JP5058882B2 - Surface mount connector - Google Patents

Surface mount connector Download PDF

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JP5058882B2
JP5058882B2 JP2008132830A JP2008132830A JP5058882B2 JP 5058882 B2 JP5058882 B2 JP 5058882B2 JP 2008132830 A JP2008132830 A JP 2008132830A JP 2008132830 A JP2008132830 A JP 2008132830A JP 5058882 B2 JP5058882 B2 JP 5058882B2
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solder
reinforcing member
surface mount
circuit board
printed circuit
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JP2009283224A (en
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隆志 室
晋司 児玉
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Yazaki Corp
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Yazaki Corp
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本発明は、プリント基板に取り付けられる表面実装コネクタに関するものである。   The present invention relates to a surface mount connector attached to a printed circuit board.

上述した表面実装コネクタとして、例えば、特許文献1に記載された表面実装コネクタが提案されている。図11にこの表面実装コネクタの側面図を示す。   As the surface mount connector described above, for example, a surface mount connector described in Patent Document 1 has been proposed. FIG. 11 shows a side view of the surface mount connector.

図11において、符号510は表面実装コネクタであり、符号560はこの表面実装コネクタ510が実装されるプリント基板である。   In FIG. 11, reference numeral 510 denotes a surface mount connector, and reference numeral 560 denotes a printed board on which the surface mount connector 510 is mounted.

表面実装コネクタ510は、図11に示すように、コネクタハウジング512と、コネクタハウジング512の両側側面に取り付けられた一対の固定金具540と、を有している。   As shown in FIG. 11, the surface mount connector 510 includes a connector housing 512 and a pair of fixing brackets 540 attached to both side surfaces of the connector housing 512.

固定金具540は、コネクタハウジング512の側面に装着される本体板541と、本体板541の下縁から一体に直角曲げして形成され且つプリント基板560に重ねられる取付板542と、から構成され、全体として略L形に形成されている。この取付板542がプリント基板560に重ねられて半田付けによって固定されることで、表面実装コネクタ510がプリント基板560に固定される。   The fixing bracket 540 includes a main body plate 541 attached to a side surface of the connector housing 512, and a mounting plate 542 formed by bending at a right angle integrally from the lower edge of the main body plate 541 and overlapping the printed circuit board 560. It is formed in a substantially L shape as a whole. The mounting plate 542 is overlaid on the printed circuit board 560 and fixed by soldering, whereby the surface mount connector 510 is fixed to the printed circuit board 560.

取付板542には、その長さ方向(即ち、図12の左右方向)に沿って、複数の半田進入孔547が一定間隔で形成されている。また、取付板542には、その突出縁から本体板541の下段部541Cの継ぎ目付近まで切れ込んだスリット550が複数形成され、さらに、取付板542の中央に位置するスリット550Aは、取付板542側から続いて、本体板541における下段部541Cから中段部541Bの下部にわたって立ち上がるようにして形成されている。   A plurality of solder entry holes 547 are formed in the mounting plate 542 at regular intervals along the length direction (that is, the left-right direction in FIG. 12). The mounting plate 542 is formed with a plurality of slits 550 that are cut from the protruding edge to the vicinity of the joint of the lower step portion 541C of the main body plate 541. Further, the slit 550A located at the center of the mounting plate 542 is formed on the mounting plate 542 side. Subsequently, the main plate 541 is formed so as to rise from the lower step portion 541C to the lower portion of the middle step portion 541B.

前記プリント基板560の表面における半田付けが予定される各部位には半田Hが塗布されており、そして、前記取付板542と半田Hが塗布された部位とが重なるように、プリント基板560の所定の位置に表面実装コネクタ510を載置して高温炉内を走行させると、半田Hが溶融して取付板542の周縁に付着するとともに、半田進入孔547に進入してその周縁に付着する。そして、半田Hが冷却されて固化されると、取付板542がプリント基板560の表面に固定され、表面実装コネクタ510がプリント基板560に固定される。   Solder H is applied to each part to be soldered on the surface of the printed circuit board 560, and the mounting board 542 and a part to which the solder H is applied overlap each other. When the surface mount connector 510 is placed in the position and run in the high temperature furnace, the solder H melts and adheres to the periphery of the mounting plate 542 and enters the solder entry hole 547 and adheres to the periphery. When the solder H is cooled and solidified, the mounting plate 542 is fixed to the surface of the printed circuit board 560, and the surface mount connector 510 is fixed to the printed circuit board 560.

例えば、この表面実装コネクタ510に図示しない相手側コネクタが嵌合され、この相手側コネクタから引き出された電線が引っ張られる等して、コネクタハウジング512に対して図11の矢線Zに示すような力が作用すると、取付板542に対してその長さ方向の一端からめくり上げる力が作用する。そして、この表面実装コネクタ510においては、表面実装コネクタ510の取付板542に複数のスリット550が設けられているので、上記めくり上げる力がスリット550の位置毎に分断されて、仮に取付板542がめくれかかったとしても、最後までめくれてしまうことを防止できた。
特開2005−302523号公報
For example, a mating connector (not shown) is fitted to the surface mount connector 510, and an electric wire drawn from the mating connector is pulled, so that the connector housing 512 is indicated by an arrow Z in FIG. When a force is applied, a force to be turned up from one end in the length direction is applied to the mounting plate 542. In this surface mount connector 510, since the mounting plate 542 of the surface mount connector 510 is provided with a plurality of slits 550, the turning-up force is divided for each position of the slit 550, so that the mounting plate 542 is temporarily installed. Even if it turned over, I was able to prevent it from turning up to the end.
JP 2005-302523 A

