JP2006253421A - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
JP2006253421A
JP2006253421A JP2005068185A JP2005068185A JP2006253421A JP 2006253421 A JP2006253421 A JP 2006253421A JP 2005068185 A JP2005068185 A JP 2005068185A JP 2005068185 A JP2005068185 A JP 2005068185A JP 2006253421 A JP2006253421 A JP 2006253421A
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Japan
Prior art keywords
indicate
package substrate
emitting diode
marking
light emitting
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JP2005068185A
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Japanese (ja)
Inventor
Sadato Imai
貞人 今井
Atsushi Nishida
敦 西田
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Priority to JP2005068185A priority Critical patent/JP2006253421A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode capable of pursuing a manufacturing history in the combination of the various colors classified by marking colored dots which indicate lot data in the narrow space of the surface of the package substrate. <P>SOLUTION: The light emitting diode is constituted so that an electrode 2 may be formed in a package substrate 1, and a mounted LED chip 3 may be covered and sealed with translucent sealing resin 4. Two or more marking dots 5 classified by colors on the surface of the package substrate 1 are provided so as to indicate the lot data of a product expressed in combination of colors of the marking dots 5. The colors of the marking dots 5 are set up corresponding to a number of 0-9. The number of marking dots 5 is composed of seven pieces in such a way that two pieces of them may indicate a manufacture year, two pieces may indicate a manufacture month, and three pieces may indicate a process management number. By indicating the lot data 5 on the package substrate 1, the manufacturing history of a product can be pursued so that it may be enabled to attain an immediate investigation, an exact discovery, and a countermeasure for a cause of defect, resulting in contribution to the improvement in subsequent quality. Accordingly, it becomes less necessary to restrain a design of a package for securing the indication space of lot data. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、一般照明用LED、携帯電話用フラッシュLED、KEY照明用LEDなどに係わり、詳しくは、製品の製造工程の履歴をパッケージの表面に表示した発光ダイオードに関する。   The present invention relates to a general lighting LED, a mobile phone flash LED, a KEY lighting LED, and the like, and more particularly, to a light emitting diode in which a history of a manufacturing process of a product is displayed on a surface of a package.

従来、軽薄短小を追求する電子機器向けに提供された表面実装型の発光ダイオードにおいて、一般的に、ガラエポ基板の表面に形成された電極パターン上にLEDチップを実装すると共に、前記LEDチップを覆うように透光性樹脂で封止した構造をしている。チップ型LEDの小型薄型化への移行やハイパワーLEDのヒートシンクの取り付けにより、パッケージ表面にロット番号を表示するスペースがなく、ロット番号を記載しない製品例がある。(例えば、非特許文献1参照)
LED標準仕様書「白色チップタイプLED」日亜化学工業株式会社カタログ、Cat.No.040618、2000年発行(第2頁)
2. Description of the Related Art Conventionally, in a surface mount type light emitting diode provided for an electronic device pursuing lightness and smallness, generally, an LED chip is mounted on an electrode pattern formed on the surface of a glass epoxy substrate and the LED chip is covered. Thus, it has a structure sealed with a translucent resin. Due to the shift to smaller and thinner chip-type LEDs and the mounting of heat sinks for high-power LEDs, there is a product example in which there is no space for displaying lot numbers on the package surface and lot numbers are not described. (For example, see Non-Patent Document 1)
LED standard specification "white chip type LED" Nichia Corporation catalog, Cat. No. 040618, 2000 (2nd page)

上記した非特許文献1に開示されている白色チップタイプLEDは、材質が耐熱ポリマー材よりなるパッケージ基板に、銅合金+銀メッキよりなる電極が形成され、LEDチップが実装されている。封止樹脂としてシリコン樹脂(拡散剤+YAG蛍光体入り)を使用している。梱包/表示の仕様として、テーピングリール及びアルミ防湿袋に、型名、ロット番号、ランク分類、数量を表示している。上記ロット番号は、6文字の英数字で表記する。その事例として、○□××××△■で、
○−製造年(例、3→2003、4→2004、・・・・等)
□−製造月(例、1→1月、9→9月、A→10月、B→11月、C→12月)
××××−製造管理番号
△−色調ランク
■−光度ランク
をそれぞれ表示する。
In the white chip type LED disclosed in Non-Patent Document 1 described above, an electrode made of copper alloy + silver plating is formed on a package substrate made of a heat-resistant polymer material, and the LED chip is mounted. Silicon resin (with diffusing agent + YAG phosphor) is used as the sealing resin. As packaging / display specifications, the model name, lot number, rank classification, and quantity are displayed on the taping reel and aluminum moisture-proof bag. The lot number is described with 6 alphanumeric characters. As an example, ○ □ ×××× △ ■
○-Year of manufacture (eg 3 → 2003, 4 → 2004, etc.)
□-Production month (eg, 1 → January, 9 → September, A → October, B → November, C → December)
XXX-Manufacturing control number △ -Color tone rank ■ -Luminance rank is displayed.

