JP5092221B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component, which includes a step of extruding an inorganic powder-containing paste from a die by forced pressurization and printing it on a substrate through a screen plate.

  Conventionally, as a screen printing method, a printing paste is uniformly applied by a doctor on a screen plate on which a desired printing pattern is formed, and then the screen plate is slid while pressing a rubber plate using a rubber squeegee, and only a predetermined pattern portion is obtained. There is a method of printing by passing a printing paste and transferring it to a substrate. In recent years, in this screen printing method, for example, in the field of electronic components, with the miniaturization and high functionality, formation of a fine and high aspect ratio pattern for fine wiring has been demanded. Since such a fine and high aspect ratio pattern shape is difficult to process by the conventional screen printing method, a tip opening for discharging the printing paste is provided in the printing squeegee, and the printing paste communicating with the tip opening is used. Provided with a supply path and a pressure tank and a pressure pump as pressure supply means that pressurizes and supplies the print paste to the supply path, and forcibly discharges the print paste from the front end opening of the printing squeegee A method of printing using a forced pressure printing squeegee configured as described above has been proposed (for example, see Patent Document 1).

  On the other hand, as a printing paste used for conventional screen printing, a paste in which the viscosity, thixotropy, and yield value of a paste made of an inorganic powder, a binder resin, and an organic solvent are controlled is known (for example, Patent Documents 2 and 3). 4).

  However, when these printing pastes are used in a screen printing machine that presses the printing paste from a die through a screen plate onto a substrate by forcible pressurization, even when a fine pattern can be printed, There are problems that the pattern is changed and the pattern is not fine, blurring or blurring occurs during printing, and film thickness and line width vary within the substrate surface. These problems are presumed to be due to a mismatch between the printing method and the flow characteristics of the printing paste.

Patent Document 5 discloses a conductive paste for electrically connecting conductor layers formed between different layers of a ceramic multilayer substrate to form via holes straddling different layers and filling the via holes. A conductive paste having a storage elastic modulus (G ′) that is equal to or greater than a loss elastic modulus (G ″) has been proposed by measuring dynamic viscoelasticity. When the printing paste was printed from the die through the screen plate, a fine pattern could not be formed.
JP-A-11-268236 Japanese Patent No. 2802622 JP-A-6-139815 JP 2003-288882 A JP 2004-63104 A

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and to provide a method for manufacturing an electronic component capable of forming a fine pattern with a high aspect ratio.

That is, the present invention is a method for producing an electronic component comprising a step of extruding a paste containing at least an inorganic powder and a binder polymer from a die by forcible pressurization and printing on a substrate through a screen plate, The ratio (G ″ / G ′) of the loss elastic modulus (G ″) to the storage elastic modulus (G ′) in vibration measurement at an angular frequency of 1 rad / sec at 25 ° C. is in the range of 1.61 to 1.79 . This is a method for manufacturing an electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic component which can form a fine and high aspect-ratio pattern can be provided.

  As a method of extruding an inorganic powder-containing paste from a die by forcible pressurization and printing on a printing material through a screen plate, a known method can be applied, and is not particularly limited. Provided with a paste tank and a pressure pump as a pressurizing supply means for pressurizing and supplying the print paste to the supply path. The printing paste is forcibly discharged from the tip opening of the printing squeegee by pressurization, a flexible tube body is disposed in the gap between the printing squeegee and the printing paste scraping scraper, A tube clamp mechanism that can press the tube body is provided at the tip of the tube body, and a pressure printing die and a screen. And a method of printing using what like having a pressing member capable of controlling the adhesion of the over down plate and the substrate.

As a paste used in the method for manufacturing an electronic component of the present invention, a ratio (G ″ / G) of a loss elastic modulus (G ″) and a storage elastic modulus (G ′) in vibration measurement at an angular frequency of 1 rad / sec at 25 ° C. ') Must be within the range of 1.61-1.79 .

