JP5032048B2 - Substrate processing apparatus control device, control method, and recording medium storing control program - Google Patents

Description

  The present invention relates to a control device for a plurality of substrate processing apparatuses that process a substrate using power supplied from a power source. In particular, the present invention relates to a control device for a substrate processing apparatus that determines whether or not to permit execution of a new process based on the maximum power value consumed during the execution of each process.

  In recent years, a so-called multi-chamber type system having a plurality of chambers (substrate processing apparatuses) for processing a substrate has been constructed. According to this system, by processing a plurality of substrates in parallel, the processing efficiency can be improved and the throughput can be improved.

  However, in the prior art, when an operator or the like requests the start of a process, the system permits the process request unconditionally without making any judgment. For this reason, in the conventional system, a power supply facility having a power exceeding the maximum power value expected to be consumed when processes are executed in all chambers is prepared, or each chamber is provided with a power supply facility. It was necessary to execute the processes in order.

  However, in the former case, a power supply facility having a very large capacity is required, which increases energy consumption and costs for the power supply facility. On the other hand, in the latter case, since the number of processes executed in parallel decreases, the capacity of the system cannot be maximized and the throughput decreases.

Therefore, according to one aspect of the present invention, there is provided a control device for a plurality of substrate processing apparatuses that process a substrate using electric power supplied from a power source, wherein the plurality of processes are performed in the plurality of substrate processing apparatuses. When executed, the maximum power value predicted to be consumed in each process is stored as a process maximum power value for each process, and the maximum power value that can be used by the plurality of substrate processing apparatuses as a whole is stored as a system maximum power value. And a total value of the process maximum power value corresponding to the process being executed in each substrate processing apparatus and the process maximum power value corresponding to the requested process in response to a process execution request. An arithmetic unit to be summed, and a determination unit that determines whether or not to permit execution of the requested process by comparing the value summed by the arithmetic unit with the system maximum power value It comprises, the storage unit stores the priority of a process, the calculation unit in accordance with the priority of the process, control of the substrate processing apparatus for specifying a process for which sums the process maximum power value An apparatus is provided.

According to this, the maximum value of power expected to be consumed in each process is totaled for all the processes being executed, and this total value is added to the power expected to be consumed in the process requesting the start. By adding the maximum values and comparing the total value with the system maximum power value, it is determined whether or not execution of the requested process is permitted. As a result, when a process requesting to start is executed, if it is expected that power consumption exceeding the power supply capacity of the system is expected, the execution of the process can not be permitted and can be put on standby. Further, when executing a process, it is possible to preferentially execute a process having a high priority while considering a peak of power consumed by each process being executed.

  That is, the determination unit may permit the requested process to be executed only when the value added by the calculation unit is within the system maximum power value. According to this, when the maximum power consumption expected when the process execution is permitted exceeds the system maximum power value, the execution of the requested process is not permitted. As a result, the power consumed simultaneously in the entire system can be suppressed. As a result, the capacity of the power supply facility can be reduced. In particular, in each process, a large amount of power is consumed at the start, and the energy (rush energy) at that time is 5 to 10 times the power consumed thereafter. Therefore, the above determination that distributes the inrush energy generated at startup in each process by permitting / disallowing the start of each process and prevents more than a predetermined amount of power from being consumed at one time suppresses the capacity of the power supply equipment, This is a very effective means to save energy.

  In this way, by reducing the capacity of the power supply equipment compared to the conventional case where the execution of the process was allowed unconditionally, the energy consumption consumed at one time can be reduced and the cost for the power supply equipment can be reduced. Can do. In particular, the energy saving effect of the present invention is very large in a substrate processing factory that operates continuously for 24 hours and always uses a large amount of energy such as gas and electric power during operation.

  The calculation unit calculates a total of the process maximum power values corresponding to the processes being executed in each substrate processing apparatus after the process being executed in each substrate processing apparatus is completed, and calculates the calculated process The sum of the maximum power values and the process maximum power value corresponding to the requested process are summed again, and the determination unit compares the resumed value with the system maximum power value, It may be determined whether to allow execution of the requested process.

  When a process ends, the maximum power value that is expected to be consumed by the running process decreases. Therefore, in the present invention, when the process is completed, the process maximum power values of all the processes being executed are summed again, and this total value and the maximum power value predicted to be consumed by the process requesting the start are obtained. It is determined again whether or not to permit execution of the requested process by adding the values and comparing the total value with the system maximum power value. As a result, it is possible to quickly adapt to the time transition of the power consumption in the system and execute the optimum process without delay at that time. As a result, throughput can be improved.

The storage unit stores the order in which the process execution requests are received, and the arithmetic unit determines the process execution request according to the priority of the process and when there are a plurality of processes having the same priority. In accordance with the order received, the process that is the target of adding the process maximum power values may be specified. According to this, it is possible to preferentially execute a process that has been requested to be executed in consideration of a peak of power consumed by each process being executed.

  At this time, each process may be a process of any unit in which each step of the semiconductor process is a unit. Each process of a semiconductor process means each process, such as film-forming, resist liquid application, exposure, development, etching, ashing, and dicing.

  This is because, when there is no superiority or inferiority in the process, it is important to advance the requested processes in the order in which the process execution requests are received in order to efficiently process each process while simplifying the system control.

  At this time, each process is a unit of the last step for performing predetermined processing on the substrate and the immediately preceding step as one unit, and each unit other than the last step and the immediately preceding step as one unit. It may be a process.

  According to this, for example, if a high priority is given to the process including the final process, the process including the final process is preferentially executed while considering the peak of power consumed by each process being executed. Can be made. As a result, since the processing is finished preferentially from the final process, the entire process proceeds smoothly and the throughput can be improved.

  The storage unit stores the end time of each requested process, and the arithmetic unit follows the priority of the process and if there are a plurality of processes having the same priority, the process In accordance with the end time of, the process that is the target of adding the process maximum power value may be specified.

  According to this, in consideration of the peak of power consumed by each running process, in principle, priority is given to a process with a higher priority, and if there are multiple processes with the same priority, Depending on the end time, the process that ends first can be given priority. As a result, since the processing is finished with priority from the process that has a high priority and finishes earlier, the entire process proceeds smoothly and the throughput can be improved.

  At this time, each process may be a unit of processing in which each step for performing a predetermined process on the substrate is a unit.

  According to this, for example, when the highest priority is given to the process of the final process and the processes of the other processes are set to the same priority, the process of the final process is prioritized while considering the power peak. In addition, a process having the same priority can be executed with priority given to a process that ends first. As a result, the efficiency of the entire system can be improved and the throughput can be improved.

  You may set the priority of the said process so that it may become so high that a process is later. According to this, the process in the subsequent process is preferentially executed while considering the peak of power. As a result, the efficiency of the entire system can be improved and the throughput can be improved.

  Further, the priority order of the processes may be set so as to be higher as the process time is shorter. According to this, the shorter time process is preferentially executed while considering the power peak. As a result, the efficiency of the entire system can be improved and the throughput can be improved.

