JP5099468B2 - Film forming apparatus and electronic component manufacturing method - Google Patents

Description

  The present invention relates to a film forming apparatus for forming an insulating or conductive film by injecting an aerosol formed by mixing raw material powder (fine particles) into a gas toward a substrate, and manufacturing an electronic component using the film forming apparatus. Regarding the method.

  In recent years, there has been a demand for further miniaturization and higher performance of electronic components used in electronic devices such as mobile phones and notebook computers, and high density of these electronic components on a circuit board (printed circuit board). Is required to be implemented. Usually, a passive element such as a capacitor used in an electronic device such as a mobile phone and a notebook personal computer is formed in a chip shape and mounted on the surface of a circuit board. However, in order to further increase the density, it has been proposed to incorporate passive elements such as capacitors in the circuit board.

  By the way, it is extremely difficult to incorporate the ceramic capacitor in the circuit board because a resin (for example, epoxy resin) constituting the circuit board cannot withstand high temperatures when the ceramic is fired. In order to solve this problem, Patent Document 1, Patent Document 2 and Patent Document 3 describe an aerosol in which a substrate is placed in a decompressed film forming chamber and ceramic powder (ceramic fine particles) and a carrier gas are mixed. An aerosol deposition method is disclosed in which a ceramic film is formed by spraying toward a substrate and depositing ceramic fine particles on the substrate.

In the aerosol deposition method, when the ceramic fine particles collide with the substrate, dirt and moisture on the surface of the substrate are removed to activate the substrate surface, and the surface of the ceramic fine particles is also activated by the collision of the ceramic fine particles. . As a result, the ceramic fine particles and the substrate, and the ceramic fine particles are strongly bonded to each other, and a ceramic film having a dense structure is formed on the substrate. In the aerosol deposition method, it is possible not only to use a powder of an insulating material or a conductive material other than ceramic as a raw material powder, but it is also possible to mix and use a plurality of types of powders made of different materials. is there. For this reason, the aerosol deposition method has attracted attention as a method for forming a composite material. Patent Documents 1 to 3 described above also describe the configuration of an aerosol deposition film forming apparatus for forming a film by an aerosol deposition method. Patent Document 4 describes that an alumina film is formed by spraying alumina fine particles on a substrate.
JP 2000-212766 A JP-A-2005-2361 JP 2005-163058 A Japanese Patent Laid-Open No. 3-231096

  However, the conventional aerosol deposition film forming apparatus has a problem that the adhesion strength of the film to the substrate is not sufficient, and peeling tends to occur when a thick film is formed.

  An object of the present invention is to provide an aerosol deposition film forming apparatus capable of forming a thick film having a high adhesion strength to a substrate and a dense structure, and an electronic component manufacturing method using the film forming apparatus. And

According to one aspect of the present invention, an aerosol generating unit that generates an aerosol by mixing raw material powder and a carrier gas, a film forming chamber, a substrate mounting unit disposed in the film forming chamber, and a rectifying gas are supplied. A rectifying gas supply unit, an aerosol generated by the aerosol generation unit toward a substrate mounted on the substrate mounting unit to form a film, and an aerosol injection unit disposed around the aerosol injection unit A rectifying gas injection unit that injects the rectified gas supplied from the rectifying gas supply unit in the same direction as the aerosol injection direction around the aerosol injected from the aerosol injection unit , and the aerosol generation unit in the middle of the pipe for sending the generated aerosol to the aerosol jetting portion, formed of a pipe for supplying an assist gas for adjusting the flow rate of the aerosol is connected Apparatus is provided.

  In the conventional aerosol deposition film forming apparatus, the aerosol sprayed from the aerosol spraying part spreads until it reaches the substrate, the speed decreases, and this causes the film adhesion to decrease. Therefore, in the film forming apparatus of the present invention, the rectifying gas injection unit is disposed around the aerosol injection unit, and the rectification gas is injected from the rectification gas injection unit around the aerosol injected from the aerosol injection unit. Thereby, the spread of the aerosol and the decrease in velocity are suppressed, and the decrease in the collision force of the fine particles in the aerosol against the substrate surface is avoided. As a result, it is possible to form a uniform film with high adhesion and a dense structure, and even when the film thickness is increased, occurrence of defects such as peeling is avoided.

