a wiring board, etc.) As the metal bumps 13 and 351, those that can realize brazing between the through wirings 11 and 33 and the electronic component are preferable, and a bonding metal material similar to the metal bump for bonding the electrode pad 44 and the terminal portion 34 is preferable. Metal bumps made of can be used.
For example, reference numeral 35 described in FIG. 5 and the like designates an electronic component (for example, the integrated circuit portion 54) provided on the second main surface 3b of the circuit board 3 and the through wiring of the circuit board 3 as an electronic device or circuit board 3. It is a bonding metal part bonded by reflow and cooling of metal bumps (metal material for bonding) provided on the surface. The bonding metal part is formed by reflow and cooling of the metal bump.
Also, the bonding metal portion 15 in FIG. 4 is formed of electrons (for example, the second circuit board 9) provided on the first main surface 3a of the circuit board 3 or metal bumps (bonding metal material) provided on the circuit board 3. It is formed by reflow and cooling.
The bonding metal portion 36 in FIG. 5 is formed by reflow and cooling of metal bumps provided on the terminal portion 44 of the chip-type device 4 or the circuit board 3.

  2 and 11, reference numeral 37 denotes a filling resin portion formed in the device housing hole 31 of the circuit board 3. The filled resin portion 37 includes an inner surface (inner peripheral surface) of the device storage hole 31 and the chip-type device 4 (in detail, an outer peripheral surface of the chip-type device 4 (chip-type device 4). The chip-type device 4 is fixed between the outer wall surface and the surface perpendicular to the pad mounting surface 43)).

The device housing hole 31 of the device-embedded substrate 1 according to the present invention has a cross-sectional dimension (a cross-sectional dimension perpendicular to the direction of the axis 31a (center axis). Hereinafter, also referred to as a cross-sectional dimension of the device housing hole 31). The contact of the electrode pad 44 on the first pad mounting surface is slightly larger than the cross-sectional dimension perpendicular to the axis 31a of the device housing hole 31 in the chip-type device 4 (hereinafter also referred to as the cross-sectional dimension of the chip-type device 4). The dimension is increased by 5 to 195% of the dimension of the surface 44a.
The filled resin portion 37 has an entire circumference of the inner circumferential surface of the device housing hole 31 (however, at least one of the apexes of the four corners of the cross section of the chip-shaped device 4 shown in FIG. When it is in contact (for example, see FIG. 12), it is formed over this part.
The relationship between the cross-sectional dimension of the device housing hole 31 and the contact surface 44a of the electrode pad 44 of the chip-type device 4 will be described in detail later.

In the device-embedded substrate 1, the pad placement of the chip-type device 4 is continued in the device housing hole 31 of the circuit board 3 from the filling resin portion 37 in addition to the resin filling portion 37. An extended resin layer 37a covering the surface 43 (the pad installation surface 43 on which the electrode pad 44 bonded to the terminal portion 34 is installed) is also formed.
When the chip-type device 4 is an optical element, the extended resin layer 37a is formed of a transparent resin and functions as the transparent resin layer 38 that covers the pad installation surface 43 (receiving / light emitting unit installation surface) of the optical element 40.

1 to 3, the device built-in substrate 1 includes an opening sealing member 2 attached to the first main surface 3 a of the circuit substrate 3. The opening sealing member 2 is formed in a sheet shape or a plate shape, and is attached to the circuit board 3 so as to cover the entire first main surface 3a side, and on the first main surface 3a of the circuit board 3. The opening of the device housing hole 31 is blocked.
The opening sealing member 2 is configured such that when the liquid resin material 8 for forming the filling resin portion 37 and the extended resin layer 37a is injected into the device housing hole 31 (see FIG. 15), the first sealing substrate 2 of the circuit board 3 is used. The function of closing the opening of the device housing hole 31 in the main surface 3a and preventing leakage of the resin material 8 from the opening is achieved. Moreover, it functions also as a protective material which protects the terminal part 34 and the said pad installation surface 43 (1st pad installation surface) of the chip-type device 4 from collision of a collision object.

In the case where the chip-type device 4 is an optical element, a transparent member is employed as the opening sealing member 2, and the light receiving / emitting part 401 provided on the pad installation surface 43 of the optical element 40 and the sheet type are used. An optical path H2 (see FIG. 5) between the mirror portion 24 of the optical waveguide 20 is formed.
When the chip-type device 4 is other than an optical element, it is not always necessary to employ the transparent opening sealing member 2.

An example of a method for assembling the device built-in substrate 1 (an assembly method of the electronic device built-in substrate) will be described.
Here, as shown in FIG. 3, a case where a chip-type device 4 in which metal bumps 45 are mounted on electrode pads 44 will be described.
The circuit board 3 used here has a configuration in which the first metal bumps 12 and the second metal bumps 13 and 351 are mounted as shown in FIG. 1, but the first metal bumps 12 and the second metal bumps 13 are mounted. , 351 is employed, and the first metal bump 12 and the second metal bumps 13 and 351 may be mounted on the circuit board after the chip-type device 4 is assembled and mounted on the circuit board. good.

(Chip mounting process)
First, the chip-type device 4 is assembled in the device housing hole 31 of the circuit board 3, the metal bumps 45 of the chip-type device 4 are reflowed, and the electrode pads 44 are bonded to the terminal portions 34 of the circuit board 3 (chips). Mounting process). By cooling and solidifying the reflowed metal bumps 45, the electrode pads 44 of the chip-type device 4 and the terminal portions 34 of the circuit board 3 are bonded.

  In the chip mounting process, by reflowing the metal bumps 45, the contact surfaces 44a of the plurality of electrode pads 44 of the chip-type device 4 and the circuit board 3 are caused by the surface tension of the molten bump material (bonding metal material). Of the chip-type device 4 in the device housing hole 31 so that the contact surfaces 34a formed on the plurality of terminal portions 34 overlap (overlap in plan view, the contact surfaces 44a and 34a in FIG. 12 overlap). The position is adjusted (self-alignment of the chip-type device 4 by the surface tension itself of the reflowed bump material (bonding metal material)).

As described above, the cross-sectional dimension of the device housing hole 31 of the circuit board 3 according to the present invention is larger than the cross-sectional dimension of the chip-type device 4 and the dimension of the contact surface 44 a of the electrode pad 44 of the chip-type device 4. The size is increased by 5 to 195%. 11 and 12, specifically, an external cubic chip device 4 is used, and the chip device 4 has a cross-sectional shape perpendicular to the axis 31a (center axis) of the device housing hole 31. Is a rectangle (FIGS. 11 and 12 schematically show a square cross-sectional shape). The cross-sectional shape perpendicular to the axis 31 a (center axis) of the device housing hole 31 is a similar shape (rectangle, more specifically square) that is slightly larger than the cross-sectional shape of the chip-type device 4.
For this reason, at the stage where the chip-type device 4 is stored in the device storage hole 31 of the circuit board 3 (before the reflow of the metal bump 45), the difference between the cross-sectional dimension of the chip-type device 4 and the cross-sectional dimension of the device storage hole 31 The movable range within the device housing hole 31 is secured in the chip-type device 4.

The contact surfaces 44a of the plurality of electrode pads 44 of the chip-type device 4 of the illustrated example shown in FIG. 10 are rectangular (square in the illustrated example), and their areas are aligned with each other. Further, in the plurality of terminal portions 34 of the circuit board 3 illustrated in FIG. 12, the contact surface 34 a has the same shape and area as the contact surface 44 a of the electrode pad 44 of the chip-type device 4. The electrode pads 44 of the chip-type device 4 are formed by collectively adjusting the contact surfaces 44 a of all the electrode pads 44 by adjusting the position of the chip-type device 4 in the device housing hole 31. It arrange | positions so that it can align so that it may overlap with the contact surface 34a.
The cross-sectional dimension of the device housing hole 31 is obtained by adding 5 to 195% of the length of one of the four sides of the contact surface 44 a of the electrode pad 44 of the chip-type device 4 to the cross-sectional dimension of the chip-type device 4. It is a dimension.

  When the contact surface 44 a of the electrode pad 44 of the chip-type device 4 is circular, the cross-sectional dimension of the device housing hole 31 is 5 to 195% of the diameter of the contact surface 44 a of the electrode pad 44 of the chip-type device 4. The dimensions are in addition to the cross-sectional dimensions of the chip-type device 4.

  When the metal bump 45 is reflowed, the contact surface 44a of the plurality of electrode pads 44 of the chip-type device 4 and the plurality of terminal portions 34 of the circuit board 3 are caused by the surface tension itself of the melted bump material (bonding metal material). The position of the chip-type device 4 in the device housing hole 31 is adjusted so that the contact surface 34a overlaps with the contact surface 34a. Here, when the metal bump 45 is reflowed, the overlap between the contact surfaces 44a of the plurality of electrode pads 44 of the chip-type device 4 and the contact surfaces 34a of the plurality of terminal portions 34 of the circuit board 3 is not necessarily chip-shaped. The contact surfaces 44a of all the electrode pads 44 of the device 4 completely overlap the contact surfaces 34a of the plurality of terminal portions 34 of the circuit board 3 (the entire contact surfaces 44a of all the electrode pads 44 of the chip-type device 4 are terminals). The contact surface 44a is not located on the contact surface 34a of the terminal portion 34 of the circuit board 3 on the one or more electrode pads 44 of the chip-type device 4. Some parts may be present.