しかしながら、上述した表面実装コネクタ510は、その取付板542をプリント基板560の表面に半田付けによって固定しているだけなので、補強部材等を用いて補強を施した表面実装コネクタに比べて、プリント基板から剥離することに抗する強度に劣るという問題があった。また、補強部材を併用して固定することにより上述の強度を向上させることができるが、補強部材を取り付けるための組立工程が増加するので、コストアップしてしまうという問題があった。   However, since the above-described surface mount connector 510 only has its mounting plate 542 fixed to the surface of the printed circuit board 560 by soldering, the printed circuit board is more in comparison with a surface mount connector reinforced using a reinforcing member or the like. There was the problem that it was inferior in the strength which resists peeling from. Moreover, although the above-mentioned intensity | strength can be improved by fixing together with a reinforcement member, since the assembly process for attaching a reinforcement member increases, there existed a problem that cost increased.

本発明は、上記課題に係る問題を解決することを目的としている。即ち、本発明は、組立工程の増加を抑えつつ、プリント基板から剥離することに抗する強度を向上させることができる表面実装コネクタを提供することを目的としている。   The present invention aims to solve the above problems. That is, an object of the present invention is to provide a surface mount connector capable of improving strength against peeling from a printed circuit board while suppressing an increase in assembly process.

上記目的を達成するために、請求項1に記載された発明は、コネクタハウジングと、前記コネクタハウジングに取り付けられた本体部及び前記本体部の一端から曲げ形成された平板状の取付部を有する固定金具と、を有し、前記取付部がプリント基板の表面に重ねられて半田付けされることで前記プリント基板に固定される表面実装コネクタにおいて、前記取付部に設けられた貫通穴と、平面視面積が前記貫通穴より大きく形成されて前記取付部に重ねられる基部、及び、該基部から突出して一体形成され且つ前記貫通穴を通り先端が前記半田内に溶け込む突出部を有する合成樹脂からなる補強部材と、有していることを特徴とする表面実装コネクタである。   In order to achieve the above-mentioned object, the invention described in claim 1 is a fixed device having a connector housing, a main body portion attached to the connector housing, and a flat plate-like attachment portion bent from one end of the main body portion. In a surface mount connector that is fixed to the printed circuit board by being overlaid on the surface of the printed circuit board and soldered, the through hole provided in the mounting section, and a plan view Reinforcement made of a synthetic resin having a base formed with an area larger than the through-hole and overlaid on the mounting portion, and a projecting portion that protrudes from the base and is integrally formed and the tip passes through the through-hole and melts into the solder A surface-mount connector characterized by comprising a member.

請求項2に記載された発明は、請求項1に記載された発明において、前記取付部が、前記補強部材の前記基部の平面視形状に沿って形成された溝部を有し、前記貫通穴が、前記溝部内に設けられていることを特徴とするものである。   The invention described in claim 2 is the invention described in claim 1, wherein the attachment portion has a groove portion formed along a planar view shape of the base portion of the reinforcing member, and the through hole is formed. And is provided in the groove.

請求項1に記載された発明によれば、固定金具の取付部に設けられた貫通穴と、平面視面積が貫通穴より大きく形成されて取付部に重ねられる基部、及び、該基部から突出して一体形成され且つ貫通穴を通り先端が半田内に溶け込む突出部を有する合成樹脂からなる補強部材と、を有しているので、貫通穴に通された突出部を介して基部と固定用導体パターン上の半田とが接続されて、これら基部と固定用導体パターンとの間に取付部を狭持する。また、補強部材の突出部の先端が半田内に溶け込むものであり、即ち、半田が溶融する温度において半田と同様に溶融する合成樹脂で構成されているので、補強部材の突出部の先端を非溶融状態の半田に接するように配置したのち、該半田を溶融状態にさせる温度を加えると、その温度によって該先端が半田内に溶け込む。   According to the first aspect of the present invention, the through hole provided in the mounting portion of the fixing bracket, the base portion having a plan view area larger than the through hole and overlaid on the mounting portion, and protruding from the base portion And a reinforcing member made of a synthetic resin having a protruding portion that is integrally formed and passes through the through hole and the tip melts into the solder, so that the base portion and the fixing conductor pattern via the protruding portion passed through the through hole The upper solder is connected to hold the mounting portion between the base portion and the fixing conductor pattern. In addition, the tip of the protruding portion of the reinforcing member is melted into the solder, that is, it is made of a synthetic resin that melts in the same manner as the solder at a temperature at which the solder melts. When the solder is arranged so as to be in contact with the molten solder and a temperature for bringing the solder into a molten state is applied, the tip is melted into the solder by the temperature.

請求項2に記載された発明によれば、取付部が補強部材の基部の平面視形状に沿って形成された溝部を有し、貫通穴が溝部内に設けられているので、補強部材を取付部に配設するとき、補強部材がこの溝部にはめ込まれ、そして、半田が溶融する温度が加えられたとき、補強部材が該溝部内で溶融される。   According to the second aspect of the present invention, the attachment portion has the groove portion formed along the shape of the base portion of the reinforcing member in plan view, and the through hole is provided in the groove portion. When the reinforcing member is disposed in the groove, the reinforcing member is fitted into the groove, and when the temperature at which the solder melts is applied, the reinforcing member is melted in the groove.

