JP5023377B2 - Ceramic sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further improve a characteristic feature of a ceramic layer in a ceramic sheet having a ceramic layer composed of a plurality of ceramic small pieces arranged in a planar manner. <P>SOLUTION: The ceramic layer 5 of the ceramic sheet 1 has a structure wherein a plurality of ceramic small pieces 5a are arranged. The plurality of ceramic small pieces 5a are formed by sandwiching a thin plate like ceramic where a dashed line-like recessed part or a hole part is formed on at least either one side surface of front and back sides between resin sheet layers 3 and then splitting it along the dashed line. The characteristic feature of the ceramic layer can be improved by splitting a thin plate like ceramic along a dashed line-like recessed part or hole part, as compared with the case where the thin plate-like ceramic is split along a solid line-like groove. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a ceramic sheet having a structure in which a plurality of layers including a ceramic layer are laminated, wherein the ceramic layer has a structure in which a plurality of ceramic pieces are arranged in a planar shape.

  Conventionally, a ceramic sheet provided with a layer formed by arranging a plurality of ceramic pieces in a planar shape has already been proposed (see, for example, Patent Document 1). In Patent Document 1 below, as a method of arranging a plurality of ceramic pieces in a planar shape, a green sheet containing ceramic is provided with slits, the green sheet is fired to form a fired body, and the fired body is placed on the sheet. A method of dividing the fired body into a plurality of blocks through slits is disclosed (Patent Document 1: Paragraphs [0036] to [0037] and the like).

If ceramic pieces are provided in this way, the green sheet will be shrunk in the vicinity of the part where the slit is provided by the firing reaction, making it easier to form a non-contact surface where adjacent blocks do not contact each other. It can be done. Further, it is disclosed that stress can be prevented from being concentrated on the corner of the block by providing such a non-contact surface (for example, Patent Document 1: Paragraph [0048]).
JP 2006-315368 A

  However, if a non-contact surface as described above is formed on each ceramic block, the contact surface between adjacent magnetic blocks is reduced by that amount, so the continuity of the ceramic layer is lost and the characteristics of the ceramic layer ( For example, there is a drawback that magnetic characteristics, dielectric characteristics, etc. are impaired.

  Therefore, in the case where importance is placed on not concentrating stress on the corners of each ceramic block, even if the technique described in Patent Document 1 is effective, the technique described in Patent Document 1 uses the characteristics of the ceramic layer. It has been difficult to improve sufficiently.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to further improve the characteristics of the ceramic layer in a ceramic sheet including a ceramic layer in which a plurality of ceramic pieces are arranged in a planar shape. It is to provide a technology that can.

Hereinafter, the configuration employed in the present invention will be described.
The ceramic sheet of the present invention is
A ceramic sheet having a structure having a plurality of stacked layers, wherein at least one of the plurality of layers is a ceramic layer formed of a ceramic material, and the ceramic layer includes a plurality of ceramic pieces. Are arranged in a plane, and the plurality of ceramic pieces are sandwiched between other layers and enclosed inside the layers of the other layers, so that they are not exposed to the end face of the ceramic sheet, and , said one of the other layers by the adhesive layer is an adhesive layer composed of a double-sided adhesive tape is adhered to the ceramic layer, which is configured to be able to maintain a structure that is arranged on the planar, wherein the plurality of ceramic pieces, a plurality of recesses or holes is a thin plate-shaped ceramic formed like a dashed line, seen write scissors to the other layers, and, adhered to the adhesive layer Et al., Wherein the plurality of recesses or be one that is formed by dividing along the broken line formed of the hole, broken portion fine debris generated when divided by the ceramic layer is captured and held by the adhesive layer The broken line has a structure in which the relationship between the total length A of the broken line and the length B of the interval portion included in the broken line is 0.2 ≦ (B / A) ≦ 0.7. It is formed so that the form which satisfy | fills may be made.

  In the ceramic sheet of the present invention, the plurality of ceramic pieces are formed by sandwiching a thin plate-like ceramic in which a plurality of recesses or holes are formed in a broken line shape between other layers or affixing to another layer, and then along the broken lines. It was formed by splitting.

  Therefore, the contact area between adjacent ceramic pieces is smaller if the thickness of the thin plate-like ceramic and the depth of the groove are the same as compared to the case where the thin plate-like ceramic formed with continuous grooves is divided along the groove. growing. Therefore, the continuity of the ceramic layer is improved, and the characteristics of the ceramic layer (for example, magnetic characteristics, dielectric characteristics, etc.) are improved.

In addition, when forming a continuous groove in a thin plate-like ceramic, the depth of the groove cannot be made to penetrate the thin plate-like ceramic. However, as in the present invention, a plurality of recesses or holes are formed in a broken line shape. In this case, not only the concave portion that does not penetrate the thin plate ceramic but also the hole portion that penetrates the thin plate ceramic can be formed. Therefore, it is possible to arbitrarily select whether the plurality of concave portions are formed in a broken line shape or the plurality of hole portions are formed in a broken line shape in accordance with the form and use of the final product.
Furthermore, in the ceramic sheet of the present invention, the ceramic layer is sandwiched between the other layers and enclosed within the interlayer of the other layers, so that it is not exposed to the end face of the ceramic sheet. The ceramic layer can be protected more reliably.
In addition, since an adhesive layer made of double-sided adhesive tape is attached to the ceramic layer, even if fine debris is generated when the ceramic layer is broken, such fine debris is captured and held by the adhesive layer. And stays near the break. Therefore, the ceramic sheet performance is stabilized and the performance can be easily maintained as compared with the case where fine fragments fall off from the vicinity of the fractured portion or move to a biased position.

The ceramic sheet of the present invention is also equivalent to the technique described in Patent Document 1 in that the following actions and effects can be obtained.
That is, first, at the stage where the thin plate ceramic is sandwiched between other layers or pasted on another layer, it is not necessary to arrange the ceramic pieces individually and align them as designed. The work can be carried out very easily.

  In addition, since the plurality of ceramic pieces are sandwiched between other layers or attached to other layers and held in a state where they are not displaced relative to each other, they are accurately arranged at the expected positions. Thus, the ceramic pieces do not fall off or scatter.

  Adjacent ceramic pieces are in contact with each other at a fracture surface that was originally continuous. Therefore, even when microscopic irregularities are formed on the fracture surface when the thin ceramic plate is broken along the broken line, the adjacent ceramic pieces are closely aligned with each other. It becomes a form that matches.

  Therefore, there is almost no void between adjacent ceramic pieces, or even if it exists, it becomes a very narrow void, and there is no excessive void between adjacent ceramic pieces, so the ceramic layer has good characteristics ( Magnetic properties, dielectric properties, etc.). Therefore, it can be used in the same manner as a general ceramic sintered body.

  Furthermore, after the lamellar ceramic is broken along the broken line, the ceramic layer can be bent together with the other layers. Therefore, if the other layers are flexible layers, the ceramic sheet can be bent or bent unlike a general thin plate ceramic sintered body, and the ceramic sheet can be curved or uneven. It can be arranged so that it follows.

  Therefore, compared to a highly rigid ceramic sintered body, the degree of freedom when arranging is high, and if it is a ceramic sheet of the present invention, of course, where the highly rigid ceramic sintered body can be disposed, It becomes possible to arrange the ceramic sintered body having high rigidity even at a place where it is difficult to arrange the ceramic sintered body.

  In addition, in general, many thin plate ceramics are prone to cracking or chipping. However, in the present invention, since the thin plate ceramic is divided in advance along the broken line, the ceramic pieces are further cracked or chipped. It becomes difficult. Therefore, it is superior in impact resistance and durability as compared to a simple sheet ceramic.