The plurality of terminal portions 34 of the circuit board 3 do not need to have the shape, area, and installation interval of the contact surface 34a completely coincide with the contact surface 44a of the electrode pad 44 of the chip-type device 4, for example, contact The size (area) of the surface 34 a may be slightly larger or slightly smaller than the contact surface 44 a of the electrode pad 44 of the chip-type device 4.
Further, the shapes and areas of the contact surfaces 34a of the plurality of terminal portions 34 do not necessarily have to coincide with each other, and may vary slightly.

  By performing self-alignment of the chip-type device 4 by reflow of the metal bump 45, the position of the chip-type device 4 accommodated in the device accommodation hole 31 is adjusted, and the contact surfaces 44a of all the electrode pads 44 of the chip-type device 4 are adjusted. However, it is possible to easily obtain a state in which the range that overlaps the contact surfaces 34a of the plurality of terminal portions 34 of the circuit board 3 is sufficiently secured. Therefore, the bonding and electrical connection between each electrode pad 44 and the terminal portion 34 are ensured by cooling and solidifying the bump material (bonding metal material) in a molten state by reflow.

In order to realize self-alignment of the chip-type device 4 by reflow of the metal bumps 45, all the electrode pads of the chip-type device 4 before reflow of the metal bumps 45 of the chip-type device 4 housed in the device housing hole 31 are realized. 44 metal bumps 45 need to be in contact with the terminal portions 34 of the circuit board 3. For this reason, the cross-sectional dimensions of the device housing hole 31 of the circuit board 3 are such that the contact surfaces 44a of all the electrode pads 44 of the chip-type device 4 housed in the device housing hole 31 are contact surfaces 34a of the terminal portions 34, respectively. It is adjusted so that it may have a portion that overlaps.
The contact surface 44a of the electrode pad 44 has a cross-sectional dimension of the device housing hole 31 of the circuit board 3 that is perpendicular to the axial center 31a (center axis) of the device housing hole 31 of the chip-type device 4. The contact surfaces 44a of all the electrode pads 44 of the chip-type device 4 housed in the device housing hole 31 overlap the contact surfaces 34a of the terminal portions 34 respectively. It is possible to realize the relationship of having a part.

As shown in FIG. 12, in order to smoothly realize the self-alignment of the chip-type device 4 by the reflow of the metal bump 45, the chip-type device 4 stored in the device storage hole 31 is reflowed at the time of the reflow of the metal bump 45. Permits movement of the device housing hole 31 along a plane perpendicular to the axis 31a (center axis), rotational movement about the axis about the axis 31a, and tilting with respect to the axis 31a (see FIG. 13). Need to be.
In this regard, the position of the terminal portion 34 with respect to the device housing hole 31 is determined when the central portion of the contact surface 44a of all the electrode pads 44 of the chip-type device 4 overlaps the central portion of the contact surface 34a of the terminal portion 34 (contact When the area where the surfaces 44a and 34a overlap each other is the maximum, hereinafter, the state at this time is also referred to as a complete alignment state, and the cross section orthogonal to the outer periphery of the chip-type device 4 (the axis 31a of the device housing hole 31). It is preferable to set so that a gap is secured between the inner circumference of the device housing hole 31 and the entire inner circumference. In the present embodiment, a configuration in which this position setting is performed for the terminal portion 34 is illustrated.
However, the present invention is not limited to this, and the position setting of the terminal portion 34 can be appropriately changed.

  The difference between the cross-sectional dimension of the device housing hole 31 of the circuit board 3 and the cross-sectional dimension of the chip-shaped device 4 perpendicular to the axis 31a (center axis) of the device housing hole 31 is the electrode pad of the chip-shaped device 4 If the size of the contact surface 44a of 44 is less than 5%, the gap between the inner peripheral surface of the device storage hole 31 and the outer peripheral surface of the chip-type device 4 stored in the device storage hole 31 is too small. There is a high possibility that the self-alignment of the chip-type device 4 due to the reflow of the bumps 45 is not realized smoothly. Further, it takes time to insert the chip-type device 4 into the device storage hole 31.

  On the other hand, the difference between the cross-sectional dimension of the device housing hole 31 of the circuit board 3 and the cross-sectional dimension perpendicular to the axis 31a (center axis) of the device housing hole 31 in the chip-shaped device 4 is If it exceeds 195% of the dimension of the contact surface 44 a of the electrode pad 44, the overlap between the contact surface 44 a of the electrode pad 44 of the chip-type device 4 housed in the device housing hole 31 and the contact surface 34 a of the terminal portion 34 will occur. When the metal bump 45 is reflowed, the case where the self-alignment due to the surface tension of the melted bump material (bonding metal material) is not effective is likely to occur. In this case, when the complete alignment state described above is achieved, the dimension of the contact surface 44a of the electrode pad 44 of the chip-type device 4 is 195/2 between the outer periphery of the chip-type device 4 and the inner surface of the device housing hole 31. % Gap will be secured.

  Further, as shown in FIG. 12, the cross-sectional dimension of the device storage hole 31 having a rectangular cross section (square in the illustrated example) of the circuit board 3 is such that the length of one side of the four cross sections is the device storage hole of the chip-type device 4. It is preferable that it is smaller than the diagonal dimension of a cross section (cross-sectional shape is rectangular, square in the illustrated example) perpendicular to the axis 31a (center axis) of 31.

If the length of one side of the device housing hole 31 is larger than the diagonal dimension of the cross section of the chip device 4, when the chip device 4 is housed in the device housing hole 31, the chip device 4 is stored in the device housing hole 31. Positioning in the direction around the axis centered on the axis 31a by the inner surface of the hole 31 (abutting the inner surface of the device housing hole 31 of the chip-type device 4) (overlap of the contact surfaces 44a and 34a before reflow of the metal bumps) To secure). Further, when the metal bump 45 is reflowed, the chip-type device 4 freely rotates in the direction around the axis centering on the axis 31 a, so that the contact surface 44 a and the terminal portion 34 of each electrode pad 44 of the chip-type device 4. The case where the overlap with the contact surface 34a becomes very small or the case where the overlap disappears easily occurs.
When the number of sets of electrode pads 44 and terminal portions 34 to be bonded to each other is large (for example, 5 sets or more), the process of reflowing metal bumps due to variations in metal bump size (amount of bump material (bonding metal material)) Rotation in the direction around the axis is likely to occur in the chip-type device 4 due to variations in the melting state of the metal bumps 45 and variations in the progress of solidification of the bump material in the step of cooling and solidifying the reflowed bump material.

  As shown in FIG. 12, the distance between the opposing inner surfaces of the four inner surfaces of the device housing hole 31 is smaller than the diagonal dimension of the cross section of the chip-type device 4, and the device housing of the circuit board 3. Depending on the difference between the cross-sectional dimension of the hole 31 and the cross-sectional dimension of the chip-type device 4, the rotation range in the direction around the axis about the axis 31a of the chip-type device 4 when the metal bump 45 is reflowed is set. For example, self-alignment due to the surface tension of the melted bump material (bonding metal material) ensures a sufficiently large overlap between the contact surface 44a of each electrode pad 44 of the chip-type device 4 and the contact surface 34a of the terminal portion 34. Can be realized more reliably.

  In addition, the cross-sectional shape of the chip-type device 4 and the cross-sectional shape of the device housing hole 31 are not limited to a square shape, and may be a rectangular shape. Also in this case, the cross-sectional shape of the device housing hole 31 is a similar shape of the cross-section of the chip-type device 4 that is larger than the cross-sectional dimension of the chip-type device 4 by 5 to 195% of the dimension of the contact surface 44a of the electrode pad 44. Will not change. Further, the device housing hole 31 has a length of at least one of the two sets of parallel sides of the outer periphery of the cross section shorter than the diagonal dimension of the chip-type device 4.

  In the circuit board 3, the cross-sectional dimension of the device housing hole 31 is perpendicular to the axis 31 a (center axis) of the device housing hole 31 in the chip-type device 4, and the contact surface 44 a of the electrode pad 44 is used. Therefore, the chip-shaped device 4 is positioned by the accuracy of the inner surface of the device housing hole 31 (the chip-shaped device 4 is positioned by fitting the chip-shaped device 4 into the device housing hole 31). Compared to the configuration of the above, the operation of inserting and inserting the chip-type device 4 into the device housing hole 31 can be performed easily and smoothly. Compared to the configuration in which the chip-type device 4 is positioned based on the accuracy of the inner surface of the device storage hole 31 (the configuration in which the chip-type device 4 is positioned by fitting the chip-type device 4 into the device storage hole 31). Since the requirement for the formation accuracy of the inner surface of the hole 31 may be considerably low, there is an advantage that the labor for processing the device housing hole 31 can be greatly reduced. Even if the formation accuracy of the inner surface of the device housing hole 31 is low, the chip-type device 4 can be self-aligned by the surface tension of the melted bump material (bonding metal material) only by reflowing the metal bump 45.

