JP5108740B2 - Electrochemical devices - Google Patents

Description

  The present invention relates to an electrochemical device such as an electric double layer capacitor that enables surface mounting on a mounting partner such as a circuit board.

  Patent Documents 1 and 2 disclose an electric double layer capacitor that can be surface-mounted on a mounting partner such as a circuit board by reflow soldering. The electric double layer capacitors disclosed in both Documents 1 and 2 are basically a power storage element impregnated with an electrolyte, a sealed container containing the power storage element, and a first container provided on the lower surface of the sealed container. A terminal and a second terminal; a first lead conductor that electrically connects the power storage element and the first terminal; and a second lead conductor that electrically connects the power storage element and the second terminal.

  In these electric double layer capacitors, in order to facilitate the formation of the first terminal, the second terminal, the first lead conductor and the second lead conductor, the lower wall of the sealed container is made of a non-metallic material such as ceramic. A method is adopted in which a part is formed, and a conductor paste is printed and fired on the other part to form them.

  To avoid damage that the first lead conductor and the second lead conductor may suffer during reflow soldering or after mounting, such as cracks or corrosion, the exposed areas of the first lead conductor and the second lead conductor should be made as small as possible. Is desirable. In order to realize this, in the electric double layer capacitor disclosed in Patent Document 2, a via conductor portion (a hole filled with a conductor) is used for one of the first lead conductor and the second lead conductor, and the exposed area of We are trying to reduce it.

However, when a via conductor portion is used for at least one of the first lead conductor and the second lead conductor, the strength of the portion where the via conductor portion is provided is lower than that of the other portion. There is a risk of breakage due to stress generated based on thermal expansion / contraction caused by temperature change during soldering or temperature change after mounting.
JP 2001-216852 A JP2007-20382A

  The object of the present invention is based on thermal expansion / contraction caused by temperature change during reflow soldering or temperature change after mounting even when a via conductor part is used as a lead conductor. An object of the present invention is to provide an electrochemical device that can be prevented from being damaged by the stress generated.

  In order to achieve the above object, the present invention has at least one pair of terminals on the lower surface of a sealed container containing an electrochemical element capable of storing or generating electricity, and electrically connects the electrochemical element and each terminal. An electrochemical device having at least one pair of lead conductors to be connected, wherein the sealed container is made of a non-metallic member that closes a lower end opening of the cylindrical portion through a metallic cylindrical portion and a metallic seal ring. And at least one of the lead conductors has a via conductor portion along the thickness direction of the plate portion, and the via conductor portion is displaced from the center of the plate portion. Is provided.

  According to this electrochemical device, the via conductor portion is provided avoiding the center of the plate-like portion where stress caused by thermal expansion and contraction due to temperature change during reflow soldering and temperature change after mounting is likely to concentrate. Therefore, even if stress generated based on the thermal expansion and contraction is applied to the plate-like portion, it is possible to reliably avoid the possibility that the portion of the plate-like portion provided with the via conductor is damaged by the stress. it can.

  According to the present invention, even when the via conductor portion is used as the lead conductor, the portion where the via conductor portion is provided is based on the thermal expansion / contraction caused by the temperature change during reflow soldering or the temperature change after mounting. An electrochemical device that can be prevented from being damaged by the generated stress can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

  1 to 7 show an electrochemical device according to the present invention. FIG. 1 is a top view of the electrochemical device, FIG. 2 is a sectional view taken along line x1-x1 in FIG. 1, and FIG. 3 is shown in FIG. 4 is a bottom view of the electrochemical device, FIG. 4 is a diagram excluding the storage element, the cylindrical portion and the seal ring from FIG. 1, FIG. 5 is a diagram excluding the upper layer of the plate-like portion from FIG. 4 is a view for explaining the position of the via conductor portion shown in FIG. 4, and FIG. 7 is a view showing a modification of the position of the via conductor portion shown in FIGS. In the following description, the horizontal direction in FIG. 1 is referred to as a length direction, and the vertical direction is referred to as a width direction.