解決しようとする問題点は、上記した非特許文献1に開示されている白色チップタイプLEDは、パッケージ基板にスペースがないためロット番号をパッケージ基板の表面に表示できない。従って、市場に出た製品の製造履歴を追うためには、LEDを搭載するメーカが、テーピングリール及びアルミ防湿袋に記載されているロット番号とLEDを搭載しているパッケージ基板などのロット番号を対応させなくてはならない。上記したように、パッケージ基板のスペースの不足のため、LEDパッケージ表面にロット番号を表示していないことから、製品を市場に出た後に、その製品の製造履歴を追うことが困難になる。などの問題があった。   The problem to be solved is that the white chip type LED disclosed in Non-Patent Document 1 cannot display the lot number on the surface of the package substrate because there is no space in the package substrate. Therefore, in order to keep track of the manufacturing history of products on the market, the manufacturer that installs the LED must specify the lot number written on the taping reel and aluminum moisture-proof bag and the lot number of the package substrate that carries the LED. It must be supported. As described above, since the lot number is not displayed on the surface of the LED package due to the lack of space on the package substrate, it is difficult to follow the manufacturing history of the product after it is put on the market. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、製品のパッケージ基板の表面の狭いスペースに、ロットデータを表示する色分けしたマーキングドットを施し、そのさまざまな色のマーキングドットの組合わせで、製品の製造履歴を追うことが可能な発光ダイオードを提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its purpose is to provide color-coded marking dots for displaying lot data in a narrow space on the surface of a product package substrate, and to combine the marking dots of various colors. Thus, the present invention provides a light emitting diode capable of tracking the manufacturing history of a product.

上記目的を達成するために、本発明における発光ダイオードは、パッケージ基板にLEDチップを実装し、該LEDチップを透光性樹脂で封止した発光ダイオードにおいて、前記パッケージ基板の表面に色分けした複数個のマーキングドットを施し、該マーキングドットの色の組合せにより製品のロットデータを表示することを特徴とするものである。   In order to achieve the above object, a light-emitting diode according to the present invention is a light-emitting diode in which an LED chip is mounted on a package substrate and the LED chip is sealed with a light-transmitting resin. The product lot data is displayed by the combination of the marking dot colors.

また、前記マーキングドットの色は、0〜9の数字に対応するように設定されていることを特徴とするものである。   Further, the color of the marking dot is set so as to correspond to numbers of 0 to 9.

また、前記パッケージ基板の表面に色分けした複数のマーキングドットの数は7個であり、その内訳は、2個が製造年、2個が製造月、3個が工程管理番号を表示することを特徴とするものである。   In addition, the number of marking dots color-coded on the surface of the package substrate is seven, and the breakdown is that two display the manufacturing year, two display the manufacturing month, and three display the process control number. It is what.

本発明の発光ダイオードは、製品のロットデータをパッケージ基板に表示することにより、製品の製造履歴を追うことが容易で、市場や他社工程にて発生した自社製造工程起因の不具合について、その製造工程の履歴を知るのに、ロットデータを元に遡ることができる。その結果、不具合原因の迅速な調査、的確な発見及び迅速な対策がとれ、その後の品質の向上に貢献するものである。   The light emitting diode of the present invention is easy to follow the manufacturing history of the product by displaying the product lot data on the package substrate, and the manufacturing process for defects caused by the in-house manufacturing process that occurred in the market and other companies' processes. It is possible to go back to the lot data based on the lot data. As a result, quick investigation of the cause of failure, accurate discovery and quick countermeasures can be taken, which contributes to the subsequent improvement of quality.

本発明の発光ダイオードについて、図面に基づいて説明する。   The light emitting diode of the present invention will be described with reference to the drawings.

