JP5104178B2 - Manufacturing method of ceramic wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a ceramic wiring board formed by firing a green sheet made of ceramic on which a metallized paste is printed.

  Conventionally, a ceramic multilayer wiring board has been proposed as this type. In the manufacturing method, generally, a plurality of ceramic green sheets having a metallized paste layer made of metallized paste printed on one surface are laminated, and the laminate is fired. Thereby, each metallized paste layer constitutes the surface layer and inner layer wirings in the ceramic laminated wiring board.

  Here, in such a manufacturing method, since the amount of shrinkage at the time of firing differs between the metallized paste layer and the ceramic constituting the green sheet, the green sheet warps during firing.

In order to reduce this warpage, conventionally, a method of firing by devising the configuration of the firing furnace (see Patent Document 1), a method of reducing warpage by changing the material of the green sheet (see Patent Document 2), a green sheet A method in which the four corners are cut out (see Patent Document 3) has been proposed.
JP 2002-168570 A JP-A-10-308584 JP 2006-253434 A

  However, the methods described in the above-mentioned patent documents involve restrictions such as a change in the firing method, a change in the green sheet material, and a change in the shape of the green sheet. Therefore, the present inventor decided to pay attention to the printing method of the metallized paste layer, and to search for a solution technique that is not bound by the above-mentioned restrictions.

  The present invention has been made in view of the above circumstances, and in a method for manufacturing a ceramic wiring substrate obtained by firing a green sheet made of ceramic on which a metallized paste layer made of metallized paste is printed, By devising the printing method, the object is to reduce the warpage of the green sheet that occurs during firing due to the difference in shrinkage between the metallized paste layer and the green sheet during firing.

  In general, since the deformation at the center of the sheet is the largest in the warp, the present invention pays particular attention to reducing the difference in shrinkage during firing of the metallized paste layer and the ceramic at the center of the ceramic green sheet. It came to create.

According to the first aspect of the present invention, the metallized paste layer (15a) is formed as a wiring constituting the circuit of the ceramic wiring board by firing, and is formed at the center of one surface of the green sheets (11a to 13a). The thickness of the metallized paste layer (15a) is changed in-plane so that the metallized paste layer (15a) to be printed is thinner than the metallized paste layer (15a) printed outside the center part. Printing ,
The green sheet (11a) is a multiple sheet in which a region to be a single ceramic wiring substrate (S1) is continuous in a plurality of planes. After firing, the fired body of the green sheet (11a) is used as the region unit. The ceramic wiring substrate (S1) divided into individual pieces is manufactured, and the central portion of one surface of the green sheet (11a) is the central portion of the entire one surface of the green sheet (11a). In addition, the outside of the central portion is a portion outside the central portion in the entire one surface,
Green sheets (11a, 13a) in the carrying out the calcination in a state of forming a different groove (30) and the break groove of the substrate split, and feature.

According to this, since the metallized paste layer (15a) located at the center of one surface of the green sheets (11a to 13a) is thinner than the metallized paste layer (15a) located outside thereof, the green sheet ( 11a to 13a) has a smaller difference in shrinkage during firing between the metallized paste layer (15a) and the ceramic than in the center thereof. Therefore, the warp of the green sheet that occurs during firing can be reduced due to the difference in the shrinkage amount. Further, if firing is performed on the green sheet (11a, 13a) in a state where the groove (30) different from the break groove for dividing the substrate is formed, the stress due to shrinkage is dispersed in the groove (30) and warps. (Refer to FIG. 10 described later).

Further, the invention of claim 2 is the invention of claim 1, wherein the metallized paste layer (15a) printed on the center portion of one surface of the green sheets (11a to 13a) is further outside the center portion. Printing is performed by changing the composition of the metallized paste layer (15a) in-plane so that the shrinkage amount due to firing is closer to that of the green sheets (11a to 13a) than the metallized paste layer (15a) printed on the surface. It is characterized by that.

