JP5024966B2 - Fault monitoring apparatus, fault monitoring method and fault monitoring program for electronic device - Google Patents

Description

  The present invention relates to a failure monitoring device, a failure monitoring method, and a failure monitoring program for an electronic device that performs management related to the occurrence of a failure in various electronic devices.

  In various electronic devices such as servers, circuit components such as a built-in CPU (Central Processing Unit) and resistors generate heat when energized. Therefore, when a trouble that the built-in fan does not operate normally occurs, there is a possibility that the temperature inside the apparatus rises excessively and the built-in electronic circuit runs out of heat.

  Therefore, environmental data such as the temperature of the electronic device is measured and monitored, and when the value as the environmental data exceeds a preset range that enables safe driving, an environmental abnormality may be notified. It has been proposed as a first related technique of the present invention. According to the first related technique, it is possible to prevent a system failure due to an environmental abnormality such as a temperature and improve the reliability of the system.

Further, it is the second aspect of the present invention that the temperature in the apparatus is compared with a preset allowable limit temperature to suppress activation of an OS (Operating System) under temperature conditions outside the allowable limit temperature range. It has been proposed as a related technology. According to the second related technology, it is possible to prevent a failure caused by operating the OS under a temperature condition outside the allowable limit temperature value range, improve system operability, and ensure system reliability. it can.
JP 62-47753 A (2nd page, upper left column, line 17 to upper right column, line 19; FIG. 1) Japanese Patent Laid-Open No. 08-292819 (paragraph 0018, FIG. 1)

  Among these, in the first related technique, for example, when the temperature around the electronic device is raised or lowered due to changes in the four seasons, the environmental data acquired from the surroundings is also raised or lowered accordingly. The range of values such as preset temperatures that enable safe driving is naturally set to a somewhat wide temperature range corresponding to the temperature change of the four seasons, assuming that the electronic device operates throughout the four seasons. The As a result, for example, even if a part of the electronic circuit is overheated in the cold season of winter, it is not detected that the temperature abnormality has occurred until the upper limit value of the normal temperature considering the hot season in summer is exceeded. For this reason, even if abnormal heat generation occurs locally in the device in winter, it may take time to be detected by the sensor, and there is a possibility that a small change leading to abnormality may be missed. There was a problem.

  On the other hand, in the second related technology, when the temperature becomes abnormally high, for example, in summer, the OS itself is prevented from being started to ensure safety. However, there is a case where the temperature rises locally due to sunlight being irradiated from the outside to a part of the casing of the electronic device. In such a case, if the OS is started and the air cooling fan is operated, the initial uneven distribution of temperature often does not cause a problem in the operation of the electronic device thereafter. Even in such a case, according to the second related technique, there is a problem in that it cannot be adapted to a local change in the environment, and the use of the electronic device itself may be restricted. Further, the second related technique is not a technique for monitoring an abnormal state of the electronic apparatus after the OS is once started. Therefore, the second related technique cannot be used for such an abnormal situation.

  Also, conventional fault monitoring devices that monitor faults in electronic devices are equipped with a dedicated IC chip exclusively for warnings or added later as a management board, mainly for power supply voltage, component temperature, cooling fan rotation The system is configured to detect and warn of an actually occurring abnormality. Some redundantly configured machines have a function of detecting even the degeneration of the hard disk, CPU, and memory. However, such a conventional fault monitoring apparatus detects a fault after some abnormality has occurred, and is not sufficient from the viewpoint of fault prevention.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a failure monitoring device, a failure monitoring method, and a failure for an electronic device that can detect an early detection of a failure and a sign leading to the failure by detecting a local change in the environment during the operation of the electronic device. To provide a monitoring program.

In the present invention , (a) a cooling means for cooling the temperature inside the electronic device, (b) a predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by the cooling means, and (c) the electronic device described above Environmental temperature measuring means for measuring the environmental temperature of the place where it is installed, and (d) sampling means for repeatedly acquiring each measurement data at intervals from the environmental temperature measuring means and the predetermined part temperature measuring means described above. (E) By calculating the temperature difference as the difference between the two types of measurement data obtained at the respective sampling times using this sampling means, the cooling degree at the sampling time of the cooling means is calculated. Cooling degree calculation means to perform, and (f) Cooling that shows the state of change of the cooling degree over time by arranging the calculation results of the cooling degree calculation means in time series Cooling degree change data creating means for creating change data, and (g) The cooling degree does not increase as the environmental temperature rises above a predetermined environmental temperature from the cooling degree change data created by the cooling degree change data creating means. A failure occurrence detection means for detecting a failure occurrence warning when the failure occurrence detection means detects a failure occurrence warning, and a failure prediction warning means for issuing a warning regarding cooling of the cooling means. The fault monitoring device of the electronic device is provided.

In the present invention , (a) an acoustic sensor, and (b) sampling means for repeatedly acquiring, as measurement data, amplitude data indicating the amplitude of the sound and frequency data indicating the frequency of the sound with time from the acoustic sensor, (C) Difference calculation means for calculating the difference between the two types of measurement data obtained using this sampling means, and (d) Arranging the calculation results of the difference calculation means in time series, and the sound as amplitude Change data creating means for creating change data represented by frequency; and (e) a comparison means for comparing the change indicated by the change data created by the change data creating means with a predetermined predetermined safety range in which no failure occurs. (F) When it is determined by this comparison means that there has been a change in the change data exceeding the predetermined safety range, And failure detecting means for knowledge, (g) the failure detecting means fault monitoring device for an electronic device and a predictive failure warning means for issuing a warning about the generation of noise when detecting a sign of failure is provided.