When G ″ / G ′ is within the range of 1.61 to 1.79 , bleeding, blurring, and repelling during printing can be prevented, and a fine pattern can be obtained. Variations in the substrate surface are suppressed, and a fine pattern can be formed uniformly in the substrate surface. When G ″ / G ′ is less than 1, the surface after printing becomes rough, and variations in the substrate surface in film thickness and line width occur. growing. On the other hand, if the number exceeds 8, creases occur during printing, and pattern printing becomes difficult .

  These characteristics can be measured using a known rheometer. An example is a rheometer of Visco Analyzer VAR-50 manufactured by Jusco International. The measurement conditions in the present invention are values measured at a gap of 1 mm using a parallel plate for the measurement temperature of 25 ° C. and the geometry.

  The paste used in the method for producing an electronic component of the present invention contains at least an inorganic powder and a binder resin. The binder resin is necessary for imparting fluidity to the paste and obtaining good printability. Moreover, a desired function can be provided to an electronic component by selecting the inorganic powder according to the purpose as described later.

  When the method for manufacturing an electronic component of the present invention is used for forming an electrode, a dielectric layer, or an insulating layer, an organic pattern such as a binder resin is removed by baking after performing the above-described printing, thereby obtaining an inorganic pattern. Can do.

  The paste used in the method for producing an electronic component of the present invention contains at least an inorganic powder, a binder resin, and an organic solvent, and the content of the inorganic powder is preferably in the range of 85 to 98% by mass in the paste. More preferably, it exists in the range of 90-95 mass%. By setting the content of the inorganic powder within the above range, a paste having G ″ / G ′ of 1 to 8 can be easily obtained. When the content of the inorganic powder exceeds 98% by mass, the inorganic powder is contained. On the other hand, when the content of the inorganic powder is less than 85% by mass, there is a problem that the firing shrinkage ratio is increased and G ″ / G ′ is 8 There is a case where the size becomes larger and a pattern of fine wiring cannot be obtained.

  The inorganic powder is appropriately selected depending on the target paste. For example, as a paste for forming a dielectric layer, an insulating layer, or the like of an electronic component, glass powder, ceramic powder, or a mixture of glass powder and ceramic powder can be used. The glass powder has a softening temperature of 900 ° C. or lower, preferably 350 to 800 ° C. Glass having a softening temperature of 350 ° C. or lower has low chemical stability, and when the softening temperature is 900 ° C. or higher, it is difficult to sufficiently soften the substrate. Any glass powder having a softening temperature of 800 ° C. or lower, preferably 350 to 800 ° C. can be used without any particular limitation. However, when glass powder containing an alkali metal is used, the substrate glass is used during firing. Since the substrate may be warped by the ion exchange reaction with, the content of alkali metal in the glass powder is preferably 10% by mass or less. Ceramic powders that do not soften at a firing temperature of about 500 to 1000 ° C. can be widely used, and ceramic powders such as alumina, magnesia, calcia, cordierite, silica, mullite, zircon, and zirconia can be exemplified. In addition, an inorganic pigment may be included for identifying the insulating layer when multilayering. In the case of black, it is made of a compound such as Co—Cr—Fe, Co—Mn—Fe, Co—Cu—Mn, Co—Ni—Mn, Co—Ni—Cr—Mn, and Co—Ni—Cu—Mn. Black pigment, in the case of blue, Co-Al, Co-Al-Cr, Co-Al-Si, Zr-Si-V, Co-Zn-Si, Co-Zn-Al, Co-Zr-V, Co- For Si, green, Ca-Si-Cr, Sn-Zr-V, Zr-Si-Pr-V, Zr-Si-Pr-Cr-Fe, Cr-Al, Zr-Si-Pr-Cr, Cr In the case of -Co-Al-Zn, Cr-Al-Si, and vermilion, pigments such as Al-Mn, Al-Cr-Zn, Sn-Cr, and Zr-Si-Fe can be used. The amount of the pigment added depends on the type of pigment, but is usually preferably in the range of 0.1 to 40% by mass with respect to the entire paste.

  Metal powder can be used in the paste for forming the conductive layer of the electronic component. As the metal powder, a material selected from the group of Ag, Au, Pd, Ni, Cu, Al and Pt can be preferably used. These may be in a single state or an alloy state.