  According to this, since the difference in shrinkage amount during firing of the metallized paste layer (15a) and the ceramic is smaller in the central portion of the green sheets (11a to 13a) than in the outside thereof, the difference in the shrinkage amount. Therefore, the warpage of the green sheet that occurs during firing can be reduced.

  Here, the green sheet (11a) is a multiple sheet in which a region to be a single ceramic wiring board (S1) is continuous in a plurality of planes. After firing, the fired body of the green sheet (11a) is In the case where the ceramic wiring substrate (S1) divided into individual regions is manufactured, the central portion of one surface of the green sheet (11a) is the one surface of the green sheet (11a). It is a central part with respect to the whole, and the outside of the central part may be a part outside the central part of the entire surface (see FIG. 9A described later).

  On the other hand, in this case, the central portion of one surface of the green sheet (11a) is the central portion of one region in the one surface of the green sheet (11a), and the outside of the central portion is one piece. It is good also as what is a site | part outside the said center part of the said area | region (refer FIG.9 (b) mentioned later). However, it is considered that the former can reduce warpage after firing as a whole green sheet.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a schematic cross-sectional view showing a ceramic wiring board S1 according to the first embodiment of the present invention. The ceramic wiring board S1 is a laminated wiring board in which a plurality of ceramic layers 11, 12, and 13 formed by firing ceramic green sheets are laminated.

  The ceramic layers 11 to 13 are produced by a general doctor blade method using a green sheet made of alumina or the like, and are alumina sheets in this example. The thickness of each ceramic layer 11-13 in this ceramic multilayer wiring board S1 is, for example, about 0.1 mm to 0.3 mm.

  And the wiring 14 which comprises the circuit of board | substrate S1 is formed in the front and back both surfaces and inside of ceramic wiring board S1. The wiring 14 is made of a metallized paste whose main component is a metal such as W (tungsten) or Mo (molybdenum). Specifically, a metallized paste is printed and fired.

  This wiring 14 is composed of a layered wiring 15 and a through-hole wiring 16 that form a layer, and in FIG. 1, the direction of hatching is changed between the both 15 and 16. The layered wiring 15 is formed on one surface of each ceramic layer 11 to 13, and is positioned on both the front and back surfaces of the substrate S <b> 1 or between the ceramic layers 11 to 13. The through hole wiring 16 is formed in a through hole formed in each ceramic layer 11 to 13.

  Here, as shown in FIG. 1, in the present embodiment, the layered wiring 15 printed on the center portion of one surface of the ceramic layers 11 to 13 is layered wiring 15 printed on the outside of the center portion. It is thinner than.

  Specifically, the thin one of the layered wirings 15 is about half the thickness. For example, the thickness of the layered wiring 15 printed at the center is 8 μm and printed on the outside thereof. The thickness of the layered wiring 15 is 15 μm.

  Next, a method for manufacturing the ceramic wiring board S1 according to this embodiment will be described. Note that this manufacturing method is based on an alumina laminated wiring board using a general green sheet made of alumina, and pressurizing / firing conditions are based on this. 2 and 3 are process diagrams showing the manufacturing method.

  First, each green sheet 11a-13a produced by the doctor blade method used as the ceramic layers 11-13 is prepared (refer Fig.2 (a)). Next, a through hole K to be a through hole is formed in each of the green sheets 11a to 13a using a mold or the like (see FIG. 2B).

  Next, the metallized paste 16a is filled into the through holes K by a printing method or the like on the green sheets 11a to 13a in which the through holes K are formed in this way (see FIG. 2C). This metallized paste 16a finally becomes the through-hole wiring 16.

  Next, a metallized paste is applied to one surface of each of the green sheets 11a to 13a by a printing method or the like to form a metallized paste layer 15a (see FIG. 2D). The metallized paste layer 15a on one side of the green sheets 11a to 13a finally becomes the layered wiring 15. Again, in FIGS. 2 and 3, the direction of hatching is changed between the pastes 15a and 16a.

