JP5047065B2 - Connecting device for waveguide and dielectric substrate - Google Patents

Description

  The present invention relates to a connection device between a waveguide and a dielectric substrate.

  Conventionally, as a connection mechanism between waveguides, for example, there has been a choke flange shown in FIG. 18A is a front view of the choke flange 1, and FIG. 18B is a cross-sectional view thereof. In the figure, 1 is a waveguide, 2a is an inner choke groove, 2b is an outer choke groove, 3 is a partition metal plate in the choke groove 2a and the choke groove 2b, and L is a length delimited by the partition metal plate 3 Reference numeral 5 denotes the inside of the waveguide 1, and 6 denotes a waveguide facing the waveguide 1. The operating frequency is λ, and L is a length of λ / 2 to λ.

  FIG. 19 is an explanatory view of the principle of the choke flange of FIG. 18, and FIG. 19 (a) is a cross-sectional view of the choke structure portion, with the impedance viewed from X1, Y1, X2, and Y2. FIG. 19B shows the choke structure as a circuit as a transmission line. In FIG. 19A, the right end is the end of the flange, and the portion between the end and the point X1 is the contact portion with the mating flange. Here, the impedance viewed from the X1 point in the outward direction (in the direction of the arrow) is Z1, and the characteristic impedance of each groove and the opposed surface portion as a radial line is Z2, Z3, Z4, and Z5 in order from the outside.

  Next, the operation will be described. Since each groove and each width of the opposed surface portion are set to λ / 4, it functions as a λ / 4 transformer, and as a circuit, as shown in FIG. A plurality of different λ / 4 transformers are connected in cascade, and their ends are terminated with Z1.

  Z1 is the impedance of the contact portion between the flanges and has a small impedance.

As shown in FIG. 19A, each impedance viewed from the point of the waveguide wall surface is {Z1 (Z3) ² (Z5) ² } / {(Z2) ² (Z4) ² }. Therefore, the end face of the waveguide can be in a state close to a short circuit.

  Further, since the choke groove 2a and the choke groove 2b are partitioned by the partition metal plate 3, the resonance frequency in the length direction of the groove portion is prevented from entering the operating frequency band, so that the influence of the resonance on the operation is affected. Deterred.

JP 2002-374101 A

  A normal choke groove is generally as narrow as λ / 16. However, in the conventional example, this groove is λ / 4, which has the advantage of being easy to process.

  However, the structure of the conventional example has a problem that it is difficult to ensure sufficient dimensional accuracy because the depth and width of the groove must be accurately manufactured particularly at a high frequency.

  In addition, the structure of the conventional example only considers the connection between the waveguides, and when considering the connection between the waveguide and the dielectric substrate, the contact between dissimilar metals often occurs, and electric corrosion occurs. There was a problem.

  In order to solve the above-mentioned problems, the present invention has a simpler structure than the conventional one by adjusting the flange shape of the waveguide and the position of the fixing mechanism. An object of the present invention is to provide a connection device for a waveguide and a dielectric substrate.

  In addition, it is possible to provide a connecting device for a waveguide and a dielectric substrate that prevents electrolytic corrosion by inserting a dielectric between the waveguide and the dielectric substrate, and further manages the gap size between the two. Objective.

  According to the present invention, a dielectric substrate provided with a first outer conductor layer and a second outer conductor layer on both opposing main surfaces of the dielectric layer, and a tube shaft with a gap from the first outer conductor layer. A step-like structure in which the direction is perpendicular to the first outer conductor layer, and the thickness of the step decreases toward the outer side of the tube axis toward the outer side of the tube axis on the side of the dielectric layer. A waveguide provided with a flange, a dielectric block filled between the first outer conductor layer and the flange of the waveguide, and a plurality of discretely provided fixing mechanisms for fixing them, The dielectric block and the first outer conductor layer have through-holes and coupling holes respectively at positions facing the opening of the waveguide, and the in-tube wavelength in the dielectric block is λg, The step-like structure is located at λg / 4 from the inner wall surface of the waveguide. And a connecting device for a waveguide and a dielectric substrate, wherein the plurality of fixing mechanisms are located at positions separated from the step-like structure by (2n + 1) λg / 4 (n: positive integer). is there.

