JP5064318B2 - Sensor module mounting structure - Google Patents

Description

  The present invention relates to a sensor module mounting structure that is mounted on an air conditioner or the like and detects temperature and humidity.

Sensor modules that detect temperature and humidity are attached to devices such as air conditioners. The sensor module includes a sensor substrate, a temperature sensor and a humidity sensor mounted on the sensor mounting surface of the sensor substrate, and a case in which these are built. A ventilation hole is formed in the case so that the temperature sensor and the humidity sensor are exposed to the outside air. A sensor module equipped with a temperature sensor and a humidity sensor is described in Patent Document 1, for example. In Patent Document 1, the sensor module is attached to a predetermined part of the air conditioner with the sensor mounting surface facing downward.
JP 2003-139373 A

  The sensor module is generally attached to a device with the sensor mounting surface facing upward or downward. When the sensor module is attached to the device with the sensor mounting surface facing upward, there is an advantage that the state of the sensor substrate or sensor can be easily inspected. However, if the sensor mounting surface is faced up, dust and water droplets that have entered the case from the ventilation holes will remain attached without falling from the sensor mounting surface. Or malfunction of the sensor. For this reason, when the device is used in an environment where dust or water droplets easily enter, it is desirable to mount the sensor module with the sensor mounting surface facing downward.

  Here, in order to change the orientation of the sensor mounting surface to a desired orientation when the sensor module is attached to the device, a change is made to the attachment portion configured in a predetermined part of the device, or the sensor module is attached to the device. For this reason, there is a problem that any measure of changing the mounting portion formed in the sensor module is required.

  SUMMARY OF THE INVENTION In view of such a point, an object of the present invention is to provide a sensor module mounting structure that can be mounted on a device with a desired orientation of the sensor mounting surface without changing the mounting portion of the sensor module or device. Is to propose.

In order to solve the above-described problems, the present invention provides a sensor in which a sensor board on which at least one of a temperature sensor and a humidity sensor is mounted in a predetermined part of a device such as an air conditioner. The sensor module mounting structure is capable of mounting the module in a state where the sensor mounting surface of the sensor substrate faces either one of the first direction and the second direction,
A device-side mounting portion formed on the device for mounting the sensor module;
A module cover attachable to the sensor module;
The sensor module includes a module side mounting portion that can be mounted on the device side mounting portion,
The module cover includes a first cover side mounting portion that can be mounted on the module side mounting portion, and a second cover side mounting portion that can be mounted on the device side mounting portion.
When the module-side attachment portion is attached to the device-side attachment portion, the sensor module is attached to the device with the sensor mounting surface facing the first direction,
When the first cover side mounting portion is attached to the module side mounting portion and the module cover is attached to the sensor module, and in this state, the second cover side mounting portion is attached to the device side mounting portion, the sensor mounting The sensor module is attached to the device with a surface facing the second direction.

  According to the present invention, the sensor module has a module-side mounting portion that can be attached to the device-side mounting portion formed on the device. When the module-side mounting portion is attached to the device-side mounting portion, the sensor module is mounted on the sensor. It is attached to the device with its surface facing the first direction. The first cover side mounting portion includes a module cover including a first cover side mounting portion that can be mounted on the module side mounting portion and a second cover side mounting portion that can be mounted on the device side mounting portion. When the module cover is attached to the sensor module by attaching the sensor cover to the module side attachment portion, and the second cover side attachment portion is attached to the equipment side attachment portion in this state, the sensor module is the device with the sensor mounting surface facing the second direction. Attached to. That is, when only the sensor module is attached to the device, the sensor mounting surface is oriented in the first direction, and when the sensor module is attached to the device via the module cover, the sensor mounting surface is oriented in the second direction. Therefore, the sensor mounting surface can be mounted in a desired direction without changing the module side mounting portion formed in the sensor module and the device side mounting portion formed in the device.