  First, the case where the electrochemical device having the structure shown in the drawings is used as a square PAS (polyacene organic semiconductor) capacitor will be described.

As shown in FIGS. 1 to 5, the PAS capacitor includes a power storage element 10 impregnated with an electrolyte, a sealed container 20 containing the power storage element 10, and a first terminal provided on the lower surface of the sealed container 20. 30 and the 2nd terminal 40, the 1st extraction conductor 50 which electrically connects the electrical storage element 10 and the 1st terminal 30, and the 2nd extraction conductor 60 which electrically connects the electrical storage element 10 and the 2nd terminal 40 It is equipped with.

  The electrical storage element 10 includes a first polar part 11 and a second polar part 12 having a rectangular top view shape, and a separator having a rectangular top view interposed between the first polar part 11 and the second polar part 12. 13. The first polar part 11 and the second polar part 12 are made of a material mainly composed of PAS, and the separator 13 is a material having high ion permeability, for example, a fiber material such as glass fiber, cellulose, rayon, polypropylene, polyethylene, etc. , Synthetic resin materials such as polyamide and polyimide, and other materials.

  The lower surface of the first polar part 11 is electrically joined to the upper surface of the first conductor part 51 of the first lead conductor 50 described later via a conductive material. Moreover, the upper surface of the 2nd polar part 12 is electrically joined to the lower surface of the upper wall 21a of the cylindrical part 21 of the sealed container 20 mentioned later via a electrically conductive material. Further, the first polar part 11, the second polar part 12 and the separator 13 are impregnated with an electrolytic solution obtained by dissolving an electrolyte such as triethylmethylammonium borofluoride in a predetermined concentration in a solvent such as propylene carbonate.

  The sealed container 20 includes a cylindrical portion 21 having a substantially rectangular shape in top view, a plate-like portion 22 having a substantially rectangular shape in top view, and a top view interposed between the cylindrical portion 21 and the plate-like portion 22. The seal ring 23 has a rectangular frame shape. The cylindrical portion 21 is made of a metal such as Kovar (KOVAR: US registered trademark), which is an alloy of nickel, cobalt, and iron, or an alloy of nickel, iron, copper, aluminum, stainless steel, nickel, gold, and the like. The part 22 is made of a non-metallic material such as alumina ceramics, and the seal ring 23 is made of the same metal as the cylindrical part 21.

  The cylindrical portion 21 includes a rectangular upper wall 21a in a top view, a rectangular cylindrical side wall 21b extending downward from the outer peripheral edge of the upper wall 21a, and a flange 21c extending laterally outward from the lower edge of the side wall 21b. And have. Further, the bottom view width of the flange 21c is substantially the same as the top view width of the seal ring 23. Furthermore, the lower surface of the flange 21c is electrically joined to the upper surface of the seal ring 23 via a conductive material. Furthermore, the lower surface of the seal ring 23 is electrically joined to the upper surface of the first conductor portion 61 of the second lead conductor 60 described later via a conductive material.

  The plate-like portion 22 has a two-layer structure having an upper layer 22a and a lower layer 22b, and closes the lower surface opening of the tubular portion 21 via a seal ring 23. In addition, cutouts 22a1 and 22b1 whose top view shape is a quarter circle are formed at four corners of the upper layer 22a and the lower layer 22b, respectively. Furthermore, a recess 22b2 that is recessed inward from each side is formed at the center of the two sides facing each other in the length direction of the lower layer 22b.

  As shown in FIG. 5, each recess 22b2 includes a portion having a small recess depth Da (hereinafter referred to as a first recess portion Da) and a portion having a large recess depth Db on both sides of the first recess portion Da ( Hereinafter referred to as a second indented portion Db). Moreover, the width Wa of each 1st hollow part Da is smaller than the width Wb of each recessed part 22b2.

  The first terminal 30 has a rectangular shape when viewed from the bottom, and is provided at one end in the length direction of the lower surface of the plate-like portion 22 (the lower surface of the lower layer 22b). The second terminal 40 has a rectangular shape when viewed from the bottom, and is provided at the other end in the length direction of the lower surface of the plate-like portion 22 (the lower surface of the lower layer 22b) so as to be spaced from the first terminal 30. . The first terminal 30 and the second terminal 40 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, etc., like the cylindrical portion 21.