Further, in the present invention, (a) a predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by the cooling means for cooling the temperature inside the electronic device, and the environmental temperature of the place where the electronic device is installed A measurement data acquisition step for acquiring each measurement data at each sampling time from the ambient temperature measurement means to be measured; and (b) as a difference between the two types of measurement data acquired in this measurement data acquisition step. A cooling degree calculation step for calculating the cooling degree at the time of the sampling of the cooling means described above by obtaining a temperature difference; and (c) arranging the calculation results in this cooling degree calculation step in time series, and the cooling degree time Cooling degree change data creation step for creating cooling degree change data indicating the state of a typical change, and (d) the cooling degree change data creation step A failure occurrence detection step for detecting a failure occurrence sign when it is determined from the cooling degree change data that the cooling degree does not increase with an increase in the environmental temperature at a predetermined ambient temperature or higher, and (e) the failure occurrence detection. The failure monitoring method for an electronic device includes a failure prediction warning step for issuing a warning regarding cooling of the cooling means when a sign of failure occurrence is detected in the step.

Furthermore, in the present invention, (a) a data sampling step for repeatedly acquiring, as measurement data, amplitude data indicating the amplitude of sound and frequency data indicating the frequency of sound from the acoustic sensor provided in the electronic device, with a time interval; (B) a difference calculation step for calculating the difference between the two types of measurement data obtained in this data sampling step, and (c) the calculation results in this difference calculation step are arranged in time series, and the sound is amplified. A change data creation step for creating change data represented by frequency and (d) a comparison for comparing the change indicated by the change data created in the change data creation step with a predetermined predetermined safety range in which no failure occurs. And (e) there is a change in the change data exceeding the predetermined safety range by the comparison step. Electrons and failure detection step for detecting a sign of a failure when it is discriminated, and a predictive failure warning step of issuing a warning on the occurrence of sound upon detecting a sign of failure in (to) the failure detecting step that A device fault monitoring method is provided.

Furthermore, in the present invention, a cooling means for cooling the temperature inside the electronic device, a predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by the cooling means, and a place where the electronic device is installed. A computer equipped with an environmental temperature measuring means for measuring the environmental temperature is used as a fault monitoring program for an electronic device, and (b) the measured data from the environmental temperature measuring means and the predetermined part temperature measuring means described above. And (b) the sampling time point of the cooling means described above by obtaining a temperature difference as a difference between the two types of measurement data acquired at the respective sampling time points by the sampling process. Cooling degree calculation processing for calculating the cooling degree in (i) and (c) the calculation result by this cooling degree calculation processing From the cooling degree change data created in this cooling degree change data creation process, which is arranged in time series and creates the cooling degree change data indicating the temporal change in the cooling degree, and (d) A fault detection process for detecting a sign of a fault occurrence when it is determined that the degree of cooling does not increase as the environmental temperature rises above a predetermined environmental temperature ; and (e) a fault sign in the fault detection process. And a failure prediction warning process for issuing a warning related to the cooling of the cooling means described above.

In the present invention, a computer having an electronic device equipped with an acoustic sensor is used as a fault monitoring program for the electronic device. (A) Amplitude data indicating the amplitude of the sound and the frequency of the sound are shown from the acoustic sensor. Sampling processing for repeatedly acquiring frequency data as measurement data, (b) difference calculation processing for calculating the difference between the two types of measurement data acquired by the sampling processing, and (c) calculation by the difference calculation processing. Change data creation processing for arranging the results in time series and creating change data representing the sound in amplitude and frequency; (
(D) a comparison process for comparing the change indicated by the change data created in the change data creation process with a predetermined safety range that can be regarded as not causing a failure; and (e) the predetermined safety range described above by this comparison process. Fault detection processing that detects a sign of a failure when it is determined that there has been a change in change data exceeding (), and (f) a warning about the occurrence of a sound when a sign of a failure is detected in this fault detection process And a failure prediction warning process for generating

  As described above, according to the present invention, the difference between two predetermined measurement data is taken and the temporal change is monitored, so that the internal change of the electronic device can be specifically grasped. In addition, it is possible not only to predict the occurrence of a failure, but also to facilitate the maintenance management of various parts of the electronic device.

  FIG. 1 is a diagram corresponding to a claim of a failure monitoring device for an electronic device according to the present invention. The fault monitoring apparatus 10 for an electronic apparatus according to the present invention includes a measuring unit 11 that repeatedly measures a plurality of types of predetermined physical phenomena and measures two types of predetermined physical phenomena obtained from the measuring unit 11. A difference calculation means 12 for calculating these differences for data, and a calculation result of the difference calculated by the difference calculation means 12 are arranged in a time series, and a change over time of the calculation result can be regarded as a failure occurring in advance. A comparison means 13 for comparing with a predetermined safety range, and a failure prediction warning means 14 for issuing a warning when it is determined by the comparison means 13 that there has been a change in the calculation result exceeding the predetermined safety range. ing.

  FIG. 2 is a diagram corresponding to a claim of a failure monitoring device for another electronic device according to the present invention. The fault monitoring device 20 for another electronic device of the present invention includes a cooling means 21 for cooling the temperature inside the electronic device, a predetermined part temperature measuring means 22 for measuring the temperature of a predetermined part cooled by the cooling means 21, The environmental temperature measuring means 23 for measuring the environmental temperature of the place where the electronic device is installed, and the sampling means 24 for repeatedly acquiring the respective measured data at intervals from the environmental temperature measuring means 23 and the predetermined part temperature measuring means 22 The cooling means 21 calculates the degree of cooling at the time of sampling described above by obtaining the temperature difference as the difference between the two types of measurement data obtained at the time of sampling using the sampling means 24. The degree calculation means 25 and the calculation results of the degree of cooling calculation means 25 are arranged in time series, and the change of the degree of cooling over time is changed. The cooling degree change data creating means 26 for creating the cooling degree change data indicating the child, and the cooling degree according to the rise in the environmental temperature at a predetermined ambient temperature or higher from the cooling degree change data created by the cooling degree change data creating means 26 And a failure prediction warning means 27 that issues a warning regarding cooling of the cooling means 21 when it is determined that the temperature does not rise.