  In the present invention, it is preferable that the first direction is a direction in which the sensor mounting surface is horizontal and upward, and the second direction is a direction in which the sensor mounting surface is horizontal and downward. In this way, when only the sensor module is attached to the device, the sensor mounting surface becomes horizontal and upward, so that it is easy to inspect the state of the sensor substrate and the sensor built in the sensor module. When the sensor module is attached to the device via the module cover, the sensor mounting surface becomes horizontal and downward, so that even if dust or water drops adhere to the sensor mounting surface, they fall. Since dust and water droplets do not remain on the sensor mounting surface, corrosion of the sensor substrate and sensor malfunction can be suppressed or prevented.

  In the present invention, the module cover covers the front surface of the sensor module with a predetermined interval in a state of being attached to the sensor module, and external air is mounted on the sensor mounting surface on the front surface of the sensor module. A ventilation part for guiding the sensor to the sensor is formed, and the module cover has a cover so as to be located at a part removed from a part facing the ventilation part in a state of being attached to the sensor module. It is desirable that a side ventilation part is formed. If it does in this way, the outside air which flows from the front will bend the flow path after passing through a cover side ventilation part, and will be led to a sensor via a ventilation part after that. Therefore, it is possible to reduce or avoid the dust and water droplets carried by the outside air from directly passing through the ventilation portion and adhering to the sensor mounting surface.

  In the present invention, in order to reduce or avoid the water droplets carried by the outside air or the water droplets that have fallen from being attached to the sensor mounting surface from the ventilation portion along the surface of the sensor module, the sensor module is a rectangular parallelepiped as a whole. When the sensor module is attached to the device with the sensor mounting surface being in the second direction, the front surface of the sensor module is vertical, and the module cover is attached to the sensor module. In the mounted state, it is desirable to include a front plate portion that covers the front surface of the sensor module from the front and an upper plate portion that covers the upper end surface of the sensor module from above.

  In the present invention, in order to enable the module side mounting portion and the second cover side mounting portion to be mounted on the device side mounting portion, respectively, and to enable the first cover side mounting portion to be mounted on the module side mounting portion, The device-side mounting portion is formed by a device-side vertical mounting surface formed in a predetermined part of the device and a device-side screw hole formed in the device-side vertical mounting surface, and a side edge of the front surface of the sensor module The module-side mounting portion is formed by a module-side mounting plate projecting laterally in parallel with the front surface and a module-side screw hole formed in the module-side mounting plate, and the front side of the module cover A first cover side mounting plate fixed at a certain interval to the back surface of the plate portion so as to be parallel to the front plate portion, and formed on the first cover side mounting plate The first cover side screw hole forms the first cover side mounting portion, and the second cover portion protrudes laterally in parallel with the front plate portion from the side edge of the front plate portion of the module cover. It is desirable that the second cover side mounting portion is formed by a cover side mounting plate and a second cover side screw hole formed in the second cover side mounting plate.

  In the present invention, in order to attach the sensor module to the device in a predetermined posture by positioning the module cover when the second cover side attachment portion is attached to the device side attachment portion, the device side attachment portion includes: A device-side vertical positioning surface orthogonal to the device-side vertical mounting surface is formed, the front plate portion of the module cover is rectangular, and one side edge of the front plate portion has the above-mentioned The second cover side mounting plate protrudes laterally from the upper end in a state where it is attached to the sensor module, and a positioning plate is formed that is bent at a right angle from the lower end toward the back side and protrudes. When the cover-side attachment portion is attached to the device-side attachment portion, it is desirable that the positioning plate abuts on the device-side vertical positioning surface.

  Next, the present invention can be a module cover used in the sensor module mounting structure described above.

  According to the present invention, the sensor module has a module-side mounting portion that can be attached to the device-side mounting portion formed on the device. When the module-side mounting portion is attached to the device-side mounting portion, the sensor module is mounted on the sensor. It is attached to the device with its surface facing the first direction. The first cover side mounting portion includes a module cover including a first cover side mounting portion that can be mounted on the module side mounting portion and a second cover side mounting portion that can be mounted on the device side mounting portion. When the module cover is attached to the sensor module by attaching the sensor cover to the module side attachment portion, and the second cover side attachment portion is attached to the equipment side attachment portion in this state, the sensor module is the device with the sensor mounting surface facing the second direction. Attached to. That is, when only the sensor module is attached to the device, the sensor mounting surface is oriented in the first direction, and when the sensor module is attached to the device via the module cover, the sensor mounting surface is oriented in the second direction. Therefore, the sensor mounting surface can be mounted in a desired direction without changing the module side mounting portion formed in the sensor module and the device side mounting portion formed in the device.