According to another aspect of the present invention, the step of disposing a substrate in a reduced-pressure atmosphere, spraying an aerosol formed by mixing raw material powder and a carrier gas toward the substrate, and surrounding the aerosol around the aerosol And a step of forming a film on the substrate by supplying a rectifying gas in the same direction as the injection direction, and supplying an assist gas for adjusting the flow velocity of the aerosol in the middle of the pipe through which the aerosol passes An electronic component manufacturing method is provided.

  In the electronic component manufacturing method of the present invention, since the rectifying gas is injected around the aerosol, the spread of the aerosol and the decrease in the speed are suppressed, and a film having high adhesion and a dense structure can be formed. According to the method of the present invention, since a ceramic film or other dielectric film or conductor film can be formed without performing a heat treatment at a high temperature, a substrate having a film of a resin or the like that cannot be exposed to a high temperature. Ceramic capacitors and other electronic components can be manufactured on top.

  The inventors of the present application examined the cause of insufficient adhesion strength of a film formed by a conventional aerosol deposition film forming apparatus. The results will be described below.

  FIG. 1 is a schematic diagram showing a spray nozzle of a conventional aerosol deposition film forming apparatus and a film formed on a substrate. FIG. 2 is a schematic diagram showing the aerosol ejected from the ejection nozzle. In addition, the code | symbol 13 in a figure has shown the microparticles | fine-particles in aerosol.

  As shown in FIG. 1, the aerosol is injected from the injection nozzle 11 toward the substrate 12 disposed in the film formation chamber at a pressure of, for example, 100 kPa. On the other hand, the pressure in the film forming chamber is reduced to, for example, about 200 Pa so as not to reduce the velocity of the sprayed aerosol. Therefore, there is a large atmospheric pressure difference between the aerosol injected from the injection nozzle 11 and its surroundings. As shown in FIG. 2, a lateral force H corresponding to the atmospheric pressure difference acts and the distance from the injection nozzle 11 increases. The aerosol spreads and the velocity in the direction perpendicular to the substrate surface decreases.

  As shown in FIG. 1, the fine particles 13 at the center of the aerosol collide almost perpendicularly with the surface of the substrate 12 to form a film 14 having a high adhesion strength to the substrate 12 and a dense structure. However, since the fine particles 13 in the peripheral portion of the aerosol collide obliquely with the substrate 12, the collision force is dispersed in the vertical direction and the horizontal direction. Therefore, the collision force P1 of the fine particles 13 in the peripheral part of the aerosol with respect to the substrate 12 is smaller than the collision force P of the fine particles 13 in the central part of the aerosol with respect to the substrate 12 by ΔP. For this reason, a portion with low adhesion strength to the substrate 12 and low tissue density is formed, and when an attempt is made to increase the thickness of the film, peeling occurs at a portion with low adhesion strength and density.

  From these, the inventors of the present application conclude that it is necessary to suppress the spread of the aerosol injected from the injection nozzle in order to form a uniform film with high adhesion strength to the substrate and a dense structure. Reached. Patent Document 2 described above proposes that a mask having an opening through which only the central portion of the aerosol passes is disposed between the spray nozzle and the substrate, and fine particles in the peripheral portion of the aerosol are eliminated by this mask. . However, since the aerosol spreads due to the pressure difference even after passing through the opening of the mask, it cannot be said that the film forming apparatus described in Patent Document 2 is sufficiently effective in increasing the adhesion strength and the denseness of the film.

(First embodiment)
FIG. 3 is a schematic diagram showing the configuration of the aerosol deposition film forming apparatus according to the first embodiment of the present invention. As shown in FIG. 3, the aerosol deposition film forming apparatus of this embodiment includes a film forming chamber 21 connected to a vacuum pump 26 via a mechanical booster 27, and an aerosol generating unit 31 that generates aerosol. Has been.

  The film forming chamber 21 is provided with a stage 23 on which a substrate 24 is mounted, and a stage driving unit 25 that drives the stage 23 in the horizontal direction (XY direction) and the vertical direction (Z direction). In the present embodiment, the stage 23 is moved at a constant speed in the horizontal direction or the vertical direction by the stage driving unit 25. In the film forming chamber 21, an injection nozzle 22 for injecting aerosol toward the substrate 24 mounted on the stage 23 is disposed. The structure of the injection nozzle 22 will be described later.