  FIG. 3 is a diagram corresponding to a claim of a failure monitoring device for still another electronic device according to the present invention. The fault monitoring device 30 of still another electronic device according to the present invention repeats the acoustic sensor 31, the amplitude data indicating the sound amplitude and the frequency data indicating the frequency of the sound from the acoustic sensor 31 as measurement data. The sampling means 32 to be acquired, the difference calculation means 33 for calculating the difference between the two types of measurement data acquired using the sampling means 32, and the calculation results of the difference calculation means 33 are arranged in time series, Change data creation means 34 for creating change data representing sound in amplitude and frequency, and the change indicated by the change data created by the change data creation means 34 is compared with a predetermined predetermined safe range in which no failure occurs. The comparison means 35 and the comparison means 35 have changed the change data exceeding the predetermined safety range. A warning regarding the occurrence of another have been when the sound and a predictive failure warning means 36.

  FIG. 4 is a diagram corresponding to a claim of the failure monitoring method for an electronic device according to the present invention. The fault monitoring method 40 for an electronic device according to the present invention includes a measurement step 41 for repeatedly measuring a plurality of predetermined physical phenomena, and measuring two predetermined physical phenomena obtained in the measurement step 41. A difference calculation step 42 for calculating these differences for data, and a calculation result of the difference calculated by the difference calculation step 42 are arranged in a time series, and a change over time of the calculation result can be regarded as a failure not occurring. A comparison step 43 for comparing with a predetermined safety range, and a failure prediction warning step 44 for issuing a warning when it is determined by the comparison step 43 that there has been a change in the calculation result exceeding the predetermined safety range. ing.

  FIG. 5 is a diagram corresponding to a claim of a failure monitoring method for another electronic device according to the present invention. According to another electronic device fault monitoring method 50 of the present invention, predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by a cooling means for cooling the temperature inside the electronic apparatus, and the above-described electronic device are installed. A measurement data acquisition step 51 for acquiring the respective measurement data at each sampling time from the environmental temperature measurement means for measuring the environmental temperature of the place, and the two types of measurement data acquired in the measurement data acquisition step 51 The cooling degree calculation step 52 for calculating the cooling degree at the time of sampling of the cooling means described above by obtaining the temperature difference as the difference between the cooling means, and the calculation results at the cooling degree calculation step 52 are arranged in time series, and cooling The cooling degree change data creating step 53 for creating the cooling degree change data indicating the temporal change of the degree of cooling, and the cooling degree change data Failure prediction warning step for issuing a warning about cooling of the cooling means when it is determined from the cooling degree change data created in the data creation step 53 that the cooling degree does not increase in response to a rise in the environmental temperature above a predetermined environmental temperature. 54.

  FIG. 6 is a diagram corresponding to a claim of a failure monitoring method for still another electronic device according to the present invention. The fault monitoring method 60 of another electronic device according to the present invention repeatedly obtains amplitude data indicating the amplitude of sound and frequency data indicating the frequency of sound from the acoustic sensor provided in the electronic device as measurement data. A data sampling step 61, a difference calculation step 62 for calculating the difference between the two types of measurement data acquired in the data sampling step 61, and the calculation results in the difference calculation step 62 are arranged in time series, A change data creation step 63 for creating change data representing sound in amplitude and frequency, and a change indicated by the change data created in the change data creation step 63 is compared with a predetermined predetermined safe range in which no failure occurs. The comparison step 64 and the comparison step 64 exceeds the predetermined safety range. That there has been a change in the variation data and a predictive failure alert step 65 to alert about the occurrence of a sound when it is judged that.

  FIG. 7 is a diagram corresponding to a claim of the failure monitoring program for an electronic device according to the present invention. The electronic device failure monitoring program 70 according to the present invention causes a computer to repeatedly measure a plurality of types of physical phenomena in advance, and to measure two types of physical properties. A difference calculation process 72 that calculates these differences for the measurement data of the phenomenon, and a calculation result of the difference calculated by the difference calculation process 72 are arranged in a time series, and a change in the calculation result over time is not caused by a failure. A comparison process 73 for comparison with a predetermined predetermined safe range that can be considered, and a failure prediction warning process 74 that issues a warning when it is determined by this comparison process 73 that the calculation result has changed beyond the predetermined safe range. And execute.

  FIG. 8 is a diagram corresponding to a claim of a failure monitoring program for another electronic device according to the present invention. Another electronic device failure monitoring program 80 according to the present invention includes a cooling means for cooling the temperature inside the electronic device, a predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by the cooling means, and the electronic apparatus described above. The computer having the environmental temperature measuring means for measuring the environmental temperature of the place where the computer is installed is repeatedly acquired from the environmental temperature measuring means and the predetermined part temperature measuring means with a time interval. The cooling degree at the sampling time of the above-described cooling means is calculated by obtaining a temperature difference as a difference between the sampling process 81 and the two kinds of measurement data obtained at the respective sampling times by the sampling process 81 The cooling degree calculation process 82 and the calculation result of the cooling degree calculation process 82 are arranged in time series. Then, the cooling degree change data creation process 83 for creating the cooling degree change data indicating the temporal change of the cooling degree, and the cooling degree change data created in the cooling degree change data creation process 83 is equal to or higher than a predetermined environmental temperature. When it is determined that the degree of cooling does not increase in accordance with the increase in the environmental temperature, the failure prediction warning process 84 for issuing a warning regarding cooling of the cooling means is executed.

