JP5024421B2 - Laminated electronic components - Google Patents

Description

  The present invention relates to a multilayer electronic component such as a multilayer ceramic capacitor.

  As a multilayer electronic component, a plurality of insulating layers are laminated, a pair of main surfaces facing each other, a pair of side surfaces extending so as to connect between the pair of main surfaces and facing each other, and a pair of the main surfaces An element body having a pair of end faces extending to connect each other and facing each other, a plurality of internal electrodes arranged in the stacking direction of the plurality of insulating layers in the element body, and drawn to the end faces, and a pair of end faces There are known ones each including a pair of terminal electrodes that are formed and connected to internal electrodes that are led out to respective end faces (see, for example, Patent Documents 1 and 2). In the multilayer electronic component described in Patent Documents 1 and 2, the ridge line portion positioned between the main surface and the end surface and the ridge line portion positioned between the main surface and the side surface are rounded so as to be curved.

JP 2001-006964 A JP 2007-149990 A

  An object of the present invention is to provide a laminated electronic component capable of suppressing occurrence of abnormal formation of terminal electrodes, occurrence of short-circuit defects, occurrence of chipping of an element body, and occurrence of peeling of an insulating layer.

  The present inventors have conducted intensive research on multilayer electronic components that can suppress the occurrence of abnormal formation of terminal electrodes, the occurrence of short-circuit defects, the occurrence of chipping of the element body, and the occurrence of peeling of the insulating layer. First, the present inventors have found that the occurrence of abnormal formation of terminal electrodes, the occurrence of short-circuit failure, and the occurrence of chipping of the element body are contradictory events. The ridge line portion located between the main surface and the end surface and the ridge line portion located between the main surface and the side surface are rounded so as to be curved in order to suppress the occurrence of chipping in the ridge line portion or the like. . Regarding the radius of curvature of the curved ridge line portion, the occurrence of the chipping can be suppressed as the radius of curvature increases. On the other hand, the occurrence of abnormal terminal electrode formation and the occurrence of short-circuit failure can be suppressed as the radius of curvature is smaller.

  The terminal electrode is generally formed by applying a conductive paste to the end face of the element body and baking the applied conductive paste. At this time, as a result of investigations by the present inventors, the ridge line portion is located around the end surface, and it is difficult for the conductive paste to adhere to the ridge line portion. When the radius of curvature is increased, the internal electrode located outside as viewed in the stacking direction of the plurality of insulating layers among the plurality of internal electrodes may be exposed at the ridge line portion. When the internal electrode is exposed at the ridge line part, it is difficult to apply the conductive paste so as to cover the part of the internal electrode exposed at the ridge line part, and the application of the conductive paste may be abnormal. is there. When an abnormality occurs in the application of the conductive paste, an abnormality also occurs in the terminal electrode formed from the conductive paste.

  Moreover, even if the conductive paste adheres to the ridge line portion of the element body, it is difficult to ensure a sufficient adhesion thickness of the conductive paste. Therefore, even if the conductive paste covers the end portion of the internal electrode exposed at the ridge line portion, the formed terminal electrode is thin, and short circuit failure may occur due to the ingress of moisture or the like.

  Therefore, the present inventors, in the cut surface cut in the direction orthogonal to the main surface and the end surface, the distance from the bending start point of the ridge line portion on the end surface side to the virtual corner is a plurality of the plurality of internal electrodes By setting it larger than the distance between the inner electrode located on the outermost side in the laminating direction of the insulating layer and the main surface, the internal electrode is prevented from being exposed at the ridgeline, and abnormal formation of terminal electrodes and short circuit failure It came to discover the new fact that it can control outbreak of. And, the present inventors, in the cut surface cut in the direction perpendicular to the main surface and the end surface, from the bending start point of the ridge line portion on the main surface side to the virtual corner assumed that the ridge line portion is a right angle The distance is set to be larger than the distance from the bending start point of the ridge line portion on the end surface side to the imaginary corner, and in the cut surface cut in the direction orthogonal to the main surface and the side surface, By setting the distance from the bending start point to the virtual corner to be larger than the distance from the bending start point to the virtual corner of the ridge line part on the side surface side, occurrence of terminal electrode formation abnormality, occurrence of short circuit failure, In addition, a new fact that the occurrence of chipping of the element body can be suppressed has been found.