  According to the present invention, it is possible to provide an apparatus for connecting a waveguide and a dielectric substrate, which has a simpler structure than that of the prior art, and which relaxes the dimensional accuracy limitation during manufacturing.

Embodiment 1 FIG.
1 is a cross-sectional view of a waveguide and dielectric substrate connecting apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a view of the apparatus of FIG. 1 as viewed from the left side of the drawing. In both figures, reference numeral 7 denotes a first waveguide disposed so as to be perpendicular to the first outer conductor layer 9a, that is, the dielectric substrate (9, 9a, 9b), and 7a denotes a first conductor. The inside of the wave tube 7, 7b is a step-like structure provided on the flange 7f of the first waveguide 7, 9 is a first dielectric layer, 9a is a first outer conductor layer, and 9b is a second outer conductor. Layers 10 and 10 are dielectric blocks filled in a gap between the first outer conductor layer 9a and the flange 7f of the first waveguide 7, and 11 is an opening of the first waveguide 7 of the first outer conductor layer 9a. A coupling hole 10a having a predetermined size provided at a position facing 7c and a through hole 12a having a predetermined size provided at a position facing the opening 7c of the first waveguide 7 of the dielectric block 10 are provided. Is formed of, for example, a bolt and a nut, the flange 7f of the first waveguide 7, the first dielectric layer 9, and the first and second outer layers. A dielectric substrate made of a conductor layer 9a, 9b, a fixing mechanism for fixing the dielectric block 10, 14a indicates the radio path in the case of exciting the first waveguide 7.

  The flange 7f at the dielectric layer side end of the waveguide 7 has a step-like structure 7b whose thickness decreases toward the outer side of the tube axis on the side opposite to the first dielectric layer 9 side. Assuming that the wavelength in the tube of the dielectric block 10 is λg, the step-like structure 7b is at a position away from the inner wall surface of the first waveguide 7 by λg / 4, and each fixing mechanism 12 is approximately (about) from the step-like structure 7b. 2n + 1) λg / 4 (n: positive integer) away.

  The operation of this embodiment will be described. As shown in the radio wave path 14 a, the radio wave traveling through the first waveguide 7 propagates to the first dielectric layer 9 through the coupling hole 11. The radio wave traveling in the first waveguide 7 is supplied from the left end of the first waveguide 7 in FIG. 1 by a power supply means such as another waveguide (not shown).

  The dielectric block 10 formed by filling between the flange 7f of the waveguide 7 and the first outer conductor layer 9a is sandwiched between the flange 7f and the first outer conductor layer 9a. It is a waveguide. The impedance of this waveguide looking outward from the stepped structure 7b appears to be open due to the stepped structure, and therefore, outward from the inner wall of the first waveguide 7 that is λg / 4 away from the stepped structure 7b. The impedance seen is low and generally short.

  Therefore, there is almost no radio wave leaking into the dielectric block 10 from the gap between the first waveguide 7 and the first outer conductor layer 9a, and the radio wave can be propagated without loss.

  This embodiment is particularly effective in the case where the waveguide 7 and the dielectric substrate (9, 9a, 9b) cannot be brazed directly, and it is possible to avoid risks such as leakage of adhesive and characteristic deterioration due to poor adhesion.

  In addition, since the first waveguide 7 and the first outer conductor layer 9a are separated by the dielectric block 10, it is possible to prevent electrolytic corrosion and to prevent water from entering the inside of the first waveguide 7. Can be used as a mechanism.

  Furthermore, the thickness of the dielectric block 10 can be used to manage the gap size between the flange 7f of the waveguide and the first outer conductor layer 9a, thereby preventing the leakage of radio waves.

  In the above description, the embodiment has been described in which the radio wave propagates from the first waveguide 7 to the dielectric substrate (9, 9a, 9b), but the dielectric substrate (9, 9a, 9b). The same effect can be obtained even when radio waves propagate from the first to the first waveguide 7.