  Here, in the present embodiment, the metallized paste layer 15a printed on the center part of one surface of the green sheets 11a to 13a is thinner than the metallized paste layer 15a printed on the outside of the center part. In addition, printing is performed by changing the thickness of the metallized paste layer 15a within the surface of the green sheet.

  A specific example of this printing method will be described with reference to FIG. Here, a method of printing in two divided portions is shown. In this method, in the first printing, as shown in FIGS. 4A, 4 </ b> B, and 4 </ b> C, using the first mask M <b> 1 and the squeegee S, the center of one surface of the green sheets 11 a to 13 a. A thin metallized paste layer 15a is printed on the part side.

  Next, in the second printing, as shown in FIGS. 4D and 4E, the green sheets 11a to 13a are formed using the second mask M2 and the squeegee S that are thicker than the first mask M1. A metallized paste layer 15a having a thickness greater than that of the first printing is printed on the outer side of one surface. Here, when printing for the second time, the second mask M2 is provided with a relief portion M 'for covering the first-time printed portion so as not to come into contact with the first metallized paste layer 15a.

  Then, each green sheet 11a-13a is laminated | stacked, these are pressurized and the laminated body 100 is formed (refer Fig.3 (a)). Here, the pressurizing condition can be a load of about 30 kg to 70 kg, for example.

  Thereafter, break grooves B are formed on the outermost layers 11a and 13a in the laminate 100 by press working using a cutting tool or the like (see FIG. 3B). The break groove B is a substrate dividing groove.

  Next, the laminated body 100 in which the break groove B is formed is fired. This firing is performed at a temperature of about 1600 ° C. in a reducing atmosphere such as hydrogen. Thereby, each green sheet 11a-13a becomes each ceramic layer 11-13, and each paste 15a, 16a is baked and becomes layered wiring 15 and through-hole wiring 16, respectively. And the following processes are performed with respect to the baked laminated body 100 as needed.

  For example, a plating film (not shown) is formed on the layered wiring 15 located on the surface of the outermost layers 11 and 13 of the fired laminate 100. This plating film is formed by, for example, electroless Cu plating or electroless Au plating on Cu plating, and is formed for the purpose of ensuring wire bonding and solderability. is there.

  Although not shown, it is also possible to provide a functional thick film body such as a resistor to the fired laminated body 100, mount a mounting component such as an IC chip or a capacitor, or perform wire bonding. Do as needed. Thereafter, the fired laminated body 100 is divided along the break grooves B, so that individual ceramic wiring boards S1 as shown in FIG. 1 are completed.

  By the way, according to the manufacturing method of this embodiment, since the metallized paste layer 15a located in the center of one surface of the green sheets 11a to 13a is thinner than the metallized paste layer 15a located on the outer side, the green sheet The difference in shrinkage during firing between the metallized paste layer 15a and the ceramic is smaller in the central portion of the sheets 11a to 13a than in the outside thereof.

  FIGS. 5A and 5B are diagrams showing a comparison of the state of warping of the green sheet 11a due to firing in (a) this embodiment and (b) conventional. In the present embodiment, as shown in FIG. 5A, the difference in the shrinkage amount can be reduced, so that the warpage of the green sheets 11a to 13a generated during firing can be reduced.

  Conventionally, as shown in FIG. 5B, the thickness of the metallized paste layer 15a formed by printing is usually uniform within the printing surface of the green sheet 11a. In, the difference in the amount of shrinkage can be reduced at the center by changing the thickness in the plane.

  In this embodiment, since the difference in shrinkage amount between the metallized paste layer 15a and the ceramic is reduced at the center of the sheet where the deformation is maximum during firing, the difference in shrinkage occurs during firing. Green sheet warpage can be reduced.