以上説明したように請求項1に記載された発明によれば、補強部材の突出部を介して補強部材の基部と固定用導体パターン上の半田とが接続され、これら基部と固定用導体パターンとの間に取付部を狭持することができるので、この補強部材を設けることによって、取付部と固定用導体パターンとを固定する強度を補強することができる。また、補強部材の突出部の先端を非溶融状態の半田に接するように配置したのち、該半田を溶融させる温度を加えると、その温度によって該先端が半田内に溶け込むので、別途作業工程を設けることなく、補強部材の基部と固定用導体パターン上の半田とを接続することができる。そのため、組立工程の増加を抑えつつ、プリント基板から剥離することに抗する強度を向上させることができる。   As described above, according to the invention described in claim 1, the base of the reinforcing member and the solder on the fixing conductor pattern are connected via the protrusion of the reinforcing member, and the base and the fixing conductor pattern are connected to each other. Since the attachment portion can be held between the two, the strength for fixing the attachment portion and the fixing conductor pattern can be reinforced by providing this reinforcing member. Further, after the tip of the protrusion of the reinforcing member is arranged so as to be in contact with the solder in a non-molten state, when a temperature for melting the solder is applied, the tip melts into the solder due to the temperature, so a separate work process is provided. Without this, the base of the reinforcing member and the solder on the fixing conductor pattern can be connected. Therefore, the strength against peeling from the printed circuit board can be improved while suppressing an increase in the assembly process.

請求項2に記載された発明によれば、補強部材が溝部にはめ込まれたのち、該溝部内で溶融されるので、補強部材を取付部により密着させることができ、さらに強固に取付部を固定用導体パターンに固定することができる。   According to the second aspect of the present invention, since the reinforcing member is fitted into the groove portion and then melted in the groove portion, the reinforcing member can be brought into close contact with the attaching portion, and the attaching portion is more firmly fixed. It can be fixed to the conductor pattern for use.

以下、本発明の一実施形態を示す表面実装コネクタを図1〜図8を参照して説明する。   Hereinafter, a surface mount connector showing an embodiment of the present invention will be described with reference to FIGS.

図1に示す本発明の表面実装コネクタ1は、同図に示すプリント基板6に半田付けされて固定されている。このプリント基板6は、絶縁性の合成樹脂で構成された基板の平面上に複数の導体パターンが設けられた周知の構成のプリント基板である。プリント基板6の表面6A(図1中、上側に位置する面をいう)には、後述する表面実装コネクタ1が備える複数の端子3が半田付けされる複数の端子用導体パターン64と、表面実装コネクタ1が備える一対の固定金具4がそれぞれ半田付けされる長方形状に形成された一対の固定用導体パターン62と、が設けられている。   A surface mount connector 1 of the present invention shown in FIG. 1 is soldered and fixed to a printed circuit board 6 shown in FIG. This printed circuit board 6 is a printed circuit board having a well-known configuration in which a plurality of conductor patterns are provided on a plane of a substrate made of an insulating synthetic resin. A surface 6A (referred to as an upper surface in FIG. 1) of the printed circuit board 6 has a plurality of terminal conductor patterns 64 to which a plurality of terminals 3 included in a surface mount connector 1 to be described later are soldered, and surface mounting. A pair of fixing conductor patterns 62 formed in a rectangular shape to which a pair of fixing metal fittings 4 included in the connector 1 are soldered are provided.

表面実装コネクタ1は、図1に示すように、複数の端子3と、これら複数の端子3を収容したコネクタハウジング2と、このコネクタハウジング2に取り付けられた一対の固定金具4と、一対の固定金具4それぞれに取り付けられる補強部材46と、を有している。   As shown in FIG. 1, the surface mount connector 1 includes a plurality of terminals 3, a connector housing 2 that accommodates the plurality of terminals 3, a pair of fixing brackets 4 attached to the connector housing 2, and a pair of fixings. And a reinforcing member 46 attached to each of the metal fittings 4.

複数の端子3は、棒状の金属部材が屈曲されて形成されており、前記相手側コネクタのコネクタハウジング2への嵌合方向Eに沿って互いに反対方向に直線状に延びた2つの部分と、これら2つの部分を接続するプリント基板6の厚み方向に沿って直線状に延びた部分と、を有したクランク型の形状をなしている。また、この端子3の一端部32は、プリント基板6の表面6Aに設けられた端子用導体パターン64に重ねられて、半田によって電気的に接続される。また、この端子3の他端部31は、相手側コネクタ(不図示)の端子と接続される。嵌合方向Eは、相手側コネクタが接離される方向であり、プリント基板6の表面と平行な方向である。そして、これら複数の端子3は、嵌合方向Eと直交する方向に沿って互いに間隔をあけて配置されている。   The plurality of terminals 3 are formed by bending a rod-shaped metal member, and two portions extending linearly in opposite directions along the fitting direction E of the mating connector to the connector housing 2; It has a crank shape having a portion extending linearly along the thickness direction of the printed circuit board 6 connecting these two portions. Further, the one end portion 32 of the terminal 3 is overlapped with a terminal conductor pattern 64 provided on the surface 6A of the printed circuit board 6, and is electrically connected by solder. The other end 31 of the terminal 3 is connected to a terminal of a mating connector (not shown). The fitting direction E is a direction in which the mating connector is contacted and separated, and is a direction parallel to the surface of the printed circuit board 6. The plurality of terminals 3 are arranged at intervals from each other along a direction orthogonal to the fitting direction E.

