JP5031384B2 - Electronic component module - Google Patents

Description

  The present invention relates to an electronic component module that accommodates and holds a plurality of electronic components.

  A hybrid vehicle in which an engine and an electric motor are mounted as a drive source includes a power storage device that stores electric power generated by the engine driving the electric motor. The power storage device also has a function as a power source for supplying power to the electric motor. As such a power storage device, for example, a capacitor module configured using a large-capacity capacitor is applied (see, for example, Patent Document 1). The capacitor module includes a plurality of regularly arranged capacitor cells, a cooling plate that radiates heat generated from the capacitors contained in the capacitor cells to the outside, and a support member that supports the cooling plate.

  When the capacitor module having the above-described configuration is mounted on a hybrid construction machine, large vibrations are repeatedly applied to the capacitor module while the construction machine is operating, so that the capacitor cell is securely fixed to the cooling plate. There is a need.

JP 2005-93759 A

By the way, in construction machines, in order to be able to mount various work devices, it is required to reduce the size and space of each work device. In the case of a capacitor module which is one of the working devices, the capacitor module is often reduced in size and space by increasing the integration degree of the capacitor. However, since the cooling plate is formed into a thin flat plate with a light metal such as aluminum in consideration of the heat dissipation effect, in the conventional capacitor module, the cooling plate can resist the vibration of the highly integrated capacitor. It did not have enough strength. As a result, when the conventional capacitor module is highly integrated, there is a problem with the durability of the cooling plate, and sufficient vibration isolation cannot be obtained.

The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component module that can improve the vibration isolation of a cooling plate to which a plurality of highly integrated electronic components are attached.

In order to solve the above-described problems and achieve the object, an electronic component module according to the present invention is a flat plate having a plurality of electronic components and a cooling channel to which the plurality of electronic components are attached and through which a cooling medium flows. A cooling plate, an upper covering portion that collectively covers all of the plurality of electronic components attached to the cooling plate from the surface side of the cooling plate, and an outer edge direction of the cooling plate from an opening end of the upper covering portion An upper cover having an upper flange portion extending to the lower plate, and a lower covering portion and a lower covering portion that collectively cover all the fixing portions of the plurality of electronic components attached to the cooling plate from the back side of the cooling plate A lower cover having a lower flange portion extending from the opening end of the portion toward the outer edge of the cooling plate, and fixing the cooling plate with the cooling plate sandwiched between the upper cover and the lower cover A cover member, formed of a vibration-proof rubber, has a flat plate shape having a support member that supports the upper flange portion, the cooling plate, and the lower flange portion, and an opening through which the upper covering portion can be inserted, A first reinforcing member that abuts over substantially the entire surface of the upper flange portion that does not face the cooling plate and is fastened to the support member together with the upper flange portion, the cooling plate, and the lower flange portion. And the outer edges of the upper flange portion and the lower flange portion substantially coincide with the outer edge of the cooling plate, and the support member is located near the outer edges of the upper flange portion, the cooling plate, and the lower flange portion. It is characterized by being attached.

Further, the electronic component module according to the present invention is the above invention, wherein the electronic component module is in the form of a flat plate having an opening portion that is interposed between the lower flange portion and the support member and through which the lower covering portion can be inserted. And a second reinforcing member fastened to the support member together with the cooling plate and the lower flange portion.

An electronic component module according to the present invention is attached to a plurality of electronic components, a flat plate-like cooling plate to which the plurality of electronic components are attached, and having a cooling channel for flowing a cooling medium, and the cooling plate. An upper cover having an upper covering portion that collectively covers all of the plurality of electronic components from the surface side of the cooling plate, and an upper flange portion that extends from the opening end of the upper covering portion toward the outer edge of the cooling plate. And a lower covering portion that collectively covers all the fixing portions of the plurality of electronic components attached to the cooling plate from the back side of the cooling plate, and an opening end of the lower covering portion in an outer edge direction of the cooling plate. A lower cover having an extended lower flange portion, and a metal cover member for fixing the cooling plate with the cooling plate sandwiched between the upper cover and the lower cover, and a vibration-proof rubber. A flat plate having a support member that supports the upper flange portion and an opening through which the upper covering portion can be inserted, and abuts over substantially the entire surface of the surface of the upper flange portion that does not face the cooling plate. A third reinforcing member fastened to the support member together with the upper flange portion, and an outer edge of the upper flange portion is located outside an outer edge of the cooling plate and the lower flange portion, The support member is attached near the outer edge of the upper flange portion.

Further, the electronic component module according to the present invention is the above-described invention, wherein the electronic component module is in the form of a flat plate having an opening that is interposed between the upper flange portion and the support member and through which the cooling plate can be inserted. And a fourth reinforcing member fastened to the support member.

  The electronic component module according to the present invention is characterized in that, in the above invention, the electronic component is a power storage element.