Embodiment 2. FIG.
FIG. 3 is a cross-sectional view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 2 of the present invention, and FIG. 4 is a partial perspective view of the apparatus of FIG. 3 from the left side of the drawing. In both figures, the same or corresponding parts as those of the above embodiment are indicated by the same or corresponding reference numerals, and the description thereof will be omitted (the same applies hereinafter). 3 and 4, reference numeral 13 denotes a second waveguide disposed so as to be parallel to the first outer conductor layer 9a, that is, the dielectric substrate (9, 9a, 9b) with a gap therebetween, and 13a denotes a second waveguide. 13f is a flange provided on the first dielectric layer 9 side of the second waveguide 13, and 13b is a step-like structure provided on the flange 13f of the second waveguide 13. , 13c are holes of a predetermined size provided on the surface of the second waveguide 13 facing the dielectric substrate (9, 9a, 9b), and 11 is the second waveguide of the first outer conductor layer 9a. A coupling hole having a predetermined size provided at a position facing the hole 13c of the tube 13 and a through hole having a predetermined size provided at a position facing the hole 13c of the second waveguide 13 of the dielectric block 10 are provided. Reference numeral 14b denotes a path of radio waves when the second waveguide 13 is excited.

  The operation of this embodiment will be described. As shown in the radio wave path 14 b, the radio wave traveling through the second waveguide 13 propagates to the first dielectric layer 9 through the coupling hole 11. The radio wave traveling in the second waveguide 13 is supplied from the front side or the back side of the second waveguide 13 in FIG. 3 by a feeding means such as another waveguide (not shown). .

  The operation and effect of the present embodiment are the same as those of the first embodiment. However, since the second waveguide 13 is disposed in parallel to the first dielectric layer 9, the entire structure is obtained from the first embodiment. Can be made thinner.

Embodiment 3 FIG.
The connection device between the waveguide and the dielectric substrate according to the third embodiment is the same as that of the first embodiment shown in FIG. 1 and FIG. 2 or the second embodiment shown in FIG. 3 and FIG. The waveguide wavelength in the dielectric block 10 is λg, the height L1 of the step-like structures 7b and 13b is λ / 2 or less, and the step-like structures 7b and 13b to the end faces of the flanges 7f and 13f of the waveguides 7 and 13 The distance L2 is n × λg / 2 (n: a positive integer).

  In addition to the effects described in the first embodiment or the second embodiment, the impedance when the outside is viewed from the step-like structure 7b or 13b is more because L2 is n × λg / 2 (n: positive integer). It looks clearly open, and therefore the impedance when viewed from the inner wall surface of the first waveguide 7 or the second waveguide 13 is lower and the operation as a short circuit is improved.

  Further, since it is not necessary to provide a choke groove as in the prior art and the structure is simple, the dimensional accuracy during manufacture can be relaxed.

Embodiment 4 FIG.
FIG. 5 is a sectional view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 4 of the present invention. In FIG. 7, 15 is a second dielectric layer (auxiliary dielectric layer) provided on the surface of the first outer conductor layer 9a facing the first waveguide 7, and 14c is the first conductor layer. A path of radio waves when the wave tube 7 is excited is shown.

  The flange 7f at the dielectric layer side end of the first waveguide 7 has a step-like structure 7b whose thickness decreases toward the outside of the tube axis on the side opposite to the first dielectric layer 9 side. The in-tube wavelength in the second dielectric layer 15 is λg ′, the step-like structure 7b is at a position away from the inner wall surface of the first waveguide 7 by λg ′ / 4, and each fixing mechanism 12 is separated from the step-like structure 7b. The distance is approximately (about) (2n + 1) λg ′ / 4 (n: positive integer).

  The operation of this embodiment will be described. As shown in the radio wave path 14 c, the radio wave traveling through the first waveguide 7 passes through the second dielectric layer 15 through the coupling hole 11 and propagates to the first dielectric layer 9.

  Between the first waveguide 7 whose tube axis is perpendicular to the first outer conductor layer 9a and the first outer conductor layer 9a, there is a second dielectric layer 15 and a space, which is a kind of It has a waveguide structure. The impedance viewed from the outside of the step-like structure 7b to the waveguide appears to be open because of the step-like structure, and therefore the impedance seen from the inner wall surface of the first waveguide 7 becomes lower and becomes almost short-circuited.

  Therefore, the radio wave can be propagated without loss without leaking into the gap between the first waveguide 7 and the second dielectric layer 15.

