JP5133970B2 - 冷却装置、及びこのような冷却装置を有する電子装置 - Google Patents
冷却装置、及びこのような冷却装置を有する電子装置 Download PDFInfo
- Publication number
- JP5133970B2 JP5133970B2 JP2009500983A JP2009500983A JP5133970B2 JP 5133970 B2 JP5133970 B2 JP 5133970B2 JP 2009500983 A JP2009500983 A JP 2009500983A JP 2009500983 A JP2009500983 A JP 2009500983A JP 5133970 B2 JP5133970 B2 JP 5133970B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- tube
- transducer
- resonator
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D23/00—Other rotary non-positive-displacement pumps
- F04D23/006—Creating a pulsating flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Description
Claims (16)
- 対象物の冷却のために脈動流体を用いる冷却装置であり、
圧力波を駆動周波数において生成するよう適合されるトランスデューサと、
前記圧力波を前記トランスデューサから受け取るよう適合される第1端部、及び前記対象物の方への脈動正味出力流を生成するよう適合される第2端部を持つ管とを有する冷却装置であって、前記管が、λ/10より長い長さを持つ管共鳴器であり、ここで、λが前記圧力波の波長であることを特徴とする冷却装置。 - 請求項1に記載の装置であって、前記管共鳴器が、λ/8より長い長さを持つ装置。
- 請求項1に記載の装置であって、前記管共鳴器が、(2n+1)λ/4と本質的に等しい長さを持ち、ここで、n=0、1、2、…であり、λが前記圧力波の波長である装置。
- 請求項1に記載の装置であって、前記トランスデューサが、前記駆動周波数において、前記トランスデューサのDCインピーダンスより1.5乃至2.5倍大きいインピーダンスを持つよう設計される装置。
- 請求項4に記載の装置であって、前記トランスデューサが、前記駆動周波数において、前記DCインピーダンスより2倍大きいインピーダンスを持つよう設計される装置。
- 請求項1乃至5のいずれか一項に記載の冷却装置であって、前記管共鳴器の前記第1端部が、前記圧力波を前記トランスデューサから直接受け取るよう配設される冷却装置。
- 請求項1乃至5のいずれか一項に記載の冷却装置であって、前記トランスデューサと前記管共鳴器との間にキャビティボリュームが配設される冷却装置。
- 請求項1乃至7のいずれか一項に記載の冷却装置であって、前記駆動周波数が、前記トランスデューサと、前記管共鳴器と、間にある任意のキャビティとを含むシステムの反共鳴周波数と実質的に一致する冷却装置。
- 請求項1乃至8のいずれか一項に記載の冷却装置であって、前記管共鳴器が、開口部を通る総正味流量を減らすよう適合される冷却装置。
- 請求項1乃至9のいずれか一項に記載の冷却装置であって、前記駆動周波数が、前記正味出力流が本質的に乱流であるように選択される冷却装置。
- 請求項1乃至10のいずれか一項に記載の冷却装置であって、前記第2端部が複数の開口部を持つ冷却装置。
- 請求項1乃至11のいずれか一項に記載の冷却装置であって、前記管が実質的にまっすぐである冷却装置。
- 請求項1乃至11のいずれか一項に記載の冷却装置であって、前記管が実質的にコイル状をしている冷却装置。
- 請求項1乃至13のいずれか一項に記載の冷却装置であって、前記管が、少なくとも部分的に前記管の長手方向に沿って延在する細長い開口部を、前記出力流を少なくとも部分的に前記細長い開口部を通して放出するために、持つ冷却装置。
- 請求項1乃至14のいずれか一項に記載の冷却装置であって、前記共鳴器の前記第2端部から或る距離離れた場所から流体の二次流れを取り入れるための導管を有する冷却装置。
- 電子回路と、前記回路を冷却する請求項1乃至15のいずれか一項に記載の冷却装置とを有する電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06111434.4 | 2006-03-21 | ||
EP06111434 | 2006-03-21 | ||
PCT/IB2007/050859 WO2007107921A2 (en) | 2006-03-21 | 2007-03-14 | Cooling device and electronic device comprising such a cooling device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009530840A JP2009530840A (ja) | 2009-08-27 |
JP5133970B2 true JP5133970B2 (ja) | 2013-01-30 |
Family
ID=38461918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009500983A Expired - Fee Related JP5133970B2 (ja) | 2006-03-21 | 2007-03-14 | 冷却装置、及びこのような冷却装置を有する電子装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090168343A1 (ja) |
EP (1) | EP1999381B1 (ja) |
JP (1) | JP5133970B2 (ja) |
CN (1) | CN101405508B (ja) |
BR (1) | BRPI0709645A2 (ja) |
TW (1) | TW200809152A (ja) |
WO (1) | WO2007107921A2 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007034344A2 (en) * | 2005-09-20 | 2007-03-29 | Koninklijke Philips Electronics N.V. | Band- pass transducer system with long port |
WO2008075245A2 (en) * | 2006-12-15 | 2008-06-26 | Koninklijke Philips Electronics N.V. | Pulsating fluid cooling with frequency control |
KR101555890B1 (ko) * | 2007-06-14 | 2015-09-30 | 코닌클리케 필립스 엔.브이. | 맥동 유체 냉각을 갖는 조명 장치 |
KR101799485B1 (ko) * | 2007-12-07 | 2017-11-20 | 필립스 라이팅 홀딩 비.브이. | 내부 합성 제트를 이용한 냉각 장치 |
JP5643651B2 (ja) * | 2007-12-07 | 2014-12-17 | コーニンクレッカ フィリップス エヌ ヴェ | 低ノイズ冷却装置 |
JP5498490B2 (ja) * | 2008-07-10 | 2014-05-21 | コーニンクレッカ フィリップス エヌ ヴェ | 合成ジェット冷却のための熱パイプ及び共振器の組み合わせによる遠隔冷却 |
JP2011529620A (ja) | 2008-07-31 | 2011-12-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 空冷を伴う照明アセンブリ |
RU2011114129A (ru) * | 2008-09-12 | 2012-10-20 | Конинклейке Филипс Электроникс Н.В. (Nl) | Устройство, снабженное промежуточным пространством |
US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
CN102364712B (zh) * | 2011-10-22 | 2013-03-20 | 中山伟强科技有限公司 | 一种合成射流散热装置 |
KR20150002749A (ko) * | 2012-04-03 | 2015-01-07 | 지멘스 악티엔게젤샤프트 | 냉각 디바이스 |