(Second Embodiment)
In the second embodiment of the present invention, another printing method for printing by changing the thickness of the metallized paste layer 15a as described above within one surface of the green sheets 11a to 13a is provided. This embodiment can also be applied to the following embodiments in which the thickness of the metallized paste layer 15a is changed in the plane.

  In the first embodiment, as shown in FIG. 4, the printing is performed twice using the masks M1 and M2 having different thicknesses. On the other hand, in this embodiment, the printing mask is improved in order to perform printing by changing the thickness of the metallized paste layer 15a in the plane so that the central portion becomes thinner than the outside by one printing. It is a thing.

  FIG. 6A is a schematic cross-sectional view of a mask M3 as a first example of this embodiment, and FIG. 6B is a schematic plan view of a mask M4 as a second example of this embodiment. In FIG. 6A, the thickness of the mask M3 is inclined to provide a thick portion and a thin portion within the surface.

  The metallized paste layer 15a printed at a thick part has a thick film thickness, and the one printed at a thin part has a thin film thickness. Printing of the layer 15a is possible.

  In FIG. 6B, the film thickness is controlled by partially thinning the mesh in the mask M4. Since the metallized paste layer 15a printed at the portion M4a having a coarse mesh has a thick film thickness, and the one printed at the portion M4b having a fine mesh has a thin film thickness. The metallized paste layer 15a can be printed by one printing.

  Moreover, in order to change the film thickness of the metallized paste layer 15a in the plane of the green sheets 11a to 13, a dispensing method or an ink jet method may be used instead of the printing method.

  In recent years, with the miniaturization of wiring patterns, printing methods cannot be used, and dispensing and inkjet are often used. In such a case, it is possible to make a similar structure by changing the amount of the metallized paste applied during dispensing within the surface.

(Third embodiment)
FIG. 7 is a diagram showing a main part of the method for manufacturing a ceramic wiring board according to the third embodiment of the present invention, in which the metallized paste layer 15a to be the layered wiring 15 and the metallized paste for through holes (not shown) are printed. 4 is a schematic sectional view showing four green sheets 11a to 13a, 17a in a separated state before lamination. This embodiment can be applied in combination with the embodiments described above and below.

In this case, the metallized paste layer 15a is positioned between the outer surfaces of the uppermost and lowermost green sheets 11a and 13a and between the green sheets, and has a total of five layers. Here, the first layer, the second layer,..., The fifth layer from the top in FIG. 7, the first layer wiring area of the metallized paste layer 15a is Amm ² , the second layer wiring area is Bmm ² , the third layer The wiring area is Cmm ² , the fourth layer wiring area is Dmm ² , and the fifth layer wiring area is Emm ² .

  In this embodiment, as shown in FIG. 7, the pattern layout of the metallized paste layer 15a of each layer is arranged so that the wiring area is vertically symmetric, thereby reducing the warpage of the green sheet that occurs during firing. ing.

  Specifically, the layout may be made so as to satisfy the relationship of A = E and B = D in the area. This is because the warpage amount tends to increase as (AE) and (BD) increase.

  That is, in the multilayer substrate, the wiring area of the first metallized paste layer 15a from the top is equal to the wiring area of the first metallized paste layer 15a from the bottom, and the second from the top and the second from the bottom To be equal. This means that the metallized paste layer 15a of each layer may be laid out so that the nth wiring area from the top and the nth wiring area from the bottom are equal according to the number of layers, where n is a natural number. .

(Fourth embodiment)
FIG. 8 is a schematic cross-sectional view showing the main part of the method for manufacturing a ceramic wiring board according to the fourth embodiment of the present invention. As described above, when the in-plane film thickness is changed in order to reduce the warpage of the green sheet generated during firing, component mounting is preferably performed as shown in FIG.

  That is, in the thick part of the metallized paste layer 15a on the green sheet 11a to be the ceramic layer 11, the layered wiring 15 becomes thick accordingly, so that the heat capacity of the layered wiring 15 is increased and the wiring resistance is reduced. .