  The sensor module mounting structure of the present invention will be described below with reference to the drawings.

  1A is a perspective view of the sensor module, FIG. 1B is a perspective view of the module cover, and FIG. 1C is a perspective view showing a state in which the module cover is attached to the sensor module.

  The mounting structure of the sensor module 1 of this example is as follows when the sensor module 1 in which the sensor substrate 4 on which the thermistor (temperature sensor) 2 and the humidity sensor 3 are mounted is mounted on a predetermined part in the dehumidifying dryer. The sensor mounting surface 4a of the sensor substrate 4 can be mounted in a state in which the sensor mounting surface 4a faces either one of a horizontal upward direction (first direction) or a horizontal downward direction (second direction). is there. When mounting with the sensor mounting surface 4a facing upward, the sensor module 1 shown in FIG. When mounting with the sensor mounting surface 4a facing downward, the module cover 5 shown in FIG. 1 (b) is attached to the sensor module 1 to the state shown in FIG. 1 (c). Attach module 1 to the equipment.

  2 (a) is a front view of the sensor module 1, FIG. 2 (b) is a plan view thereof, FIG. 2 (c) is a bottom view thereof, and FIG. 2 (d) is a right side view thereof. FIG. 2 (e) is a longitudinal sectional view taken along AA of the front view. The sensor module 1 will be described with reference to FIG.

  The sensor module 1 includes a rectangular parallelepiped case 11 that is flat in the front-rear direction. A module side attachment portion 13 that can be attached to a device side attachment portion formed at a predetermined portion of the dehumidifying dryer is formed on the right edge of the case front plate portion 12. The posture of the sensor module 1 shown in FIG. 1A and FIG. 2 is the same basic posture as the state where the sensor module 1 is attached to the device by the module side attachment portion 13. Details of the device-side mounting portion will be described later.

  In the basic posture, the sensor substrate 4 is built in the lower portion of the case 11 with the sensor mounting surface 4a being horizontal and facing upward. The sensor substrate 4 is fixed by being sandwiched from protrusions 12a and 14a having a concave shape in cross section protruding from the case front plate portion 12 and the case back plate portion 14 to the inside of the case 11 from the front and rear directions. A wiring connector 15 is mounted on the sensor mounting surface 4a, and a lead wire 16 extending from the controller of the dehumidifying dryer is connected to the wiring connector 15.

  The case front plate portion 12 is formed with a first ventilation hole (venting portion) 17 so that outside air is guided to the thermistor 2 and the humidity sensor 3. A second vent hole 18 is formed in the case back plate portion 14 so that outside air introduced into the case 11 flows out. The first vent hole forming area 17A, which is the first vent hole 17 forming area in the case front plate portion 12, has a rectangular shape that is long in the left-right direction, and is the forming area of the second vent hole 18 in the case back plate portion 14. The second vent hole forming region 18A has a rectangular shape that is long in the vertical direction. As shown in FIG. 2 (a), the first vent hole forming region 17A and the second vent hole forming region 18A are in a position where a part thereof overlaps in the front-rear direction. Further, as shown in FIG. 2 (e), in the basic posture, both the first vent hole forming region 17 </ b> A and the second vent hole forming region 18 </ b> A are located above the sensor substrate 4.

  The module side mounting portion 13 is fixed in parallel with the case front plate portion 12 toward the right continuously from the base portion 13a projecting forward from the center of the right side edge of the case front plate portion 12 in the vertical direction. The module-side mounting plate 13b extends in the width and the module-side screw hole 13c formed in the module-side mounting plate 13b. The tip of the module side mounting plate 13b has a semicircular arc shape, and the module side screw hole 13c is formed at the center.