  As a result of further investigation and research on the multilayer electronic component in which the inventors set the distance R2 to be greater than the distance R1, the inventors have peeled off the insulating layer on the main surface side of the element body when the distance R1 becomes too large. It turns out that there is a fear that a new problem of becoming easier.

Based on such research results, the multilayer electronic component according to the present invention has a plurality of insulating layers stacked, a pair of main surfaces facing each other, and a pair extending to connect between the pair of main surfaces and facing each other. And a plurality of elements disposed in the stacking direction of the plurality of insulating layers in the element body and led out to the end surfaces. And a pair of terminal electrodes formed on a pair of end surfaces and connected to the internal electrodes drawn out to the end surfaces, and a ridge line portion and a main surface located between the main surface and the end surface, The ridge line part located between the side surface is rounded so as to be curved, and the ridge line part is cut from the bending start point of the ridge line part on the main surface side in the cut surface cut in the direction orthogonal to the main surface and the end surface. A virtual corner assumed to be a right angle And the distance R1, and the distance R2 to the corner of the virtual from the curved starting point of the ridge line portion at the end face side,
1.05 ≦ R1 / R2 ≦ 1.47
The distance R3 from the bending start point of the ridge line portion on the main surface side to the imaginary corner on the cut surface cut in the direction orthogonal to the main surface and the side surface and the curvature of the ridge line portion on the side surface side The distance R4 from the starting point to the virtual corner is
1.05 ≦ R3 / R4 ≦ 1.47
The distance R2 and the interval T between the inner electrode located on the outermost side in the stacking direction of the plurality of insulating layers and the main surface among the plurality of inner electrodes,
T> R2
It is characterized by satisfying the following relationship.

Preferably, the ridge line portion located between the side surface and the end surface is rounded so as to be curved, and the cut surface cut in a direction perpendicular to the side surface and the end surface is from the bending start point of the ridge line portion on the end surface side. The distance R5 to the imaginary corner and the distance Wg between the internal electrode and the side surface are:
Wg> R5
The distance R6 from the bending start point of the ridge line portion on the side surface side to the imaginary corner and the distance Lg between the internal electrode and the end surface in the cut surface cut in the direction orthogonal to the side surface and the end surface are satisfied. ,
Lg> R6
And the distance R4 and the interval T are
T> R4
Satisfies the relationship. More preferably, the distance R5 is shorter than both the distance R2 and the distance R4, and the distance R6 is shorter than both the distance R2 and the distance R4. In these cases, the distance between the end face and the internal electrode not exposed at the end face and the distance between the side face and the internal electrode are secured. As a result, it is possible to suppress the deterioration of insulation resistance in a high temperature and high humidity environment.

  ADVANTAGE OF THE INVENTION According to this invention, the multilayer electronic component which can suppress generation | occurrence | production of the formation abnormality of a terminal electrode, generation | occurrence | production of a short circuit defect, generation | occurrence | production of a chip | tip of an element | base_body, and peeling of an insulating layer can be provided.

It is a perspective view of the multilayer electronic component which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of the element | base_body contained in the multilayer electronic component which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of the element | base_body contained in the multilayer electronic component which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of the element | base_body contained in the multilayer electronic component which concerns on this embodiment. It is a chart which shows the result of the 1st experiment. It is a chart which shows the result of the 2nd experiment. It is a chart which shows the result of the 3rd experiment. It is a chart which shows the result of the 4th experiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-4, the laminated electronic component C which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view of the multilayer electronic component according to the present embodiment. 2-4 is a figure for demonstrating the cross-sectional structure of the element | base_body contained in the multilayer electronic component which concerns on this embodiment. The multilayer electronic component C according to the present embodiment is a chip-shaped multilayer capacitor. The multilayer electronic component C has a substantially rectangular parallelepiped shape. For example, the length in the longitudinal direction is about 3.2 mm, the length in the width direction is about 1.6 mm, and the length in the height direction is 1. About 6 mm. That is, the multilayer electronic component C is a 3216 size chip component.

  The multilayer electronic component C includes an element body 1, terminal electrodes 3 and 5 disposed on both ends of the element body 1, and a plurality of internal electrodes 7.