  Therefore, an element 20 that requires high heat dissipation and an element 21 that requires low wiring resistance are mounted on the outer thick layered wiring 15, and high heat dissipation and lower wiring resistance are provided on the thin layered wiring 15 near the center. It is desirable to mount elements 22 that are not required. Here, examples of the elements 20 and 21 mounted on the thick layered wiring 15 include a power element such as a MOS transistor, and examples of the elements 22 mounted on the thin layered wiring 15 include a resistor and a capacitor. .

(Fifth embodiment)
FIG. 9 is a schematic plan view showing the main part of the method for manufacturing a ceramic wiring board according to the fifth embodiment of the present invention, wherein (a) shows a first example and (b) shows a second example. FIG. 9 shows one green sheet 11a among the stacked green sheets shown in the first embodiment, but the same applies to the other green sheets.

  One green sheet 11a is usually a multiple sheet in which a region to be one ceramic wiring substrate S1 is connected in a plurality of planes. Here, a state in which the break groove B is put in the green sheet 11a is shown, and for each of FIGS. 9A and 9B, a rectangular area partitioned by the break groove B is shown as the area. 3 × 3 are arranged vertically and horizontally.

  Then, the green sheet 11a shown in FIG. 9 is fired, and the fired body is divided into individual pieces by the break grooves B in the above-mentioned region units, whereby the same ceramic wiring substrate S1 as described above is manufactured. .

  At this time, also in the present embodiment, the metallized paste layer 15a printed on the center part of one surface of the green sheet 11a is thinner than the metallized paste layer 15a printed on the outside of the center part. Printing is performed by changing the thickness of the metallized paste layer 15a in the plane. In FIG. 9, the thick metallized paste layer 15 a is dot-hatched to distinguish it from the thin one.

  Here, in the first example shown in FIG. 9A, the central portion of one surface of the green sheet 11a is the central portion with respect to the entire one surface of the green sheet 11a, and the outside of the central portion is It is a site outside the central portion of the entire surface. In accordance with this definition, in FIG. 9A, the thickness of the metallized paste layer 15a is changed.

  On the other hand, instead of the first example, a second example shown in FIG. 9B may be used. That is, the central portion of one surface of the green sheet 11a is the central portion in one of the regions on one surface of the green sheet 11a, and the outside of the central portion is the central portion of the one region. It is a site outside.

  In this way, the position may be defined such that the center and the outside are within the region to be a single ceramic wiring board S1, and in accordance with this definition, the thickness of the metallized paste layer 15a is shown in FIG. 9B. Has been changed.

  Basically, the warpage of the substrate is caused by the metallized paste layer 15a of the entire green sheet. Therefore, comparing the first example with the second example, the effect of the first example is greater.

  However, if the pattern design of the metallized paste layer 15a cannot be performed as in the first example, the second example has the effect of making the in-plane density distribution uniform, and thus reducing the warpage. It is considered effective. Each example of the present embodiment can be applied in combination with each of the embodiments described above and below.

(Sixth embodiment)
FIG. 10 is a schematic cross-sectional view showing the main part of the method for manufacturing a ceramic wiring board according to the sixth embodiment of the present invention, wherein (a) shows a first example and (b) shows a second example. Each example of this embodiment can be applied in combination with each of the embodiments described above and below.

  In this example, five layers of green sheets 11a to 13a, 17a, and 18a are stacked, and each paste is omitted. In the present embodiment, the grooves 30 different from the break grooves for dividing the substrate are formed on the green sheets 11a and 13a by pressing or the like before firing. In the first example, the groove 30 is formed in the uppermost green sheet 11a, and in the second example, the groove 30 is formed in the lowermost green sheet 13a.

  And if it bakes in this state, since the stress added to a green sheet at the time of baking will be disperse | distributed by the groove | channel 30, the reduction of the said curvature amount can be gasified. In FIG. 10, (a) the first example is effective when the green sheet is warped so as to be convex upward, and (b) the second example is such that the green sheet is convex downward. Effective when warped.