  FIG. 9 is a diagram corresponding to a claim of a failure monitoring program for still another electronic device according to the present invention. According to still another embodiment of the present invention, there is provided an electronic device fault monitoring program 90 comprising: a computer equipped with an acoustic sensor in an electronic device; amplitude data indicating sound amplitude and frequency data indicating sound frequency with time from the acoustic sensor described above. Sampling processing 91 for repeatedly acquiring each as measurement data, difference calculation processing 92 for calculating the difference between the two types of measurement data acquired in the sampling processing 91, and calculation results by the difference calculation processing 92 in time series And a change data creation process 93 for creating change data representing a sound in amplitude and frequency, and a change indicated by the change data created in the change data creation process 93 is a predetermined predetermined value that can be regarded as causing no failure. The comparison process 94 for comparing with the safety range, and the comparison process 94 exceeds the predetermined safety range. Of changes in the data that had to execute a predictive failure warning process 95 to alert about the occurrence of a sound when it is judged.

  <Embodiment of the Invention>

  Next, an embodiment of the present invention will be described.

  FIG. 10 shows a configuration of an electronic apparatus provided with a failure monitoring apparatus according to an embodiment of the present invention. The electronic device 100 according to the present embodiment includes a failure monitoring device 101 for managing the occurrence of a failure. In the failure monitoring apparatus 101, a central control function unit 102 that performs overall control of the inside is disposed. The central control function unit 102 includes a CPU (Central Processing Unit) 103 and a memory 104 that stores a control program executed by the CPU 103 in a partial area thereof.

  The central control function unit 102 is connected to a sensor input circuit 106 that inputs information from various sensors. The sensor input circuit 106 is connected to an ambient temperature measurement thermosensor 107, an environmental temperature measurement thermosensor 108, and an acoustic sensor 109.

  Among them, the ambient temperature measuring thermosensor 107 is a sensor for measuring the temperature around the heat sink 141 as a cooling device for releasing heat generated by the CPU 103 to the outside, or a heater for fixing a printing unit (not shown). It is assumed that the sensor measures the temperature of As the ambient temperature measurement thermosensor 107, a device that sets a measurement target range as wide as 10 cm square, such as an infrared sensor such as a thermopile, is preferable. Accordingly, the ambient temperature measurement thermosensor 107 can measure the average temperature around the heat source inside the electronic device 100. This is to prevent erroneous detection due to local temperature fluctuation that may occur when the temperature is measured pinpointly using, for example, a thermocouple.

  The environmental temperature measurement thermosensor 108 is a sensor that measures the environmental temperature where the electronic apparatus 100 is placed. In the present embodiment, the ambient temperature measurement thermosensor 108 is disposed in the vicinity of an air intake composed of a fan 142 that takes in air from the outside of the electronic device 100. Thereby, the environmental temperature measurement thermosensor 108 measures the environmental temperature surrounding the electronic device 100.

  The acoustic sensor 109 is a sensor that measures a sound generated by various mechanisms in the failure monitoring apparatus 101 such as a hard disk (not shown) that constitutes a part of the memory 104 and an impact sound transmitted through a housing (not shown). The acoustic sensor 109 according to the present embodiment has a noise canceling function so as to reduce or eliminate the environmental sound outside the electronic device 100.

  The central control function unit 102 further controls each of the following units in the failure monitoring apparatus 101. The data memory function unit 111 stores measurement data 112 input by the central control function unit 102 via the sensor input circuit 106. The difference calculation function unit 113 takes out the accumulated data 114 from the data memory function unit 111 and performs an operation of calculating the difference between the accumulated measurement data for the two paired sensors. However, the acoustic sensor 109 outputs measurement data regarding the amplitude and frequency of the sound, and in the case of the present embodiment, the measurement data regarding the amplitude and frequency of the sound is used as a pair of measurement data. Therefore, with respect to the sound, an operation for obtaining a difference between the measurement data is performed using one type of sensor called the acoustic sensor 109.

  The calculation result memory function unit 115 stores the difference data 116 calculated by the difference calculation function unit 113. The change calculation function unit 117 reads the difference data 118 from the difference calculation function unit 113 along the time axis, and generates time-series change data in a format in which the difference data 118 is connected. The change amount memory function unit 119 stores time-series change data 120 output from the change calculation function unit 117. The comparison function unit 121 inputs the difference data 122 read from the change calculation function unit 117 and the time-series change data 123 read from the change amount memory function unit 119, and the threshold value 125 read from the determination level holding register 124 It comes to compare. The determination result output function unit 126 inputs both the comparison result data 127 output from the comparison function unit 121 and the measurement data 112 output from the central control function unit 102. If the measurement data 112 itself exceeds the guaranteed value that guarantees the safety of the device, such as when the measurement value of the ambient temperature measurement thermosensor 107 indicates abnormal heat generation of the electronic device 100 itself, The alarm output (alarm) 128 by sound or visual display is performed on the assumption that an abnormal situation has occurred as has been conventionally done. Further, when the comparison result data 127 indicates a phenomenon in which the failure of the electronic device 100 is predicted (hereinafter referred to as a sign in this specification) or indicates that a failure has occurred, The alarm output 128 corresponding to the content is performed.

  In the fault monitoring apparatus 101 having such a configuration, each component such as the data memory function unit 111 constituting the fault monitoring apparatus 101 is not necessarily configured by hardware. At least some of the components constituting the failure monitoring apparatus 101 may be configured as software components that are functionally realized by the CPU 103 executing a control program.