According to another aspect of the present invention, there is provided a control method for a plurality of substrate processing apparatuses for processing a substrate using power supplied from a power source, wherein the plurality of processes are performed by the plurality of substrate processing apparatuses. Are stored in the storage unit, the maximum power value predicted to be consumed in each process is stored in the storage unit for each process as the process maximum power value, and the plurality of substrate processing apparatuses Each substrate processing apparatus is stored in the storage unit as a maximum power value that can be used as a system maximum power value, and is specified as a summation target according to the priority of the process according to a process execution request. The total value of the process maximum power values corresponding to the processes being executed in the process and the process maximum power value corresponding to the requested process are summed, and the summed value and the system By comparing the beam maximum power value, control method of a substrate processing apparatus determines whether to permit the execution of the requested process is provided.

According to another aspect of the present invention, there is provided a computer-readable recording medium storing a control program for controlling a plurality of substrate processing apparatuses that process a substrate using power supplied from a power source, When a plurality of processes are executed by the plurality of substrate processing apparatuses, the priority order of the processes is stored in the storage unit, and the maximum power value predicted to be consumed in each process is stored for each process as the process maximum power value. And storing the maximum power value that can be used in the whole of the plurality of substrate processing apparatuses as a system maximum power value in the storage unit, and summing according to the priority of the process according to the process execution request . of the processes identified as an object, versus the total value and the requested process of the above process the maximum power value corresponding to a running process in the substrate processing apparatuses Processing for adding the process maximum power value to be performed, and processing for determining whether to permit execution of the requested process by comparing the summed value with the system maximum power value. A computer-readable recording medium storing a control program to be executed by a computer is provided.

  According to this, when the above control method and the above control program are executed, if the process is started, power consumption exceeding the power supply capacity of the system is expected when the process is started. Can wait for the process to run.

  As a result, the power consumed simultaneously in the entire system can be suppressed. As a result, the capacity of the power supply facility can be reduced. As a result, it is possible to reduce the energy consumed at one time and reduce the cost for the power supply equipment, compared to the conventional case where the execution of the process is allowed unconditionally. In particular, the energy saving effect of the present invention is very large in a substrate processing factory that operates continuously for 24 hours and always uses a large amount of energy such as gas and electric power during operation.

  The system maximum power value can be made variable. According to this, it is possible to share power supply equipment in a well-balanced manner with other systems in the factory (for example, summer cooling equipment).

  As described above, according to the present invention, a substrate can be processed using a power supply facility with a smaller capacity.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following description and the accompanying drawings, components having the same configuration and function are denoted by the same reference numerals, and redundant description is omitted. In this specification, 1 mTorr is (10 ⁻³ × 101325/760) Pa, and 1 sccm is (10 ⁻⁶ / 60) m ³ / sec.

(First embodiment)
An outline of the substrate processing system according to the first embodiment of the present invention will be described with reference to FIG. In the present embodiment, a process for etching a glass substrate (hereinafter referred to as a substrate G) will be described as an example.

(Substrate processing system)
The substrate processing system 900 includes a host computer 100, an apparatus controller (hereinafter referred to as EC (Equipment controller) 200), n control controllers 300a to 300n, and n PM (Process Module) systems 400a to 400n. is doing. The host computer 100 and the EC 200 are connected by a network 500 such as the Internet. Further, the EC 200 and the controller are connected by a network 600 such as a LAN (Local Area Network).

  The host computer 100 manages the entire substrate processing system 900. The EC 200 performs management such as sending a command for controlling the etching process to the control controllers 300a to 300n according to the process recipe used for controlling the etching process of the substrate, and storing a history of the used process recipe. Do.

  The controller 300a-300n outputs a drive signal to the PM system 400a-400n based on the command transmitted from the EC 200, and each PM system 400a-400n transports the substrate based on the drive signal, Etching is performed. Processing data at that time (for example, changes over time such as temperature, pressure, and gas flow rate) is transmitted from the controller 300a to 300n to the host computer 100 via the EC 200.

  Next, the hardware configuration of the EC 200 and the PM system 400 will be described with reference to FIGS. 2 and 3, respectively. The hardware configurations of the host computer 100 and the controller 300 are not shown, but are the same as those of the EC 200.

(EC hardware configuration)
As shown in FIG. 2, the EC 200 includes a ROM 205, a RAM 210, a CPU 215, a bus 220, an internal interface (internal I / F) 225, and an external interface (external I / F) 230.

  The ROM 205 stores a basic program executed by the EC 200, a program that is activated when an abnormality occurs, and the like. The RAM 210 stores various programs, data, process recipes, and the like. The ROM 205 and the RAM 210 are examples of a storage device, and may be a storage device such as an EEPROM, an optical disk, or a magneto-optical disk. The CPU 215 determines whether to control the etching process of the substrate according to the process recipe or to permit the execution of the process. The bus 220 is a path for exchanging information between devices.

  The internal interface 225 inputs various data from the keyboard 710 and the touch panel 715 by an operator's operation, and outputs necessary data to the monitor 720 and the speaker 725. The external interface 230 transmits / receives data to / from the host computer 100 and each controller 300.

(PM system hardware configuration)
Next, the hard wafer configuration of the PM system 400 will be described with reference to the plan view of FIG. The PM system 400 is a so-called multi-chamber type system having a plurality of chambers CH (chambers CH1 to CH5: equivalent to a substrate processing apparatus), and a processing unit S for transporting the substrate G and a processing unit S for etching the substrate G. And have. The transport unit H and the processing unit S are connected via a load lock chamber LLM.

  The transport unit H includes a cassette stage 405 and a transport stage 410. Three cassette containers Ca1 to Ca3 are placed on the cassette stage 405. In each cassette container Ca, a plurality of substantially rectangular thin plate-like substrates G are accommodated side by side in a substantially horizontal posture.

  The transfer stage 410 is provided with a transfer mechanism 410a that slides on a guide rail (not shown) extending along the transfer direction (x-axis direction). The transfer mechanism 410a is provided with a transfer arm 410a1 that can be bent and stretched, and can hold the substrate G between each cassette container Ca and the load lock chamber LLM while holding a single substrate G substantially horizontally. It is designed to be transported.

  The processing unit S is provided with five chambers CH1 to CH5 and a transfer chamber 415. The chambers CH1 to CH5 are joined to the transfer chamber 415 via gate valves 420a to 420e that can be opened and closed in an airtight manner.

  The chambers CH1 to CH5 and the transfer chamber 415 are each evacuated to a desired level. The transfer chamber 415 is provided with a transfer mechanism 415a having a transfer arm 415a1 that can be bent and stretched. The transfer arm 415a1 carries the substrate G from the load lock chamber LLM to each chamber CH via the transfer chamber 415, and carries the substrate G after the etching process to the load lock chamber LLM via the transfer chamber 415. It is like that. In the chambers CH1 to CH5, various processes such as a diffusion process, a film forming process, an ashing process, and a sputtering process are performed in addition to the etching process.

(Internal configuration of each chamber CH)
Next, the internal configuration of each chamber CH will be described with reference to a longitudinal sectional view of the chamber CH schematically shown in FIG. Each chamber CH includes a processing container 10 and a lid 20. The processing container 10 and the lid 20 are hermetically sealed by an O-ring 32 disposed between the lower surface outer periphery of the lid 20 and the upper surface outer periphery of the processing container 10, whereby the processing chamber U in which plasma processing is performed. Is formed. The processing container 10 and the lid 20 are made of, for example, a metal such as aluminum and are electrically grounded.

  The processing container 10 is provided with a susceptor 11 (mounting table) for mounting the substrate G thereon. The susceptor 11 is made of, for example, aluminum nitride, and a power feeding portion 11a is provided therein.