  One of the first terminal 30 and the second terminal 40 is provided with an index for distinguishing polarities (in the drawing, an excision location 30a provided at one corner of the first terminal 30). Further, the outer edge of the first terminal 30 reaches the first recessed portion Da of the one recess 22b2 in the lower layer 22b of the plate-like portion 22, and is below the third conductor portion 54 of the first lead conductor 50 described later. It is electrically connected to the rim. Furthermore, the outer edge of the second terminal 40 reaches the first recessed portion Da of the other recess 22b2 in the lower layer 22b of the plate-like portion 22, and is below the fourth conductor portion 64 of the second lead conductor 60 described later. It is electrically connected to the rim.

  The width of the first terminal 30 and the second terminal 40 excluding the outer edges is larger than the width Wa and smaller than the width Wb. The widths of the outer edges of the first terminal 30 and the second terminal 40 are substantially the same as the width Wa.

  The first lead conductor 50 is provided in the center of the upper surface 22a of the upper layer 22a of the plate-like portion 22, and is provided in the first conductor portion 51 whose upper surface shape is rectangular and the upper layer 22a of the plate-like portion 22, and the upper surface thereof. The via conductor portion 52 having a circular shape (provided with a conductor filled in the hole of the upper layer 22a) and the upper layer 22a and the lower layer 22b of the plate-like portion 22, and the upper surface shape having a substantially T-shape. The second conductor portion 53 and the third conductor portion 54 provided on the side wall of the first recess portion Da of the one recess 22b2 in the lower layer 22b of the plate-like portion 22 are configured. That is, the first lead conductor 50 has a via conductor portion 52 along the thickness direction of the plate-like portion 22 of the sealed container 20. The first conductor portion 51, the via conductor portion 52, the second conductor portion 53, and the third conductor portion 54 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, etc., like the cylindrical portion 21. .

  The top view shape of the first conductor portion 51 substantially matches the bottom view shape of the first polarity portion 11 of the power storage element 10. The second conductor portion 53 is continuous with a circular portion 53a having a diameter larger than that of the via conductor portion 52, a longitudinal strip portion 53b continuous with the outer peripheral edge of the circular portion 53a, and an end of the strip portion 53b. And a rectangular portion 53c reaching the first hollow portion Da of the one recess 22b2. Furthermore, the width of the rectangular portion 53c substantially matches the width of the third conductor portion 54, that is, the width Wa.

  The lower surface of the first conductor portion 51 is electrically connected to the upper surface of the via conductor portion 52, and the lower surface of the via conductor portion 52 is electrically connected to the upper surface of the circular portion 53 a of the second conductor portion 53, The outer edge of the rectangular portion 53 c of the conductor 53 is electrically connected to the upper edge of the third conductor portion 54. That is, the first polar part 11 of the electricity storage element 10 accommodated in the sealed container 20 is electrically connected to the first terminal 30 via the first lead conductor 50.

  The second lead conductor 60 is provided on the upper surface outer periphery of the upper layer 22a of the plate-like portion 22, and the first conductor portion 61 whose top view shape is a rectangular frame shape, and two notches in the upper layer 22a of the plate-like portion 22. A second conductor portion 62 provided on the inner surface of 22a1, a third conductor portion 63 provided between the upper layer 22a and the lower layer 22b of the plate-like portion 22 and having a substantially T-shaped top view, and a plate It is comprised from the 4th conductor part 64 provided in the side wall of 1st hollow part Da of the other recessed part 22b2 in the lower layer 22b of the shape part 22. FIG. The first conductor portion 61, the second conductor portion 62, the third conductor portion 63, and the fourth conductor portion 64 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, and the like, like the cylindrical portion 21. Become.