In addition, since the self-alignment of the chip-type device 4 can be realized by reflowing the metal bumps 351, it is not necessary to adjust the insertion position of the chip-type device 4 with respect to the device storage hole 31, and the chip-type device 4 is inserted into the device storage hole 31. The work can be done very easily.
As shown in FIG. 14A, variations are allowed in the positions of the chip-type devices 4 respectively housed in the plurality of device housing holes 31 of the circuit board 3. Then, by reflowing the metal bumps 351, as shown in FIG. 14B, the plurality of chip-type devices 4 are connected to the contact surfaces 44a of the plurality of electrode pads 44 of the chip-type device 4 and the contact surfaces 34a of the terminal portions 34. Alignment with respect to the terminal portion 34 can be performed in a short time in a short time so as to ensure a sufficiently large overlap.

(Filled resin part forming process)
When the chip mounting step is completed, a filling resin portion forming step for forming a filling resin portion 37 that fills the space between the inner surface of the device housing hole 31 and the chip-type device 4 is performed.
As shown in FIG. 15, in this filling resin portion forming step, the opening portion of the device housing hole 31 in the first main surface 3 a of the circuit board 3 (substrate with a device housing hole) is used as the opening sealing member 2. In the closed state, the filling resin portion 37 is formed by injecting the liquid resin material 8 into the device accommodation hole 31 (injecting into the device accommodation hole 31 from the device mounting surface 1a side) and solidifying.

At this time, a gap is ensured between the pad mounting surface 43 of the chip-type device 4 mounted on the circuit board 3 and the opening sealing member 2, and the resin material 8 is allowed to flow into the gap, thereby filling resin. Together with the portion 37, an extended resin layer 37a that covers the pad mounting surface 43 of the chip-type device 4 is also formed continuously from the filled resin portion 37. In this case, the filling resin portion 37 and the extended resin layer 37a are formed of the same resin material 8.
The gap between the pad installation surface 43 of the chip-type device 4 and the opening sealing member 2 is a circuit board 3 positioned between the pad installation surface 43 of the chip-type device 4 and the opening sealing member 2. The terminal portion 34 can be secured by restricting the opening node member 2 from entering the device housing hole 31. In addition, for example, a spacer for securing a gap can be used separately.

  When the chip-type device 4 is other than an optical element, the liquid resin material 8 may be any material that can fix the chip-type device 4 that has completed the chip mounting process by being injected into the device housing hole 31 and solidified. There is no particular limitation. As the resin for forming the filling resin portion 37 and the extended resin layer 37a, for example, a thermosetting resin such as an epoxy resin, a phenol resin, or a urethane resin, or an ultraviolet curable resin such as an epoxy resin or an acrylic resin can be employed. . It may be opaque. The liquid resin material 8 is injected into the device housing hole 31 and solidified to form the filling resin portion 37 and the extended resin layer 37a.

When the resin for forming the filling resin portion 37 and the extended resin layer 37a is an ultraviolet curable resin, the opening sealing member 2 can transmit ultraviolet rays for curing the liquid resin material 8 injected into the device housing hole 31. It is preferable to use a transparent material. Thereby, it is possible to irradiate the resin material 8 in the device housing hole 31 with ultraviolet rays from the side opposite to the circuit board 3 through the opening sealing member 2.
In this case, for example, polyimide, polynorbornene (PNB), benzocyclobutene (BCB), or the like is preferable as a material for forming the transparent sheet-like (or plate-like) opening sealing member 2.
When the chip-type device 4 is an optical element, a transparent optical path H2 (see FIG. 5) is formed between the mirror part 24 of the sheet-type optical waveguide 10 and the light receiving / emitting part 401 of the optical element 40. Adoption of the opening sealing member 2 is essential.

  In addition, the transparent opening portion sealing member 2 is used in the filling resin portion forming step in the state where the opening portion sealing member 2 is attached to the first main surface 3a of the circuit board 3 and The resin material 8 for forming the transparent resin layer 38 is injected into the device accommodation hole 31, and the device accommodation is performed from the bottom side mounting surface 1 a side of the device built-in substrate 1 through the opening sealing member 2. The filling state of the resin material 8 into the holes 31 can be observed.

  By completing the filling resin portion forming step, the device-embedded substrate 1 including the filling resin portion 37 and the extended resin layer 37a is obtained.

The device-embedded substrate 1 illustrated in FIG. 1 uses the first metal bumps 12 mounted on the first main surface 3a of the circuit board 3 and the second metal bumps 13 and 351 mounted on the second main surface 3b. Electrical connection (bonding) with a circuit of an electronic component (for example, an electronic device such as a semiconductor package, a wiring board, etc.) can be performed.
The first metal bump 12 penetrates the opening sealing member 2 and protrudes from the bottom side mounting surface 1a of the device built-in substrate 1, and is arranged on the bottom side mounting surface 1a side of the device built-in substrate 1. It can be used for electrical connection with parts.

In the integrated circuit portion 54A of the integrated circuit device 5A shown in FIG. 7, the integrated circuit portion 54A is located between the integrated circuit substrates 51 at both ends among a plurality (three or more in this case) of integrated circuit substrates 51 constituting the integrated circuit portion 54A. A configuration in which the device-embedded substrate 1 is used as one of the intermediate circuit substrates 51 is illustrated.
In the illustrated integrated circuit portion 54A, the first and second metal bumps 12 and 13 of the device built-in substrate 1 are used to connect the circuit wiring of the device built-in substrate 1 and the bottom side mounting surface 1a of the device built-in substrate 1 to the side. Electrical connection by bonding with circuit wiring of the laminated integrated circuit board 51, circuit wiring of the device built-in board 1 and circuit wiring of the integrated circuit board 51 laminated on the device mounting surface 1b side of the device built-in board 1 Bonding and electrical connection.
Further, as the integrated circuit section, for example, as an integrated circuit substrate 51 (including a device built-in substrate adopted as the integrated circuit substrate 51), one side thereof (for example, the lower side of each integrated circuit substrate 51 in FIG. 7) It is also possible to adopt a configuration in which metal bumps provided only on the surface are laminated.

  The integrated circuit portion 54 is not limited to the configuration in which the device-embedded substrate according to the present invention is applied to the intermediate-layer integrated circuit substrate 51, and the integrated circuit portion 54 is not limited to the plurality of integrated circuit substrates 51 constituting the integrated circuit portion 54. The device-embedded substrate 1 according to the present invention can be applied to one or both of the integrated circuit substrates 51 at both ends. Further, two or more of the plurality of integrated circuit substrates 51 constituting the integrated circuit portion may be the device-embedded substrate 1 according to the present invention.

FIG. 8 illustrates an integrated circuit device 5B assembled by mounting a packaged LSI chip 54B as an integrated circuit portion on the device mounting surface 1b of the device-embedded substrate 1.
In this integrated circuit device 5B, the second metal bumps 13 and 351 of the device built-in substrate 1 are connected to the electrode pads (not shown) of the LSI chip 54B and the circuit wiring (specifically in FIG. 8). It is used for bonding and electrical connection with the through wiring 33 and the second through wiring 11).
However, the present invention is not limited to this. For example, a flip chip type LSI chip provided with metal bumps is adopted, and the LSI built-in device substrate according to the present invention using the metal bumps of the LSI chip. It is also possible to mount the LSI chip on the device mounting surface of the device built-in substrate by using it for bonding to (which does not include the second metal bumps 13 and 351).

FIGS. 9A and 9B show, as the chip-type device 4, a pad installation surface 431 (second electrode) in which an electrode pad 441 (second electrode pad) is provided on the side opposite to the pad installation surface 43. The structure which employ | adopted the thing (chip-type device 4A) which comprises a pad installation surface) is illustrated.
The chip type device 4A of the illustrated example has a configuration in which metal bumps are mounted on the electrode pads 44, 441 of both pad mounting surfaces 43, 431. In the figure, reference numeral 451 denotes a metal bump mounted on the second electrode pad electrode pad 441.
However, the present invention is not limited to this, and a configuration in which metal bumps are mounted only on the electrode pads on one of the pad mounting surfaces, or a configuration in which only the electrode pads 44 and 441 are provided without providing metal bumps on both sides can be employed.