According to the electronic component module according to the present invention, a plurality of electronic components, a flat plate-like cooling plate having a cooling channel through which the plurality of electronic components are attached and flowing a cooling medium, and the cooling plate are attached. An upper cover having an upper covering portion that collectively covers all of the plurality of electronic components from the surface side of the cooling plate, and an upper flange portion that extends from the opening end of the upper covering portion toward the outer edge of the cooling plate. And a lower covering portion that collectively covers all the fixing portions of the plurality of electronic components attached to the cooling plate from the back side of the cooling plate, and an opening end of the lower covering portion in an outer edge direction of the cooling plate. A lower cover having an extended lower flange portion, and a metal cover member for fixing the cooling plate with the cooling plate sandwiched between the upper cover and the lower cover, and a vibration-proof rubber. A support plate, and further having a flat plate shape having an opening through which the upper covering portion can be inserted, abutting over substantially the entire surface of the upper flange portion that does not face the cooling plate, and A first reinforcement member that is fastened to the support member together with the flange portion, the cooling plate, and the lower flange portion is provided, or a third reinforcement that is fastened to the support member together with the upper flange portion. Since the members are provided, it is possible to improve the vibration isolation of the cooling plate to which a plurality of highly integrated electronic components are attached.

  The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described below with reference to the accompanying drawings. Note that the drawings referred to in the following description are merely schematic, and when the same object is shown in different drawings, dimensions, scales, and the like may be different.

(Embodiment 1)
FIG. 1 is a plan view showing a schematic configuration of an electronic component module according to Embodiment 1 of the present invention. 2 is a partial cross-sectional view taken along line AA in FIG. FIG. 3 is a partial cross-sectional view taken along line BB in FIG. In the first embodiment, a capacitor is applied as an electronic component. For this reason, the electronic component module according to the first embodiment is a capacitor module configured by electrically connecting a plurality of capacitor cells each containing and holding a capacitor.

  The capacitor module 1 shown in FIGS. 1 to 3 includes a plurality of capacitor cells 2, a plurality of capacitor cells 2 that are regularly attached and fixed in a matrix, a cooling plate 3 that cools the capacitor cells 2, and a predetermined position. A temperature sensor 4 for measuring the temperature in the vicinity of the capacitor cell 2, and a sheet member 5 interposed between the capacitor cell 2 and the cooling plate 3. In addition, the capacitor module 1 includes an upper cover 6 (cover member) that covers a plurality of capacitor cells 2 collectively, and a lower cover 7 that covers a region where the capacitor cells 2 are attached on the bottom surface side of the cooling plate 3. A supporting member 8 that supports the cooling plate 3, a wiring box 9 that accommodates wiring connected to the capacitor module 1, and wiring that is accommodated in the wiring box 9. And a connector mounting member 10 capable of detachably mounting a connector to be connected.

  The capacitor cell 2 is accommodated in a state where the capacitor 21, which is a kind of power storage element, a housing case 22 for housing the capacitor 21, two external terminals 23 connected to the capacitor 21, and the upper opening of the housing case 22 are blocked. A terminal plate 24 that is fixed to the case 22 and holds the external terminals 23 is provided.

  The capacitor 21 has a vertically long shape with a small bottom area, and has two internal terminals 211. The two internal terminals 211 are respectively connected to different external terminals 23, and when a voltage is applied, one becomes a positive electrode and the other becomes a negative electrode.

  The housing case 22 is made of a light metal having relatively good thermal conductivity such as aluminum, and has a cylindrical shape with one end closed. A screw hole 222 for screwing the screw member 14 for fixing the capacitor cell 2 to a predetermined position of the cooling plate 3 is provided in the bottom 221 of the housing case 22. The thickness of the bottom portion 221 provided with the screw hole 222 is thicker than the thickness of the side surface portion of the housing case 22. Therefore, the screw hole 222 can be sufficiently deep, and the capacitor cell 2 can be reliably fixed to the cooling plate 3. Moreover, since the attachment structure of the housing case 22 to the cooling plate 3 is simple, the capacitor cell 2 can be easily attached to the cooling plate 3.

  Since the accommodation case 22 can accommodate the vertically long capacitor 21, it itself has a vertically long shape and has a small bottom area. For this reason, the capacitor cells 2 are regularly arranged in the horizontal direction, and a small and compact module structure can be realized. In addition, since the bottom area of the housing case 22 is small, the capacitor cell 2 can be securely fixed to the cooling plate 3 in a state of being in close contact with the cooling plate 3 by one screw member 14. Thus, the capacitor 21 can be efficiently cooled from the bottom surface.

  In addition, it is more preferable to form an insulating synthetic resin film on the outer surface of the housing case 22 because the insulating property can be improved. It is also possible to provide a plurality of screw holes 222 in the bottom portion 221.

  The capacitor cells 2 are regularly attached to the surface of the cooling plate 3 in a matrix form. Specifically, each capacitor cell 2 is arranged so that two external terminals 23 are arranged along the longitudinal direction of the capacitor module 1 (horizontal direction in FIG. 1). The opposing external terminals 23 of the capacitor cells 2 adjacent along the longitudinal direction of the capacitor module 1 (row direction in FIG. 1) are connected via a bus bar 11 which is a metal fitting for electrical connection. In addition, the external terminal 23 of the capacitor cell 2 located at the end in the row direction is connected to the external terminal 23 of the capacitor cell 2 located at the end of the adjacent row via the bus bar 11. In this way, by connecting the adjacent capacitor cells 2 in a zigzag manner via the bus bar 11, all the capacitor cells 2 in the capacitor module 1 are electrically connected in series.