  By the way, in the ceramic sheet of the present invention, the method of forming the plurality of recesses or holes in a broken line shape is arbitrary, but the plurality of recesses or holes are formed by laser processing after firing the thin plate ceramic. It is preferable that

  By forming a plurality of recesses or holes by such a method, it is possible to prevent a situation in which the green sheet contracts and the recesses or the holes expand when the thin plate ceramic is fired. Therefore, it is possible to make the concave portion or the hole portion the minimum necessary size, and thereby it is possible to suppress a decrease in the contact area between adjacent ceramic pieces.

Examples of the laser processing method include a method of forming a plurality of recesses or holes in a thin plate ceramic with a laser processing apparatus using a CO ₂ laser, a YAG laser, or the like. With such a processing method, it is possible to relatively easily form a plurality of recesses or holes in a broken line shape.

  From the viewpoint of performance improvement, as described above, it is preferable to form the concave portion or the hole portion by laser processing. However, if the required performance can be satisfied, whether or not laser processing is performed in the present invention is determined. Is optional.

  As a method other than the laser processing, for example, a method of forming a plurality of concave portions or holes in a broken line shape in advance at the time of a green sheet before firing of ferrite and firing it can be considered. In this case, the green sheet can be processed using a blade capable of forming a recess or hole in a broken line shape, or the recess or hole is broken in a mold for forming a thin plate ceramic. Protrusions for forming may be provided.

Further, in the ceramic sheet of the present invention, when the concave portion or the hole portion as described above is formed in a broken line shape, the broken line has a relationship between the total length A of the broken line and the length B of the interval portion included in the broken line, 0.2 ≦ (B / a) Ru formed to the form that satisfies the relationship of ≦ 0.7.

  Here, in the above (B / A), a state of 0 corresponds to “a case where adjacent recesses or holes continuously form a solid line-like groove”, and a state of 1 indicates “a recess or hole. The index is equivalent to “when the part is completely lost”.

  The closer (B / A) is to 0, the higher the abundance ratio of “recesses or holes” present on the broken line, so that it tends to break the thin plate ceramic. However, if the abundance ratio of “recesses or holes” becomes excessively high, it approaches that of a continuous groove formed as in the prior art, so the contact area between adjacent ceramic pieces is reduced and the characteristics as a ceramic deteriorate. Tend.

  Therefore, the present inventors experimentally confirmed the lower limit value that can sufficiently improve the characteristics as a ceramic, and as a result, it is preferable that the (B / A) is 0.2 or more. I came to a conclusion.

  On the other hand, the closer the (B / A) is to 1, the lower the abundance ratio of “recesses or holes” on the broken line, so if it can be cleanly broken along the broken line, contact between adjacent ceramic pieces The area may be large.

  However, as a result of experimental confirmation by the present inventors, when the above (B / A) is excessively increased, the thin plate ceramic tends to be difficult to break. In some cases, it was broken at a position different from the broken line. For this reason, it is not always preferable to make the (B / A) excessively large, and it has been concluded that it is preferable to set the (B / A) to 0.7 or less within the experimentally confirmed range. It was.

  In the present invention, the ceramic material is a magnetic material that is Ni—Zn ferrite, Mn—Zn ferrite, Mg—Zn ferrite, Ba ferrite, Ferroc planar ferrite, alumina, silicon carbide, or barium titanate. A material or a dielectric material is preferred.

  When the ceramic material is Ni-Zn ferrite, Mn-Zn ferrite, Mg-Zn ferrite, Ba ferrite, or Ferroc sprayer ferrite, the ceramic sheet of the present invention has excellent characteristics as a magnetic material. It will be demonstrated.

Further, when alumina, silicon carbide, or barium titanate is used as the ceramic material, the ceramic sheet of the present invention exhibits excellent characteristics as a dielectric.
Also, various specific methods for dividing the thin plate ceramic along the plurality of recesses or holes can be considered. For example, a plurality of ceramic pieces are formed by laminating a plurality of layers. The laminate is preferably formed by applying pressure to the laminate with a roller and dividing the thin plate-shaped ceramic along a plurality of recesses or holes.
In the ceramic sheet of the present invention, the ceramic layer preferably has a thickness of 0.01 mm to 1 mm, and more preferably a thickness of 0.01 mm to 0.3 mm. If the ceramic layer is made thin to this extent, the ceramic sheet can be easily bent or bent.

  Moreover, in the ceramic sheet of the present invention, the groove formed in the thin plate-like ceramic preferably has a width of 0.001 mm to 1 mm, and more preferably 0.01 mm to 0.5 mm. .

  In the ceramic sheet of the present invention, the ceramic piece is preferably shaped and dimensioned within a range of 0.01 mm square to 5 mm square, and desirably within a range of 0.5 mm square to 3 mm square. It is good to be the shape and dimension contained.

If comprised in this way, since a ceramic piece will become small enough, an extra crack and a chip | tip can be prevented and the softness | flexibility of a ceramic sheet will also become sufficient.
Furthermore, in the ceramic sheet of the present invention, the other layers other than the ceramic layer are basically layers for holding the ceramic layer, as long as they are made of a material that does not impair the function of the ceramic layer. The material is not limited.

  More specifically, various plastic materials and elastomer materials that can be formed into a sheet shape can be arbitrarily used. For example, the other layer may be composed of a PET (polyethylene terephthalate) sheet, a PEN (polyethylene naphthalate) sheet, a PPS (polyphenylene sulfide) sheet, a PVC (polyvinyl chloride) sheet, a urethane sheet, a polyimide sheet, or the like. .

In these cases, the thickness of the other layer is preferably about 0.005 mm to 0.5 mm, and more preferably about 0.01 mm to 0.3 mm.
In addition, the other layer may have some function in addition to the function of holding the ceramic layer.

Specifically, for example, in the ceramic sheet of the present invention, the other layer may be an adhesive layer in which at least one layer is formed of an adhesive material.
When comprised in this way, if the outermost layer is an adhesive layer, the ceramic sheet can be fixed to an adherend other than the ceramic sheet of the present invention using the adhesive layer.

Further, the inner layer may be an adhesive layer, and in this case, the layers on both sides at the position sandwiching the adhesive layer are fixed via the adhesive layer .

In the ceramic sheet of the present invention, the other layer may be a conductive layer in which at least one layer is formed of a conductive material.
If comprised in this way, since an electroconductive layer functions as an electromagnetic wave shield layer, the effect which suppresses radiation noise can further be improved according to a synergistic effect with a ceramic layer.

In the ceramic sheet of the present invention, the other layer may be a heat conductive layer in which at least one layer is formed of a heat conductive material.
If comprised in this way, heat can be released from the heat-source side to the thermal radiation part side using a heat conductive layer.

  In addition, although the structure provided with a certain function other than the function in which another layer hold | maintains a ceramic layer was demonstrated above, the ceramic sheet | seat of this invention is the other which exists in any one or both of a ceramic layer and a ceramic layer, or both In addition to the layers, some layers may be stacked. Therefore, for example, a three-layer structure in which a ceramic layer is sandwiched between other layers, or a two-layer structure in which a ceramic layer is attached to another layer is used as a basic structure. A plurality of conductive layers, heat conductive layers, and the like may be stacked.

Next, embodiments of the present invention and related techniques of the present invention will be described with specific examples.
[First Embodiment]
Fig.1 (a) is a perspective view of the ceramic sheet illustrated as one Embodiment of the related technology of this invention, The same figure (b) is an exploded view which shows the structure of the ceramic sheet.