  The present embodiment is also effective when the first waveguide 7 and the dielectric substrate (9, 9a, 9b) cannot be brazed, and risks such as leakage of adhesive and deterioration of characteristics due to poor adhesion. Can be avoided.

  Since the second dielectric layer 15 and the first dielectric layer 9 can be integrally formed as a multilayer substrate, there is no need to prepare the dielectric block 10 as in the first embodiment, and the number of components can be reduced. There is.

  Further, since the second dielectric layer 15 is inserted between the first waveguide 7 and the first outer conductor layer 9a, it is intended to prevent electrolytic corrosion and to manage the gap size between them. Yes.

Embodiment 5 FIG.
6 is a cross-sectional view of a waveguide and dielectric substrate connecting apparatus according to Embodiment 5 of the present invention. In FIG. 6, 13 is a second waveguide whose tube axis is parallel to the first outer conductor layer 9a, 15 is a second dielectric layer (auxiliary dielectric layer), and 14d is a second dielectric layer. The path of a radio wave when the waveguide 13 is excited is shown.

  The operation of this embodiment will be described. As shown in the radio wave path 14 d, the radio wave traveling through the second waveguide 13 passes through the second dielectric layer 15 through the coupling hole 11 and propagates to the first dielectric layer 9.

  In the present embodiment, in addition to the effects of the fourth embodiment, the entire structure can be made thin as in the second embodiment.

Embodiment 6 FIG.
FIG. 7 is a sectional view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 6 of the present invention. The connection device between the waveguide and the dielectric substrate according to the sixth embodiment is different from the fourth embodiment or the fifth embodiment in that, as shown in FIG. An etching mask layer 18 provided with a through hole 18a is provided at a position facing the hole 13c. FIG. 7 shows a case where an etching mask layer 18 is provided instead of the second dielectric layer 15 in the fourth embodiment.

  In the present embodiment, the etching mask layer 18 serves as the second dielectric layer 15.

  In addition to the effects of the fourth or fifth embodiment, the step of removing the etching mask layer at the time of manufacture can be omitted, and the second dielectric layer 15 can be omitted, so that the manufacturing cost can be reduced.

Embodiment 7 FIG.
8 is a cross-sectional view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 7 of the present invention, and FIG. 9 is a view of the apparatus of FIG. 8 as viewed from the left side of the drawing. In the seventh embodiment, as shown in FIGS. 8 and 9 in the fourth to sixth embodiments, the second dielectric layer 15 or the etching mask layer 18 is penetrated, and the first outer conductor layer 9a and the like, for example, A through-hole plated conductor 17a for connecting the first waveguide 7 and a land 17b generated when the through-hole plated conductor 17a is manufactured are provided. 8 and FIG. 9 show the case where the embodiment is implemented in the fourth embodiment of FIG. In the case of the fifth embodiment of FIG. 6, a through-hole plated conductor 17a and a land 17b for connecting the first outer conductor layer 9a and the second waveguide 13 are provided, and in the case of the sixth embodiment of FIG. Includes a through-hole plated conductor 17a and a land 17b that penetrate the etching mask layer 18 and connect the first outer conductor layer 9a and the first or second waveguides 7 and 13.

  The land 17b swells and can make point electrical contact with the first waveguide 7 or the second waveguide 13 to ensure reliable electrical conduction.

  Further, the impedance of the outside seen from the step-like structure 7b or the step-like structure 13b appears to be open because of the step-like structure, and therefore, the impedance is outside from the inner wall surface of the first waveguide 7 or the second waveguide 13. The impedance seen is low and generally short.

  Therefore, even when there is a gap between the first waveguide 7 or the second waveguide 13 and the second dielectric layer 15 or the etching mask layer 18, it is possible to propagate radio waves without loss.

  Further, this embodiment can be applied even when the contact surface between the waveguide and the dielectric substrate cannot be brazed, and it is possible to avoid risks such as leakage of adhesive and characteristic deterioration due to poor adhesion.