  The internal space of the film forming chamber 21 is depressurized by a vacuum pump 26 and a mechanical booster 27. As the vacuum pump 26, for example, a rotary pump or a diaphragm pump can be used. In addition, the part which did not contribute to film formation among the raw material powder injected in the film-forming chamber 21 between the film-forming chamber 21 and the mechanical booster 27 or between the mechanical booster 27 and the vacuum pump 26. You may provide the dust collector which collects.

The raw material powder 32 is stored in the aerosol generating unit 31. In the case of forming a ceramic film, ceramic powder (ceramic fine particles) such as Al ₂ O ₃ (alumina), MgO and BaTiO ₃ is used as the raw material powder 32. Further, when forming the conductor film, metal powder (metal fine particles) such as Cu, Au, and Al is used as the raw material powder 32, for example. The average particle diameter of the raw material powder 32 is, for example, 10 nm to 1 μm. As the raw material powder 32, a mixture of a plurality of types of fine particles made of different materials may be used.

  In the film forming apparatus of the present embodiment, a vibrator 33 for accelerating the generation of aerosol is attached to the aerosol generator 31. The vibrator 33 applies ultrasonic vibrations or mechanical vibrations to the aerosol generating unit 31 to scatter the raw material powder 32 and promote the generation of the aerosol. Further, the aerosol generating unit 31 is provided with a heater (not shown) for promoting the drying of the raw material powder 32. The internal space of the aerosol generating unit 31 is connected to the mechanical booster 27 via a pipe 44 and an opening / closing valve 44a.

  Carrier gas is supplied into the aerosol generation unit 31 via a pipe 41, an on-off valve 41a, and a mass flow controller 41b. This carrier gas is mixed with the raw material powder 32 in the aerosol generating section 31 to become an aerosol. The aerosol generated by the aerosol generator 31 is sent to the spray nozzle 22 in the film forming chamber 21 through the pipe 42 and the opening / closing valve 42a. In the aerosol generating unit 31, the tip of the pipe 41 is disposed near the bottom of the aerosol generating unit 31, and the tip of the pipe 42 is disposed near the top of the aerosol generating unit 31.

  Further, the rectifying gas is supplied to the injection nozzle 22 via the pipe 43, the open / close valve 43a, and the mass flow controller 43b. This rectified gas is injected around the aerosol as described later in order to prevent the aerosol injected from the injection nozzle 22 from spreading.

  As the carrier gas and the rectifying gas, for example, an inert gas such as Ar (argon), He (helium), Ne (neon), Xe (xenon), Kr (krypton), and N (nitrogen), oxygen, or air is used. be able to. In this embodiment, both the carrier gas and the rectifying gas are supplied from the gas cylinder 34. However, the carrier gas and the rectifying gas may be supplied from individual gas cylinders, and different gases may be used as the carrier gas and the rectifying gas. May be used. Further, a compressor (compressor) may be used instead of the gas cylinder 34. For example, a gas generated from liquid nitrogen may be compressed by a compressor to be a carrier gas or a rectifying gas. When nitrogen gas or oxygen gas is used, those gases may be extracted from the air.

  4A is a cross-sectional view of the injection nozzle 22, and FIG. 4B is a plan view of the injection nozzle 22 as viewed from the direction indicated by the arrow A in FIG. 4A. As shown in FIG. 4B, an aerosol injection port (aerosol injection unit) 51 that is opened in a slit shape and an annular shape that surrounds the aerosol injection port 51 are formed at the tip of the injection nozzle 22 of the present embodiment. Further, a rectifying gas injection port (rectifying gas injection part) 52 is provided. As shown in FIG. 4A, the aerosol injection port 51 is connected to the pipe 42 shown in FIG. 3 through a hole 51a formed along the central axis of the injection nozzle 22, and the rectifying gas injection port 52 is a hole. It connects with the piping 43 shown in FIG. 3 through the hole 52a provided in the circumference | surroundings of 51a.

  Hereinafter, a film forming method using the aerosol deposition film forming apparatus of the present embodiment having the above-described configuration will be described.

  First, as shown in FIG. 3, the raw material powder 32 is put in the aerosol generating unit 31. The raw material powder 32 is preferably sufficiently dehumidified in advance. Thereafter, the valve 44a is opened with the valves 41a, 42a, 43a closed, and the mechanical booster 27 and the vacuum pump 26 are operated. Thereby, the inside of the film forming chamber 21 and the aerosol generating unit 31 is evacuated to form a reduced pressure atmosphere. At this time, it is preferable to remove the moisture in the raw material powder 32 more completely by heating the aerosol generator 31 with a heater.