  A high frequency power supply 12b is connected to the power supply unit 11a via a matching unit 12a (for example, a capacitor). In addition, a high-voltage DC power supply 13b is connected to the power supply unit 11a via a coil 13a. The power feeding unit 11a applies a predetermined bias voltage to the inside of the processing container 10 by the high frequency power output from the high frequency power source 12b. The power feeding unit 11a electrostatically attracts the substrate G with a DC voltage output from the high-voltage DC power supply 13b.

  The bottom surface of the processing container 10 is opened in a cylindrical shape, and one end of a bellows 15 is attached to the outer peripheral edge thereof. The other end of the bellows 15 is fixed to the elevating plate 16. Thereby, the opening part of the processing container 10 bottom face is sealed.

  The susceptor 11 is supported by the cylindrical body 17 and moves up and down integrally with the lifting plate 16 and the cylindrical body 17, thereby adjusting the susceptor 11 to a height corresponding to the processing process. A baffle plate 18 is provided around the susceptor 11 for controlling the gas flow in the processing chamber U to a preferable state.

  A vacuum pump (not shown) provided outside the processing container 10 is provided at the bottom of the processing container 10. The vacuum pump is configured to depressurize the processing chamber U to a desired degree of vacuum by discharging the gas in the processing container 10 through the gas discharge pipe 19.

  The lid 20 is provided with a lid main body 21, six rectangular waveguides 33, a slot antenna 30, and a dielectric (consisting of a plurality of dielectric parts 31). The rectangular waveguide 33 has a rectangular cross-sectional shape and is arranged in parallel inside the lid body 21. The slot antenna 30 is formed integrally with the lid body 21 below the lid body 20. The slot antenna 30 is provided with a slot 37 (opening) on the lower surface of each rectangular waveguide 33.

  A gas introduction pipe 29 is connected to the gas supply source 43 via a flow path 42, and the gas output from the gas supply source 43 is supplied into the processing chamber U from the gas introduction pipe 29 penetrating the beam 27. Is done. A cooling water supply source 45 disposed outside the chamber CH is connected to the cooling water pipe 44, and the cooling water supplied from the cooling water supply source 45 circulates in the cooling water pipe 44 to supply the cooling water. By returning to the source 45, the lid body 21 is maintained at a desired temperature.

  With the configuration described above, for example, a 2.45 GHz × 3 microwave output from a microwave generator (not shown) passes through each slot 37 from the rectangular waveguide 33 and passes through each dielectric part 31 for processing. The desired gas that has entered the chamber U and is supplied into the processing chamber U is turned into plasma, and thereby the substrate G is etched.

(Functional structure of EC)
Next, each function of the EC 200 will be described with reference to FIG. The EC 200 has functions indicated by blocks of a storage unit 250, an input unit 255, a calculation unit 260, a determination unit 265, a substrate processing execution unit 270, a communication unit 275, and an output unit 280.

  The storage unit 250 stores a process recipe 250a (see FIG. 14) indicating a substrate processing procedure, and a process request table 250b (see FIG. 9) in which information related to a process requested to be executed is held. The storage unit 250 also stores process priorities. For example, the priority of each process may be determined in advance so as to be higher as the process is later, or may be determined so as to be higher as the process time is shorter.

  Further, in the storage unit 250, a process maximum power value Y corresponding to the process type is stored in advance and a system maximum power value Ymax is stored in advance. The process maximum power value Y indicates the maximum power value that is expected to be consumed in each execution process when a plurality of processes are executed in parallel in a plurality of chambers provided in the substrate processing system 900. The system maximum power value Ymax indicates the maximum power value that can be used in the entire substrate processing system 900 (that is, the maximum capacity of the power supply equipment that the substrate processing system 900 has).

  Here, "130" (kW) is set as the system maximum power value Ymax of a series of etching processes (process <E + A + D>) (in the following description, unit kW is omitted), and a series of film deposition processes ( “100” is stored in advance as the system maximum power value Ymax of the process <C + D>. Further, the system maximum power value Ymax of the etching process (process <E>), ashing + static elimination process (process <A + D>), ashing process (process <A>), and static elimination process (process <D>) is “130”, “50”, “50”, and “45” are stored in advance.

  The input unit 255 inputs a lot start request or a process request when the operator operates the keyboard 710 or the touch panel 715. The process request input by the input unit 255 is stored in the process request table 250b.

  In response to the process execution request, the calculation unit 260 adds the total value Ysum of the process maximum power values corresponding to the processes being executed in each chamber CH and the process maximum power value Y corresponding to the requested process. . Further, after the processes executed in the respective chambers are completed, the calculation unit 260 calculates again the total Ysum of the process maximum power values corresponding to the processes being executed in the respective chambers, and calculates the calculated process maximum power. The total value Ysum and the process maximum power value Y corresponding to the requested process are summed again.

  At this time, the calculation unit 260 can identify the process to be added up to the process maximum power value according to the order in which the process execution requests are received in consideration of the power peak.

  This is effective when each process is a process in any unit, each process being a unit of each process of the semiconductor process. This is because in this case, there is no superiority or inferiority in the process, so that it is important for each process to be processed efficiently while simplifying system control while advancing the requested process in the order in which the process execution requests were received. is there.

  Further, for example, the calculation unit 260 may specify a process that is a target for adding the process maximum power value in accordance with the priority order of the processes in consideration of the power peak. Furthermore, when there are a plurality of processes having the same priority, the calculation unit 260 may specify a process that is a target for adding the process maximum power values according to the order in which the process execution requests are received.

  This is because each process is a unit of the final process for performing predetermined processing on the substrate and the process immediately preceding it as a unit, and each unit other than the final process and the process immediately preceding it as a unit. It is effective when Because, in this case, for example, if a high priority is given to the process including the final process, the process including the final process is prioritized while considering the peak of power consumed by each process being executed. As a result, since the processing is finished preferentially from the final step, the entire process proceeds smoothly and the throughput can be improved.

  In addition, for example, the calculation unit 260 is a process to which the process maximum power value is added according to the process priority, and when there are a plurality of processes having the same priority, according to the end time of the process. May be specified.

  This is effective in the case where each process is a process of any unit with each process for performing a predetermined process on the substrate as one unit. This is because, in consideration of the peak of power consumed by each process being executed, in principle, priority is given to a process with a high priority, and if there are multiple processes with the same priority, the process end time is set. Therefore, by giving priority to the process that terminates first, the process is finished with priority over the process that finishes earlier and the process that finishes earlier, so that the entire process proceeds smoothly and throughput can be improved. Because it can.

  The determination unit 265 determines whether to permit execution of the requested process by comparing the value Yto added by the calculation unit 260 with the system maximum power value Ymax. For example, the determination unit 265 permits the execution of the requested process when the total value Yto is within the system maximum power value Ymax, and does not permit the execution of the request process when the total value Yto exceeds the system maximum power value Ymax.

  Further, the determination unit 265 determines whether or not to permit execution of the requested process by comparing the value Yto summed up again with the system maximum power value Ymax after the process being executed in each chamber is completed. Determine.

  The substrate processing execution unit 270 controls the execution of the process permitted by the determination unit 265 based on the procedure of the process recipe 250a. The communication unit 275 transmits the control signal output from the substrate processing execution unit 270 to the control controller 300. The controller 300 transmits a drive signal corresponding to the control signal to each actuator, whereby the actuator G operates according to the drive signal, whereby the substrate G is etched in the chamber.

