JP5135865B2 - Light source substrate manufacturing method and light source substrate manufacturing apparatus - Google Patents

Description

  The present invention relates to a light source substrate manufacturing method and a light source substrate manufacturing apparatus built in a backlight device that irradiates light to a liquid crystal display panel or the like.

At present, in the liquid crystal display device, a method of displaying an image by illuminating a transmissive liquid crystal display panel from the back side with a backlight device is mainly used. As a light source of the backlight device, a fluorescent lamp such as a CCFL (Cold Cathode Fluorescent Lamp) is often used. Recently, a light emitting diode (LED: Light Emitting Diode) having higher luminance and lower power consumption than CCFL is used. It has come to be used instead of CCFL (see, for example, Patent Document 1).
JP 2006-301209 A

  However, in the light emitting diode, the brightness and wavelength are more likely to vary from individual to individual than the CCFL, which causes uneven brightness and color unevenness in the backlight device. For example, a light emitting diode with uniform characteristics such as brightness and wavelength is used. It is necessary to sort.

  As a selection method of light emitting diodes, for example, appearance inspection and measurement of optical characteristics are performed on all chip-shaped light emitting diodes (hereinafter referred to as “chips”) formed on a wafer, and as a result, Chips judged as non-defective are ranked from the viewpoint of optical characteristics, and are temporarily placed on a tray (or sheet) for each rank, and one or more types of chips are mounted on the substrate from the tray (or sheet). , Mount an optical lens on the mounted chip to form a subunit, measure the optical characteristics of each chip in the subunit, and as a result, rank the subunits determined to be non-defective from the viewpoint of optical characteristics, There is a method of classifying subunits by rank.

  In this method, since it is possible to easily grasp how many chips and subunits are present for each rank, inventory management is easy. In addition, it is easy to rework a defective light emitting diode at the stage of the subunit before the light emitting diode is mounted on the wiring board. Therefore, when a light-emitting diode is used as a light source, it is a common practice to form a light source substrate by mounting a subunit obtained using this method on a wiring substrate.

  However, in the above-described method, if the range of each rank is too narrow, the number of ranks becomes enormous and waste increases. Therefore, the range of each rank is set to be somewhat wide. For this reason, once it is attempted to form a high-performance light source substrate with strict specifications, it is necessary to further select the ranked subunits, which increases the number of processes. Further, in the above method, since the subunits that are parts of the light source substrate must be produced for each rank and kept in stock, the number of stocks increases.

  The present invention has been made in view of such a problem, and an object thereof is to manufacture a light source substrate and a light source substrate manufacturing method capable of manufacturing a high-performance light source substrate while minimizing the number of processes and the number of stocks. To provide an apparatus.

Manufacturing method of the light source substrate of the present invention, based on the optical characteristics data obtained by measuring the individual optical properties of a plurality of light emitting diodes of U E c on which is formed in a chip shape, matching the extraction conditions The method includes a mounting step of manufacturing a light source substrate by directly mounting a light emitting diode corresponding to data on a wiring substrate. The optical property data includes position information of the individual light emitting diodes on the wafer and at least one of light output, wavelength, forward voltage, and reverse bias current. The wafer is given unique wafer identification information for each wafer. In the mounting step, the light emitting diode is directly mounted on the wiring board based on the optical characteristic data and the wafer identification information of the wafer from which the optical characteristic data is obtained.

The light source substrate manufacturing apparatus of the present invention, based on the optical characteristics data obtained by measuring the individual optical properties of a plurality of light emitting diodes of U E c on which is formed in a chip shape, matching the extraction condition data A light emitting diode corresponding to the above is directly mounted on the wiring substrate, and a light source substrate is manufactured . The optical property data includes position information of the individual light emitting diodes on the wafer and at least one of light output, wavelength, forward voltage, and reverse bias current. The wafer is given unique wafer identification information for each wafer. In the mounting step, the light emitting diode is directly mounted on the wiring board based on the optical characteristic data and the wafer identification information of the wafer from which the optical characteristic data is obtained.