  This ceramic sheet 1 has a three-layer structure in which a flexible resin sheet layer 3, a ceramic layer 5 formed of a ceramic material, and a flexible resin sheet layer 3 are laminated in this order. .

Among these, the resin sheet layer 3 is configured by a PET sheet having a thickness of 0.1 mm in the present embodiment.
In the case of this embodiment, the ceramic layer 5 is composed of a sintered body of soft magnetic ferrite (for example, Ni—Zn ferrite), and has a structure in which a plurality of ceramic pieces 5 a are arranged vertically and horizontally. ing.

  More specifically, the plurality of ceramic pieces 5a are formed by forming a recess 5c (see FIG. 2B) in advance on one surface of a thin plate-like ceramic 5b (see FIG. 2A). It is formed by sandwiching the ceramic 5b between the resin sheet layers 3 (see FIG. 2 (c)) and then splitting along the recess 5c (see FIG. 2 (d)).

  In the case of the present embodiment, a thin plate-like ferrite sintered body having a thickness of 0.2 mm is used as the thin plate-like ceramic 5b, and one surface of the thin plate-like ceramic 5b is 0.1 mm wide by a laser processing apparatus. A recess 5c having a depth of 0.1 mm (50% of the thickness of the thin plate ceramic 5b) was formed.

  Then, a laminated body having a three-layer structure was obtained by laminating both surfaces of the thin plate-like ceramic 5b in which the concave portions 5c were formed with a PET sheet to be the resin sheet layer 3. Note that the interface between the resin sheet layer 3 and the thin plate-like ceramic 5b is in a heat-sealed state.

Pressure was applied to such a laminate with a roller (not shown) to divide the thin plate-like ceramic 5b along the recess 5c, thereby forming a 1 mm square ceramic piece 5a.
Since the ceramic sheet 1 having the structure as described above includes the ceramic layer 5 made of soft magnetic ferrite, it can be used as an electromagnetic wave shielding body or an electromagnetic wave absorbing body like a general ferrite sintered body. It can be used for measures against radiation noise from parts and various cables.

  Further, unlike a general ferrite sintered body, the ceramic sheet 1 can be arranged even in a very narrow space that could not be arranged with a conventional ferrite sintered body because it can have a very thin structure. It becomes like this.

  Further, since the ceramic sheet 1 has a structure in which the ceramic layer 5 in a state of being split along the recess 5c can be bent together with the resin sheet layer 3, the entire ceramic sheet 1 has flexibility. Become. Therefore, the ceramic sheet 1 can be bent or bent, and the ceramic sheet 1 can be arranged along a curved surface or unevenness.

  Therefore, the degree of freedom in arranging the ceramic sheet 1 is higher than that of a ferrite sintered body with high rigidity, and from this point, it is difficult to arrange with the conventional ferrite sintered body. It becomes possible to arrange the ceramic sheet 1 on the surface.

  Further, in manufacturing the ceramic sheet 1, in the stage of sandwiching the thin plate-like ceramic 5 b between the resin sheet layers 3, it is necessary to perform an operation of arranging a plurality of ceramic pieces 5 a individually and aligning them as designed. Therefore, the pinching operation can be performed very easily.

  Further, since the plurality of ceramic pieces 5a are sandwiched between the resin sheet layers 3 and are held without being relatively displaced from each other, the same as before the thin plate-like ceramic 5b is cracked along the recess 5c. The ceramic pieces 5a are accurately arranged at the positions, and the ceramic pieces 5a are not dropped or scattered.

Therefore, the ceramic sheet 1 can be easily manufactured despite having the ceramic layer 5 in which a plurality of ceramic pieces 5a are arranged in a planar shape.
Further, in this ceramic sheet 1, as shown in FIG. 2D, the plurality of ceramic small pieces 5 a are in contact with each other at the fracture surface 5 d that was originally continuous. . Therefore, even if there are microscopic irregularities on the fracture surface 5d, the adjacent ceramic pieces 5a are in a form in which the irregularities exactly match each other.

  Therefore, there is almost no gap between adjacent ceramic pieces 5a, or even if it exists, the gap is very narrow, and no excessive gaps are generated between adjacent ceramic pieces 5a. The magnetic characteristics will be demonstrated.

  Incidentally, FIG. 2B shows an example in which the concave portion 5c is formed on one surface of the thin plate-like ceramic 5b. This is because both the front and back sides of the thin plate-like ceramic 5b are formed as shown in FIG. You may make it form the recessed part 5c in the surface. When the concave portions 5c are formed on both the front and back surfaces of the thin plate-like ceramic 5b, the front and rear concave portions 5c may be formed at the same position as shown in FIG. 2 (e). As shown in FIG. 5, the front and back recesses 5c may be formed at different positions (for example, alternately).

  By the way, as shown in FIG. 3A, the recess 5c has a plurality of recesses 5c formed in a broken line shape. More specifically, the broken lines made up of the plurality of recesses 5c are formed at positions where a plurality of lines extend vertically and horizontally to form a lattice pattern.

  The plurality of ceramic pieces 5a shown in FIG. 1 (b) are formed by dividing the ceramic layer 5 along the broken lines formed by the plurality of recesses 5c. The broken line formed of the plurality of recesses 5c may be any pattern as long as the pattern can break the ceramic layer 5 to form the plurality of ceramic pieces 5a.

  For example, in the case of the ceramic layer 5 described above, a plurality of broken line-shaped concave portions extending vertically and horizontally as shown in FIG. 3A form a lattice pattern, but the ceramic shown in FIG. Like the layer 11, in addition to a plurality of broken line-shaped depressions extending vertically and horizontally, a plurality of broken line-shaped depressions extending obliquely from the upper right to the lower left in the figure may be formed.

  3C, in addition to a plurality of broken line-shaped recesses extending vertically and horizontally, a plurality of broken line-shaped recesses extending obliquely from the upper right to the lower left in the figure, and from the upper left to the lower right in the figure. A plurality of broken line-like recesses extending obliquely may be formed.

  Alternatively, as in the ceramic layer 15 shown in FIG. 3 (d), instead of the plurality of broken line-shaped depressions extending vertically and horizontally, a plurality of broken line-shaped depressions extending obliquely from the upper right to the lower left in the figure, and from the upper left to the lower right in the figure. A plurality of broken line-shaped recesses extending obliquely to the surface may be formed.

  The ceramic sheet that is finally obtained changes in the direction in which it can be easily bent due to the difference in the pattern formed by these broken line-shaped recesses. Therefore, it is preferable to select the groove pattern in consideration of the form in use.

  3A to 3D, the pattern of the concave portions in the broken line shape is formed in parallel with one extending in parallel, but like the ceramic layer 17 shown in FIG. A pattern in which the interval between the broken line-like concave portions is partially changed may be adopted. By adopting such a broken line-shaped concave pattern, the ease of bending of the finally obtained ceramic sheet can be partially changed.

  Furthermore, what is illustrated in FIG. 3 is a pattern in which a broken line-like concave part that draws a straight line extends in parallel, but the broken line-like concave part is a broken line-like concave part that draws a curve or a broken line-like concave part that draws a broken line. It may be.

  In addition, in the above description, it has been described that the thin plate-like ceramic is provided with a broken-line-shaped concave portion. Instead of the bottomed concave portion, a hole that penetrates the thin plate-like ceramic from the front side to the back side is provided. May be. Even when such holes are provided in the thin plate-like ceramic, a plurality of holes are provided in a broken line shape as in the case of the recesses.

  Here, in the case of providing a continuous solid line-shaped groove, if a groove having a depth penetrating the thin plate ceramic is provided, the thin plate ceramic is divided into a plurality of ceramic pieces. It is not possible.