Embodiment 8 FIG.
10 is a sectional view of a waveguide / dielectric substrate connecting apparatus according to an eighth embodiment of the present invention. The waveguide / dielectric substrate connecting apparatus according to the eighth embodiment is, for example, as shown in FIG. 10 in place of the auxiliary dielectric layer 15 or the etching mask layer 18 in the fourth to seventh embodiments. A plurality of dielectric spacers 19 are discretely provided between the flange 7f of one waveguide 7 and the first outer conductor layer 9a. This may be provided between the flange 13f of the second waveguide 13 and the first outer conductor layer 9a.

  The length of the plurality of dielectric spacers 19 makes it possible to manage the gap size between the first waveguide 7 or the second waveguide 13 and the first outer conductor layer 9a, and to prevent leakage of radio waves. There is.

  Further, the impedance of the outside seen from the step-like structure 7b or the step-like structure 13b appears to be open because of the step-like structure, and therefore, the impedance is outside from the inner wall surface of the first waveguide 7 or the second waveguide 13. The impedance seen is low and generally short.

  Therefore, even when there is a gap between the first waveguide 7 or the second waveguide 13 and the first dielectric layer 9, it is possible to propagate radio waves without loss.

  Further, this embodiment can be applied even when the contact surface between the waveguide and the dielectric substrate cannot be brazed, and it is possible to avoid risks such as leakage of adhesive and characteristic deterioration due to poor adhesion.

  In addition, since there is no dielectric in the region in the vicinity of the step-like structure 7b or the step-like structure 13b, it is possible to reduce the dielectric loss.

Embodiment 9 FIG.
The connection device between the waveguide and the dielectric substrate according to the ninth embodiment is the first waveguide 7 or the second waveguide 13 in the fourth to eighth embodiments, where the wavelength of the operating frequency is λ. And the wavelength in the region formed by the gap between the second dielectric layer 15 or the etching mask layer 18 or the dielectric spacer 19 is λgg, and the height L1 of the step-like structure 7b or the step-like structure 13b is λ / 2 or less. The distance L2 between the step-like structures 7b and 13b and the flange end surface is n × λgg / 2 (n: positive integer).

  In addition to the effects of the fourth to eighth embodiments, the impedance viewed from the outside of the step-like structure 7b or the step-like structure 13b is more clearly open because L2 is n × λgg / 2. It looks and is open because of the step-like structure. Therefore, the impedance when viewed from the inner wall surface of the first waveguide 7 or the second waveguide 13 is lower and the operation as a short circuit is improved.

  Further, the structure is simpler than the structure using the conventional choke groove, and the dimensional accuracy at the time of manufacture can be relaxed as in the fourth to eighth embodiments.

Embodiment 10 FIG.
FIG. 11 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 10 of the present invention. In the waveguide and dielectric substrate connecting apparatus according to the tenth embodiment, the waveguide 20 is provided in the first dielectric layer 9 in the first to ninth embodiments as shown in FIG. .

  The waveguide 20 is formed by a plurality of through-hole plated conductors as shown in FIGS.

  The impedance of the outside seen from the stepped structure 7b or the stepped structure 13b appears to be open because of the stepped structure, and therefore the outside is seen from the inner wall surface of the first waveguide 7 or the second waveguide 13. Impedance becomes low and becomes almost short-circuited.

  Therefore, even when there is a gap between the first waveguide 7 or the second waveguide 13 and the first outer conductor layer 9a, it is possible to propagate radio waves without loss.

  Further, this embodiment can be applied even when the contact surface between the waveguide and the dielectric substrate cannot be brazed, and it is possible to avoid risks such as leakage of adhesive and characteristic deterioration due to poor adhesion.

  Thus, the same effect can be obtained even when the waveguide is a dielectric-filled waveguide.

Embodiment 11 FIG.
FIG. 12 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 11 of the present invention. In the tenth embodiment, the waveguide and dielectric substrate connecting apparatus according to the eleventh embodiment is provided with a slot 21 parallel to the tube axis of the waveguide 20 as shown in FIG.

  Thus, even if the shunt slot is used as a coupling hole, the same effects as those of the first to tenth embodiments can be obtained.

Embodiment 12 FIG.
FIG. 13 is a perspective view of a connecting device for a waveguide and a dielectric substrate according to Embodiment 12 of the present invention. In the tenth embodiment, the connecting device for a waveguide and a dielectric substrate according to the twelfth embodiment is provided with a slot 22 orthogonal to the tube axis of the waveguide 20 as shown in FIG.