コネクタハウジング2は、絶縁性の合成樹脂で構成された複数の外壁により箱状に形成されている。この複数の外壁のうち、プリント基板6の表面6Aに重ねられる板状の外壁を底壁22と呼ぶ。また、この底壁22と間隔をあけて平行に設けられた板状の外壁を上壁21と呼ぶ。また、これら底壁22と上壁21の端同士を連結した板状の一対の外壁を側壁23、24と呼ぶ。これら一対の側壁23、24は、それぞれプリント基板6の表面6Aと垂直に設けられているとともに、複数の端子3の並び方向に沿って互いに間隔をあけて設けられている。   The connector housing 2 is formed in a box shape by a plurality of outer walls made of insulating synthetic resin. Of the plurality of outer walls, a plate-like outer wall that is superimposed on the surface 6A of the printed circuit board 6 is referred to as a bottom wall 22. In addition, a plate-like outer wall provided in parallel with the bottom wall 22 at a distance is referred to as an upper wall 21. A pair of plate-like outer walls connecting the ends of the bottom wall 22 and the top wall 21 are referred to as side walls 23 and 24. The pair of side walls 23 and 24 are provided perpendicular to the surface 6A of the printed circuit board 6 and are spaced from each other along the arrangement direction of the plurality of terminals 3.

そして、コネクタハウジング2は、上壁21、底壁22、側壁23、側壁24それぞれの嵌合方向Eに沿った一端部に囲まれた開口部20から、嵌合方向Eに沿って、相手側コネクタが挿入される。   And the connector housing 2 is the other side along the fitting direction E from the opening part 20 enclosed by the one end part along the fitting direction E of each of the upper wall 21, the bottom wall 22, the side wall 23, and the side wall 24. The connector is inserted.

また、コネクタハウジング2は、上記外壁として、上壁21、底壁22、側壁23、側壁24それぞれの嵌合方向Eに沿った他端部同士、即ち開口部20から離れた他端部同士、を連結した奥壁をさらに有している。この奥壁は、上述した複数の端子3の屈曲された部分近傍を支持している。   Further, the connector housing 2 has, as the outer wall, the other end portions along the fitting direction E of the upper wall 21, the bottom wall 22, the side wall 23, and the side wall 24, that is, the other end portions separated from the opening portion 20, It further has a back wall connecting the two. The back wall supports the vicinity of the bent portions of the plurality of terminals 3 described above.

さらに、一対の側壁23、24は、詳しくは、次のような構成となっている。即ち、一対の側壁23、24は、底壁22と上壁21の端同士を連結した板状の側壁本体7と、この側壁本体7の外側に設けられた一対の固定金具取付壁8と、で構成されている。これら一対の固定金具取付壁8は、嵌合方向Eに沿って互いに間隔をあけて設けられているとともに、それぞれ、側壁本体7との間に固定金具4の端部41aを挟むための隙間を有して設けられている。このような一対の側壁23、24は、後述する固定金具4をコネクタハウジング2に取り付ける。また、図1では、側壁23側の側壁本体7及び固定金具取付壁8が隠れているが、この側壁23は、側壁24側と同一構成となっている。   Further, the pair of side walls 23 and 24 has the following configuration in detail. That is, the pair of side walls 23 and 24 includes a plate-like side wall main body 7 in which the ends of the bottom wall 22 and the upper wall 21 are connected to each other, a pair of fixing metal mounting walls 8 provided outside the side wall main body 7, It consists of The pair of fixing bracket mounting walls 8 are provided at intervals along the fitting direction E, and each has a gap for sandwiching the end 41 a of the fixing bracket 4 between the side wall body 7. It is provided. Such a pair of side walls 23, 24 attaches a fixture 4, which will be described later, to the connector housing 2. In FIG. 1, the side wall body 7 and the fixing bracket mounting wall 8 on the side wall 23 side are hidden, but the side wall 23 has the same configuration as the side wall 24 side.

一対の固定金具4は、上述した一対の側壁23、24それぞれに、1つずつ取り付けられる。この固定金具4は、図2、図3に示すように、1枚の金属製の板が折り曲げられて形成されており、側壁23、24に取り付けられる板状の本体部41と、半田付けによってプリント基板6に固定される取付部42と、を有している。   A pair of fixing brackets 4 is attached to each of the pair of side walls 23 and 24 described above. As shown in FIGS. 2 and 3, the fixing bracket 4 is formed by bending a single metal plate, and a plate-like main body 41 attached to the side walls 23 and 24 and soldering. And an attachment portion 42 fixed to the printed circuit board 6.

本体部41は、略長方形状に設けられており、側壁本体7に重ねられるとともに、その両端部41aが側壁本体7と固定金具取付壁8との隙間に嵌め込まれることによって側壁23、24に取り付けられる。   The main body 41 is provided in a substantially rectangular shape, and is attached to the side walls 23 and 24 by being overlapped with the side wall main body 7 and having both end portions 41a fitted into the gap between the side wall main body 7 and the fixing bracket mounting wall 8. It is done.