  In this regard, if a plurality of holes are provided in a broken line shape, it is not divided into a plurality of ceramic pieces unless the thin plate ceramic is broken. Can do. Note that the plurality of holes and the plurality of recesses may form broken lines in such a way that both are mixed.

[Second Embodiment]
Hereinafter, another embodiment different from the first embodiment will be described.
As shown in FIG. 4A, the ceramic sheet 1 described in the first embodiment has a structure in which the resin sheet layer 3, the ceramic layer 5, and the resin sheet layer 3 are simply laminated. The ceramic sheet 21 shown in b) employs a structure in which the ceramic layer 5 is sandwiched between the resin sheet layers 3 that are one size larger than the ceramic layer 5 and the resin sheet layers 3 on both sides are directly heat-sealed at the peripheral edge thereof. is doing.

The material of the resin sheet layer 3 is the same as that in the first embodiment. The material, structure, processing method, and the like of the ceramic layer 5 are the same as in the first embodiment.
Even the ceramic sheet 21 adopting such a structure exhibits the same operations and effects as those of the first embodiment. Moreover, in the case of this ceramic sheet 21, the ceramic layer 5 is enclosed in the resin sheet layer 3, and the ceramic layer 5 is not exposed on the end face of the ceramic sheet 21, so that the ceramic layer 5 can be more reliably protected. Will be able to.

[Third Embodiment]
The ceramic sheet 23 shown in FIG. 4C has a structure in which the resin sheet layer 3, the ceramic layer 5, the resin sheet layer 3, and the adhesive layer 25 are laminated.

  In the case of this embodiment, the adhesive layer 25 is formed of an acrylic adhesive, but as the adhesive, any adhesive that is employed in various adhesive tapes and adhesive sheets can be arbitrarily employed. .

The material and the like of the resin sheet layer 3 are the same as those in the first embodiment. The material, structure, processing method, and the like of the ceramic layer 5 are the same as those in the first embodiment.
Even the ceramic sheet 23 adopting such a structure exhibits the same operations and effects as those of the first embodiment and the like. Moreover, in the case of the ceramic sheet 23, the release paper 27 can be peeled off and the ceramic sheet 23 can be attached to an arbitrary location.

[Fourth Embodiment]
The ceramic sheet 31 shown in FIG. 4D has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated.

The material of the resin sheet layer 3 and the adhesive layer 25 is the same as that of the first embodiment. The material, structure, processing method, and the like of the ceramic layer 5 are the same as those in the first embodiment.
Even the ceramic sheet 31 adopting such a structure exhibits the same operations and effects as those of the first embodiment and the like. Moreover, this ceramic sheet 23 can also peel off the release paper 27 and affix it on arbitrary places like the said 3rd Embodiment.

  In addition, since the ceramic sheet 31 has only one resin sheet layer 3 compared to the ceramic sheet 23, there is a possibility that the mechanical strength is somewhat reduced by that amount. If the mechanical strength of the entire ceramic sheet 31 is ensured by the above, it can be used without any problem.

  In addition, the ceramic sheet 31 has a lower bending rigidity than the ceramic sheet 23 because the resin sheet layer 3 for one layer is no longer present, so that the ceramic sheet 31 bends or bends more flexibly than the ceramic sheet 23. Can do. Therefore, for example, when pasting on a curved surface, it becomes more convenient than the ceramic sheet 23.

  Furthermore, in the place where the ceramic layer 5 and the adhesive layer 25 are in direct contact, even when fine debris is generated when the ceramic layer 5 is cracked, such fine debris is captured and held by the adhesive layer 25, It becomes easy to stay in the vicinity of the broken portion of the ceramic layer 5. Therefore, the performance of the ceramic sheet 31 is stabilized and the performance of the ceramic sheet 31 can be easily maintained as compared with the case where the fine fragments fall off from the vicinity of the broken portion or move to a biased position.

[Fifth Embodiment]
The ceramic sheet group 33 shown in FIGS. 5A and 5B has a structure in which a single release paper 27 is provided for a plurality of ceramic sheets 33a. That is, in the fourth embodiment, the single release sheet 27 is provided for the single ceramic sheet 31, but the fifth embodiment is different from the fourth embodiment in this respect. It has become.

  Each ceramic sheet 33a has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated, and this point has a structure equivalent to the ceramic sheet 31 of the fourth embodiment. Yes. The material and the like of the resin sheet layer 3 and the adhesive layer 25 are the same as in the first embodiment, and the material, structure, processing method, and the like of the ceramic layer 5 are also the same as in the first embodiment.

  As shown in FIG. 5C, each ceramic sheet 33a has a size suitable for being attached to an electronic component 37 that is surface-mounted on the printed wiring board 35. The ceramic sheet 33a is attached to the electronic component 37. By sticking it on, it can be used for measures against radiation noise from the electronic component 37.

[Sixth Embodiment]
The ceramic sheet 41 shown in FIG. 6A and FIG. 6B can be interposed between the electronic component and the printed wiring board. That is, in the said 5th Embodiment, although the thing of the type affixed on an electronic component was illustrated, 6th Embodiment differs from 5th Embodiment by this point.

  The ceramic sheet 41 has a structure in which a plurality of holes 43 are formed, and a solder joint provided in an electronic component can be soldered to a conductor pattern on a printed wiring board through the holes 43. Yes.

  The ceramic sheet 41 has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated, and this point has a structure equivalent to the ceramic sheet 33a of the fifth embodiment. . The material and the like of the resin sheet layer 3 and the adhesive layer 25 are the same as in the first embodiment, and the material, structure, processing method, and the like of the ceramic layer 5 are also the same as in the first embodiment.

[Seventh Embodiment]
The ceramic sheet 45 shown in FIG. 7A has the structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated, and the ceramic sheet 31 described above (see FIG. 4D). The basic structure is the same as that described above, but in addition to these, a band 47 and an adhesive portion 48 are further provided.

  As shown in FIG. 7B, the ceramic sheet 45 configured as described above is obtained by winding the belt-like body 47 around the flat cable 51 (or FPC, etc .; the same shall apply hereinafter) to attach the adhesive portion 48 to the outer periphery of the belt-like body 47. By sticking to the side, it can be attached to the flat cable 51 and can be used for countermeasures against radiation noise from the flat cable 51.

[Eighth Embodiment]
The ceramic sheet 53 shown in FIG. 8A has been described above in that it has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated, and includes a strip 47 and an adhesive portion 48. Although the structure is similar to the ceramic sheet 45 (see FIG. 7A), the ceramic sheet 45 includes one set of the laminate of the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25. On the other hand, the ceramic sheet 53 is characterized in that it includes two sets of similar laminates.

  As shown in FIG. 8 (b), the ceramic sheet 53 configured as described above is obtained by winding the belt-like body 47 around the flat cable 51 and sticking the adhesive portion 48 to the outer peripheral side of the belt-like body 47. 51, which is similar to the ceramic sheet 45. However, since two sets of laminates of the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are provided, the flat sheet 51 can be sandwiched from both sides by these two sets of laminates. Is different.

  With such a ceramic sheet 53, the effect of radiating noise from the flat cable 51 to the flat cable 51 can be improved more than the ceramic sheet 45 described above.

[Ninth Embodiment]
The ceramic sheet 55 shown in FIG. 9A has been described above in that it has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated, and includes a strip 47 and an adhesive portion 48. Although the structure is similar to the ceramic sheet 45 (see FIG. 7A) and the ceramic sheet 53 (see FIG. 8A), the laminate of the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 is formed. It is characterized by having 8 sets.

  As shown in FIG. 9B, the ceramic sheet 55 configured in this way can be attached to the outer periphery of the cable 57 in a form having an octagonal cross section. Can be used.