  The element body 1 has a pair of main surfaces 11 and 12, a pair of side surfaces 13 and 14, and a pair of end surfaces 15 and 16. The pair of main surfaces 11 and 12 face each other. The pair of side surfaces 13 and 14 extend so as to connect the pair of main surfaces 11 and 12 and face each other. The pair of end surfaces 15 and 16 extend so as to connect the pair of main surfaces 11 and 12 and face each other.

  The element body 1 includes ridge line portions 17a to 17d, ridge line portions 18a to 18d, and ridge line portions 19a to 19d. The ridge line portions 17 a to 17 d are located between the main surfaces 11 and 12 and the end surfaces 15 and 16. The ridge line portions 18 a to 18 d are located between the main surfaces 11 and 12 and the side surfaces 13 and 14. The ridge line portions 19 a to 19 d are located between the side surfaces 13 and 14 and the end surfaces 15 and 16. The ridge line portions 17a to 17d, the ridge line portions 18a to 18d, and the ridge line portions 19a to 19d are rounded so as to be curved, and so-called R chamfering is performed.

  The element body 1 has a plurality of insulating layers 21 as shown in FIGS. Each insulating layer 21 extends in a direction parallel to the pair of main surfaces 11 and 12, and is laminated in a direction opposite to the pair of main surfaces 11 and 12. That is, the facing direction of the pair of main surfaces 11 and 12 and the stacking direction in the element body 1 coincide. The element body 1 has a structure in which the internal electrodes 7 are stacked so as to face each other with the insulating layer 21 interposed therebetween. The element body 1 includes a capacitance forming portion (inner layer portion) 1 a including the internal electrode 7, and an outer layer portion 1 b that sandwiches the capacitance forming portion 1 a in the opposing direction of the pair of main surfaces 11 and 12. The outer layer portion 1 b is a layer in which a plurality of insulating layers 21 are laminated and these insulating layers 21 are integrated, and does not include the internal electrode 7.

Each insulating layer 21 is composed of a ceramic green sheet sintered body containing a dielectric material (for example, BaTiO ₃ or the like) as a main component. In an actual laminated electronic component C, the insulating layers 21 are integrated to such an extent that the boundary between the insulating layers 21 cannot be visually recognized.

  Each internal electrode 7 has a substantially rectangular shape, and its ends are exposed at the end faces 15 and 16. The internal electrodes 7 exposed on the end surface 15 and the internal electrodes 7 exposed on the end surface 16 are alternately arranged in the stacking direction of the insulating layer 21 in the element body 1, that is, in the opposing direction of the pair of main surfaces 11 and 12. Yes. The internal electrodes 7 adjacent to each other in the stacking direction of the insulating layer 21 face each other with the insulating layer 21 interposed therebetween. The internal electrode 7 is made of a conductive material (for example, Ni that is a base metal) that is normally used as an internal electrode of a multilayer electric element. The internal electrode 7 is configured as a sintered body of a conductive paste containing the conductive material.

  The terminal electrode 3 is disposed on the end face 15 side. The terminal electrode 5 is disposed on the end face 16 side. Each terminal electrode 3, 5 has a baked electrode layer and a plating layer. The baked electrode layer is formed so as to cover the whole of the end surfaces 15 and 16 and a part of the pair of main surfaces 11 and the pair of side surfaces 13 and 14 adjacent to the end surfaces 15 and 16. Therefore, the baked electrode layer covers the ridge line portions 17a to 17d and the ridge line portions 19a to 19d. The baked electrode layer is formed by applying and baking a conductive paste containing a conductive metal powder (for example, Cu powder or the like) to a corresponding portion of the outer surface of the element body 1. The plating layer is formed on the baked electrode layer by a wet plating method (for example, an electrolytic plating method). For electrolytic plating, for example, Ni / Sn plating or the like can be used.

  Each terminal electrode 3, 5 (baked electrode layer) covers all the portions of the internal electrode 7 exposed at the end faces 15, 16. Therefore, the internal electrode 7 is physically and electrically connected to the corresponding terminal electrodes 3 and 5.

  Then, the position of the curve start point in each ridgeline part 17a-17d, 18a-18d, 19a-19d is demonstrated.