  By the way, when the capacitor module 1 having the vertically long shape and the capacitor cell 2 having a small bottom area as described above is mounted on a vehicle that is repeatedly subjected to severe vibration such as a construction machine, the strength of the capacitor cell 2 against the vibration load. May be insufficient. Therefore, in the first embodiment, a material with high rigidity and thickness is applied as the bus bar 11. As a result, each capacitor cell 2 is fixed to the cooling plate 3 by a single screw member 14 at the bottom surface, and is connected to the adjacent capacitor cell 2 via the bus bar 11 at the top thereof. The capacitor cell 2 as a whole has high rigidity. Therefore, it is possible to provide the capacitor module 1 having sufficient strength against the vibration load and having high vibration isolation. Moreover, the effect which improves the electrical conductivity between the external terminals 23 of the different capacitor cell 2 can also be acquired by making the bus-bar 11 thick.

  The wiring Wc accommodated in the wiring box 9 is connected to the two external terminals 23 (positioned at the upper left end and the lower left end in FIG. 1) located at the extreme ends when connected in series. In FIG. 1, by setting the number of columns to be an even number, both the outermost external terminals 23 connected to the wiring Wc are positioned on the wiring box 9 side, so that the extra length of the wiring Wc is reduced. In addition, the wiring Wc does not cross over the capacitor cell 2. Therefore, setting the number of columns to an even number is preferable in terms of downsizing and space saving. In FIGS. 2 and 3, the wiring Wc is omitted in order to avoid complexity of the drawings.

  Two external terminals 23 of the capacitor cell 2 are connected via the balance substrate 12. The balance substrate 12 has a function of adjusting the voltage of the capacitor 21 within a predetermined range.

  The capacitor cell 2 having the above configuration has the external terminals 23 arranged on the upper portion of the housing case 22 and the screw holes 222 are formed in the bottom portion 221 of the housing case 22, so that the plurality of capacitor cells 2 are fixed to the surface to be fixed. Can be aligned and fixed to the upper surface of the cooling plate 3. Therefore, the capacitor module 1 can be reduced in size and saved in space.

  Note that FIG. 1 illustrates a case where the capacitor cells 2 are arranged in a matrix of 6 rows and 6 columns, but this is only an example, and the number of rows and columns can be changed as appropriate. . By arranging in this way, high integration becomes possible. For example, by setting the number of capacitor cells 2 to about 50 or more, the rigidity of the bus bar 11 can be increased.

  FIG. 4 is a diagram showing an internal configuration of the cooling plate 3, and is a diagram showing a cross section taken along the line CC of FIG. The cooling plate 3 is formed by laminating two plate-like members 31 and 32 in the plate thickness direction, and is formed of a light metal such as aluminum having a relatively good thermal conductivity like the housing case 22 of the capacitor cell 2.

  The cooling plate 3 can be inserted through a cooling flow path 33 for flowing cooling water (cooling medium) for cooling the heat generated in the capacitor 21 and a screw member 14 that penetrates in the thickness direction and attaches the capacitor cell 2. It has a cell attachment hole 34 that communicates with the screw hole 222 when the capacitor cell 2 is attached, and a bolt insertion hole 35 through which a bolt 81 provided in the support member 8 is inserted.

  The plate-like member 31 is provided with a hole 34 a that forms part of the cell attachment hole 34. In addition, the plate-like member 32 is provided with a hole 34 b that forms a part of the cell attachment hole 34. Therefore, the cell attachment hole 34 is formed by communicating the hole portions 34a and 34b. The plate-like members 31 and 32 are also formed with holes that form part of the bolt insertion holes 35 (not shown).

  The cooling flow path 33 is a hollow portion surrounded by a groove formed in the plate-like member 31 and a surface of the plate-like member 32 facing the plate-like member 31. In this sense, FIG. 4 is also a cross-sectional view showing the shape of the groove formed in the plate-like member 31.

  The cooling flow path 33 communicates seven linear flow paths 301 to 307 extending in a direction parallel to each other and the end portions on the same side of the three linear flow paths 301 to 303 adjacent to each other, and the outlet 311. And the communication part 321 that connects the end portions on the same side of the four linear flow paths 304 to 307 adjacent to each other and the communication part 322 connected to the inflow port 312 and the communication part 321 of the straight flow paths 301 to 307 or And a communication portion 323 that communicates with an end portion that is not connected to 322.

  The cross-sectional areas of the planes orthogonal to the extending direction of the straight flow paths 301 to 307, that is, the longitudinal direction of the capacitor module 1 are equal to each other (see FIG. 3). As is clear from FIGS. 3 and 4, the straight flow paths 301 to 307 are arranged at equal intervals along the short direction of the capacitor module 1.