[Tenth embodiment]
The ceramic sheet 55 shown in FIG. 9B was attached to the outer periphery of the cable 57 in such a form that the cross section is an octagon, but the laminate of the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25. When it can be sufficiently curved, the laminate of the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 is made a single one like the ceramic sheet 61 shown in FIG. As shown to (b), you may make it attach to the outer periphery of the cable 63. FIG.

  Since the ceramic layer 5 bends between a plurality of ceramic pieces constituting the ceramic layer 5, the smaller the ceramic piece size (that is, the greater the number of ceramic pieces per unit area), the smoother the curve. It will be something that can be made.

[Eleventh embodiment]
The ceramic sheet 65 shown in FIG. 11A includes the resin sheet layer 3 and the ceramic layer 5, and the embodiments described above (for example, the ceramic sheet 31 (see FIG. 4D) and the like). Although it is the same structure, it differs from each embodiment demonstrated previously by the point provided with the conductive layer 67 formed with the electroconductive material.

  As a conductive material for forming the conductive layer 67, for example, a material obtained by dispersing a conductive filler such as metal powder, metal plating powder, or carbon powder in a matrix resin can be used. Alternatively, the conductive layer 67 may be formed by applying a metal coating to the surface of the resin sheet by a method such as metal vapor deposition, sputtering, or ion plating. Alternatively, the conductive layer 67 may be composed of a metal foil such as aluminum foil or copper foil, or the conductive layer 67 may be composed of a metal-plated woven fabric or non-woven fabric.

  In the case of the ceramic sheet 65 having such a structure, as shown in FIG. 11A, the conductive layer 67 functions as an electromagnetic wave shielding layer. Therefore, it can be used for countermeasures against radiation noise from the conductor pattern 73.

  FIG. 11B and FIG. 11C are diagrams showing an example in which the ceramic sheet 65 is applied to the flat cable 51. Thus, even when the ceramic sheet 65 provided with the conductive layer 67 is attached to the flat cable 51, the conductive layer 67 functions as an electromagnetic wave shielding layer, so that radiation noise is effectively suppressed by a synergistic effect with the ceramic layer 5. It can be used for countermeasures against radiation noise from the flat cable 51.

[Twelfth embodiment]
The ceramic sheet 75 shown in FIG. 12 (a) has the same structure as that of the above-described embodiments of the ceramic layer 5, but includes a heat conductive layer 77 formed of a heat conductive material. This is different from the above-described embodiments.

As a heat conductive material for forming the heat conductive layer 77, for example, a material obtained by dispersing a heat conductive filler such as alumina in a matrix resin is used.
With the ceramic sheet 75 having such a structure, as shown in FIG. 12A, the ceramic sheet 75 is a heat source by being sandwiched between the electronic component 81 surface-mounted on the printed wiring board 79 and the radiation fin 83. Heat can be transmitted from the electronic component 81 to the heat radiating fins 83 which are heat radiating portions, and heat dissipation from the electronic component 81 can be promoted. At the same time, it can be used for countermeasures against radiation noise from the electronic component 81.

  Alternatively, the ceramic sheet 75 is sandwiched between an electronic component 81 surface-mounted on a printed wiring board 79 and a shield case 85, as shown in FIG. Heat can be transmitted to the shield case 85 that also functions as a heat radiating section, and heat dissipation from the electronic component 81 can be promoted.

  Thus, depending on the application, the heat conductive layer 77 may be provided, and even in this case, the ceramic having a structure in which a plurality of ceramic pieces 5a are arranged in a planar manner by the procedure as described above. Layer 5 can be formed.

[Thirteenth embodiment]
The basic structure of the ceramic sheet 91 shown in FIG. 13 is the same as that of the first embodiment, but the shape of the outer peripheral portion 93 is cut into an arbitrary shape, and some holes 95 are formed inside. The structure is formed.

  The shape of the outer peripheral portion 93 and the hole 95 is designed in accordance with the arrangement of the electronic components included in the electronic device to be arranged. For example, the convex portion can be escaped, used as a screw hole, It is for use as a mouth, or as a light transmission part or a monitoring window.

  In FIG. 13, the ceramic layer inside the ceramic sheet 91 is divided into a plurality of ceramic pieces at the position indicated by the dotted line in the figure, but the ceramic layer is interposed between the resin sheet layers as in the embodiments described above. Since the structure is sandwiched, even if the shape of the outer peripheral portion 93 is processed into an arbitrary shape, the ceramic pieces on the outer peripheral portion 93 will not fall off. For the same reason, even if the holes 95 having various shapes are provided, the ceramic pieces on the periphery of the holes 95 do not fall off.

[Fourteenth embodiment]
The ceramic sheet 101 shown in FIGS. 14A and 14B is affixed to the RFID antenna substrate 103, and has a structure in which the resin sheet layer 3, the ceramic layer 5, and the adhesive layer 25 are laminated. Therefore, the structure is the same as that of the fourth embodiment.

  If such a ceramic sheet 101 is affixed to the RFID antenna substrate 103, the influence of metal around the RFID antenna substrate 103 can be avoided when performing communication by RFID, thereby expanding the communication distance. can do.

  A ceramic sheet 111 shown in FIG. 14C is a modification in which a conductive layer 67 is employed instead of the resin sheet layer 3 provided in the ceramic sheet 101. Similarly to the ceramic sheet 101, the ceramic sheet 111 is used by being attached to the RFID antenna substrate 103.

  Even with such a ceramic sheet 111, it is possible to avoid the influence of the metal around the RFID antenna substrate 103 and expand the communication distance when performing communication by RFID like the ceramic sheet 101. The electromagnetic wave shielding effect can be improved by the conductive layer 67.

[Fifteenth embodiment]
The ceramic sheet 121 shown in FIG. 15A has a structure in which the ceramic layer 5 and the double-sided adhesive tape 123 are laminated.

  That is, in the embodiment described above, it has been described that an adhesive layer formed of an adhesive is provided. However, when laminating a resin sheet and an adhesive, both sides are provided in advance without laminating each separately. What was comprised as the adhesive tape 123 may be laminated | stacked.

  In the above-described embodiment, the configuration in which the ceramic layer 5 is sandwiched from the front and back by other layers has been described. In the fifteenth embodiment, the ceramic layer 5 is attached to the double-sided adhesive tape 123. A ceramic sheet having a two-layer structure is formed.

That is, in configuring a ceramic sheet corresponding to the related art of the present invention, the ceramic layer 5 may be sandwiched between other layers to form a three-layer structure, or a two-layer structure as in the fifteenth embodiment.

[Sixteenth Embodiment]
The ceramic sheet 131 shown in FIG. 15B has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the double-sided adhesive tape 123 are laminated.

  In the case of this ceramic sheet 131, the both side layers sandwiching the ceramic layer 5 are the double-sided adhesive tape 123 (that is, the adhesive layer), and both sides of the ceramic layer 5 are covered with the adhesive material. .

  Therefore, even when fine fragments are generated when the ceramic layer 5 is cracked, such fine fragments are captured and held by the double-sided adhesive tape 123 on both sides of the ceramic layer 5 in the stacking direction, and in the vicinity of the broken portion. Stay.

  Therefore, the performance of the ceramic sheet 131 is stabilized and the performance can be easily maintained as compared with the case where the fine fragments are dropped from the vicinity of the broken portion or moved to a biased position. In addition, the performance of the ceramic sheet 131 is more stable than that in which the double-sided adhesive tape 123 is laminated only on one side of the ceramic layer 5, and the performance can be easily maintained.