  In the light source substrate manufacturing method and the light source substrate manufacturing apparatus according to the present invention, the extraction conditions are met based on optical characteristic data obtained by measuring individual optical characteristics of a plurality of light emitting diodes formed on the wafer. The light emitting diode is mounted directly on the wiring board. That is, a light emitting diode that meets the extraction conditions is directly mounted on the wiring board without producing a subunit that is an intermediate part of the light source board.

  According to the light source board manufacturing method and the light source board manufacturing apparatus of the present invention, the light emitting diode that matches the extraction condition is directly mounted on the wiring board without producing the subunit that is an intermediate part of the light source board. It is only necessary to stock the wafers, and it is not necessary to stock the subunits that can be enormously larger than the wafers. Thereby, the number of inventory can be reduced. Moreover, since it is possible to form a high-performance light source substrate with strict specifications by setting extraction conditions, it is not necessary to rank. Thereby, the number of processes can be reduced by the amount necessary for ranking. If the correspondence between each light emitting diode and the optical characteristic data can be stored, the light emitting diodes can be collected in lot units or in trays (or sheets) instead of being stocked on the wafer. You may stock in the state put together for every. In this case, these operations are separately required, but conventionally, since the chips and subunits are ranked, the number of processes can be reduced as compared with the prior art. Therefore, in the present invention, it is possible to manufacture a high-performance light source substrate while minimizing the number of processes and the number of inventory.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows functional blocks of a light source substrate manufacturing apparatus 1 according to an embodiment of the present invention. The light source board manufacturing apparatus 1 is an apparatus for manufacturing a light source board 100 described later, and includes an ID printing unit 10, an optical inspection unit 11, an extraction data generation unit 12, an ID printing unit 13, a mounting unit 14, An optical inspection unit 15 and a traceability unit 16 are provided. In FIG. 1, each functional block is described as an independent device. However, in this embodiment, the light source substrate manufacturing apparatus 1 does not need to be an independent device. An included device may be provided.

  For example, as shown in FIG. 2, the ID printing unit 10 generates unique identification information (wafer ID (10D)) that can identify individual wafers 20R, 20G, and 20B on the wafers 20R, 20G, and 20B. This is an apparatus for printing or attaching a label printed with a wafer ID (10D) to the wafers 20R, 20G, and 20B. The position where the wafer ID (10D) is printed on the wafers 20R, 20G, 20B or the position where the label printed with the wafer ID (10D) is attached to the wafers 20R, 20G, 20B is on each of the wafers 20R, 20G, 20B. Any of the surfaces of the wafers 20R, 20G, and 20B may be used as long as the chips 21R, 21G, and 21B are not obstructed when picking.

  Here, the wafer 20R is formed with a plurality of chip-like red light emitting diodes (chips) 21R, and the individual chips 21R are two-dimensionally arranged on the wafer 20R. Similarly, the wafer 20G is formed with a plurality of chip-shaped green light emitting diodes (chips) 21G, and the individual chips 21G are two-dimensionally arranged on the wafer 20G. Further, the wafer 20B is formed with a plurality of chip-like blue light emitting diodes (chips) 20B, and the individual chips 20B are two-dimensionally arranged on the wafer 20B.

  The optical inspection unit 11 measures, for example, individual optical characteristics of the plurality of chips 21R, 21G, and 21B formed on the wafers 20R, 20G, and 20B, and the wafer IDs of the measurement target wafers 20R, 20G, and 20B. (10D) reading device. The optical characteristics measured by this apparatus are at least one of parameters that are likely to vary in each of the chips 21R, 21G, and 21B, for example, optical output, wavelength, forward voltage, and reverse bias current. For example, as shown in FIG. 3, the optical inspection unit 11 uses the measured positional information (for example, x, y coordinates) on the wafers 20R, 20G, and 20B of the chips 21R, 21G, and 21B as shown in FIG. As shown in FIG. 1, the optical characteristic data 11D is sent to the extraction data generation unit 12 and the traceability unit 16 together with the wafer ID (10D). That is, the optical inspection unit 11 uses, as unique identification information that can identify the individual chips 21R, 21G, and 21B, the wafer ID (10D) of the measurement target wafers 20R, 20G, and 20B and the individual chips 21R. , 21G, and 21B on the wafers 20R, 20G, and 20B (for example, x and y coordinates).