取付部42は、本体部41のプリント基板6側の下端部に連なり、本体部41の平面と直交する方向に延びた長方形状に形成されている。取付部42は、プリント基板6の表面6Aに設けられた固定用導体パターン62より一回り小さい長方形状に形成されており、この固定用導体パターン62に重ねられて半田付けされる。また、取付部42は、その中央付近に設けられた円形の穴部45と、この穴部45を囲むように、取付部42の表面42A(図3中、上側に位置する面をいう)をその厚み方向に掘り下げて設けられた環状の溝部43と、を有している。さらに、溝部43の内部には、取付部42を円柱状にくり抜いて貫通する複数の貫通穴44が等間隔に設けられている。なお、溝部43の配設位置及び形状、並びに、貫通穴の形状、個数及び間隔等は、表面実装コネクタ1の構成等に応じて適宜定められる。   The attachment portion 42 is connected to the lower end portion of the main body portion 41 on the printed circuit board 6 side, and is formed in a rectangular shape extending in a direction orthogonal to the plane of the main body portion 41. The attachment portion 42 is formed in a rectangular shape that is slightly smaller than the fixing conductor pattern 62 provided on the surface 6A of the printed circuit board 6, and is superposed on the fixing conductor pattern 62 and soldered. The mounting portion 42 has a circular hole 45 provided in the vicinity of the center thereof, and a surface 42A of the mounting portion 42 (refers to a surface located on the upper side in FIG. 3) so as to surround the hole 45. And an annular groove 43 provided by being dug down in the thickness direction. Furthermore, a plurality of through holes 44 are formed in the groove portion 43 at equal intervals so as to penetrate the attachment portion 42 in a columnar shape. The arrangement position and shape of the groove 43 and the shape, number and interval of the through holes are appropriately determined according to the configuration of the surface mount connector 1 and the like.

補強部材46は、半田が溶融する温度において該半田と同様に溶融する合成樹脂で構成されており、図4に示すように、溝部43の平面視形状に沿って平板環状に形成された基部46aと、基部46aと一体に形成され且つ基部46aの一方の面から垂直に立設された円柱状の複数の突出部46bと、を有している。複数の突出部46bは、複数の貫通穴44と同数、同間隔、且つ、貫通穴44に挿通可能な形状に形成されている。また、突出部46bは、その高さが取付部42の溝部43内における厚みとほぼ同一に形成されている。即ち、補強部材46が、その突出部46bが設けられた一方の面を溝部43に向けるようにして溝部43にはめ込まれることで、複数の突出部46bがそれぞれに対応する複数の貫通穴44に挿通され、そして、突出部46bの先端46cが、取付部42の裏面42B(図3中、下側に位置する面をいう)と同じ高さに位置づけられる。   The reinforcing member 46 is made of a synthetic resin that melts in the same manner as the solder at a temperature at which the solder melts. As shown in FIG. 4, a base portion 46 a formed in a flat plate shape along the planar view shape of the groove 43. And a plurality of columnar protrusions 46b that are formed integrally with the base 46a and are erected vertically from one surface of the base 46a. The plurality of protrusions 46 b are formed in the same number and the same interval as the plurality of through holes 44 and in a shape that can be inserted into the through holes 44. Further, the protrusion 46 b has a height that is substantially the same as the thickness of the mounting portion 42 in the groove 43. That is, the reinforcing member 46 is fitted into the groove portion 43 so that one surface provided with the protruding portion 46b faces the groove portion 43, so that the plurality of protruding portions 46b are respectively inserted into the corresponding through holes 44. The leading end 46c of the protruding portion 46b is positioned at the same height as the back surface 42B of the mounting portion 42 (referred to as a lower surface in FIG. 3).

上記構成の表面実装コネクタ1は、図1に示すように、取付部42が固定用導体パターン62に重なるように半田付けされてプリント基板6の表面6A上に固定されている。さらに、図2に示すように、補強部材46が取付部42に設けられた溝部43にはめ込まれており、補強部材46の複数の突出部46bが溝部43内の複数の貫通穴44に挿通されるとともに、突出部46bの先端46cが固定用導体パターン62上の半田H内にとけ込んでおり、そのため、複数の突出部46bを介して互いに接続された基部46aと固定用導体パターン62とが、取付部42を挟み込んでプリント基板6の表面6A上に固定している。   As shown in FIG. 1, the surface mount connector 1 having the above-described configuration is fixed on the surface 6 </ b> A of the printed circuit board 6 by being soldered so that the mounting portion 42 overlaps the fixing conductor pattern 62. Further, as shown in FIG. 2, the reinforcing member 46 is fitted in the groove portion 43 provided in the mounting portion 42, and the plurality of protruding portions 46 b of the reinforcing member 46 are inserted into the plurality of through holes 44 in the groove portion 43. At the same time, the tip 46c of the protrusion 46b is melted into the solder H on the fixing conductor pattern 62. Therefore, the base 46a and the fixing conductor pattern 62 connected to each other via the plurality of protrusions 46b are The mounting portion 42 is sandwiched and fixed on the surface 6A of the printed circuit board 6.

次に、上述した表面実装コネクタ1とプリント基板6とを組み付ける手順について、図5〜図8を参照して説明する。   Next, a procedure for assembling the surface mount connector 1 and the printed board 6 described above will be described with reference to FIGS.