  In the cross section shown in FIG. 3, the sum of the cross-sectional areas of the straight flow paths 301 to 307 is about 10 to 30% of the cross-sectional area of the cooling plate 3 including the cross-sectional areas of the straight flow paths 301 to 307 in the same cross section. This ratio (hereinafter referred to as “cross-sectional area ratio”) is determined in consideration of the balance between the mechanical strength of the cooling plate 3 and the cooling performance of the cooling plate 3.

  FIG. 5 is a diagram illustrating an example of setting an appropriate cross-sectional area ratio. In FIG. 5, a curve L1 represents the relationship between the mechanical strength of the cooling plate 3 and the cross-sectional area ratio, while a curve L2 represents the relationship between the cooling performance of the cooling plate 3 and the cross-sectional area ratio. Among these, the mechanical strength of the cooling plate 3 indicated by the curve L1 decreases as the cross-sectional area ratio increases, and when the cross-sectional area ratio exceeds 30%, the mechanical strength applicable as the cooling plate 3 is not provided. On the other hand, the cooling performance of the cooling plate 3 shown by the curve L2 decreases as the cross-sectional area ratio decreases, and when the cross-sectional area ratio becomes smaller than 10%, the cooling performance of the straight flow paths 301 to 307 starts to vary, No proper cooling performance. Therefore, by forming the cooling plate 3 in such a manner that the cross-sectional area ratio is included in the range S that is 10 to 30%, the mechanical strength of the cooling plate 3 and the cooling performance of the cooling plate 3 can be appropriately balanced. Is possible.

  The inflow port 312 and the outflow port 311 are connected to a pump that circulates the cooling water via a pipe that forms a flow path of the cooling water, and a cooler (for example, a radiator) that cools the cooling water circulated from the outflow port 311. (Not shown).

  4 shows a case where the lengths of the straight flow paths 301 and 307 located at both ends in the width direction of the cooling flow path 33 are shorter than the lengths of the remaining straight flow paths 302 to 306. The lengths of the paths 301 to 307 may all be the same length. Further, the number and arrangement of the straight flow paths may be determined according to the number and arrangement of the capacitor cells 2.

  The cell attachment holes 34 are arranged at equal intervals along the extending direction of the straight flow paths 301 to 307, that is, the longitudinal direction of the capacitor module 1, between adjacent straight flow paths. This interval corresponds to the length of the bottom surface of the capacitor cell 2 in the longitudinal direction. The cell attachment hole 34 has a hole 131 having the same diameter as the screw hole 222 of the capacitor cell 2, and the interposing material 13 made of an insulating material is inserted therethrough. One end of the interposing material 13 has a flange shape that is locked to the cell attachment hole 34.

  In the plate-like members 31 and 32, portions other than the cooling flow path 33 are fixed without gaps by adhesion or the like. As a result, the cooling water flows into the cooling flow path 33 from the inflow port 312, flows in the middle without leaking to the outside, and then flows out from the outflow port 311. In particular, the first embodiment has a configuration in which almost half of the flow paths communicate with the end portion on the side where the inflow port 312 and the outflow port 311 are present, and all the flow paths communicate with each other on the opposite end portion. As a result, cooling water flows easily. Therefore, the cooling performance of the cooling plate 3 can be improved.

  When the capacitor cell 2 is attached to the cooling plate 3 having the above configuration, the screw member 14 is screwed from the bottom surface of the cooling plate 3. At this time, after inserting the interposing material 13 into the cell mounting hole 34 of the cooling plate 3 in advance, the screw member 14 is screwed. The screw member 14 has a function of attaching the capacitor cell 2 to the cooling plate 3 and also has a function of radiating heat generated in the capacitor 21 to the cooling plate 3 through the housing case 22. In the first embodiment, since the screw member 14 penetrates between the adjacent straight flow paths in the plate thickness direction, the periphery of the screw member 14 is cooled by the cooling water, and the heat generated in the capacitor cell 2 is generated. Heat can be radiated accurately.

  Next, the configuration of the capacitor module 1 will be described. The temperature sensor 4 is provided at two locations, that is, a bus bar 11 that connects two capacitor cells 2 positioned substantially in the center, and a bus bar 11 that is closest to the outlet 311. These temperature sensors 4 are connected to a controller (not shown) via a wiring Ws. In FIGS. 2 and 3, the wiring Ws is omitted.

  The controller has a power conversion function and a boost function, and performs charge / discharge control of the capacitor cell 2 based on a sensor signal from the temperature sensor 4. Specifically, the controller calibrates the temperature of the capacitor cell 2 using the detection results of the two temperature sensors 4, and performs charge / discharge control based on the calibration results. Since the temperature of the bus bar 11 provided with the temperature sensor 4 is substantially equal to the internal temperature of the capacitor 21, it is possible to appropriately perform control according to the heat generation of the capacitor 21 without providing the capacitor 21 with a temperature sensor. . Note that more temperature sensors 4 may be provided for the capacitor module 1.