  Thus, even if the series slot is used as a coupling hole, the same effects as those of the first to tenth embodiments can be obtained.

Embodiment 13 FIG.
FIG. 14 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 13 of the present invention. In the tenth embodiment, the waveguide and dielectric substrate connecting apparatus according to the thirteenth embodiment is provided with a slot 23 that is inclined with respect to the tube axis of the waveguide 20 as shown in FIG. Is.

  As described above, the same effect as in the first to tenth embodiments can be obtained even when the oblique slot is used as the coupling hole.

Embodiment 14 FIG.
15 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 14 of the present invention. In the eleventh embodiment, the connecting device for a waveguide and a dielectric substrate according to the fourteenth embodiment has a tube axis of the waveguide 20 with λd as the in-tube wavelength in the waveguide 20, as shown in FIG. The short-circuit surface 24 provided at a position away from the parallel slot 21 by (2n + 1) λd / 4 (n: positive integer) is provided.

  Thus, the same effect as in the eleventh embodiment can be obtained even in the configuration of the two-port circuit using the shunt slot coupling.

Embodiment 15 FIG.
FIG. 16 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 15 of the present invention. In the twelfth embodiment, the waveguide and dielectric substrate connecting apparatus according to the fifteenth embodiment is arranged on the tube axis of the waveguide 20 with λd being the in-tube wavelength in the waveguide 20 as shown in FIG. A short-circuit surface 25 provided at a position away from the orthogonal slot 22 by n × λd / 2 (n: positive integer) is provided.

  Thus, the same effect as in the twelfth embodiment can be obtained even in the configuration of the two-port circuit using series slot coupling.

Embodiment 16 FIG.
FIG. 17 is a perspective view of a waveguide / dielectric substrate connecting apparatus according to Embodiment 16 of the present invention. In the thirteenth embodiment, the waveguide and dielectric substrate connecting apparatus according to the sixteenth embodiment is arranged on the tube axis of the waveguide 20 with λd as the in-tube wavelength in the waveguide 20, as shown in FIG. On the other hand, a short-circuit surface 26 provided at a position away from the slot 23 inclined obliquely by n × λd / 2 (n: positive integer) is provided.

  Thus, the same effect as that of the thirteenth embodiment can be obtained even in the configuration of the two-port circuit using the diagonal slot coupling.

Embodiment 17. FIG.
In the waveguide and dielectric substrate connecting apparatus according to the seventeenth embodiment, the height of the step-like structure of the first to sixteenth embodiments is limited to λ / 2 or less. In the embodiment other than the above, the use frequency is λ, and the height L1 of the step-like structure 7b or the step-like structure 13b is λ / 2 or more.

  In this structure, the outside from the step-like structure 7b or the step-like structure 13b is regarded as a simple open structure, not a waveguide, and the L2 dimension is arbitrary, and there is an advantage that the degree of freedom of design increases. Of course, the dimensional accuracy of L2 is not necessary.

  Further, this embodiment can be applied even when the contact surface between the waveguide and the dielectric substrate cannot be brazed, and it is possible to avoid risks such as leakage of adhesive and characteristic deterioration due to poor adhesion.

Needless to say, the present invention is not limited to the above-described embodiments, but includes all possible combinations of these embodiments.
Also, the size and size of the waveguide opening and hole in the waveguide and dielectric substrate connecting device according to the present invention, the through hole of the dielectric block, the coupling hole of the external waveguide layer, etc. may not be the same. Moreover, it is not limited to a special size relationship.

It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 1 of this invention. It is the figure which looked at the apparatus of FIG. 1 from the left side of drawing. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 2 of this invention. It is the figure which looked at the apparatus of FIG. 3 from the left side of drawing. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 4 of this invention. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 5 of this invention. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 6 of this invention. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 7 of this invention. It is the figure which looked at the apparatus of FIG. 8 from the left side of drawing. It is sectional drawing of the connection apparatus of the waveguide and dielectric substrate by Embodiment 8 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 10 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 11 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 12 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 13 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 14 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 15 of this invention. It is a perspective view of the connection apparatus of the waveguide and dielectric substrate by Embodiment 16 of this invention. It is a figure which shows the structure of the conventional choke flange. It is explanatory drawing of the principle of the choke flange of FIG.