  The particle diameter of these inorganic powders is selected in consideration of the thickness and line width of the layer to be produced. The center diameter of the volume-based distribution is 0.05 to 5 μm and the maximum particle size is 15 μm or less. preferable.

  The paste used in the method for producing an electronic component of the present invention is fired after pattern printing, especially when an inorganic pattern is formed. The binder resin used is oxidized or / and decomposed or / and vaporized during firing, and the carbide remains in the inorganic substance. It is preferable that the cellulose resin such as ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose butyrate, or methyl (meth) acrylate, ethyl (meth) acrylate, normal butyl (meth) acrylate, Acrylic resin comprising a polymer or copolymer such as isobutyl (meth) acrylate, isopropyl (meth) acrylate, 2-ethylmethyl (meth) acrylate, 2-hydroxylethyl (meth) acrylate, poly- - methyl sulfone, polyvinyl alcohol, polybutene and the like are preferably used.

  The binder resin preferably has a weight average molecular weight in the range of 100,000 to 3,000,000, more preferably in the range of 150,000 to 2,000,000, and still more preferably in the range of 200,000 to 1,000,000. When the weight average molecular weight of the binder resin is within this range, it becomes easy to set G ″ / G ′ to 1 to 8. When the weight average molecular weight is less than 100,000, the paste viscosity becomes low. May cause problems such as non-uniform composition and sedimentation of inorganic powder, etc. On the other hand, when the weight average molecular weight exceeds 3 million, it is difficult to disperse and knead when preparing the paste, making it possible to produce a paste with a uniform composition. In addition, the weight average molecular weight can be measured using a photorefractive method in gel permeation chromatography, and a polystyrene standard so that the molecular weight of a sample to be measured can be interpolated as a reference for molecular weight measurement. Create a calibration curve using the substance.

  Moreover, what has functional groups, such as a carboxyl group, a hydroxyl group, a mercapto group, an amide group, an amino group, can preferably be used for binder resin. By using a binder resin having such a functional group, the adsorptivity to the surface of the inorganic powder is improved, and the expression of G ″ / G ′ can be made 1 to 8 can be facilitated. Control of G ″ / G ′ can be facilitated by the amount.

  In particular, the binder resin preferably has a hydroxyl group and / or a carboxyl group. Examples of the binder resin having a hydroxyl group include a copolymer obtained by polymerizing another monomer copolymerizable with a monomer having a hydroxyl group as a main copolymerizable monomer. As the monomer having a hydroxyl group, hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, Examples include 4-hydroxybutyl (meth) acrylate, glycerol (meth) acrylate, dipentaerytriol mono (meth) acrylate, and the like. Examples of monomers copolymerizable with these monomers having a hydroxyl group include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl. Examples include (meth) acrylate, sec-butyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, stearyl (meth) acrylate, and the like. The hydroxyl value of the resulting resin having a hydroxyl group is preferably in the range of 2-50, more preferably in the range of 3-20.

  The binder resin containing a carboxyl group can be obtained by copolymerizing the monomer and an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value of the obtained resin having a carboxyl group is preferably in the range of 2 to 45, more preferably 3 to 40. If the acid value is less than 2, the adsorptivity to the surface of the inorganic powder may be insufficient, and G ″ / G ′ tends to be smaller than 1. Also, if the acid value exceeds 45, the inorganic powder There is a problem that the reaction with and becomes gelled.

  The content of the binder resin is preferably in the range of 2 to 30% by mass, more preferably in the range of 4 to 28% by mass, and still more preferably in the range of 5 to 25% by mass with respect to the entire paste.