As shown in FIGS. 9A and 9B, a device-embedded board that is assembled using the chip-type device 4A as a chip to be incorporated in the device housing hole 31 of the circuit board 3 is disposed on the device mounting surface 1b side. The second metal bumps 13 and 351 and the metal bumps 451 mounted on the second installation surface 431 of the chip-type device 4A are provided.
In this case, by using the metal bump 451, the chip-type device 4A and the electronic component 6 provided on the device mounting surface side of the device-embedded substrate (for example, the integrated circuit unit 54 illustrated in FIG. 4 and illustrated in FIG. 7). The integrated circuit portion 54A and the LSI chip 54B illustrated in FIG. 8) can be directly connected (electrically connected).

4, 7, and 8, the electronic component 6 (integrated circuit portion 54 </ b> B in the illustrated example) and the chip-type device 4 on the device mounting surface 1 b side of the device-embedded substrate 1 pass through the device-embedded substrate. In this configuration, the wiring 33, the wiring part 32, and the terminal part 34 are connected.
In contrast to this, in the case of the configuration shown in FIGS. 9A and 9B, the length of the connection wiring connecting the chip-type device 4A and the electronic device can be shortened.

  The shortening of the connection wiring length between the electronic devices facilitates ensuring high-frequency signal characteristics between the electronic devices. For this reason, it is possible to increase the speed of signal transmission between electronic devices and increase the transmission amount.

Next, a case where an optical element is used as the chip type device 4 will be described.
As shown in FIGS. 1, 4, 5, and the like, the optical element 40 employed here includes a light receiving / emitting unit 401 on a pad installation surface 43. In the present embodiment, as shown in FIG. 10, on the pad installation surface 43, the light receiving / emitting unit 401 is installed at the center, and the electrode pads 44 are provided at a plurality of locations around the receiving / emitting unit 401. This is an example.
In the light emitting element 41, the electrode pad 44 functions as an input terminal for an electric signal for driving to the light emitting element 41. In the light emitting element 42, the electrode pad 44 functions as an output terminal for outputting a light receiving signal (electric signal) from the light receiving element 42.

In the optical element 40, the pad installation surface 43 functions as a light receiving / light emitting unit installation surface. In the optical element 40, the pad installation surface 43 is hereinafter also referred to as a light receiving / emitting unit installation surface.
The light receiving / emitting part installation surface 43 is an end surface of the optical element 40 that faces the sheet-shaped optical waveguide 20.
Note that the position of the light receiving / light emitting unit 401 on the light receiving / light emitting unit installation surface 43 is not necessarily the center of the light receiving / light emitting unit installation surface 43. The position may be shifted from the center of the light receiving / light emitting unit installation surface 43.
Further, the number of light receiving / light emitting portions 401 provided on the light receiving / light emitting portion installation surface 43 is not limited to one, and may be plural (see FIGS. 20A to 20C as an example). ).

For the device-embedded substrate having the structure in which the optical element 40 is mounted in the device housing hole 31 of the circuit board 3, as described above, in the filling resin portion forming step after the completion of the chip mounting step, the transparent opening Using the sealing member 2, a filling resin portion 37 and an extended resin layer 37a (hereinafter also referred to as a transparent resin layer 38) made of a transparent synthetic resin are formed. This enables optical coupling between the optical component (for example, the sheet-shaped optical waveguide in FIGS. 4 and 5) on the bottom side mounting surface 1 a side of the device-embedded substrate 1 and the light receiving / emitting unit 401 of the optical element 40.
In the optical waveguide with integrated circuit 10 shown in FIGS. 4 and 5, the mirror part 24 of the sheet-shaped optical waveguide 20 and the light receiving / emitting part 401 of the optical element 40 through the transparent resin layer 38 and the opening sealing member 2. Is transmitted (that is, the optical path H2 is secured).

As described above, the transparent opening portion sealing member 2 uses an ultraviolet curable resin as a synthetic resin for forming the filling resin portion 37 and the transparent resin layer 38, and uses the filling resin portion 37 and the extension resin layer 37a. Can be formed easily in a short time.
In addition, as a synthetic resin which forms the filling resin part 37 and the transparent resin layer 38, it is also possible to employ | adopt the thermosetting resin as stated above. However, as the thermosetting resin, a transparent resin is adopted in view of securing the optical paths H1 and H2.

  4 and 5, the transparent resin layer 38 prevents the air layer from interposing between the light receiving / emitting part 401 of the optical element 40 and the sheet-shaped optical waveguide 20. Thus, it effectively contributes to a reduction in loss due to scattering of transmitted light due to the presence of the air layer.

The optical waveguide with integrated circuit 10 will be described.
As shown in FIGS. 4 and 5, the optical waveguide with integrated circuit 10 is a sheet of an integrated circuit device formed by mounting an integrated circuit portion on the device-embedded substrate 1 (mounting on the device mounting surface 1b of the device-embedded substrate 1). It can be assembled by mounting on the optical waveguide 20.

The mirror portion 24 of the sheet-shaped optical waveguide 20 is shown in FIGS. 4 and 5 in a state where the device-embedded substrate 1 of the optical waveguide with integrated circuit 10 is bonded to the sheet-shaped optical waveguide 20 (the bottom side mounting surface 1a is bonded). As shown, the optical element 40 can receive and emit light through the sheet-shaped optical waveguide 20 (and the opening sealing member 2 and the transparent resin layer 38) from the side opposite to the circuit board 3 (device-embedded substrate 1). The mirror part 24 which is a V-shaped concave part is formed on the sheet-shaped optical waveguide 20 from the side opposite to the circuit board 3 in alignment with the part 401. The mirror portion 24 is formed by, for example, laser processing or machining of the sheet-shaped optical waveguide 20.
Alternatively, the optical waveguide with integrated circuit 10 may be mounted on the sheet-shaped optical waveguide 20 in which the mirror portion 24 has been formed, and the device-embedded substrate 1 may be bonded (the bottom-side mounting surface 1a is bonded).

(Sheet type optical waveguide)
The sheet type optical waveguide 20 will be described.
FIG. 16 is a perspective view showing the structure of the sheet-shaped optical waveguide 20.
As shown in FIG. 16, the sheet-shaped optical waveguide 20 has a structure having a linear core portion 22 in a sheet-like clad portion 21. The periphery of the linear core portion 22 is covered with a clad portion 21.
The core part 22 does not need to be linear, and may be curved in the clad part 21. Moreover, the core part 22 may have a branch part, and thereby the core part 22 may be configured in a circuit shape.

For example, the following (a) and (b) can be adopted as a method of manufacturing the sheet-shaped optical waveguide 20.
(A) As shown to Fig.17 (a), the clad layer 232 (resin layer for forming a part of clad part 21) is provided in both surfaces of the core layer 231 which is a resin layer for core part formation. An optical waveguide forming body 23 having a three-layer structure is prepared, and the optical waveguide forming body 23 is irradiated with active energy rays to form the core portion 22 (FIG. 17B).
By irradiation with active energy rays, a part of the core layer 231 becomes the core part 22, and a part other than the core part 22 of the core layer 231 and the clad layers 232 on both sides of the core layer 231 constitute the clad part 21.
In the case of this manufacturing method, the core part 22 having a quadrangular cross section (rectangle, but including a square) is obtained.

Examples of the material for forming the core layer 231 include resin materials such as acrylic resins, epoxy resins, polyimide resins, benzocyclobutene resins, and cyclic olefin resins such as norbornene resins. A resin composition mainly containing a cyclic olefin resin such as a benzocyclobutene resin or a norbornene resin is preferred, and a resin composition mainly containing an addition polymer of a norbornene resin is particularly preferred.
Examples of the active energy rays for forming the core portion 22 include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, and X-rays. An electron beam can be irradiated with an irradiation dose of, for example, about 50 to 200 KGy.
The material constituting the cladding layer is not particularly limited as long as the refractive index is lower than that of the material constituting the core layer. Specific examples include resin materials such as acrylic resins, epoxy resins, polyimide resins, benzocyclobutene resins, and cyclic olefin resins such as norbornene resins. Among these, a resin composition mainly comprising an addition polymer of norbornene resin is particularly preferable.
When a resin composition mainly composed of an addition polymer of norbornene-based resin is adopted as a material for forming the core layer and the clad layer, transparency, insulation, flexibility and heat resistance can be sufficiently obtained. In addition, the hygroscopicity can be reduced as compared with the case where other resins are used. In the case of a resin composition mainly composed of an addition polymer of norbornene resin, there is an advantage that the refractive index can be adjusted depending on the type of side chain of the addition polymer of norbornene resin.

The optical waveguide forming body 23 having a three-layer structure is formed by, for example, applying a varnish containing a resin material for forming individual layers of the optical waveguide forming body 23 to a sheet-like or plate-like base material. Can be obtained by sequentially forming. In this case, for example, the circuit board 3 itself can be used as a base material.
The optical waveguide with integrated circuit 10 is made of a varnish containing a resin material that forms the individual layers of the circuit board 3 on one surface of the sheet-shaped optical waveguide 20 and the optical waveguide forming body 23 having a three-layer structure on the other surface. The structure provided with the base material used when forming in order by application | coating may be sufficient.