  3A is a front view of the module cover 5 attached to the sensor module 1, FIG. 3B is a plan view thereof, and FIG. 3C is a right side view thereof. The module cover 5 will be described with reference to FIGS. 1B, 1C, and 3. FIG.

  The module cover 5 includes a rectangular cover front plate portion (front plate portion) 51 that extends in the vertical direction, and a cover upper plate portion that extends at a right angle from the upper end of the cover front plate portion 51 toward the rear. Plate portion) 52 and a cover side plate portion 53 that is bent at a right angle from the left end of the cover front plate portion 51 and extends rearward. The left end of the cover upper plate portion 52 and the upper end of the cover side plate portion 53 are continuous. The cover front plate portion 51, the cover side plate portion 53, and the cover upper plate portion 52 are respectively the case front plate portion 12, the case left plate portion 20 and the case right plate portion 21, the case upper plate portion 19 and the case lower portion of the sensor module 1. The shape is slightly larger than the plate portion 22. A third vent hole (cover-side vent portion) 54 is formed in the cover front plate portion 51. The third vent hole forming region 54A, which is the formation region of the third vent hole 54 in the cover front plate portion 51, has an L shape.

  The module cover 5 includes a first cover side mounting portion 55 that can mount the module cover 5 on the module side mounting portion 13 of the sensor module 1 and a second cover that can mount the module cover 5 on the device side mounting portion of the device. A side mounting portion 56 and a positioning plate 57 are provided.

  The first cover side attaching portion 55 is formed of a plate member having a constant width attached to the back surface portion 51 a of the cover front plate portion 51. Specifically, the first cover side mounting portion 55 includes an upper mounting plate portion 55a that extends in the vertical direction and is fixed to the back surface portion 51a of the cover front plate portion 51, and a back surface portion 51a from the lower end of the upper mounting plate portion 55a. The upper horizontal plate portion 55b is bent in the direction away from the upper horizontal plate portion 55b and is horizontally extended, and the upper horizontal plate portion 55b is bent downward from the rear end of the upper horizontal plate portion 55b and extends in parallel with the cover front plate portion 51 with a certain distance therebetween. A mounting plate portion (cover-side mounting plate) 55c, a lower horizontal plate portion 55d bent in a direction approaching the back surface portion 51a from the lower end of the mounting plate portion 55c, and extending downward from the front end of the lower horizontal plate portion 55d. A lower mounting plate portion 55e that extends in a bent manner and is fixed to the back surface portion 51a of the front cover plate portion 51 is provided. Cover side screw holes 55f are formed.

  The second cover side mounting portion 56 includes a second cover side mounting plate 56a that protrudes from the upper end of the right edge of the cover front plate portion 51 to the right side with a constant width and a second portion formed at the tip portion thereof. The cover side screw hole 56b is formed.

  The positioning plate 57 is a flat plate that is bent at a right angle from the lower end of the right edge of the cover front plate portion 51 toward the back side and protrudes at a right angle. A screw hole 57a is formed at the tip portion.

  Here, when the module cover 5 is attached to the sensor module 1, the sensor module 1 in the basic posture is turned upside down without changing the front and rear. That is, the sensor mounting surface 4a of the sensor substrate 4 is set in a horizontal and downward state. Thereafter, the first cover side screw hole 55f of the first cover side mounting portion 55 of the module cover 5 and the module side screw hole 13c of the module side mounting portion 13 are aligned and screwed.

  In the state where the module cover 5 is attached to the sensor module 1, as shown in FIGS. 1C and 3, the cover front plate portion 51 covers the case front plate portion 12 from the front side with a predetermined gap. The cover upper plate portion 52 covers the case upper plate portion 19 from above with a predetermined gap. The cover side plate portion 53 covers the case right side plate portion 21 from the left side with a predetermined gap. Further, the third vent hole forming region 54A in the cover front plate portion 51 and the first vent hole forming region 17A in the case front plate portion 12 do not overlap in the front-rear direction. That is, the third vent hole forming region 54A is located in a portion of the cover front plate portion 51 that is out of the portion facing the first vent hole forming region 17A.