  The top view width of the first conductor portion 61 is substantially the same as the top view width of the seal ring 23. The third conductor portion 63 includes two arc portions 63 along the notch 22b in which the second conductor portion 62 is provided, a band-shaped portion 63b in the width direction connecting both arc portions 63, and the center of the band-shaped portion 63b. And a rectangular portion 63c that reaches the first hollow portion Da of the other recess 22b2. Further, the width of the rectangular portion 63c substantially matches the width of the fourth conductor portion 64, that is, the width Wa.

  The portion along the notch 22 a 1 of the first conductor portion 61 is electrically connected to the upper end of each second conductor portion 62, and the lower end of each second conductor portion 62 is the outer edge of each arc portion 63 of the third conductor portion 63. The outer edge of the rectangular portion 63 c of the third conductor 63 is electrically connected to the upper edge of the fourth conductor portion 64. That is, the second polar part 12 of the electricity storage device 10 accommodated in the sealed container 20 is electrically connected to the second terminal 40 via the cylindrical part 21 and the seal ring 23 of the sealed container 20 and the second lead conductor 60. Has been.

When paired with a surface mounted said PAS capacitor implementation partner such as a circuit board by reflow soldering, so that the first terminal 30 and second terminal 40 is in contact with the connection portion such as a pre-coated metal pads cream solder The PAS capacitor is mounted on the mounting partner, and the mounted one is put into a reflow furnace to perform the desired soldering.

  Here, the position of the via conductor portion 52 of the first lead conductor 50 provided on the plate-like portion 22 (upper layer 22a) of the sealed container 20 will be described with reference to FIGS. .

  The sealed container 20 expands and contracts due to a temperature change during reflow soldering, a temperature change after mounting, and the like. Since the plate-like portion 22 of the sealed container 20 is a separate part from the tubular portion 21 and the seal ring 23 and is made of a different material from the tubular portion 21 and the seal ring 23, the thermal expansion and contraction of the plate-like portion 22 is performed. This behavior is different from that of the cylindrical portion 21 and the seal ring 23. Further, the portion of the plate-like portion 22 provided with the via conductor portion 52 has a lower strength than other portions because the continuity is cut off by the holes.

  Since the stress generated based on the thermal expansion and contraction is most easily concentrated at the center CT (see FIG. 4) of the plate-like portion 22, when the position of the via conductor portion 52 coincides with the center CT of the plate-like portion 22. The portion of the plate-like portion 22 provided with the via conductor portion 52 may be damaged by the stress concentration.

  In order to avoid this damage, the via conductor portion 52 is provided at a position shifted from the center CT of the plate-like portion 22 as shown in FIGS. Specifically, the via conductor portion 52 is provided such that the center thereof is shifted by Lx in the length direction and by Ly in the width direction with respect to the center CT of the plate-like portion 22.

Moreover, since the stress value produced based on the said thermal expansion and contraction tends to become a high value on the 1st-4th virtual lines L1-L4 shown in FIG. 6, the via conductor part 52 of these virtual lines L1-L4 In order to avoid the risk of breakage, it is preferable to position them so as to be separated from each other. Incidentally, the first virtual line L1 is a line passing through the center of the two opposite sides in the width direction of the plate-like portion 22, the second virtual line L2 is a line passing through the center of the other two sides of the plate-like portion 22, and the third virtual line The line L3 is a line passing through the opposite two corner vertices of the plate-like portion 22 (the virtual vertices here because of the cutouts 22a1 and 22b1), and the fourth virtual line L4 is the other two corner vertices ( Since the notches 22a1 and 22b1 are present, the line passes through the virtual vertex).