  The sheet member 5 is made of an insulating material having thermal conductivity. By interposing such a sheet member 5 between the capacitor cell 2 and the cooling plate 3, the capacitor cell 2 and the cooling plate 3 are insulated from each other, and heat generated by the capacitor cell 2 is transmitted to the cooling plate 3. The heat dissipation effect can be improved.

  The upper cover 6 covers all the capacitor cells 2 attached to the cooling plate 3 in a lump and covers the cooling plate 3 in a direction parallel to the surface of the cooling plate 3 from the opening end of the covering portion 61. And a flange portion 62 extending in the outer edge direction, and is formed of a metal member such as aluminum or an iron plate. An opening 611 for passing the wiring Wc and the wiring Ws is provided on the side surface of the covering portion 61 where the wiring box 9 is attached. The outer edge of the flange portion 62 coincides with the outer edge of the cooling plate 3, and the hole portion is formed in the vicinity of the outer edge of the flange portion 62 with the same diameter as the bolt insertion hole 35 of the cooling plate 3, and communicates with the bolt insertion hole 35 when installed. Is formed (not shown).

  The lower cover 7 has a covering portion 71 that covers all the screw members 14 that fix the capacitor cell 2 on the bottom surface side of the cooling plate 3, and a direction parallel to the surface of the cooling plate 3 from the opening end of the covering portion 71. And a flange portion 72 extending in the outer edge direction of the cooling plate 3, and is formed of the same metal member as the upper cover 6. The flange portion 72 is formed with a bolt insertion hole (not shown) penetrating in the thickness direction.

In the first embodiment, by covering the capacitor cell 2 and the screw member 14 with the upper cover 6 and the lower cover 7 respectively, a drip-proof effect and a dust-proof effect on the capacitor 21 can be obtained. Further, the cooling plate 3 can be held by the upper cover 6 and the lower cover 7 to reinforce the strength of the cooling plate 3 . Further, since the plurality of capacitor cells 2 are collectively covered, the number of components can be reduced and the capacitor module 1 can be easily assembled.

  The support member 8 is formed using an anti-vibration rubber, and a bolt 81 extending from the main body portion along the central axis is embedded. The support member 8 is fixed to the cooling plate 3 by inserting a bolt 81 in the order of the lower cover 7, the cooling plate 3, the sheet member 5, and the upper cover 6 and then fastening a nut 82. By attaching the support member 8 to the cooling plate 3 in this manner, the vibration isolating property of the cooling plate 3 can be improved.

  In the wiring box 9, the wiring Wc is provided with a fuse and a relay for controlling the opening / closing operation of the pump when circulating the cooling water (not shown). The installation position of the wiring box 9 can be appropriately changed according to the shape of the capacitor module 1, particularly the shape of the upper cover 6.

  The connector mounting member 10 is detachably mountable with a connector for electrical connection between the wiring of the capacitor module 1 and a controller that controls the capacitor module 1. Thus, by making the connector detachable via the connector mounting member 10, the safety of the maintenance work can be ensured by removing the connector during maintenance of the capacitor cell 2 or the controller.

  FIG. 6 is a diagram illustrating a schematic configuration of a construction machine that is an example of a hybrid vehicle to which the capacitor module 1 according to the first embodiment is applied. The construction machine shown in the figure is a hydraulic excavator 100, and has a self-propelled portion 101a that self-propels by rotation of wheels and the like, a working machine such as a bucket, a boom, and an arm, and a cab. A turning unit 101b that can turn around a turning axis that is oriented in a predetermined direction. The hydraulic excavator 100 having such an external configuration has an engine 101, a drive shaft that is directly connected to the drive shaft of the engine 101, and is connected to an electric assist motor 102 that assists in driving the engine 101, and a turning portion 101b. And an electric turning motor 103 for turning the turning portion 101b around a predetermined axis with respect to the self-running portion 101a. The capacitor module 1, the assist motor 102, and the turning motor 103 are electrically connected to the controller 104 and operate under the control of the controller 104. When the capacitor module 1 is mounted on a construction machine, an electric double layer capacitor is preferable as the capacitor 21.

  In the hydraulic excavator 100 having the above-described configuration, the capacitor module 1 has a function of supplying electric power to the assist motor 102 and the turning motor 103 and storing electric power generated by the assist motor 102 and the turning motor 103. The capacitor module 1 is suitable for mounting on a construction machine such as the hydraulic excavator 100 because the capacitor cell 2 can be miniaturized and space-saving by arranging the capacitor cells 2 in a highly integrated manner.

  As described above, the support member 8 of the capacitor module 1 is formed by using the anti-vibration rubber, and the cooling plate 3 is securely held by sandwiching the outer edge portion of the cooling plate 3 with the flange portion 62 of the upper cover 6. keeping. Therefore, even when the capacitor module 1 is mounted on a construction machine such as the hydraulic excavator 100 in which large vibrations are often repeatedly applied, the vibration isolation performance of the cooling plate 3 can be improved. Reliability and durability can be ensured.