  By the way, in the fault monitoring apparatus 101 of this embodiment, the sensor input circuit 106 samples the measurement values output from the ambient temperature measurement thermosensor 107, the environmental temperature measurement thermosensor 108, and the acoustic sensor 109 at regular intervals. Thus, the measurement data 131 is input to the central control function unit 102. As an example, the sampling period of the sensor input circuit 106 is a period of every 6 minutes. Of course, it is not necessary to perform sampling at a constant period. For example, sampling may be performed finely in a time period during which a sign of failure may be observed.

  FIG. 11 shows an outline of the measurement data reception process. This will be described with reference to FIG.

  The central control function unit 102 waits for reception of the measurement data 131 via the sensor input circuit 106 (step S201). When the measurement data 131 is received from the ambient temperature measurement thermosensor 107, the environmental temperature measurement thermosensor 108, or the acoustic sensor 109 at the sampling period of 6 minutes as described above (Y), the central control function unit 102 receives the measurement data 131. Then, time information is added to the information indicating the type of sensor sent together with this, and stored in the data memory function unit 111 as the measurement data 112 (step S202).

  The measurement data 112 is also sent to the determination result output function unit 126. The determination result output function unit 126 determines whether or not the value indicated by the measurement data 112 exceeds the guaranteed value based on the information indicating the sensor type in the measurement data 112 that has been sent. (Step S203). For example, it is assumed that the ambient temperature of a specific part measured by the ambient temperature measurement thermosensor 107 exceeds a threshold as an upper limit temperature that is determined as a safe temperature determined in advance. In this case, an alarm corresponding to the measurement data 112 (hereinafter, referred to as a first alarm) is output (step S204) as exceeding the guaranteed value for the temperature of the specific part (step S203: Y). . As an example, a voice message “The fixing temperature of the printing unit of the device is abnormally high, so that the energization of the fixing device is stopped for a predetermined time.” Flows from a speaker (not shown) and an error message is displayed on a display (not shown). The process returns to the state of waiting for reception of the measurement data in step S201 (return). On the other hand, if it is determined in step S203 that the value indicated by the measurement data 112 is equal to or less than the guaranteed value and is safe (N), step S201 is performed without performing such first alarm output processing. Return to processing (return).

  The processing from step S203 onward is conventionally performed normally when various sensors detect an abnormality. Even in the electronic device 100 of this embodiment, the first alarm is output when an abnormality is detected, and the same safety measures as in the past are used in combination with the safety measures unique to this embodiment. .

  FIG. 12 shows a state of processing for early detection of a failure and detection of a failure sign as unique processing of the electronic apparatus according to the present embodiment. This will be described with reference to FIG.

  Whether the central control function unit 102 has arrived at the timing of calculation of difference data by the difference calculation function unit 113 (step S221), or has the timing of creating change amount data by the change calculation function unit 117 (step S222)? It is always checked whether the timing for comparison by the comparison function unit 121 has arrived (step S223).

  When the timing of the difference data calculation by the difference calculation function unit 113 comes (step S221: Y), the corresponding measurement data 114 is read from the data memory function unit 111 (step S224). Then, the difference data is calculated (step S225).

  Here, in order to make the explanation easy to understand, an example will be described in which an early detection of a heat generation failure of the electronic device 100 itself and a sign of a heat generation failure are detected. In this description, it is assumed that the ambient temperature measurement thermosensor 107 is a sensor that measures the temperature around the heat sink 141 of the electronic device 100.

  In the case of this example, the central control function unit 102 extracts and reads out the measurement data 114 of the ambient temperature measurement thermosensor 107 and the environmental temperature measurement thermosensor 108 from the data memory function unit 111 (step S224). The difference calculation function unit 113 calculates the difference between the pair of measurement data that are substantially coincident in time (step S225). Here, the difference between the temperature around the heat sink 141 and the outside air temperature is calculated, and the difference data 116 obtained thereby is stored in the calculation result memory function unit 115 (step S226). Thereafter, the processing is performed from step S221 to step S223. Return to the standby state (return).

  By the way, the difference data 116 stored in the calculation result memory function unit 115 has a meaning as “cooling performance data” of the heat sink 141. As the determination principle of the cooling performance, attention is paid to the temperature difference between the environmental temperature (average value around the air intake) and the object to be measured (temperature around the heat sink 141). In general, the cooling device has a function of bringing the temperature of the heat source close to the environmental temperature by releasing the amount of heat corresponding to the cooling performance from the heat source having a constant heat generation amount. The smaller the difference data 116, the higher the heat exchange efficiency and the “cooling performance” of the heat sink 141. The larger the difference data 116, the lower the heat exchange efficiency and the “cooling performance” of the heat sink 141. Further, when the temporal change of the difference data 116 is observed, if the difference of the difference data 116 is opened as time elapses, the cooling efficiency decreases with time, and a heat generation failure occurs or heat generation occurs. There may be signs of failure.

  Returning to FIG. 12, the description will be continued. When the change calculation timing for observing the temporal change in the “cooling performance” of the heat sink 141 comes (step S221: N, step S222: Y), the change calculation function unit 117 receives the difference data 118 from the calculation result memory function unit 115. Are read one by one along the time series (step S227). The change calculation function unit 117 connects the read individual difference data 118 one by one along the time axis to generate time-series change data (step S228). The generated time-series change data 120 is stored in the change amount memory function unit 119 (step S229). Thereafter, the process returns to the standby state of steps S221 to S223 (return). In this manner, the time-series change amount data representing the temporal change of the “cooling performance” is accumulated in the change amount memory function unit 119.