  Furthermore, since the longitudinal cross-sectional area of the plate-like portion 22 when it is cut along a line orthogonal to the third and fourth virtual lines L3 and L4 gradually decreases toward the corner, the third and fourth virtual lines L3 and L3 Considering the stress along L4, the closer to the corner, the more disadvantageous to damage resistance. That is, the outer area of the virtual rectangular area (including the fifth to eighth virtual lines L5 to L8) defined by the fifth to eighth virtual lines L5 to L8 shown in FIG. Since the via conductor portion 52 is located inside the virtual rectangular area (not including the fifth to eighth virtual lines L5 to L8) in order to avoid the possibility of the damage because it is a disadvantageous area for damage resistance. preferable. Incidentally, the fifth virtual line L5 is a point where one side in the width direction of the plate-like portion 22 and the first virtual line L1 intersect, and one side in the length direction of the plate-like portion 22 and a second virtual line L2. The sixth virtual line L6 is a point where one side in the length direction of the plate-like portion 22 and the second virtual line L2 intersect, the other side in the width direction of the plate-like portion 22 and the first virtual line L1. A line passing through the intersecting point, the seventh virtual line L7, is a point where the other side in the width direction of the plate-like part 22 intersects with the first virtual line L1, another side in the length direction of the plate-like part 22, and the second virtual line. A line passing through the point where the line L2 intersects, the eighth virtual line L8 is the other side in the length direction of the plate-like part 22, the point where the second virtual line L2 intersects and one side in the width direction of the plate-like part 22 This is a line that passes through the point where the first virtual line L1 intersects.

  Furthermore, if the position of the via conductor portion 52 is far from the center CT of the plate-like portion 22, there is a possibility that the charge / discharge capability of the power storage element 10 may vary depending on the distance between the center CT and the via conductor portion 52. The via conductor portion 52 is preferably close to the center CT of the plate-like portion 22.

  Further, in FIGS. 4 and 5, the via conductor portion 52 is positioned on the right side of the center CT of the plate-like portion 22 in FIG. 4 in order to shorten the length of the band-like portion 53 b of the first connection conductor 53. As shown in FIG. 7, a form of a first connection conductor 53 ′ in which the via conductor portion 52 is positioned on the left side of the center CT of the plate-like portion 22 in FIG. 7 may be adopted. In the first connection conductor 53 ′ shown in FIG. 7, the length of the band-like portion 53b ′ is longer than the length of the band-like portion 53b of the first connection conductor 53 shown in FIG. 4 and FIG. If the dimensional ratio in the length direction and the width direction of the portion 53b ′ is made the same as that of the strip portion 53b, the resistance values of both the strip portions 53b and 53b ′ can be made the same.

  In other words, the strip portions 53b and 53b 'of the first connection conductors 53 and 53' can be used for adjusting the ESR (equivalent series resistance) of the PAS capacitor. For adjusting the ESR, in addition to the method of changing the length and width dimensions of the strip portions 53b and 53b ′, the strip portions 53b and 53b ′ are non-linear, for example, U-shaped, V-shaped, U-shaped, etc. For example, a method of varying the conductive path length without changing the dimension in the length direction can be adopted.

  Thus, in the above-described PAS capacitor, the first lead conductor 50 has the via conductor portion 52 along the thickness direction of the plate-like portion 22 (upper layer 22a), and the via conductor portion 52 is a plate. It is provided at a position shifted from the center of the shape portion 22. That is, the via conductor portion 52 is provided avoiding the center CT of the plate-like portion 22 where stress generated due to thermal expansion and contraction due to temperature change during reflow soldering, temperature change after mounting, and the like tends to concentrate. Therefore, even if the stress generated based on the thermal expansion and contraction is applied to the plate-like portion 22, it is possible to reliably avoid the possibility that the portion provided with the via conductor portion 52 of the plate-like portion 22 is damaged by the stress. it can. As a result, even when the via conductor portion 52 is used for the first lead conductor 50, the portion where the via conductor portion 52 is provided is subject to thermal expansion and contraction due to a temperature change during reflow soldering, a temperature change after mounting, and the like. It is possible to provide a PAS capacitor that can be prevented from being damaged by the stress generated on the basis thereof.

The via conductor portion 52 includes a first virtual line L1 that passes through the center of two opposite sides of the plate-like portion 22, a second virtual line L2 that passes through the center of the other two sides of the plate-like portion 22, and a plate-like shape. a third virtual line L3 that passes through the apex of the two opposite corners of the parts 22 are located off the respective fourth imaginary line L4 passing through the vertex of the other two corners of the plate portion 2 2. That is, since the stress value generated by the thermal expansion and contraction tends to be high on the first to fourth virtual lines L1 to L4, the position of the via conductor portion 52 is deviated from each of these virtual lines L1 to L4. By positioning, it is possible to more reliably avoid the possibility that the portion of the plate-like portion 22 provided with the via conductor portion 52 is damaged by the stress generated based on the thermal expansion and contraction.

