JP5062214B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component sucked by a nozzle on a substrate.

  In the electronic component mounting field, an electronic component mounting apparatus including a nozzle for transferring and mounting an electronic component supplied from a parts feeder onto a substrate is widely used. As the nozzle, a nozzle composed of two independent parts of a base part and a movable part slidably attached to the base part is often used. The movable part is biased downward by a biasing means such as a compression spring. After the nozzle is lowered, the movable part is pushed by the biasing force of the compression spring after contacting the electronic component. Only a load acts (see Patent Document 1).

Japanese Patent No. 3574666

  In this way, since the nozzle is densely configured by a plurality of members such as a base, a movable part, and a compression spring, the movement of the members becomes awkward while not in use for a long time, and normal operation cannot be expected. May be. If the nozzle in such a state is used as it is, problems such as excessive or insufficient pushing load occur, and the mounting quality is greatly affected.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method for starting an electronic component mounting operation after setting a nozzle in a state where normal operation can be expected.

The electronic component mounting apparatus according to claim 1, a nozzle on which a movable portion having an electronic component suction portion is slidably mounted, nozzle moving means for moving the nozzle in the sliding direction of the movable portion, A contacted part that contacts the suction part, and the nozzle is reciprocated a plurality of times in the movement direction in a state in which the suction part is in contact with the contacted part before the nozzle is used for an electronic component mounting operation. The movable part is slid.

  An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus transferred according to the first aspect, wherein the nozzle reciprocates in a stroke smaller than a maximum sliding stroke of the movable portion.

According to a third aspect of the present invention, there is provided an electronic component mounting method including a nozzle on which a movable portion having an electronic component suction portion is slidably mounted, and nozzle moving means for moving the nozzle in a sliding direction of the movable portion. In the electronic component mounting apparatus, before the nozzle is used for mounting the electronic component, the nozzle is reciprocated a plurality of times in the moving direction in a state where the suction portion is in contact with other than the electronic component, and the movable portion is slid. Move.

According to the present invention, before the nozzle is used for the mounting operation of the electronic component, the nozzle is reciprocated a plurality of times in a state where the suction portion is in contact with the contacted portion, and the movable portion is slid to perform normal operation. The mounting operation can be performed using the nozzle that is in an expected state.

1 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention. Side sectional view of a nozzle according to an embodiment of the present invention Explanatory drawing of the preparation operation of the nozzle in the electronic component mounting apparatus of embodiment of this invention

  An electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to FIG. The electronic component mounting apparatus 1 includes a parts feeder 2 that supplies electronic components, a transport rail 4 that transports the substrate 3 to and from the electronic component mounting apparatus 1, a mounting head 5, and a horizontal movement of the mounting head 5. The head horizontal movement mechanism 6 to be moved (arrow A), the nozzle 7 for picking up electronic components from the parts feeder 2, the nozzle lifting mechanism 8 to move the nozzle 7 in the vertical direction (arrow B), and the replacement nozzle 9 are stored. The nozzle stocker 10 and the nozzle pressing surface 11 that presses the nozzle 7 are the main components.

  The parts feeder 2 supplies the electronic components housed therein to the opening 12 serving as a pickup position. The electronic component supplied to the opening 12 is picked up by the nozzle 7 from above and picked up from the opening 12. The nozzle 7 that picks up the electronic component moves horizontally above the substrate 3 and is mounted on the substrate 3 while applying a pressing load to the electronic component. This indentation load also acts when the electronic component in the opening 12 is adsorbed. The nozzle 7 is attached to an elevating part 8 a of the nozzle elevating mechanism 8. As the nozzle lifting mechanism 8 is driven, the lifting / lowering portion 8a is lifted / lowered, and the nozzle 7 is lifted / lowered accordingly. The nozzle 7 moves up and down when the electronic component is picked up and mounted.

  The nozzle stocker 10 is disposed between the parts feeder 2 and the transport rail 4 at a position directly below the moving path of the mounting head 5. A plurality of nozzles 9 are stored in the nozzle stocker 10 in the same direction as the nozzles 7 attached to the mounting head 5. The nozzle 9 is compatible with the nozzle 7, and can be mounted on the mounting head 5 by replacing the nozzle 7. There are various types of nozzles 9 stored in the nozzle stocker 10, and those corresponding to the types of electronic components are mounted on the mounting head 5 for use. A rigid block 13 is attached to the side of the nozzle stocker 10. A nozzle pressing surface 11 is horizontally formed on the upper portion of the rigid block 13.

  The structure of the nozzle 7 will be described with reference to FIG. The nozzle 7 (same for the replacement nozzle 9) is composed of two independent members, a base portion 20 and a movable portion 21. Of these, only the base 20 is attached to the elevating part 8a. The movable portion 21 is attached to a hollow cylindrical portion 22 at the lower end of the base portion 20. The outer peripheral surface 23 of the movable part 21 and the inner peripheral surface 24 of the cylindrical part 22 are in sliding contact. A groove 25 having a predetermined length in the vertical direction is formed in the movable portion 21, and a pin 26 that engages with the groove 25 is attached to the cylindrical portion 22 of the base portion 20. The movable portion 21 can slide in the vertical direction within the range of the maximum stroke S determined by the length of the groove 25.

  The base 20 and the movable portion 21 are formed with suction holes 27 that communicate with each other in the vertical direction. By sucking the suction hole 27 from the mounting head side, the electronic component 29 can be sucked to the suction portion 28 formed at the lower end of the movable portion 21.