  For example, as shown in FIG. 4, the extraction data generation unit 12 is based on the optical property data 11D and the wafer IDs (10D) of the wafers 20R, 20G, and 20B from which the optical property data 11D is obtained. Position information (for example, x, y coordinates) of the chips 21R, 21G, and 21B on the wafers 20R, 20G, and 20B corresponding to the data that matches the extraction condition 12A is extracted from the optical characteristic data 11D to generate the extracted data 12D; As shown in FIG. 1, the extracted data 12D is sent to the mount unit 14 together with the wafer ID (10D).

  The extraction condition 12A can freely specify the parameter values included in the optical characteristic data 11D as needed. For example, as shown in FIG. A plurality of parameters included in the optical characteristic data 11D, such as specifying a parameter value in a range, specifying a single point such as “wavelength 621.0 nm”, or “reverse bias current not specified”, for example. It is also possible to make one or a plurality of values unspecified.

  For example, as shown in FIGS. 5 and 6, the ID printing unit 13 prints unique identification information (board ID (13D)) that can identify each wiring board 100A on each wiring board 100A. Or it is an apparatus which affixes the label which printed board ID (13D) to each wiring board 100A. The positions where the board ID (13D) is printed on the wiring board 100A or the position where the label printed with the board ID (13D) is pasted on the wiring board 100A are mounted on the wiring board 100A with the chips 21R, 21G, and 21B. Any place on the surface of the wiring board 100A may be used as long as it does not get in the way.

  For example, as shown in FIG. 5, the mount unit 14, based on the extraction data 12 </ b> D and the wafer ID (10 </ b> D), inserts the chips 21 </ b> R, 21 </ b> G, and 21 </ b> B corresponding to the data matching the extraction condition 12 </ b> A into the wiring board 100 </ b> A. Mount directly on top. More specifically, in the wafers 20R, 20G, and 20B corresponding to the wafer ID (10D), positional information (for example, x, x) of the chips 21R, 21G, and 21B included in the extracted data 12D on the wafers 20R, 20G, and 20B. The chips 21R, 21G, and 21B formed at positions corresponding to the y coordinate) are directly mounted on the wiring board 100A. In this way, the mount unit 14 forms the light source substrate 100 as shown in FIG. 6, for example, by disposing all the chips 21R, 21G, and 21B at predetermined positions on the wiring substrate 100A. ing.

  In addition, it is preferable that the mount part 14 is prepared separately for each chip 21R, 21G, 21B. Further, when the mount unit 14 can store the correspondence between the chips 21R, 21G, and 21B and the optical characteristic data 11D, as shown in FIG. There is no need to pick directly from the wafers 20R, 20G, and 20B and mount them directly on the wiring board 100A. For example, the chips 21R, 21G, and 21B are grouped in lot units or in a tray (or sheet) grouped state. Thus, it may be picked from a lot or tray (or sheet) and directly mounted on the wiring board 100A.

  The mount unit 14 mounts the chips 21R, 21G, and 21B directly at predetermined positions on the wiring board 100A, and then mounts the chips 21R, 21G, and 21B, for example, as shown in FIG. The board ID (13D) of the wiring board 100A, the wafer ID (10D) of the wafers 20R, 20G, and 20B on which the mounted chips 21R, 21G, and 21B are formed, and the mounted chips 21R, 21G, and 21B are formed. The positional information (for example, x, y coordinates) on the wafers 20R, 20G, and 20B that has been performed and the positional information (for example, x, y coordinates) of the mounted chips 21R, 21G, and 21B on the wiring board 100A are mutually connected. The mount data 14D is generated in association with each other and sent to the traceability unit 16 as shown in FIG. .