(Seventh embodiment)
FIG. 11: is a schematic plan view which shows the principal part of the manufacturing method of the ceramic wiring board based on 6th Embodiment of this invention, (a) is a comparative example, (b) shows this embodiment. FIG. 10 shows one green sheet 11a among the stacked green sheets shown in the first embodiment, but the same applies to the other green sheets.

  Similar to a normal one, one green sheet 11a is a product part R1 which is a region to be the ceramic wiring board S1 and an outer peripheral part R2 located on the outer periphery of the product part R1. . After firing, the fired body of the green sheet 11a is divided into a product part R1 and an outer peripheral part R2.

  For example, as shown in FIG. 9, the product portion R1 is a region in which a plurality of units serving as the wiring substrate S1 are connected, and the metallized paste is printed thereon. Further, the outer peripheral portion R2 normally does not print the metallized paste as shown in FIG. In FIG. 11, the hatched area for identification is given to the area where the metallized paste layer 15 a is printed on one surface of the green sheet 11 a.

  Here, in this embodiment, as shown in FIG. 11B, the metalized paste is also printed on the outer peripheral portion R2. By doing so, compared with FIG. 11 (a), since the shrinkage | contraction amount of a green sheet (ceramic) becomes uniform by outer peripheral part R2 and product part R1, it is effective in reduction of the said curvature.

  At this time, it is desirable that the metallized paste layer 15a printed on the outer peripheral portion R2 is printed thicker than the metallized paste layer 15a printed on the product portion R1. As described above, since the entire green sheet 11a is most likely to warp in the central portion, the metallized paste layer 15a of the product portion R1 located in the central portion is thinned to reduce the first portion. This is because the warp suppressing effect is exhibited by the same principle as described in the embodiment.

  FIGS. 12A and 12B are schematic plan views showing other examples of the present embodiment, respectively. When the metallized paste layer 15a is formed on the outer peripheral portion R1, it is most effective to make it circular as shown in FIG. 12A from the relationship of the shrinkage direction during firing. In addition, if the pattern cannot be made circular for convenience of pattern formation, a pseudo-circular pattern may be used as shown in FIG.

  In this embodiment, the metallized paste layer 15a formed on the outer peripheral portion R2 may be patterned in the same manner as that of the product portion R1, or hatched in FIGS. 11 and 12. Alternatively, the film may be a so-called solid film formed uniformly on the entire outer peripheral portion R2. In addition, this embodiment can also be applied in combination with each of the embodiments described above and below.

(Other embodiments)
FIG. 13: is a schematic sectional drawing which shows the principal part of the manufacturing method of the ceramic wiring board based on other embodiment of this invention. Here, one green sheet 11a among the stacked green sheets shown in the first embodiment is shown, but the same applies to the other green sheets.

  In FIG. 13, the metallized paste layer 15a printed on the central portion of one surface of the green sheet 11a has a shrinkage amount due to firing on the green sheet 11a than the metallized paste layer 15a printed on the outside of the central portion. Printing is performed by changing the composition of the metallized paste layer 15a in the plane so that the layers are close to each other. In FIG. 13, the metallized paste layers 15a having different compositions are shown by changing the direction of hatching.

  For example, in FIG. 13, the metallized paste layer 15a printed at the center is Mo, and the metallized paste layer 15a printed outside is W. Regarding the amount of shrinkage, Mo is closer to green sheet 11a made of ceramic such as alumina than W. The printing of the metallized paste layer 15a with the composition changed in this way can be performed by printing in two steps.

  In the manufacturing method shown in FIG. 13, since only the material composition of the metallized paste layer 15a is changed, it can be performed in combination with the above embodiments. For example, when the composition is changed as shown in FIG. 13, it may be a manufacturing method in which the thickness is further changed in the plane as in the first embodiment.