(B) The periphery of the core part formed in advance is covered with a clad material (clad part).
In the case of this manufacturing method, the cross-sectional shape of the core part 22 becomes free.

Further, the optical waveguide with integrated circuit 10 may have a configuration in which the circuit board 3 is attached to one surface of the sheet-shaped optical waveguide 20 and a sheet-like or plate-like base material is attached to the other surface.
The base material may be, for example, a base material used when sequentially forming by applying a varnish containing a resin material for forming each layer of the optical waveguide forming body 23 having the three-layer structure described above.
However, it is necessary that the base material does not become an obstacle to the formation of the mirror portion 24 on the sheet-shaped optical waveguide 20. For this purpose, for example, a material that can be peeled off from the sheet-shaped optical waveguide 20 is employed, provided only at a location that avoids the planned formation position of the mirror portion 24, and is attached to the sheet-shaped optical waveguide 20 after the formation of the mirror portion 24. Take the following measures.

In the LSI 5 illustrated in FIG. 4, the integrated circuit unit 54 includes a driver circuit for driving control of the light emitting element 41 and a receiver circuit (amplifier) for the light receiving element 42. The circuit of the integrated circuit portion 54 is electrically connected to the light emitting element 41 and the light receiving element 42 via the through wiring 33 and the wiring portion 32 of the circuit board 3.
The integrated circuit unit 54 mounted on the circuit board 3 may be configured to include only one of the driver circuit of the light emitting element 41 and the receiver circuit of the light receiving element 42.

  As shown in FIG. 4, the sheet-shaped optical waveguide 20 includes a device-embedded substrate 1 and an electronic component 9 (for example, a circuit) provided on the opposite side of the device-embedded substrate 1 via the sheet-shaped optical waveguide 20. A bonding material storage hole 25 is provided through which a bonding metal portion 15 that connects a substrate (second circuit board), a semiconductor package, etc.) with a conductive bonding metal material so as to be electrically conductive can be provided.

Here, the metal bumps 12 (see FIG. 1) protruding from the bottom side mounting surface 1a side of the device built-in substrate 1 are used for bonding and electrical connection between the device built-in substrate 1 and the electronic component 9.
The metal bumps 12 of the device built-in substrate 1 before bonding to the electronic component 9 are housed in the bonding material housing hole 25, so that they are on the side opposite to the device built-in substrate 1 through the sheet-shaped optical waveguide 20. Since it protrudes, it can be used for bonding with the electronic component 9.

  It is also possible to omit the metal bump 12 of the device built-in substrate 1 and use the metal bump protruding from the electronic component 9 for bonding the device built-in substrate 1 and the electronic component 9. In this case, as a metal bump protruding from the electronic component 9, the metal bump can be brought into contact with the device-embedded substrate 1 (specifically, the electrode pad 14) when the metal bump is inserted into the bonding material storage hole 25. Adopt one.

As a method for processing (forming) the bonding material accommodation hole 25 in the sheet-shaped optical waveguide 20, for example, laser processing using an excimer laser is suitable. In addition, a method using reactive ion etching (RIE), exposure of the sheet-shaped optical waveguide 20 having photosensitivity, and processing by development can be employed.
In laser processing, the bonding material accommodation hole 25 having a desired size can be easily processed by using a stencil mask or the like. In the exposure and development of the reactive ion etching and the photosensitive sheet-shaped optical waveguide 20, the bonding material accommodation hole 25 having a desired size can be easily processed by using a film-like mask or a resist resin.

In the optical waveguide with integrated circuit 10 illustrated in FIG. 4 and the like, the circuit of the integrated circuit portion 54 provided on the device mounting surface 1b side of the device-embedded substrate 1 is bonded to the device-embedded substrate by bonding using a bonding metal material. An electronic component 9 that is connected to one second through wiring 11 so as to be electrically conductive and is provided on the side opposite to the device-embedded substrate 1 via the sheet-shaped optical waveguide 20 is connected to the device-embedded substrate via the bonding metal portion 15. Bonded to one second through wiring 11, the circuit of the integrated circuit device 5 and the circuit of the electronic component 9 are electrically connected via the second through wiring 11.
The second through wiring 11 of the device built-in substrate 1 electrically connects the integrated circuit portion 54 provided on the device mounting surface 1b side of the device built-in substrate 1 and the electronic component 9 bonded to the device built-in substrate 1. Function as connection wiring.

In FIG. 4, a configuration in which a circuit board (hereinafter referred to as a reference numeral 9 and also referred to as a second circuit board) is employed as the electronic component 9 is illustrated.
The second circuit board 9 extends along the sheet-shaped optical waveguide 20 and is laminated and attached to the sheet-shaped optical waveguide 20. The second circuit board 9 functions as an inter-integrated circuit connecting board that electrically connects the integrated circuit devices 5 of the optical waveguide with integrated circuit 10.

  The second circuit board 9 has circuit wirings 92 for connecting between the integrated circuit devices 5 (interconnecting circuits for connecting integrated circuits) on the joint surface 91 facing the sheet-shaped optical waveguide 20. The circuit wiring 92 is connected to the circuit of the integrated circuit portion 54 of the optical waveguide with integrated circuit 10 through the bonding metal portion 15 so as to be electrically conductive. The circuits of the plurality of integrated circuit devices 5 provided in the sheet-shaped optical waveguide 20 can be electrically connected to each other through the circuit wiring 92 of the second circuit board 9 so as to be separated from each other.

(Built-in hybrid device board)
As described above, FIG. 6 shows a light emitting element 41 and a driver element for driving the light emitting element 41 as a chip-type device 4 on one circuit board 3 having a plurality of device housing holes 31 (four or more in this case). 46, a light receiving element 42 and a device built-in substrate 1A (mixed device built-in substrate) configured to incorporate a light receiving signal converting receiver element 47 (amplifier) of the light receiving element 42 are illustrated. Although not shown, each of the chip-type devices 4 (the light emitting element 41, the driver element 46, the light receiving element 42, and the receiver element 47) has a filling resin portion 37 and an extension resin formed in the device housing hole 31. It is fixed by the layer 37a.
The device-embedded substrate 1A is a chip-type device incorporated in the circuit board 3 on the first main surface 3a of the circuit board 3 in addition to the wiring part 32 for connection between the through wiring 33 and the terminal part 34. 4 is provided with a wiring 321 for connection between the four (hereinafter also referred to as inter-chip connection wiring).

The interchip connection wiring 321 is formed between the device storage holes 31 of the circuit board 3 and is electrically connected to the terminal portions 34 respectively protruding from the device storage holes 31 at different positions of the circuit board 3. Has been.
In this device built-in substrate 1 </ b> A, the circuits of the chip-type device 4 mounted in the device housing hole 31 can be electrically connected via the inter-chip connection wiring 321.

  The interchip connection wiring 321 may be formed between the two device housing holes 31 so as to correspond to the connection between the circuits of the two chip type devices 4, but between the circuits of the three or more chip type devices 4. In order to correspond to the connection, it may be configured to be electrically connected to the terminal portion 34 protruding from each of the three or more device storage holes 31.

In the device-embedded substrate 1A illustrated in FIG. 6, the light emitting element 41 and the driver element 46, and the light receiving element 42 and the receiver element 47 are electrically connected to each other via an interchip connection wiring 321.
For this reason, in the device built-in substrate 1A, for example, the light emitting element 41 and the light receiving element 42 are connected to the device built-in substrate 1A via the through wiring 33, the wiring unit 32, and the terminal unit 34 of the device built-in substrate 1. The connection wiring length connecting the light emitting element 41 and the driver element 46 and between the light receiving element 42 and the receiver element 47 is shorter than the configuration in which the circuit is electrically connected to the circuit of the integrated circuit unit 54 mounted in FIG. The connection wiring length can be shortened.
The shortening of the connection wiring length between the chip-type devices 4 facilitates ensuring high-frequency signal characteristics between the chip-type devices 4. For this reason, it is possible to increase the speed of signal transmission between electronic devices and increase the transmission amount.

(Another aspect of optical waveguide with integrated circuit)
FIG. 18 shows an optical waveguide with integrated circuit 10 </ b> A in which an integrated circuit device 5 </ b> B having a device-embedded substrate 1 </ b> B that does not have the opening sealing member 2 is attached to a sheet-shaped optical waveguide 20.
In the optical waveguide with integrated circuit 10 </ b> A, the first main surface 3 a of the circuit board 3 is directly bonded to the sheet-shaped optical waveguide 20.