  The optical inspection unit 15 is, for example, a device that measures individual optical characteristics of the plurality of chips 21R, 21G, and 21B mounted on the wiring board 100A and reads the board ID (13D) of the wiring board 100A to be measured. is there. The optical characteristics measured by this apparatus are at least one of parameters that are likely to vary in each of the chips 21R, 21G, and 21B mounted on the wiring board 100A, for example, luminance, wavelength, chromaticity, forward voltage, and reverse bias current. One. The optical inspection unit 15 associates the measured optical characteristics with the positional information (for example, x, y coordinates) on the wiring board 100A of the measured chips 21R, 21G, and 21B as shown in FIG. As shown in FIG. 1, the inspection data 15D is sent to the traceability unit 16 together with the substrate ID (13D). That is, the optical inspection unit 15 uses the board ID (13D) of the wiring board 100A to be measured and the individual identification information that can identify the individual chips 21R, 21G, and 21B on the wiring board 100A as well as the individual IDs. Position information (for example, x, y coordinates) on the wiring substrate 100A of the chips 21R, 21G, and 21B is used.

  The traceability unit 16 associates the inspection data 15D associated with the substrate ID (13D), the mount data 14D, and the optical property data 11D associated with the wafer ID (10D) to generate the traceability data 16D. It has become. Thereby, for example, the chip 21R, 21G or 21B mounted at the position (x, y) on the wiring board 100A of a certain substrate ID (13D) is formed at which position on which wafer 20R, 20G, 20B. Or the optical measured by the optical inspection unit 11 and the optical inspection unit 15 of the chip 21R, 21G or 21B mounted at the position (x, y) on the wiring substrate 100A of a certain substrate ID (13D). It is possible to know (track) what kind of content the result of the characteristic was.

  Next, an example of a method of manufacturing the light source substrate 100 using the light source substrate manufacturing apparatus 1 of the present embodiment will be described with reference to FIG. FIG. 9 is a flowchart for explaining an example of a method for manufacturing the light source substrate 100.

  First, labels printed with the wafer ID (10D) in the ID printing unit 11 are attached to the wafers 20R, 20G, and 20B (step S1). Subsequently, the wafers 20 </ b> R, 20 </ b> G, and 20 </ b> B with labels attached thereto are set in the optical inspection unit 11. Further, a label on which the board ID (13D) is printed in the ID printing unit 13 is attached to each wiring board 100A (step S2), and each wiring board 100A to which the label is attached is set on the mount unit.

  Next, the optical inspection unit 11 measures individual optical characteristics of the plurality of chips 21R, 21G, and 21B formed on the wafers 20R, 20G, and 20B (step S3). Subsequently, the optical characteristic data 11D is generated by associating the measured optical characteristic data with the measured wafer position information (x, y coordinates) on the wafers 20R, 20G, and 20B of the chips 21R, 21G, and 21B. Step S4). Thereafter, the generated optical characteristic data 11D and the wafer ID (10D) are sent to the extraction data generation unit 12 and the traceability unit 16.

  Next, in the extraction data generation unit 12, based on the optical characteristic data 11D and the wafer ID (10D) of the wafers 20R, 20G, and 20B from which the optical characteristic data 11D is obtained, data that matches the extraction condition 12A The wafer position information of the chips 21R, 20G, and 20B corresponding to is extracted, and extracted data 12D is generated (step S5). Thereafter, the generated extraction data 12D and the wafer ID (10D) are sent to the mount unit 14.

  Next, in the mount unit 14, the chips 21R, 21G, and 21B formed at positions corresponding to the wafer position information included in the extracted data 12D are extracted from the wafers 20R, 20G, and 20B corresponding to the wafer ID (10D), and wiring is performed. Mounting directly on the substrate 100A (step S6).

  Subsequently, the mount unit 14 includes the substrate ID (13D) of the wiring substrate 100A on which the chips 21R, 21G, and 21B are mounted, and the wafers 20R, 20G, and 20B on which the mounted chips 21R, 21G, and 21B are formed. The wafer ID (10D), the wafer position information of each mounted chip 21R, 21G, 21B, and the substrate position information (x, y coordinates) of the mounted chips 21R, 21G, 21B on the wiring board 100A are associated with each other. Then, mount data 14D is generated (step S7). Thereafter, the mount data 14D is sent to the traceability unit 16.