  Next, the case where the comparison timing as the timing when the check for alarm output is performed will be described. In the present embodiment, since the measurement data 131 is acquired every 6 minutes from the ambient temperature measurement thermosensor 107 and the environmental temperature measurement thermosensor 108, the comparison timing comes every 6 minutes. When the comparison timing comes (step S222: N, step S223: Y), the comparison function unit 121 reads out the latest difference data 122 in time from the change calculation function unit 117 and stores it from the change amount memory function unit 119. Read time-series change data 123 is read out. Accordingly, if the latest time-series change data is generated in step S228 as the comparison timing in step S223, the latest difference data 118 received by the change calculation function unit 117 is supplied to the comparison function unit 121 as the difference data 122. At the same time, the generated time series change data 120 is sent to the change amount memory function unit 119, and the time series change data 120 is supplied to the comparison function unit 121 as the time series change data 123.

  When the comparison function unit 121 acquires the difference data 122 and the time-series change data 123, the data 122 and 123 are related to “cooling performance”, so the threshold value 125 related to “cooling performance” is read from the determination level holding register 124. Then, the degree of change is determined by comparing the degree of deviation from the threshold value 125, the comparison result data 127 indicating the degree of stability of the electronic device 100 is output (step S230), and the process is returned to the standby state (step S230). return). When the comparison result data 127 has contents corresponding to early detection of a failure of the electronic device 100 or detection of a sign of failure, the determination result output function unit 126 uses a warning of detection of a sign of failure as a warning output 128 (hereinafter referred to as “first”). 2)) is output.

  As described above, the failure monitoring apparatus 101 according to the present embodiment has the first alarm corresponding to the measurement data 112 and the second alarm as a result of detection of a failure sign based on the comparison result data 127. Two types of alarms will be output. This will be described more specifically.

  The environmental temperature measured by the failure monitoring apparatus 101 is Ta, and the temperature of the object to be measured is Tb. Also, the degree of cooling is Td, and the guaranteed value as the limit temperature for the electronic device 100 is Tlt. The determination result output function unit 126 calculates the degree of cooling Td using the following equation (1).

  Td = Tb-Ta (1)

  Further, as shown in FIG. 11, at the time when the measurement data 112 is stored in the data memory function unit 111, it is determined whether the temperature Tb of the measured object exceeds the guaranteed value Tlt by the following equation (2). If this condition is met, the first alarm is output as the alarm output 128.

  Tb> Tlt (2)

By the way, the degree of cooling Td may be slightly higher or lower depending on the environmental temperature Ta as the outside air temperature or the load of the electronic device 100. Therefore, a change can be captured in time series, and for that purpose, a certain number of values are prepared as cooling degrees Td, such as cooling degrees Td ₁ , Td ₂ , Td ₃ ,. Further, a reference cooling degree Tds serving as a reference is set. Here, the reference cooling degree Tds is collected by an actual machine in advance and set as a reference value, or the electronic device 100 is operated for about the first day, and data on the cooling degree at that time is collected and an average value is taken. And set as the reference cooling degree Tds.

The reference cooling degree Tds and displacement amounts Tdis ₁ , Tdis ₂ , Tdis ₃ ,... Of the respective cooling degrees Td ₁ , Td ₂ , Td ₃ ,... Are generated and stored as the following equation (3). .

Tds−Td ₁ = Tdis ₁
Tds−Td ₂ = Tdis ₂
Tds−Td ₃ = Tdis ₃
…… …… (3)

  Then, for example, the change ΔTdis of the displacement amount Tdis is measured in units of one day. As long as the cooling performance by the heat sink 141, the fan 142, etc. is maintained, the change ΔTdis of the displacement amount itself does not become negative. On the other hand, when the fan 142 is fouled and the cooling performance is lowered, the cooling is performed when the environmental temperature Ta is increased even when the change ΔTdis of the displacement amount is not negative when the environmental temperature Ta is lowered. Performance is insufficient. In such a case, the change ΔTdis in the displacement amount may start to shift to minus. Therefore, when the change ΔTdis in the displacement amount becomes negative, a second alarm is output as a warning output 128 as a sign of some failure.

  In this way, unlike the conventional method of warning notification when an abnormal temperature is actually detected, the second alarm knows the limit of the performance of parts and equipment against the secular change of parts and long-term environmental changes. It is effective as a mechanism for outputting an alarm before the occurrence of a fault or at an early stage of a fault where the fault is not yet recognized.

  The heat generation failure of the electronic device 100 has been described above. Next, fault detection using the acoustic sensor 109 shown in FIG. 10 will be briefly described with reference to FIGS. In the present embodiment, the acoustic sensor 109 itself has a noise canceling function, and the influence of a sound source existing outside the electronic apparatus 100 can be ignored.

  First, the output of the first alarm related to sound is performed by determining whether the sound generated inside the electronic device 100 exceeds the guaranteed value (step S203 in FIG. 11). That is, when a sound that exceeds the guaranteed value or the limit value is detected (step S203: Y), the first alarm is output from the determination result output function unit 126 as the alarm output 128. The acoustic sensor 109 according to the present embodiment can detect sound with two components of amplitude and frequency at the audible frequency. Therefore, for example, when a sound of a predetermined level or higher is detected in a frequency region that does not occur during normal operation, the first alarm is output as an abnormal sound has occurred.

  Next, the output of the second alarm relating to sound will be described. When the timing of the difference calculation for the output of the acoustic sensor 109 shown in FIG. 10 comes (step S221: Y in FIG. 12), the measurement data 114 output from the acoustic sensor 109 is read from the data memory function unit 111 (step S224). ). Then, the difference data for calculating the difference between the sound amplitude and the frequency is calculated (step S225). The difference data 116 thus obtained is stored in the calculation result memory function unit 115 (step S226).