図5は、表面実装コネクタ1をプリント基板6に取り付ける前の状態を示す斜視図である。図6は、図5の状態におけるプリント基板6と固定金具4と補強部材46との位置関係を示す断面図である。図7は、表面実装コネクタ1をプリント基板6に取り付けた後の状態を示す斜視図である。図8は、図7の状態におけるプリント基板6と固定金具4と補強部材46との位置関係を示す断面図である。   FIG. 5 is a perspective view showing a state before the surface mount connector 1 is attached to the printed circuit board 6. FIG. 6 is a cross-sectional view showing the positional relationship among the printed circuit board 6, the fixing bracket 4, and the reinforcing member 46 in the state shown in FIG. 5. FIG. 7 is a perspective view showing a state after the surface mount connector 1 is attached to the printed circuit board 6. FIG. 8 is a cross-sectional view showing the positional relationship among the printed circuit board 6, the fixing bracket 4, and the reinforcing member 46 in the state of FIG. 7.

まず、図5、図6に示す状態において、図示しない組立装置によって、プリント基板6の固定用導体パターン62、及び、端子用導体パターン64、それぞれにクリーム状の半田(不図示)が塗布される。そして、固定金具4の取付部42がプリント基板6の表面6A上の固定用導体パターン62に重なるように、表面実装コネクタ1がプリント基板6の上方に位置づけられる。そして、取付部42の溝部43内に設けられた複数の貫通穴44と、これら複数の貫通穴44それぞれに対応する補強部材46の複数の突出部46bとが同一直線上に配置されるように、補強部材が取付部42の上方に位置づけられる。そののち、取付部42が固定用導体パターン62に重なるように、表面実装コネクタ1をプリント基板6の表面6Aに載置し、そして、補強部材46が、その突出部46bを貫通穴44に挿通して溝部43にはめ込まれる。なお、図5、図6において、側壁23に取り付けられる固定金具4及び補強部材46は、側壁24に取り付けられるものと同一であるので、それら記載を省略している。   First, in the state shown in FIGS. 5 and 6, cream-like solder (not shown) is applied to each of the fixing conductor pattern 62 and the terminal conductor pattern 64 of the printed circuit board 6 by an assembly device (not shown). . Then, the surface mount connector 1 is positioned above the printed circuit board 6 so that the mounting portion 42 of the fixing metal fitting 4 overlaps the fixing conductor pattern 62 on the surface 6A of the printed circuit board 6. And the some through-hole 44 provided in the groove part 43 of the attaching part 42 and the some protrusion part 46b of the reinforcement member 46 corresponding to each of these some through-hole 44 are arrange | positioned on the same straight line. The reinforcing member is positioned above the attachment portion 42. After that, the surface mount connector 1 is placed on the surface 6A of the printed circuit board 6 so that the mounting portion 42 overlaps the fixing conductor pattern 62, and the reinforcing member 46 inserts the protruding portion 46b into the through hole 44. And fitted into the groove 43. In FIGS. 5 and 6, the fixing bracket 4 and the reinforcing member 46 attached to the side wall 23 are the same as those attached to the side wall 24, and thus the description thereof is omitted.

補強部材46が溝部43にはめ込まれると、補強部材46の突出部46bの先端46cが、固定用導体パターン62上に塗布された非溶融状態の半田に接する。この状態で、不図示の高温炉内を走行させると、高温炉内の温度によって、上述の半田が溶融し、この半田に接していた突出部46bの先端46cがこの半田内に溶け込み、同時に、補強部材46の基部46aが溶融して溝部43に密着する。そして、高温炉内から取り出され、半田が冷却されて固化されると、図7、図8に示すように、取付部42と固定用導体パターン62とが半田によって互いに固定され、さらに、図2に模式的に示されるように、突出部46bの先端46cが半田H内に溶け込んだ状態で固まり、即ち、突出部46bを介して基部46aと固定用導体パターン62とが接続されて、これらによって取付部42が狭持されて固定される。   When the reinforcing member 46 is fitted in the groove 43, the tip 46 c of the protruding portion 46 b of the reinforcing member 46 comes into contact with the unmelted solder applied on the fixing conductor pattern 62. In this state, when traveling in a high temperature furnace (not shown), the above-described solder is melted by the temperature in the high temperature furnace, and the tip 46c of the protruding portion 46b in contact with the solder is melted into the solder. The base portion 46 a of the reinforcing member 46 is melted and is in close contact with the groove portion 43. Then, when the solder is taken out from the high-temperature furnace and the solder is cooled and solidified, the mounting portion 42 and the fixing conductor pattern 62 are fixed to each other by the solder as shown in FIGS. As shown schematically, the tip 46c of the protrusion 46b is solidified in a state of being melted in the solder H, that is, the base 46a and the fixing conductor pattern 62 are connected via the protrusion 46b. The attachment part 42 is pinched and fixed.

このように、本発明の表面実装コネクタ1は、固定金具4の取付部42に設けられた貫通穴44と、平面視面積が貫通穴44より大きく形成されて取付部42に重ねられる基部46a、及び、基部46aから突出して一体形成され且つ貫通穴44を通り先端46cが半田内に溶け込む突出部46bを有する合成樹脂からなる補強部材46と、を有しているので、貫通穴44に通された突出部46bを介して基部46aと固定用導体パターン62上の半田とが接続され、これら基部46aと固定用導体パターン62と間に取付部42を狭持する。また、補強部材46の突出部46bの先端46cが半田内に溶け込むものであり、即ち、半田が溶融する温度において半田と同様に溶融する合成樹脂で構成されているので、補強部材46の突出部46bの先端46cを非溶融状態の半田に接するように配置したのち、該半田を溶融状態にさせる温度を加えると、その温度によって該先端46cが半田内に溶け込む。   As described above, the surface mount connector 1 of the present invention includes a through hole 44 provided in the attachment portion 42 of the fixing bracket 4 and a base portion 46a that is formed in a plan view area larger than the through hole 44 and overlaps the attachment portion 42. And a reinforcing member 46 made of a synthetic resin that has a protruding portion 46b that protrudes from the base portion 46a and is integrally formed and passes through the through hole 44 and the tip 46c melts into the solder, and is passed through the through hole 44. The base portion 46 a and the solder on the fixing conductor pattern 62 are connected via the protruding portion 46 b, and the attachment portion 42 is sandwiched between the base portion 46 a and the fixing conductor pattern 62. Further, the tip 46c of the protruding portion 46b of the reinforcing member 46 is melted into the solder, that is, the protruding portion of the reinforcing member 46 is made of a synthetic resin that melts in the same manner as the solder at a temperature at which the solder melts. After the tip 46c of 46b is placed in contact with the unmelted solder, a temperature for bringing the solder into a molten state is applied, and the tip 46c melts into the solder due to the temperature.