図1〜図5は、本発明の実施例に係わり、図1は、発光ダイオードの正面図、図2は、図1に示す発光ダイオードの側面図、図3は、図1に示す発光ダイオードの背面図、図4は、図3のマーキングドットの色とその色に対応する数字を示す図表、図5は、色分けしたマーキングドットの組み合せ表示例を示す図表である。   1 to 5 relate to an embodiment of the present invention, FIG. 1 is a front view of a light emitting diode, FIG. 2 is a side view of the light emitting diode shown in FIG. 1, and FIG. FIG. 4 is a rear view, FIG. 4 is a chart showing the color of the marking dots in FIG. 3 and numbers corresponding to the colors, and FIG. 5 is a chart showing an example of combination display of the color-coded marking dots.

図1〜図3において、1は耐熱性ポリマーなどよりなる絶縁性を有するパッケージ基板で、該パッケージ基板1の上下面及び側面には、銅合金+銀メッキなどよりなり、所定の配線パターンに形成された一対の電極2が形成されている。前記パッケージ基板1上にLEDチップ3を実装し、そのLEDチップ3を覆うように、蛍光体入り樹脂よりなる封止樹脂4で封止されている。図3に示すように、前記パッケージ基板1の背面に複数個の色分けしたマーキングドット5(図3では7個)が施されている。   1 to 3, reference numeral 1 denotes an insulating package substrate made of a heat-resistant polymer. The upper and lower surfaces and side surfaces of the package substrate 1 are made of a copper alloy + silver plating or the like and formed in a predetermined wiring pattern. A pair of the electrodes 2 is formed. An LED chip 3 is mounted on the package substrate 1 and is sealed with a sealing resin 4 made of a phosphor-containing resin so as to cover the LED chip 3. As shown in FIG. 3, a plurality of color-coded marking dots 5 (seven in FIG. 3) are provided on the back surface of the package substrate 1.

前記マーキングドット5の色分けは、図4に示すように、黒色が数字の「0」に対応し、以下、茶色「1」、赤色「2」、橙色「3」、黄色「4」、緑色「5」、青色「6」、紫色「7」、灰色「8」、桃色「9」のように、マーキングドット5の色を、「0〜9」の数字に対応するように設定されている。   As shown in FIG. 4, the marking dots 5 are color-coded, with black corresponding to the numeral “0”, and brown “1”, red “2”, orange “3”, yellow “4”, green “ The color of the marking dot 5 is set to correspond to the numbers “0 to 9”, such as “5”, blue “6”, purple “7”, gray “8”, and pink “9”.

図5は、図3に示す7個のマーキングドットの組み合わせの表示例である。図5において、7個のマーキングドット5の内訳は、その中の2個が製造年、2個が製造月、3個が工程管理番号を表示するものであり、例えば、黒色「0」と黄色「4」で、製造年:2004年、茶色「1」と赤色「2」で、製造月:12月、青色「6」、緑色「5」と紫色「7」で、工程管理番号:657を示し、7個の組み合わせで、該当する製品は、「2004年12月製造、工程管理番号657」を表示している。   FIG. 5 is a display example of a combination of seven marking dots shown in FIG. In FIG. 5, the breakdown of the seven marking dots 5 is one in which two indicate the manufacturing year, two indicate the manufacturing month, and three indicate the process control number. For example, black “0” and yellow “4”, production year: 2004, brown “1” and red “2”, production month: December, blue “6”, green “5” and purple “7”, process control number: 657 Shown in the combination of 7 pieces, the corresponding product displays “December 2004 production, process control number 657”.

以上説明しように、本発明の発光ダイオードは、ロットデータをパッケージ基板に表示することにより、製品の製造履歴を知ることができ、製品が市場に出た後も追跡調査が可能である。ロットデータの表示スペースの確保のために、パッケージのデザインを制約する必要性が少なくなる。不具合発生時にその原因の迅速な調査、的確な発見、迅速な対策がとれ、その後の品質の向上につながる、信頼性に優れた発光ダイオードを提供することが可能である。   As described above, the light emitting diode of the present invention can display the lot data on the package substrate to know the manufacturing history of the product, and can be followed up after the product is put on the market. In order to secure a lot data display space, there is less need to restrict the package design. When a defect occurs, it is possible to provide a light-emitting diode with excellent reliability that can promptly investigate the cause of the failure, find it accurately, and take quick measures to improve the quality thereafter.