  Further, the via conductor portion 52 passes through two points where the opposite two sides of the plate-like portion 22 and the first virtual line L1 intersect, and two points where the other two sides intersect the second virtual line in order. It is located inside the virtual rectangular area defined by the fifth to eighth virtual lines L5 to L8. That is, since the longitudinal cross-sectional area of the plate-like portion 22 when it is cut along a line orthogonal to the third and fourth virtual lines L3 and L4 gradually decreases toward the corner, the fifth to eighth virtual lines L5 to L8. Since the outer area of the virtual rectangular area defined by (including the fifth to eighth virtual lines L5 to L8) has a small vertical cross-sectional area and is disadvantageous for damage resistance, the via conductor portion 52 is Stress caused by positioning the via conductor portion 52 of the plate-like portion 22 based on the thermal expansion and contraction by being positioned inside the virtual rectangular region (not including the fifth to eighth virtual lines L5 to L8) The risk of breakage can be avoided more reliably.

  Furthermore, a recess 22b2 that is recessed inward from each side is formed at the center of two sides facing each other in the length direction of the plate-like portion 22 (virtual 22b), and each recess 22b2 is a first recess portion having a small recess depth. Da and the 2nd hollow part Db with the large hollow depth which exists in the both sides of this 1st hollow part Da are provided. Further, the outer edge of the first terminal 30 reaches the first recessed portion Da of the one recess 22b2, and is electrically connected to the lower edge of the third conductor portion 54 of the first lead conductor 50, The outer edge of the two terminals 40 reaches the first recessed portion Da of the other recess 22b2 and is electrically connected to the lower edge of the fourth conductor portion 64 of the second lead conductor 60. That is, when the PAS capacitor is surface-mounted to a mounting partner such as a circuit board by reflow soldering, the flux contained in the cream solder with the second recessed portions Db existing on both outer edges of the first terminal 30 and the fourth terminal 40. Therefore, it is possible to avoid the possibility that a flux remains in the solder during reflow soldering and bubbles due to evaporation of the residual flux remain in the solder, resulting in poor soldering.

  Next, the case where the electrochemical device having the structure shown in the drawings is used as a rectangular lithium ion capacitor will be described.

  As shown in FIGS. 1 to 5, the lithium ion capacitor includes a power storage element 10 impregnated with an electrolyte, a sealed container 20 containing the power storage element 10, and a first surface provided on the lower surface of the sealed container 20. The terminal 30 and the second terminal 40, the first lead conductor 50 that electrically connects the power storage element 10 and the first terminal 30, and the second lead conductor 60 that includes the power storage element 10 and the second terminal 40 are provided. ing.

  The electrical storage element 10 includes a first polar part 11 and a second polar part 12 having a rectangular top view shape, and a separator having a rectangular top view interposed between the first polar part 11 and the second polar part 12. 13. When the first polar part 11 is an anode and the second polar part 12 is a cathode, the first polar part 11 is made of a material mainly composed of activated carbon, and the second polar part 12 is made of a carbon material that can store lithium ions. It is made of a material having a main component and is in a state in which a predetermined amount of lithium ions is doped in advance (lithium pre-doping). This lithium pre-doping proceeds by impregnating the electrolytic solution in a state where a predetermined amount of metallic lithium is in contact with the surface of the second polar portion 12, and all the metallic lithium becomes lithium ions to form the second polar portion 12. It ends when it is doped inside. The separator 13 is made of a material having a high ion permeability, for example, a fiber material such as glass fiber, cellulose, or rayon, a synthetic resin material such as polypropylene, polyethylene, polyamide, or polyimide, or other materials.