  Further, in the first embodiment, each capacitor cell 2 is fixed to the cooling plate 3 by one screw member 14 at the bottom surface thereof, and adjacent to the upper portion thereof by a thick and thick bus bar 11 having high rigidity. Since the capacitor cell 2 is connected, the plurality of capacitor cells 2 as a whole have high rigidity. Therefore, the capacitor module 1 has sufficient strength against the vibration load, and in this sense, the capacitor module 1 is suitable for a construction machine.

  By the way, in the hydraulic excavator 100, piping for circulating the cooling water is provided via the swing motor 103 and the controller 104 (not shown), and the cooling water cooled by the cooler is cooled by a pump. The cooling passage 33, the controller 104, and the turning motor 103 are circulated in this order. Therefore, the cooling water having the lowest temperature flows through the cooling flow path 33, so that the heat radiation of the capacitor cell 2 having the lowest heat resistant temperature can be performed with the highest priority.

  Even when the capacitor module 1 is applied to a construction machine, the number of capacitor cells 2 is preferably about 50 or more.

  According to the electronic component module (capacitor module) according to Embodiment 1 of the present invention described above, a plurality of electronic components and a plurality of electronic components are attached, and cooling is performed by flowing a cooling medium that cools those electronic components. A plate-like cooling plate having a flow path, a covering portion that collectively covers a plurality of electronic components attached to the cooling plate, and a flange portion that extends from the opening end of the covering portion toward the outer edge of the cooling plate A cooling plate for mounting a plurality of highly integrated electronic components by providing a metal cover member having the flange portion fixed to the cooling plate and a support member for supporting the cooling plate. Vibration isolation can be improved.

(Embodiment 2)
FIG. 7 is a diagram illustrating a configuration of a capacitor module that is an electronic component module according to the second embodiment of the present invention, and corresponds to FIG. 2 described in the first embodiment. The capacitor module 15 shown in FIG. 7 is reinforced to be attached to the support member 8-2 together with the flange portion 62 of the upper cover 6, the flange portion 72 of the lower cover 7, and the cooling plate 3 in addition to the configuration of the capacitor module 1. A member 16 (first reinforcing member) is provided. The support member 8-2 is formed using vibration-proof rubber similarly to the support member 8, and a bolt 81-2 extending from the main body portion along the central axis is embedded.

  FIG. 8 is a top view showing the configuration of the reinforcing member 16. The reinforcing member 16 has a flat plate shape, an opening 161 through which the covering portion 61 of the upper cover 6 can be inserted, holes 162 and 163 communicated with the outflow port 311 and the inflow port 312, respectively, and a support member 8-2. A bolt insertion hole 164 through which the bolt 81-2 is inserted. The reinforcing member 16 abuts over the entire area of the surface of the flange portion 62 opposite to the cooling plate 3, and the cooling plate 3 and the flange portion 62 of the upper cover 6 by the bolts 81-2 and nuts 82-2. Together with the flange portion 72 of the lower cover 7, it is fastened to the support member 8-2.

According to the electronic component module (capacitor module) according to the second embodiment of the present invention described above, in addition to the same effects as in the first embodiment, a flat plate shape having an opening through which the covering portion can be inserted is formed. A first reinforcing member that abuts over substantially the entire surface of the surface of the flange portion of the upper cover that does not face the cooling plate and is fastened to the support member together with the flange portion and the cooling plate of the upper cover; Further, the strength of the cooling plate can be further reinforced .

(Embodiment 3)
FIG. 9 is a diagram showing a configuration of a capacitor module that is an electronic component module according to Embodiment 3 of the present invention, and corresponds to FIG. 2 described in Embodiment 1 above. The capacitor module 17 shown in FIG. 9 is reinforced to be attached to the support member 8-2 together with the flange portion 62 of the upper cover 6, the flange portion 72 of the lower cover 7, and the cooling plate 3 in addition to the configuration of the capacitor module 1. A member 18 (second reinforcing member) is provided.

  The reinforcing member 18 has a flat plate shape, and has an opening 181 through which the covering portion 71 of the lower cover 7 can be inserted, and a bolt insertion hole (not shown) through which the bolt 81-2 of the support member 8-2 is inserted. The reinforcing member 18 abuts over the entire area of the surface of the flange portion 72 of the lower cover 7 on the side opposite to the cooling plate 3, and the cooling plate 3 and the upper cover 6 are secured by bolts 81-2 and nuts 82-2. The flange 62 and the flange 72 of the lower cover 7 are fastened to the support member 8-2.

According to the electronic component module (capacitor module) according to the third embodiment of the present invention described above, it is interposed between the cooling plate and the support member and corresponds to the region where the plurality of electronic components of the cooling plate are attached. As in the second embodiment, the cooling plate has a flat plate shape having an opening in the region, and further includes a second reinforcing member fastened to the support member together with the flange portion of the lower cover and the cooling plate. The strength of can be further reinforced .

  As a modification of the third embodiment, the capacitor module 17 can further include the reinforcing member 16 applied in the second embodiment.