  Next, the optical inspection unit 15 measures individual optical characteristics of the plurality of chips 21R, 21G, and 21B mounted on the wiring board 100A and reads the board ID (13D) of the wiring board 100A to be measured ( Step S8). Subsequently, inspection data 15D is generated by associating the measured optical characteristic data with the measured substrate position information of the chips 21R, 21G, and 21B (step S9). Thereafter, the inspection data 15D and the substrate ID (13D) are sent to the traceability unit 16.

  Next, the traceability unit 16 generates the traceability data 16D by associating the inspection data 15D associated with the substrate ID (13D), the mount data 14D, and the optical characteristic data 11D associated with the wafer ID (10D) with each other. (Step S10).

  Conventionally, as a method of selecting light emitting diodes, appearance inspection and measurement of optical characteristics have been performed on all of the chips 21R, 21G, and 21B formed on the wafers 20R, 20G, and 20B. The determined chips 21R, 21G, and 21B are ranked from the viewpoint of optical characteristics, are temporarily placed on a tray (or sheet) for each rank, and, for example, each chip 21R, 21G, and 21B is wired from the tray (or sheet). Mounted on a substrate smaller than the substrate 100A, an optical lens is mounted on the mounted chips 21R, 21G, and 21B to form subunits (not shown), and the chips 21R, 21G, and 21B in the subunits are formed. Measure the optical characteristics, and as a result, the subunits that are determined to be non-defective are ranked in terms of optical characteristics, How to classify the sub-unit is generally used for each link.

  In this method, since it is possible to easily grasp how many chips 21R, 21G, and 21B and subunits are present for each rank, inventory management is easy. Further, if the chips 21R, 21G, and 21B are in the subunit stage before being mounted on the wiring board 100A, it is easy to rework defective chips 21R, 21G, and 21B. Therefore, when a light-emitting diode is used as a light source, it is a general practice to form the light source substrate 100 by mounting the subunit obtained by this method on the wiring substrate 100A.

  However, in this method, if the range of each rank is too narrow, the number of ranks becomes enormous and waste increases, so the range of each rank is set to be somewhat wide. For this reason, once it is attempted to form a high-performance light source substrate 100 with strict specifications, it is necessary to further select the ranked subunits, which increases the number of processes. Further, in this method, since the subunits that are parts of the light source substrate 100 must be produced for each rank and stocked, the number of stocks increases.

  On the other hand, in the method of manufacturing the light source substrate 100 using the light source substrate manufacturing apparatus 1 of the present embodiment, individual optical characteristics of the plurality of chips 21R, 21G, and 21B formed on the wafers 20R, 20G, and 20B are measured. Based on the optical characteristic data 11D obtained in this way and the wafer IDs (10D) of the wafers 20R, 20G, and 20B from which the optical characteristic data 11D was obtained, the chips 21R corresponding to the data meeting the extraction condition 12A, 21G and 21B are directly mounted on the wiring board 100A. That is, chips 21R, 21G, and 21B that meet the extraction condition 12A are directly mounted on the wiring board 100A without producing a subunit that is an intermediate part of the light source board 100.

  Thereby, it is only necessary to stock the individual wafers 20R, 20G, and 20B, and it is not necessary to stock the subunits that can be enormous in number compared to the wafers 20R, 20G, and 20B, so that the number of stocks can be reduced. Further, since the high-performance light source substrate 100 with strict specifications can be formed by setting the extraction condition 12A, there is no need to rank. Thereby, the number of processes can be reduced by the amount necessary for ranking.

  If the correspondence between the chips 21R, 21G, and 21B and the optical characteristic data 11D can be stored, the chips 21R, 21G, and 21B are stocked while being arranged on the wafers 20R, 20G, and 20B. Instead, they may be collected in units of lots or in a state of being collected for each tray (or sheet). In this case, these operations are separately required, but conventionally, since the chips 21R, 21G, and 21B and the subunits are ranked, the number of steps can be reduced as compared with the conventional case. Therefore, in the present embodiment, it is possible to manufacture the high-performance light source substrate 100 while minimizing the number of processes and the number of inventory.