As shown in FIG. 2, the ridge line portions 17 a to 17 d are cut in a direction perpendicular to the main surfaces 11 and 12 and the end surfaces 15 and 16, and the main surfaces 11 and 12 side and the end surfaces 15 and 16 side Each has a bending start point. In the cut surface cut in a direction orthogonal to the main surfaces 11 and 12 and the end surfaces 15 and 16, a virtual angle assuming that the ridge line portions 17a to 17d are right angles is defined as “A1”. The distance from the bending start point of the ridge line portions 17a to 17d on the 12th side to the virtual angle A1 is defined as “R1”, and the virtual angle A1 from the bending start point of the ridge line portions 17a to 17d on the end faces 15 and 16 side is defined. Is defined as “R2”. The distance R1 and the distance R2 are
1.05 ≦ R1 / R2 ≦ 1.47
Satisfies the relationship. The ridge line portions 17a to 17d are, for example, along an elliptical arc having a distance R1 as a major axis and a distance R2 as an end axis on a cut surface cut in a direction perpendicular to the main surfaces 11 and 12 and the end surfaces 15 and 16. ing.

Internal electrode 7 and main surface which are located on the outermost side in the stacking direction of a plurality of insulating layers 21 among a plurality of internal electrodes 7 in a cut surface cut in a direction perpendicular to main surfaces 11 and 12 and end surfaces 15 and 16 The interval between 11 and 12 is defined as “T”. The interval T corresponds to the thickness of the outer layer portion 1b. The distance R2 and the interval T are
T> R2
Satisfies the relationship.

As shown in FIG. 3, the ridge line portions 18 a to 18 d are cut in a direction perpendicular to the main surfaces 11 and 12 and the side surfaces 13 and 14, and the main surface 11 and 12 side and the side surface 13 and 14 side. Each has a bending start point. In the cut surface cut in a direction orthogonal to the main surfaces 11 and 12 and the side surfaces 13 and 14, a virtual corner assuming that the ridge line portions 18a to 18d are right angles is defined as “A2”. The distance from the bending start point of the ridge line portions 18a to 18d on the 12th side to the virtual angle A2 is defined as “R3”, and the virtual angle A2 from the bending start point of the ridge line portions 18a to 18d on the side surfaces 13 and 14 side is defined. Is defined as “R4”. The distance R3 and the distance R4 are
1.05 ≦ R3 / R4 ≦ 1.47
Satisfies the relationship. The distance R4 and the interval T are
T> R4
Satisfies the relationship. The ridge line portions 18a to 18d are, for example, along an elliptical arc having a distance R3 as a major axis and a distance R4 as an end axis on a cut surface cut in a direction perpendicular to the main surfaces 11 and 12 and the side surfaces 13 and 14. ing.

As shown in FIG. 4, the ridge line portions 19 a to 19 d are respectively formed on the side surfaces 13 and 14 side and the end surfaces 15 and 16 side in the cut surfaces cut in the direction orthogonal to the side surfaces 13 and 14 and the end surfaces 15 and 16. It has a curve start point. In the cut surface cut in the direction perpendicular to the side surfaces 13 and 14 and the end surfaces 15 and 16, a virtual corner assuming that the ridge line portions 19a to 19d are perpendicular is defined as "A3", and the end surfaces 15 and 16 side The distance from the bending start point of the ridge line portions 19a to 19d to the virtual angle A3 is defined as “R5”, and the distance between the internal electrode 7 and the side surfaces 13 and 14 is defined as “Wg”. The distance R5 and the distance Wg are
Wg> R5
Satisfies the relationship. The distance R5 is shorter than the distance R2 and the distance R4.

In the cut surface cut in the direction perpendicular to the side surfaces 13 and 14 and the end surfaces 15 and 16, the distance from the bending start point of the ridge line portions 19a to 19d on the side surface 13 and 14 side to the virtual angle A3 is “R6”. The distance between the internal electrode 7 and the end faces 15 and 16 is defined as “Lg”. The distance R6 and the distance Lg are
Lg> R6
Satisfies the relationship. The distance R6 is shorter than the distance R2 and the distance R4. The ridge line portions 19a to 19d are along a circular arc whose radius is a distance R5 (distance R6), for example, on a cut surface cut in a direction perpendicular to the side surfaces 13 and 14 and the end surfaces 15 and 16.

  Here, the relationship between the distances R1 to R6 and the occurrence of abnormal formation of the terminal electrodes 3 and 5, the occurrence of short-circuit defects, the occurrence of chipping of the element body 1, and the occurrence of peeling of the insulating layer 21 will be described in detail. .