  For example, the device-embedded substrate 1B that does not have the opening sealing member 2 removes the opening sealing member 2 from the device-embedded substrate 1 with the opening sealing member 2 described above. Is performed in a state in which the opening of the device housing hole 31 is closed using a sealing plate or the like that can be moved toward and away from the circuit board 3 (after the filling resin portion forming step is completed, the sealing plate is attached to the circuit board 3). Can be obtained by

  In the case of this optical waveguide with integrated circuit 10A, since the opening sealing member 2 is not interposed between the circuit board 3 and the sheet-shaped optical waveguide 20, the optical waveguide with integrated circuit 10 illustrated in FIGS. In comparison, the distance between the light receiving / emitting unit 401 of the optical element 40 and the mirror unit 24 is short. Further, since the number of resin layers (in other words, the number of resin layers through which the optical path H2 passes) between the light receiving / emitting section 401 and the mirror section 24 of the optical element 40 is small, the transmission light at the interface between the layers is reduced. Scattering is suppressed, and light loss between the sheet-shaped optical waveguide 20 and the light receiving / emitting unit 401 of the optical element 40 can be reduced. That is, it is possible to easily realize a reduction in coupling loss between the sheet-shaped optical waveguide 20 and the light receiving / emitting section 401 of the optical element 40 and a reduction in insertion loss of light transmitted from the light-emitting element 41 to the sheet-shaped optical waveguide 20. .

(Another method of assembling the electronic device-embedded substrate (optical waveguide with integrated circuit))
An optical waveguide with integrated circuit 10A shown in FIG. 18 includes, for example, a sheet-type optical waveguide 20 itself directly attached to the circuit board 3 (specifically, attached to the first main surface 3a) as shown in FIG. It can also obtain by performing a filling resin part formation process as an opening part sealing member.
The chip mounting process is performed before the filling resin portion forming process. The sheet-shaped optical waveguide 20 is preferably performed after the completion of the chip mounting process.

(Adopting optical elements with multiple light receiving / emitting sections)
As described above, the optical element 40 applied to the device-embedded substrate according to the present invention may be one in which a plurality of light receiving / light emitting portions 401 are provided on the light receiving / light emitting portion installation surface 43.
However, as shown in FIGS. 20A to 20C, for example, as shown in FIGS. 20A to 20C, the light receiving / light emitting portion installation surface 43 is provided so that self-alignment of the optical element 40 with respect to the circuit board 3 can be performed as much as possible by reflowing metal bumps. In this case, it is preferable to adopt a configuration in which the electrode pads 44 are provided on both sides via the light receiving / emitting unit 401.
Reference numerals 40A, 40B, and 40C are attached to the optical elements 40 in FIGS.

In the example shown in FIGS. 20A to 20C, the optical element 40 is a chip having a rectangular parallelepiped shape having a rectangular light receiving / emitting part installation surface 43.
Optical elements 40A and 40C shown in FIGS. 20 (a) and 20 (c) have a central portion in the width direction of the rectangular light receiving / light emitting portion installation surface 43 (in the direction along the short side of the rectangular light receiving / light emitting portion installation surface 43). A plurality of light receiving / light emitting portions 401 are arranged and arranged in a line along the longitudinal direction of the rectangular light receiving / light emitting portion installation surface 43 in the center portion, and the plurality of light receiving / light emitting portions 401 are arranged. The electrode pads 44 are installed at a plurality of locations on both sides via the light emitting unit installation row 401L.

  If the electrode pad 44 is provided on only one side of the both sides via the light receiving / emitting unit installation row 401L, the optical element is accommodated in the device accommodation hole 31, and each electrode pad 44 is accommodated. The optical element 40 tilts when the metal bump mounted on the contact portion 34a is brought into contact with the contact surface 34a of the terminal portion 34, and the self-alignment of the optical element 40 with respect to the circuit board 3 even if the metal bump is reflowed. May not work effectively. On the other hand, as in the optical elements 40A and 40C shown in FIGS. 20A and 20C, the electrode pads 44 may be installed at a plurality of positions on both sides via the light receiving / emitting section installation row 401L. For example, when the optical element is stored in the device storage hole 31 and the metal bump mounted on each electrode pad 44 is brought into contact with the contact surface 34a of the terminal portion 34, the optical element 40 is tilted unnecessarily. And the self-alignment of the optical element 40 with respect to the circuit board 3 can be reliably performed by reflowing the metal bumps.

  In the optical element 40 having the rectangular light receiving / emitting part installation surface 43, the electrode pad 44 is rectangular in light receiving / emitting light in that the self-alignment of the optical element 40 with respect to the circuit board 3 effectively functions by reflowing the metal bumps. It is preferable that the configuration is provided at a plurality of locations along the longitudinal direction of the light receiving / light emitting unit installation surface 43 on each of both sides in the width direction of the unit installation surface 43. In this regard, the light receiving / light emitting unit 401 is not necessarily arranged to form the light receiving / light emitting unit installation row 401L. For example, the light receiving / light emitting unit 401 is installed in the region where the electrode pad 44 is installed on both sides in the width direction of the light receiving / light emitting unit installation surface 43, and at the center in the width direction of the light receiving / light emitting unit installation surface 43. It does not exclude the configuration, etc. that are not installed.

The optical element 40B of FIG. 20B has a configuration in which the light receiving / emitting section 401 and the electrode pad 44 are arranged in a line along the longitudinal direction of the rectangular receiving / light emitting section installation surface 43.
In this case, when the optical element is housed in the device housing hole 31 and the metal bump mounted on each electrode pad 44 is brought into contact with the contact surface 34a of the terminal portion 34, FIG. Although the posture stability of the optical element is inferior to the optical elements 40A and 40C shown in c), self-alignment of the optical element 40 with respect to the circuit board 3 by reflow of metal bumps can be realized without any problem.

Even when the optical element 40 formed on the rectangular parallelepiped chip having the rectangular light receiving / emitting portion installation surface 43 is employed, a cross section perpendicular to the axis 31 a of the device housing hole 31 is taken as the optical element 4. A rectangular shape having a dimension slightly larger than the cross-sectional dimension perpendicular to the axis 31a of the device housing hole 31 (enlarged by 5 to 195% of the dimension of the contact surface 44a of the electrode pad 44) This is the same as the case of the optical element having the light emitting portion installation surface 43.
Further, the device housing hole 31 having a rectangular cross section has a long side dimension of the cross section perpendicular to the axis 31a (center axis) of the device housing hole 31 of the optical element 40 (the cross sectional shape is rectangular. In the illustrated example, the square shape). Make it smaller than the diagonal dimension.

  When the optical element 40 having a configuration in which the light receiving / emitting parts 401 are provided at a plurality of locations along the longitudinal direction of the rectangular light receiving / emitting part installation surface 43, a plurality of the optical elements 40 are used as the sheet-shaped waveguide 20. The number of core portions 22 corresponding to the number of the light receiving / light emitting portions 401 (or the number of the light receiving / light emitting portions 401 may be larger) is adopted. In addition, a mirror part 24 is provided at a position corresponding to each light receiving / emitting part 401 of the optical element 40, and an optical path and light receiving / emitting light corresponding to each core part 22 of the sheet-shaped waveguide 20 via the mirror part 24. The unit 401 is optically coupled on a one-to-one basis.

  The optical element 40 of the type having a plurality of light receiving / light emitting portions 401 that is currently on the market generally has an installation interval of the light receiving / light emitting portions 401 in the longitudinal direction of the rectangular light receiving / light emitting portion installation surface 43 of 250 μm. Is. In order to cope with this, the arrangement interval of the core portions 22 formed in parallel corresponding to the plurality of light receiving / emitting portions 401 of the optical element 40 in the sheet-shaped optical waveguide 20 is also set to 250 μm.

  The arrangement interval of the core portions 22 formed in parallel with the sheet-shaped optical waveguide 20 is aligned with the installation interval of the light receiving / light emitting portions 401 in the longitudinal direction of the rectangular light receiving / light emitting portion installation surface 43 in the optical element 40. The installation interval of the light emitting units 401 is not limited to 250 μm. In the case of other than 250 μm (for example, 125 μm), the arrangement interval of the core portions 22 is also aligned with the installation interval of the light receiving / emitting portions 401 accordingly.

According to the device-embedded substrate and the circuit board 3 according to the present invention, the chip-type electronic device 4 is built in the device housing hole 31 of the circuit board 3 and mounted on the circuit board 3. 4 can easily be reduced in size of the entire device-embedded substrate including 4.
By applying the device-embedded substrate 1 according to the present invention as an integrated circuit substrate constituting an integrated circuit (integrated circuit device) formed by stacking a plurality of integrated circuit substrates, it is possible to easily reduce the size of the integrated circuit device. realizable.

  By using a device-embedded substrate in which the chip-type device 4 is incorporated in the device housing hole 31 of the circuit substrate 3 as one or more of the plurality of integrated circuit substrates constituting the integrated circuit device, a plurality of integrated circuit devices are manufactured. It is possible to eliminate the step of mounting a chip-type device by wire bonding or the like on a multilayer substrate formed by stacking integrated circuit substrates (or to reduce the number of chip-type devices to be mounted by wire bonding or the like). The device can be assembled efficiently. In addition, a known and existing technique can be applied to the process of assembling an integrated circuit device by stacking a plurality of integrated circuit substrates, which is advantageous in terms of ensuring productivity.