Explanation of symbols

  7 first waveguide, 7a inside, 7b stepped structure, 7c opening, 7f flange, 9 first dielectric layer, 9a first outer conductor layer, 9b second outer conductor layer, 10 dielectric block 10a through hole, 11 coupling hole, 12 fixing mechanism, 13 second waveguide, 13a inside, 13b stepped structure, 13c hole, 13f flange, 14a-14d path, 15 second dielectric layer (auxiliary dielectric) Body layer), 17a through-hole plated conductor, 17b land, 18 etching mask layer, 18a through-hole, 19 dielectric spacer, 20 waveguide, 21-23 slot, 24-26 short-circuit plane.

Claims (18)

A dielectric substrate provided with a first outer conductor layer and a second outer conductor layer on both opposing main surfaces of the dielectric layer,
The dielectric layer is disposed so that the tube axis direction is perpendicular to the first outer conductor layer with a gap from the first outer conductor layer, and toward the outside of the tube axis at the dielectric layer side end. A waveguide provided with a flange having a step-like structure with a thickness decreasing on the opposite side;
A dielectric block filled between the first outer conductor layer and a waveguide flange;
A plurality of discretely provided fixing mechanisms for fixing them;
With
The dielectric block and the first outer conductor layer have a through hole and a coupling hole at positions facing the opening of the waveguide, respectively.
When the wavelength in the tube of the dielectric block is λg, the stepped structure of the flange is located at λg / 4 from the inner wall surface of the waveguide, and the plurality of fixing mechanisms are approximately (2n + 1) λg from the stepped structure. / 4 (n: positive integer) A device for connecting a waveguide and a dielectric substrate, which is located at a position distant from the outside. A dielectric substrate provided with a first outer conductor layer and a second outer conductor layer on both opposing main surfaces of the dielectric layer,
The tube is disposed so that the tube axis direction is parallel to the first outer conductor layer with a gap from the first outer conductor layer, and a hole is provided on the surface facing the dielectric layer, and further on the dielectric layer side A waveguide provided with a flange having a step-like structure whose thickness decreases toward the outside of the hole on the opposite side of the dielectric layer;
A dielectric block filled between the first outer conductor layer and a waveguide flange;
A plurality of discretely provided fixing mechanisms for fixing them;
With
The dielectric block and the first outer conductor layer have a through hole and a coupling hole at positions facing the holes of the waveguide, respectively.
When the wavelength in the tube of the dielectric block is λg, the stepped structure of the flange is located at λg / 4 from the inner wall surface of the waveguide, and the plurality of fixing mechanisms are approximately (2n + 1) λg from the stepped structure. / 4 (n: positive integer) A device for connecting a waveguide and a dielectric substrate, which is located at a position distant from the outside.   The wavelength of the operating frequency is λ, the height of the step-like structure is λ / 2 or less, and the distance between the step-like structure and the end of the flange is n × λg / 2 (n: positive integer). 3. A device for connecting a waveguide and a dielectric substrate according to claim 1 or 2.   3. The apparatus for connecting a waveguide and a dielectric substrate according to claim 1, wherein the wavelength of the used frequency is λ and the height of the step-like structure is λ / 2 or more. A dielectric substrate provided with a first outer conductor layer and a second outer conductor layer on both opposing main surfaces of the dielectric layer,
The dielectric layer is disposed so that the tube axis direction is perpendicular to the first outer conductor layer with a gap from the first outer conductor layer, and toward the outside of the tube axis at the dielectric layer side end. A waveguide provided with a flange having a step-like structure with a thickness decreasing on the opposite side;
An auxiliary dielectric layer provided on a surface of the first outer conductor layer facing the waveguide;
A plurality of discretely provided fixing mechanisms for fixing them;
With
The first outer conductor layer has a coupling hole at a position facing the opening of the waveguide;
The guide wavelength of the auxiliary dielectric layer is λg ′, the stepped structure of the flange is located at λg ′ / 4 from the inner wall surface of the waveguide, and the plurality of fixing mechanisms are substantially 2n + 1) λg ′ / 4 (n: positive integer) The waveguide and the dielectric substrate connecting device are located apart from each other. A dielectric substrate provided with a first outer conductor layer and a second outer conductor layer on both opposing main surfaces of the dielectric layer,