  Conventionally, when a defect is found in one light emitting diode in a certain backlight device, depending on the content of the defect, the same applies to other light emitting diodes manufactured on the wafer on which the light emitting diode is manufactured. There are times when there is a high possibility that a malfunction will occur. However, when a backlight device is manufactured by forming subunits as described above and arranging a plurality of light source substrates formed using subunits classified by rank in a housing, chips or Due to the fact that the subunits are ranked, it is not easy to track the wafer on which the defective light emitting diode is manufactured. Therefore, conventionally, it has been difficult to accurately grasp which liquid crystal display device can cause the same problem.

  On the other hand, in the method of manufacturing the light source substrate 100 using the light source substrate manufacturing apparatus 1 of the present embodiment, each wafer 20R, 20G, 20B is given a unique wafer ID (10D) for each wafer. Each wiring board 100A is given a unique board ID (13D), and further, inspection data 15D associated with the board ID (13D), mount data 14D, and wafer ID (10D). ) And the traceability data 16D associated with the optical characteristic data 11D associated therewith. Thereby, for example, the chip 21R, 21G or 21B mounted at the position (x, y) on the wiring board 100A of a certain substrate ID (13D) is formed at which position on which wafer 20R, 20G, 20B. Or the optical measured by the optical inspection unit 11 and the optical inspection unit 15 of the chip 21R, 21G or 21B mounted at the position (x, y) on the wiring substrate 100A of a certain substrate ID (13D). It is possible to track what the result of the characteristic was. Therefore, in this embodiment, when a defect is found in one light emitting diode in a certain backlight device, it is possible to accurately grasp which liquid crystal display device can cause the same defect.

[Application example]
Next, a liquid crystal display device 600 to which the light source substrate 100 manufactured using the light source substrate manufacturing apparatus 1 of the above embodiment is applied will be described.

  FIG. 10 is an exploded perspective view of the liquid crystal display device 600 according to this application example. The liquid crystal display device 600 includes a liquid crystal display panel 500, a backlight device 400 disposed behind the liquid crystal display panel 500, and a drive circuit (not shown) for driving the liquid crystal display panel 500 to display an image. ), And the surface of the liquid crystal display panel 500 is directed toward the observer (not shown).

  The liquid crystal display panel 500 is, for example, a transmissive display panel in which each pixel is driven in accordance with a video signal, and has a structure in which a liquid crystal layer is sandwiched between a pair of transparent substrates. Specifically, in order from the observer side, a polarizing plate, a transparent substrate, a color filter, a transparent electrode, an alignment film, a liquid crystal layer, an alignment film, a transparent pixel electrode, a transparent substrate, and a polarizing plate And have.

  Here, the transparent substrate is generally a substrate transparent to visible light. Note that an active driving circuit including a TFT (Thin Film Transistor) as a driving element electrically connected to the transparent pixel electrode and wiring is formed on the transparent substrate on the backlight device 400 side. . The color filter is formed by arranging color filters for separating light emitted from the backlight device 400 into, for example, three primary colors of red (R), green (G), and blue (B). The transparent electrode is made of, for example, ITO (Indium Tin Oxide) and functions as a common counter electrode. The alignment film is made of, for example, a polymer material such as polyimide, and performs an alignment process on the liquid crystal. The liquid crystal layer is made of, for example, a liquid crystal in a VA (Virtical Alignment) mode, a TN (Twisted Nematic) mode, or an STN (Super Twisted Nematic) mode. Each pixel has a function of transmitting or blocking. The transparent pixel electrode is made of, for example, ITO and functions as an electrode for each pixel. The pair of polarizing plates is a kind of optical shutter, and allows only light in a certain vibration direction (polarized light) to pass therethrough. Each of the pair of polarizing plates is disposed so that the polarization axes thereof are different from each other by 90 degrees, whereby the light emitted from the backlight device 400 is transmitted or blocked through the liquid crystal layer. Yes.

  The backlight device 400 is a surface light source in which the optical sheet 300 is arranged on a plurality of light source substrates 100 two-dimensionally arranged in the housing 200 and illuminates the liquid crystal display panel 500 from behind.

