JP5057331B2 - Polishing object holder - Google Patents

Description

  The present invention relates to an object holding tool used when an object to be polished is installed and fixed in a polishing machine at the time of precision planar polishing of a semiconductor wafer, LCD glass, an interlayer insulating film of a semiconductor device, metal wiring, and the like.

  When polishing an object to be polished such as a semiconductor wafer, LCD glass, or semiconductor device, the object to be polished is pressed against a polishing cloth placed on a surface plate while being held by a polishing head, and passed through a slurry containing abrasive grains. And is polished by sliding. In the polishing, a polishing object holder is used for the polishing head in order to prevent the polishing object from falling off due to frictional force or centrifugal force.

  FIG. 10 shows a conventional workpiece holder. In addition, the thing of patent document 1 is mentioned as an example of the conventional to-be-polished object holder.

  The object holder 30 includes a holding frame member 32 having a holding hole 36 for holding an object to be polished 35 and a backing material 31 made of an elastic body for holding the object to be polished 35. These are fixed to each other via the layer 33. The holding frame member 32 is called a template and suppresses the slip of the object to be polished 35 in the lateral direction and prevents the object to be polished 35 from jumping out during polishing.

  As the elastic body to be the backing material 31, a wet coagulated porous film that is a polymer elastic foam suitable for holding the object to be polished 35 is generally used.

  As the material of the holding frame member 32, a laminated plate obtained by laminating and pressing a fiber material such as glass fiber, aramid fiber, carbon fiber, paper fiber, etc. using a resin such as an epoxy resin, a phenol resin, or a silicon resin is generally used. Has been used.

  The object holder 30 uses surface tension generated when the object 35 passes through a liquid such as water, and generates a negative pressure between the backing material 31 and the holding interface between the object 35 and the object to be polished. The object 35 is adsorbed and held.

The workpiece holder 30 is generally used by being attached to an upper surface plate 37 on the polishing head side of a polishing machine via an adhesive layer 34. At this time, a rotational force in the direction of rotation of the surface plate 37 acts on the object to be polished 35, and a force acts in such a direction as to release it to the outer peripheral portion. This force causes inconveniences such that the object to be polished 35 collides with the holding frame member 32 at the time of polishing, and the object to be polished 35 is cracked. Further, when the object to be polished 35 collides with the holding frame member 32, the holding frame member 32 is broken and the constituent members such as the fiber layer and the resin layer in the holding frame member 32 are dropped, and the object to be polished 35 is polished. There arises a disadvantage that scratches (hereinafter referred to as scratches) occur.
JP 2003-225857 A

  As a method for solving the above problem, by increasing the width and thickness of the holding frame member 32, the workpiece 35 is prevented from jumping out and climbing up, and cracking of the workpiece 35 has been suppressed. However, when the width and thickness of the holding frame member 32 are increased, the pressure distribution state to the object to be polished 35 is often non-uniform, and the polishing flatness cannot be ensured. For this reason, it has been difficult to design a product that is consistent with the prevention of protrusion and cracking of the workpiece 35 and the flatness of polishing.

  Moreover, the material of the holding frame member 32 has been changed to hard fibers made of polyamide, polyimide, etc., and the breakage of the holding frame member 32 has been implemented, but the object holder itself becomes very expensive, Loss of profitability and the breakage of the holding frame member 32 are caused by local pressure. Therefore, it is difficult to prevent the breakage even with the hard material, which may cause more excessive scratches. It was connected.

  Accordingly, the present invention has been made to solve the above-described problems, and prevents the object to be polished from jumping out and getting on, preventing the object to be polished and the holding frame material from being damaged, preventing scratches, and improving the polishing flatness. An object of the present invention is to provide a workpiece holder that is secured and inexpensive.

A polishing object holder according to the present invention includes a backing material that is fixed to a polishing head and holds the object to be polished, and a holding frame material that is fixed to the polishing head or the backing material and holds the outer periphery of the object to be polished. a workpiece holder comprising a cushioning material via an adhesive layer along the opening peripheral surface of the holding hole for holding the workpiece which has been established in the holding frame members, said openings in peripheral While being fixed only to the surface, the cushioning material is formed of a softer material than the holding frame material .

  The cushioning material is preferably made of an annular member fitted into the holding hole, or made of a belt-like member arranged along the inner peripheral surface of the holding hole.