  Examples of the organic solvent include diethylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol mono-2-ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate. Rate, 2,2,4-trimethyl-1,3-pentanediol diisobutyrate, 2-ethyl-1,3-hexanediol, terpineol, benzyl alcohol, 1-butoxy-2-propane, 1,2-diacetoxy Propane, 1-methoxy-2-propanol, 2-acetoxy-1-ethoxypropane, (1,2-methoxypropoxy) -2-propanol, (1,2-ethoxypropoxy) -2-propanol, 2-hydride Xyl-4-methyl-2-pentanone, 3-methoxy-3-methylbutyl acetate, 2-methoxyethanol, 2-ethoxyethanol, 2- (methoxymethoxy) ethanol, 2-isopropoxyethanol, 2-butoxyethanol, 2 -(Isopentyloxy) ethanol, 2- (hexyloxy) ethanol, 2-phenoxyethanol, 2- (benzyloxy) ethanol, benzyl alcohol, furfuryl alcohol, tetrafurfuryl alcohol, 2,2'-dihydroxydiethyl ether, 2 -(2-methoxyethoxy) ethanol, 2- [2- (2-methoxyethoxy) ethoxy] ethanol, 2-methyl-1-butanol, 3-methyl-2-butanol, 2-methyl-1-pentanol, 4 -Methyl-2-pentanol 2-ethyl-1-butanol, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2-butoxyethyl acetate, 2-phenoxyethyl acetate, 1,2-dimethoxyethane, 1,2-diethoxyethane, 1, 2-dibutoxyethane, cyclohexanenone, methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, 1-methylpentyl acetate, 2-ethylbutyl acetate, 2-ethylhexyl acetate, cyclohexyl acetate, benzyl acetate, hexane, cyclohexane , Methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, methyl isobutyl ketone, 2-heptanone, 4-heptanone, diisobutyl ketone and the like can be preferably used. The organic solvent is selected by selecting mainly considering the volatility of the organic solvent and the solubility of the binder resin to be used. If the solubility of the solvent in the binder resin is low, the viscosity of the coating liquid tends to be high even if the solid concentration in the paste is the same, and the coating properties tend to be deteriorated. If the content of the organic solvent in the paste is too small, the viscosity of the paste becomes so high that it is difficult to remove bubbles from the coating film, and the smoothness of the coated surface tends to be poor. On the other hand, when the amount is too large, the sedimentation of the inorganic powder particles is accelerated, and it becomes difficult to stabilize the composition of the paste containing the inorganic powder, and there is a tendency to cause problems such as requiring a lot of energy and time for drying. Therefore, the preferable content rate of a solvent is 5-35 mass% in a paste, More preferably, it is 10-30 mass%.

  The paste used in the method for producing an electronic component of the present invention includes, as other components, addition of a plasticizer, an antioxidant, an antifoaming agent, a dispersant, a leveling agent, an ultraviolet absorber, a polymerization inhibitor, a thixotropic agent, and the like. Although a physical component may be contained, it is particularly effective in the present invention to contain a dispersant.

  The paste used in the method for manufacturing an electronic component according to the present invention has a high inorganic powder content, so that it is difficult to uniformly disperse the inorganic powder and it is difficult to control the flow characteristics, but a dispersant should be used appropriately. Thus, dispersibility is improved and flow characteristics are easily controlled. As a result, it becomes easy to set G ″ / G ′ to 1-8.

  Dispersants used include fatty acid soaps, N-acyl amino acids and salts thereof, polyoxyethylene alkyl ether carboxylates, carboxylates such as acylated peptides, alkyl benzene sulfonates, alkyl naphthalene sulfonates, dialkyl sulfosuccinates Salts, sulfosuccinic acid alkyl disalts, polyoxyethylene alkyl sulfosuccinic acid disalts, sulphonates such as alkyl sulfoacetates, α-olefin sulfonates, higher alcohol sulfates, polyoxyethylene alkyl ether sulfates, polyoxy Sulfate esters such as ethylene fatty acid alkanolamide sulfate, polyoxyethylene alkylphenyl ether sulfate, monoglyculate, sulfate ester salt of fatty acid alkylol amide, polyoxyethylene alcohol Anionic dispersants such as phosphate ether salts such as ether phosphate, polyoxyethylene alkylphenyl ether phosphate, alkyl phosphate, polyoxyethylene alkyl ether, polyoxyethylene secondary alcohol ether, polyoxyethylene alkyl Ether type such as phenyl ether, polyoxyethylene sterol ether, polyoxyethylene polyoxypropylene block copolymer, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene glycerin fatty acid ester, polyoxyethylene castor oil and hydrogenated castor oil, polyoxy Ester ether type such as ethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, polyethylene glycol fatty acid ester, ethylene Nonionic dispersants such as glycol fatty acid esters, glycerin fatty acid esters, polyglycerin fatty acid esters, sorbitan fatty acid esters, propylene glycol fatty acid esters, fatty acid amine salts and their quaternary ammonium salts, benzalkonium chloride, chloride Although effects may be seen even with cationic dispersants such as benzethonium, pyridinium salts, imidazolinium salts, etc., the effect is particularly observed when a dispersant of a polycarboxylic acid compound is used.