本発明の実施例に係る発光ダイオードの正面図である。It is a front view of the light emitting diode which concerns on the Example of this invention. 図1に示す発光ダイオードの側面図である。It is a side view of the light emitting diode shown in FIG. 図1に示す発光ダイオードの背面図である。It is a rear view of the light emitting diode shown in FIG. 図3のマーキングドットの色とその色に対応する数字を示す図表である。FIG. 4 is a chart showing the color of marking dots in FIG. 3 and numbers corresponding to the colors. 色分けしたマーキングドットの組み合せ表示例を示す図表である。It is a table | surface which shows the example of a combination display of the marking dot classified by color.

符号の説明Explanation of symbols

1 パッケージ基板
2 電極
3 LEDチップ
4 封止樹脂
5 マーキングドット

1 Package substrate 2 Electrode 3 LED chip 4 Sealing resin 5 Marking dot

Claims (3)

パッケージ基板にLEDチップを実装し、該LEDチップを透光性樹脂で封止した発光ダイオードにおいて、前記パッケージ基板の表面に色分けした複数個のマーキングドットを施し、該マーキングドットの色の組合せにより製品のロットデータを表示することを特徴とする発光ダイオード。   In a light-emitting diode in which an LED chip is mounted on a package substrate and the LED chip is sealed with a light-transmitting resin, a plurality of color-coded marking dots are applied to the surface of the package substrate, and a product is obtained by combining the color of the marking dots A light emitting diode characterized by displaying lot data. 前記マーキングドットの色は、0〜9の数字に対応するように設定されていることを特徴とする請求項1記載の発光ダイオード。   2. The light emitting diode according to claim 1, wherein a color of the marking dot is set so as to correspond to a number of 0 to 9. 前記パッケージ基板の表面に色分けした複数のマーキングドットの数は7個であり、その内訳は、2個が製造年、2個が製造月、3個が工程管理番号を表示することを特徴とする請求項1または2記載の発光素子。

The number of the plurality of marking dots color-coded on the surface of the package substrate is 7, and the breakdown is characterized in that 2 indicate the manufacturing year, 2 indicate the manufacturing month, and 3 indicate the process control number. The light emitting device according to claim 1.

JP2005068185A 2005-03-10 2005-03-10 Light emitting diode Pending JP2006253421A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270406A (en) * 2007-04-18 2008-11-06 Sony Corp Method and device for manufacturing light source substrate

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167799A (en) * 1997-08-22 1999-03-09 Nippon Retsuku Kk Manufacture of electronic component
WO2002075644A1 (en) * 2001-03-16 2002-09-26 Tani Electronics Corporation Identification label and identified article
JP2003101070A (en) * 2001-09-21 2003-04-04 Rohm Co Ltd Semiconductor light-emitting device and manufacturing method therefor
JP2003264101A (en) * 2002-03-08 2003-09-19 Koa Corp Bifacial mountable resistor
JP2004022981A (en) * 2002-06-19 2004-01-22 Renesas Technology Corp Semiconductor device and its manufacturing method
JP2004172636A (en) * 2004-02-12 2004-06-17 Nichia Chem Ind Ltd Light emitting diode and its manufacturing method
JP2004241704A (en) * 2003-02-07 2004-08-26 Shin Etsu Chem Co Ltd Light emitting device and its manufacturing device
JP2004327492A (en) * 2003-04-21 2004-11-18 Sharp Corp Led device and portable telephone set, digital camera, and lcd display device using the led device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167799A (en) * 1997-08-22 1999-03-09 Nippon Retsuku Kk Manufacture of electronic component
WO2002075644A1 (en) * 2001-03-16 2002-09-26 Tani Electronics Corporation Identification label and identified article
JP2003101070A (en) * 2001-09-21 2003-04-04 Rohm Co Ltd Semiconductor light-emitting device and manufacturing method therefor
JP2003264101A (en) * 2002-03-08 2003-09-19 Koa Corp Bifacial mountable resistor
JP2004022981A (en) * 2002-06-19 2004-01-22 Renesas Technology Corp Semiconductor device and its manufacturing method
JP2004241704A (en) * 2003-02-07 2004-08-26 Shin Etsu Chem Co Ltd Light emitting device and its manufacturing device
JP2004327492A (en) * 2003-04-21 2004-11-18 Sharp Corp Led device and portable telephone set, digital camera, and lcd display device using the led device
JP2004172636A (en) * 2004-02-12 2004-06-17 Nichia Chem Ind Ltd Light emitting diode and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270406A (en) * 2007-04-18 2008-11-06 Sony Corp Method and device for manufacturing light source substrate

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