また、取付部42が補強部材46の基部46aの平面視形状に沿って形成された溝部43を有し、貫通穴44が溝部43内に設けられているので、補強部材46を取付部42に配設するとき、補強部材46がこの溝部43にはめ込まれ、そして、半田が溶融する温度が加えられたとき、補強部材46が該溝部43内で溶融される。   Further, since the attachment portion 42 has the groove portion 43 formed along the planar view shape of the base portion 46 a of the reinforcing member 46 and the through hole 44 is provided in the groove portion 43, the reinforcement member 46 is used as the attachment portion 42. When disposing, the reinforcing member 46 is fitted into the groove 43, and the reinforcing member 46 is melted in the groove 43 when a temperature at which the solder melts is applied.

以上より、本発明によれば、補強部材46の突出部46bを介して補強部材46の基部46aと固定用導体パターン62上の半田とが接続され、これら基部46aと固定用導体パターン62との間に取付部42を狭持することができるので、この補強部材46を設けることによって、取付部42と固定用導体パターン62とを固定する強度を補強することができる。また、補強部材46の突出部46bの先端46cを非溶融状態の半田に接するように配置したのち、該半田を溶融させる温度を加えると、その温度によって該先端46cが半田内に溶け込むので、別途作業工程を設けることなく、補強部材46の基部46aと固定用導体パターン62上の半田とを接続することができる。そのため、組立工程の増加によるコストアップを抑えつつ、表面実装コネクタ1がプリント基板6から剥離することに抗する強度を向上させることができる。   As described above, according to the present invention, the base portion 46 a of the reinforcing member 46 and the solder on the fixing conductor pattern 62 are connected via the protruding portion 46 b of the reinforcing member 46, and the base portion 46 a and the fixing conductor pattern 62 are connected to each other. Since the attachment portion 42 can be held between them, the strength for fixing the attachment portion 42 and the fixing conductor pattern 62 can be reinforced by providing the reinforcing member 46. Further, after the tip 46c of the protruding portion 46b of the reinforcing member 46 is disposed so as to contact the unmelted solder, when the temperature at which the solder is melted is applied, the tip 46c is melted into the solder by that temperature. The base 46a of the reinforcing member 46 and the solder on the fixing conductor pattern 62 can be connected without providing a work process. Therefore, it is possible to improve the strength against the surface mount connector 1 being peeled from the printed circuit board 6 while suppressing an increase in cost due to an increase in the assembly process.

また、補強部材46が溝部43にはめ込まれたのち、該溝部43内で溶融されるので、補強部材46を取付部42により密着させることができ、さらに強固に取付部42を固定用導体パターン62に固定することができる。   Further, since the reinforcing member 46 is fitted into the groove portion 43 and then melted in the groove portion 43, the reinforcing member 46 can be brought into close contact with the attachment portion 42, and the attachment portion 42 is more firmly attached to the fixing conductor pattern 62. Can be fixed to.

なお、本実施形態において、図1に示すように、取付部42に環状の溝部43を設け、この溝部43にはめ込み可能なように基部46aが平板環状に形成された補強部材46を用いていたが、これに限定するものではなく、取付部42における溝部の有無は任意であり、また、補強部材は、その基部の平面視形状が貫通穴44より大きければその形状は任意である。例えば、図9、図10に示すように、取付部42に、溝部を設けずに所定の間隔で一対の貫通穴44を設け、長方形状の基部47aと、基部47aに一体成形され且つこれら貫通穴44それぞれに挿通される突出部46bと、を備えた補強部材47を用いてもよい。この補強部材47は、上述した補強部材46と同様に、基部47aの一方の面から突出して一体形成された複数の突出部47bを備え、図10に示すように、これら複数の突出部47bの先端47cが、固定用導体パターン62上の半田H内に溶け込んでいる。   In the present embodiment, as shown in FIG. 1, an annular groove 43 is provided in the mounting portion 42, and a reinforcing member 46 in which a base 46 a is formed in an annular shape so as to be fitted into the groove 43 is used. However, the present invention is not limited to this, and the presence or absence of the groove portion in the attachment portion 42 is arbitrary, and the shape of the reinforcing member is arbitrary if the shape of the base portion in plan view is larger than the through hole 44. For example, as shown in FIGS. 9 and 10, a pair of through holes 44 are provided at a predetermined interval in the mounting portion 42 without providing a groove portion, and the rectangular base portion 47 a and the base portion 47 a are integrally formed and penetrated. You may use the reinforcement member 47 provided with the protrusion part 46b penetrated by each of the hole 44. FIG. Similar to the reinforcing member 46 described above, the reinforcing member 47 includes a plurality of protruding portions 47b that are integrally formed by protruding from one surface of the base portion 47a. As shown in FIG. The tip 47 c is melted into the solder H on the fixing conductor pattern 62.