The present inventors clarified the relationship between the distances R1 to R6, the occurrence of abnormal formation of the terminal electrodes 3 and 5, the occurrence of short-circuit defects, the occurrence of chipping of the element body 1, and the occurrence of peeling of the insulating layer 21. In order to do this, the following first experiment was conducted. A predetermined number (1000) of specimens are prepared for each sample 1 to 11 of multilayer capacitors (3216 type multilayer capacitors) having different distances R1 and R2, and abnormal formation of the terminal electrodes 3 and 5 in each specimen occurs. Generation | occurrence | production of the short circuit defect, the generation | occurrence | production of the chip | tip of the element | base_body 1, and the peeling of the insulating layer 21 were confirmed. Regarding the occurrence of abnormal formation of the terminal electrodes 3 and 5, the appearance of each specimen was inspected, and when the internal electrode was not covered by the external electrode, it was judged as “defective”. Regarding the occurrence of a short circuit defect, the resistance value when a predetermined voltage (1 V) was applied to each specimen was measured, and when the measured value was 10 kΩ or less, it was determined as “defective”. Regarding the occurrence of chipping of the element body 1, the appearance of each specimen was inspected, and when a fracture surface with a predetermined area (10 μm ² ) or more was confirmed in the ridge line portion, it was determined as “bad”. Regarding the occurrence of peeling of the insulating layer 21, the appearance of each specimen was inspected, and when there was a gap parallel to the stacking direction, it was determined as “defective”.

  The result of the first experiment is shown in FIG. Each of the samples 1 to 11 has the same configuration as the multilayer electronic component C (multilayer capacitor) of the above-described embodiment except that the distance R1 and the distance R2 are different from each other. It has the same electrical characteristics (for example, B characteristics). In the first experiment, in each specimen, the distance R3 was set to 230 μm, and the distance R4 was set to 180 μm. Therefore, the ratio (R3 / R4) between the distance R3 and the distance R4 in each specimen is 1.28. In the first experiment, for each specimen, the interval T was set to 200 μm, and the distance Wg and the distance Lg were set to 200 μm.

From the experimental results shown in FIG. 5, the distance R1 and the distance R2 are 1.05 ≦ R1 / R2 ≦ 1.47.
When the above relationship is satisfied, it can be seen that the occurrence of abnormal formation of the terminal electrodes 3 and 5, the occurrence of short-circuit failure, the occurrence of chipping of the element body 1, and the occurrence of peeling of the insulating layer 21 are suppressed. In particular, the distance R1 and the distance R2 are 1.14 ≦ R1 / R2 ≦ 1.22.
When the above relationship is satisfied, none of the defects such as abnormal formation of the terminal electrodes 3 and 5, short circuit failure, chipping of the element body 1, and peeling of the insulating layer 21 have occurred. The final pass / fail judgment is made based on the total failure occurrence rate obtained by summing up the respective failure occurrence rates of abnormal formation of the terminal electrodes 3, 5, short circuit failure, chipping of the element body 1, and peeling of the insulating layer 21. A sample having a defect occurrence rate of 0.5% or less was determined as “good (◎ or ○)”.

  Subsequently, the present inventors conducted the following second experiment. A predetermined number (1000) of specimens are produced for each sample 12 to 18 of multilayer capacitors having different distances R3 and R4 (3216 type multilayer capacitors), and occurrence of abnormal formation of the terminal electrodes 3 and 5 in each specimen, Generation | occurrence | production of the short defect, the generation | occurrence | production of the chip | tip of the element | base_body 1, and the peeling of the insulating layer 21 were confirmed. Regarding the occurrence of these defects, the same evaluation as in the first experiment was performed.

  The result of the second experiment is shown in FIG. Each of the samples 12 to 18 has the same configuration as the laminated electronic component C of the above-described embodiment except that the distance R3 and the distance R4 are different, and the specimens have the same electrical characteristics in all the samples 12 to 18. (For example, B characteristics). In the second experiment, the distance R1 was set to 230 μm and the distance R2 was set to 200 μm for each specimen. Therefore, the ratio (R1 / R2) between the distance R1 and the distance R2 in each specimen is 1.15. In the first experiment, for each specimen, the interval T was set to 200 μm, and the distance Wg and the distance Lg were set to 200 μm.