  The lower surface of the first polar part 11 is electrically joined to the upper surface of the first conductor part 51 of the first lead conductor 50 via a conductive material. Further, the upper surface of the second polar part 12 is electrically joined to the lower surface of the upper wall 21a of the cylindrical part 21 of the sealed container 20 via a conductive material. Further, the first polar part 11, the second polar part 12 and the separator 13 are impregnated with an electrolytic solution obtained by dissolving a lithium electrolyte salt such as lithium borofluoride at a predetermined concentration in a solvent such as propylene carbonate.

  Since the other configuration of this lithium ion capacitor is the same as that of the PAS capacitor described above, its description is omitted. Further, since the operations and effects obtained with this lithium ion capacitor are the same as those of the PAS capacitor described above, description thereof is omitted.

  Although the case where the electrochemical device having the structure shown in the drawing is used as a PAS capacitor and the case where it is used as a lithium ion capacitor has been described above, the electrochemical device having the structure shown in the drawing is used as an electric double layer other than the PAS capacitor. Even when used as a capacitor or as a redox capacitor other than the lithium ion capacitor, the same operation and effect as described above can be obtained.

  In addition, the present invention is not limited to the structure shown in the drawings. For example, an electric double layer capacitor having two or more pairs of terminals and lead conductors can be used as long as it is an electrochemical device having a structure included in the claims. The present invention can also be applied to a redox capacitor or the like, a battery such as an electric double layer capacitor and a lithium ion battery having a different kind from the redox capacitor, and the like. In short, the present invention has at least one pair of terminals on the lower surface of a sealed container containing an electrochemical element capable of storing or generating electricity, and at least one pair for electrically connecting the electrochemical element and each terminal. The present invention can be widely applied to electrochemical devices having a lead conductor, and the application can provide the same operations and effects as described above.

1 is a top view of an electrochemical device according to the present invention. It is sectional drawing which follows the x1-x1 line | wire of FIG. It is a bottom view of the electrochemical device shown in FIG. It is the figure which excluded the electrical storage element, the cylindrical part, and the seal ring from FIG. It is the figure which excluded the upper layer of the plate-shaped part from FIG. FIG. 5 is a diagram for explaining the positions of via conductor portions shown in FIGS. 2 and 4. FIG. 5 is a diagram illustrating a modified example of the position of the via conductor portion illustrated in FIGS. 2 and 4.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Power generation element, 11 ... 1st polarity part, 12 ... 2nd polarity part, 13 ... Separator, 20 ... Sealed container, 21 ... Cylindrical part, 22 ... Plate-like part, 23 ... Seal ring, 30 ... 1st terminal , 40 ... second terminal, 50 ... first lead conductor, 51 ... first conductor portion, 52 ... via conductor portion, 53, 53 '... second conductor portion, 54 ... third conductor portion, 60 ... second lead conductor 61 ... 1st conductor part, 62 ... 2nd conductor part, 63 ... 3rd conductor part, 64 ... 4th conductor part.

Claims (2)

At least one pair of terminals on the lower surface of the sealed container containing an electrochemical device capable of power storage or generator, and, at least one pair of the lead conductor which electrically connects the electrochemical element wherein the respective terminals An electrochemical device comprising:
The sealed container comprises a metallic tubular portion, which is composed of a non-metallic plate portion for closing the lower end opening of the cylindrical portion via a metal seal ring,
Wherein at least one of the lead conductors have a via conductor portions along the thickness direction of said plate-like portion, the via conductor unit is provided at a position displaced from the center of said plate-like portion,
The plate-like portion has a rectangular shape when viewed from above,
The via conductor portion includes a first virtual line that passes through the center of two opposite sides of the plate-like portion, a second virtual line that passes through the center of the other two sides of the plate-like portion, and a relative relationship between the plate-like portions. The third virtual line that passes through the two vertexes and the fourth virtual line that passes through the other two vertexes of the plate-like part.
An electrochemical device characterized by that . The via conductor section, two points and the other two sides and the second imaginary lines of the plate-like portion and the two points where the the two opposed sides of the plate-like portion first virtual line intersects intersect is located inside of a virtual rectangular region defined by the first through eighth imaginary line through the sequentially,
The electrochemical device according to claim 1 . .

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