  According to the workpiece holder of the present invention, the buffer material is fixed via the adhesive layer along the inner peripheral surface of the holding hole of the holding frame material, so that the outer periphery of the workpiece is rotated by the rotational force of the surface plate during polishing. When a force is applied in a direction to escape to the part, the object to be polished hits the cushioning material, so that the impact can be mitigated, and the object to be polished can be prevented from jumping out and getting on.

  In addition, the object to be polished hits the cushioning material at the time of polishing, so that the impact can be mitigated, and damage to the object to be polished and the holding frame material can be prevented.

  Moreover, since the breakage of the holding frame material can be prevented, scratching can be prevented.

  In addition, by fixing the cushioning material to the inner peripheral surface of the opening of the holding frame material, it is possible to prevent the object to be polished from jumping out and climbing on, and to prevent the object to be polished and the holding frame material from being damaged. Therefore, it is possible to ensure the polishing flatness and obtain a good polishing result.

  Further, since the material of the holding frame material has been conventionally used, and expensive hard fibers or the like are not used, an inexpensive object holder can be provided.

  According to the present invention, the object to be polished can be prevented from jumping out and climbing up, the object to be polished and the holding frame material can be prevented from being damaged, scratches can be prevented, the polishing flatness is ensured, and good polishing results can be obtained. In addition, an inexpensive workpiece holder can be provided.

  An embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a plan view of a frame material of an object holder, FIG. 2 is a cross-sectional view of the object holder, and FIG. 3 is a cross-sectional view of a polished state.

  1 and 2, 10 is a workpiece holder, 11 is a backing material, 12 is a holding frame material, 13 is an adhesive layer, 14 is a cushioning material, 15 and 16 are adhesive layers, 17 is an object to be polished, 18 is A holding hole 23 is an upper surface plate which is the polishing head side of the polishing machine.

  The workpiece holder 10 includes a backing material 11, a holding frame material 12, an adhesive layer 13, a buffer material 14, and an adhesive layer 15. The backing material 11 is attached to the surface plate 23 via the adhesive layer 16. .

  The backing material 11 is made of an elastic body that holds the workpiece 17, and a wet coagulated porous film that is a polymer elastic foam is generally used as the elastic body.

  The holding frame member 12 is formed in a circular shape having a holding hole 18 in which the object to be polished 17 is installed, and is fixed to the backing material 11 through an adhesive layer 13 such as a double-sided adhesive tape or adhesive. . The holding frame member 12 is generally a laminated plate obtained by laminating and pressing a fiber material such as glass fiber, aramid fiber, carbon fiber, paper fiber, etc. using a resin such as epoxy resin, phenol resin, or silicon resin. It has been.

  The cushioning material 14 is fixed along the inner peripheral surface of the holding hole 18 of the holding frame member 12 via an adhesive layer 15 such as a double-sided adhesive tape or adhesive. The buffer material 14 is fixed only to the inner peripheral surface of the holding hole 18 by the adhesive layer 15, and is not fixed to the surface of the backing material 11. Thus, the freedom degree when the to-be-polished object 17 contacts is raised by not fixing the surface at the side of the backing material 11 of the buffer material 14.

  The buffer material 14 is a polymer elastic body having a thickness of 0.1 to 2.0 mm and an Asker C hardness of 60 to 90, or a polymer having a thickness of 0.1 to 2.0 mm and a compression elastic modulus of 70 to 98%. Made of foam. As the cushioning material 14 of the present embodiment, an elastic body such as an annular soft rubber having an outer diameter substantially equal to the inner diameter of the holding hole 18 is used. In addition, as an elastic body, what is necessary is just softer than the holding frame material 12, and it is not restricted to soft rubber, For example, urethane foam, silicon rubber, etc. may be sufficient. Further, if the thickness of the cushioning material 14 is less than 0.1 mm, it will be hard enough to be the same as the hardness of the holding frame material 12, and if it is thicker than 2.0 mm, it will become too soft and easily deformed, which is not preferable. When the buffer material 14 is fixed, the adhesive layer 15 is fixed in advance to the inner peripheral surface of the opening of the holding frame member 12, the buffer material 14 is fitted into the holding hole 18, and the outer peripheral surface is bonded to the adhesive layer 15. Alternatively, the adhesive layer 15 may be fixed to the outer peripheral surface of the cushioning material 14 and fitted into the holding hole 18 so that the adhesive layer 15 is bonded to the inner peripheral surface of the holding frame member 12. .

  Next, polishing of the workpiece 17 will be described.