  In assembling the above-described device-embedded substrate, the positioning and mounting of the chip-type device can be easily performed by self-alignment simply by reflowing the metal bumps of the chip-type device 4 housed in the device housing hole 31 of the circuit board 3. . The positioning and mounting of the chip-type device with respect to the circuit board 3 can be performed simply and efficiently as compared with the technique of mounting the chip-type device by wire bonding or the like on a multilayer substrate assembled by stacking a plurality of integrated circuit substrates.

Further, according to the integrated circuit device of the present invention, since the chip-type device 4 is built in the integrated circuit device by adopting the device-embedded substrate, the number of mounted chip-type electronic devices 4 can be easily increased. Can be realized.
Further, since the chip-type electronic device 4 is built in a circuit board constituting the integrated circuit device, packaging is simplified or packaging is not required, and cost reduction can be easily realized.

In the present invention, the size of the chip-type device 4 (the size in the direction along the pad installation surface 43) can be accommodated by the size of the device housing hole 31 formed in the circuit board 3.
In addition, by adopting self-alignment by reflow of metal bumps for positioning of the chip-shaped device 4, in the range of the gap secured between the outer peripheral surface of the chip-shaped device 4 and the inner peripheral surface of the device housing hole 31, In the device housing hole 31, some versatility can be ensured with respect to the size of the chip-type device 4 (size in the direction along the pad installation surface 43).

In addition, as shown in FIGS. 21A and 21B, in the present invention, in order to widely correspond to the height dimension h (dimension in the direction perpendicular to the pad installation surface 43) of the chip-type device 4, a circuit board is used. 3 in which the thickness dimension t and the axial dimension d of the device housing hole 31 are sufficiently larger than the height dimensions h1 and h2 of the chip-type device 4 (reference numeral 3A in the figure). After the chip-type device 4 is assembled and mounted in the device housing hole 31 of the circuit board 3A (after completion of the filling resin portion forming step), by polishing from the device mounting surface 1b side of the obtained device built-in substrate 1C, etc. It is also possible to reduce the thickness of the device built-in substrate 1C.
By reducing the thickness of the device-embedded substrate 1C after the chip-type device 4 is mounted, the thickness dimensions of the device-embedded substrate 1C and the circuit board 3A can be appropriately adjusted according to the height dimensions h1 and h2 of the chip-type device 4. Further, by reducing the thickness dimension of the device-embedded substrate 1C, it is possible to reduce the size of an integrated circuit device configured using the device-embedded substrate 1C.
The method for reducing the thickness of the device-embedded substrate 1C from the device mounting surface 1b side is not limited to polishing. For example, cutting using a laser or the like, mechanical cutting, cutting, or a combination of any of these and polishing may be used.

  When the chip-type device 4 is an optical element, an optical element mounted on a substrate deposited on the sheet-shaped optical waveguide, for example, by attaching a device-embedded substrate incorporating the optical element 40 to the sheet-shaped optical waveguide. Compared with the configuration in which optical coupling is performed with the sheet-shaped optical waveguide, the light receiving / emitting portion 401 of the optical element 40 can be easily disposed close to the sheet-shaped optical waveguide 20. And the insertion loss of light transmitted from the light emitting element 41 to the sheet-shaped optical waveguide 20 can be easily realized.

In addition, this invention is not limited to the above-mentioned embodiment, It can change suitably.
(A) The present invention includes a device-embedded substrate that does not include the filling resin portion 37 and the transparent resin layer 38, and a device that includes only the filling resin portion among the filling resin portion 37 and the transparent resin layer 38. Includes substrate. In addition, the method for assembling the device-embedded substrate includes a configuration that does not include the filling resin portion forming step.
(B) The device-embedded substrate having the inter-chip connection wiring illustrated in FIG. 6 is not limited to the configuration in which the light-emitting element 41, the driver element 46, the light-receiving element 42, and the receiver element 47 are built-in. The present invention can be widely applied to electrical connection between a plurality of provided chip-type devices and electrical connection between chip-type devices other than optical elements. The plurality of chip-type devices incorporated in the circuit board of the device-embedded board having the inter-chip connection wiring may be configured such that no optical element is included.
(C) As a circuit board, it is not limited to what formed the device accommodation hole in the semiconductor substrate. For example, a device in which a device housing hole, a wiring portion, a terminal portion, and a through wiring are provided on an electrically insulating insulating resin plate can be employed.

It is a front sectional view showing the structure of a device built-in substrate and a circuit board according to an embodiment of the present invention. It is the expanded sectional view which expanded and showed the area | region A shown with the virtual line of the device built-in board | substrate of FIG. It is a figure which shows the chip-type electronic device before incorporating in the device accommodation hole of a circuit board. 1 is an overall front view showing a structure of an optical waveguide with an integrated circuit according to an embodiment of the present invention. FIG. 5 is an enlarged cross-sectional view showing a region B indicated by an imaginary line of the optical waveguide with an integrated circuit in FIG. 4 in an enlarged manner. FIG. 3 is a front sectional view showing a structure of a mixed device built-in substrate having a configuration in which a light emitting element, a driver element, a light receiving element, and a receiver element are incorporated in a device housing hole of a circuit board, and a structure of an optical waveguide with an integrated circuit configured using the substrate . It is a front sectional view showing another embodiment of the integrated circuit device according to the present invention. It is sectional drawing which shows the integrated circuit device of the structure which mounted the packaged LSI chip on the device built-in board | substrate as an integrated circuit part. BRIEF DESCRIPTION OF THE DRAWINGS It is front sectional drawing explaining the chip-type electronic device which comprises an electrode pad and a metal bump on both surfaces, and the device built-in board | substrate of the structure which incorporated it in the device accommodation hole of a circuit board, (a) is a chip-type electronic device Before installation, (b) shows after installation. It is a figure which shows the pad installation surface (receiving / light-emitting part installation surface of an optical element) of a chip-type electronic device. It is a top view which shows the state which the several electrode pad (specifically contact surface of an electrode pad) of a chip-type electronic device overlapped with the terminal part (specifically contact surface of a terminal part) of a circuit board, respectively. It is a top view which shows the relationship between the cross-sectional dimension of the device storage hole of a circuit board, and the cross-sectional dimension (especially diagonal dimension of a rectangular cross section) of a chip-type electronic device. It is a front sectional view explaining inclination of a chip type electronic device in a device accommodation hole of a circuit board by reflow of a metal bump of a chip type electronic device. (A), (b) is a figure (plan view) explaining the self-alignment of the chip-type electronic device in a plurality of device housing holes of the circuit board, (a) before reflow of the metal bumps of the chip-type electronic device (B) shows after reflow of the metal bump of the chip-type electronic device. It is a figure explaining the filling resin part formation process in the assembly method of the device built-in board concerning the present invention, Comprising: It is a device in the state where the opening part of the device accommodation hole in the joint surface of a circuit board was plugged up using the opening part sealing member It is a figure explaining the process of inject | pouring a liquid resin material in a storage hole. It is a perspective view which shows the structure of the sheet-like optical waveguide of the optical waveguide with an integrated circuit which concerns on this invention. It is a figure explaining an example of the manufacturing method of the sheet | seat type optical waveguide of FIG. 16, (a) is a perspective view which shows the optical waveguide formation body of 3 layers, (b) is an optical waveguide formation body of FIG. It is a perspective view which shows the state which formed the core part by irradiation of active energy to. It is a figure explaining another aspect of the optical waveguide with an integrated circuit which concerns on this invention, Comprising: It is a front sectional view which shows the structure of the optical waveguide with an integrated circuit of the structure which used the sheet | seat type optical waveguide itself as an opening part sealing member . It is a figure explaining another aspect of the assembly method (optical waveguide with an integrated circuit) of the assembly method of a board | substrate with a built-in electronic device. (A)-(c) is a figure which shows the example of the optical element which comprises multiple light receiving / light-emitting parts. It is a figure explaining the case where a device built-in board is assembled using a circuit board in which thickness dimension t and axial direction dimension d of a device accommodation hole are large enough compared with height dimension h of a chip type device, FIG. 21A is a diagram schematically showing a state in which a chip-type device is incorporated in a device housing hole of a circuit board, and FIG. 21B is a diagram schematically showing a state in which the thickness of the circuit board is reduced after FIG. It is.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C ... Electronic device built-in board | substrate (optical element built-in board | substrate), 1a ... Bottom part side mounting surface, 1b ... Device mounting surface, 11 ... 2nd penetration wiring, 12 ... Metal bump (1st metal bump), DESCRIPTION OF SYMBOLS 13 ... Metal bump (2nd metal bump), 14 ... Electrode pad, 15 ... Bonding metal part, 2 ... Opening part sealing member 3, 3A ... Circuit board, 3a ... 1st main surface, 3b ... 2nd main surface 31 ... Device housing hole, 31a ... Axis center, 32 ... Wiring portion, 321 ... Inter-chip connection wiring, 33 ... Through wiring, 34 ... Terminal portion, 34a ... Contact surface, 35 ... Bonding metal portion, 351 ... Metal bump (Second metal bump), 36 ... bonding metal part, 37 ... filling resin part, 37a ... extended resin layer, 38 ... transparent resin layer, 39 ... semiconductor substrate (silicon substrate), 39a ... oxide film, 4, 4A ... chip Electronic device , 40, 40A, 40B, 40C ... optical element, 401 ... light receiving / emitting part, 41 ... light emitting element, 411 ... light emitting part, 42 ... light receiving element, 421 ... light receiving part, 43 ... pad installation surface (light receiving / light emitting part installation) Surface), 431 ... pad mounting surface (second pad mounting surface), 44 ... electrode pad, 44a ... contact surface, 441 ... electrode pad (second electrode pad), 45 ... metal bump, 451 ... metal bump, 46 ... driver Element, 47 ... Receiver element, 5, 5A, 5B ... Integrated circuit device (LSI), 5a ... Bottom surface, 51 ... Substrate, 52 ... Electronic circuit, 53 ... Via wiring, 54, 54A ... Integrated circuit section, 54B ... Integrated circuit Part (LSI chip), 6 ... electronic component, 8 ... (liquid) resin material, 9 ... electronic component (second circuit board), 91 ... bonding surface, 92 ... circuit wiring (connection wiring between integrated circuits), 10, 10A ... Circuit-equipped optical waveguide, 20 ... sheet type optical waveguide, 21 ... clad portion, 22 ... core part, 23 ... optical waveguide forming body, 231 ... core layer, 232 ... clad layer, 25 ... bonding material accommodating hole.