  If a problem occurs during each process or the determination unit 265 determines that the process is not permitted, the output unit 280 outputs that fact to the monitor 720 and the speaker 725.

  Each function of the EC 200 described above is actually illustrated by the CPU 215 in FIG. 2 executing a control program describing a processing procedure for realizing these functions, or for realizing each function. This is achieved by controlling the IC that does not. For example, in the present embodiment, the functions of the calculation unit 260, the determination unit 265, and the substrate processing execution unit 270 are actually executed by the CPU 215 executing a program or process recipe that describes a processing procedure for realizing these functions. Is achieved.

(Process permission processing)
Next, the process permission processing of this embodiment executed by the EC 200 will be described with reference to FIGS. FIG. 6 is a flowchart (main routine) showing the process permission process, which is repeatedly executed at predetermined time intervals after the operator turns on the lot start button. FIG. 7 is a flowchart (subroutine) showing determination processing called in the main routine of FIG. FIG. 8 is a time chart for explaining process permission / denial, and FIG. 9 is a state transition diagram of the process request table 250b.

  Here, the process request signal is input to the input unit 255 when the operator turns on the lot start button. However, the process request signal may be output from the controller 300 that controls each chamber, for example, at the timing when the substrate G is carried into the chamber, or at the timing when each process is executed according to the process recipe 250a. The information may be output from the substrate processing execution unit 270. Similarly, a process end signal is output by an operator or any controller (including a host computer).

  The process request table 250b is a FIFO (First In First Out) type file, and stored data is extracted in the order of old storage, and the data stored last is extracted last. Yes. For example, when the data stored in the process request number “1” in FIG. 9B is deleted, the data is automatically carried, that is, the process request number “2” is added to the process request number “1”. The data stored in the process number is carried forward, and the data stored in the process request number “2” disappears. In this manner, the process request table 250b always stores data stored in order from the process request number “1”. That is, data is stored in the process request table 250b in the order in which process execution requests are received.

  In the following, the input unit 255 performs a series of etching processes including etching <E>, ashing <A>, and charge removal <D> in the chamber CH1 at the timing of (1) as shown in FIG. <E + A + D> A signal requesting a process is input. Thereafter, a series of etching process <E + A + D> process request signals in the chamber CH2 are input at the timing (2), and the film formation <C> and the charge removal <D> in the chamber CH3 are input at the timing (3). A case will be described in which a signal requesting a series of film forming processes <C + D> process including is input and a signal indicating the end of the process in the chamber CH1 is input at the timing (4).

  Etching <E> is a process in which radicals and ions generated by plasma react with the substrate G, and the reaction product is converted into a volatile gas and exhausted to the outside by a vacuum exhaust system. Ashing <A> This is a process for removing unnecessary resist after the etching process. Further, the charge removal <D> is performed by etching and ashing the substrate G, and then generating Ar plasma on the substrate G, so that the substrate G is charged from the negative (−) state to the Ar. The step of neutralizing by reacting with ions (+) in plasma, thereby losing the adsorption of the substrate G to the susceptor 11 and enabling the substrate G to be carried out.

(1) Process request for chamber CH1 When the operator turns on the lot start button, the process permission process is started from step 600, and the input unit 255 determines in step 605 whether or not a process request signal has been input. To do. At the time of FIG. 8 (1), the etching process <E + A + D> in the chamber CH1 is requested (hereinafter referred to as the requested process (1)), so the process proceeds to step 610, and the storage unit 250 stores the data in FIG. As shown in a), the chamber number “1” of the process request number “1” in the process request table 250b is stored with the chamber number “1” requiring the process, and <E + A + D> is stored in the process type p.

  Next, proceeding to step 615, the input unit 255 determines whether or not a process end signal has been input. Since the process end signal is not input at the time point (1), the process proceeds to step 625, and the determination process is called.

  The determination process starts from step 700 in FIG. 7. In step 705, the calculation unit 260 assigns “1” to the process request number m, and in step 710, each process maximum power value being executed. And the process maximum power value Y “130” stored in the storage unit 250 corresponding to the process type <E + A + D> of the process request number “1” are added together. At this time, since the total value Ysum of the process maximum power values has the initial value “0”, the total value Yto becomes “130”.

  Next, in step 715, the determination unit 265 compares the total value Yto with the system maximum power value Ymax. Here, assuming that the maximum system power value Ymax is “250 (set to a very small capacity to simplify the following description)”, the total value Yto does not exceed the maximum system power value Ymax at this point. . Therefore, in step 720, the determination unit 265 outputs a signal for permitting the requested process (that is, permitting power supply to the chamber CH1), and in step 725, the total value Yto is calculated as the current process maximum power. In step 730, the first data is deleted from the process request table 250b, and the process proceeds to step 740, where it is determined whether or not the current process request number “1” has the next data. To do.

  At this time, since data is not stored in the process request number “1”, the determination unit 265 ends this routine in step 795, returns to the main routine, and ends the process permission routine in step 695. As a result, the requested process (1) is permitted at the time of FIG. 8 (1), and about half of the system maximum power value Ymax, “130” power is occupied for the processing of the chamber CH1. .

(2) Process request of chamber CH2 When the process permission process of FIG. 6 is started again at the time of FIG. 8 (2), the input unit 255 determines “YES” in step 605, and the storage unit 250 Stores “2” in the chamber number r of the process request number “1” in FIG. 9B, stores <E + A + D> in the process type p, and proceeds to step 625 following step 615 to call the determination process. .

  In Step 710 following Steps 700 and 705 of the called determination processing, the arithmetic unit 260 adds the process type of the process request number “1” in FIG. 9B to the total value Ysum “130” of the process maximum power values. In accordance with <E + A + D>, the process maximum power value Y “130” stored in the storage unit 250 is added to calculate a total value Yto “260”. At this time, since the total value Yto “260” exceeds the system maximum power value Ymax “250”, m is incremented by 1 in step 735 without permitting the request process (2). , It is determined that there is no next data in the process request table 250b, and the process ends at step 695 following step 795. As a result, the request process (2) is not permitted at the time of FIG. 8 (2) because the power peak exceeds the allowable range of the power supply equipment.

(3) Process request of chamber CH3 When the process permission process of FIG. 6 is started again at the time of FIG. 8 (3), the storage unit 250 stores the process request in FIG. 9B in step 610 following step 605. “3” is stored in the chamber number r of the process request number “2”, <C + D> is stored in the process type p, and the process proceeds to step 625 following step 615 to call the determination process.

  In this state, first, as a result of executing steps 700 to 735 of the determination process for the data of the process request number “1” in FIG. 9B, the request process (2) of the chamber CH2 has a power peak. Not permitted because it exceeds the allowable range of the power supply equipment. Therefore, in step 740 following steps 715 and 735, the determination unit 265 determines that there is second data in the process request table 250b, returns to step 710, and targets the data of the process request number “2”. Steps 700 to 735 of the determination process are executed.

  In step 710, the calculation unit 260 sets the process maximum power value Y stored in the storage unit 250 according to the process type <C + D> of the process request number “2” to the total value Ysum “130” of the process maximum power values. The total value Yto “230” is calculated by adding up “100 (maximum power value during film forming process)”. At this time, the total value Yto “230” does not exceed the system maximum power value Ymax “250”. Therefore, the determination unit 265 permits the request process (3) to the chamber CH3 in step 720. In step 725, the total value Ysum of the process maximum power values is set to the total value Yto “230”. The second data is erased from the process request table 250b (see FIG. 9C), and the process ends at step 695 following steps 740 and 795. As a result, at the time of FIG. 8 (3), the request process (2) of CH2 is not permitted and the request process (3) of CH3 is permitted so that the power peak does not exceed the allowable range of the power supply equipment. It becomes a state.

