JP5085429B2 - Circuit unit heat dissipation structure - Google Patents

Description

  The present invention relates to a heat dissipation structure for a circuit unit constituting a communication device or the like mounted on a flying object such as an aircraft.

  In general, in a circuit unit, a heat generating component such as an electronic component is mounted on a printed wiring board to constitute a desired electronic device such as a communication device. In such a circuit unit, a plurality of units are respectively housed in a plurality of housing grooves provided in the device housing and arranged side by side to construct a desired electronic device system.

  By the way, such a circuit unit generates heat when a heat-generating component mounted on the printed wiring board is driven, and when the temperature rises, the performance deteriorates. There is a need for thermal control of components.

  Therefore, in this circuit unit, heat from the heat-generating components of each unit is transported to the device housing via the heat conducting member so that heat can be controlled at the same time, and is transported to the device housing. Heat control is performed using a so-called indirect air-cooling heat dissipation structure that discharges the heat outside the device housing.

As such a heat dissipation structure, for example, a guide plate having a guide groove is provided in the chassis, and a retainer having a corrugated contact surface of the electronic circuit module is inserted into the guide groove of the guide plate, and the contact is made. There is known a configuration in which the heat of the electronic circuit module is transported to the guide groove of the guide plate via the retainer by bringing the surfaces into contact (for example, see Patent Document 1). Then, cool air is supplied from the outside into the guide plate of the chassis, and the cool air is exhausted from the exhaust port of the chassis, whereby heat control of the electronic circuit module is performed.
JP-A-8-195572

  However, the heat dissipation structure disclosed in Patent Document 1 is configured to increase the heat dissipation efficiency by bringing the wavy contact surface of the retainer into contact with the guide groove of the chassis to reduce the thermal resistance at the contact portion. If the performance of the heat-generating component is improved as requested recently and the heat generation is further increased, the heat control becomes difficult.

  The present invention has been made in view of the above circumstances, and it is possible to reduce the contact thermal resistance with a simple configuration, so that improvement in heat dissipation efficiency can be realized while ensuring miniaturization. An object of the present invention is to provide a heat dissipation structure for a circuit unit.

The present invention is mounted on a circuit unit in which a heat generating component is mounted on a printed wiring board, a device housing provided with a receiving groove into which the circuit unit is inserted, and a component mounting surface of the circuit unit. A frame member having a thermal coupling portion accommodated in the accommodation groove, and a frame member that is attached to the frame member and thermally coupled thereto, wherein a gap is formed in the thermal coupling portion of the frame member. A heat conducting member for conducting heat from the heat generating component of the circuit unit provided with a heat coupling portion that is opposed to and accommodated in a housing groove of the device housing, and the frame member and the heat conducting member. A fixing means for fixing to the circuit unit, and a heat coupling portion of the heat conducting member and a heat coupling portion of the frame member are interposed between the heat coupling portion and freely accommodated in the accommodating groove . Thermal coupling Pressure, to constitute a heat dissipation structure of a circuit unit and a mounting member for pressing is divided into side walls of different side walls of the housing groove of the equipment cabinet.

  According to the above configuration, in the circuit unit, with the frame member and the heat conducting member being fixed via the fixing means, each thermal coupling portion is press-contacted to the housing groove of the device casing independently by the mounting member. By being thermally coupled in two paths, a large contact area with the device casing can be taken, and the thermal contact resistance in the heat transport path can be set small. Therefore, high-efficiency heat dissipation can be realized while ensuring miniaturization, and the performance of the heat-generating component can be easily improved.

  As described above, according to the present invention, a circuit unit that can reduce the contact thermal resistance with a simple configuration, and can achieve improvement in heat dissipation efficiency while ensuring miniaturization. The heat dissipation structure can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a heat dissipation structure for a circuit unit according to an embodiment of the present invention. An apparatus housing 10 is mounted on an aircraft, for example, and is used for use. A plurality of pairs of concave receiving grooves 11 are arranged in parallel at a predetermined interval.

  In addition, in the device casing 10, two systems of air passages 12 formed in the direction in which the housing grooves 11 are arranged in parallel are provided in each base portion of the plurality of pairs of housing grooves 11. For example, fins are internally provided in the two air passages 12, one end of which is communicated with an air intake port (not shown) provided on one wall surface of the device housing 10, and the other end is connected to the device housing 10. Is communicated with an air exhaust port 13 provided on the other wall surface.

  As a result, when the cold air is supplied to the air intake port (not shown), the two air passages 12 take the heat of the surroundings while moving through the fins and exhaust from the air exhaust port 13. Then, with this cold air, the heat transported to the pair of housing grooves 11 of the device housing 10 is exhausted to the outside as will be described later.

  Between the plurality of pairs of receiving grooves 11 of the device casing 10, the circuit units 14 are inserted and housed side by side, for example, so as to be installed. In this circuit unit 14, an electronic circuit component 141, which is a heat generating component, is mounted on a printed wiring board 142 to form a desired electronic circuit. A frame-shaped frame member 15 and a plate-shaped heat conduction member 16 are sequentially attached on the component mounting surface of the circuit unit 14 (see FIG. 2).