  Next, after closing the valve 44a, the vibrator 33 is operated to vibrate the aerosol generating unit 31. Further, the valves 41 a, 42 a, and 43 a are opened to supply the carrier gas from the gas cylinder 34 into the aerosol generating unit 31 and to supply the rectifying gas to the injection nozzle 22.

  The raw material powder 32 is scattered in the aerosol generating unit 31 and mixed with the carrier gas by the carrier gas supplied into the aerosol generating unit 31 and the vibration by the vibrator 33, and an aerosol is generated. The aerosol is sent to the injection nozzle 22 via the pipe 42 and is injected toward the substrate 24 from the aerosol injection port 51 (see FIG. 4B). In this case, the pressure and flow rate of the carrier gas are adjusted to set the aerosol injection speed within a range of, for example, 50 m / s to 1000 m / s.

  On the other hand, the rectifying gas is supplied from the gas cylinder 34 to the injection nozzle 22 through the pipe 43, and the rectifying gas is injected from the rectifying gas injection port 52 (see FIG. 4B) of the injection nozzle 22. The jetting speed of the rectifying gas is preferably substantially the same as the spraying speed of the aerosol.

  FIG. 5 is a schematic diagram showing aerosol and rectifying gas injected from the injection nozzle 22. As shown in FIG. 5, the aerosol (indicated by the arrow 55 in the figure) injected from the aerosol injection port 51 and the rectifying gas (indicated by the arrow 56 in the drawing) injected around the aerosol from the rectifying gas injection port 52. Therefore, the spread of the aerosol is small, and the raw material powder (fine particles) 53 collides with the surface of the substrate 24 substantially perpendicularly. As a result, a uniform film 29 having a high adhesion strength and a dense structure is formed, and even if the film thickness is increased, the occurrence of peeling is prevented.

  Hereinafter, a method for manufacturing a ceramic capacitor using the film forming apparatus of the present embodiment will be described with reference to cross-sectional views shown in FIGS.

First, as shown in FIG. 6A, a substrate 61 is prepared. As the substrate 61, a circuit substrate or a semiconductor substrate can be used. Here, it is assumed that a silicon substrate (wafer) having an insulating film (not shown) made of SiO ₂ formed on the surface is used as the substrate 61. In place of the SiO ₂ film, a silicon substrate having an insulating film made of polyimide formed on the surface may be used.

  Next, as shown in FIG. 6B, a conductor film 62 that forms the lower electrode of the ceramic capacitor is formed on the substrate 61. The conductor film 62 is composed of a laminated film having a two-layer structure, for example, a lower layer of a Cr (chrome) layer having a thickness of 0.08 μm and an upper layer of a Cu (copper) layer having a thickness of 2 μm. The Cr layer and the Cu layer are formed by sputtering, for example.

  Thereafter, a resist film (not shown) having a predetermined pattern is formed on the conductor film 62, and the conductor film 62 is wet-etched using the resist film as a mask, as shown in FIG. A lower electrode 63 is formed. At the same time, the conductor film 62 may be used to form a lead wiring or other wiring electrically connected to the lower electrode 63 on the substrate 61.

Next, a ceramic film (dielectric film) 64 having a thickness of, for example, 5 μm is formed on the substrate 61 and the lower electrode 63 as shown in FIG. Form. In this ceramic film forming step, as described above, the rectifying gas is sprayed around the aerosol to form the ceramic film 64 having a high adhesion strength, a dense structure, and a uniform film thickness. Here, as a raw material of the ceramic film 64, a powder made of BaTiO ₃ fine particles having an aluminum film formed on the surface using aluminum alkoxide is used. The average particle diameter of the BaTiO ₃ fine particles is, for example, 0.5 μm.

  The ceramic film 64 does not need to be formed on the entire surface of the substrate 61. For example, the ceramic film 64 may be formed only on the lower electrode 63 and its surrounding area.