(4) Completion of process in chamber CH1 When the process permission process of FIG. 6 is started again at the time of FIG. 8 (4), there is no process request at this time. If “NO” is determined and the process immediately proceeds to step 615, the process end signal of the chamber CH1 is input. Therefore, “YES” is determined in step 615, and the process proceeds to step 620, where the total process maximum power value is summed. The process maximum power value Y “130” stored in the storage unit 250 in accordance with the process type <E + A + D> ended from the value Ysum “230” (the ended process type is included as information in the process end signal). The subtracted value “100” is set as the total value Ysum of the process maximum power values, and the process proceeds to step 625 to execute the determination process.

  In step 710 subsequent to steps 700 and 705 of the determination process, the arithmetic unit 260 calculates the total value Ysum of the maximum power values of the processes currently being executed and the process request number “1” shown in FIG. 9C. The process maximum power value Y “130” stored in the storage unit 250 is added in accordance with the process type <E + A + D>, and the total value Yto is “230 (= 100 + 130)”. At this time, the total value Yto “230” does not exceed the system maximum power value Ymax “250”. Therefore, the determination unit 265 determines “YES” in step 715, permits the request process (2) to the chamber CH2 in step 720, and substitutes the total value Yto for the total value Ysum in step 725, In step 730, the first data is deleted from the process request table 250b, and the data in the table disappears. Therefore, in step 695 following steps 740 and 795, this processing is terminated. As a result, if the peak of power consumed by each process being executed does not exceed the allowable range, the process that has previously requested execution can be executed with priority.

  In the above description, a series of etching processes (<E + A + D>) and a series of film formation processes (<C + D)>) are described as examples. However, each process is a unit of each process of the semiconductor process. It may be a process of any unit. If there is no superiority or inferiority of the process, in principle, it is important to advance the requested processes in the order in which the requests for process execution are received, in order to simplify the system control and efficiently process each process. That's why. In addition, each process of a semiconductor process means each process, such as film-forming, resist liquid application | coating, exposure, image development, etching, ashing, dicing.

(Second Embodiment)
Next, a substrate processing system 900 according to the second embodiment of the present invention will be described. The substrate processing system 900 according to the second embodiment is configured to determine whether to allow a requested process while considering the power peak consumed in each process being executed and the priority of the process. This is different from the first embodiment in which it is determined whether or not to permit the requested process without considering the process priority.

  Therefore, the process permission processing according to the present embodiment will be described with reference to FIGS. FIG. 10 is a flowchart (main routine) showing the process permission process of this embodiment, and FIG. 11 is a time chart for explaining the process permission / denial of this embodiment. Hereinafter, a case where the input unit 255 inputs a process request signal and a process end signal as shown in FIG. 11 will be described.

  In the following description, the final process (static elimination <D>) and the immediately preceding process (ashing <A>) for performing an etching process on the substrate G at each timing of FIG. 11 (1) to FIG. 11 (10). ) As one unit <A + D>, and any unit in which each step (here, only etching <E>) other than the last step and the immediately preceding step is one unit <E> is each process.

  It is assumed that the process priority order of the process <A + D> including the final process is higher than the process <E>. The process priority may be stored in the storage unit 250 for each process, but here, the data of each request process is stored in a separate process request table 250b in the order in which the processes are requested. In addition, the smaller the table number S, the higher the priority of the process. That is, in the present embodiment, the request process related to the process <A + D> is stored in the request order in the process request table 250b of the table number 1, and the request process related to the process <E> is stored in the process request table 250b of the table number 2. Stored in order of request. Here, the process request table 250b for each table number is not shown. In this embodiment, the process request table 250b has a one-to-one relationship between the table number S and the process type p of the table. Therefore, the process type table is not stored in the process request table 250b. Based on the number, the maximum power value Y of each request process stored in the storage unit 250 is extracted. In this embodiment, Smax representing the maximum number of tables is set to “2” in advance. In the present embodiment, the maximum system power value Ymax is “260”.

(Process <E> request of CH1 (1), CH2 (2), CH3 (3))
When the operator turns on the lot start button at the time of FIG. 11 (3), the process request number of the process request table 250b of the table number 2 at step 1005 following steps 1000 and 605 of the process permission process of FIG. Data relating to the request process (1) is stored in “1”, “1” is stored in the table number S in step 1010 following step 615, and data is stored in the process request table 250b of table number 1 in step 1015. It is determined whether or not there is. At this time, since there is no data of the process <A + D>, the determination unit 265 determines “NO”, proceeds to step 1020, determines that the maximum table number Smax “2” is larger than the table number 1, In step 1025, the table number is incremented by 1 to "2", and the process returns to step 1015 to determine that there is data in the process request table 250b of table number 2, and in step 625, the determination process is called.

  In the determination process of FIG. 7 called again, the processes in steps 705 to 740 are executed on the data stored in the process request table 250b of the table number 2. That is, the determination unit 265 considers the peak of power consumed in each process being executed in the order in which the processes are requested (request process (1) → request process (2) → request process (3)). Determine whether to allow the process. As a result, the request process (1) and the request process (2) are permitted, and the request process (3) is not permitted because it exceeds the power peak. Returning to step 1020 in FIG. 10 in this state, since the table number S is equal to the maximum number of tables Smax at this time, the process immediately proceeds to step 1095 to end the present process. At this time, the total value Ysum of the process maximum power values is “260 (= 130 (request process (1) start)) + 130 (request process (2) start)”.

(CH1 (4) process <E> end, CH1 (5) process <A + D> request)
Next, at the time of FIGS. 11 (4) and 11 (5), the process permission process of FIG. 10 is executed. In the state after the process of step 1005 following steps 1000 and 605 is executed, the process request of table number 1 is executed. The process request number “1” in the table 250b stores data related to the request process (5) having a high priority, and the process request number “1” in the process request table 250b in the table number 2 has a request having a high priority. Data relating to the process (3) is stored. Further, in the state after the processing of step 620 following step 615 is executed, the total value Ysum of process maximum power values corresponding to the process being executed is “130 (= 260−130 (end of process (4))). "

  In this state, when the determination process of FIG. 7 is called, first, steps 705 to 740 are performed on the process (that is, the request process (5)) stored in the process request table 250b of the table number 1 having a high priority. It is determined whether or not the process can be permitted. At this time, the total value Yto of the total power Ysum “130” of the process maximum power values and the maximum power value Y “50” stored in the storage unit 250 according to the request process (5) becomes “180”. The maximum power value Ymax “260” is not exceeded. Therefore, the determination unit 265 permits the request process (5) at step 720.

  Next, it is determined whether or not the process can be permitted in steps 705 to 740 for the process stored in the process request table 250b of the table number 2 (that is, the request process (3)). At this time, the total value Yto of the total power Ysum “180” of the process maximum power values and the maximum power value Y “130” stored in the storage unit 250 in accordance with the requested process (3) becomes “310”. The maximum power value Ymax “260” is exceeded. Therefore, the determination unit 265 terminates the determination process in FIG. 7 without permitting the request process (3) in step 720, and ends the present process in step 1095 following step 1020 in FIG. At this time, the total value Ysum of the process maximum power values is “180 (= 260−130 (process (4) end)” + 50 (request process (5) start) ”.