(Embodiment 4)
FIG. 10 is a diagram showing a configuration of a capacitor module that is an electronic component module according to Embodiment 4 of the present invention. FIG. 11 is a partial cross-sectional view taken along the line DD of FIG. The capacitor module 19 shown in these drawings includes a plurality of capacitor cells 2, a plurality of capacitor cells 2 that are regularly attached and fixed in a matrix, a cooling plate 330 that cools the capacitor cells 2, and a plurality of capacitor cells. 2, an upper cover 190 (cover member) that collectively covers 2, a lower cover 700 that covers a region where the capacitor cell 2 is attached on the bottom surface side of the cooling plate 330, and an edge portion on the bottom surface side of the cooling plate 330 And a support member 8-3 that supports the cooling plate 330. 10 and 11, the same components as those of the capacitor module 1 described above are denoted by the same reference numerals as those in FIG.

  The upper cover 190 covers the capacitor cells 2 attached to the cooling plate 330 collectively, and the outer edge of the cooling plate 3 in a direction parallel to the surface of the cooling plate 330 from the opening end of the covering portion 191. And a flange portion 192 extending in the direction. Of the side surfaces of the covering portion 191, an opening portion 1911 for passing the wiring Wc and the wiring Ws is provided on the side surface to which the wiring box 9 is attached. The outer edge of the flange portion 192 of the upper cover 190 is located outside the outer edge of the cooling plate 330. The cooling plate 330 includes two plate-like members 331 and 332 and has a cooling channel 333 having the same shape as the cooling channel 33 of the cooling plate 3. The lower cover 700 has a covering part 701 and a flange part 702.

  The support member 8-3 is formed using vibration-proof rubber, and a bolt 81-3 extending from the main body portion along the central axis is embedded. The support member 8-3 has a flange portion formed by inserting a bolt 81-3 into a bolt insertion hole provided in the vicinity of the outer edge of the flange portion 192 of the upper cover 190, and then fastening a nut 82-3 to the bolt 81-3. It is attached near the outer edge of 192. In addition, the cooling plate 330, the flange portion 192 of the upper cover 190, and the flange portion 702 of the lower cover 700 are sandwiched between the screw member 193 and the nut 194 and fastened together.

  According to the electronic component module (capacitor module) according to the fourth embodiment of the present invention described above, the upper cover holds the cooling plate, and the support member is directly fastened to the upper cover. As in the first embodiment, the vibration isolation property of the cooling plate to which a plurality of highly integrated electronic components are attached can be improved.

  Note that a reinforcing member can also be provided in the fourth embodiment. FIG. 12 is a diagram illustrating a configuration of a capacitor module according to a first modification of the fourth embodiment, and corresponds to FIG. The capacitor module 19-2 shown in FIG. 12 has a flat plate shape having an opening 261 through which the covering portion 191 of the upper cover 190 can be inserted in addition to the configuration of the capacitor module 19, and a cooling plate among the surfaces of the flange portion 192. Further, a reinforcing member 260 (third reinforcing member) that abuts over the entire surface located on the opposite side of 330 and is fastened to the supporting member 8-3 together with the flange portion 192 is further provided.

  FIG. 13 is a diagram illustrating a configuration of a capacitor module according to a second modification of the fourth embodiment, and corresponds to FIG. In addition to the configuration of the capacitor module 19, the capacitor module 19-3 shown in FIG. 13 is interposed between the flange portion 192 of the upper cover 190 and the support member 8-3, and a plurality of capacitor cells 2 on the cooling plate 330 are arranged. A reinforcing member 480 (which has a flat plate shape having an opening 481 in a region corresponding to the attached region, and is fastened to the support member 8-3 together with the flange portion 192 of the upper cover 190 and the flange portion 702 of the lower cover 700. A fourth reinforcing member).

  According to the two modifications of the fourth embodiment described above, the same effects as those of the second and third embodiments can be obtained.

  It is also possible to configure a capacitor module provided with both the reinforcing members 260 and 480 used in the two modifications described above.

(Other embodiments)
So far, the first to fourth embodiments have been described in detail as the best mode for carrying out the present invention, but the present invention should not be limited only by the above-described four embodiments. For example, in the first to fourth embodiments, the case where the electronic component is a capacitor has been described. However, the electronic component module according to the present invention can be applied to an electronic component other than the capacitor.

  Thus, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

It is a top view which shows schematic structure of the electronic component module (capacitor module) which concerns on Embodiment 1 of this invention. FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a partial cross-sectional view taken along line BB in FIG. 1. It is a figure which shows the internal structure of a cooling plate. It is a figure which shows the example of a setting of appropriate cross-sectional area ratio. It is a figure which shows schematic structure of the construction machine with which the electronic component module (capacitor module) which concerns on Embodiment 1 of this invention is applied. It is a figure which shows schematic structure of the electronic component module (capacitor module) which concerns on Embodiment 2 of this invention. It is a top view which shows the structure of the reinforcement member (1st reinforcement member) with which the electronic component module (capacitor module) which concerns on Embodiment 2 of this invention is provided. It is a figure which shows schematic structure of the electronic component module (capacitor module) which concerns on Embodiment 3 of this invention. It is a top view which shows schematic structure of the electronic component module (capacitor module) which concerns on Embodiment 4 of this invention. It is the DD sectional view taken on the line of FIG. It is a figure which shows schematic structure of the electronic component module (capacitor module) which concerns on the 1st modification of Embodiment 4 of this invention. It is a figure which shows schematic structure of the electronic component module (capacitor module) which concerns on the 2nd modification of Embodiment 4 of this invention.