  The movable part 21 is urged vertically downward by a compression spring 30 disposed at the upper part. The nozzle 7 has the longest total length L in a no-load state in which no external force acts on the movable portion 21, and the total length L is shortened by applying a load exceeding the urging force of the compression spring 30 to the movable portion 21. When the nozzle 7 is lowered when the electronic component 29 is attracted, the counteracting force acts on the movable portion 21 from the electronic component 29 side and moves to the base 20 side from the time when the attracting portion 28 contacts the upper surface of the electronic component 29. As a result, the nozzle 7 shrinks.

  When the nozzle 7 contracts, the urging force of the compression spring 30 acts only as a pushing load on the electronic component 29, and damage to the electronic component 29 and the nozzle 7 due to overload can be prevented. The same applies to the case where the electronic component 29 is mounted on the substrate 3. After the electronic component 29 adsorbed by the nozzle 7 comes into contact with the substrate 3, the nozzle 7 contracts, and the electronic component 29, the substrate 3, and the nozzle 7 have no contact with each other. The push load only acts.

  The nozzle 7 is in a state where the outer peripheral surface 23 of the movable portion 21 and the inner peripheral surface 24 of the cylindrical portion 22 can slide smoothly, and the compression spring 30 can be expanded and contracted smoothly. Normal operation can be expected for the first time. Only when the nozzle 7 is in a state of being able to operate normally, can a pressing load be applied without excess or deficiency, and if the movable portion 21 does not slide smoothly with respect to the base portion 20 or the compression spring 30. If it is not in a state where it does not expand and contract smoothly, a situation may occur in which an overload exceeding the indentation load acts on the movable portion 21 or a sufficient indentation load does not act on the movable part 21, in addition to damage to various members. In addition, the mounting quality is greatly adversely affected, such as a decrease in adsorption rate and a decrease in mounting strength.

  In order to maintain the nozzle 7 in a state where it can operate normally, it is necessary to slide the outer peripheral surface 23 and the inner peripheral surface 24 to expand and contract the compression spring 30, that is, to cause the nozzle 7 to perform expansion and contraction. The nozzle 7 mounted on the mounting head 5 maintains a normal operation state by repeating the expansion and contraction operation every time the mounting operation for picking up the electronic component 29 and mounting it on the substrate 3 is performed. However, the replacement nozzles 9 stored in the nozzle stocker 10 may be mixed with those that have been used for a long time since the last use or those that have never been used. May not be able to expect normal operation.

  When the electronic component mounting apparatus 1 resumes the use after the mounting operation is stopped even if the nozzle 9 just after replacement or the nozzle 7 mounted on the mounting head 5 is stopped, prior to the actual operation used for actual suction or mounting. A dummy preparation operation is performed. The preparatory operation is an operation in which the nozzle 7 is reciprocated several times in the vertical direction while the suction portion 28 of the nozzle 7 is in contact with the nozzle pressing surface 11.

  As shown in FIG. 3, the nozzles 7 and 9 are repeatedly expanded and contracted several times by the lifting and lowering operation of the lifting and lowering portion 8 a, and the outer peripheral surface 23 of the movable portion 21 and the inner peripheral surface 24 of the cylindrical portion 22 slide, Under the same environment as when the main operation of the compression spring 30 extending and contracting is performed, the normal operation can be expected.

  The moving stroke of the movable portion 21 is made smaller than the maximum sliding stroke S so that an overload does not act on the nozzles 7 and 9 that repeat the expansion and contraction operations in this preparation operation. The nozzles 7 and 9 that have undergone the preparatory operation are relieved of the so-called movement astringency caused by non-use for a long time, including those that can operate normally before the preparatory operation. In this operation, a normal state in which a smooth expansion / contraction operation can be performed is obtained.

  Since the preparatory operation is an operation of expanding and contracting the nozzles 7 and 9 several times, it is not limited to the nozzle pressing surface 11 on the upper part of the rigid block 13 to contact the suction portion 28 at that time. Any member that can come into surface contact with the suction portion 28 can serve as a nozzle pressing surface.

The present invention expects normal operation by reciprocating the nozzle a plurality of times and sliding the movable part in a state where the suction part is in contact with the contacted part before the nozzle is used for mounting the electronic component. This has the advantage that the mounting operation can be performed using the nozzle in the obtained state, and is useful in the electronic component mounting field in which the electronic component sucked by the nozzle is mounted on the substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 7, 9 Nozzle 8 Nozzle raising / lowering mechanism 11 Nozzle pressing surface 20 Base 21 Movable part

Claims (3)

A nozzle on which a movable part having a suction part for electronic parts is slidably mounted; nozzle moving means for moving the nozzle in the sliding direction of the movable part; and a contacted part for contacting the suction part, Before using the nozzle for mounting an electronic component, the nozzle is reciprocated a plurality of times in the moving direction in a state where the suction portion is in contact with the contacted portion, and the movable portion is slid. Electronic component mounting device.   2. The electronic component mounting apparatus according to claim 1, wherein the nozzle reciprocates in a stroke smaller than a maximum sliding stroke of the movable portion. An electronic component mounting apparatus, comprising: a nozzle having a movable portion having an electronic component suction portion slidably mounted thereon; and nozzle moving means for moving the nozzle in a sliding direction of the movable portion. An electronic component mounting method, wherein the nozzle is reciprocated a plurality of times in the moving direction and the movable portion is slid in a state where the suction portion is in contact with other than the electronic component before being used for the mounting operation.

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