GB201220471D0 (en) * | 2012-11-14 | 2012-12-26 | Technology Partnership The | Pump |
EP2819159A1 (en) * | 2013-06-27 | 2014-12-31 | Alcatel Lucent | Cooling technique |
WO2015113938A1 (en) | 2014-02-03 | 2015-08-06 | Koninklijke Philips N.V. | Cooled component enclosure |
DE102014213851A1 (de) * | 2014-07-16 | 2016-01-21 | Siemens Aktiengesellschaft | Kühlmodul und Elektronikgerät |
DE102018100279B3 (de) | 2018-01-08 | 2019-04-18 | Beuth Hochschule Für Technik Berlin | Lüftervorrichtung zum Wärmeabtransport von einem Gegenstand und Gegenstand |
Family Cites Families (21)
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US4942939A (en) * | 1989-05-18 | 1990-07-24 | Harrison Stanley N | Speaker system with folded audio transmission passage |
JPH03211796A (ja) * | 1990-01-17 | 1991-09-17 | Hitachi Ltd | 放熱構造 |
US5758823A (en) * | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
DE19539020C2 (de) * | 1995-10-19 | 1999-04-22 | Siemens Ag | Pumpe zur Förderung gasförmiger oder flüssiger Medien |
GB2322500A (en) * | 1997-02-19 | 1998-08-26 | Motorola Gmbh | Heat dissipator using acoustically generated airflow |
US5914856A (en) * | 1997-07-23 | 1999-06-22 | Litton Systems, Inc. | Diaphragm pumped air cooled planar heat exchanger |
US6418016B1 (en) * | 2001-01-18 | 2002-07-09 | Motorola, Inc. | System and method for cooling using an oscillatory impinging jet |
US6603658B2 (en) * | 2001-03-19 | 2003-08-05 | Tufts University | Laminar air jet cooling of heat producing components |
US6722581B2 (en) * | 2001-10-24 | 2004-04-20 | General Electric Company | Synthetic jet actuators |
US6588497B1 (en) * | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
CN100399556C (zh) * | 2003-02-20 | 2008-07-02 | 皇家飞利浦电子股份有限公司 | 包括微喷射器的冷却组件 |
JP2004274383A (ja) * | 2003-03-07 | 2004-09-30 | Matsushita Electric Ind Co Ltd | スピーカーボックスを有する装置の放熱機構 |
US7263837B2 (en) * | 2003-03-25 | 2007-09-04 | Utah State University | Thermoacoustic cooling device |
US6937472B2 (en) * | 2003-05-09 | 2005-08-30 | Intel Corporation | Apparatus for cooling heat generating components within a computer system enclosure |
JP2007527618A (ja) * | 2003-07-07 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法 |
JP4677744B2 (ja) * | 2003-11-04 | 2011-04-27 | ソニー株式会社 | 噴流発生装置、電子機器及び噴流発生方法 |
JP4572548B2 (ja) * | 2004-03-18 | 2010-11-04 | ソニー株式会社 | 気体噴出装置 |
US7283365B2 (en) * | 2005-01-18 | 2007-10-16 | Lucent Technologies Inc. | Jet impingement cooling apparatus and method |
US8069910B2 (en) * | 2005-10-12 | 2011-12-06 | Nuventix, Inc. | Acoustic resonator for synthetic jet generation for thermal management |
US7684585B2 (en) * | 2006-01-31 | 2010-03-23 | Alpine Electronics, Inc. | Thermal management system for speaker system having vented frame for establishing air passages |
JP2010511142A (ja) * | 2006-11-30 | 2010-04-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 脈動冷却システム |
-
2007
- 2007-03-14 CN CN2007800099814A patent/CN101405508B/zh not_active Expired - Fee Related
- 2007-03-14 EP EP07713245.4A patent/EP1999381B1/en not_active Not-in-force
- 2007-03-14 US US12/293,546 patent/US20090168343A1/en not_active Abandoned
- 2007-03-14 WO PCT/IB2007/050859 patent/WO2007107921A2/en active Application Filing
- 2007-03-14 JP JP2009500983A patent/JP5133970B2/ja not_active Expired - Fee Related
- 2007-03-14 BR BRPI0709645-3A patent/BRPI0709645A2/pt not_active IP Right Cessation
- 2007-03-16 TW TW096109135A patent/TW200809152A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2009530840A (ja) | 2009-08-27 |
TW200809152A (en) | 2008-02-16 |
EP1999381A2 (en) | 2008-12-10 |
CN101405508B (zh) | 2013-03-27 |
EP1999381B1 (en) | 2017-11-22 |
CN101405508A (zh) | 2009-04-08 |
BRPI0709645A2 (pt) | 2011-07-19 |
WO2007107921A2 (en) | 2007-09-27 |
WO2007107921A3 (en) | 2007-12-13 |
US20090168343A1 (en) | 2009-07-02 |
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