  Next, the apparatus side attaching part formed in the dehumidifying dryer will be described with reference to FIGS. FIG. 4 is a perspective view of a dehumidifying dryer to which the sensor module 1 is attached. FIG. 5A is a perspective view showing a state where the sensor module 1 is attached to the device, and FIG. 5B is a perspective view showing a state where the sensor module 1 is attached to the device via the module cover 5. is there. 5A and 5B show a state where the filter attached to the air suction port of the dehumidifying dryer is removed.

  As shown in FIG. 4, the dehumidifying dryer 100 includes a rectangular parallelepiped casing 101. An air suction port 103 is formed at the center in the vertical direction of the case front plate portion 102 of the case 101. A filter 104 is attached to the opening of the air suction port 103. An air outlet 105 is formed at the upper end of the housing front plate portion 102. An air flow path 106 connected from the air suction port 103 to the air outlet 105 is formed in the housing 101. Air is sucked into the air flow path 106 from the air suction port 103 and supplied from the air outlet 105. A fan for dehumidification, an evaporator for dehumidifying the sucked air, a heater for adjusting the sucked air to a predetermined temperature state, and the like (not shown) are arranged.

  When the dehumidifying dryer 100 operates, the outside air is sucked into the housing 101 from the air suction port 103 and is blown out from the air outlet 105 after being adjusted to a predetermined temperature and humidity. The arrows in the figure indicate the direction in which outside air flows. The sensor module 1 is attached to the opening edge portion of the air suction port 103 on the back side of the filter 104.

  The device-side mounting portion 107 is configured as a right front corner column 108 among the four columns that define the four corners of the housing 101. As shown in FIG. 5, a plate-like member 109 having a L-shaped cross section extending in the vertical direction from the back side of the column 108 is attached to a portion corresponding to the air suction port 103 of the column 108 at the right front corner. Yes. One flat plate portion 109a bent in an L shape extends in parallel with the case front plate portion 102, and the other flat plate portion 109b extends rearward along the case right plate portion 110. One flat plate portion 109a includes an edge portion (device-side vertical mounting surface) 109c protruding from the column 108 toward the air suction port 103 with a certain width, and a side end surface (device-side vertical positioning surface) 109d of the edge portion 109c. Yes. A device-side screw hole 109e is formed at the center in the vertical direction of the edge portion 109c. The device-side mounting portion 107 includes an edge portion 109c of the flat plate portion 109a, a side end surface 109d of the edge portion 109c, and a device-side screw hole 109e.

(Attaching the sensor module)
When the sensor module 1 is attached to the dehumidifying dryer 100 with the sensor mounting surface 4a being horizontal and facing upward, the module side screw hole 13c of the module side attachment portion 13 of the sensor module 1 and the device side of the device side attachment portion 107 are arranged. The screw hole 109e is aligned and screwed.

  As a result, as shown in FIG. 5A, the sensor module 1 is attached to the device-side attachment portion 107 with the sensor mounting surface 4a being horizontal and facing upward. In addition, the case front plate portion 12 is attached so that the outside air passes vertically from the first ventilation hole 17 of the case front plate portion 12 toward the second ventilation hole 18 of the case back plate portion 14. The first vent hole forming region 17A and the second vent hole forming region 18A are located above the sensor substrate 4.

  When the sensor module 1 is attached to the device in a state where the sensor mounting surface 4a is horizontal and downward, the sensor module 1 is attached to the device via the module cover 5. That is, the module cover 5 is attached to the sensor module 1 by attaching the first cover side attaching portion 55 to the module side attaching portion 13, and in this state, the second cover side screw hole 56 b of the second cover side attaching portion 56 and the device are attached. The device side screw hole 109e of the side mounting portion 107 is aligned and screwed. Then, since the positioning plate 57 of the module cover 5 comes into contact with the side end surface 109d of the edge portion 109c, the module cover 5 is positioned in a predetermined posture. Accordingly, the sensor module 1 attached to the module cover 5 is fixed in a predetermined posture.