(CH2 (6) process <E> end, CH2 (7) process <A + D> request)
Furthermore, when the process permission process of FIG. 10 is executed at the time of FIGS. 11 (6) and (7), the request process (7) is considered in consideration of the priority of the process and the power peak as in the above process. Is then allowed, followed by request process (3). At this time, the total value Ysum of the process maximum power values in step 725 is “230 (= 180−130 (process (6) end)” + 50 (request process (7) start) +130 (request process (3) start). "

(End of process <A + D> of CH1 (8))
Thereafter, when the process (8) is terminated at the time of FIG. 11 (8), the total value Ysum of the process maximum power values becomes “180 (= 230−50 (process (8) termination))”.

(CH2 (9) process <A + D> end, CH1 (10) process <E> request)
Thereafter, when the process permission process of FIG. 10 is called at the time of FIGS. 11 (9) and (10), the request process (10) is stored at the first of the table number 2 of the process request table 250b at this time. Yes. Therefore, in steps 705 to 740 of the determination process in FIG. 7, the determination unit 265 determines whether or not the request process (10) in the process request table 250b with the table number 2 is permitted. At this time, the total value Yto of the process maximum power value Ysum “130 (= 180−50 (process (9) end))” and the process maximum power value Y “130” becomes “260”, and the system maximum power The value Ymax “260” is not exceeded. Therefore, the determination unit 265 permits the request process (10) in step 720, ends the determination process in FIG. 7, and ends the present process in step 1095 following step 1020 in FIG.

  As described above, according to the second embodiment, execution of a process with a high priority can be preferentially permitted while considering a power peak. If there are a plurality of processes having the same priority, the execution of the processes can be permitted in the order in which the process execution requests are received (that is, the order of the processes stored in the process request table 250b).

  According to this, for example, if a high priority is given to the process including the final process, the process including the final process can be preferentially executed while considering the power peak. As a result, since the processing is finished preferentially from the final process, the entire process proceeds smoothly and the throughput can be improved.

(Third embodiment)
Next, a substrate processing system 900 according to the third embodiment of the present invention will be described. In the substrate processing system 900 according to the third embodiment, when there are a plurality of processes having the same priority, the process having the same priority is determined in accordance with the end time of the process. When there are a plurality of processes, this is different from the second embodiment in which it is determined whether or not the requested processes are permitted in the order in which the processes are requested.

  Therefore, the process permission processing according to the present embodiment will be described with reference to FIGS. FIG. 12 is a flowchart showing the process permission process, which is repeatedly executed every predetermined time. FIG. 13 is a flowchart showing the process-specific determination process called in the main routine of FIG.

  FIG. 14 is a process recipe 250a showing the procedure of each step of the etching process executed in the present embodiment. The etching process is composed of three steps. The first step is etching <E>, the second step is ashing <A>, and the third step is charge removal <D>. More specifically, (a) pressure regulation, (b) etching and (c) evacuation are performed in the first step, and (d) pressure regulation, (e) ashing and (f) evacuation are performed in the second step. In the third step, (g) pressure regulation, (h) static elimination, and (i) exhaust are performed.

  In the present embodiment, the process request signal and the process end signal are not generated by an operator input, but are automatically output by the substrate processing execution unit 270. That is, the substrate processing execution unit 270 outputs an etching <E> process request signal at (a) pressure adjustment timing, and (d) etching <E> process end signal and ashing <at pressure adjustment timing. A> process request signal is output, (g) ashing <A> process end signal and charge removal <D> process request signal are output at the pressure adjustment timing, and (i) discharge removal < D> process end signal is output.

  FIG. 15 shows an example of the process request table 250b according to the present embodiment. Three process request tables 250b are prepared, with table number 1 having the highest priority for charge removal request, table numbers 2 and 3 having the same priority, and ashing and etching having a lower priority than the charge removal process. It is a table which stores the data regarding the request process.

  FIG. 16 is a time chart for explaining the process permission / denial of the present embodiment. In the following description, at each timing of (1) to (19), each process of the first process to the third process is regarded as one unit, and whether the process is permitted or not is determined for each process. In the present embodiment, the system maximum power value Ymax is “300”.

(CH1 (1) process <E> request)
When the process permission process is started in step 1200 of FIG. 12 at the time of FIG. 16 (1), the determination unit 265 determines “YES” in step 605 because the request process (1) has occurred. In step 1205, the data of the request process (1) is stored in the first process request table 250b of the table number 3. As a result, the chamber number “1” and the process end time “00:01:10” are stored in the process request number “1” of the table number 3 shown in FIG. The process end time is calculated from the process time of the process recipe 250a in FIG. Next, since there is no process completed at this time, the process proceeds to step 1210 following step 615 to call the process-specific determination process.

  The process-specific determination process starts from step 1300 in FIG. 13. In step 1305, the determination unit 265 determines whether there is data requested for the process. Here, since the data requested for the process exists in the table number 3, the process proceeds to step 1310, and the highest priority table including the data related to the process request is selected from the undecided process request table 250b. Here, table number 3 is selected. Next, the determination unit 265 proceeds to step 1315 and determines some of the selected tables. Here, since one table with table number 3 is selected, the process proceeds to step 1320.

  In step 1320, the determination unit 265 selects the process to be terminated first based on the requested process termination time Te in each table, and proceeds to step 1325 to determine whether there are two or more corresponding processes. judge. If there are two or more, the process proceeds to step 1330, where the determination unit 265 selects a process in the previous process, and if there are two or more processes that are the same process and are simultaneously terminated, the process request number m is early. Choose a process.

  Here, since the corresponding process is one of the request processes (1), the determination unit 265 proceeds to steps 710 to 720, permits the request process (1), and after the processing of steps 725 and 730, in step 1335 , It is determined that there is no data in the process request table 250b of the table number 3, and the process returns to step 1305, determines that there is no process request, proceeds to step 1395, and ends this processing. As a result, at the time of FIG. 16 (1), the requested process (1) is permitted, and the maximum power total value Ysum of the process being executed is “130 (start requested process (1))”.

(CH2 (2) process <E> request, CH3 (3) process <E> request)
After that, when the process permission process of FIG. 12 is started at the time of FIG. 16 (3), the determination unit 265 performs the power processing after the process of FIG. 12, similarly to the process of the request process (1) of FIG. The request process (2) is allowed, but the request process (3) is not allowed. Therefore, at the time of FIG. 16 (3), the data of the request process (3) remains in the table number 3, and the maximum power total value Ysum of the process being executed is “260 (= 130 + 130 (start of the request process (2))”. ) ”.

(CH1 (4) process <E> end, CH1 (5) process <A> request)
Thereafter, when the process permission process of FIG. 12 is started at the time point (4) and (5) of FIG. 16, the process ends from the maximum power total value Ysum at step 620 following steps 605, 1205, and 615 of FIG. In step 1310 subsequent to steps 1300 and 1305 of FIG. 13 which is subtracted from the maximum power value Y of process (4) and called in step 1210, the determination unit 265 stores the data of table number 2 (request process (5) data storage). ) And the process request table 250b of the table number 3 (data storage of the request process (3)) are selected, and the process proceeds to Step 1320.