  Among them, the frame member 15 is formed by, for example, two regions connected so as to avoid the mounting position of the electronic circuit component 141 of the circuit unit 14, and the thermal coupling portions 151 are formed at both ends of the device housing 15. The pair of receiving grooves 11 of the body 10 are detachably provided. In the frame member 15, a plurality of mounting holes 152 are formed corresponding to the mounting holes 143 provided in the printed wiring board 142 of the circuit unit 14.

  Note that the frame member 15 is not limited to the frame structure formed separately in two regions. For example, the frame member 15 may surround the electronic component circuit 141 according to the mounting structure of the electronic circuit component 141 of the circuit unit 14. What is formed into a frame shape that can be used is used.

As shown in FIGS. 3 to 5, a plurality of mounting holes 161 are formed in the heat conducting member 16 corresponding to the mounting holes 143 of the printed wiring board 142 and the mounting holes 152 of the frame member 15 . Further, on both side portions of the heat conducting member 16, thermal coupling portions 162 are respectively provided corresponding to the pair of receiving grooves 11 of the device casing 10.

  The heat coupling portion 162 is provided, for example, so as to be deformable (see FIG. 5). When the heat coupling portion 162 is housed in the housing groove 11, the heat coupling portion 162 is sandwiched by a fastening member 17 called a well-known wedge lock. It is arranged opposite to the thermal coupling portion 151. When the mounting member 17 is tightened, the heat coupling portion 151 of the frame member 15 and the heat coupling portion 162 of the heat conducting member 16 are pressed against the side wall of the housing groove 11 when the mounting member 17 is tightened. It is thermally coupled to the side wall of the housing groove 11 of the housing 10.

  At this time, the heat coupling portion 162 of the heat conducting member 16 is pressed against the elastic force by the mounting member 17 and elastically deformed, so that it is pressed against the side wall of the housing groove 11 and has a small thermal contact resistance. The contact arrangement can be ensured.

  In the above configuration, the frame member 15 and the heat conducting member 16 are sequentially placed on the component mounting surface of the printed wiring board 142 of the circuit unit 14, and the mounting member 17 is interposed between the heat coupling portions 151 and 162. The

  In this state, for example, the screw member 18 is inserted into the heat conduction member 16 from the attachment hole 161 of the heat conduction member 16, and the screw member 18 is screwed into the attachment hole 152 of the frame member 15. Mounted on the surface of. The frame member 15 has a screw member 19 inserted through the mounting hole 143 of the printed wiring board 142 of the circuit unit 14 in the mounting hole 152, and the printed wiring on the other surface side. A substrate 142 is attached (see FIG. 2, where the screw member 19 is screwed to the screw member 18 in a state shifted in the paper surface direction). In this way, the frame member 15 and the heat conducting member 16 are assembled integrally with the circuit unit 14.

  Note that the frame member 15 and the heat conducting member 16 are, for example, inserted into the mounting hole 152 of the frame member 15 by inserting the screw member 18 from the mounting hole 161 of the heat conducting member 16, for example, and then further printed circuit board. 142 is inserted into the mounting hole 143 of 142. Then, a nut member may be screwed to the distal end portion of the screw member 18 so that the frame member 15 and the heat conducting member 16 are integrally assembled to the circuit unit 14.

  Here, the mounting member 17 interposed between the frame member 15 and the heat coupling portions 151 and 162 of the heat conducting member 16 is tightened. Then, the heat coupling portion 162 of the heat conducting member 16 is elastically deformed by the mounting member 27 in a direction in which it is urged against the elastic force so as to have a bending allowance.

  In the circuit unit 14, the heat coupling portion 151 of the frame member 15 and the heat coupling portion 162 of the heat conducting member 16 are inserted into the pair of housing grooves 11 of the device housing 10, and a plurality of units are arranged in the device housing 10. Are accommodated in parallel at predetermined intervals.

  Here, the thermal coupling portions of the frame member 15 and the heat conducting member 16 inserted into the housing groove 11 are pressed against the side walls of the housing groove 11 by the mounting members 17, respectively, and the circuit units 14 are respectively connected to the housing grooves 11. The two paths are contacted and thermally coupled. At this time, the heat coupling portion 162 of the heat conducting member 16 is strongly brought into contact with the wall surface of the housing groove 11 of the device housing 10 by the action of the bending allowance, and high-quality heat contact is performed.

  The circuit units 14 arranged in parallel in the device casing 10 generate heat when the electronic circuit component 141 is driven. Then, this heat is thermally transported to the wall surface on each side of the pair of housing grooves 11 of the device housing 10 via the frame member 15 and accommodated in the pair of device housings 10 via the heat conducting member 16. Heat transport is performed through two paths on the other wall surface of the groove 11. Then, cold air is supplied to the air passage 12 of the device casing 10 from the air supply port (not shown), and the cold air is exhausted to the outside from the air exhaust port 13.