  Next, a resist film (not shown) having a predetermined pattern is formed on the ceramic film 64 using a photoresist. Then, wet etching is performed using this resist film as a mask to pattern the ceramic film 64 into a predetermined shape as shown in FIG. In this wet etching, for example, an aqueous hydrofluoric acid solution having a concentration of 5 wt% is used as an etchant, and the substrate 61 on which the ceramic film 64 and the resist film are formed is immersed in the etchant for about 5 minutes at a temperature of 23 ° C. Is done.

  Next, Cu is deposited to a thickness of about 2 μm on the entire upper surface of the substrate 61 by sputtering to form a conductor film (not shown). Then, this conductor film is patterned by a photolithography method to form an upper electrode 65 on the ceramic film 64 as shown in FIG. At the same time, a lead wiring or other wiring electrically connected to the upper electrode 65 may be formed on the substrate 61 using the conductor film. In this manner, a ceramic capacitor including the lower electrode 63, the ceramic film 64 (dielectric film), and the upper electrode 65 is formed on the substrate 61.

  In forming a ceramic film by sputtering or sol-gel method, which is a conventional low-temperature process, it is necessary to perform heat treatment at a temperature of at least 400 ° C. after the ceramic film is formed in order to increase the dielectric constant of the ceramic film. There is a risk of thermally damaging the dielectric film or the like formed on the substrate. On the other hand, according to the manufacturing method of the present embodiment described above, since the ceramic film 64 is formed at room temperature, it is reliably avoided that the substrate and the dielectric film formed thereon are thermally damaged. it can.

  In the above-described ceramic capacitor manufacturing method, the ceramic film 64 is patterned into a predetermined shape using an etching method. However, the ceramic film 64 may be patterned by a lift-off method. That is, a photoresist film is formed on the substrate 61 on which the lower electrode 63 is formed, an opening having a predetermined shape is formed in the photoresist film, and then a ceramic film is formed using the film forming apparatus shown in FIG. Form. Thereafter, the ceramic film in the opening is left, and the ceramic film in other regions is removed together with the resist film. In this way, the ceramic film 64 having a predetermined shape can be easily formed.

  Further, the ceramic film may be formed by a mask method without using a resist. That is, a metal mask having an opening having a predetermined shape is disposed on the substrate on which the lower electrode 63 is formed. Then, after forming the ceramic film 64 using the film-forming apparatus shown in FIG. 3, the metal mask is removed. In this way, the ceramic film 64 having a predetermined shape can be easily formed.

  Furthermore, in the above-described method for manufacturing a ceramic capacitor, the conductor film to be the lower electrode and the upper electrode is formed by the sputtering method. However, these conductor films may also be formed by the aerosol deposition method.

  In the first embodiment described above, the case where the film forming apparatus of the present invention is applied to the manufacture of a ceramic capacitor has been described. However, the film forming apparatus of the present invention is other than a ceramic capacitor constituted by a conductive or insulating film. It can also be applied to the manufacture of electronic parts such as coils and resistance elements.

  Moreover, in the film-forming apparatus of 1st Embodiment mentioned above, although the shape of the aerosol injection port 51 was made into slit shape (rectangular) as shown in FIG.4 (b), it is to FIG.7 (a), (b). As shown, the aerosol injection port 51 may have a circular shape. In the aerosol injection nozzle 22 shown in FIGS. 7A and 7B, the rectifying gas injection port 52 is formed concentrically around the aerosol injection port 51.

(Second Embodiment)
FIG. 8 is a schematic diagram showing the configuration of an aerosol deposition film forming apparatus according to the second embodiment of the present invention. The film forming apparatus according to the second embodiment is different from the film forming apparatus according to the first embodiment in that a pipe 45 for injecting an assist gas is provided in the pipe 44. Since this is basically the same as the film forming apparatus of the first embodiment, in FIG. 8, the same components as those in FIG.

  In the film forming apparatus of this embodiment, a pipe 45 is connected to a pipe 44 between the aerosol generating unit 31 and the injection nozzle 22, and assist gas flows in the direction in which the aerosol in the pipe 44 flows through the pipe 45. Is supposed to be injected. The assist gas is supplied from a gas cylinder (not shown) through an open / close valve 45a and a mass flow controller (not shown). As the assist gas, the same gas as the carrier gas may be used, or a gas different from the carrier gas may be used.

  In this embodiment, since the flow velocity of the aerosol is controlled by the assist gas, there is an advantage that the stability of the aerosol injection speed is improved.