  The difference data stored in the calculation result memory function unit 115 is read out in time series in step S227 (step S227), and time series change data related to sound is generated (step S228). The time-series change data 120 is stored in the change amount memory function unit 119 (step S229), and when the comparison timing comes (step S223: Y), the comparison function unit 121 executes a comparison process (step S230). In this comparison process, by monitoring the process in which the difference in the difference data 118 increases, it is possible to grasp the deterioration of parts having moving parts such as the fan 142 and a hard disk (not shown) and the progress of the malfunction. At this time, the second alarm is output as the alarm output 128.

  Even in the case of the acoustic sensor 109, it is effective to collect measurement data at intervals of, for example, every 6 minutes, as in the case of temperature, and calculate an average value. Compared to the case of heat generation, the electronic device 100 is less likely to cause inconvenience in its operation immediately even when abnormal noise occurs. Therefore, in many of the conventional electronic devices 100, it is easy to overlook the occurrence of abnormal noise by neglecting the monitoring of the operation by sound. However, it should not be overlooked that the sound changes as a result of some failure when considered as a sign of failure. The acoustic sensor 109 can also detect an impact applied to the electronic device 100 from the outside as a change in sound. Therefore, it is possible to output the second alarm as the alarm output 128 by capturing the impact as a sudden change in sound.

  In the above-described embodiment, the second alarm is individually output as the alarm output 128 for each of the temperature detection and the sound detection. If it occurs in the belt, a more severe alarm may be output. In the embodiment described above, temperature and sound are the detection targets. However, depending on the type of electronic device, other physical phenomena such as light, magnetism, current, and humidity are measured, and the difference data over time is measured. The second alarm may be output as the alarm output 128 by checking the change. Of course, also in this case, it is possible to simply compare the output of these sensors with a predetermined threshold value and output the first alarm.

  According to the present embodiment described above, it is possible to warn of a sign of a failure by reading a change in an operation state or an environmental factor before the occurrence of the failure, so that the operation quality of the electronic device can be improved. In this embodiment, the second alarm can be output and the first alarm can also be output. Therefore, it is possible to cope with a situation in which a failure occurs without outputting the second alarm.

  Further, according to the present embodiment, if a failure occurs and the first alarm is output and the worker who goes to repair the electronic device has the second alarm at that time, the second alarm is output. By searching for the cause of the output of the alarm, it is possible to easily identify the failure, not only to repair the failure that has occurred specifically, but also to deal with the failure that may occur next. Also, by examining the history of whether or not the second alarm has occurred during periodic inspections, the probability of keeping the electronic device healthy until the next periodic inspection can be improved, and the cost of maintenance management can be reduced. And reduce customer complaints. In addition, when a detection that does not actually cause a failure is performed, frequent opening and closing of the cover of the electronic device may have caused the generation of a sound that predicts a failure such as an impact sound. In some cases, it is possible to give advice for operating the user in a better environment.

It is a claim corresponding | compatible figure of the failure monitoring apparatus of the electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring apparatus of the other electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring apparatus of the further another electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring method of the electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring method of the other electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring method of the further another electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring program of the electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring program of the other electronic device of this invention. It is a claim corresponding | compatible figure of the failure monitoring program of the other electronic device of this invention. It is a block diagram showing the structure of the electronic device provided with the failure monitoring apparatus by embodiment of this invention. It is a flowchart showing the outline | summary of the reception process of the measurement data in this Embodiment. It is a flowchart showing the process of the early detection of the failure in the electronic device of this Embodiment and the detection of the precursor of a failure.

Explanation of symbols

10, 20, 30 Failure monitoring device for electronic device 11 Measuring means 12, 33 Difference calculating means 13, 35 Comparison means 14, 27, 36 Failure prediction warning means 21 Cooling means 22 Predetermined part temperature measuring means 23 Environmental temperature measuring means 24, 32 Sampling means 25 Cooling degree calculating means 26 Cooling degree change data creating means 31, 109 Acoustic sensor 34 Change data creating means 40, 50, 60 Electronic device failure monitoring method 41 Measuring step 42, 62 Difference calculating step 43, 64 Comparison step 44, 54, 65 Failure prediction warning step 51 Measurement data acquisition step 52 Cooling degree calculation step 53 Cooling degree change data creation step 61 Data sampling step 63 Change data creation step 70, 80, 90 Fault monitoring program for electronic device 71 Measurement processing 72 , 9 Difference calculation processing 73, 94 Comparison processing 74, 84, 95 Failure prediction warning processing 81, 91 Sampling processing 82 Cooling degree calculation processing 83 Cooling degree change data creation processing 93 Change data creation processing 100 Electronic device 101 Fault monitoring device 102 Central control function Part 103 CPU
DESCRIPTION OF SYMBOLS 104 Memory 106 Sensor input circuit 107 Ambient temperature measurement thermosensor 108 Environmental temperature measurement thermosensor 113 Difference calculation function part 117 Change calculation function part 119 Change amount memory function part 121 Comparison function part 124 Judgment level holding register 126 Judgment result output function part 128 Alarm output (alarm)
141 heat sink 142 fan

Claims (7)