  First, the workpiece 17 is held in the holding hole 18 of the workpiece holder 10. The object holder 10 uses the surface tension generated when the object 17 passes through a liquid such as water, and generates a negative pressure between the backing material 11 and the holding interface between the object 17 and the object to be polished. The object 17 is adsorbed and held. Then, as shown in FIG. 3, the object to be polished 17 is pressed against the polishing cloth 19 installed on the surface plate while being held by the object holder 10 and is slid through the slurry containing abrasive grains. It is polished by moving.

  According to the polishing object holder 10 of the present invention, the cushioning material 14 is fixed via the adhesive layer 15 along the inner peripheral surface of the holding hole 18 of the holding frame member 12, so that the rotational force of the surface plate 34 is polished during polishing. When the force acts in the direction (shearing direction) in which the object to be polished 35 escapes to the outer peripheral portion, the object to be polished 35 hits the cushioning material 14 to reduce the impact, and the object to be polished 35 jumps out and rides up. Can be prevented.

  Further, the object to be polished 35 hits the cushioning material 14 at the time of polishing, so that the impact can be mitigated, and damage to the object to be polished 35 and the holding frame material 12 can be prevented. Thus, the yield can be improved since damage to the object to be polished 35 can be prevented.

  Moreover, since the breakage of the holding frame member 12 can be prevented, scratching can be prevented. Thus, by suppressing the occurrence of scratches, the life of the object holder 10 is extended, the replacement frequency is reduced, and the cost can be reduced.

  Further, by fixing the cushioning material 14 to the inner peripheral surface of the opening of the holding frame member 12, it is possible to prevent the object to be polished 35 from jumping out and climbing up and preventing the object to be polished 35 and the holding frame member 12 from being damaged. Since the width and thickness of the frame member 12 are not increased, the polishing flatness can be ensured and good polishing results can be obtained.

  Moreover, since the material of the holding frame material 12 is conventionally used and does not use expensive hard fibers or the like, an inexpensive object holder 10 can be provided.

  Further, since the cushioning material 14 is fixed by the adhesive layer 15 along the opening inner peripheral surface of the holding frame member 12, it is possible to more reliably prevent the workpiece 17 from jumping out and climbing up during polishing, Breakage of the holding frame member 12 can be prevented more reliably. That is, as shown in FIG. 4, when the cushioning material 20 is fixed to the backing material 11 via the adhesive layer 21 and not fixed to the inner peripheral surface of the opening of the holding frame material 12, When a force acts on the object 17 to escape to the outer periphery, and the object 17 tries to ride on the shock absorber 20, the shock absorber 20 is held by the holding frame member 12 as shown in FIG. Therefore, the cushioning material 20 is easily turned over, and the object to be polished 17 jumps out or collides with the holding frame material 12. In this respect, when the cushioning material 14 is fixed by the adhesive layer 15 along the inner circumferential surface of the opening of the holding frame member 12 as in the present embodiment, the object to be polished 17 is about to ride on the cushioning material 14. Further, the buffer material 14 is not turned over, and it is possible to reliably prevent the workpiece 17 from popping out or colliding with the holding frame material 12. Furthermore, in this embodiment, since the cushioning material 14 is not fixed to the backing material 11, the degree of freedom of deformation is high, and the impact when the workpiece 17 hits the cushioning material 14 during polishing is effectively reduced. can do.

  In the above embodiment, the holding frame member 12 uses the workpiece holder 10 fixed to the backing material 11 via the adhesive layer 13, but the outer peripheral surface of the backing material 11 as shown in FIG. In the workpiece holding tool 10 in which the holding frame member 12 is independently fixed to the surface plate 23 of the polishing machine, the cushioning material 14 is disposed along the inner peripheral surface of the holding frame member 12 via the adhesive layer 15. It may be fixed.

  Further, as shown in FIG. 7, the cushioning material 14 may be formed by arranging a belt-like elastic body in an annular shape along the inner peripheral surface of the opening of the holding frame member 12. In this case, both ends of the buffer material 14 are not overlapped so that the impact of the workpiece 17 during polishing can be absorbed uniformly over the entire circumference of the workpiece 17. For this reason, a gap 22 may be formed between both ends, but the gap 22 is preferably as small as possible, or more preferably no gap.

  Further, as shown in FIG. 8, the holding frame member 12 may be formed in a rectangular shape in which a holding hole 18 in which the workpiece 17 is installed is opened. Furthermore, the holding frame member 12 may have a shape other than a circle or a rectangle.