By using a polycarboxylic acid compound dispersant, it is possible to easily obtain a paste having G ″ / G ′ of 1.61-1.79 by increasing the compatibility of various components in the paste containing the inorganic powder. Examples of the polycarboxylic acid compound include a carboxylate of polyoxyethylene alkyl ether, a carboxylate of polyoxyethylene phenyl ether, a compound having a carboxyl group and a salt thereof at one end of a polyoxyalkylene group, an unsaturated group An alkylene oxide ester of a carboxylic acid having a salt, a copolymer of an acrylate ester having a salt-forming group and a copolymerizable monomer having an unsaturated group, and a polyalkylene glycol alkenyl ether monomer and a maleic acid monomer Examples thereof include a copolymer of these monomers and a copolymerizable monomer.

In addition, it is also effective to add an amine compound to the paste used in the method for manufacturing an electronic component of the present invention to adjust G ″ / G ′ to 1.61-1.79 . Specifically, 3- (2-ethylhexyloxy) propylamine, 3- (dibutylamino) propylamine, di-2-ethylhexylamine, 3- (diethylamino) propylamine, 3-ethoxypropylamine and the like can be exemplified.

  The inorganic powder-containing paste in the present invention is prepared by mixing various components so as to have a predetermined composition, and then predispersed by a mixer such as a planetary mixer, and then a kneader such as a three-roller or a media disperser such as a bead mill. Use to disperse and make.

  Next, as an electronic component manufacturing method, a laminated electronic component will be described as an example. Examples of the multilayer electronic component include a coil, a capacitor, a transformer, a common mode choke coil, a balun, a directional coupler, and a filter in which a plurality of elements are integrated. For example, insulating layers and conductor patterns are alternately laminated, and conductor patterns between insulating layers are connected to form a coil in the laminate. Both ends of the coil are drawn out to the end face of the coil and connected to external electrodes provided on the end face of the laminate. Such a laminated electronic component is formed by a printing lamination method in which an insulating layer and a conductor pattern are sequentially printed, or a sheet lamination method in which sheets on which a conductive pattern is printed are laminated. The printing process of the present invention can be suitably used for sequential printing in the printing lamination method and conductive pattern printing on a sheet. Firing may be performed for each layer formation, but may be collectively performed at the end. The firing atmosphere and temperature vary depending on the type of paste and substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace, a belt-type continuous firing furnace, or the like can be used. The firing temperature is 600 to 1000 ° C.

  In recent years, there has been a demand for reducing the line width and spacing of conductive patterns in order to reduce the size, weight, and performance of electronic components, and the diameter of through holes provided in insulating layers to connect conductive patterns between insulating layers has been reduced. For the demand, the method for manufacturing an electronic component of the present invention is effective.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these Examples.

(1) Printing machine New Long Seimitsu Kogyo printing machine An LZ9764 type printing head part was used instead of a pressure printing base. A solvent-resistant urethane rubber plate was attached to the tip material of the base, and was further screwed with metal fittings for reinforcement. A pressing member was attached at a rear position with respect to the traveling direction of the base. The material of the pressing member was a roller shape (material: silicon, hardness: 80 °, solvent resistance specification).
The printing conditions are as follows.
Pressurized printing die push-in amount: 2mm
Pressurizing printing base indentation pressure: 0.3 MPa
Printing speed: 40mm / s
Presser member push-in amount: 2 mm
Holding member pushing pressure: 0.3 MPa
Base-pressing member interval: 80 mm
Clearance amount: 2mm
(2) Screen version As the screen mask, a 400 mesh mesh mask made by Nakanuma Art Screen and a stainless steel bowl having a wire diameter of 23 μm and having an emulsion thickness of 20 μm was used. The plate tension was 0.8 mm. Five types of pattern structures of line / pitch = 20/20 μm, 40/40 μm, 60/60 μm, 80/80 μm, and 100/100 μm were prepared.