Cooling means for cooling the temperature inside the electronic device;
Predetermined part temperature measuring means for measuring the temperature of the predetermined part cooled by the cooling means;
Environmental temperature measuring means for measuring the environmental temperature of the place where the electronic device is installed;
Sampling means for repeatedly acquiring each measurement data at intervals from the environmental temperature measuring means and the predetermined part temperature measuring means;
A cooling degree calculating means for calculating a cooling degree at the sampling time of the cooling means by obtaining a temperature difference as a difference between the two types of measurement data acquired at the time of each sampling using the sampling means;
The calculation result of the cooling degree calculating means is arranged in time series, and the cooling degree change data creating means for creating the cooling degree change data indicating the temporal change state of the cooling degree,
Failure occurrence detection means for detecting as a sign of failure occurrence when it is determined from the cooling degree change data created by the cooling degree change data creation means that the cooling degree does not increase in response to a rise in the environmental temperature above a predetermined environmental temperature When,
A failure monitoring apparatus for an electronic device, comprising: a failure prediction warning unit that issues a warning about cooling of the cooling unit when the failure occurrence detection unit detects a sign of occurrence of a failure. An acoustic sensor;
A sampling means that repeatedly obtains amplitude data indicating the amplitude of the sound and frequency data indicating the frequency of the sound from the acoustic sensor as measurement data, respectively ,
Difference calculating means for calculating the difference between the two types of measurement data acquired using the sampling means;
The calculation result of this difference calculation means is arranged in time series, change data creation means for creating change data representing sound in amplitude and frequency,
Comparison means for comparing the change indicated by the change data created by the change data creation means with a predetermined predetermined safety range that can be regarded as not causing a failure,
A failure occurrence detection means for detecting as a sign of failure occurrence when it is determined by the comparison means that there has been a change in change data exceeding the predetermined safety range ;
A failure monitoring device for an electronic device, comprising: failure prediction warning means for issuing a warning about sound generation when the failure detection means detects a sign of failure occurrence. The acoustic sensor is a noise canceller circuit that suppresses the influence of sound generated in places other than its own device.
The fault monitoring apparatus for an electronic device according to claim 2, further comprising a path . Time is measured from the predetermined part temperature measuring means for measuring the temperature of the predetermined part cooled by the cooling means for cooling the temperature inside the electronic device, and the environmental temperature measuring means for measuring the environmental temperature of the place where the electronic device is installed. A measurement data acquisition step to obtain each measurement data at each sampling,
A cooling degree calculation step of calculating a cooling degree at the time of sampling of the cooling means by obtaining a temperature difference as a difference between the two types of measurement data acquired in the measurement data acquisition step;
The calculation result in this cooling degree calculation step is arranged in time series, and the cooling degree change data creation step for creating the cooling degree change data indicating the state of the temporal change in the cooling degree,
A failure occurrence detection step for detecting, as a sign of failure occurrence, when it is determined from the cooling degree change data created in this cooling degree change data creation step that the cooling degree does not increase in response to a rise in the environmental temperature at a predetermined environmental temperature or higher. When,
Failure prediction warning step for issuing a warning about cooling of the cooling means when a failure occurrence sign is detected in this failure detection step
A failure monitoring method for an electronic device, comprising: A data sampling step for repeatedly acquiring amplitude data indicating the amplitude of sound and frequency data indicating the frequency of sound from the acoustic sensor provided in the electronic device as measurement data, respectively,
A difference calculating step for calculating the difference between the two types of measurement data acquired in the data sampling step;
Place the calculation results in this difference calculation step in time series, change data creation step for creating change data representing sound in amplitude and frequency,
A comparison step for comparing the change indicated by the change data created in this change data creation step with a predetermined predetermined safety range that can be regarded as no failure occurs;
A failure occurrence detection step of detecting as a sign of failure occurrence when it is determined that there has been a change in change data exceeding the predetermined safety range by this comparison step;
A failure prediction method for an electronic device, comprising: a failure prediction warning step for issuing a warning about sound generation when a failure occurrence sign is detected in the failure occurrence detection step. Cooling means for cooling the temperature inside the electronic device, predetermined part temperature measuring means for measuring the temperature of a predetermined part cooled by the cooling means, and environmental temperature measurement for measuring the environmental temperature of the place where the electronic device is installed A computer with means,
Sampling processing for repeatedly acquiring each measurement data at intervals from the environmental temperature measurement means and the predetermined part temperature measurement means;
A cooling degree calculation process for calculating a cooling degree at the time of sampling of the cooling means by obtaining a temperature difference as a difference between the two types of measurement data acquired at the time of each sampling by the sampling process;
The calculation result by this cooling degree calculation process is arranged in time series, and the cooling degree change data creation process for creating the cooling degree change data indicating the temporal change state of the cooling degree,
Failure occurrence detection processing for detecting a sign of failure occurrence when it is determined from the cooling degree change data created in this cooling degree change data creation processing that the cooling degree does not increase in response to a rise in the environmental temperature at a predetermined environmental temperature or higher. When,
Failure prediction warning processing for issuing a warning about cooling of the cooling means when a failure occurrence sign is detected in this failure detection processing
And a fault monitoring program for an electronic device. In computers equipped with acoustic sensors in electronic devices,
A sampling process for repeatedly acquiring amplitude data indicating the amplitude of sound and frequency data indicating the frequency of sound from the acoustic sensor as measurement data, respectively,
A difference calculation process for calculating the difference between the two types of measurement data acquired by the sampling process;
Arrangement results of the difference calculation processing in time series, change data creation processing for creating change data representing sound in amplitude and frequency,
A comparison process for comparing the change indicated by the change data created in the change data creation process with a predetermined predetermined safety range that can be regarded as not causing a failure;
A fault occurrence detection process for detecting a sign of a fault occurrence when it is determined by this comparison process that there has been a change in change data exceeding the predetermined safety range;
Failure prediction warning processing that issues a warning about sound generation when a failure sign is detected in this failure detection processing
And a fault monitoring program for an electronic device.

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