  Here, the heat from the circuit unit 14 thermally transported to the housing groove 11 of the device casing 10 is taken away by the cold air passing through the air passage 12 and is exhausted to the outside from the air exhaust port 13 together with the air. As a result, the electronic circuit components 141 of the plurality of circuit units 14 accommodated in the device casing 10 are thermally controlled to a desired temperature.

  Thus, the heat dissipation structure of the circuit unit includes the frame member 15 having the thermal coupling portion 151 accommodated in the housing groove 11 of the device housing 10 on the component mounting surface of the circuit unit 14 and the housing of the device housing 10. The heat conduction members 16 having the heat coupling portions 162 accommodated in the grooves 11 are stacked in order, and the heat coupling portions 162 of the heat conduction members 16 and the heat coupling portions 151 of the frame member 15 are mutually connected. An attachment member 17 that presses and thermally couples the heat coupling portions 151 and 162 to the wall surface of the housing groove 11 of the device housing 10 is interposed, and heat from the electronic circuit component 141 of the circuit unit 14 is transferred to the frame member 15 and the heat. The heat is exhausted through the two paths of the heat coupling portions 151 and 162 of the conductive member 16.

  According to this, in the state where the circuit unit 14 is thermally coupled to the frame member 15 and the heat conducting member 16, each thermal coupling portion 151, 162 is accommodated in the device housing 10 independently by the mounting member 17. By being in pressure contact with the groove 11 and being thermally coupled in two paths, a large contact area with the device housing 10 can be taken, and the thermal contact resistance in the heat transport path can be reduced and set small. it can.

  Thereby, after ensuring the downsizing of the device casing 10, highly efficient heat dissipation is realized, and the performance of the electronic circuit component can be easily improved.

In the above embodiment, a case has been described in which the device housing is applied to a housing groove structure in which a plurality of pairs of recessed housing grooves are provided and a circuit unit is inserted into the pair of housing grooves. Without limitation, it can be applied to other housing groove structures.
Moreover, although the said embodiment demonstrated the case where it comprised so that the air path 12 might be provided in the base of the accommodating groove | channel 11 in the apparatus housing | casing 10 as an air cooling structure, it is not restricted to this air cooling structure, and various other It is also possible to configure using an air cooling structure.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the disassembled perspective view which decomposed | disassembled and showed the principal part of the thermal radiation structure of the circuit unit which concerns on one embodiment of this invention. It is the partial cross section figure which expanded and showed a part of assembly | attachment state of FIG. It is the perspective view which showed the state which took out the heat conductive member of FIG. 1 and was seen from one surface. It is the perspective view which showed the state which took out the heat conductive member of FIG. 1 and was seen from the other surface. It is the perspective view which expanded and showed the thermal coupling part of the heat conductive member of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Equipment housing | casing, 11 ... Accommodating groove, 12 ... Air path, 13 ... Air exhaust port, 14 ... Circuit unit, 141 ... Electronic circuit component, 142 ... Printed wiring board, 143 ... Mounting hole, 15 ... Frame member, 151 DESCRIPTION OF SYMBOLS ... Thermal coupling part, 152 ... Mounting hole, 16 ... Heat conduction member, 161 ... Mounting hole , 162 ... Thermal coupling part , 17 ... Mounting member, 18 ... Screw member, 19 ... Nut member.

Claims (6)

A circuit unit in which a heat generating component is mounted on a printed wiring board;
A device housing provided with a housing groove into which the circuit unit is inserted;
A frame member that is mounted on a component mounting surface of the circuit unit and has a thermal coupling portion that is accommodated in the accommodation groove;
A thermal coupling portion is provided which is deposited on the frame member and thermally coupled, and is opposed to the thermal coupling portion of the frame member with a gap and is accommodated in the accommodation groove of the device casing. A heat conducting member through which heat from the heat generating component of the circuit unit is conducted;
Fixing means for fixing the frame member and the heat conducting member to the circuit unit;
Clamped between the thermal coupling portion of the heat conducting member and the thermal coupling portion of the frame member and accommodated in the accommodation groove, and presses both of the thermal coupling portions by adjusting the tightening, and A mounting member that is pressed into different side walls on both side walls of the body housing groove;
A heat dissipation structure for a circuit unit, comprising: The equipment is housing, heat radiation structure of the circuit unit of claim 1, wherein the air passage for supplying and exhausting the outside air against the housing groove is provided.   3. The heat dissipation structure for a circuit unit according to claim 1, wherein the heat coupling portion of the heat conducting member is provided so as to be elastically deformable.   4. The circuit unit heat dissipation structure according to claim 1, wherein a pair of the housing grooves of the device housing are arranged to face each other at both ends of the circuit unit. 5.   5. The heat dissipation structure for a circuit unit according to claim 4, wherein a plurality of pairs of the housing grooves of the device casing are provided at a predetermined interval.   6. The circuit unit heat dissipation structure according to claim 1, wherein the device casing is mounted on a flying object.

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