From the experimental results shown in FIG. 6, the distance R3 and the distance R4 are 1.05 ≦ R3 / R4 ≦ 1.47.
When the above relationship is satisfied, it can be seen that the occurrence of abnormal formation of the terminal electrodes 3 and 5, the occurrence of short-circuit failure, the occurrence of chipping of the element body 1, and the occurrence of peeling of the insulating layer 21 are suppressed. In particular, the distance R3 and the distance R4 are 1.15 ≦ R3 / R4 ≦ 1.24.
When the above relationship is satisfied, none of the defects such as abnormal formation of the terminal electrodes 3 and 5, short circuit failure, chipping of the element body 1, and peeling of the insulating layer 21 have occurred. Here again, the final pass / fail judgment is made by the total failure occurrence rate obtained by summing up the failure occurrence rates of the formation abnormality of the terminal electrodes 3, 5, short-circuit failure, chipping of the element body 1, and peeling of the insulating layer 21. A sample having a total defect occurrence rate of 0.5% or less was determined as “good (◎ or ○)”.

  Next, the present inventors conducted the following third experiment in order to clarify the relationship between the distance R4 and the interval T and the occurrence of insulation resistance deterioration under a high temperature and high humidity environment. A predetermined number (1000) of specimens are prepared for each sample 19 to 21 of a multilayer capacitor (3216 type multilayer capacitor) having a different relationship between the distance R4 and the distance T, and the insulation resistance deteriorates in a high temperature and high humidity environment in each specimen. The occurrence of was confirmed. Here, an acceleration test was performed with each specimen mounted on a substrate by soldering (reflow), and the insulation resistance IR before and after each acceleration test was measured. A specimen whose insulation resistance IR decreased by one digit or more after the acceleration test was judged as “defective”. In the acceleration test, a 50 V DC voltage was continuously applied to each specimen for 24 hours in a constant temperature and humidity environment (temperature: 121 ° C., relative humidity: 95%, pressure: 2 atm). The insulation resistance after the acceleration test was a value measured after a predetermined time (2 hours or more) elapsed from the acceleration test.

  The result of the third experiment is shown in FIG. Each sample 19 to 21 has the same configuration as the laminated electronic component C of the above-described embodiment except that the relationship between the distance R4 and the interval T is different. Characteristic (for example, B characteristic). In the third experiment, in each specimen, the distance R1 was set to 205 μm, the distance R2 was set to 180 μm, and the distance R3 was set to 230 μm. Therefore, the ratio (R1 / R2) between the distance R1 and the distance R2 in each specimen is 1.14. In the third experiment, in each specimen, the interval T was set to 200 μm, and the distance Wg and the distance Lg were set to 200 μm.

  From the experimental results shown in FIG. 7, the distance R4 and the interval T are

T> R4
It can be seen that the deterioration of insulation resistance is suppressed when the above relationship is satisfied.

  Subsequently, in order to clarify the relationship between the relationship between the distance R5 and the distance Wg, the relationship between the distance R6 and the distance Lg, and the occurrence of insulation resistance deterioration under a high-temperature and high-humidity environment, A fourth experiment was performed. A multilayer capacitor (3216 type multilayer capacitor) having a different relationship between the distance R5 and the distance Wg and the relationship between the distance R6 and the distance Lg is prepared for a predetermined number (1000) of samples for each of the samples 22 to 26. The occurrence of insulation resistance deterioration under high temperature and high humidity environment was confirmed. Regarding the occurrence of the insulation resistance deterioration, the same evaluation as in the third experiment was performed.

  The result of the fourth experiment is shown in FIG. Each of the samples 22 to 26 has the same configuration as the multilayer electronic component C of the above-described embodiment except that the relationship between the distance R5 and the distance Wg and the relationship between the distance R6 and the distance Lg are different. In 22 to 26, the specimens have the same electrical characteristics (for example, B characteristics). In the fourth experiment, in each specimen, the distance R1 was set to 205 μm, the distance R2 was set to 180 μm, the distance R3 was set to 230 μm, and the distance R4 was set to 180 μm. Accordingly, the ratio (R1 / R2) between the distance R1 and the distance R2 in each specimen is 1.14, and the ratio (R3 / R4) between the distance R3 and the distance R4 in each specimen is 1.10. In the third experiment, in each specimen, the interval T was set to 200 μm, and the distance Wg and the distance Lg were set to 200 μm.