  Furthermore, as shown in FIG. 9, a plurality of holding holes 18 may be created in the holding frame member 12. Also in this case, the buffer material 14 is fixed via the adhesive layer 15 along the inner peripheral surface of each holding hole 18. The shape of the holding hole 18 may be a shape other than a circle, for example, a rectangle.

Example An example of the workpiece holder 10 according to the present invention will be described.

  A backing material (trade name: R601) manufactured by Nitta Haas was used for the wet-solidified porous film as the backing material 11, and glass epoxy was used for the holding frame material 12.

Polishing was performed under the following conditions by using Speed Fam Co., Ltd. (device name: SP800) as the polishing machine. Glass to be polished 17: lime glass (0.7 mm), polishing pressure: 100 gf / cm ² , lower surface plate rotation speed: 100 rpm, carrier rotation speed: 70 rpm, slurry flow rate: 10 l / min, polishing cloth: Nita Haas Made by company (trade name: MHC14B).

  The soft rubber as the buffer material 14 had a thickness of 1.0 mm, a height of 0.7 mm, an Asker C hardness of 60, and was fixed to the inner peripheral surface of the opening of the holding frame material 12 with an adhesive layer 15 of a double-sided adhesive tape.

  As a comparative example, as shown in FIG. 10, a material in which a holding frame material 32 was simply fixed on a backing material 31 was used, and the polishing was performed under the same conditions as in the above example except for that.

  Table 1 shows the polishing results of Examples and Comparative Examples.

研磨結果については、スクラッチの発生頻度、被研磨物のクラック・飛び出しの発生頻度について、実施例と比較例それぞれについて測定した。なお、各研磨結果は、比較例の発生頻度を１．０としてその比で示している。

About the grinding | polishing result, it measured about the Example and the comparative example about the occurrence frequency of a scratch and the occurrence frequency of the crack of a to-be-polished object, and a pop-out. In addition, each grinding | polishing result is shown by the ratio with the generation frequency of a comparative example being 1.0.

  From Table 1, it can be seen that the frequency of occurrence of scratches is 0.5 in the example with respect to the comparative example 1.0, and the frequency of occurrence of scratches is halved. It can also be seen that the frequency of occurrence of cracks and pop-outs of the object to be polished is reduced to 0.8 in the example with respect to the comparative example 1.0.

  As described above, the case where the cushioning material 14 is fixed along the inner peripheral surface of the opening of the holding frame member 12 via the adhesive layer 15 is more scratched than the case where the holding frame member is fixed to the backing material. It has been found that both the frequency and the frequency of occurrence of cracks and pop-outs of the workpiece can be reduced.

  INDUSTRIAL APPLICABILITY The present invention is useful as an object holding tool for holding an object to be polished such as a semiconductor wafer, LCD glass, an interlayer insulating film of a semiconductor device, and metal wiring during precision planar polishing.

The top view of the holding | maintenance frame material of the to-be-polished object holder in embodiment of this invention Sectional drawing of the to-be-polished object holder in embodiment of this invention Sectional drawing of the grinding | polishing state in embodiment of this invention Sectional drawing of the workpiece holder in a comparative example Sectional drawing which shows the problem of the to-be-polished object holder in a comparative example Sectional drawing of the to-be-polished object holder in the modification of this invention The top view of the holding frame material of the to-be-polished object holder in the modification of this invention The top view of the holding frame material of the to-be-polished object holder in the modification of this invention The top view of the holding frame material of the to-be-polished object holder in the modification of this invention Sectional drawing of the workpiece holder in the conventional example

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Polishing object holder 11 Backing material 12 Holding frame material 14 Buffer material 15 Adhesive layer 17 Polishing object 18 Holding hole 23 Surface plate

Claims (3)

A polishing object holder comprising a backing material fixed to a polishing head and holding an object to be polished, and a holding frame member fixed to the polishing head or the backing material and holding an outer periphery of the object to be polished. And
While fixing the cushioning material only on the inner peripheral surface of the opening along the inner peripheral surface of the opening along the inner peripheral surface of the opening of the holding hole that holds the object to be polished established in the holding frame member , A workpiece holder made of a material softer than the holding frame material . The said buffer material consists of a cyclic | annular member fitted in the said holding hole , The to- be-polished object holder of Claim 1 characterized by the above-mentioned. The said buffer material consists of a strip | belt-shaped member arrange | positioned along the opening internal peripheral surface of the said holding hole , The to-be-polished object holder of Claim 1 characterized by the above-mentioned.

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