  As a result, as shown in FIG. 5B, the sensor module 1 is attached to the device-side attachment portion 107 with the sensor mounting surface 4a being horizontal and facing downward. In addition, the case front plate portion 12 is attached so that the outside air passes vertically from the first ventilation hole 17 of the case front plate portion 12 toward the second ventilation hole 18 of the case back plate portion 14. The sensor substrate 4 built in the sensor module 1 is horizontal, and the first vent hole forming region 17A and the second vent hole forming region 18A are located below the sensor substrate 4.

  Here, as indicated by a one-dot chain line, the position of the thermistor 2 and the humidity sensor 3 built in the sensor module 1 when only the sensor module 1 is attached to the dehumidifying dryer 100, and the sensor module via the module cover 5. The positions of the thermistor 2 and the humidity sensor 3 built in the sensor module 1 when 1 is attached to the dehumidifying dryer 100 are substantially the same.

(Effects of this embodiment)
According to this example, the sensor module 1 includes the module side mounting portion 13 that can be mounted on the device side mounting portion 107 formed in the dehumidifying dryer 100, and the module side mounting portion 13 is connected to the device side mounting portion 107. The sensor module 1 is attached to the dehumidifying dryer 100 with the sensor mounting surface 4a being horizontal and facing upward. The module cover 5 includes a first cover side mounting portion 55 that can be mounted on the module side mounting portion 13 and a second cover side mounting portion 56 that can be mounted on the device side mounting portion 107. The module cover 5 is attached to the sensor module 1 by attaching the 1 cover side attaching portion 55 to the module side attaching portion 13, and when the second cover side attaching portion 56 is attached to the device side attaching portion 107 in this state, the sensor module 1 It is attached to the dehumidifying dryer 100 with the mounting surface 4a being horizontal and facing downward. That is, when only the sensor module 1 is attached to the dehumidifying dryer 100, the sensor mounting surface 4a becomes horizontal and upward. When the sensor module 1 is attached to the dehumidifying dryer 100 via the module cover 5, the sensor mounting surface 4a is It will be in a horizontal and downward state. Therefore, the sensor mounting surface 4a is mounted in a desired direction without changing the module side mounting portion 13 formed in the sensor module 1 and the device side mounting portion 107 formed in the dehumidifying dryer 100. be able to.

  Further, when only the sensor module 1 is attached to the dehumidifying dryer 100 by the module side attaching portion 13, the sensor mounting surface 4a becomes horizontal and upward, so that the sensor substrate 4 incorporated in the sensor module 1, the thermistor 2 and It becomes easy to inspect the state of the humidity sensor 3. On the other hand, when the sensor module 1 is attached to the device via the module cover 5 by the second cover side attachment portion 56, the sensor mounting surface 4a is in a horizontal and downward state, so that dust and water droplets adhere to the sensor mounting surface 4a. Even they fall. Since dust and water droplets do not remain attached to the sensor mounting surface 4a, corrosion of the sensor substrate 4 and malfunction of the thermistor 2 and the humidity sensor 3 can be suppressed or prevented.

  Further, the module cover 5 covers the case front plate portion 12 of the sensor module 1 with a predetermined interval in a state where the module cover 5 is attached to the sensor module 1, and the third vent hole forming region 54A of the module cover 5 The module 1 is located at a portion that is out of the portion facing the first vent hole forming region 17A. As a result, the outside air flowing from the front passes through the third vent hole 54 and is bent in the flow path, and then is guided to the thermistor 2 and the humidity sensor 3 through the first vent hole 17. Therefore, it is possible to reduce or avoid the dust and water droplets carried by the outside air from directly passing through the first ventilation hole 17 and adhering to the sensor mounting surface 4a.

  When the sensor module 1 is attached to the dehumidifying dryer 100 with the sensor mounting surface 4a being horizontal and facing downward, the case front plate portion 12 of the sensor module 1 is vertical, and the cover front plate portion 51 of the module cover 5 is the sensor. The case front plate portion 12 of the module 1 is covered. Further, the cover upper plate portion 52 of the module cover 5 covers the case lower plate portion 22 of the sensor module 1. Accordingly, it is possible to reduce the amount of water droplets carried by the outside air or falling water droplets from being attached to the sensor mounting surface 4a from the first ventilation holes 17 formed in the case front plate portion 12 along the surface of the sensor module 1. Can be avoided.