  From the experimental results shown in FIG. 8, the distance R5 and the distance Wg are

Wg> R5
And the distance R6 and the distance Lg are

Lg> R6
It can be seen that the deterioration of insulation resistance is suppressed when the above relationship is satisfied.

As described above, in the present embodiment, the distance R1 and the distance R2 are
1.05 ≦ R1 / R2 ≦ 1.47
And the distance R3 and the distance R4 are
1.05 ≦ R3 / R4 ≦ 1.47
And the distance R2 and the interval T are
T> R2
Therefore, the occurrence of abnormal formation of the terminal electrodes 3, 5, the occurrence of short-circuit failure, the occurrence of chipping of the element body 1, and the peeling of the insulating layer 21 can be suppressed.

In the present embodiment, the distance R5 and the distance Wg are
Wg> R5
And the distance R6 and the distance Lg are
Lg> R6
And the distance R4 and the interval T are
T> R4
Therefore, it is possible to suppress the occurrence of insulation resistance deterioration in a high temperature and high humidity environment.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  The present invention is not limited to a multilayer capacitor, and can also be applied to multilayer electronic components such as multilayer varistors and multilayer piezoelectric actuators.

  The present invention can be used for multilayer electronic components such as multilayer ceramic capacitors.

DESCRIPTION OF SYMBOLS 1 ... Element body, 1a ... Capacitance formation part, 1b ... Outer layer part, 3, 5 ... Terminal electrode, 7 ... Internal electrode, 11, 12 ... Main surface, 13, 14 ... Side surface, 15, 16 ... End surface, 17a-17d , 18a to 18d, 19a to 19d ... ridge line portion, 21 ... insulating layer, C ... laminated electronic component.

Claims (3)

A plurality of insulating layers are stacked, a pair of main surfaces facing each other, a pair of side surfaces extending so as to connect between the pair of main surfaces and facing each other, and a pair of the main surfaces are connected An element body having a pair of end faces extending and facing each other;
A plurality of internal electrodes arranged in the stacking direction of the plurality of insulating layers in the element body and led out to the end face;
A pair of terminal electrodes respectively formed on the pair of end faces and connected to the internal electrodes drawn out to the end faces;
The ridge line portion positioned between the main surface and the end surface and the ridge line portion positioned between the main surface and the side surface are rounded so as to be curved,
In a cut surface cut in a direction orthogonal to the main surface and the end surface, a distance R1 from a bending start point of the ridge line portion on the main surface side to a virtual corner assumed to be a right angle from the ridge line portion; , A distance R2 from the starting point of curvature of the ridge line part on the end face side to the virtual corner,
1.05 ≦ R1 / R2 ≦ 1.47
Satisfy the relationship
In a cut surface cut in a direction orthogonal to the main surface and the side surface, a distance R3 from the bending start point of the ridge line portion on the main surface side to the virtual corner, and the ridge line portion on the side surface side The distance R4 from the curve start point to the virtual corner is
1.05 ≦ R3 / R4 ≦ 1.47
Satisfy the relationship
The distance R2 and the interval T between the inner electrode located on the outermost side in the stacking direction of the plurality of insulating layers and the main surface among the plurality of inner electrodes,
T> R2
A laminated electronic component characterized by satisfying the following relationship: The ridge line portion located between the side surface and the end surface is rounded so as to be curved,
In a cut surface cut in a direction perpendicular to the side surface and the end surface, a distance R5 from the bending start point of the ridge line portion to the imaginary corner on the end surface side, and a distance Wg between the internal electrode and the side surface And
Wg> R5
Satisfy the relationship
In a cut surface cut in a direction perpendicular to the side surface and the end surface, a distance R6 from the bending start point of the ridge line portion to the imaginary corner on the side surface side, and a distance Lg between the internal electrode and the end surface And
Lg> R6
Satisfy the relationship
The distance R4 and the interval T are
T> R4
The multilayer electronic component according to claim 1, wherein the following relationship is satisfied. The distance R5 is shorter than both the distance R2 and the distance R4,
The multilayer electronic component according to claim 2, wherein the distance R6 is shorter than both the distance R2 and the distance R4.

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