(Third embodiment)
FIG. 9A is a cross-sectional view showing an injection nozzle of an aerosol deposition film forming apparatus according to a third embodiment of the present invention, and FIG. 9B is a plan view when the injection nozzle is viewed from the injection port side. It is. The film forming apparatus according to the third embodiment is different from the film forming apparatus according to the first embodiment in that the shapes of the aerosol injection port and the rectifying gas injection port provided in the injection nozzle are different. Is basically the same as the film forming apparatus of the first embodiment. Therefore, in FIGS. 9 (a) and 9 (b), the same components as those in FIGS. Description of the parts to be performed is omitted.

  In the spray nozzle 71 used in the film forming apparatus of this embodiment, as shown in FIG. 9B, three slit-shaped aerosol spray ports 72a, 72b, 72c are arranged in parallel and close to each other. Four slit-shaped rectifying gas injection ports 73a, 73b, 73c, and 73d are disposed so as to surround the aerosol injection ports 72a, 72b, and 72c.

  In the film forming apparatus of the present embodiment, three sets of aerosol generators are provided, and aerosols containing different raw material powders are supplied from the aerosol generators to the respective aerosol injection ports 72a, 72b, 72c. . These raw material powders are mixed between the injection nozzle 71 and the substrate and deposited on the substrate to form a composite material film made of three kinds of materials. Thus, in the film forming apparatus of this embodiment, a dense and homogeneous composite material film can be formed using a plurality of types of raw material powders that are difficult to mix uniformly in advance.

  In the film forming apparatus of this embodiment, the rectifying gas injection ports 73a, 73b, 73c, and 73d are independent of each other. In general usage, the flow velocity of the rectifying gas injected from these rectifying gas injection ports 73a, 73b, 73c, and 73d is set to be the same, but the rectifying gas injected from each of the rectifying gas injection ports 73a, 73b, 73c, and 73d is the same. The flow rate may be changed. For example, as schematically shown in FIG. 10, when the flow velocity of the rectifying gas injected from the rectifying gas injection port 72a is made higher than the flow velocity of the rectifying gas injected from the rectifying gas injection port 73b, the aerosol is shown by an arrow 75 in FIG. Turn in the direction indicated by. By changing the flow velocity of the rectifying gas injected from the rectifying gas injection ports 73a and 73b with time, it becomes possible to scan the aerosol in a certain direction, and the position of the injection nozzle 71 and the substrate is fixed on the substrate. A film can be formed in a wide range.

  Hereinafter, various aspects of the present invention will be collectively described as supplementary notes.

(Appendix 1) An aerosol generating unit that generates an aerosol by mixing raw material powder and a carrier gas;
A deposition chamber;
A substrate mounting portion disposed in the film forming chamber;
A rectifying gas supply unit for supplying the rectifying gas;
An aerosol injection unit that forms a film by injecting the aerosol generated by the aerosol generation unit toward a substrate mounted on the substrate mounting unit;
And a rectifying gas injection unit that is arranged around the aerosol injection unit and injects the rectification gas supplied from the rectification gas supply unit around the aerosol injected from the aerosol injection unit. apparatus.

  (Additional remark 2) The said rectification | straightening gas injection part is cyclically | annularly provided around the said aerosol injection part, The film-forming apparatus of Additional remark 1 characterized by the above-mentioned.

  (Additional remark 3) Furthermore, it has a pressure-reduction apparatus which maintains the said film-forming chamber in a pressure-reduced state, The film-forming apparatus of Additional remark 1 characterized by the above-mentioned.

  (Supplementary note 4) The film forming apparatus according to supplementary note 1, wherein the carrier gas and the rectifying gas are supplied from the same gas supply source.

  (Additional remark 5) The film-forming apparatus of Additional remark 1 characterized by having two or more said aerosol injection parts, and each aerosol injection part is supplied with the aerosol containing a different raw material powder.

  (Supplementary note 6) The film forming apparatus according to supplementary note 1, wherein a plurality of the rectifying gas injection units are arranged around the aerosol injection unit.

  (Additional remark 7) The piping which supplies the assist gas for adjusting the flow velocity of the said aerosol is connected in the middle of the piping which sends the aerosol which generate | occur | produced in the said aerosol generation part to the said aerosol injection part. 2. The film forming apparatus according to 1.