[Seventeenth embodiment]
The ceramic sheet 141 shown in FIG. 15C has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the resin sheet layer 3 are laminated.

  Similarly to the above-described sixteenth embodiment, the ceramic sheet 141 also has a double-sided adhesive tape 123 on both sides of the ceramic layer 5, so that the performance of the ceramic sheet 141 is stable and easily maintained. It will be possible.

[Eighteenth embodiment]
The ceramic sheet 151 shown in FIG. 15D has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the conductive layer 153, the double-sided adhesive tape 123, the ceramic layer 5, and the double-sided adhesive tape 123 are laminated.

  As the conductive layer 153, for example, a Cu foil, an Al foil, a graphite sheet, or the like can be used. By providing such a conductive layer 153, the ceramic sheet 151 can be provided with conductivity.

  Also, this ceramic sheet 151 also has a double-sided adhesive tape 123 on both sides of the ceramic layer 5 so that even if fine debris is generated when the ceramic layer 5 is broken, Such fine debris stays in the vicinity of the broken portion, and the performance of the ceramic sheet 151 is stabilized.

[Nineteenth Embodiment]
The ceramic sheet 161 shown in FIG. 15 (e) has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, the double-sided adhesive tape 123, the ceramic layer 5, the double-sided adhesive tape 123, and the resin sheet layer 3 are laminated. Has been.

  In this manner, a structure in which a plurality of ceramic layers 5 (two layers in the case of the present embodiment) are provided may be employed. With such a structure, the effect (for example, electromagnetic wave shielding effect) by providing the ceramic layer 5 can be enhanced.

  Further, the plurality of ceramic layers 5 may be ceramic layers made of different materials, for example, one is a magnetic body that shields relatively low frequency band electromagnetic waves, and the other is relatively high frequency band electromagnetic waves. A structure capable of shielding a wider band of electromagnetic waves may be formed by using a dielectric material for shielding.

  Further, the ceramic sheet 161 also has a double-sided adhesive tape 123 on both sides of the ceramic layer 5 so that even if fine fragments are generated when the ceramic layer 5 is broken, Such fine debris stays in the vicinity of the broken portion, and the performance of the ceramic sheet 161 is stabilized and the performance can be easily maintained.

[20th embodiment]
The ceramic sheet 171 shown in FIG. 16A and FIG. 16B has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the vibration-proof heat conductive layer 173 are laminated.

The vibration-proof heat conductive layer 173 is made of a composite material obtained by blending a heat-conductive filler in an elastomer material having excellent vibration damping properties.
As shown in FIG. 16B, such a ceramic sheet 171 is attached to an electronic component 176 that is surface-mounted on a printed wiring board 175, and the resin sheet layer 3 side is in contact with the casing 177 of the electronic device. Is arranged.

  By adopting such a structure, it is possible to realize countermeasures against radiation noise from the electronic component 37 and heat countermeasures at the same time, and further, to reduce vibration and impact transmitted from the housing 177 to the electronic component 176, the electronic component 176 Can be protected.

  In addition, in the twentieth embodiment, all countermeasures against radiation noise, heat countermeasures, and external vibration countermeasures have been taken, but when only radiation noise countermeasures and heat countermeasures are sufficient (for example, in the case of a stationary device), The vibration-proof heat conductive layer 173 described above may be replaced with a heat conductive layer. Further, in the case where only countermeasures against radiation noise and countermeasures against external vibration are required (for example, in the case of a device having low heat generation), the above-described vibration-proof heat conductive layer 173 may be replaced with a vibration-proof layer.

  In addition, when the vibration-proof heat conductive layer 173 has adhesiveness, the vibration-proof heat conductive layer 173 also functions as an adhesive layer. In this case, the two layers on both sides of the ceramic layer 5 are the vibration-proof heat conductive layer 173 and the double-sided adhesive tape 123 that also function as an adhesive layer. Accordingly, the ceramic layer 5 is sandwiched between the adhesive layers from both sides, and even when fine fragments are generated when the ceramic layer 5 is cracked, such fine fragments remain in the vicinity of the broken portion. Therefore, the performance of the ceramic sheet 171 is stabilized and the performance can be easily maintained.

[Twenty-first embodiment]
The ceramic sheet 181 shown in FIG. 17A and FIG. 17B has a structure in which the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the vibration-proof heat conductive layer 173 are laminated as in the twentieth embodiment. It is what is said.

  However, unlike the twentieth embodiment, a plurality of holes 183 are provided, and the vibration-proof heat conductive layer 173 is exposed to the resin sheet layer 3 through the holes 183. That is, the hole 183 is provided so as to penetrate the resin sheet layer 3, the double-sided adhesive tape 123, and the ceramic layer 5, and a part of the vibration-proof heat conductive layer 173 enters the hole 183. .

  As in the twentieth embodiment, the ceramic sheet 181 is attached to the electronic component 176 that is surface-mounted on the printed wiring board 175 as shown in FIG. 17B, and the resin sheet layer 3 side is an electronic device. It arrange | positions so that the housing | casing 177 may be contacted.

  By adopting such a structure, it is possible to realize countermeasures against radiation noise from the electronic component 37 and heat countermeasures at the same time, and further, to reduce vibration and impact transmitted from the housing 177 to the electronic component 176, the electronic component 176 Can be protected.

  In addition, since a part of the vibration-proof heat conductive layer 173 directly contacts the housing 177 through the hole 183, the heat conduction performance from the electronic component 176 to the housing 177 is improved. It can be higher than that of the form.

[Twenty-second embodiment]
18A and 18B, the ceramic sheet 191 includes the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the vibration-proof heat conductive layer 173, as in the twentieth and twenty-first embodiments. However, the laminated structure is slightly different.

  Specifically, in the present embodiment, a laminate of the resin sheet layer 3, the double-sided pressure-sensitive adhesive tape 123, and the ceramic layer 5 is put in the material constituting the vibration-proof heat conductive layer 173.

  Thereby, the structure of the laminated portion is a structure in which the vibration-proof heat conductive layer 173, the resin sheet layer 3, the double-sided adhesive tape 123, the ceramic layer 5, and the vibration-proof heat conductive layer 173 are stacked. Moreover, the vibration-proof heat conductive layer 173 located at the position where the laminate of the resin sheet layer 3, the double-sided adhesive tape 123, and the ceramic layer 5 is sandwiched is continuous at the periphery.

  As in the twentieth and twenty-first embodiments, such a ceramic sheet 191 is also attached to the electronic component 176 that is surface-mounted on the printed wiring board 175, as shown in FIG. 18B, and the resin sheet layer 3 It arrange | positions so that the side may contact the housing | casing 177 of an electronic device.

  By adopting such a structure, it is possible to realize countermeasures against radiation noise from the electronic component 37 and heat countermeasures at the same time, and further, to reduce vibration and impact transmitted from the housing 177 to the electronic component 176, the electronic component 176 Can be protected.

  In addition, since the vibration-proof heat conductive layer 173 has a structure in direct contact with the housing 177, the heat conduction performance from the electronic component 176 to the housing 177 can be improved more than that of the twentieth embodiment. it can.

  Furthermore, when the vibration-proof heat conductive layer 173 has adhesiveness, the vibration-proof heat conductive layer 173 also functions as an adhesive layer. In this case, both the layers sandwiching the ceramic layer 5 become the vibration-proof heat conductive layer 173 that also functions as the adhesive layer and the double-sided adhesive tape 123, and the end surface of the ceramic layer 5 is also surrounded by the adhesive layer. .