  In step 1320, the determination unit 265 selects the request process (3) as the process to be terminated first based on the process end time Te stored first in each process request table 250b, and proceeds to step 1325. Since there are not two or more corresponding processes, it is determined as “NO”, and the process proceeds to Step 710.

  The determination unit 265 permits the requested process (3) requested in steps 710 to 730, and if there is data (requested process (5)) requested in the process request table 250b in step 1335. Determination is made and the process returns to step 1320 again.

  The determination unit 265 selects the request process (5), considers the power consumption peak in steps 710 to 730 following step 1325, and does not permit the request process (5), and “NO” in step 1335. In step 1305, it is determined that there is no other process request, and the processing ends in step 1295 following step 1395. As a result, at the time of FIG. 16 (5), only the request process (3) is permitted and the request process (5) is not permitted, considering the power peak and the process end time, and the maximum number of processes being executed is maximum. The total power value Ysum is “260 (= 260−130 (end of process (4)) + 130 (start of requested process (3)))”.

(CH2 (6) process <E> end, CH2 (7) process <A> request)
After that, when the process permission process of FIG. 12 is started at the time of FIGS. 16 (6) and (7), the determination unit 265 performs the process-specific determination process of FIG. 13 called by the process permission process of FIG. The request process (5) is permitted, and then the request process (7) is permitted. Therefore, at this time, the maximum power total value Ysum of the process being executed is “230 (= 260−130 (process (6) end)” + 50 (request process (5) start) +50 (request process (7) start). "

(Each process request / end of (8) to (13))
Thereafter, when the process permission process of FIG. 12 is started at the time of FIG. 16 (13), the determination unit 265 performs the power determination in the process-specific determination process of FIG. 13 called by the process permission process of FIG. While considering the peak, the request process (9) is permitted, then the request process (11) is permitted, and further the request process (13) is permitted. As a result, at each time point in FIG. 16 (13), the maximum power total value Ysum of the process being executed is “140 (= 230−50 (process (8) end)” − 50 (process (10) end) −130. (Process (12) end) +45 (request process (9) start) +45 (request process (11) start) +50 (request process (13) start)) ”.

(End of each process of (14) and (15))
When the process permission process of FIG. 12 is started at the time of FIG. 16 (15), the determination unit 265 again at step 620 following steps 605, 1205, and 615 of FIG. The maximum power total value Ysum of the process being executed is obtained, and it is determined in step 1305 of FIG. 13 that is called in the subsequent step 1210 that there is no process request, and this processing is terminated in step 1295 following step 1395. As a result, at each time point of FIG. 16 (15), the maximum power total value Ysum of the process being executed is “50 (= 140−45 (end of process (14)) − 45 (end of process (15))”. It becomes.

(Process end in (16), Process request in (17) to (19))
When the process permission process of FIG. 12 is started at the time of FIGS. 16 (16) to (19), the determination unit 265 performs the request process (17) in step 1205 following step 1200 and step 605 of FIG. Data is stored in the corresponding process request table 250b for all of (19) to (19). Then, following step 615, with the end of the process (16) in step 620, the maximum power value Y of the process is subtracted from the maximum power total value Ysum of the process being executed, and called in step 1210. In step 1305 following step 1300, the determination unit 265 determines that there is a request process (17) (18) (19), proceeds to step 1310, and has the highest priority table number having a process request. 1 process request table 250b is selected, the process proceeds to step 1315, the selected table is determined to be one, the request process (19) is permitted in steps 1320, 1325, and steps 710 to 730, and from step 1335 again. Return to step 1305.

  In step 1305, “YES” is determined. In step 1310, the determination unit 265 selects the process request table 250 b having the table number 3 from the undecided process request tables 250 b, and proceeds to steps 1315 and 1320.

  According to the process end time Te, the request process (17) and the request process (18) are simultaneously requested because they are requested at the same time. Accordingly, the determination unit 265 selects the request process (17) and the request process (18) in step 1320, determines “YES” in step 1325, and proceeds to step 1330. Here, since the required processes (17) and (18) are the same etching process, the determination unit 265 selects the required process (17) having a quick process request, that is, the process request number m is small, and steps 710 to 730 are performed. In step 1335, the request process (17) is permitted. In step 1335, it is determined that the process request data (request process (18)) exists in the process request table 250b, and the process returns to step 1320. The same processing is performed at 1325, 710 to 730, and considering the power, the request process (18) is not permitted and the processing proceeds to step 1295 of FIG. finish.

  Thus, at the time of FIGS. 16 (16) to (19), the power peak, the process priority, the process end time in the case of the same priority process, and the process end time in the case of the same process end time, The permission / non-permission of each process request is determined in consideration of the process context and the order of process requests.

  According to each embodiment described above, permission / non-permission of each process request is determined in consideration of a power peak. For example, consider the point in time when there is a request process (3) after the request process (2) in FIG. According to the conventional system that does not have the arbitration process described above, one peak A of the power consumption of the request process (2) shown in FIG. 17A and the request process (3) shown in FIG. Since a state where one peak B of power consumption overlaps may occur, it is necessary to provide a supply facility having a capacity equal to or greater than the sum of the maximum power values of all processes.

  However, according to the substrate processing system 900 according to the present embodiment, in consideration of the maximum power allowed by the system, the execution of the request process (3) is not permitted at the time shown in FIG. Execution of the request process (3) is permitted at the time shown in (c). As a result, the power peak A of the request process (2) and the power peak B of the request process (3) can be shifted. As a result, excessive capital investment can be abolished and power supply equipment with an appropriate capacity can be used effectively. In particular, since the substrate processing factory consumes a large amount of power in a short time, the effect of the substrate processing system 900 is very large.

  Further, according to the substrate processing system 900 according to the present embodiment, the permission / rejection of each process request is considered in consideration of the power peak, the process priority, the process end time, the process context, and the process request order. Non-permission is determined. For example, in this embodiment, process priorities are basically managed by table numbers (the smaller the table number, the higher the priority), and within the same table number, the process is permitted from the process whose end time is earlier. . As a result, the process of the entire system is executed more smoothly, thereby improving the throughput.

  In the above embodiment, the operations of the respective units are related to each other, and can be replaced as a series of operations in consideration of the relationship between each other. Therefore, the invention of the control device for the substrate processing apparatus can be the invention of the control method for the substrate processing apparatus.

  Further, by replacing the operation of each unit with the processing of each unit, a program embodiment can be obtained. Also, by storing the program in a computer-readable recording medium, the embodiment of the program can be made an embodiment of a computer-readable recording medium recorded in the program.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  For example, in the above embodiment, paying attention to the power consumed in the substrate processing system 900, whether the process is permitted / not permitted is determined based on the maximum value of the power energy consumed in each process. However, the present invention is not limited to this. For example, using the method described above, in addition to the power consumed by each unit in the chamber, the cooling water, pure water, and chemical solution supplied from the cooling water supply source are used. It is also possible to determine whether the process is permitted or not based on all of the utility.

  In the above embodiment, the control device of the substrate processing apparatus is achieved by the function of EC200. However, the control apparatus for the substrate processing apparatus according to the present invention may be achieved by providing the host computer 100 or the control controller 300 with such a function.

  Further, the substrate processing apparatus according to the present invention is not limited to the etching process, and can perform all kinds of substrate processes such as a film forming process, a thermal diffusion process, an ashing process, and a sputtering process.