(Appendix 8) Arranging a substrate in a reduced-pressure atmosphere;
And spraying an aerosol formed by mixing raw material powder and a carrier gas toward the substrate, and spraying a rectifying gas around the aerosol to form a film on the substrate. Manufacturing method for electronic parts.

  (Supplementary note 9) The method of manufacturing an electronic component according to supplementary note 8, wherein ceramic fine particles are used as the raw material powder.

  (Supplementary note 10) The method for manufacturing an electronic component according to supplementary note 8, wherein conductive fine particles are used as the raw material powder.

FIG. 1 is a schematic diagram showing a spray nozzle of a conventional aerosol deposition film forming apparatus and a film formed on a substrate. FIG. 2 is a schematic diagram showing the aerosol ejected from the ejection nozzle. FIG. 3 is a schematic diagram showing the configuration of the aerosol deposition film forming apparatus according to the first embodiment of the present invention. FIG. 4A is a cross-sectional view of an injection nozzle of the aerosol deposition film forming apparatus of the first embodiment, and FIG. 4B is the same view of the injection nozzle from the direction indicated by arrow A in FIG. It is a top view at the time. FIG. 5 is a schematic diagram showing aerosol and rectifying gas injected from the injection nozzle of the aerosol deposition film forming apparatus of the first embodiment. 6A to 6F are cross-sectional views showing a method of manufacturing a ceramic capacitor using the film forming apparatus of the first embodiment in the order of steps. FIG. 7A is a sectional view showing an example of the shape of the aerosol injection port, and FIG. 7B is a plan view of the aerosol injection port. FIG. 8 is a schematic diagram showing a configuration of an aerosol deposition film forming apparatus according to the second embodiment of the present invention. FIG. 9A is a cross-sectional view showing an injection nozzle of an aerosol deposition film forming apparatus according to a third embodiment of the present invention, and FIG. 9B is a plan view when the injection nozzle is viewed from the injection port side. It is. FIG. 10 is a schematic diagram showing the rectifying gas injected from the rectifying gas injection port and the aerosol injected from the aerosol injection port.

Explanation of symbols

11, 22, 71 ... injection nozzle,
12, 24, 61 ... substrate,
13 ... fine particles,
14, 29 ... membrane,
21 ... deposition chamber,
23 ... stage,
25. Stage drive unit,
26 ... vacuum pump,
27 ... Mechanical booster,
31 ... Aerosol generator,
32, 53 ... Raw material powder,
33 ... Exciter,
34 ... Gas cylinder,
41, 42, 43, 44, 45 ... piping,
51, 72a, 72b, 72c ... aerosol injection port,
52, 73a, 73b, 73c, 73d ... Rectification gas injection port,
62 ... Conductor film,
63 ... lower electrode,
64: Ceramic membrane,
65: Upper electrode.

Claims (5)

An aerosol generating unit for generating an aerosol by mixing raw material powder and a carrier gas;
A deposition chamber;
A substrate mounting portion disposed in the film forming chamber;
A rectifying gas supply unit for supplying the rectifying gas;
An aerosol injecting unit that injects the aerosol generated by the aerosol generating unit toward a substrate mounted on the substrate mounting unit to form a film;
A rectifying gas injection unit that is arranged around the aerosol injection unit and injects the rectification gas supplied from the rectification gas supply unit around the aerosol injected from the aerosol injection unit in the same direction as the injection direction of the aerosol; Have
A film forming apparatus , wherein a pipe for supplying an assist gas for adjusting a flow rate of the aerosol is connected to a middle of a pipe for sending the aerosol generated in the aerosol generating section to the aerosol injecting section .   The film forming apparatus according to claim 1, wherein the rectifying gas injection unit is provided in an annular shape around the aerosol injection unit.   2. The film forming apparatus according to claim 1, wherein a plurality of the aerosol injection units are provided, and each of the aerosol injection units is supplied with an aerosol containing different raw material powders. Placing the substrate in a reduced pressure atmosphere;
An aerosol formed by mixing raw material powder and carrier gas is sprayed toward the substrate, and a rectifying gas is sprayed around the aerosol in the same direction as the aerosol spraying direction to form a film on the substrate. and a step of,
A method for manufacturing an electronic component, comprising supplying an assist gas for adjusting a flow rate of the aerosol in a middle of a pipe through which the aerosol passes .   5. The method of manufacturing an electronic component according to claim 4, wherein ceramic fine particles are used as the raw material powder.

Images