  Therefore, since the ceramic layer 5 is sandwiched between the adhesive layers from both sides, the ceramic layer 5 is completely surrounded by the adhesive material, so that fine debris is generated when the ceramic layer 5 is cracked. Even in such cases, such fine debris tends to stay very close to the break. Therefore, the performance of the ceramic sheet 191 is stabilized and the performance can be easily maintained.

[Twenty-third embodiment]
A cable holder 201 shown in FIG. 19 is obtained by attaching the ceramic sheet 205 of the present invention to the inner periphery of a resin molded body 203. Such a cable holder 201 is used by being fixed to the housing 207 with a screw 209 and can be used for measures against radiation noise from the cable.

[Twenty-fourth embodiment]
A ceramic sheet 211 illustrated in FIG. 20 includes a square hole 213 and a round hole 215, and can be attached to the periphery of the connector 223 and the connector 225 included in the electronic device 221. If such a ceramic sheet 211 is affixed to the electronic device 221, it can be used for measures against radiation noise from the periphery of the connector 223 and the connector 225.

[25th Embodiment]
Next, when forming various ceramic sheets as described above, in forming a plurality of recesses or holes in a broken line shape, what is the interval between the broken lines (that is, the interval between the recesses or the interval between the holes)? It was verified whether it is preferable to set to.

  In the verification, a YAG laser was used to form a concave portion on one surface of the thin plate ferrite with a solid line or broken line lattice pattern having a unit structure as shown in FIGS. 21 (a) to 21 (c).

  The dimensions A shown in FIGS. 21A to 21C were all 3 mm. In addition, for the dimension B of the gap between the broken lines, samples with a ratio (B / A) to the dimension A of 20%, 30%, 50%, and 70% were prepared. Further, for the dimensions B1 and B2, a sample having a ratio ((B1 + B2) / A) to the dimension A of 50% was prepared.

  Each thin plate-like ferrite as described above was further processed (cut) into a ring shape having an outer diameter of 18 mm, an inner diameter of 6 mm, and a thickness of 0.3 mm with a YAG laser. Then, after laminating them with a resin sheet layer (PET), the thin plate-like ferrite was bent along a solid or broken line lattice pattern to make it completely cracked.

  The magnetic permeability μr ′ of the sample as described above was measured with an impedance material analyzer (E4991A manufactured by Agilent Technologies). The measurement results are shown in Tables 1 and 2 and FIG.

図２１（ｄ）は、５ＭＨｚ〜２５ＭＨｚの周波数帯における透磁率周波数特性を示すグラフである。［表１］は、１５ＭＨｚにおける隙間なし／ありでの透磁率特性を比較したものである。

FIG. 21D is a graph showing permeability frequency characteristics in the frequency band of 5 MHz to 25 MHz. [Table 1] compares the magnetic permeability characteristics with and without a gap at 15 MHz.

  As can be seen from these graphs and tables, in the frequency band of 5 MHz to 25 MHz, the permeability μr ′ is greater in the case where the lattice pattern is in a broken line shape than in the case where the lattice pattern is in a solid line over the entire band. Improved.

  Therefore, as in the present invention, when forming a plurality of ceramic pieces by splitting a thin plate-like ceramic, the characteristics of the ceramic sheet can be improved by forming the broken line-shaped recesses as compared with the case of forming the solid-line grooves. Can be considered.

  [Table 2] shows a difference between the case where the gap ratio is 50%, which is relatively long (FIG. 21B), and the case where the gap is relatively short (FIG. 21C). This is a result of verifying whether or not the above occurs.

  From this result, it was found that the performance with the relatively short broken line interval (FIG. 21C) was slightly improved, but it was found that the difference was not as great as when the gap ratio was changed. Therefore, in order to improve the performance, it is considered that it is more important to optimize the gap ratio of the broken line than the magnitude of the absolute value of the distance between the broken lines.

[Twenty-sixth embodiment]
The ceramic sheet 231 shown in FIG. 22 has a structure in which the resin sheet layer 3, the pressure-sensitive adhesive layer 233, the ceramic layer 5, and the double-sided pressure-sensitive adhesive tape 123 are laminated. Such a ceramic sheet 231 has a resin sheet layer 3 having a pressure-sensitive adhesive layer 233 formed in advance on one surface thereof, and is attached to one surface of the ceramic layer 5, and the other ceramic layer 5 has another surface. It can comprise by affixing the double-sided adhesive tape 123 with respect to a surface.

  In the case of this ceramic sheet 231, the layers on both sides of the ceramic layer 5 are the pressure-sensitive adhesive layer 233 and the double-sided adhesive tape 123 (that is, the adhesive layer), and both sides of the ceramic layer 5 are adhesive. It will be covered by the material.

  Therefore, even when fine fragments are generated when the ceramic layer 5 is cracked, such fine fragments are captured and held by the pressure-sensitive adhesive layer 233 or the double-sided adhesive tape 123 on both sides of the ceramic layer 5 in the stacking direction. And stays near the break.

  Therefore, the performance of the ceramic sheet 231 is stabilized and the performance can be easily maintained as compared with the case where the fine fragments are dropped from the vicinity of the broken portion or moved to a biased position. Further, the performance of the ceramic sheet 231 can be further stabilized and the performance can be easily maintained as compared with the case where the pressure-sensitive adhesive layer 233 or the double-sided pressure-sensitive adhesive tape 123 is laminated only on one side of the ceramic layer 5. become.

[Other Embodiments]
As mentioned above, although embodiment of this invention and the related technique of this invention was described, this invention is not limited to said specific embodiment, In addition, it can implement with a various form.

  For example, in each of the above embodiments, an example in which the ceramic layer 5 is made of Ni—Zn-based ferrite has been shown, but the ceramic layer 5 may be formed of other ceramic materials. As a specific example, the ceramic layer 5 may be composed of, for example, Mn—Zn ferrite, Mg—Zn ferrite, Ba ferrite, Ferroc planar ferrite, alumina, silicon carbide, or barium titanate.

  If Mn—Zn based ferrite, Mg—Zn based ferrite, Ba based ferrite, or Ferroc planer based ferrite is used, excellent characteristics as a magnetic material will be exhibited. If alumina, silicon carbide, or barium titanate is used, excellent characteristics as a dielectric will be exhibited.

  Moreover, in the said embodiment, the specific example was illustrated about the shape of the ceramic sheet, the thickness of the ceramic layer 5, the width | variety and depth of the recessed part 5c formed in the thin plate-shaped ceramic 5b, and the size and shape of the ceramic small piece 5a. However, these can be arbitrarily changed as long as the function as the ceramic sheet is not impaired.

  Furthermore, in the said embodiment, when forming the recessed part 5c in the thin plate-shaped ceramic 5b, the process by a laser processing apparatus was illustrated, However, You may form the recessed part 5c with another method. Specifically, the concave portions may be formed by various cutting machines after firing the thin plate-like ceramic 5b, or the concave portions are formed by a mold or some jig at the time of the green sheet before firing the thin plate-like ceramic 5b. May be. However, since it is easier to secure the continuity of ceramic pieces (contact area between adjacent ceramic pieces) by processing finer recesses and holes after firing, laser processing is desirable in that respect.

  In addition, in the said embodiment, although the double-sided adhesive tape 123, the pressure sensitive adhesive layer 233, etc. were illustrated as a specific example of the adhesion layer, you may provide another adhesion layer. Examples of the other pressure-sensitive adhesive layer include a layer formed with a heat-sensitive adhesive.

  In the above embodiment, an example in which the plurality of recesses 5c are formed in a broken line shape to break the ceramic layer 5 has been shown. However, a continuous groove (in a solid line shape) is used as long as the performance of the ceramic sheet is not impaired. There is no problem even if some of the formed grooves) are mixed. However, as already explained, if the abundance ratio of the continuous grooves is excessive, the performance of the ceramic sheet is correspondingly lowered. Therefore, even if there is a situation where it is necessary to provide continuous grooves, such continuous grooves are required. The abundance ratio is preferably as small as possible.