Explanation of symbols

1,15,17,19,19-2,19-3 Capacitor module 2 Capacitor cell 3,330 Cooling plate 4 Temperature sensor 5 Sheet member 6,190 Upper cover 7,700 Lower cover 8, 8-2, 8-3 Support member 9 Wiring box 10 Connector mounting member 11 Bus bar 12 Balance board 13 Interstitial material 14 Screw member 16, 18, 260, 480 Reinforcing member 21 Capacitor 22 Housing case 23 External terminal 24 Terminal plate 31, 32, 331, 332 Plate shape Member 33,333 Cooling flow path 34 Cell mounting hole 34a, 34b, 131, 162, 163 Hole 35, 164 Bolt insertion hole 61, 71, 191, 701 Cover 62, 72, 192, 702 Flange 81, 81- 2,81-3 bolt 82, 82-2, 82-3 nut 100 hydraulic excavator 1 01 Engine 101a Self-propelled part 101b Turning part 102 Assist motor 103 Turning motor 104 Controller 161, 181, 261, 481, 611, 1911 Opening part 193 Screw member 194 Nut 211 Internal terminal 221 Bottom 222 Screw hole 301, 302, 303, 304 , 305, 306, 307 Straight flow path 311 Outlet 312 Inlet 321, 322, 323 Communication portion Wc, Ws Wiring

Claims (5)

Multiple electronic components,
A plurality of electronic components are mounted, and a flat plate-like cooling plate having a cooling flow path for flowing a cooling medium;
Upper extending from the upper cover portion and the open end of the upper cover portion for covering all of said plurality of electronic components mounted on the cooling plate in bulk from the surface side of the cooling plate in the outer edge direction of the cooling plate An upper cover having a flange portion, a lower covering portion that collectively covers all the fixing portions of the plurality of electronic components attached to the cooling plate from the back side of the cooling plate, and an open end of the lower covering portion A lower cover having a lower flange portion extending in the outer edge direction of the cooling plate, and a metal cover member for fixing the cooling plate with the cooling plate sandwiched between the upper cover and the lower cover ; ,
A support member formed of anti-vibration rubber and supporting the upper flange portion, the cooling plate, and the lower flange portion ;
A flat plate shape having a through opening capable of the upper cover portion, abuts over substantially the entire area of the cooling plate not facing the surface of the surface of the upper flange portion, the upper flange portion, the cooling plate, and the A first reinforcing member fastened to the support member together with the lower flange portion ;
With
The outer edges of the upper flange part and the lower flange part substantially coincide with the outer edge of the cooling plate,
The electronic component module, wherein the support member is attached in the vicinity of an outer edge of the upper flange portion, the cooling plate, and the lower flange portion . The support member together with the upper flange portion, the cooling plate, and the lower flange portion is formed between the lower flange portion and the support member and has a flat plate shape having an opening through which the lower cover portion can be inserted. The electronic component module according to claim 1, further comprising a second reinforcing member fastened to the electronic component. Multiple electronic components,
A plurality of electronic components are mounted, and a flat plate-like cooling plate having a cooling flow path for flowing a cooling medium;
Upper extending from the upper cover portion and the open end of the upper cover portion for covering all of said plurality of electronic components mounted on the cooling plate in bulk from the surface side of the cooling plate in the outer edge direction of the cooling plate An upper cover having a flange portion, a lower covering portion that collectively covers all the fixing portions of the plurality of electronic components attached to the cooling plate from the back side of the cooling plate, and an open end of the lower covering portion A lower cover having a lower flange portion extending in the outer edge direction of the cooling plate, and a metal cover member for fixing the cooling plate with the cooling plate sandwiched between the upper cover and the lower cover ; ,
A support member formed of anti-vibration rubber and supporting the upper flange portion ;
It has a flat plate shape having an opening through which the upper covering portion can be inserted, abuts over substantially the entire surface of the surface of the upper flange portion that does not face the cooling plate, and the support member together with the upper flange portion. A third reinforcing member to be fastened;
With
The outer edge of the upper flange portion is located outside the outer edges of the cooling plate and the lower flange portion ,
The electronic component module, wherein the support member is attached in the vicinity of an outer edge of the upper flange portion. A fourth reinforcing member that is interposed between the upper flange portion and the support member, has a flat plate shape having an opening through which the cooling plate can be inserted, and is fastened to the support member together with the upper flange portion. The electronic component module according to claim 3, further comprising:   The electronic component module according to claim 1, wherein the electronic component is a power storage element.

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