  Further, in the manufacturing method shown in FIG. 13, the wiring area may be symmetrical as in the third embodiment, or the component may be mounted according to the thickness as in the fourth embodiment. Good. Further, a method of forming the groove 30 as in the sixth embodiment or a method of printing the metallized paste not only on the product portion R1 but also on the outer peripheral portion R2 as in the seventh embodiment may be adopted in combination. Good.

  Further, in the manufacturing method in which the composition is changed between the central portion and the outside as shown in FIG. 13, the central portion and the outside are formed in the entire multiple green sheets as shown in FIG. 9 (fifth embodiment). May be defined, or the central portion / outside may be defined in one of the above-described regions of the green sheet.

  In each of the above embodiments, the ceramic wiring board is a laminated board formed by laminating a plurality of green sheets. However, the ceramic wiring board is obtained by firing a green sheet made of ceramic having a metallized paste layer printed on one surface. If it exists, it may consist of a single layer of green sheets.

It is a schematic sectional drawing which shows the ceramic wiring board which concerns on 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the ceramic wiring board which concerns on 1st Embodiment. FIG. 3 is a process diagram illustrating a manufacturing method subsequent to FIG. 2. It is process drawing which shows the printing method of the metallization paste layer which concerns on 1st Embodiment. It is a figure which shows the state of the curvature of the green sheet by baking, (a) shows the case of 1st Embodiment, (b) shows the conventional case. It is a figure which shows the mask for printing which concerns on 2nd Embodiment of this invention, (a) is a schematic sectional drawing of the mask as a 1st example, (b) is a schematic plan view of the mask as a 2nd example. It is. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on 4th Embodiment of this invention. It is a schematic plan view which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on 5th Embodiment of this invention, (a) shows a 1st example and (b) shows a 2nd example. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on 6th Embodiment of this invention, (a) shows a 1st example, (b) shows a 2nd example. It is a schematic plan view which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on 6th Embodiment of this invention, (a) is a comparative example, (b) shows this embodiment. (A), (b) is a schematic plan view which shows the other example of 6th Embodiment, respectively. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the ceramic wiring board which concerns on other embodiment of this invention.

Explanation of symbols

11a, 12a, 13a ... green sheet, 15a ... metallized paste layer,
30 ... groove, R1 ... product part, R2 ... outer peripheral part, S1 ... ceramic wiring board.

Claims (2)

In a method for manufacturing a ceramic wiring substrate, which is obtained by firing a green sheet (11a, 12a, 13a) made of ceramic on which a metallized paste layer (15a) made of a metallized paste is printed on one side,
The metallized paste layer (15a) is a wiring constituting the circuit of the ceramic wiring board by the firing,
Of the one surface of the green sheets (11a to 13a), the metallized paste layer (15a) printed at the center is thinner than the metallized paste layer (15a) printed outside the center. As described above, the thickness of the metallized paste layer (15a) is changed in the plane to perform the printing.
The green sheet (11a) is a multiple sheet in which a region to be a single ceramic wiring substrate (S1) is continuous in a plurality of planes, and after the firing, a fired body of the green sheet (11a) is formed. The ceramic wiring board (S1) that is divided into individual regions and separated into pieces is produced.
The central portion of the one surface of the green sheet (11a) is a central portion with respect to the whole of the one surface of the green sheet (11a), and the outside of the central portion is the central portion of the entire one surface. The outer part of the
A method of manufacturing a ceramic wiring board, wherein the firing is performed in a state where a groove (30) different from a break groove for dividing a substrate is formed on the green sheet (11a, 13a).   Further, the metallized paste layer (15a) printed at the center of the one surface of the green sheets (11a to 13a) is more than the metallized paste layer (15a) printed outside the center. The printing is performed by changing the composition of the metallized paste layer (15a) in-plane so that the amount of shrinkage caused by the firing is close to that of the green sheets (11a to 13a). The manufacturing method of the ceramic wiring board as described in 2.

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