Claims (22)

A semiconductor substrate incorporates a wiring portion formed on at least one of both surfaces of the semiconductor substrate, a through-wiring penetrating the semiconductor substrate, and a through-hole penetrating the semiconductor substrate and incorporating a chip-type electronic device. The device storage hole and the electrode pad provided on the chip-type electronic device are electrically connected to each other by extending from one of the wiring portions on both sides of the semiconductor substrate to the opening at one end of the device storage hole. And a protruding terminal portion connected to the
The cross-sectional dimension of the device housing hole is a dimension obtained by increasing the cross-sectional dimension perpendicular to the axis of the device housing hole of the chip-type electronic device by 5 to 195% of the dimension of the contact surface of the electrode pad. ,
The chip-type electronic device is a square chip, and the device storage hole having a rectangular cross section for storing the chip-type electronic device has a length of at least one of the two sets of parallel sides of the outer periphery of the cross section. Is shorter than the diagonal dimension of the chip-type electronic device,
The chip-type electronic device is capable of rotating and moving within the device storage hole while being set and regulated by a difference between a cross-sectional dimension of the device storage hole and a cross-sectional dimension of the chip-type electronic device, and The contact surfaces of all the electrode pads of the chip-type electronic device overlap the contact surfaces of the terminal portions in plan view over the entire range of rotational movement of the chip-type electronic device around the axis centered on the axis. A circuit board characterized by having a portion. The chip-type electronic device is incorporated in the device housing hole of the circuit board according to claim 1, and the electrode pads of the chip-type electronic device are bonded with a conductive bonding metal material so as to be electrically conductive. An electronic device-embedded substrate characterized by comprising: 3. The electronic device built-in substrate according to claim 2 , further comprising: a filling resin portion that fills a space between the inner surface of the device storage hole and the chip-type electronic device in the device storage hole. An optical element that is a light-emitting element or a light-receiving element as the chip-type electronic device is incorporated in the device housing hole, and this optical element is a surface on which the electrode pad bonded to the terminal portion is provided. 4. The electronic device built-in substrate according to claim 2 , further comprising a light emitting portion or a light receiving portion on a surface. A transparent resin formed on the pad mounting surface of the optical element continuously from the filling resin part, comprising a filling resin part filling the space between the inner surface of the device storage hole and the optical element in the device storage hole The electronic device-embedded substrate according to claim 4 , wherein the light emitting unit or the light receiving unit is covered with a layer. 6. The electronic device built-in according to claim 4 , wherein the circuit board is provided with a transparent opening sealing member that closes the opening provided with the terminal portion of the device housing hole. substrate. The circuit board has a plurality of device housing holes, and a light emitting element incorporated in the device housing hole and a light receiving element incorporated in a device housing hole different from the device housing hole in which the light emitting element is incorporated. The board | substrate with a built-in electronic device in any one of Claims 4-6 characterized by including an element. A plurality of the device housing holes are formed in the circuit board, a device housing hole in which a light emitting element is incorporated, and a device housing hole in which a driver element for driving the light emitting element is incorporated as the chip-type electronic device, comprising a, the light emitting element and the driver element is, in any one of claims 4-7, characterized in that said are electrically connected through a circuit board formed wiring chip connection The board | substrate with a built-in electronic device of description. A plurality of device housing holes are formed in the circuit board, a device housing hole in which a light receiving element is incorporated, and a device housing in which a receiver element for converting a light receiving signal of the light receiving element is incorporated as the chip-type electronic device. ; and a hole, and the light receiving element and the receiver element, any claim 4-8, characterized in that said are electrically connected through a circuit board formed wiring chip connection An electronic device-embedded substrate according to claim 1. The electronic device-embedded substrate according to claim 2 , further comprising an electrode pad and a metal bump mounted on the electrode pad on at least one of both surfaces of the circuit board. 11. The electronic device-embedded substrate according to claim 2 , wherein the chip-type electronic device includes a second electrode pad on a side opposite to the pad mounting surface. 12. The electronic device built-in substrate according to claim 11, wherein metal bumps are mounted on the second electrode pads. 13. An integrated circuit device comprising: a base circuit board that is an electronic device built-in substrate according to claim 2 ; and an integrated circuit portion mounted on one surface of the base circuit board. The integrated circuit portion is configured by connecting circuit wirings of an integrated circuit substrate laminated in multiple layers on a base circuit substrate, and one or more of the plurality of integrated circuit substrates constituting the integrated circuit portion are: 14. The integrated circuit device according to claim 13 , wherein the integrated circuit device is a substrate with a built-in electronic device according to claim 2 or 3 . One or a plurality of integrated circuit devices according to claim 13 or 14 are mounted on the sheet-shaped optical waveguide, the base circuit substrate being the electronic device built-in substrate according to any one of claims 3 to 9 ,
The sheet-shaped optical waveguide has the light emitting element and the light receiving element at positions corresponding to light emitting elements incorporated in the integrated circuit device and positions corresponding to light receiving elements incorporated in the integrated circuit device. An optical waveguide with an integrated circuit, comprising a mirror portion for forming an optical path that is optically connected through a sheet-shaped optical waveguide. And a second circuit board laminated on the opposite side of the sheet-shaped optical waveguide from the base circuit board,
For bonding, the circuit wiring of the second circuit board and the electrode pads provided on the base circuit board of the integrated circuit device are electrically connected to the bonding material accommodation holes penetrating the sheet-shaped optical waveguide. A plurality of the integrated circuit devices in which a metal material is stored and connected to the circuit wiring of the second circuit board so as to be electrically conductive are electrically connected to each other via the circuit wiring of the second circuit board. The optical waveguide with an integrated circuit according to claim 15 . A chip-type electronic device is incorporated in the device housing hole of the circuit board according to claim 1, and a metal bump previously mounted on an electrode pad provided in the chip-type electronic device is reflowed to form the electrode pad. An electronic device built-in substrate assembling method, wherein: Claim 17, characterized in that said electrode pad after bonding to the terminal part comprises a filled resin portion forming step of forming a filled resin portion filling the space between the said chip-type electronic device and the device receiving hole inner surface A method for assembling the electronic device-embedded substrate as described. In the filling resin portion forming step, the circuit board has a liquid in the device housing hole in a state in which the opening of the device housing hole provided with the terminal portion is closed with an opening sealing member. 19. The method of assembling an electronic device built-in substrate according to claim 18, wherein the resin material is injected to form the filled resin portion. 20. The method of assembling a substrate with a built-in electronic device according to claim 19 , wherein a transparent opening sealing member is used. As the chip-type electronic device, an optical element that is a light-receiving element or a light-emitting element is used, and metal bumps that are mounted in advance on electrode pads provided on the end face where the light-receiving / light-emitting portion of the optical element is provided. 21. The method of assembling an electronic device built-in substrate according to claim 17 , wherein the electrode pad is bonded to the terminal portion by reflow. The method for assembling an electronic device built-in substrate according to claim 21, wherein the electronic device built-in substrate according to claim 19 or 20 is assembled.
A method of assembling a substrate with a built-in electronic device, wherein in the filling resin portion forming step, a transparent resin layer covering the end face of the optical element is formed continuously from the filling resin portion.

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