  Here, the optical sheet 300 includes, for example, a diffusion plate, a diffusion sheet, a prism sheet, a reflective polarizing sheet, and the like arranged in order from the light source substrate 100 side. The diffusion plate and the diffusion sheet are for reducing luminance unevenness and color unevenness of the light emitted from the light source substrate 100. The diffusion plate is, for example, a diffusion material (inside a relatively thick plate-like transparent resin). The diffusion sheet is formed, for example, by applying a transparent resin (binder) containing a diffusion material on a relatively thin film-like transparent resin. The prism sheet is for improving the front brightness. For example, a plurality of columnar prisms extend in one direction in the surface on the light emission side, and are continuously parallel in a direction intersecting the extending direction. Has been placed. The reflective polarizing sheet is for increasing the light utilization efficiency. For example, a plurality of columnar prisms having refractive index anisotropy extend in one direction in the plane on the light exit side, and the extending direction. Are arranged in parallel continuously in the direction intersecting with.

  The housing 200 is for maintaining a constant gap between the light source substrate 100 and the optical sheet 300 and dissipating heat generated from the light source substrate 100. The light source substrate 100 is manufactured using the light source substrate manufacturing apparatus 1 of the above embodiment.

  By the way, in the liquid crystal display device 600 according to this application example, a unique ID for identifying each backlight device 400 or the liquid crystal display device 600 is given to at least one of the backlight device 400 and the liquid crystal display device 600. Production data in which the ID and the board ID (10D) given to the wiring board 100A in each light source board 100 mounted on the liquid crystal display device 600 are associated with each other is generated, for example, in an assembly process. When a unique ID for identifying each light source substrate 100 is given to each light source substrate 100 mounted on the liquid crystal display device 600 in association with the wiring substrate 100A, each backlight device 400 or Production data in which a unique ID for identifying the liquid crystal display device 600 and a unique ID for identifying each light source substrate 100 are associated with each other may be generated.

  In the liquid crystal display device 600 having such a configuration, in the backlight device 400, the optical paths of the respective color lights emitted from the light source substrate 100 are mixed by the optical sheet 300, and the luminance unevenness and the color unevenness are reduced. White light whose viewing angle is adjusted illuminates the liquid crystal display panel 500 from behind.

  In the liquid crystal panel 20, the illumination light from the backlight device 400 is transmitted according to the magnitude of the voltage applied to each pixel between the transparent pixel electrode and the counter electrode, and is color-separated and observed by the color filter. Inject to the side. Thereby, a color image display is performed.

  By the way, in the liquid crystal display device 600 according to this application example, the light source substrate 100 manufactured by the light source substrate manufacturing apparatus 1 of the above embodiment is used, and therefore, no subunit is used for the light source substrate 100. As a result, when manufacturing the light source substrate 100 to be mounted on the high-performance liquid crystal display device 600 having strict specifications such as luminance uniformity and monochromaticity of illumination light, it is not necessary to select a subunit, and the extraction condition 12A Just tighten the settings. Therefore, a high-performance liquid crystal display device 600 with strict specifications can be easily manufactured.

  In this application example, the traceability data 16D is generated when the light source substrate 100 is manufactured, and is further mounted on the liquid crystal display device 600 and at least one ID of the backlight device 400 and the liquid crystal display device 600. Production data in which the ID of each light source substrate 100 or the substrate ID (13D) of the wiring substrate 100A in each light source substrate 100 is associated with each other is generated. Thereby, after manufacturing the backlight device 400 and the liquid crystal display device 600, when a defect is found in one light emitting diode in a certain backlight device in a production factory or market, the traceability data 16D and the production data are stored. By referring to, for example, the backlight device 400 or the liquid crystal display device 600 on which the light source substrate 100 mounted with the light emitting diode formed on the same wafer as the wafer on which the detected defective light emitting diode is formed is specified. It becomes possible to do. Therefore, when a failure is found in one light emitting diode in a certain backlight device, it is possible to accurately grasp which backlight device 400 or liquid crystal display device may have the same failure.

  While the present invention has been described with the embodiments and application examples, the present invention is not limited to these embodiments and the like, and various modifications are possible.