(3) Printing paste The paste composition was prepared by mixing and kneading the components shown in Table 1 with a planetary mixer and a three-roll mill.
a: Silver powder (G-17, manufactured by Dowa Mining Co., Ltd.)
b: Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., TSP03)
c: Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., MTR-103)
d: Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., TSP10)
e: Polymer (Fujikura Kasei Co., Ltd. acrylic polymer, MTR-47)
f: Polymer (Fujikura Kasei Co., Ltd. acrylic polymer, MTR-30)
g: Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., MTR-32)
h: polymer (ethyl cellulose, N-10, manufactured by Hercules)
i: Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., MTR-38)
j: Polymer activator of polycarboxylic acid compound (manufactured by Kyoeisha Chemical Co., "Floren" G-700)
k: polyether ester type anionic activator (manufactured by Enomoto Kasei Co., Ltd., “Disparon” 7004)
l: Diethylene glycol monobutyl ether acetate (manufactured by Kyowa Hakko Kogyo Co., Ltd.)
m: Turpineol (manufactured by Yasuhara Chemical)
n: 3- (2-ethylhexyloxy) propylamine (manufactured by Wako Pure Chemical Industries, Ltd.)
(4) Viscoelasticity measurement A rheometer of Visco Analyzer VAR-50 manufactured by Jusco International was used. The measurement conditions are values measured at a measurement temperature of 25 ° C., using a parallel plate as a geometry, with a gap of 1 mm and an angular frequency of 1 rad / sec.

(5) Printed material A 100 μm thick PET film (U426, Toray) was used. The surface of the film is coated with an easy adhesion layer mainly composed of an acrylic resin in order to improve the adhesiveness of the printing paste.

(6) Evaluation of printing pattern Among printing plates capable of pattern formation using the pastes of Examples and Comparative Examples, evaluation was performed using a printing pattern obtained using a printing plate having the smallest line width. It was. The line width of the print pattern was measured at 9 locations in the plane, and the average value was obtained. In addition, the difference between the maximum value and the minimum value of the line widths at the nine points of each sample was obtained and used as the in-plane variation of the line width. The measurement was performed with an optical microscope and an electron microscope (S-2400 Hitachi Instrument Service). The presence / absence of bleed / repellency was observed using an optical microscope. The bleed was observed when the boundary of the print line was unclear, and the paste was scattered along the print line.

(7) Manufacturing method of electronic component The multilayer inductor was produced as an electronic component. First, the following insulating paste was printed and dried, and then the insulating paste and the conductive paste of Table 1 were alternately printed and laminated in the same manner, and dried to obtain a green laminate (thickness of conductive layer 15 μm, insulating layer) Film thickness of 40 μm). Next, the green laminate was cut into a green chip, and then fired in air at 870 ° C. to produce an inductor.

Insulating paste: SiO ₂ (38 mass%), Al ₂ O ₃ (35 mass%), B ₂ O ₃ (9 mass%), MgO (5 mass%), CaO (5 mass%), BaO (5 mass%) ), A softening point of 795 ° C. made of other oxides (3% by mass), a glass powder having a central particle diameter of 1 μm, a maximum particle diameter of 5 μm, 65% by mass, a central diameter of 75 nm, a maximum diameter of 180 nm, and a spherical powder of 94% of 15%. %, Polymer (acrylic polymer manufactured by Fujikura Kasei Co., Ltd., MTR-103) 5% by mass, diethylene glycol monobutyl ether acetate (manufactured by Kyowa Hakko Kogyo Co., Ltd.) 14% by mass, polymer activator of polycarboxylic acid compound (manufactured by Kyoeisha Chemical Co., Ltd., “ "Floren" G-700 1% by mass mixed and kneaded with a planetary mixer and three roll mill.