  Further, according to this example, the module side mounting portion 13, the first cover side mounting portion 55, the second cover side mounting portion 56, and the device side mounting portion 107 are all formed of plate-like members and screw holes. ing. Accordingly, the module-side attachment portion 13 and the second cover-side attachment portion 56 can be attached to the device-side attachment portion 107, respectively, and the first cover-side attachment portion 55 can be attached to the module-side attachment portion 13. it can.

  Further, according to this example, when the sensor module 1 is attached to the dehumidifying dryer 100 via the module cover 5 by the second cover side attachment portion 56, the positioning plate 57 contacts the side end surface 109d of the device side attachment portion 107. Therefore, the module cover 5 is positioned. As a result, the sensor module 1 is attached in a predetermined posture.

  Further, when the sensor module 1 is attached to the dehumidifying dryer 100 via the module cover 5, the sensor board 4 built in the sensor module 1 is attached horizontally, and the sensor board 4 is attached to the case front plate portion 12. It is located above the first vent hole forming area 17A and the second vent hole forming area 18A in the case back plate portion 14. Therefore, it is possible to reduce or avoid dust and water droplets that have entered the case 11 from the first ventilation hole 17 and the second ventilation hole 18 from adhering to the sensor mounting surface 4a of the sensor substrate 4.

  Furthermore, the position of the thermistor 2 and the humidity sensor 3 built in the sensor module 1 when only the sensor module 1 is attached to the dehumidifying dryer 100 is attached to the dehumidifying dryer 100 via the module cover 5. The positions of the thermistor 2 and the humidity sensor 3 are substantially the same. Therefore, even if the sensor module 1 is attached to the dehumidifying dryer 100 or the sensor module 1 is attached to the dehumidifying dryer 100 via the module cover 5, the temperature and humidity detection positions do not change.

(Other embodiments)
Since the screw hole 57a is formed in the positioning plate 57 of the module cover 5, the sensor module 1 can be attached to a device such as an air conditioner by using the positioning plate 57 and the screw hole 57a as the second cover side mounting portion. it can. Further, if one of the third ventilation holes 54 formed in the cover front plate portion 51 of the module cover 5 is a screw hole, the cover front plate portion 51 and the third ventilation hole 54 are used as the second cover side mounting portion. The sensor module 1 can be attached to a device such as an air conditioner.

(A) is a perspective view of a sensor module, (b) is a perspective view of a module cover, (c) is a perspective view which shows the state which attached the module cover to the sensor module. (A) is a front view of the sensor module, (b) is a plan view thereof, (c) is a bottom view thereof, (d) is a right side view thereof, and (e) is a front view thereof. It is a longitudinal cross-sectional view in AA. (A) is the front view of the state which attached the module cover to the sensor module, (b) is the top view, (c) is the right view. It is a perspective view of the dehumidification dryer to which a sensor module is attached. (A) is a perspective view which shows the state in which the sensor module was attached to the dehumidification dryer, (b) is a perspective view which shows the state in which the sensor module was attached to the dehumidification dryer via the module cover.

Explanation of symbols

1 Sensor module 2 Thermistor (temperature sensor)
3 Humidity sensor 4 Sensor substrate 4a Sensor mounting surface 5 Module cover 11 Case 12 Case front plate portion 13 Module side mounting portion 13b Module side mounting plate 13c Module side screw hole 14 Case back plate portion 17 First ventilation hole (venting portion)
17A 1st ventilation hole formation area 18 2nd ventilation hole 18A 2nd ventilation hole formation area 19 Case upper board part 20 Case left board part 21 Case right board part 22 Case lower board part 51 Cover front board part (front board part)
52 Cover upper plate part (upper plate part)
53 Cover side plate portion 54 Third vent hole (cover side vent)
54A 3rd ventilation hole formation area 55 1st cover side attaching part 55c Attachment plate part (cover side attachment plate)
55f 1st cover side screw hole 56 2nd cover side attaching part 56a 2nd cover side attaching plate 56b 2nd cover side screw hole 100 Dehumidification dryer 107 Equipment side attaching part 109 Plate-like member 109c Edge part (apparatus side) Vertical mounting surface)
109d Side edge surface of the edge part (apparatus side vertical positioning surface)
109e Device side screw hole