The tube is disposed so that the tube axis direction is parallel to the first outer conductor layer with a gap from the first outer conductor layer, and a hole is provided on the surface facing the dielectric layer, and further on the dielectric layer side A waveguide provided with a flange having a step-like structure whose thickness decreases toward the outside of the hole on the opposite side of the dielectric layer;
An auxiliary dielectric layer provided on a surface of the first outer conductor layer facing the waveguide;
A plurality of discretely provided fixing mechanisms for fixing them;
With
The first outer conductor layer has a coupling hole at a position facing the hole of the waveguide;
The guide wavelength of the auxiliary dielectric layer is λg ′, the stepped structure of the flange is located at λg ′ / 4 from the inner wall surface of the waveguide, and the plurality of fixing mechanisms are substantially 2n + 1) λg ′ / 4 (n: positive integer) The waveguide and the dielectric substrate connecting device are located apart from each other.   7. The waveguide and dielectric according to claim 5, further comprising an etching mask layer provided with a through hole at a position facing the opening or hole of the waveguide instead of the auxiliary dielectric layer. Body board connection device.   A plurality of through-hole plating conductors are provided at positions corresponding to the periphery of the opening or hole of the waveguide through the auxiliary dielectric layer or etching mask layer, and the waveguide of the auxiliary dielectric layer or etching mask layer 8. A waveguide and a dielectric substrate according to claim 5, wherein lands for electrically connecting the waveguide and the through-hole plated conductor are provided on a surface on the side. Connection equipment.   Between the flange of the waveguide and the first outer conductor layer, a plurality of dielectric spacers having predetermined heights are discretely disposed in the vicinity of the fixing mechanism instead of the auxiliary dielectric layer or the etching mask layer. The waveguide and dielectric substrate connecting device according to any one of claims 5 to 8, wherein the waveguide and dielectric substrate connecting device is disposed.   The wavelength of the frequency used is λ, the wavelength in the region formed by the gap between the waveguide and the auxiliary dielectric layer or the etching mask layer or the dielectric spacer is λgg, the height of the stepped structure is λ / 2 or less, The waveguide and dielectric according to any one of claims 5 to 9, wherein a distance between the step-like structure and the flange end portion is set to n × λgg / 2 (n: a positive integer). Board connection device.   10. The connection between a waveguide and a dielectric substrate according to any one of claims 5 to 9, wherein the wavelength of the used frequency is λ, and the height of the step-like structure is λ / 2 or more. apparatus.   12. The waveguide and dielectric substrate connecting device according to claim 1, wherein a waveguide is provided in the dielectric substrate.   13. The apparatus for connecting a waveguide to a dielectric substrate according to claim 12, wherein the coupling hole of the first outer conductor layer is a slot parallel to the tube axis of the waveguide.   13. The apparatus for connecting a waveguide to a dielectric substrate according to claim 12, wherein the coupling hole of the first outer conductor layer is a slot orthogonal to the tube axis of the waveguide.   13. The apparatus for connecting a waveguide and a dielectric substrate according to claim 12, wherein the coupling hole of the first outer conductor layer is a slot inclined obliquely with respect to the tube axis of the waveguide.   The waveguide wavelength of the waveguide is λd, and the waveguide has a short-circuit surface at a position (2n + 1) λd / 4 (n: positive integer) from a slot parallel to the tube axis. The waveguide and dielectric substrate connection device described.   The waveguide wavelength of the waveguide is λd, and the waveguide has a short-circuit surface at a position of n × λd / 2 (n: positive integer) from a slot orthogonal to the tube axis. Device for connecting waveguides and dielectric substrates.   The waveguide wavelength of the waveguide is λd, and the waveguide has a short-circuit surface at a position of n × λd / 2 (n: positive integer) from a slot inclined obliquely to the tube axis. Item 15. A device for connecting a waveguide and a dielectric substrate according to Item 15.

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