Examples 1-4
Conductive pastes having the compositions shown in Table 1 were prepared and evaluated for printing patterns. G ″ / G ′ of the obtained conductive paste was 1.61 to 1.79. In the print pattern evaluation, the pattern finished was 22 in average value of the line width with respect to the pattern width of 20 μm of the screen plate used. The in-plane variation (maximum value-minimum value) was 2 μm, and the plate separation characteristics at the time of application were good, and the plates were evenly separated when passing through the pressing member. When the multilayer inductor was produced using the electrically conductive paste of Examples 1-4 and the Q value was measured, the high value of 15-50 was obtained at 800 MHz.

Comparative Examples 4 and 5
Conductive pastes having the compositions shown in Table 1 were prepared and evaluated for printing patterns. G ″ / G ′ of the obtained paste was 2.32 and 6.25. A screen plate having a pattern width of 20 μm was used but could not be formed. A screen plate having a pattern width of 40 μm was almost a screen plate. While the pattern could be formed in a pattern Street, plate separation characteristics at plane variation was achieved slightly larger. coating, were uniformly plate away when the pressing member passes is good. Next, Comparative example When the multilayer inductor was produced using the conductive paste of No. 4 and Comparative Example 5 and the Q value was measured, a high value of 15 to 50 was obtained at 800 MHz.

Comparative Examples 6-9
Conductive pastes having the compositions shown in Table 1 were prepared and evaluated for printing patterns. G ″ / G ′ of the obtained conductive paste was 1.04 to 1.20. In the printing pattern evaluation, it could not be formed with a screen plate with a pattern width of 20 μm, but with a screen plate with a pattern width of 40 to 80 μm. However, the pattern formation was possible, but the in-plane variation was relatively large, and the plate separation characteristics at the time of application were good, and the plates were separated evenly when passing through the pressing member. Moreover , when the laminated inductor was produced using the electrically conductive paste of Comparative Examples 6-9 and the Q value was measured, the high value of 15-50 was obtained at 800 MHz.

Comparative Examples 1 and 2
Conductive pastes having the compositions shown in Table 1 were prepared and evaluated for printing patterns. G ″ / G ′ of the obtained conductive paste was 0.81 and 0.97. In the printing pattern evaluation, a screen plate having a pattern width of 20 to 80 μm was used, but no pattern was formed. When a screen plate of 100 μm was used, a temporary pattern was formed, but there were many disconnections, and there was a large in-plane variation. Sometimes the plate could not be evenly separated.

  Next, multilayer inductors were produced using the conductive pastes of Comparative Example 1 and Comparative Example 2, and the Q value was measured, but the measurement could not be performed.

Comparative Example 3
Conductive pastes having the compositions shown in Table 1 were prepared and evaluated for printing patterns. G ″ / G ′ of the obtained conductive paste was 8.3. In the printing pattern evaluation, a screen plate having a pattern width of 20 to 100 μm was used, but pattern formation was not possible. Next, Comparative Example 2 A multilayer inductor was manufactured using the conductive paste of No. 4, and the Q value was measured, but measurement was not possible.

Claims (4)

A method for producing an electronic component comprising a step of extruding a paste containing at least an inorganic powder and a binder polymer from a die by forcible pressing, and printing on a substrate through a screen plate, the angular frequency of the paste at 25 ° C. A ratio (G ″ / G ′) of loss elastic modulus (G ″) and storage elastic modulus (G ′) in vibration measurement at 1 rad / sec is in a range of 1.61 to 1.79. Manufacturing method of electronic components. The method for producing an electronic component according to claim 1, wherein the inorganic powder contained in the paste is at least one selected from glass, ceramics, metal, and metal oxide. The method for producing an electronic component according to claim 1 or 2, wherein the binder resin contained in the paste has a hydroxyl group and / or a carboxyl group. The manufacturing method of the electronic component in any one of Claims 1-3 in which a paste contains a polycarboxylic acid compound.