  In addition, the substrate processing apparatus according to the present invention is not limited to an apparatus for processing a large glass substrate in manufacturing a large display device, but can also be applied to an apparatus for manufacturing a semiconductor device that processes a semiconductor wafer.

1 is an overall system diagram according to each embodiment of the present invention. It is a hardware block diagram of EC concerning each embodiment. It is a hardware block diagram of PM system concerning each embodiment. It is a longitudinal cross-sectional view of the chamber CH concerning each embodiment. It is a functional block diagram of EC concerning each embodiment. It is the flowchart which showed the process permission processing routine performed in 1st Embodiment. It is the flowchart which showed the determination processing routine performed in the same embodiment. It is an example of the time chart of the process permission process performed in the same embodiment. It is the figure which showed an example of the process request table used in the embodiment. It is the flowchart which showed the process permission processing routine performed in 2nd Embodiment. It is an example of the time chart of the process permission process performed in the same embodiment. It is the flowchart which showed the process permission processing routine performed in 3rd Embodiment. It is the flowchart which showed the determination process routine according to process performed in the same embodiment. It is an example of the process recipe used in the embodiment. It is the figure which showed an example of the process request table used in the embodiment. It is an example of the time chart of the process permission process performed in the same embodiment. It is the figure which showed an example of the effect of the process permission process concerning each embodiment.

Explanation of symbols

100 Host computer 200 EC
250 storage unit 250a process recipe 250b process request table 255 input unit 260 arithmetic unit 265 determination unit 270 substrate processing execution unit 275 communication unit 280 output unit 300 controller 400 PM system 405 cassette stage 410 transport stage 410a, 415a transport mechanism 410a1, 415a1 Transfer arm 415 Transfer chamber 420a to 420e Gate valve 900 Substrate processing system CH, CH1 to CH5 Chamber LLM Load lock chamber G Substrate

Claims (19)

A control device for a plurality of substrate processing apparatuses for processing a substrate using power supplied from a power source,
When a plurality of processes are executed in the plurality of substrate processing apparatuses, the maximum power value predicted to be consumed in each process is stored for each process as a process maximum power value, and is used by the plurality of substrate processing apparatuses as a whole. A storage unit for storing the maximum possible power value as a system maximum power value;
In accordance with a request for process execution, an arithmetic unit that adds the total value of the process maximum power values corresponding to the processes being executed in each substrate processing apparatus and the process maximum power value corresponding to the requested process; ,
A determination unit that determines whether or not to permit execution of the requested process by comparing the value added by the calculation unit and the system maximum power value ;
The storage unit stores process priorities,
The calculation unit is a control device for a substrate processing apparatus, which specifies a process to be added to the maximum process power value in accordance with the priority order of the processes .   2. The control apparatus for a substrate processing apparatus according to claim 1, wherein the determination unit permits execution of the requested process only when the value added by the calculation unit is within the system maximum power value. The calculation unit calculates again the sum of the process maximum power values corresponding to the processes being executed in each substrate processing apparatus after the process being executed in each substrate processing apparatus is completed, and the calculated Sum the process maximum power value and the process maximum power value corresponding to the requested process again,
3. The determination unit according to claim 1, wherein the determination unit determines whether to permit execution of the requested process by comparing the resumed value with the system maximum power value. 4. A control apparatus for the described substrate processing apparatus. The storage unit stores the order of receiving process execution requests,
  The arithmetic unit is a target for adding the process maximum power values according to the priority of the process, and when there are a plurality of processes having the same priority, according to the order in which the process execution request is received. The control apparatus of the substrate processing apparatus described in any one of Claims 1-3 which specifies a process. The storage unit stores an end time of the process for each requested process,
  The arithmetic unit specifies a process to be added to the maximum process power value according to the priority of the process, and when there are a plurality of processes having the same priority, according to the end time of the process. The control apparatus of the substrate processing apparatus as described in any one of Claims 1-3. 6. The control apparatus for a substrate processing apparatus according to claim 1, wherein each process is a process of any unit in which each step of the semiconductor process is a unit. Each of the processes is a unit of processing in which the final step for performing a predetermined process on the substrate and the immediately preceding step are set as one unit, and each step other than the final step and the immediately preceding step is set as one unit. The control apparatus of the substrate processing apparatus as described in any one of Claims 1-5. 6. The control apparatus for a substrate processing apparatus according to claim 1, wherein each of the processes is a process of any unit in which each process for performing a predetermined process on the substrate is a unit. The control apparatus for a substrate processing apparatus according to claim 1, wherein the priority of the process becomes higher as the process is performed later. The control apparatus for a substrate processing apparatus according to claim 1, wherein the priority of the process becomes higher as the process time is shorter. A method for controlling a plurality of substrate processing apparatuses for processing a substrate using power supplied from a power source,
  When a plurality of processes are executed by the plurality of substrate processing apparatuses, the priority order of the processes is stored in the storage unit, and the maximum power value predicted to be consumed in each process is stored for each process as the process maximum power value. Storing the maximum power value that can be used by the plurality of substrate processing apparatuses as a system maximum power value in the storage unit,
  In response to a request for process execution, among the processes identified as summation targets according to the priority of the process, the total value of the process maximum power value corresponding to the process being executed in each substrate processing apparatus and the request The process maximum power value corresponding to the processed process,
  A control method for a substrate processing apparatus, which determines whether or not to permit execution of a requested process by comparing the summed value and the system maximum power value. Store the order of request for process execution in the storage unit,
  A process for specifying a process to which the process maximum power value is to be added according to the priority of the process, and when there are a plurality of processes having the same priority, in accordance with the order of the process execution requests. Item 12. A method for controlling a substrate processing apparatus according to Item 11. Storing the end time of the process in the storage unit for each of the requested processes;
  12. The process to which the process maximum power value is added is specified according to the priority of the process, and when there are a plurality of processes having the same priority, according to the end time of the process. Method for controlling a processed substrate processing apparatus. The method of controlling a substrate processing apparatus according to claim 11, wherein each process is a process of any unit in which each step of the semiconductor process is a unit. Each of the processes is a unit of processing in which the final step for performing a predetermined process on the substrate and the immediately preceding step are set as one unit, and each step other than the final step and the immediately preceding step is set as one unit. A method for controlling a substrate processing apparatus according to claim 11. The method for controlling a substrate processing apparatus according to claim 11, wherein each of the processes is a process of any unit in which each process for performing a predetermined process on the substrate is a unit. The method of controlling a substrate processing apparatus according to claim 11, wherein the priority of the process becomes higher as the process is performed later. 18. The method for controlling a substrate processing apparatus according to claim 11, wherein the priority order of the processes becomes higher as the process time is shorter. A computer-readable recording medium storing a control program for controlling a plurality of substrate processing apparatuses that process a substrate using power supplied from a power source,
  When a plurality of processes are executed by the plurality of substrate processing apparatuses, the priority order of the processes is stored in the storage unit, and the maximum power value predicted to be consumed in each process is stored for each process as the process maximum power value. Storing the maximum power value that can be used by the plurality of substrate processing apparatuses as a system maximum power value in the storage unit,
  In response to a request for process execution, among the processes identified as summation targets according to the priority of the process, the total value of the process maximum power value corresponding to the process being executed in each substrate processing apparatus and the request A process of adding the process maximum power value corresponding to the processed process;
  A computer readable program storing a control program for causing a computer to execute whether or not to permit execution of a requested process by comparing the summed value and the system maximum power value. recoding media.

Images