なお、前述した実施形態は本発明の代表的な形態を示したに過ぎず、本発明は、実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。   In addition, embodiment mentioned above only showed the typical form of this invention, and this invention is not limited to embodiment. That is, various modifications can be made without departing from the scope of the present invention.

本発明の一実施形態である表面実装コネクタを示す斜視図である。It is a perspective view which shows the surface mount connector which is one Embodiment of this invention. 図1中のA−A線に沿った断面を模式的に示す拡大断面図である。It is an expanded sectional view which shows typically the cross section along the AA in FIG. 図1の固定金具の拡大斜視図である。It is an expansion perspective view of the fixing metal fitting of FIG. 図1の補強部材の拡大斜視図である。It is an expansion perspective view of the reinforcing member of FIG. 表面実装コネクタをプリント基板に取り付ける前の状態を示す斜視図である。It is a perspective view which shows the state before attaching a surface mount connector to a printed circuit board. 図5中のB−B線に沿った断面図である。It is sectional drawing along the BB line in FIG. 表面実装コネクタをプリント基板に取り付けた後の状態を示す斜視図である。It is a perspective view which shows the state after attaching the surface mount connector to a printed circuit board. 図7中のC−C線に沿った断面図である。It is sectional drawing along CC line in FIG. 補強部材の変形例を示す斜視図である。It is a perspective view which shows the modification of a reinforcement member. 図9中のD−D線に沿った断面を模式的に示す拡大断面図である。FIG. 10 is an enlarged cross-sectional view schematically showing a cross section taken along line DD in FIG. 9. 従来の表面実装コネクタを示す側面図である。It is a side view which shows the conventional surface mount connector.

符号の説明Explanation of symbols

1 表面実装コネクタ
2 コネクタハウジング
4 固定金具
6 プリント基板
6A プリント基板の表面
41 本体部
42 取付部
43 溝部
44 貫通穴
46 補強部材
46a 基部
46b 突出部
46c 突出部の先端
62 固定用導体パターン
DESCRIPTION OF SYMBOLS 1 Surface mount connector 2 Connector housing 4 Fixing metal fitting 6 Printed circuit board 6A The surface of a printed circuit board 41 Main body part 42 Mounting part 43 Groove part 44 Through hole 46 Reinforcement member 46a Base part 46b Projection part 46c Projection end 62 Fixed conductor pattern

Claims (2)

コネクタハウジングと、前記コネクタハウジングに取り付けられた本体部及び前記本体部の一端から曲げ形成された平板状の取付部を有する固定金具と、を有し、前記取付部がプリント基板の表面に重ねられて半田付けされることで前記プリント基板に固定される表面実装コネクタにおいて、
前記取付部に設けられた貫通穴と、
平面視面積が前記貫通穴より大きく形成されて前記取付部に重ねられる基部、及び、該基部から突出して一体形成され且つ前記貫通穴を通り先端が前記半田内に溶け込む突出部を有する合成樹脂からなる補強部材と、有していることを特徴とする表面実装コネクタ。
A connector housing; and a fixing member having a main body portion attached to the connector housing and a flat plate-like attachment portion formed by bending from one end of the main body portion, and the attachment portion is superimposed on the surface of the printed circuit board. In the surface mount connector fixed to the printed circuit board by being soldered,
A through hole provided in the mounting portion;
From a synthetic resin having a base formed in a plan view area larger than the through-hole and overlaid on the mounting portion, and a protrusion that is integrally formed protruding from the base and the tip passes through the through-hole and melts into the solder And a reinforcing member, and a surface mount connector.
前記取付部が、前記補強部材の前記基部の平面視形状に沿って形成された溝部を有し、
前記貫通穴が、前記溝部内に設けられていることを特徴とする請求項1に記載の表面実装コネクタ。
The mounting portion has a groove formed along the shape of the base of the reinforcing member in plan view;
The surface mount connector according to claim 1, wherein the through hole is provided in the groove.
JP2008132830A 2008-05-21 2008-05-21 Surface mount connector Expired - Fee Related JP5058882B2 (en)

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Application Number Priority Date Filing Date Title
JP2008132830A JP5058882B2 (en) 2008-05-21 2008-05-21 Surface mount connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008132830A JP5058882B2 (en) 2008-05-21 2008-05-21 Surface mount connector

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Publication Number Publication Date
JP2009283224A JP2009283224A (en) 2009-12-03
JP5058882B2 true JP5058882B2 (en) 2012-10-24

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JPS5183793U (en) * 1974-12-27 1976-07-05
US5380221A (en) * 1993-06-18 1995-01-10 The Whitaker Corporation Anchor pin
JP4013914B2 (en) * 2004-04-12 2007-11-28 住友電装株式会社 Board connector
JP2008293796A (en) * 2007-05-24 2008-12-04 Yazaki Corp Fixing fitting and fixing method of fixing fitting, fixing structure of fixing fitting
JP5054462B2 (en) * 2007-08-06 2012-10-24 富士通コンポーネント株式会社 Balanced transmission connector
JP5308687B2 (en) * 2008-02-13 2013-10-09 矢崎総業株式会社 Mounting structure of surface mount connector to printed circuit board

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