(A) is a perspective view of the ceramic sheet illustrated as 1st Embodiment, (b) is an exploded view which shows the structure of the ceramic sheet. (A)-(d) is explanatory drawing which shows the formation procedure of a ceramic layer, (e), (f) is explanatory drawing which shows the modification about the formation position of a recessed part. Explanatory drawing which shows the lattice pattern of the recessed part thru | or a hole formed in a broken line shape. (A) is sectional drawing of the ceramic sheet illustrated as 1st Embodiment, (b) is sectional drawing of the ceramic sheet illustrated as 2nd Embodiment, (c) is sectional drawing of the ceramic sheet illustrated as 3rd Embodiment. (D) is sectional drawing of the ceramic sheet illustrated as 4th Embodiment. (A) is sectional drawing of the ceramic sheet group illustrated as 5th Embodiment, (b) is a top view of the ceramic sheet group, (c) is explanatory drawing which shows the use condition of the ceramic sheet illustrated as 5th Embodiment . (A) is explanatory drawing which shows the use condition of the ceramic sheet illustrated as 6th Embodiment, (b) is a top view of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 7th Embodiment, (b) is a perspective view which shows the use condition of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 8th Embodiment, (b) is a perspective view which shows the use condition of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 9th Embodiment, (b) is a perspective view which shows the use condition of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 10th Embodiment, (b) is a perspective view which shows the use condition of the ceramic sheet. (A) is explanatory drawing which shows the use condition of the ceramic sheet illustrated as 11th Embodiment, (b) is a perspective view which shows another use condition of the ceramic sheet illustrated as 11th Embodiment, (c) is 11th. Explanatory drawing which shows another use condition of the ceramic sheet illustrated as embodiment. (A) is explanatory drawing which shows the use condition of the ceramic sheet illustrated as 12th Embodiment, (b) is explanatory drawing which shows another use condition of the ceramic sheet illustrated as 12th Embodiment. The top view of the ceramic sheet illustrated as 13th Embodiment. (A) is a perspective view showing a ceramic sheet and an RFID antenna substrate exemplified as the fourteenth embodiment, (b) is an explanatory view showing a use state of the ceramic sheet exemplified as the fourteenth embodiment, and (c) is a fourteenth embodiment. Explanatory drawing which shows the use condition of the ceramic sheet illustrated as a modification of a form. (A) is sectional drawing of the ceramic sheet illustrated as 15th Embodiment, (b) is sectional drawing of the ceramic sheet illustrated as 16th Embodiment, (c) is sectional drawing of the ceramic sheet illustrated as 17th Embodiment. (D) is sectional drawing of the ceramic sheet illustrated as 18th Embodiment, (e) is sectional drawing of the ceramic sheet illustrated as 19th Embodiment. (A) is sectional drawing of the ceramic sheet illustrated as 20th Embodiment, (b) Explanatory drawing which shows the use condition of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 21st Embodiment, (b) Explanatory drawing which shows the use condition of the ceramic sheet. (A) is a perspective view of the ceramic sheet illustrated as 22nd Embodiment, (b) Explanatory drawing which shows the use condition of the ceramic sheet. The perspective view which shows the use condition of a cable holder provided with the ceramic sheet illustrated as 23rd Embodiment. The perspective view which shows the use condition of the ceramic sheet illustrated as 24th Embodiment. (A)-(c) is explanatory drawing about the solid line-shaped or broken line-shaped lattice pattern verified in 25th Embodiment, (d) is a graph which shows a magnetic permeability frequency characteristic. Sectional drawing of the ceramic sheet illustrated as 26th Embodiment.

Explanation of symbols

  1, 1, 23, 31, 33a, 41, 45, 53, 55, 61, 65, 75, 91, 101, 111, 121, 131, 141, 151, 161, 171, 181, 191, 205, 211, 231 ... Ceramic sheet, 3 ... Resin sheet layer, 5, 11, 13, 15, 17 ... Ceramic layer, 5a ... Ceramic piece, 5b ... Thin plate ceramic, 5c ... Recess 5d ... fracture surface, 25 ... adhesive layer, 27 ... release paper, 33 ... ceramic sheet group, 43, 95 ... hole, 47 ... strip, 48 ... adhesive Part, 67, 153 ... conductive layer, 77 ... heat conduction layer, 93 ... outer periphery, 103 ... RFID antenna substrate, 123 ... double-sided adhesive tape, 173 ... vibration-proof heat Conductive layer, 183 ... hole, 201 ... Bull retainer 203 ... resin molding, 213, 215 ... hole, 233 ... pressure-sensitive adhesive layer 233.

Claims (4)

In the structure having a plurality of layers stacked, at least one of the plurality of layers is a ceramic sheet formed of a ceramic material,
In the ceramic layer, a plurality of ceramic pieces are arranged in a planar shape, and the plurality of ceramic pieces are sandwiched between other layers and enclosed inside the layers of the other layers, so that the end face of the ceramic sheet is formed. A structure that is in an unexposed state, and one of the other layers is an adhesive layer made of a double-sided adhesive tape, and the adhesive layer is attached to the ceramic layer , thereby being arranged in the planar shape Is configured to be maintainable,
Wherein the plurality of ceramic pieces, a plurality of recesses or holes is a thin plate-shaped ceramic formed like a dashed line, seen write scissors to the other layers, and, since adhered to the adhesive layer, the plurality of recesses or It is formed by dividing along the broken line formed by the hole, and the fine debris generated when the ceramic layer is broken is captured and held by the adhesive layer and remains in the vicinity of the breakage point. And
Moreover, the broken line is formed such that the relationship between the total length A of the broken line and the length B of the interval portion included in the broken line satisfies the relationship of 0.2 ≦ (B / A) ≦ 0.7. A ceramic sheet characterized by being made . The ceramic material is Ni-Zn based ferrite, Mn-Zn based ferrite, Mg-Zn based ferrite, Ba based ferrite, Ferlock sprayer based ferrite, alumina, silicon carbide, or barium titanate. Item 10. The ceramic sheet according to Item 1 . The plurality of ceramic pieces are formed by splitting the thin plate ceramic along the plurality of recesses or holes by applying pressure with a roller to a laminate in which the plurality of layers are stacked. The ceramic sheet according to claim 1 or 2 , wherein the ceramic sheet is a thing. In the structure having a plurality of layers stacked, at least one of the plurality of layers is a ceramic sheet formed of a ceramic material,
In the ceramic layer, a plurality of ceramic pieces are arranged in a planar shape, and the plurality of ceramic pieces are sandwiched between other layers and enclosed inside the layers of the other layers, so that the end face of the ceramic sheet is formed. A structure that is in an unexposed state, and one of the other layers is an adhesive layer made of a double-sided adhesive tape, and the adhesive layer is attached to the ceramic layer, thereby being arranged in the planar shape Is configured to be maintainable,
The plurality of ceramic pieces include a thin plate-like ceramic having a plurality of concave portions formed in a broken line shape, sandwiched between the other layers and attached to the adhesive layer, and then along the broken lines formed by the plurality of concave portions. It is formed by cracking, and the fine debris generated when the ceramic layer is broken is captured and held by the adhesive layer and remains in the vicinity of the breakage point,
Moreover, the broken line is formed such that the relationship between the total length A of the broken line and the length B of the interval portion included in the broken line satisfies the relationship of 0.2 ≦ (B / A) ≦ 0.7. Has been
A ceramic sheet characterized by that .

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