Claims (7)

A sensor module in which a sensor board on which at least one of a temperature sensor and a humidity sensor is mounted is installed in a predetermined part of a device such as an air conditioner, and the sensor mounting surface of the sensor board is the first. A sensor module mounting structure that can be mounted in a state facing either one of the direction and the second direction,
A device-side mounting portion formed on the device for mounting the sensor module;
A module cover attachable to the sensor module;
The sensor module includes a module side mounting portion that can be mounted on the device side mounting portion,
The module cover includes a first cover side mounting portion that can be mounted on the module side mounting portion, and a second cover side mounting portion that can be mounted on the device side mounting portion.
When the module-side attachment portion is attached to the device-side attachment portion, the sensor module is attached to the device with the sensor mounting surface facing the first direction,
When the first cover side mounting portion is attached to the module side mounting portion and the module cover is attached to the sensor module, and in this state, the second cover side mounting portion is attached to the device side mounting portion, the sensor mounting An attachment structure of a sensor module, wherein the sensor module is attached to the device in a state where a surface faces the second direction. In the sensor module mounting structure according to claim 1,
The first direction is a direction in which the sensor mounting surface is horizontal and upward,
The sensor module mounting structure, wherein the second direction is a direction in which the sensor mounting surface is horizontal and downward. In the sensor module mounting structure according to claim 2,
The module cover is attached to the sensor module and covers the front surface of the sensor module with a predetermined gap therebetween,
On the front surface of the sensor module, a ventilation portion for guiding outside air to the sensor mounted on the sensor mounting surface is formed,
A sensor module mounting feature, wherein the module cover is formed with a cover-side ventilation portion so as to be located at a position away from a portion facing the ventilation portion when attached to the sensor module. Construction. In the mounting structure of the sensor module according to claim 3,
The sensor module has a rectangular parallelepiped shape as a whole,
In the state where the sensor module is attached to the device with the sensor mounting surface being in the second direction, the front surface of the sensor module is vertical,
The module cover includes a front plate portion that covers the front surface of the sensor module from the front and an upper plate portion that covers the upper end surface of the sensor module from above when attached to the sensor module. A sensor module mounting structure characterized by comprising: In the mounting structure of the sensor module according to claim 4,
The device-side mounting portion is formed by the device-side vertical mounting surface formed in a predetermined part of the device and the device-side screw hole formed in the device-side vertical mounting surface,
The module-side mounting portion is formed by a module-side mounting plate that protrudes laterally from the side edge of the front surface of the sensor module in parallel to the front surface, and a module-side screw hole formed in the module-side mounting plate. And
A first cover side mounting plate fixed to the back surface of the front plate portion of the module cover so as to be parallel to the front plate portion at a predetermined interval, and a first cover side mounting plate formed on the first cover side mounting plate The first cover side mounting portion is formed by one cover side screw hole,
A second cover side mounting plate projecting laterally from the side edge of the front plate portion of the module cover in parallel with the front plate portion, and a second cover side screw hole formed in the second cover side mounting plate; The mounting structure of the sensor module, wherein the second cover side mounting portion is formed. In the sensor module mounting structure according to claim 5,
In the device side mounting portion, a device side vertical positioning surface orthogonal to the device side vertical mounting surface is formed,
The front plate portion of the module cover is rectangular,
On one side edge of the front plate portion, the second cover side mounting plate protrudes laterally from the upper end in a state of being attached to the sensor module, and is bent at a right angle from the lower end toward the rear side and protrudes. Positioning plate is formed,
The sensor module mounting structure, wherein when the second cover side mounting portion is mounted on the device side mounting portion, the positioning plate abuts on the device side vertical positioning surface.   A module cover used in the sensor module mounting structure according to claim 1.

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