  For example, in the above-described embodiment and the like, the light emitting diodes of the three primary colors (red, green, and blue) are used as the light source. However, for example, a white light emitting diode may be used.

It is a functional block diagram of the light source board | substrate manufacturing apparatus which concerns on one embodiment of this invention. It is the flowchart explaining the manufacturing method of the light source substrate. It is a perspective view of the wafer for each color. It is a conceptual diagram for demonstrating optical characteristic data. It is a schematic diagram for demonstrating the method of extracting extraction data from optical characteristic data. It is the schematic diagram showing a mode that a chip | tip is directly mounted on a wiring board from a wafer. It is a plane block diagram of a light source substrate. It is a conceptual diagram for demonstrating mount data. It is a conceptual diagram for demonstrating inspection data. It is a schematic block diagram of the liquid crystal display device provided with the light source substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Light source substrate manufacturing apparatus, 10, 13 ... ID printing part, 10D ... Wafer ID, 11, 15 ... Optical inspection part, 11D ... Optical characteristic data, 12 ... Extraction data generation part, 12A ... Extraction condition, 12D ... Extraction data , 13D ... substrate ID, 14 ... mount part, 14D ... mount data, 15 ... optical inspection part, 15D ... inspection data, 16 ... traceability part, 20R, 20G, 20B ... wafer, 21R, 21G, 21B ... chip, 100 ... Light source substrate, 100A ... wiring substrate, 200 ... casing, 300 ... optical sheet, 400 ... backlight, 500 ... liquid crystal display panel, 600 ... liquid crystal display device.

Claims (5)

A method of manufacturing a light source substrate used in a backlight of a display device ,
Based on the optical characteristics data obtained by measuring the individual optical properties of the formed chip-shaped plurality of light emitting diodes on the web wafer, a light emitting diode corresponding to the data that matches the extraction condition wiring substrate look including the mounting step of producing a light source substrate by mounting directly to,
The optical property data includes position information of the individual light emitting diodes on the wafer and at least one of light output, wavelength, forward voltage, and reverse bias current,
The wafer is given unique wafer identification information for each wafer,
A method of manufacturing a light source substrate, wherein in the mounting step, the light emitting diode is directly mounted on the wiring substrate based on the optical characteristic data and wafer identification information of the wafer from which the optical characteristic data is obtained . The wiring board is given unique board identification information for each wiring board,
After mounting the light emitting diode directly on the wiring substrate in the mounting step, substrate identification information of the wiring substrate on which the light emitting diode is mounted, wafer identification information on the wafer on which the mounted light emitting diode is formed, and mounting light source according the position information of the wafer in which the light emitting diode has been formed that, the mounting data generating step of generating mounting data in association with each other and the position information of the wiring board of the mounted light emitting diode including claim 1 A method for manufacturing a substrate. Inspection data obtained by measuring optical characteristics of each light emitting diode on the wiring board after the light emitting diode is directly mounted on the wiring board in the mounting step, the mount data, and the optical characteristic data. manufacturing method of the light source substrate according traceability data generation step of generating the traceability data to including claim 2 in association with each other. The inspection data includes position information in the wiring substrate of the individual light emitting diodes, luminance, wavelength, chromaticity, the manufacture of the light source substrate according to at least one of the forward voltage and the reverse bias current to including claim 3 Method. A light source substrate manufacturing apparatus for manufacturing a light source substrate used for a backlight of a display device ,
Based on the optical characteristics data obtained by measuring the individual optical properties of a plurality of light emitting diodes formed on a wafer chip-like, the light emitting diode corresponding to the data that matches the extraction condition on the wiring substrate Provided with a mounting part for manufacturing the light source substrate by direct mounting,
The optical property data includes position information of the individual light emitting diodes on the wafer and at least one of light output, wavelength, forward voltage, and reverse bias current,
The wafer is given unique wafer identification information for each wafer,
The mount unit is a light source board manufacturing apparatus for directly mounting the light emitting diode on the wiring board based on the optical characteristic data and wafer identification information of the wafer from which the optical characteristic data is obtained .

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